Abstract: A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The second work piece is heated using a heating head of a heating tool to melt the solder bump. After the step of heating the second work piece, one of the first and the second work pieces is allowed to move freely in a horizontal direction to self-align the first and the second work pieces. After the step of allowing one of the first and the second work pieces to move, a temperature of the heating head is lowed until the first solder bump solidifies to form a second solder bump.

Abstract: The present invention provides a reliable die bonder that can accurately bond a die and a semiconductor manufacturing method. The present invention is provided with a bonding head that adsorbs a die from a wafer and bonds it to a substrate, a positioning mechanism that is provided with a first adjustment mechanism that positions a position of the die at predetermined accuracy, and positions the bonding head, a positioning controller that controls the positioning mechanism and a second adjustment mechanism that is provided to the bonding head, and adjusts a position of the die at higher accuracy than the first adjustment mechanism.

Abstract: A bonding apparatus for conducting bonding on substrates comprises a first substrate holding device for clamping a first substrate during bonding and a second substrate holding device for clamping a second substrate during bonding. Each substrate holding device is operative to move sequentially between its respective onloading position for receiving substrates, bonding position whereat substrates are bonded and offloading position whereat bonded substrates are removed from the substrate holding device. A first actuator is operative to drive the first substrate holding device along a first feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a first return path. A second actuator is operative to drive the second substrate holding device along a second feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a second return path.

Abstract: A bonding apparatus for bonding substrates having metal bonding portions, includes: a processing container having an opening formed on the bottom of the processing container; a thermal treating plate disposed within the processing container, the thermal treating plate allowing for substrates to be mounted thereon and allowing for thermal treatment of the substrates; a pressing mechanism disposed within the processing container opposite the thermal treating plate and which presses the substrates to the thermal treating plate; an annular supporter which is disposed in an inner side of the processing container along the opening of the processing container, the annular supporter providing an airtight seal between the processing container and the thermal treating plate, and supporting the thermal treating plate; and a cooling mechanism which is disposed in an inner side of the supporter below the thermal treating plate, the cooling mechanism cooling the thermal treating plate.

Abstract: A method and apparatus for managing the delivery of component parts and tooling to a robotic welding assembly positioned on a motor vehicle body assembly line. Automatic guided vehicles deliver component parts from a source of parts to a parts staging area on the robotic welding assembly including a substage awaiting area, a substage in-use area and a substage empty area, and further automatic guided vehicles deliver tooling from a tooling management area to the robotic welding assembly whereafter the tooling, upon model changeover, is moved to a tooling use area proximate the assembly line whereafter, upon further model changeover, the tooling is removed from the tooling use area and loaded onto an automatic guided vehicle for return to the tooling management area.

Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.

Abstract: The present invention consists in a system and a method for installation of duct lines and/or pipelines comprising a pipe shop, supporting, rolling and guiding elements previously provided along a path of duct line/pipeline designed to be formed, the quantity of elements varying according to the length and the characteristics of the path, the said pipe shop comprising within the same a facility for welding, inspection and finishing of the pipes for forming the duct line/pipeline, the elements comprising a supporting base and a roller.

Abstract: A device and method for joining and tacking several individual components independently of shape and/or size to form inherently rigid, transportable sections for transportation vehicles, such as an aircraft is disclosed. According to one embodiment of the invention, the individual components may be spatially positioned relative to each other independently of shape and/or size. The spatial positions of the individual components may be determined by a measuring device, such as a laser measuring device, and varied via several positioning devices until a preset spatial position of the individual components has been reached in which the individual component are tacked together to form a section. In another embodiment, the positioning devices may be designed as base positioners, a first lateral positioner, a second lateral positioner, an upper positioner as well as an inner positioner.

Abstract: A device for machining components, in particular of a vehicle body has a transport and positioning unit for the component and several machining stations, which are arranged around said unit and to which the component held by a component holder of the transport and positioning unit can be fed in a position ready for machining. To transport the component from one machining station to the other machining stations while taking up the smallest possible surface area, the transport and positioning unit includes a rotor and a pivoting arm that is mounted eccentrically on said rotor, driven in opposition to the latter and supports the component holder. The drives of the rotor and the pivoting arm are synchronized in such a way that the component holder is displaced along a closed curved path comprising spaces between the neighboring apexes of said path.

