Work Portion Comprises Electrical Component Patents (Class 228/44.7)
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Patent number: 6484922Abstract: An apparatus and method of supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.Type: GrantFiled: June 8, 2001Date of Patent: November 26, 2002Assignee: Micron Technology, Inc.Inventor: Michael B. Ball
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Patent number: 6478211Abstract: A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.Type: GrantFiled: December 10, 2001Date of Patent: November 12, 2002Assignee: Micron Technology, Inc.Inventors: Michael B. Ball, Rich Fogal
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Publication number: 20020162878Abstract: A method and system for instantaneous heat-sink soldering comprising a gripper device, an intense heat source, and an air-jet cooling system is provided for soldering terminals to structures of dissimilar material composition. The gripper device is adapted to secure the terminal between a pair of jaws and selectively position the terminal closely adjacent the structure. The jaws further serve as heat sinks to continually remove residual heat from the terminal, both during and after the application of heat to the terminal. Upon termination of the heat application, air-jet cooling is provided to the terminal to quickly cool the terminal and the molten layer of solder. The method of rapidly heating and cooling the terminal and layer of solder prevents the annealing of certain silica substrates and provides better solder connections.Type: ApplicationFiled: May 7, 2001Publication date: November 7, 2002Inventor: Larry J. Costa
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Patent number: 6464123Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.Type: GrantFiled: September 18, 2001Date of Patent: October 15, 2002Assignee: Micron Technology, Inc.Inventors: Michael B. Ball, Rich Fogal
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Publication number: 20020092887Abstract: There is provided an inclination prevention member for preventing a pressing part from inclining to a supporting part. Therefore a pressing face and a stage face can be arranged to be nearly parallel. The pressing face can be thus disposed with the higher parallelism to the bonding stage as compared with the conventional art, so that components and a circuit form object can be bonded with a high bonding quality.Type: ApplicationFiled: January 14, 2002Publication date: July 18, 2002Inventors: Naoto Hosotani, Shuji Ono, Hidenobu Nishikawa, Mitsuo Maeno, Hiroshi Nasu
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Patent number: 6419145Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.Type: GrantFiled: March 1, 2001Date of Patent: July 16, 2002Assignee: Micron Technology, Inc.Inventor: Michael B. Ball
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Publication number: 20020066774Abstract: A pipe fitting apparatus includes first and second connector units for releasable connection to respective first and second pipe sections adjacent pipe ends to be coupled, so as to hold the pipe sections relative to one another in the desired relative orientations during welding. Each connector unit has a groove on one face for location against the outside of a pipe, with the longitudinal groove axis extending parallel to the axis of a pipe to which it is secured. The units are adjustably secured together by a pivot coupling having a pivot axis extending transverse to the groove axis for pivotal adjustment of the orientation of the second connector unit relative to the first connector unit, whereby the relative orientation of the first and second pipes to be coupled can be adjusted. A releasable locking device releasably secures the second connector unit at a selected orientation relative to the first connector unit.Type: ApplicationFiled: December 5, 2000Publication date: June 6, 2002Inventor: Jan Prochac
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Patent number: 6378857Abstract: A fixture supports and secures a printed circuit board (“PCB”) during processing thereof. The fixture includes a frame for supporting the PCB and an attachable and entirely detachable bar or plate for securing the PCB in the fixture. A first opening is defined by the frame and is of sufficient dimensions to expose a first surface of the PCB. The plate defines a second opening, the second opening being of sufficient dimensions to expose a second surface of the PCB for processing. Spring-loaded latch assemblies connect the bar or plate to the frame at its ends or corners, respectively. The latch assemblies are simultaneously actuated by application of a slight pressure on the plate or bar. Simultaneous actuation of the latch assemblies ensures uniform application of pressure on the PCB, to avoid creation of a moment in the board. The latch assemblies do not require an operator's individual, repeated manipulation, but are actuated with a single application of slight pressure to the plate or bar.Type: GrantFiled: November 13, 2000Date of Patent: April 30, 2002Assignee: S.P. Precision International, LtdInventor: Livingston Taylor
