Abstract: A sensor device, a sensor package, and method for fabricating a sensor device are described that include an integrated light blocker disposed on the thermopile device and a lens configured to direct light to the thermopile device. In an implementation, the thermopile device includes a substrate; a thermopile membrane disposed on the substrate, the thermopile membrane including at least one passivation layer; a thermopile disposed within the thermopile membrane, the thermopile including at least one thermocouple; and a light blocking layer disposed proximate to the thermopile membrane, the light blocking layer including an aperture disposed proximate to the thermopile.

Abstract: A method of determining a temperature of a patient includes determining a temperature associated with a measurement site of the patient with a temperature device, and without contacting the patient with the device. The method also includes estimating a temperature of the patient based at least in part on the temperature associated with the measurement site. The temperature device includes a sensing element configured to determine the temperature associated with the measurement site, an imaging device, and a controller configured to estimate the temperature of the patient based on the temperature associated with the measurement site.

Abstract: The invention relates to a vibration based mechanical IR detector having one or more than one resonating pixel structure and an IR imaging method for measuring incoming IR radiation by means of mechanical resonance of the resonating pixels.

Abstract: A synchronized infrared beacon/infrared detector system. The system may include (A) an infrared beacon module configured to generate a time-varying encoded infrared signal, (B) an infrared detector module configured to capture the encoded infrared signal generated by the beacon module, (C) a synchronizer configured to generate a synchronization signal that controls timing of the beacon module and the detector module, and (D) a processor, in communication with the detector module, configured to analyze the infrared signal captured by the detector module. The infrared signal may be modulated at frequencies undetectable by human vision. The synchronizer signal may be produced independent of the capture of, and without input from, the infrared signal.

Abstract: The present invention tracks or locates small moving objects, or generates a 3-D frame of data by using 3-D focal plane arrays with low laser energy and few mechanically moving parts. The invention may be used to determine the direction of a laser designating a target, for target tracking, used as a 3-D movie/video camera or used to provide data for autonomous navigation.

Abstract: An apparatus includes: a focal plane array (FPA) of receivers for a passive millimeter wave camera, the FPA comprising: receivers configured to sample an image, the image comprising one or more regions, the receivers arranged in an array of dimensions m rows by n columns, and a scanning reflector configured to move, thereby moving an image of the scene across the FPA transverse to the receiver columns.

Abstract: A backside illuminated semiconductor image sensor that includes a Fabry-Perot resonator tuned to absorb near infrared (NIR) radiation; wherein the Fabry-Perot resonator comprises a front reflector, a back reflector and an active Silicon layer between the front reflector and the back reflector.

Abstract: An infrared optical system having a spectral range for achieving a fog penetration distance of at least 2.75 Runway Visibility Range (RVR) is provided herein. The optical system may include a single set of optical elements designed to have a wavelength range extending beyond 1.2 ?m toward shorter wavelengths and comprising a short-wavelength infrared (SWIR) range and at least one of: a middle-wavelength infrared (MWIR) range and a long-wavelength infrared (LWIR) range, to enhance a detection range of the infrared optical system, wherein the single set of optical elements is laid such that the both the SWIR range and the at least one of the MWIR range and the LWIR range of infrared radiation pass through all of the optical elements.

Abstract: A thermal image generating apparatus for generating a thermal image regarding a target object is provided. The apparatus includes a memory configured to store a first thermal image, a first sensor, configured to measure a temperature of the target object, a second sensor configured to measure a distance to the target object, a third sensor configured to detect a movement of the thermal image generating apparatus, and a controller configured to generate a second thermal image based on temperature information received from the first sensor, distance information received from the second sensor, and movement information received from the third sensor, and generate a third thermal image based on the first thermal image and the second thermal image.

Abstract: A balanced differential transimpedance amplifier with a single-ended input operational over a wide variation in the dynamic range of input signals. A threshold circuit is employed to either or a combination of (1) generate a varying decision threshold to ensure a proper slicing over a wide range of input current signal levels; and (2) generate a bias current and voltage applied to an input of a transimpedance stage to cancel out a dependence of the transimpedance stage voltage input on input current signal levels.