Abstract: A device for machining components, in particular of a vehicle body has a transport and positioning unit for the component and several machining stations, which are arranged around said unit and to which the component held by a component holder of the transport and positioning unit can be fed in a position ready for machining. To transport the component from one machining station to the other machining stations while taking up the smallest possible surface area, the transport and positioning unit includes a rotor and a pivoting arm that is mounted eccentrically on said rotor, driven in opposition to the latter and supports the component holder. The drives of the rotor and the pivoting arm are synchronized in such a way that the component holder is displaced along a closed curved path comprising spaces between the neighboring apexes of said path.

Abstract: An embodiment of the invention comprises a method associated with a PCB having a first component, and a second component, that has substantially less thermal mass than the first component. During an initial time period, the PCB and its components are placed at an initial position proximate to a first heat source, which is operable to provide heat energy in accordance with a thermal profile comprising successive phases. After the initial time period, the first heat source is operated during each of the phases in accordance with the thermal profile to selectively apply heat to the PCB and to the plurality of components thereon. During the initial time period or a specified one of the phases, selectively, heat energy from a focused heat source is directed only to the first component, and not to other components.

Abstract: A wire alignment tool for use during soldering is disclosed. The tool includes a handle configured to contain a supply of solder, a solder advancement mechanism constructed and arranged to move the supply of solder from the handle to a soldering locus, and a clamping mechanism constructed and arranged to maintain two or more wires to be soldered at the soldering locus.

Abstract: A manufacturing apparatus (2) for components (3), which has at least one movable loading station (20) designed as a tool magazine (13) and having reception points (39) with different tools (4, 5, 6, 7) for different component types A-I. The loading station (20) is connected to one or more machining stations (20, 22?) at which at least one machining device (23) and at least one handling device (24) for handling and releasing the components (3) from the tool (4, 5, 6, 7, 8) are arranged. The selected Figure is FIG. 5.

Abstract: Adjustable, elongate, beam-offset jig structure for assisting, under manual, or appropriate computer, control, in welding a pair of beam-end, column-interface components to the opposite ends of an elongate beam. The jig structure includes spaced, adjustable head-stock and tail-stock structures, each capable of holding such a component adjacent a beam end for adjustment to an infinite number of different, pre-weld angular-offset dispositions relative to such a beam end in order to accommodate planned horizontal and vertical beam offsets which will be encountered when such beams are installed in a building frame. A computer-controlled, robotic welder may be provided adjacent each end of the jig structure to implement appropriate welding when any and all offset angles have been jig-established.

Abstract: A welding facility includes a main welding line for manufacturing an assembly of frame members, and a sub-welding line for manufacturing an assembly of panel members, the sub-welding line merging with the main welding line. The main welding line is comprised of a plurality of welding stages provided with a welding robot, the sub-welding line is provided at the end with a transfer mechanism for transferring the panel member assembly to the desired welding stage, and the merging parts are changeable according to the type of product to be welded. The facility permits a plurality of vehicle bodies having different vehicle types to be manufactured using the same manufacturing line.

Abstract: A stud welding apparatus comprises a feeder to receive a plurality of studs and feed the stud one by one with the stud being fed in advance of a weld portion thereof from an outlet of the feeder; and a welding gun to receive the stud as fed from the feeder through a feeding pipe to hold the stud and to weld the stud to a workpiece. The outlet of the feeder is provided with a shuttle loader wherein a hollow shuttle is loaded to a rod body of the stud to extend the length of a short stud, so that the shuttle loaded stud is lengthened as a whole to prevent the shuttle loaded stud from tumbling in the feeding pipe and/or a stud path in the welding gun.

Abstract: A welding apparatus includes a table on which first, second and third blanks are to be fixed, a first positioning station where the first and second blanks are fixed on the table, a first welding station where the first and second blanks are welded together at their abutting surfaces, a cutting station where the abutting surface of the first or second blank or both is cut into a predetermined shape, a second positioning station where the third blank is fixed on the table, and a second welding station where the third blank and the first or second blank or the first and second blanks are welded together at their abutting surfaces.

Abstract: A robotic welding cell includes a frame, a robot arm connected to the frame, a welding gun affixed to the robot arm, a welding table connected to the welding frame, and means to move the welding table in or about at least two mutually perpendicular axes. A welding table assembly for use in a robot welding cell is also disclosed.

