Abstract: A far infrared sensor package includes a package body and a plurality of far infrared sensor array integrated circuits. The plurality of far infrared sensor array integrated circuits are disposed on a same plane and inside the package body. Each of the far infrared sensor array integrated circuits includes a far infrared sensing element array of a same size.

Abstract: In some embodiments, a method and apparatus, as well as an article, may operate to determine properties based on detected optical signals. An optical detection apparatus can include an optical detector for detecting light received through a fiber optic cable; a housing for enclosing the optical detector; a light source; and a cooling mechanism having the housing mounted thereto. The cooling mechanism can maintain the temperature of a light-sensitive region of the optical detector within a temperature range below 210 degrees Kelvin. Additional apparatus, systems, and methods are disclosed.

Abstract: Methods and systems for analyzing a field. The methods and systems acquire a thermal image indicative of thermal energy emitted by the soil and/or plants in the field and process the thermal image to assess variations in certain characteristics of the soil and/or plants.

Abstract: The disclosure has a configuration including: a supporting substrate having a cavity; at least one bridge section extending directly above the cavity and having at least one end supported by the supporting substrate and an other end; and a thermopile wiring formed in the bridge section and including hot junctions in the bridge section and cold junctions directly above the supporting substrate, the hot junctions being connected to the cold junctions. The bridge section is provided with: at least one breakage detection wiring for detecting breakage of the bridge section; and at least one heater wiring. The breakage detection wiring is wired along the thermopile wiring. The heater wiring is wired such that part of the heater wiring is in an area between the other end of the bridge section and the hot junctions.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes an image sensing element disposed within a pixel region of a substrate. A plurality of conductive interconnect layers are disposed within a dielectric structure arranged along a first side of the substrate. A second side of the substrate includes a plurality of interior surfaces arranged directly over the image sensing element. The plurality of interior surfaces respectively include a substantially flat surface that extends along a plane.

Abstract: Structures including a photodetector and methods of fabricating such structures. A substrate, which is composed of a semiconductor material, includes a first trench, a second trench, and a pillar of the semiconductor material that is laterally positioned between the first trench and the second trench. A first portion of a dielectric layer is located in the first trench and a second portion of the dielectric layer is located in the second trench. A waveguide core is coupled to the pillar at a top surface of the substrate.

Abstract: A bolometer pixel trigger including a substrate, a bolometer formed on the substrate, and a thermal-sensitive film trigger. The thermal-sensitive film trigger includes a resistive varying thermal-sensitive material configured to change resistance in response to a change in temperature thereof. The thermal-sensitive film trigger is configured such that current flow therethrough varies in response to changes in the resistance of the resistive varying thermal-sensitive material.

Abstract: Focal Plane Arrays (FPAs) or methods to produce FPAs may be provided for a microbolometer based thermal imaging sensor utilizing wafer level processing (WLP) techniques for manufacture. Batch processing techniques for sealing a cap wafer to an FPA wafer to produce vacuum sealed FPAs may be accomplished with suitable FPA design features in conjunction with a glass frit seal methodology utilizing appropriate frit glass compositions.

Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays.

Abstract: A device for detecting traces of explosive materials, weapons, firearms, knives or drugs is disclosed. The device is used a stand-alone device, or coupled to an explosive detector using mass spectrometry or ion mobility spectrometry technologies. The device comprises a plurality of sensors, a controller and a memory coupled to the processor. The sensors include radar, a position sensor, a camera and so on. The device scans a plurality of subjects in a field of regard. Based on the signals obtained from the sensors, the device determines presence of the explosive materials, weapons, firearms, knives or drugs and alerts a user of the device.

Abstract: A projection display device includes: a light source that emits a first laser light for displaying a projection and a second laser light for inspection; a scanning drive mirror that reflects the first laser light and the second laser light emitted from the light source, and uses the first laser light and the second laser light in scanning; a light diffusion unit that allows the first laser light used in the scanning by the scanning drive mirror to be transmitted through the light diffusion unit and diffuses the first laser light; a light selection unit that allows the first laser light to be transmitted through the light selection unit and reflects the second laser light at a position on an emission surface of the light diffusion unit; and a light detection unit that detects the second laser light reflected by the light selection unit.

