Abstract: A chip junction nozzle in that opposite slant planes 43 which come into contact with edges of 2 sides of the chip in parallel centering around a nozzle center, and a vacuum suction hole 42 opened in the nozzle center are provided, and the slant plane 43 is formed into a mirror surface having the surface hardness more than HrC40. Further, when the surface roughness of the mirror surface is expressed by the average roughness of the center line, the average roughness of the center line is not more than 1.6 &mgr;m.

Abstract: The present invention provides a system and method for attaching a device to an inside wall of an enclosure. The device is removably attached to a positioner. Where the device includes a metal substance, it may be attached to the positioner by a magnet affixed to the positioner, for example. A first motor-operated moving device moves the enclosure such that the device abuts an inside wall of the enclosure. A second motor-operated moving device, for example a robot, then attaches the device to the inside wall of the enclosure. Where the enclosure and the device are composed of metal, the two may be welded together. In this instance, the first motor-operated moving device may be a non-robotic, motor-operated moving device that provides a ground path for the weld.

Abstract: A method for aligning and bonding balls to substrates, such as semiconductor wafers, dice and packages, is provided. The method employs a ball retaining plate having a pattern of micromachined cavities and vacuum conduits for retaining the balls. In addition, a substrate alignment member attached to the ball retaining plate, aligns the substrate to the balls. Using the substrate alignment member, bonding sites on the substrate can be placed in physical contact with the balls which are held by vacuum on the ball retaining plate. Next, the ball alignment plate and substrate can be place in a furnace for reflowing and bonding the balls to the bonding sites. An apparatus for performing the method includes the ball retaining plate and the substrate alignment member. A system for performing the method includes a ball loader mechanism for loading balls onto the ball retaining plate, and a vacuum fixture for applying a vacuum to the ball retaining cavities.

Abstract: To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.

Abstract: An improved pitch and roll mechanism is disclosed herein which provides for increased flexibility, stability, and accuracy of motion in positioning a miniaturized electronic component in a flip chip bonding system. The pitch and roll mechanism generally includes a pitch axis assembly comprising a plurality of bearing surfaces, each possessing a circular curvature, and at least one roller bearing in operative contact with at least one of the aforementioned pitch axis bearing surfaces. In addition, a roll axis assembly, mounted at a right angle, or perpendicularly, to the pitch axis assembly, is provided. The roll axis assembly typically includes a plurality of bearing surfaces, each possessing a circular curvature, and at least one roller bearing in operative contact with at least one of the aforementioned roll axis bearing surfaces. The curvatures of the pitch and roll axis bearing surfaces are such that a single, coincident center of rotation for both the pitch and roll axis assemblies is created.

Abstract: A workpiece positioner including a pair of generally vertical laterally displaced and opposing workpiece holder supports and a pair of workpiece holders. Each the pair of workpiece holders includes a first and second workpiece holder which are operably associated with one of the workpiece holder supports such that the opposing first workpiece holders are generally coaxially aligned and the second workpiece holders are generally coaxially aligned and the workpiece holders rotate about a first generally horizontal common axis with respect to the vertical workpiece holder supports, the first workpiece holders and the second workpiece holders, respectively, are disposed at least partially on an opposite side of a plane which runs generally perpendicular to the vertical workpiece holder support and through the horizontal common axis.

Abstract: A motor vehicle body assembly and welding station comprises a pair of facing tool (12) support conformators (11) designed to work on the body and taken between them by a conveyor system (14). The conformators are movable between a rest position in which the body is free to enter and exit the station and a work position in which the tools are near the body to work on it. At least some of the tools (12) comprise measurement means (20) for the relative position of facing body parts and the conformators have an intermediate position between said work and rest positions. On command control means (19) take the conformator into said intermediate position and activate the measurement means (20) to determine the agreement of body dimensions with predetermined measurement intervals and issue acceptance or rejection signals (22) for the body on the basis of the survey result.

Abstract: A plurality of robots are positioned on a rotatable table for transporting parts to be processed through a plurality of work stations positioned around the periphery of the table. Each robot can carry a workpiece from one work station to the next. The rotation of the table moves the robot from one workstation to the next while carrying a part to be processed. Each robot can be independently movable relative to the other robots and each robot can be independently movable relative to the table. Each robot can include a welder for processing the workpiece independent of the workstation or during movement between work stations. Each robot can carry a plurality of differently configured workpieces between the work stations.