Abstract: A fixture exchange rail system is provided having first and second fixture assemblies movably mounted with respect to respective first and second stationary rails. A movable rail is disposed substantially adjacent to, and movable between, the first and second stationary rails. The movable rail is sufficiently configured to selectively receive the first and second fixture assemblies thereon. A method of operating a workstation having a fixture exchange rail system operable to enable work on a workpiece is also provided including the steps of: A) determining the style of workpiece present at the workstation; B) aligning a movable rail with one of a first and second stationary rail having a respective first and second fixture assembly mounted thereto corresponding to the style of workpiece; and C) moving the fixture assembly corresponding to the style of workpiece from the stationary rail to the movable rail.

Abstract: A die bonding apparatus is presented which is capable of realizing different semiconductor packages, for example, a face up package and a face down package in a single die bonding apparatus. The die bonding apparatus includes a substrate transportation unit for transporting a substrate. A first bonding head unit is included which has a first bonding head for bonding a semiconductor chip disposed in a mount table adjacent to the substrate transportation unit over the substrate. A die transportation unit is included for transporting the semiconductor chip disposed in a mount table to a mount stage disposed at a lower portion of the substrate. A second bonding head unit is included in which the mount stage and a second bonding head disposed at an upper portion of the substrate corresponding to the mount stage and bonding the semiconductor chip disposed in the mount stage to the lower portion of the substrate.

Abstract: A motor vehicle car body framing apparatus for use at a welding station, the apparatus including a gate having a frame structure and a plurality of tooling members carried by the frame structure for use in positioning components of the vehicle body at the welding station for welding. The tooling members are mounted on the frame structure by a plurality of mounting brackets. Each mounting bracket includes a base member mounted on the frame structure and a riser mounted on the base and mounting a respective tooling member. The riser is fixedly mounted on the base by a single central fastener bolt which may include a reduced diameter portion sized to break away in response to predetermined impact against the riser. Each mounting bracket further includes means defining a triangulated mounting interface between the base and the riser arranged in concentric relation to the fastener bolt.

Abstract: The assembly of body components using a geometry box (1) and clamping frames (7, 8) is described. At least for the larger components (9, 10), in particular the side wall parts of the body, a multipart clamping frame (8a, 8b) is used. The component (9, 10) is grasped and fed to the geometry box (1) using one clamping frame part, while the other clamping frame part is fed empty. Using both clamping frame parts, the component (9, 10) is then fixed precisely in position using positioning and fixing units acting between the geometry box (1) and the clamping frame (7, 8) in such a way that the components (6, 9, 10) to be connected to one another may be connected to one another, in particular welded.

Abstract: A die bonder is provided comprising a bond head including a collet for picking up a die and bonding the die at a bonding site. The die bonder further comprises a first motor which is connected to the collet by a shaft for driving the collet in driving directions towards and away from the bonding site and a second motor which is connected to the bond head for driving the bond head in directions parallel to the driving directions of the first motor. A rotary motor is also operatively connected to the collet for rotating the collet about a rotational axis that is parallel to the driving directions of the first motor. The shaft is slidably connected to the rotary motor and is slidable relative to the rotary motor when it is driven by the first motor to move.

Abstract: Adjustable, elongate, beam-offset jig structure for assisting in welding a pair of beam-end, column-interface components to the opposite ends of an elongate beam. The jig structure includes spaced, adjustable head-stock and tail-stock structures, each capable of holding such a component adjacent a beam end for adjustment to an infinite number of different, pre-weld angular-offset dispositions relative to such a beam end in order to accommodate planned horizontal and vertical beam offsets which will be encountered when such beams are installed in a building frame. A computer-controlled, robotic welder is preferably provided adjacent each end of the jig structure to implement appropriate welding when any and all offset angles have been jig-established.

Abstract: Plate members 17 are respectively rested on first and second tables 1A and 1B relatively movable toward and away from each other. The plate members 17 are caused to abut against reference positioning members 16a and 16b of reference positioning devices protruded ahead of and over opposing ends 1? of the tables 1A and 1B so that opposing ends of the plate members 17 are positioned ahead of the opposing ends 1? of the tables 1A and 1B, and the plate members 17 are positioned laterally. Then, the positioned plate members 17 are locked on the tables 1A and 1B. After the reference positioning devices are retracted, the tables 1A and 1B are relatively moved toward each other to cause the opposing ends of the plate members 17 to abut together for formation of weld line X.

