Including Means To Orient Work Or Position Work Portion Relative To Another Work Portion Patents (Class 228/49.1)
  • Patent number: 11562916
    Abstract: The present invention is provided with: a stage having a placing surface for a semiconductor chip, and a first heater heating the placing surface; a bonding head having a contact surface to be in contact with an subject, a second temperature sensor measuring the temperature of the subject via the contact surface, and a second heater heating the contact surface, said bonding head being driven in at least the orthogonal direction with respect to the placing surface; and a control unit measuring the temperature of the subject based on a temperature detection value of the second temperature sensor, said temperature detection value having being obtained by heating the placing surface and the contact surface to predetermined target temperatures, respectively, by means of the first and second heaters, then bringing the contact surface into contact with the subject in a state wherein heating by the second heater is stopped.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: January 24, 2023
    Assignee: SHINKAWA LTD.
    Inventors: Shoji Wada, Hiroshi Kikuchi
  • Patent number: 11554452
    Abstract: Techniques for conveyor systems that integrate robotic smart carrier nests whose configurations are dynamically changed based on product geometry are provided. In one embodiment, a system can include a modular nest configured to hold product during assembly. The modular nest includes a first actuator comprising a first pair of gripping arms that open and close in a first direction based on a first signal. The modular nest also includes a second actuator comprising a second pair of gripping arms that open and close in a second direction based on a second signal. The first signal and the second signal are based on a geometry of the product. Further, the first direction and the second direction are different directions.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: January 17, 2023
    Assignee: The Gillette Company LLC
    Inventor: Paul DiBella
  • Patent number: 11535475
    Abstract: There is described a web alignment device for aligning a web comprising an engagement surface for supporting the web, a clamp assembly for clamping the web on at least a clamp portion of the engagement surface, an alignment control assembly for controlling a correct alignment of the web. The alignment control assembly comprises a control unit for generating a trigger signal if the web is correctly aligned, a first sensor device for detecting and/or determining a desired position of a first section of the web and to send at least a first signal to the control unit if the first section is positioned in the desired position, and a second sensor device for detecting and/or determining a desired position of a second section of the web and to send a second signal to the control unit if the second section is positioned in the desired position.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: December 27, 2022
    Assignee: TETRA LAVAL HOLDINGS & FINANCE S.A.
    Inventor: Marco Ricco'
  • Patent number: 11478882
    Abstract: A vehicle body assembly system defines a preset pre-buck section and a preset main-buck section along a conveying route of a floor assembly, and may include: i) pre-buck units which are installed at both sides of the conveying route in the pre-buck section, respectively, restrict lower portions of side assemblies, which vary in accordance with a type of vehicle, with respect to both sides of the floor assembly, and preassemble the lower portions of the side assemblies to the floor assembly by a first welding robot; and ii) main-buck units which are installed at both sides of the conveying route in the main-buck section, respectively, restrict upper portions of the side assemblies preassembled by the pre-buck unit, and post-assemble vehicle body components to the upper portions of the side assemblies by a second welding robot.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: October 25, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Hyun Gu Lee, Yoon Jang, Chang Ho Jung, Ki Haing Lee, Chi Hong Hwang, Deug Young So, Young Do Kim
  • Patent number: 11456202
    Abstract: A stage structure for a semiconductor fabrication process is disclosed. The stage structure may include a stage and a pickup head tilting control device. The pickup head tilting control device may include a correction plate, a tilting driving device which is coupled to the correction plate and is configured to adjust an inclination angle of the correction plate, and a control circuitry configured to control the tilting driving device. The correction plate may include a correction surface which is selectively in contact with a suction surface of a pickup head.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: September 27, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jin-San Jung, Hyunseok Choi, Jun-Su Lim
  • Patent number: 11302666
    Abstract: A mounting apparatus is equipped with: an attachment including a surface for attaching a semiconductor die; a heater which is disposed on a side of the attachment opposite to the surface and heats the semiconductor die attached to the surface; a suction hole which penetrates through the attachment and the heater integrally and opens in the surface; and a body portion which is disposed on a side of the heater opposite to the attachment and on which a vacuum suction path in communication with the suction hole is arranged. The vacuum suction path includes a storage portion which stores a foreign matter consisting of a liquid formed by condensation of a gas suctioned from the suction hole or a solid formed by solidification of the liquid.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: April 12, 2022
    Assignee: SHINKAWA LTD.