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Patent number: 6375061Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.Type: GrantFiled: October 3, 2000Date of Patent: April 23, 2002Assignee: Micron Technology, Inc.Inventors: Sven Evers, Craig T. Clyne
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Publication number: 20020043548Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.Type: ApplicationFiled: December 11, 2001Publication date: April 18, 2002Inventors: Sven Evers, Craig T. Clyne
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Patent number: 6352191Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.Type: GrantFiled: October 30, 2000Date of Patent: March 5, 2002Assignee: Micron Technology, Inc.Inventors: Sven Evers, Craig T. Clyne
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Publication number: 20020023940Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.Type: ApplicationFiled: September 18, 2001Publication date: February 28, 2002Inventors: Michael B. Ball, Rich Fogal
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Patent number: 6343732Abstract: A method and apparatus for retaining heat at a pin-in-hole rework site on a printed circuit board during solder fountain rework of the board. A preheated heat retention plate is attached to the rework side of the printed circuit board. The heat retention plate covers a substantial portion of the board surface. During rework of the printed circuit board, the heat retention plate minimizes the temperature gradient between the rework site of the printed circuit board and the remainder of the printed circuit board. During the rework, the heat retention plate can be heated by an active heater in order to maintain a constant temperature gradient between the rework site of the board and the remainder of the board. By minimizing the escape of heat from the rework site, the number of solder cycles required to rework the board is decreased, resulting in reduced board rework times and increased board longevity.Type: GrantFiled: October 1, 1999Date of Patent: February 5, 2002Assignee: International Business Machines CorporationInventors: Scott Peter Graves, Phillip Duane Isaacs
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Patent number: 6334566Abstract: A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.Type: GrantFiled: October 31, 2000Date of Patent: January 1, 2002Assignee: Micron TechnologyInventors: Michael B. Ball, Rich Fogal
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Patent number: 6325275Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.Type: GrantFiled: September 28, 1999Date of Patent: December 4, 2001Assignee: Micron Technology, Inc.Inventors: Michael B. Ball, Rich Fogal
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Patent number: 6305593Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.Type: GrantFiled: October 19, 1999Date of Patent: October 23, 2001Assignee: Micron Technology, Inc.Inventor: Michael B. Ball
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Publication number: 20010027988Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.Type: ApplicationFiled: June 7, 2001Publication date: October 11, 2001Inventor: Michael B. Ball
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Publication number: 20010027989Abstract: An apparatus and method of supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.Type: ApplicationFiled: June 8, 2001Publication date: October 11, 2001Inventor: Michael B. Ball
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Patent number: 6290116Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.Type: GrantFiled: June 22, 1999Date of Patent: September 18, 2001Assignee: Micron Technology, Inc.Inventors: Michael B. Ball, Rich Fogal
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Patent number: 6283355Abstract: An end effector has a tower with non-stacked spatulas. Tolerance stacking is avoided by making grooves in the tower relative to a common reference surface, and mounting the spatulas in such grooves. The grooves are provided in separate planar walls of the tower. The walls intersect to enhance the structural properties of the tower. The tower has a dual-purpose clamp formed integrally with one wall for use in assembling the tower and the spatulas, and for mounting the completed end effector in a load lock. The spatula may carry a wafer during various operations, e.g., semiconductor processing, material deposition and etching systems, or in flat panel display processing systems. The carrying of the wafers is notwithstanding vibration of equipment for performing the manufacturing operations, which vibration is primarily in a range of frequencies.Type: GrantFiled: February 14, 2000Date of Patent: September 4, 2001Assignee: Lam Research CorporationInventors: Edmund L. Ma, Christopher O. Lada, Donald H. Langhans