Abstract: A machining station and a method produce vehicle bodies of different types. A clamping station has interchangeable clamping frames, at least one clamping frame magazine, into which the interchangeable clamping frames are deposited when not in use and from which the interchangeable clamping frames are removed when in use, and at least one robot for transporting the interchangeable clamping frames. The interchangeable clamping frames, in particular the clamping frames for the vehicle body side parts, are divided into a plurality of separable segmental clamping frames, with, to convert to a different type of vehicle body, one segmental clamping frame in each case being transported by a robot from the clamping station to the clamping frame magazine, being deposited there, a segmental clamping frame of a different type being removed from the clamping frame magazine and this segmental clamping frame being transported to the clamping station.

Abstract: An apparatus is provided for arranging for processing a semiconductor device having surface components on its surface. A device support comprising a set of protrusions for contacting a surface of the semiconductor device supports the semiconductor device on a plane. The protrusions are arranged and positioned such that they avoid contact with the surface components on the surface. In order to grip the semiconductor device supported on the plane, a clamping device having a first set of clamps is configured for gripping the semiconductor device along a first axis and a second set of clamps is configured for gripping the semiconductor device along a second axis perpendicular to the first axis.

Abstract: A motor vehicle body framing apparatus located at a welding station of a motor vehicle assembly line for use in precisely positioning body panels arriving at the welding station for welding. The apparatus includes a base structure positioned at the welding station and having a longitudinal extent in the direction of body panel movement and a transverse extent; a parking structure upstanding vertically from the base structure on either side of the welding station and each defining parking devices; and a pair of longitudinal side gates each carrying tooling fixtures for engagement with body side panels and each including parking devices operative in coaction with the parking devices on the upstanding parking structures to precisely position the gates on the parking structure and thereby precisely position the tooling fixtures relative to the body panels.

Abstract: A robotic welding system is provided that includes multiple welding cells equidistantly spaced in a circular arrangement, multiple perimeter light curtains to provide safety protection around the welding cells, a turntable centrally located in the circular arrangement, and multiple welding robots attached to the turntable. The welding system further includes a first welding process and a second welding process whereby both the first welding process and the second welding process each include a primary welding operation and a secondary welding operation whereby the turntable rotates between the welding cells to perform the primary and secondary welding operations.

Abstract: Disclosed are a solder attachment jig and a method of manufacturing a semiconductor device using the same. The solder ball attachment jig, which arranges a solder ball to be aligned with a conductive post of a semiconductor wafer, can include a body and a receiving hole, which is formed on the body to hold the solder ball. Internal walls of the receiving hole that face each other are symmetrically inclined. Using the solder ball attachment jig in accordance with an embodiment of the present invention, the alignment of the solder ball can be improved while reducing the cost and simplifying the processes.

Abstract: A method for soldering a soft wire to a printed circuit board conveniently includes the following step: providing a bracket having a through hole and an enameled wire; fastening the enameled wire to the bracket with the conductive wire crossing over the through hole; providing a printed circuit board formed with conductive pads thereon and setting the printed circuit board onto the bracket with the pad aligned to the through hole so that a portion of the magnet wire crossing the through hole lies on the conductive pad; providing a soldering tool having a thermal contact portion and inserting the thermal contact portion into the through hole to solder the magnet wire to the conductive pad.

Abstract: A flexible system for welding motor-vehicle bodies or subassemblies thereof envisages a series of pairs of side frames provided with referencing and clamping devices for keeping in the correct position the structures to be assembled during welding. For each different type of body to be assembled a different pair of side frames is provided, equipped with referencing and clamping devices adapted to the respective type of body. Each pair of side frames is associated to a basic structure, with which it forms a unitary referencing and clamping module. Said modules can be moved through the assembly station to follow one another in the operative welding position, according to the type of body to be welded. The structure to be assembled, or at least part thereof, is fed to the welding station by means of a conveying line that is totally independent and separate from the basic structures of the modules.

Abstract: An apparatus and method for randomly interchanging up to four pairs of side framing gates at a framing station of a vehicle assembly line while maintaining a predetermined build cycle time interval of the assembly line. The system employs first and second carousels positioned on opposite sides of the assembly line upstream of the framing station and third and fourth carousels positioned on opposite sides of the production line downstream of the framing station.