    Inventors: Manato Nishide, Kohei Seyama, Hijiri Hayashi
  • Patent number: 11276095
    Abstract: Systems and methods are disclosed for automatically generating, transmitting, and receiving one or more price requests and corresponding pricing from one or more price-providers. In some embodiments, such systems and methods are embodied in a pricing-method-agnostic ecommerce marketplace that allows each price-provider to select the pricing method it desires to use to generate its price for a corresponding price request. Examples of differing pricing methods include methods utilizing “stock” pricing engines of differing sophistication, customized pricing engines, pricing engines split between the marketplace and a price-provider, and/or pricing engines located offboard the marketplace, as well as pricing methods that are performed entirely outside the control of the marketplace, among others. Various corresponding and related systems, methods, and software are described.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: March 15, 2022
    Assignee: Desprez, LLC
    Inventor: James L. Jacobs, II
  • Patent number: 11203386
    Abstract: A vehicle body assembling system forms a pre-buck section and a main buck section set along a transfer path of a floor assembly. A main buck unit is set at opposite sides of the transfer path in the main buck section, controls an upper portion of a side assembly in a state that a lower portion of each side assembly is pre-assembled to the floor assembly the pre-buck section, and assembles the upper portion of the side assembly and vehicle body parts using a second welding robot.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: December 21, 2021
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Junkyoung Lee, Seon Woo Kweon, Sangcho Kim
  • Patent number: 10381755
    Abstract: An electrical connector is used for electrically connecting a chip module to a circuit board. The electrical connector includes an insulating body having multiple receiving holes and multiple terminals received in the receiving holes The electrical connector has a top surface and a bottom surface The receiving holes run through the insulating body. Each terminal has a base and a soldering portion extending from a lower part thereof. Two opposite sides of the soldering portion are a first surface and a second surface. The first surface includes a laser irradiation area. A solder is provided at a position, opposite to the laser irradiation area, of the second surface for urging. The laser irradiation area is heated by external laser, such that the solder is partially melted and is soldered and fixed to the second surface.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: August 13, 2019
    Assignee: LOTES CO., LTD
    Inventors: Wen Chang Chang, Zuo Feng Jin
  • Patent number: 10343201
    Abstract: A method and an installation for continuously shaping longitudinally slotted pipes from a flat material minimizes or avoids markings in the material by evenly introducing into the roll stand the rolling forces of at least two rolls acting successively on the flat material and/or by allowing the two successively acting rolls to align freely relative to one another.
    Type: Grant
    Filed: October 5, 2012
    Date of Patent: July 9, 2019
    Assignee: SMS group GmbH
    Inventor: Axel Rossbach
  • Patent number: 10319874
    Abstract: Provided is a wire setting apparatus of a tabbing apparatus. A wire setting apparatus of a tabbing apparatus according to the present invention includes: a conveyer; a wire placement platform installed adjacent to the conveyer such that a portion of a wire placed on the conveyor lies on the wire placement platform; and a placement gripper device configured to grip the wire and to place the wire on the wire placement platform.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: June 11, 2019
    Assignee: ZEUS CO., LTD.