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Publication number: 20010017313Abstract: An apparatus for attaching an electronic device to and removing an electronic device from a substrate. An electronic device pick-up and vacuum head applies a vacuum source to the electronic device for engaging, picking up and retaining the electronic device. The heat is transmitted by conduction through the structure of the device pick-up and vacuum head to the electronic device and solder for securing the electronic device on the substrate to heat the solder to its reflow temperature. The pick-up and vacuum head includes an electronic device engaging portion, a vacuum port, and a heat source engaging portion.Type: ApplicationFiled: February 1, 2001Publication date: August 30, 2001Applicant: International Business Machines CorporationInventors: Allen Thomas Mays, Kris Allan Slesinger, Michael Camillo Weller
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Publication number: 20010013531Abstract: An apparatus and method of supporting lead fingers during a wire bonding process and method of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.Type: ApplicationFiled: April 23, 2001Publication date: August 16, 2001Inventor: Michael B. Ball
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Patent number: 6267288Abstract: A pallet for mounting components on a double sided PCB including a fab (panel) having a frame area surrounding a depression. A shoulder around the depression is dimensioned to support the fab. The fab is laid on the shoulder with the a group of components mounted in a previous reflow operation in the space between the depression and a first area of the fab. The print, pick and place and reflow operations are performed to mount a second group of components on the opposite side of the fab. The first area of the fab is shielded from the heat of the oven so that the first components do not separate from the fab during the second reflow step. Standoffs in the depression prevent sagging of the board. Another area of the pallet has a recessed area with cutouts for wave soldering components located on the third area of the fab.Type: GrantFiled: October 18, 1999Date of Patent: July 31, 2001Inventor: Henry Chung
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Patent number: 6267287Abstract: An apparatus and method of supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.Type: GrantFiled: July 21, 1999Date of Patent: July 31, 2001Assignee: Micron Technology, Inc.Inventor: Michael B. Ball
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Patent number: 6264089Abstract: A heater tool, which bonds by thermocompression outer leads of a TCP to electrodes on an array substrate, is fixed to a support block and is movable between a compression-bonding position, wherein the distal end portion of the heater tool presses the TCP to compression-bond the outer leads to the electrodes of the array substrate, and a waiting position wherein the distal end portion is spaced apart from the TCP. A pressing mechanism having a pressing member is mounted on the support block and movable in interlock with the movement of the heater tool. The pressing member presses the TCP to press the outer leads against the array substrate when the heater tool moves from the waiting position toward the compression bonding position.Type: GrantFiled: January 25, 1999Date of Patent: July 24, 2001Assignee: Kabushiki Kaisha ToshibaInventors: Tatsuya Hasegawa, Satoshi Yoshimura, Toshiaki Miyoshi, Yasunori Fukumoto, Yoshikazu Yomogihara
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Publication number: 20010008248Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.Type: ApplicationFiled: March 1, 2001Publication date: July 19, 2001Inventor: Michael B. Ball
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Patent number: 6247628Abstract: An ultrasonic vibration bonding tool comprising a square bar-like horn body, bonding working portions projecting from the upper and lower surfaces of the horn body at the central maximum vibration amplitude point, and crooked support portions projecting from front and rear surfaces of the horn body at the two minimum vibration amplitude points which are separate the same distance from the bonding working portions on both sides. Proper bonding can be carried out with this ultrasonic vibration bonding tool.Type: GrantFiled: August 1, 2000Date of Patent: June 19, 2001Assignee: Ultex CorporationInventors: Shigeru Sato, Seiya Nakai
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Publication number: 20010001889Abstract: An alignment weight is provided. The alignment weight includes a body of material having first and second opposing surfaces. A number of depressions are formed in the first surface. The depressions receive pins of a floating pin field when placed on a floating pin field during connection of the floating pin field to a printed circuit board.Type: ApplicationFiled: January 4, 2001Publication date: May 31, 2001Applicant: Intel Corporation.Inventors: Cheryl M. Waldron-Floyde, Brad C. Irwin