Abstract: Adjustable, elongate, beam-offset jig structure for assisting in welding a pair of beam-end, column-interface components to the opposite ends of an elongate beam. The jig structure includes spaced, adjustable head-stock and tail-stock structures, each capable of holding such a component adjacent a beam end for adjustment to an infinite number of different, pre-weld angular-offset dispositions relative to such a beam end in order to accommodate planned horizontal and vertical beam offsets which will be encountered when such beams are installed in a building frame. A computer-controlled, robotic welder is preferably provided adjacent each end of the jig structure to implement appropriate welding when any and all offset angles have been jig-established.

Abstract: It is made possible to position plate members to be butt-welded for formation of weld line in a small amount of time so as to enhance working capacity of butt welding. Plate members 17 are respectively rested on first and second tables 1A and 1B relatively movable toward and away from each other. The plate members 17 are caused to abut against reference positioning members 16a and 16b of reference positioning devices protruded ahead of and over opposing ends 1? of the tables 1A and 1B so that opposing ends of the plate members 17 are positioned in protrusion ahead of the opposing ends 1? of the tables 1A and 1B, and the plate members 17 are positioned laterally. Then, the positioned plate members 17 are locked on the tables 1A and 1B. After the reference positioning devices are retracted, the tables 1A and 1B are relatively moved toward each other to cause the opposing ends of the plate members 17 to abut together for formation of weld line X.

Abstract: A clamping device or system (1) is provided for body parts (8, 9), which have a component clamping contour (11), especially a component flange. The clamping device or system (1) has one or more clamping devices (2, 3), which have each a frame-like structure (12) with fixed and mobile clamping units (18, 19) arranged therein, which are present in a plurality of pairs. The clamping units (18, 19) have a strip-shaped design and are adapted to the course of the component clamping contour. Furthermore, the clamping device or system (1) has an adjusting device (21), which feeds the mobile clamping units (19) to the component clamping contour and actuates them together or in a controllable sequence.

Abstract: One embodiment of the invention is directed toward an alignment device for soldering roughed-in pipes for plumbing applications that assists plumbers by acting as a third hand for the plumber. One portion of the device removably attaches to a plumbing wall-strap while another portion of the device holds one or more pipes perpendicularly in place, in order that a plumber may solder the pipes in place without the need for assistants or additional tools.

Abstract: A motor vehicle body framing apparatus located at a welding station of a motor vehicle assembly line for use in precisely positioning body panels arriving at the welding station for welding. The apparatus includes a base structure positioned at the welding station and having a longitudinal extent in the direction of body panel movement and a transverse extent; a parking structure upstanding vertically from the base structure on either side of the welding station and each defining parking devices; and a pair of longitudinal side gates each carrying tooling fixtures for engagement with body side panels and each including parking devices operative in coaction with the parking devices on the upstanding parking structures to precisely position the gates on the parking structure and thereby precisely position the tooling fixtures relative to the body panels.

Abstract: In accordance with one aspect of the present exemplary embodiment, set forth is a welding system including a plurality of adjustable welding support structures positioned in relationship to each other to permit welding of a workpiece held by a plurality of adjustable welding support structures, each of the support structures having a movable platform. The control system individually controls the position of the movable platform for each of the adjustable welding structures. In another embodiment of the present application, provided is a method for increasing the accuracy at which an adjustable support structure control system positions at least one adjustable support structure. Included in the process is the generation of a model of the adjustable support structure having an initial set of parameters, including structural position parameters and corresponding control element position parameters.

Abstract: In accordance with one embodiment of the present application, provided is a welding support structure arrangement to support an elongated assembled weldment preparatory to positional welding. The arrangement includes at least one support structure having a support base and a movable platform connected to the support base by spaced-apart 2-bar linkages with center pintels and a series of length adjusting members between the pintels and the support base. A length adjusting member is located between the movable platform and the support base, wherein the lengths of the length adjusting members set the orientation of the movable platform. In accordance with another embodiment of the present application, welding support structures are arranged in a linear array, wherein each of the welding support structures include a movable platform. At least some of the movable platforms of the plurality of support structures are moved to predetermined orientations.

Abstract: An electrical connector is soldered or affixed to a conductive element of a glass sheet of a vehicular window via radiation heating of a layer of solder with an infrared radiative heating device. The heating device may include an infrared lamp and a reflector, which functions to direct the radiant energy from the lamp to a target region generally corresponding with the location of the solder layer between the electrical connector and the conductive element. The heating device is operable to rapidly and substantially heat the solder layer to a desired temperature to melt the solder layer, while substantially limiting directing of heat to the glass sheet. The electrical connector may be affixed at a vehicular or modular window assembly plant, such that the glass sheet may be transported from a glass manufacturing plant to the vehicular or modular window assembly plant without the electrical connector.