    Inventors: Hyung Chul Gong, Byeong Su Lee, Tae Hoon Kim
  • Patent number: 10290761
    Abstract: Disclosed is a method for attaching an interconnector of a solar cell panel. The method includes forming a flux layer by spraying flux over the interconnector via spraying, the interconnector including a core layer and a solder layer formed on a surface of the core layer, and attaching the interconnector to a solar cell via soldering of the solder layer by pressing the interconnector onto the solar cell while applying heat.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: May 14, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Jinsung Kim, Hyunho Lee, Donghae Oh, Woojoong Kang, Jangho Kim, Dongju Kang, Kyuhyeok Sim
  • Patent number: 10233030
    Abstract: For a component receiving member provided with a component reception recess shaped according to a component that is a storage target, and side wall section that a component held by suction nozzle contacts when moved in the left-right direction, when the component is released in a state contacting the side wall section, the component is stored in the component reception recess by leads of the component falling along a tapered surface and the component rotating 90 degrees due to its own weight. Therefore, even in a case in which the component is held by suction nozzle with an upper surface facing up, the component is stored in the component reception recess with the upper surface facing up by the component rotating 90 degrees at the component receiving member.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: March 19, 2019
    Assignee: FUJI CORPORATION
    Inventors: Toru Matsumoto, Shunji Morikawa
  • Patent number: 10227874
    Abstract: A tooling fixture assembly for processing a component of a gas turbine engine is provided. The tooling fixture assembly includes a component nesting fixture for precisely positioning the component within the fixture using a plurality of datum locators. A transfer block is also positioned at a known location and orientation relative to the component and an adhesive is used to fix the relative position of the component and the transfer block. The component and the transfer block are then removed from the component nesting fixture and installed on a machine for drilling, machining, or otherwise processing the component. After the machining is complete, the adhesive may be removed, such that the component may be detached from the transfer block.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: March 12, 2019
    Inventors: Todd Gary Heinrich, Brian William Howard, Jonathan E. Bendel, Stephen Matthew Mayer
  • Patent number: 9751197
    Abstract: A fastener installation tool and related method are provided for installing fasteners in boards, where the boards are installed immediately adjacent one another, without a gap established therebetween. The tool can include an alignment projection that projects a preselected distance downwardly from a lower surface of the tool. The alignment projection can be disposed between opposing corners of first and second boards to install a fastener without establishing a gap between the boards. This construction can be suitable for installing boards constructed from materials that shrink over time, such as wet, treated lumber or other materials, and even non-shrinkable boards where tighter spacing is desired. A related method of installation is provided.
    Type: Grant
    Filed: January 8, 2015
    Date of Patent: September 5, 2017
    Assignee: National Nail Corp.
    Inventor: Roger A. Vandenberg
  • Patent number: 9630783
    Abstract: An aligning and feeding device which accommodates a component including a pair of rectangular end surfaces oppositely facing each other and having a longitudinal direction extending between the end surfaces of the component in a cavity formed in an accommodating member. The component is accommodated in the cavity by aligning a direction of the component such that the longitudinal direction of the component extends parallel to a main surface of the accommodating member.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: April 25, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masatoshi Harada, Miki Kurabe
  • Patent number: 9302352
    Abstract: A line up tool includes a one piece body having a main portion and a tongue portion. The tongue portion projects outwardly from the main portion defining a longitudinal axis. The main portion has at least one workpiece engaging face, a first side and a second side. A passage extends through the main portion perpendicular to the longitudinal axis from the first side to the second side. The passage is positioned and configured to receive a flexible clamping device which is used to clamp the at least one workpiece engaging face to a workpiece. The tongue has a first face, a second face, a first side and a second side. A threaded aperture extends through the tongue perpendicular to the longitudinal axis from the first face to the second face. A set screw engages the threaded aperture. The set screw has a three application end and a workpiece engaging end.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: April 5, 2016
    Inventor: Gerrithendrik Hietland
  • Publication number: 20150129643
    Abstract: A welding spinner has a base; a wheel with a mounting face for an implement to be welded; and a cam arm laterally connecting the wheel to the base and mounted to rotate between the base and the wheel to adjust the height of the wheel relative to the base. A method of using the welding spinner includes rotating the cam arm relative to the base to adjust the height of the wheel relative to the base. A counterweight device and a removable chuck are disclosed and may be used with a welding spinner.
    Type: Application
    Filed: November 14, 2013
    Publication date: May 14, 2015
    Applicant: 1202858 Alberta Ltd.
    Inventor: Trevor Darren Gaudreault
  • Publication number: 20150069110
    Abstract: A semiconductor manufacturing apparatus includes: a collet which sucks a semiconductor chip having a main surface on which a bump is formed, and an actuator which transfers the sucked semiconductor chip onto a mounting substrate or another semiconductor chip by driving the collet. A recessed portion for avoiding a contact between the collet and the bump is formed on a suction surface of the collet which sucks the semiconductor chip.