Abstract: An imaging system includes an image sensor and a row-period compensator. The image sensor includes an array of photosensitive pixels and electrical circuitry for controlling the array of photosensitive pixels and for reading accumulated electrical charge therefrom. The electrical circuitry is at least partially powered from a positive power rail and a negative power rail. The row-period compensator is for compensating for a change in current drawn by the electrical circuitry during at least part of a row-period of the image sensor, and the row-period compensator is electrically coupled between the positive and negative power rails. A method for compensating for a change in current drawn by electrical circuitry of an image sensor includes controlling a magnitude of compensation current drawn by a row-period compensator, to compensate for a change in current drawn by the electrical circuitry of the image sensor.

Abstract: An image sensor pixel having a hybrid transfer storage gate-storage diode storage node is disclosed herein. An example image sensor includes a photodiode, a storage diode, a transfer gate, and a buried storage well. The photodiode, storage diode, and buried storage well are all disposed in a semiconductor material. The transfer storage gate may be disposed on a surface of the semiconductor material between the photodiode and the storage diode. Further, the buried storage well may be disposed under the storage diode and partially under the transfer storage gate. Additionally, a length of the transfer storage gate and a length of the storage diode may be equal, and the storage diode may passivate a surface of the semiconductor material between the transfer storage gate and an output gate.

Abstract: An apparatus and method for ultrafast real-time optical imaging that can be used for imaging dynamic events such as microfluidics or laser surgery is provided. The apparatus and methods encode spatial information from a sample into a back reflection of a two-dimensional spectral brush that is generated with a two-dimensional disperser and a light source that is mapped in to the time domain with a temporal disperser. The temporal waveform is preferably captured by an optical detector, converted to an electrical signal that is digitized and processed to provide two dimensional and three dimensional images. The produced signals can be optically or electronically amplified. Detection may be improved with correlation matching against a database in the time domain or the spatial domain. Embodiments for endoscopy, microscopy and simultaneous imaging and laser ablation with a single fiber are illustrated.

Abstract: Method and system in optical microscopy based on the deflection of micro- and nanomechanical structures, upon impact of a laser beam thereon, which simultaneously and automatically provides a spatial map of the static deflection and of the form of various vibration modes, with vertical resolution in the subangstrom range. The invention comprises at least one mechanical structure, an incident laser beam sweeping the surface of the structure, an optometric detector for capturing the laser beam, and frequency excitation means that generate at least two sinusoidal signals at different frequencies in the mechanical structure.

Abstract: An infrared sensor device includes a semiconductor substrate, at least one sensor element that is micromechanically formed in the semiconductor substrate, and at least one calibration element, which is micromechanically formed in the semiconductor substrate, for the sensor element. An absorber material is arranged on the semiconductor substrate in the area of the sensor element and the calibration element. One cavern each is formed in the semiconductor substrate substantially below the sensor element and substantially below the calibration element. The sensor element and the calibration element are thermally and electrically isolated from the rest of the semiconductor substrate by the caverns. The infrared sensor device has high sensitivity, calibration functionality for the sensor element, and a high signal-to-noise ratio.

Abstract: In one example, a device includes a trench formed in a substrate. The trench includes a first end and a second end that are non-collinear. A first plurality of semiconductor pillars is positioned near the first end of the trench and includes integrated light sources. A second plurality of semiconductor pillars is positioned near the second end of the trench and includes integrated photodetectors.

Abstract: To provide a calibration device of a camera, a camera system, and a calibration method of a camera which can achieve simplification of a calibration operation and improvement of accuracy of the calibration. A calibration device 2 includes a database 30, an instruction section 25, a correction section, and an evaluation section 24. Process data in accordance with a specification of a camera 11A is stored in the database 30. The instruction section 25 outputs an operation instruction to a display screen 50A based on the process data. The evaluation section 24 evaluates a correction image which is corrected by the correction section.

Abstract: FPAs on a wafer can be tested prior to dicing the wafer into individual dies. A focal plane array (FPA) can comprise an array of photodetectors, such as microbolometers, on a semiconductor substrate or die. FPAs can be manufactured on a wafer to make multiple FPAs on a single wafer that can be later diced or divided into individual FPAs. Prior to dicing the wafer, the FPAs can be tested electrically and radiometrically in bulk to characterize individual FPAs, to identify bad pixels, to identify bad chips, to calibrate individual FPAs, and the like. These test results can be used to determine acceptable FPAs and can be used to provide initial settings for imaging systems with the tested and integrated FPA.