Abstract: A night vision apparatus having a camera assembly with a camera housing that has a charge-coupled device image sensor, an infrared illuminator assembly, and a first base assembly. Further having a switch assembly and a display assembly. The camera housing has a top face, a bottom face, a front face, a lens, and an adaptor. The lens has a focal length of approximately 25 mm or 50 mm. The infrared illuminator assembly has a housing, an infrared illuminator lens, an infrared illuminator, and a supporting structure. The infrared illuminator is an approximately 2.5 watt illuminator that produces an approximately 10° main beam pattern. The infrared illuminator assembly is attached to the camera housing. The first base assembly has a suction cup secures the camera assembly onto a surface. The switch assembly is electrically connected to a battery assembly. The display receives and shows images captured by the camera assembly.

Abstract: Various embodiments disclosed herein describe a divided-aperture infrared spectral imaging (DAISI) system that is adapted to acquire multiple IR images of a scene with a single-shot (also referred to as a snapshot). The plurality of acquired images having different wavelength compositions that are obtained generally simultaneously. The system includes at least two optical channels that are spatially and spectrally different from one another. Each of the at least two optical channels are configured to transfer IR radiation incident on the optical system towards an optical FPA unit comprising at least two detector arrays disposed in the focal plane of two corresponding focusing lenses. The system further comprises at least one temperature reference source or surface that is used to dynamically calibrate the two detector arrays and compensate for a temperature difference between the two detector arrays.

Abstract: Inspection apparatus includes an imaging module, which is configured to capture images of defects at different, respective locations on a sample. A processor is coupled to process the images so as to automatically assign respective classifications to the defects, and to autonomously control the imaging module to continue capturing the images responsively to the assigned classifications.

Abstract: A photodetector includes a first semiconductor layer and a second semiconductor layer provided on the first semiconductor layer and detecting light. The first semiconductor layer has a cavity portion for reflecting incident light.

Abstract: Systems, methods, and apparatuses having an array of micro mirrors that rotate according to absorbed radiation and reflect light to generate light spots. In a first setting, a processor obtains an image of the light spots, determines positions of the light spots using a computationally efficient but less accurate method to calculate the intensities of radiation directed at the micro mirrors, and provides the calculated radiation. In a second setting, the processor does not determines the position; and the image is transmitted to a separate computing device to determine positions of the light spots using a computationally intensive but more accurate method to calculate the intensities of radiation directed at the micro mirrors. The system can dynamically switch between the first setting and second setting without a need to adjust hardware.

Abstract: A thermal imaging system includes a pixel array having a plurality of pixel groups. Each pixel group including a plurality of pixel rows and a trigger sense circuit including a pixel group input line in signal communication with the plurality of bolometer pixels pixel row containing a plurality of bolometer pixels. The pixel group further includes a selector switch that selectively establishes an electrical connection between the pixel group and the trigger sense circuit. The selector switch operates in a first state to disconnect the pixel group from the pixel group input line while connecting the pixel group to the integration unit such that the integration unit generates the image, and a second state to disconnect the pixel group from the integration unit while connecting the pixel group to the pixel group input line such that the trigger sense circuit monitors the pixel group for a high temperature bolometer.

Abstract: An apparatus for discreet imaging of a scene, comprising: at least one short wave infrared (SWIR) sensor that captures at least one SWIR image of the scene at a SWIR wavelength range, at least one SWIR illumination element that generates SWIR illumination at the SWIR wavelength range, and a barrier positioned such that SWIR illumination reflecting off objects of scene within the field of view passes through the barrier to reach the at least one SWIR sensor, the barrier made out of a material and having a thickness selected for being opaque to visible light and non-opaque to the SWIR wavelength range.