Abstract: So as to confirm bonding precision for assuring accurate bonding, a precision confirmation substrate composed of a transparent sheet member and a precision confirmation chip composed of a transparent sheet member are used; and a precision confirmation substrate positioning component for positioning and fixing the precision confirmation substrate is provided on a bonding station, the precision confirmation chip is held by suction to a tool and disposed above the precision confirmation substrate, images of the precision confirmation substrate and precision confirmation chip are detected by an optical probe, the precision confirmation substrate and precision confirmation chip are moved and positioned relative to each other, the precision confirmation chip is then placed on the precision confirmation substrate, and the superimposed precision confirmation substrate and precision confirmation chip are again detected by the optical probe.

Abstract: The heating surface of an iron member is contacted to the upper surface of an electronic part such as a semiconductor chip to be mounted on a wiring substrate. Then solder electrode sections (solder balls) on the electronic part are dissolved so that the electronic part is soldered to a cupper foil pattern on the wiring substrate. And only the electronic parts necessary to be soldered are heated at a uniform heating temperature without influencing the periphery. Moreover, the iron member is moved by a moving head (iron head), and the wiring substrate is placed on a moving table to be moved. A semiconductor chip is mounted at a predetermined position on the wiring substrate by the movement of the iron member and the semiconductor substrate. The iron member is provided with a function of holding the semiconductor chip by attracting it, and thus the iron member has a function of a soldering apparatus and a function of a chip mounter.

Abstract: An end effector has a tower with non-stacked spatulas. Tolerance stacking is avoided by making grooves in the tower relative to a common reference surface, and mounting the spatulas in such grooves. The grooves are provided in separate planar walls of the tower. The walls intersect to enhance the structural properties of the tower. The tower has a dual-purpose clamp formed integrally with one wall for use in assembling the tower and the spatulas, and for mounting the completed end effector in a load lock. The spatula may carry a wafer during various operations, e.g., semiconductor processing, material deposition and etching systems, or in flat panel display processing systems. The carrying of the wafers is notwithstanding vibration of equipment for performing the manufacturing operations, which vibration is primarily in a range of frequencies.

Abstract: A positioning apparatus includes: a stage having a flat placement surface on which a thin plate is mounted. The placement surface has a flat region which is slightly larger than and completely covers that of said thin plate. The placement surface also has lateral side edges. An optical detecting means is arranged above the stage for detecting a mark provided on the thin plate and has such a view that the mark can be caught by the view if the thin plate placed on the placement surface is within the flat region, but the mark cannot be caught by the view if the thin plate placed on the placement surface protrudes by a part thereof from the region of the placement surface. A movable part pushes the thin plate until it comes into contact with the lateral edge to move the thin plate so that the thin plate is brought within the flat region of the placement surface.

Abstract: The present invention comprises a process system and a process method for mounting electrical components on leadframes. An endless conveyor belt is used for this purpose, having a holder which is attached to the conveyor belt. A leadframe is placed on the conveyor belt and is adjusted and locked relative to the holder. The leadframe thus maintains its position relative to the endless conveyor belt throughout the entire period for which it remains on the endless conveyor belt.

Abstract: A weld seam opening regulator for use in constricting cylindrical structures, including a frame, first and second wheels for riding on a first edge of a band of metal, a third wheel for riding on a first edge of a cylindrical portion of the structure, and a fourth wheel for riding on an inner surface of the cylindrical portion and maintaining a minimum weld spacing between the band and cylinder. Also, an adjustable bottom roller rides on a second edge of the metal band urges the metal band toward the cylindrical portion of the structure.

Abstract: An mounting apparatus for mounting an electrical component onto a substrate of an electrical assembly. The mounting apparatus employs a compensating element to facilitate the component mounting operation. The compensating element includes a spring member and a damping member. The spring member applies an optimal contact pressure for securely mounting said component without damaging the component. The damping element acts to damp the spring member during so as to effectively reduce a spring force that acts on the mounting apparatus during the component delivery stage.

Abstract: An apparatus and method for leveling the clamping surface to obtain proper heat sink for narrow strips in a coil end joiner which includes a coil material support table and a retaining plate which is positioned against the upper surface of the coil material to be joined by, for example, one or more air cylinders. A weld clamp leveler is also provided which is adjustable to provide a preselected offset between the coil material support table and the retaining plate in a forward portion of the coil material support table. The weld clamp leveler is preferably used when relatively narrow coil material is being joined to preclude tilting of the retaining plate relative to the coil material support table and the coil material being joined and is preferably adjusted to provide approximately the same offset between the coil end support table and the retaining plate as the thickness of the coil material being joined.

Abstract: A gripper for retaining a first element, such as a rotor blade, to a reciprocal motion assembly during friction welding includes a pair of clamp halves and a base. The base includes two spaced end walls. Upon joining the clamp halves together, around a collar on the first element, in the base the end walls compress the clamp halves both longitudinally and transversely, consequently causing the clamp halves to firmly grip the collar of the first element. Thus, the first element is securely held, while the motion provided by the reciprocal motion assembly is translated to the blade.