    Type: Application
    Filed: February 24, 2014
    Publication date: March 12, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Shinya FUKAYAMA, Yukifumi OYAMA, Satoshi TSUKIYAMA, Masatoshi FUKUDA
  • Patent number: 8955733
    Abstract: A clamping module for a pipe line-up system uses bell crank linkages to transmit pipe alignment and clamping forces between radially moving clamping feet and a central axially moving driving head. The clamping feet are arranged in axially spaced sets to internally engage two pipe sections to be welded independently on either side of a weld zone between the pipe sections, with welding shoes in between the clamping feet and spanning the weld zone. The bell crank linkages provide a force multiplier between the driving heads and the clamping feet.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: February 17, 2015
    Assignee: Tri Tool Inc.
    Inventors: Jerald Vanderpol, Vinh T. Hoang
  • Patent number: 8950648
    Abstract: Apparatus for assisting in weld assembling a box column from a tack-welded pre-assembly of planar plate components. The apparatus features (1) an elongate frame defining a rotational-assembly axis, and (2) plural pre-assembly-receiving, rotational support structures mounted at spaced locations on the frame—each support structure including (a) an openable/closable yoke possessing a collar-reception zone, (b) an openable/closable collar rotatably receivable within this reception zone, and possessing a central throughpassage having a cross-sectional configuration which is larger than that of a box-column which is to be assembled, and (c) a pair of removably-collar-attachable, throughpassage clamping shoes for forming cooperatively, within the collar throughpassage, a window for complementarily, receiving extension therethrough of a box-column pre-assembly's cross section.
    Type: Grant
    Filed: April 28, 2012
    Date of Patent: February 10, 2015
    Assignee: ConXtech, Inc.
    Inventor: Robert J. Simmons
  • Patent number: 8950649
    Abstract: Apparatuses and methods are provided for manufacturing bearing assemblies. In accordance with one embodiment, a fixture is provided for use in brazing bearing elements to a bearing ring. The fixture comprises a substantially annular body and at least one or more force-applying mechanism associated with the annular body. The force applying mechanisms include a push rod disposed within a channel that is formed in the annular body, the push rod being displaceable within the channel. A biasing member is configured to bias the push rod in a radial direction relative to the annular body. In one embodiment, a plurality of force-applying mechanisms are circumferentially spaced about the substantially annular body. In one embodiment, the push rods extend radially inwardly from a peripheral surface of the body, while in another embodiment the push rods extend radially outwardly from peripheral surface of the body.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: February 10, 2015
    Assignee: US Synthetic Corporation
    Inventors: Timothy N. Sexton, John Corradini
  • Patent number: 8950647
    Abstract: Disclosed herein are systems for assembly of a component, in particular a roof panel, on a motor-vehicle body structure. One system comprises a device designed to clamp the component on the body structure in the proper position; a center for welding the component on the body structure; and a conveying line for carrying to and from the welding center a succession of the body structures. The clamping device is provided with means for gripping the component and comprises first manipulator means for bringing the device into connection with the component in a pick-up position according to a predetermined mutual positioning, and for carrying the device connected to the component to a body structure that is located in a position on the conveying line, upstream of the welding center, for constraining it to the body structure according to a mutual positioning whereby the component is in the proper position of assembly.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: February 10, 2015
    Assignee: Comau S.p.A.
    Inventors: Nunzio Magnano, Francesco Di Mino
  • Publication number: 20150001279
    Abstract: A multi-vehicle type co-production line flexible framing is disclosed, comprising a robot welding system, a high speed transport system, a floor panel intelligent flexible positioning system, and a side panel flexible positioning and switching system. The floor panel intelligent flexible positioning system is correspondingly connected to a transfer rail of the high speed transport system. The side panel flexible positioning and switching system comprises a side panel fixture consolidation system, a fixture storage system, and a fixture switching and rail system. The side panel fixture consolidation system corresponds to the side of the floor panel intelligent flexible positioning system. The fixture storage system is arranged on two sides of the side panel fixture consolidation system in the transfer direction of the high speed transport system. The fixture switching and rail system is connected between the side panel fixture consolidation system and the fixture storage system.
    Type: Application
    Filed: February 4, 2013
    Publication date: January 1, 2015
    Applicant: Guangzhou Mino Automotive Equipment Co., Ltd.