Abstract: Device for observing a sample, comprising: a light source configured to emit an incident light wave in a first spectral band and in a second spectral band, the first spectral band being different from the second spectral band; an image sensor comprising a first group of pixels, which are sensitive to the first spectral band, and a second group of pixels, which are sensitive to the second spectral band; a holder configured to hold the sample in a holder plane, the holder plane lying between the light source and the image sensor, such that when the sample is held by the holder, under the effect of its illumination by the incident light wave, a light wave of interest propagates to the image sensor; the device being configured to direct, to the image sensor, a first component of the light wave of interest, in the first spectral band, and a second component of the light wave of interest, in the second spectral band.

Abstract: Examples relate to three-dimensional (3D) scan tuning. In some examples, preliminary scan data is obtained while the real-world object is continuously rotated in view of a 3D scanning device, where the 3D scanning device performs a prescan to collect the preliminary scan data. The preliminary scan data is then used to determine physical characteristics of the real-world object, and a camera operating mode of the 3D scanning device is modified based on the physical characteristics. At this stage, 3D scan data for generating a 3D model of the real-world object is obtained, where the 3D scanning device scans the real-world object according to the camera operating mode.

Abstract: An infrared imaging element includes a photosensitive pixel array and a driving line for each photosensitive pixel. The infrared imaging element includes a vertical scanning circuit, a signal line, a bias line, a differential integration circuit that time-integrates a difference between a voltage across the first constant current source and a voltage across the second constant current source; a horizontal scanning circuit; a reference pixel array that outputs a reference signal changing in accordance with a change in a temperature of photosensitive pixels; a bias generating circuit that generates a bias voltage for applying the bias voltage to the bias line, the bias voltage corresponding to a difference between a reference voltage and a differential signal between the reference signal and a voltage on the bias line; and a voltage generating circuit that generates a temperature signal generation voltage based on the bias voltage.

Abstract: An infrared sensor substrate includes: column signal lines; row signal lines; a pixel array of pixels including infrared detector elements connected to the column signal lines and the row signal lines. The infrared sensor substrate includes: a current source connected to the infrared detector elements via the column signal lines; a voltage source that applies a voltage to the infrared detector elements via the row signal lines; output terminals connected to the column signal lines, the output terminals being connectable to a signal processing circuit substrate that processes output signals of the infrared detector elements. The infrared sensor substrate includes a monitoring terminal capable of monitoring the voltage applied to the infrared detector elements by the first voltage source.

Abstract: A method of detecting ambient luminous radiation includes resetting and triggering a counter each time a photodiode illuminated by the ambient luminous radiation reaches a discharge threshold. The counter is then being clocked by a clock signal having a first frequency and delivering a counter output signal. The method further includes generating an AC signal representative of the ambient luminous radiation by converting, from digital to analog, a digital signal obtained from the counter output signal.

Abstract: A computer-implemented method of forming a thermal-based electronic image of an object that includes receiving electromagnetic radiation emitted by the object at an optically sensitive layer including a superpixel having a plurality of pixels. Each pixel of the plurality of pixels includes a plasmonic absorber having a characteristic resonance wavelength and that generates a radiance measurement of the electromagnetic radiation at its characteristic resonance wavelength. The method further provides for determining, at a processor, an emissivity and temperature for the electromagnetic radiation received at the superpixel using the radiance measurements obtained at the pixels of the superpixel. In addition, the method provides for forming an image of the object from the determined emissivity and temperature.

Abstract: A thermal imaging system includes a pixel array having a plurality of pixel groups. Each pixel group including a plurality of pixel rows and a trigger sense circuit including a pixel group input line in signal communication with the plurality of bolometer pixels pixel row containing a plurality of bolometer pixels. The pixel group further includes a selector switch that selectively establishes an electrical connection between the pixel group and the trigger sense circuit. The selector switch operates in a first state to disconnect the pixel group from the pixel group input line while connecting the pixel group to the integration unit such that the integration unit generates the image, and a second state to disconnect the pixel group from the integration unit while connecting the pixel group to the pixel group input line such that the trigger sense circuit monitors the pixel group for a high temperature bolometer.