Abstract: A measurement circuit for a resistive sensor comprises an integrator of information representative of the difference between a current passing through the sensor and a first reference current, and a circuit for making the output of the integrator depend on a reference level.

Abstract: Precise annealing of identified defective regions of a Focal Plane Array (“FPA”) (e.g., exclusive of non-defective regions of the FPA) facilitates removal of defects from an FPA that has been hybridized and/or packaged with readout electronics. Radiation is optionally applied under operating conditions, such as under cryogenic temperatures, such that performance of an FPA can be evaluated before, during, and after annealing without requiring thermal cycling.

Abstract: A data processing apparatus that is installed in plural in an installation area and processes data of each installation site, includes a processor that based on a combination of identification information included in calibration information respectively transmitted by calibration nodes and self-identification generation information that is included in the calibration information and for identifying the data processing apparatus among the plural data processing apparatuses, generates self-identification information; a memory device that retains the self-identification information; and a wireless communications circuit that receives the calibration information from the calibration nodes and performs transmission and reception of the data with an adjacent data processing apparatus provided in the installation area.

Abstract: Various embodiments are directed to an image sensor that includes a first sensor portion and a second sensor portion coupled to the first sensor portion. The second sensor portion may be positioned relative to the first sensor portion so that the second sensor portion may initially detect light entering the image sensor, and some of that light passes through the second sensor portion and is be detected by the first sensor portion. In some embodiments, the second sensor portion may be configured to have a thickness suitable for sensing visible light. The first sensor portion may be configured to have a thickness suitable for sensing IR or NIR light. As a result of the arrangement and structure of the second sensor portion and the first sensor portion, the image sensor captures substantially more light from the light source.

Abstract: A device images radiation from a scene. The scene can include two materials with spectral characteristics in different radiation wavelength regions. A static filtering arrangement includes two filters with different passbands corresponding to the two wavelength regions. An image forming optic forms an image of the scene on a detector. The radiation from the scene is imaged simultaneously through an f-number of less than 1.5 onto two detector pixel subsets. The imaged radiation on one pixel subset includes radiation in one wavelength region. The imaged radiation on the other pixel subset includes radiation in the other wavelength region. Electronic circuitry produces a pixel signal from each detector pixel. The pixel signals include information associated with absorption or emission of radiation in one of the respective wavelength regions by the two materials. The electronic circuitry determines the presence or absence of each of the two materials based on the pixel signals.

Abstract: An image sensor may be provided. The image sensor may be a high-capacitance image sensor or a dual-mode image sensor having a high-capacitance operational mode. A high-capacitance image sensor may include image detectors and associated unit cells. During operation, the image sensor may integrate image signals from each detector row using unit cells in multiple unit cell rows. The image sensor may integrate and readout image signals in an interleaved process that allows each detector row to capture image data using multiple unit cells. A dual-mode image sensor may operate in a similar manner to a high-capacitance image sensor when operated in the high-capacitance mode. The dual-mode image sensor may have switches interposed between unit cells to selectively couple and decouple the unit cells for switching between the high-capacitance mode and a normal operational mode.

Abstract: A system for integrated asset management is disclosed. According to one embodiment, information from a first reporting source about an asset is received. In addition, information is received about the asset from a second reporting source. Inspection information about the asset is received from a first enabled device. A database is then populated with the information from the first reporting source, the information from the second reporting source, and the inspection information from the first enabled device, such that the information from the first reporting source, the information from the second reporting source, and the inspection information from the first enabled device can be collected or accessed in an integrated manner from the database for use by a client information system.

Abstract: In one embodiment, an infrared (IR) imaging system for determining a concentration of a target species in an object is disclosed. The imaging system can include an optical system including an optical focal plane array (FPA) unit. The optical system can have components defining at least two optical channels thereof, said at least two optical channels being spatially and spectrally different from one another. Each of the at least two optical channels can be positioned to transfer IR radiation incident on the optical system towards the optical FPA. The system can include a processing unit containing a processor that can be configured to acquire multispectral optical data representing said target species from the IR radiation received at the optical FPA. Said optical system and said processing unit can be contained together in a data acquisition and processing module configured to be worn or carried by a person.

Abstract: A method for generating an image is provided including taking a first active radar image of an object from a first position with a handheld screening device; taking a second active radar image of the object from a second position with the handheld screening device; and generating a third image based on the first active radar image and the second active radar image. A corresponding handheld screening device is provided as well.