    Inventors: Weibing Yao, Peter Chihcheng Sun, Meng Yang, Wei He, Yi He, Kai Zhou, Hai Huang
  • Patent number: 8919634
    Abstract: A solder ball printing apparatus fills plural openings formed in a mask with solder balls using a squeegee and prints the solder balls on plural electrode portions formed on a surface of a substrate facing the mask. The solder ball printing apparatus includes: a substrate mounting table on which the substrate is mounted and on the back surface side of which plural hole portions are formed; a print table on which the substrate mounting table is mounted; an XY? stage which can drive the print table in a horizontal plane; a print table cylinder which can vertically drive the print table; a mask absorption portion which has members that can be fitted into the substrate mounting table; and a mask absorption cylinder which can vertically drive the mask absorption portion.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: December 30, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Akio Igarashi, Hirokuni Kurihara, Ryosuke Mizutori
  • Patent number: 8910848
    Abstract: A beam includes at least three web plates that are connected to a bottom flange and top flange.
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: December 16, 2014
    Assignee: Steel-Invest Ltd.
    Inventor: Seppo Hauta-Aho
  • Patent number: 8844794
    Abstract: Jig (10, 10?, 10?) for welded bulkhead fitting (18) to a steel material which is to be penetrated by the fitting, said jig comprising a foot (11), a holder (14) for the fitting, a connecting piece (13) between the foot and the holder. The foot (11) is provided with an on and off switchable magnet (12) and the holder (14) is height adjustable and replaceable. The angle between the holder (14) and the foot (11) is preferably adjustable.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: September 30, 2014
    Assignee: West Partner AS
    Inventors: Björn Förde Hatlehol, Jonny Sundkvist, Tom Richard Bauer
  • Patent number: 8800845
    Abstract: A device and a method for the positionally accurate arrangement of two material ends located opposite each other. The device includes two carriers with always one fixing device for each material end, wherein at least one of the two carriers is slidably guided relative to the second of the carriers, and at least the first carrier has a first adjusting member and a second adjusting member connected to the first adjusting member, wherein the adjusting members form a drive by means of which the first carrier is slidable against the second carrier.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: August 12, 2014
    Assignee: Nexans
    Inventors: Holger Schulz, Ralf Egerer, Wilhelm Kutzbach
  • Patent number: 8733617
    Abstract: A method and apparatus for managing the delivery of component parts and tooling to a robotic welding assembly positioned on a motor vehicle body assembly line. Automatic guided vehicles deliver component parts from a source of parts to a parts staging area on the robotic welding assembly including a substage awaiting area, a substage in-use area and a substage empty area, and further automatic guided vehicles deliver tooling from a tooling management area to the robotic welding assembly whereafter the tooling, upon model changeover, is moved to a tooling use area proximate the assembly line whereafter, upon further model changeover, the tooling is removed from the tooling use area and loaded onto an automatic guided vehicle for return to the tooling management area.
    Type: Grant
    Filed: June 5, 2013
    Date of Patent: May 27, 2014
    Assignee: Comau, Inc.
    Inventor: Velibor Kilibarda
  • Patent number: 8651357
    Abstract: An embodiment of a robotic welding apparatus comprises a robot having a welding torch and a base, where the base rotates about an axis of rotation. The embodiment further comprises an indexing table including a plurality of workpiece holding positions, where the indexing table is fixedly connected to the base substantially at a center position of the indexing table, and where the indexing table rotates about the axis of rotation.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: February 18, 2014
    Assignee: Lincoln Global, Inc.
    Inventor: Geoff Lipnevicius
  • Patent number: 8651159
    Abstract: A die bonder is provided comprising a bond head including a collet for picking up a die and bonding the die at a bonding site. The die bonder further comprises a first motor which is connected to the collet by a shaft for driving the collet in driving directions towards and away from the bonding site and a second motor which is connected to the bond head for driving the bond head in directions parallel to the driving directions of the first motor. A rotary motor is also operatively connected to the collet for rotating the collet about a rotational axis that is parallel to the driving directions of the first motor. The shaft is slidably connected to the rotary motor and is slidable relative to the rotary motor when it is driven by the first motor to move.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: February 18, 2014
    Assignee: ASM Assembly Automation Ltd
    Inventors: Sun Kuen Wong, Hon Chiu Hui, Yin Fun Ng
  • Publication number: 20140030849
    Abstract: An apparatus includes a guide ring, and a bond head installed on the guide ring. The bond head is configured to move in loops along the guide ring.