Abstract: A computer-eimplemented thermal imaging device having an optically-sensitive layer that includes a superpixel having at least one pixel. The at least one pixel includes a plasmonic absorber configured to obtain radiance measurements of electromagnetic radiation emitted from an object at a plurality of wavelengths. The device further includes a processor configured to determine an emissivity and temperature for the electromagnetic radiation received at the plasmonic material from the object using the radiance measurements and to form an image of the object from the determined emissivity and temperature.

Abstract: A computer-implemented method and thermal imaging device includes a layer of plasmonic material and a processor. The layer of plasmonic material receive electromagnetic radiation from an object and generates radiance measurements of the electromagnetic radiation at a plurality of wavelengths. The processor determines an emissivity and temperature of the object from the radiance measurements and forms a thermal-based electronic image of the object from the determined emissivity and temperature.

Abstract: A semiconductor device has a semiconductor die containing a base material having a first surface and a second surface with an image sensor area. A masking layer with varying width openings is disposed over the first surface of the base material. The openings in the masking layer are larger in a center region of the semiconductor die and smaller toward edges of the semiconductor die. A portion of the first surface of the base material is removed by plasma etching to form a first curved surface. A metal layer is formed over the first curved surface of the base material. The semiconductor die is positioned over a substrate with the first curved surface oriented toward the substrate. Pressure and temperature is applied to assert movement of the base material to change orientation of the second surface with the image sensor area into a second curved surface.

Abstract: Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device.

Abstract: A collision mitigation system makes use of ladar sensors to identify obstacles and to predict unavoidable collisions therewith, and a duplex radio link in communication with secondary vehicles, and a number of external airbags deployable under the control of an airbag control unit, to reduce the forces of impact on the host vehicle, secondary vehicles, and bipeds and quadrupeds wandering into the roadway. A suspension modification system makes use of ladar sensors to identify road hazards, and make adaptations to a number of active suspension components, each with the ability to absorb shock, elevate or lower the vehicle, and adjust the spring rate of the individual wheel suspensions.

Abstract: Systems, methods, and devices for thermal detection. A thermal detection device includes a visual sensor, a thermal sensor (e.g., a thermopile array), a controller, a user interface, a display, and a removable and rechargeable battery pack. The thermal detection device also includes a plurality of additional software and hardware modules configured to perform or execute various functions and operations of the thermal detection device. An output from the visual sensor and an output from the thermal sensor are combined by the controller or the plurality of additional modules to generate a combined image for display on the display.

Abstract: Millimeter wave imaging devices are provided. A millimeter wave imaging device includes a housing and one or more heating elements inside the housing. The millimeter wave imaging device includes a flexible gasket on the housing. The millimeter wave imaging device includes a main lens attached to the housing by the flexible gasket. The millimeter wave imaging device includes a protective lens on an outer surface of the main lens. Moreover, the millimeter wave imaging device includes an Electromagnetic Impulse (EMI) filter attached to the housing and extending along an inner surface of the main lens. Methods of operating millimeter wave imaging devices are also provided.

Abstract: Techniques for performing one or both of gesture recognition and biometric monitoring with an electronic device are disclosed, where the electronic device has a wireless communications capability using beamforming techniques and includes a plurality of millimeter wave antenna modules. Each module includes at least one transmit antenna and at least one receive antenna, operable in one or more frequency ranges not less than 20 GHz, the receive antenna coupled with a first branch configured to receive H-polarized signals and a second branch configured to receive V-polarized signals. Performing one or both of gesture recognition and biometric monitoring includes detecting a presence and motion of a reflective object or anatomical feature by determining a relationship between received H-polarized signals and received V-polarized signals for two or more receive antennas as a function of time.

Abstract: An image processing method and device, a computer-readable storage medium and an electronic device are provided. The method includes that: a target infrared image and a target depth image are acquired, and face detection is performed according to the target infrared image to determine a target face region, here, the target depth image is used to represent depth information corresponding to the target infrared image; a target face attribute parameter corresponding to the target face region is acquired, and face matching processing is performed on the target face region according to the target face attribute parameter; responsive to that face matching succeeds, liveness detection processing is performed on the target face region according to the target depth image to obtain a liveness detection result; and a face verification result is obtained according to the liveness detection result.

Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

Abstract: An image sensor apparatus and method are provided with multiple contiguous infrared (IR) filter elements. Included is an image sensor comprising a two-dimensional array of pixel elements that generate output signals as pixel data for representing an image of a scene. Further included is a filter array comprising a two-dimensional array of filter elements coupled to the two-dimensional array of pixel elements to receive light input from the scene. The filter array includes a plurality of blocks of filter elements each including a first subset of filter elements configured to transmit spectral energy in one or more colors of a visible spectrum of the light. Each pair of adjacent filter elements of the first subset are configured to transmit spectral energy in different colors of the visible spectrum of the light. Further, each block of filter elements also includes a second subset of filter elements configured to transmit spectral energy in an infrared (IR) spectrum of the light.

Abstract: A digital control laser automatic tooth preparation method and device and a tooth positioner are provided. The device includes an intra-oral three-dimensional scanner, a dental laser, an oral working end of a digital control laser tooth preparation control system, an oral and maxillofacial cone beam CT scanner, a computer, a tooth positioner, a negative-pressure suction device and a real-time monitoring device. The computer is connected respectively with the intra-oral three-dimensional scanner, the dental laser, the oral working end of the digital control laser tooth preparation control system, the oral and maxillofacial cone beam CT scanner, the negative-pressure suction device, and the real-time monitoring device. The dental laser is connected with the oral working end of the digital control laser tooth preparation control system through a light guiding arm (1).

Abstract: Systems are provided including night vision goggles and up-conversion circuits for converting short wave infrared (SWIR) light into near infrared (NIR) light or other visible light in low-light environments. An array of electrically coupled photodiodes, amplifiers, and NIR light emitters generate and amplify a current in response to SWIR, powering the light emitters to generate NIR light. The NIR can then be directed into a photomultiplier tube to amplify the light and allow an operator to see in low-light environments.

Abstract: An apparatus include one or more DACs and a resistor divider are configured to generate a variable bias voltage VBIAS with respect to a CM voltage VCM. The CM voltage VCM is applied to a cathode of one or more thermopiles or a negative input of one or more amplifiers to prevent saturation and over range of one or more low voltage readout amplifiers and one or more ADCs.

Abstract: A dual mode ladar system includes a laser transmitter having a wavelength of operation and a modulator connected thereto to impose a modulation thereon. The modulator is configured to impose amplitude modulation and/or frequency modulation. Diffusing optics illuminate a field of view and an array of light sensitive detectors each produce an electrical response signal from a reflected portion of the laser light output.

Abstract: A system, comprising a computer that includes a processor and a memory, the memory storing instructions executable by the processor to actuate a first actuator movingly connected to the camera cover and the light to move the calibration pattern and the light to cover a lens window of a camera. The processor can further execute instructions to actuate a second actuator movingly connected to the calibration pattern and the light to move the calibration pattern and the light along an optical axis of the camera.

Abstract: The present invention relates to a method of determining a reduction of remaining service lifetime of an electrical device during a specific time period. A measurement system is provided comprising a temperature measurement device, a current measurement device and a voltage measurement device. A temperature value, voltage values and current values are measured by using the measurement device. A harmonic load is determined based on the current values. A reduced maximum operating temperature is determined based on the harmonic load. An amount of transient over-voltages is determined based on the voltage values. A transient aging factor is determined based on the amount of transient over-voltages. A temperature dependent aging factor is determined based on the temperature value and the reduced maximum operating temperature. Finally, the reduction of remaining service life is determined based on the specific time period, the transient aging factor and the temperature dependent aging factor.

Abstract: Methods for generating a temperature map of a scene are provided. A method may include receiving thermal data of the scene. The thermal data includes frames of thermal infrared data. A mapping may be created for each frame based on the digital thermal infrared data. The method further includes generating the temperature map using the mapping. The temperature map is generated prior to a contrast enhancement process. The method further includes separately transmitting the temperature map and the digital thermal infrared data in a data channel.