Abstract: An imaging assembly includes a base member defining an expansion chamber therein, the base member defining a gas inlet for receiving a compressed gas and a gas outlet for expelling expanded gas, and a focal plane array assembly mounted to the base member including a sensor and a lens.

Abstract: Several embodiments for semiconductor devices and methods for forming semiconductor devices are disclosed herein. One embodiment is directed to a method for manufacturing a microelectronic imager having a die including an image sensor, an integrated circuit electrically coupled to the image sensor, and electrical connectors electrically coupled to the integrated circuit. The method can comprise covering the electrical connectors with a radiation blocking layer and forming apertures aligned with the electrical connectors through a layer of photo-resist on the radiation blocking layer. The radiation blocking layer is not photoreactive such that it cannot be patterned using radiation. The method further includes etching openings in the radiation blocking layer through the apertures of the photo-resist layer.

Abstract: The present invention discloses a communication method for machine-type-communication (MTC) between a MTC server and MTC equipments, which comprises: the MTC server broadcasts a target content related to an application, receives availability information related to the target content from candidate MTC equipments which satisfy the target content, selects any one or more MTC equipments from the candidate MTC equipments based on the availability information, establishes a session connection with each of the selected MTC equipments, and receives content uploaded by the selected MTC equipments. The invention furthermore discloses a communication method for MTC between the MTC equipments and the MTC server, and discloses the corresponding MTC server and the MTC equipment.

Abstract: Provided are an image composition apparatus for composing color images with black-and-white images including infrared components, and an image composition method thereof. The image composition method includes generating a first image signal with color information and a second image signal including infrared components without color information, dividing the first image signal into a brightness signal and a color signal, composing the brightness signal of the first image signal with a brightness signal of the second image signal to generate a composed brightness signal, and composing the composed brightness signal with the color signal of the first image signal to generate a color image.

Abstract: Optical position encoding mechanisms and methods for use in reimaged optical imaging systems. In one example, a reimaged optical imaging system includes an imaging detector, an optical component, and at least one light source coupled to the optical component and configured to be reimaged onto the imaging detector, wherein a position of an image of the at least one light source at the imaging detector encodes a position of the optical component relative to the imaging detector.

Abstract: An apparatus and a method for multispectral imaging that may, comprising a cyclopean camera arrangement comprising at least two spaced apart imaging sensors operating at a first waveband, an image combiner arranged to combine images from the at least two spaced apart imaging sensors to provide a first cyclopean image of a scene from a first virtual position, a further imaging sensor operating at a second waveband different from the first and arranged to provide a second image of the scene from a second position, and a second image combiner arranged to combine the first and second images of the scene to provide a multispectral image, wherein the first virtual position of the cyclopean camera arrangement and the second position of the further sensor are arranged to be substantially the same.

Abstract: Various techniques are disclosed for providing an infrared imaging module that exhibits a small form factor and may be used with one or more portable devices. Such an infrared imaging module may be implemented with a housing that includes electrical connections that may be used to electrically connect various components of the infrared imaging module. In addition, various techniques are disclosed for providing system architectures for processing modules of infrared imaging modules. In one example, a processing module of an infrared imaging module includes a first interface adapted to receive captured infrared images from an infrared image sensor of the infrared imaging module. The processing module may also include a processor adapted to perform digital infrared image processing on the captured infrared images to provide processed infrared images. The processing module may also include a second interface adapted to pass the processed infrared images to a host device.

Abstract: A microprocessor is operably coupled to a camera from which patient vital signs are determined and a digital infrared sensor. A temporal variation of images from the camera is generated and amplified from which the patient vital signs, such as heart rate or respiratory rate, can be determined and displayed or stored and temperature is determined from digital infrared sensor.

Abstract: Techniques are disclosed for measurement devices and methods to obtain various physical and/or electrical parameters in an integrated manner. For example, a measurement device may include a housing, an optical emitter, a sensor, a distance measurement circuit, a length measurement circuit, an electrical meter circuit, a display, an infrared imaging module, and/or a non-thermal imaging module. The device may be conveniently carried and utilized by users to perform a series of distance measurements, wire length measurements, electrical parameter measurements, and/or fault inspections, in an integrated manner without using multiple different devices. In one example, electricians may utilize the device to perform installation of electrical wires and/or other tasks at various locations (e.g., electrical work sites). In another example, electricians may utilize the device to view a thermal image of one or more scenes at such locations for locating potential electrical faults.