    Type: Application
    Filed: September 27, 2013
    Publication date: January 30, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien Ling Hwang, Ying-Jui Huang, Yi-Li Hsiao
  • Patent number: 8601664
    Abstract: A fixture exchange rail system is provided having first and second fixture assemblies movably mounted with respect to respective first and second stationary rails. A movable rail is disposed substantially adjacent to, and movable between, the first and second stationary rails. The movable rail is sufficiently configured to selectively receive the first and second fixture assemblies thereon. A method of operating a workstation having a fixture exchange rail system operable to enable work on a workpiece is also provided including the steps of: A) determining the style of workpiece present at the workstation; B) aligning a movable rail with one of a first and second stationary rail having a respective first and second fixture assembly mounted thereto corresponding to the style of workpiece; and C) moving the fixture assembly corresponding to the style of workpiece from the stationary rail to the movable rail.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: December 10, 2013
    Assignee: GM Global Technology Operations LLC
    Inventor: Andrew S. Kussmaul
  • Publication number: 20130284795
    Abstract: A method and apparatus for managing the delivery of component parts and tooling to a robotic welding assembly positioned on a motor vehicle body assembly line. Automatic guided vehicles deliver component parts from a source of parts to a parts staging area on the robotic welding assembly including a substage awaiting area, a substage in-use area and a substage empty area, and further automatic guided vehicles deliver tooling from a tooling management area to the robotic welding assembly whereafter the tooling, upon model changeover, is moved to a tooling use area proximate the assembly line whereafter, upon further model changeover, the tooling is removed from the tooling use area and loaded onto an automatic guided vehicle for return to the tooling management area.
    Type: Application
    Filed: June 5, 2013
    Publication date: October 31, 2013
    Inventor: Velibor Kilibarda
  • Publication number: 20130277361
    Abstract: Disclosed is an apparatus for electrically interconnecting a plurality of solar cells. The apparatus comprises: i) a roller operative to roll along a solar cell to press an electrical conductor against an electrical contact of the solar cell, the electrical conductor being for electrically interconnecting the solar cell with one or more other solar cells; and ii) a heat-generating device arranged and configured to provide heat for soldering the electrical conductor to the electrical contact of the solar cell while the roller is pressing the electrical conductor against the electrical contact of the solar cell. A method of electrically interconnecting a plurality of solar cells, and a mechanism for laying and soldering an electrical conductor onto a solar cell, are also disclosed.
    Type: Application
    Filed: April 19, 2012
    Publication date: October 24, 2013
    Inventors: Lian Hok TAN, Wen Ge TU, Pan YANG
  • Patent number: 8561878
    Abstract: Techniques for linear cell stringing are disclosed. In some embodiments, a plurality of sets of solar cells are linearly positioned, a plurality of tabbing ribbon segments are placed in contact with the plurality of sets of solar cells, and the plurality of sets of solar cells and corresponding plurality of tabbing ribbon segments are soldered together to form a plurality of solar cell strings. In some cases, the plurality of solar cell strings is substantially simultaneously formed in parallel.
    Type: Grant
    Filed: September 27, 2011
    Date of Patent: October 22, 2013
    Assignee: Banyan Energy, Inc.
    Inventors: David Sheldon Schultz, John Hunter Mack, Kenneth Evan Rakestraw
  • Patent number: 8474683
    Abstract: A method and apparatus for managing the delivery of component parts and tooling to a robotic welding assembly positioned on a motor vehicle body assembly line. Automatic guided vehicles deliver component parts from a source of parts to a parts staging area on the robotic welding assembly including a substage awaiting area, a substage in-use area and a substage empty area, and further automatic guided vehicles deliver tooling from a tooling management area to the robotic welding assembly whereafter the tooling, upon model changeover, is moved to a tooling use area proximate the assembly line whereafter, upon further model changeover, the tooling is removed from the tooling use area and loaded onto an automatic guided vehicle for return to the tooling management area.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: July 2, 2013
    Assignee: Comau, Inc
    Inventor: Velibor Kilibarda
  • Patent number: 8459526
    Abstract: A method and apparatus for fabricating a vertical deposition mask capable of welding a mask sheet and a mask frame for preventing a large area mask from drooping due to the weight of the mask. The apparatus includes a tensioning device for tensioning a mask sheet and a welder for attaching a mask frame to a circumference of the mask sheet. The tensioning device includes clamps for supporting the mask sheet and tensioners coupled to the clamps for applying tensile force to the clamps and to evenly fix in place the mask sheet by the clamps.