Abstract: A device for orienting an integrated lead suspension tail during a head gimbal assembly soldering operation of a head stack assembly process is disclosed. The device includes a body portion and at least one pin extending from the body portion. The pin(s) is configured to position the integrated lead suspension tail proximate to a main flex cable such that electrical coupling between the integrated lead suspension tail and the main flex cable is established upon completion of said head gimbal assembly soldering operation. The pin(s) has sufficient length to extend past a terminal end of the main flex cable.

Abstract: A machining system and unit, especially a welding cell, is provided for use for the machining of workpieces (2), especially body parts of vehicles. The machining system has one or more machining stations (15, 16) with robots (18, 19, 20) and at least one rotation or turning station (5), which has at least two work stations (6, 7) for carrying out different operations simultaneously. The turning station (5) has at least two said multiaxially movable turning units (8, 9) arranged next to one another with said gripping tools (11, 12, 13). The working areas (10) intersect each other at the work stations (6, 7).

Abstract: A system for the welding of motor-vehicle bodies comprises a conveying line, for carrying the motor-vehicle bodies to be welded through a welding station, and a plurality of pairs of side gates mobile on guide means, the gates of each pair being adapted to the configuration of a corresponding type of body to be welded. According to the invention there is provided a plurality of tractors, which are independent with respect to said side gates, each tractor being selectively coupleable in an automatic way to side gates of different pairs, for the purposes of displacement of the latter between an active position, close to the welding station, and at least one parking position, remote from the welding station.

Abstract: A method for assembling an electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink; and an adhesive layer for mechanically coupling the heat sink to the ground layer of the substrate, the adhesive layer having at least one aperture wherein aligning the at least one substrate solder aperture with the at least one adhesive layer aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

Abstract: A counterweight assembly is especially adapted for mounting to a spinner tool allowing a workpiece to be balanced when rotated during welding or other operations. The counterweight assembly has an adjustable counterweight to provide a necessary amount of counterbalance force depending upon the particular size and configuration of the workpiece. The spinner tool is adapted to secure various diameters of pipe as well as pipe flanges. The spinner tool can be mounted within a portable vise that can be used directly at a work site.

Abstract: An apparatus for semi-automatically reconditioning an articulated connector while it is still mounted to the end structure of a rail car is disclosed. The apparatus is mountable to the connector and measures to find areas and amounts of wear on portions of the connector. The apparatus then applies weld metal to the worn portion of the connector. The excess weld metal is automatically machined away by the apparatus so that the connector falls within the required dimensions. The apparatus can again measure the weld area to ensure that the specified dimensions have been achieved. A method of aligning an articulated connector to a reconditioning fixture is also disclosed. The method includes securing the fixture to the connector and the use of gauges and tools to appropriately align the objects.

Abstract: To align the edges of plates prior to joining them, a generally cylindrical anchor member is spot welded at one location on one of its rims to a plate. A mounting element of a clamp body member slidably engages the anchor member. A force applicator element of the clamp body member is generally laterally spaced from the mounting element. The mounting element includes a generally arcuately extended semi-cylindrical socket portion of such a diameter that it slidably and snugly mounts the socket portion thereon. The rim portions of the anchor member provide a plurality of spot mounting locations for breakably spot welding, brazing or otherwise temporarily attaching the anchor member to a plate or other substrate. At least one of the force applicator or mounting elements is adapted to the incremental application of aligning force on adjacent plates. The body of the clamp bridges between the respective plates that are to be brought into line with one another.

Abstract: The device for positioning a tool (1) in relation to a workpiece (6) controls drives (2, 3, 4) in relation to three spatial axes (x, y, z) through two cameras (10, 11), the first (1) of which takes an image essentially along a spatial axis (y), the other (11) being oriented essentially vertically with respect to a surface (8) of the workpiece.

Abstract: Apparatus for locating and grasping a flange include a plurality of clamp arms that move from an unclamped position to a clamped position, clamping the flange to the upper surface of a support platform. A plurality of pins are adapted to move upwardly into flange holes within the flange for positioning the flange during the clamping action. The locating and the clamping of the flange to the upper surface of the support platform are accomplished by a single pusher rod that is connected to both the pins and the clamps. The method comprises using a single pusher rod connected to both the pins and the clamps for locating and clamping the flange to the upper surface of a platform.