Abstract: The invention relates to a method for the temperature regulation of components, for example semiconductor circuits, printed circuit boards and the like, in which the components are conveyed on carriers through an inlet slot into a temperature-regulating housing provided with temperature-regulating members and are conveyed out through an outlet slot opposite the inlet slot. The carriers are accommodated by a magazine in the housing, which magazine is provided with adjacently arranged holders and, after the first holder has been loaded, is displaced progressively in one direction from a starting position into successive accommodating positions in which the individual holders of the magazine are loaded one after the other.

Abstract: A fixture containing a plurality of parallel optical fibers is aligned using a solder circuit that is itself mounted on the surface. The fixture is positioned on the circuit so as to be in contact with a quantity of solder. With the solder in the molten state, the fixture is aligned with respect to an element receiving light output from the optical fibers, and the alignment is secured by allowing the solder to solidify with the fixture immobilized.

Abstract: A system for manufacturing an aluminum alloy roof for a railway car includes a welding station, a welding unit moveably coupled to the welding station, the welding unit for applying a weld, a roof retainer for selectively holding roof components thereto and for removably coupling to a portion of the welding station, and a rotator unit coupled to the roof retainer for selectively rotating the roof retainer to allow the welding unit to weld the roof components with an orientation substantially perpendicular with respect to gravity. A method of manufacturing a railcar roof includes placing roof carlines and roof sheets on a roof retainer, aligning and clamping the roof carlines and roof sheets to the roof retainer, rotating the roof retainer with respect to a welding to unit, and welding desired weld locations between the roof sheets and roof carlines during rotation of the roof retainer with a desired orientation.

Abstract: An apparatus used for holding a first semiconductor device in proper alignment to a second semiconductor device, whose size is different from the first device, while performing a C4 bond between the two devices. The apparatus for holding the two devices in proper alignment consists of a holding fixture, which includes upper and lower pocket receptacles for receiving the semiconductor devices. The semiconductor devices are placed into the respective upper and lower slots aligned to two or more edges of the holding fixture.

Abstract: The top and bottom parts of a one-piece cover of a PCMCIA card are snapped together to form lap-joint seams which are welded together with a laser, under argon gas. Only a few small tack welds are required to substantially increases the mechanical strength and moisture resistance and to eliminate the risk of accidentally opening the card. The operation can be done at a high rate with minimal cost. Also, an internal frame may be made much narrower to allow more card area, while still meeting structural requirements for PCMCIA cards. The weld penetrates fully through the first layer of the seam and only partially through a second layer. During welding a fixture holds the seams in reasonably precise position and tightly closed so the seams are much tighter after welding than when the card is only snap closed. The precise positioning of the seams also allows the size of the weld to be minimized which reduces the risk of burn through which may damage electronic components enclosed within the card during welding.

Abstract: A chip junction nozzle in that opposite slant planes 43 which come into contact with edges of 2 sides of the chip in parallel centering around a nozzle center, and a vacuum suction hole 42 opened in the nozzle center are provided, and the slant plane 43 is formed into a mirror surface having the surface hardness more than HrC40. Further, when the surface roughness of the mirror surface is expressed by the average roughness of the center line, the average roughness of the center line is not more than 1.6 &mgr;m.

Abstract: A method of bonding wire between at least one pair of bond locations in a semiconductor device and the bonder. A conveyor is provided having a conveying surface for conveying in a predetermined direction a partially fabricated semiconductor device having first and second bonding locations. A first capillary is provided for forming a stitch bond to the first bonding location, the first capillary being disposed at an angle of about 45 degrees with respect to the predetermined direction and a line normal thereto and substantially parallel to the plane of the conveying surface. A stitch bond is formed on the first bonding location with the first capillary. The first capillary is at an angle of substantially 45 degrees with respect to a line normal to the plane of the conveying surface.

Abstract: A semiconductor die bonder (10) has a height adjuster (13) that is positioned next to the die bonding head (11). The height adjuster (13) assist in ensuring that die bonding head (11) positions a semiconductor die (36) at the desired bond line thickness.

Abstract: An ultrasonic vibration bonding machine which can simplify a suction passage structure. A resonator has a suction passage at the maximum vibration amplitude point where a bonding working portion is provided, the positions of the pads of a circuit board mounted on a mounting unit and the positions of the pads of a semiconductor chip absorbed and adsorbed to the bonding working portion are measured to align the pads accurately, and then the pads are bonded together.