    Type: Grant
    Filed: November 7, 2008
    Date of Patent: June 11, 2013
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jong-Won Hong, Eugene Kang, Si-Young Park
  • Publication number: 20130134153
    Abstract: A joining apparatus includes a joining tool on which a joining component is held and which moves the joining component in an axial direction to position a metal section of the joining component on a surface of the workpiece. A heating device is provided for heating the metal section of the joining component to integrally couple the metal section to the workpiece. A sensor is connected to the joining tool acting to determine a zero point defined when a joining surface of the metal section has reached the surface of the workpiece before the workpiece is axially deformed.
    Type: Application
    Filed: January 25, 2013
    Publication date: May 30, 2013
    Applicant: NEWFREY LLC
    Inventor: Newfrey LLC
  • Publication number: 20130086783
    Abstract: A joining apparatus for joining together structural components of an aircraft, includes positioning means for holding the structural components to be joined in a defined desired position, in which the structural components can be fixedly joined together by means of a joining device that can be moved relative to the structural components by way of guiding means, wherein the positioning means encompass a formative frame structure that is detachably secured to the structural components to be connected along the joining edges outside in the edge area, and serves as a guiding means for the joining device movably secured hereupon.
    Type: Application
    Filed: October 3, 2012
    Publication date: April 11, 2013
    Applicant: AIRBUS OPERATIONS GMBH
    Inventor: AIRBUS OPERATIONS GMBH
  • Patent number: 8336757
    Abstract: A bonding apparatus for conducting bonding on substrates comprises a first substrate holding device for clamping a first substrate during bonding and a second substrate holding device for clamping a second substrate during bonding. Each substrate holding device is operative to move sequentially between its respective onloading position for receiving substrates, bonding position whereat substrates are bonded and offloading position whereat bonded substrates are removed from the substrate holding device. A first actuator is operative to drive the first substrate holding device along a first feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a first return path. A second actuator is operative to drive the second substrate holding device along a second feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a second return path.
    Type: Grant
    Filed: January 4, 2011
    Date of Patent: December 25, 2012
    Assignee: ASM Assembly Automation Ltd
    Inventors: Man Chung Ng, Wing Fai Lam, Chung Wai Ku
  • Publication number: 20120297614
    Abstract: A method and apparatus for managing the delivery of component parts and tooling to a robotic welding assembly positioned on a motor vehicle body assembly line. Automatic guided vehicles deliver component parts from a source of parts to a parts staging area on the robotic welding assembly including a substage awaiting area, a substage in-use area and a substage empty area, and further automatic guided vehicles deliver tooling from a tooling management area to the robotic welding assembly whereafter the tooling, upon model changeover, is moved to a tooling use area proximate the assembly line whereafter, upon further model changeover, the tooling is removed from the tooling use area and loaded onto an automatic guided vehicle for return to the tooling management area.
    Type: Application
    Filed: June 8, 2012
    Publication date: November 29, 2012
    Applicant: COMAU, INC.
    Inventor: Velibor KILIBARDA
  • Patent number: 8317077
    Abstract: A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The second work piece is heated using a heating head of a heating tool to melt the solder bump. After the step of heating the second work piece, one of the first and the second work pieces is allowed to move freely in a horizontal direction to self-align the first and the second work pieces. After the step of allowing one of the first and the second work pieces to move, a temperature of the heating head is lowed until the first solder bump solidifies to form a second solder bump.
    Type: Grant
    Filed: January 16, 2012
    Date of Patent: November 27, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien Ling Hwang, Ying-Jui Huang, Cheng-Chung Lin, Chung-Shi Liu
  • Publication number: 20120214258
    Abstract: The present invention provides a reliable die bonder that can accurately bond a die and a semiconductor manufacturing method. The present invention is provided with a bonding head that adsorbs a die from a wafer and bonds it to a substrate, a positioning mechanism that is provided with a first adjustment mechanism that positions a position of the die at predetermined accuracy, and positions the bonding head, a positioning controller that controls the positioning mechanism and a second adjustment mechanism that is provided to the bonding head, and adjusts a position of the die at higher accuracy than the first adjustment mechanism.