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Patent number: 6237832Abstract: An apparatus used in a process for supporting a printed circuit board during a wave soldering operation including a frame with a frame opening in which a surface of the frame supports the board and also serves as a reference surface for vertically positioning the board above the solder pool. The board is secured against the reference surface with spring loaded clamps. Stiffeners preferably being an aluminum extrusion having a Tee or angle cross section is mounted along the outside edge of the reference surface of the frame and has a second reference surface facing in a direction opposite the reference surface of the frame. The second reference surface on the extrusion is accessible for support by a slide rail so that the height of the reference surface of the frame above the surface of the pool is independent of the thickness of the board or frame.Type: GrantFiled: October 18, 1999Date of Patent: May 29, 2001Inventor: Henry Chung
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Patent number: 6227431Abstract: An apparatus and method of supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.Type: GrantFiled: July 21, 1999Date of Patent: May 8, 2001Assignee: Micron Technology, Inc.Inventor: Michael B. Ball
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Patent number: 6213376Abstract: An apparatus used for holding a first semiconductor device in proper alignment to a second semiconductor device, whose size is different from the first device, while performing a C4 bond between the two devices. The apparatus for holding the two devices in proper alignment consists of a holding fixture, which includes upper and lower pocket receptacles for receiving the semiconductor devices. The semiconductor devices are placed into the respective upper and lower slots aligned to two or more edges of the holding fixture.Type: GrantFiled: June 17, 1998Date of Patent: April 10, 2001Assignee: International Business Machines Corp.Inventors: George C. Correia, John E. Cronin, Edmund J. Sprogis
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Patent number: 6206274Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.Type: GrantFiled: October 19, 1999Date of Patent: March 27, 2001Assignee: Micron Technology, Inc.Inventor: Michael B. Ball
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Patent number: 6193132Abstract: A method of bonding a semiconductor chip, including step of photographing a surface of a semiconductor chip, on which an electrode is formed, and detecting a relative position of the electrode with respect to the semiconductor chip, a bonding step of making the electrode of the semiconductor chip to face a circuit pattern provided on a substrate, and bonding the electrode to the circuit pattern, a step of photographing the substrate on which the semiconductor chip is formed, and detecting a relative position of the semiconductor chip with respect to the substrate. Also included is a step of evaluating a bonding accuracy by calculating a relative position of the electrode with respect to the substrate from the relative position of the semiconductor chip with respect to the substrate and the relative position of the electrode with respect to the semiconductor chip.Type: GrantFiled: November 23, 1998Date of Patent: February 27, 2001Assignee: Kabushiki Kaisha ToshibaInventors: Motojiro Shibata, Yukihiro Ikeya, Tetsuya Kubo
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Patent number: 6189764Abstract: A fitting gear for assisting in the alignment of metal plates so that the edges thereof can be welded together includes an inverted substantially U-shaped electromagnet which, when energized, is adapted to be secured to the upper surface of one of the plates adjacent on edge thereof. A wedge-shaped tapered pin is forced into the U and contacts the upper surface of the other plate to move the edges into substantial alignment with each other.Type: GrantFiled: January 25, 1999Date of Patent: February 20, 2001Inventor: Dale Hannan
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Patent number: 6173884Abstract: A bonding tool for bonding an inner lead to an electrode pad of a semiconductor chip, wherein the bonding tool has a head surface which is rectangular. The rectangular head surface has a long side that is perpendicular to a longitudinal direction of the inner lead and wider than a width of the inner lead, and a short side that is narrower than an opening in a passivation film.Type: GrantFiled: January 28, 1999Date of Patent: January 16, 2001Assignee: NEC CorporationInventor: Michitaka Urushima
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Patent number: 6173879Abstract: A wire bonder includes a cut clamper having a pair of supporting members and a pair of electrodes formed in rectangular shape. Each electrode is rotatably connected to the supporting member. Each electrode has an uneven surface. A heater is incorporated in one or both of supporting.Type: GrantFiled: December 7, 1999Date of Patent: January 16, 2001Assignee: Oki Electric Industry Co., Ltd.Inventor: Hidekazu Chiba