Abstract: Infrared detection systems according to embodiments include an infrared detector, a storage, and a correction calculator. The infrared detector is configured to detect infrared light by absorbing and photoelectrically converting infrared light of a specific wavelength range. The infrared detector is capable of sweeping an absorption peak wavelength of an absorption spectrum of infrared light. The storage is configured to store a plurality of correction coefficients for correcting a detection value from the infrared detector in accordance with the absorption peak wavelength of the infrared detector with respect to a wavelength range of an atmospheric window. The correction calculator corrects the detection value from the infrared detector for each absorption peak wavelength using corresponding correction coefficients stored in the storage.

Abstract: Systems, apparatuses, and techniques for video delivery can include one or more of the following: a wireless camera arranged in a wearable form factor comprising a battery to provide energy, and configured to generate a video feed, and a base station in wireless communication with the wireless camera and configured to receive the video feed from the wireless camera and process the video feed, and a video portal device communicatively coupled with the base station and configured to receive the processed video feed from the base station and deliver at least a portion of the processed video feed to one or more remote clients. A base station can reserve a wireless channel for the wireless camera for a video transmission.

Abstract: The present approach relates to implementations of a CT detector integrating CT scintillator packs on a fast, low electronic noise and scalable CMOS active pixel sensor substrate. In one embodiment, a large 3-side buttable CMOS active pixel array with built-in column analog-to-digital conversion (ADC) circuitry (e.g., ASICs) integrated onto the same wafer is used.

Abstract: An optical device for microscopic observation 4 comprises: a cold stop 13 having openings 13d, 13e corresponding to a low-magnification microscope optical system 5 and being a stop member arranged in a vacuum vessel 12 to let the light from the sample S pass to the camera 3; a warm stop 10 having an opening 14 corresponding to a high-magnification microscope optical system 5 and being a stop member arranged outside the vacuum vessel 12 to let the light from the sample S pass toward the cold stop 13; and a support member 11 supporting the warm stop 10 so that the warm stop can be inserted to or removed from on the optical axis of the light from the sample S, wherein the warm stop 10 has a reflective surface 15 on the camera 3 side and wherein the opening 14 is smaller than the openings 13d, 13e.

Abstract: A ladar system and related method are disclosed where the ladar system comprises first and second receivers. The first receiver receives a ladar return from a ladar pulse with a known transmit polarization. The second receiver receives the ladar return from the ladar pulse with the known transmit polarization. The ladar system also includes a control circuit that (1) measures incident polarizations at the first and second receivers with respect to the received ladar return and (2) separates a retro-reflective portion of the received ladar return from a non-retro-reflective portion of the received ladar return based on the measured incident polarization and the known transmit polarization.

Abstract: The invention relates to a method for detecting bad pixels from a pixel array of a device, for capturing an image, that is sensitive to infrared radiation. The method includes: receiving an input image captured by the pixel system, and calculating a score for a plurality of target pixels including at least some of the pixels from the input image. The score for each target pixel is generated on the basis of k pixels of the input image that are selected in a window of H by H pixels around the target pixel. H is an odd integer greater than or equal to 3, and k is an integer between 2 and 5. Each pixel, from the set formed of the k pixels and the target pixel, share at least one border or corner with another pixel from said set, and the values of the k pixels are at respective distances from the value of the target pixel, the k pixels being selected on the basis of the k distances. The method also includes detecting that at least one of the target pixels is a bad pixel on the basis of the calculated scores.

Abstract: A thermal image sensor including: a plurality of infrared detector elements that detect infrared light in a detection area; and rotors that scan the detection area in a scanning direction to detect, with the plurality of infrared detector elements, infrared light in an area to be captured as a single thermal image. The plurality of infrared detector elements include infrared detector elements arranged in mutually different positions in a rotational direction corresponding to the scanning direction of the plurality of infrared detector elements.