    Type: Application
    Filed: March 9, 2011
    Publication date: August 23, 2012
    Applicant: Hitachi High-Tech Instruments Co., Ltd
    Inventors: Masamichi KIHARA, Yoshiaki Kishi
  • Publication number: 20120168489
    Abstract: A bonding apparatus for conducting bonding on substrates comprises a first substrate holding device for clamping a first substrate during bonding and a second substrate holding device for clamping a second substrate during bonding. Each substrate holding device is operative to move sequentially between its respective onloading position for receiving substrates, bonding position whereat substrates are bonded and offloading position whereat bonded substrates are removed from the substrate holding device. A first actuator is operative to drive the first substrate holding device along a first feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a first return path. A second actuator is operative to drive the second substrate holding device along a second feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a second return path.
    Type: Application
    Filed: January 4, 2011
    Publication date: July 5, 2012
    Inventors: Man Chung NG, Wing Fai LAM, Chung Wai KU
  • Patent number: 8210417
    Abstract: A bonding apparatus for bonding substrates having metal bonding portions, includes: a processing container having an opening formed on the bottom of the processing container; a thermal treating plate disposed within the processing container, the thermal treating plate allowing for substrates to be mounted thereon and allowing for thermal treatment of the substrates; a pressing mechanism disposed within the processing container opposite the thermal treating plate and which presses the substrates to the thermal treating plate; an annular supporter which is disposed in an inner side of the processing container along the opening of the processing container, the annular supporter providing an airtight seal between the processing container and the thermal treating plate, and supporting the thermal treating plate; and a cooling mechanism which is disposed in an inner side of the supporter below the thermal treating plate, the cooling mechanism cooling the thermal treating plate.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: July 3, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Naoki Akiyama, Masahiko Sugiyama, Hajime Furuya
  • Patent number: 8201723
    Abstract: A method and apparatus for managing the delivery of component parts and tooling to a robotic welding assembly positioned on a motor vehicle body assembly line. Automatic guided vehicles deliver component parts from a source of parts to a parts staging area on the robotic welding assembly including a substage awaiting area, a substage in-use area and a substage empty area, and further automatic guided vehicles deliver tooling from a tooling management area to the robotic welding assembly whereafter the tooling, upon model changeover, is moved to a tooling use area proximate the assembly line whereafter, upon further model changeover, the tooling is removed from the tooling use area and loaded onto an automatic guided vehicle for return to the tooling management area.
    Type: Grant
    Filed: October 31, 2008
    Date of Patent: June 19, 2012
    Assignee: Comau, Inc.
    Inventor: Velibor Kilibarda
  • Patent number: 8196798
    Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.
    Type: Grant
    Filed: October 10, 2011
    Date of Patent: June 12, 2012
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Christoph Benno Luechinger, Orlando Luis Valentin
  • Patent number: 8162201
    Abstract: The present invention consists in a system and a method for installation of duct lines and/or pipelines comprising a pipe shop, supporting, rolling and guiding elements previously provided along a path of duct line/pipeline designed to be formed, the quantity of elements varying according to the length and the characteristics of the path, the said pipe shop comprising within the same a facility for welding, inspection and finishing of the pipes for forming the duct line/pipeline, the elements comprising a supporting base and a roller.
    Type: Grant
    Filed: March 4, 2009
    Date of Patent: April 24, 2012
    Inventor: Paulo Roberto Gomes Fernandes
  • Patent number: 8146222
    Abstract: A device and method for joining and tacking several individual components independently of shape and/or size to form inherently rigid, transportable sections for transportation vehicles, such as an aircraft is disclosed. According to one embodiment of the invention, the individual components may be spatially positioned relative to each other independently of shape and/or size. The spatial positions of the individual components may be determined by a measuring device, such as a laser measuring device, and varied via several positioning devices until a preset spatial position of the individual components has been reached in which the individual component are tacked together to form a section. In another embodiment, the positioning devices may be designed as base positioners, a first lateral positioner, a second lateral positioner, an upper positioner as well as an inner positioner.
    Type: Grant
    Filed: November 22, 2005
    Date of Patent: April 3, 2012
    Assignee: Airbus Deutschland GmbH
    Inventors: Holger Frauen, Tomas Gnauck, Eike Klemkow