Abstract: An imaging pixel may include an upper substrate layer with a photosensitive layer and a lower substrate with a photosensitive layer. A color filter layer may be formed over the upper substrate layer. The color filter layer may include a color filter window that allows light to pass through the upper substrate layer to the photosensitive layer in the lower substrate. The color filter window may be formed from a dielectric material or from a color filter element with a different color than the surrounding color filter element. A metal interconnect layer may couple the lower substrate layer to the upper substrate layer. The color filter window may be formed in the central portion of a pixel, or between multiple pixels in an image sensor.

Abstract: A thermal image sensor and an air conditioner in which temperature data of significant pixels selected from all the pixels in an immediately preceding step are acquired by a thinning scanner, a human probability for each of the significant pixels is generated by a human probability generator, weight values for all the pixels are generated from the human probabilities for the significant pixels by a pixel weight calculator, and pixels having a larger weight value are selected, as the significant pixels to be used in the next step, by an all-pixel sorter, thereby assigning a larger number of pixels to a region in which there is a high probability that a person is existing while the number of significant pixels used in total is kept constant.

Abstract: An image sensing device may include an interconnect layer and grid array contacts carried by the interconnect layer, and an image sensor IC carried by the interconnect layer and coupled to the grid array contacts, the image sensor IC having an image sensing surface. The image sensing device may include a transparent plate carried by the image sensor IC and aligned with the image sensing surface, and a cap carried by the interconnect layer and having an opening aligned with the image sensing surface. The cap may have an upper wall spaced above the interconnect layer and the image sensor IC to define an internal cavity, and the cap may define an air vent coupled to the internal cavity.

Abstract: Various techniques are disclosed for a system and method to dynamically co-register images captured by two or more separate imaging modules. For example, in one embodiment, a method includes: capturing a thermal image of an object; capturing a visible light (VL) image of the object; determining a plurality of thermal image reference points from the thermal image; determining a plurality of VL image reference points from the VL image; determining a geometric transform based on the plurality of thermal image reference points and the plurality of VL image reference points; and applying the geometric transform to the thermal image or the VL image to align the thermal image and the VL image. In another embodiment, an imaging system comprises two or more separate imaging modules and one or more processors configured to perform the method above to dynamically co-register images.

Abstract: In one embodiment, an infrared (IR) imaging system for determining a concentration of a target species in an object is disclosed. The imaging system can include an optical system including an optical focal plane array (FPA) unit. The optical system can have components defining at least two optical channels thereof, said at least two optical channels being spatially and spectrally different from one another. Each of the at least two optical channels can be positioned to transfer IR radiation incident on the optical system towards the optical FPA. The system can include a processing unit containing a processor that can be configured to acquire multispectral optical data representing said target species from the IR radiation received at the optical FPA. Said optical system and said processing unit can be contained together in a data acquisition and processing module configured to be worn or carried by a person.

Abstract: An integrator according to an embodiment includes first and second nodes, first to fifth switches, first and second main integration capacitors, and a first subsidiary integration capacitor. The first (second, third, fourth, fifth) switch has one end connected to a first (third, first, fourth, first) node and the other end connected to a third (second, fourth, second, fifth) node. The first main integration capacitor has one end connected to the third node and the other end connected to a standard voltage line. The second main integration capacitor has one end connected to the fourth node and the other end connected to the standard voltage line. The first subsidiary integration capacitor that has one end connected to the fifth node and the other end connected to the standard voltage line.

Abstract: A calibration system for a passive millimeter-wave (PMMW) camera. The calibration system includes a thermal calibrator having a first thermally conducting body, a second thermally conducting body, a first black body target mounted to a front surface of the first conducting body, a second black body target mounted to a front surface of the second conducting body, and a thermo-electric (TE) cooling device having a hot side and a cold side. The hot side of the TE cooling device is thermally attached to the first conducting body and the cold side of the TE cooling device is thermally attached to the second conducting body.

Abstract: A system for producing thermal images acquires at least first and second thermal images comprising a plurality of pixels and a first and second dynamic range, respectively. The second dynamic range is such that its upper limit is higher than that of the first, and at least partially overlaps the first. A final thermal image is created comprising pixels from the first thermal image that are not saturated or nearly saturated with respect to the first dynamic range, and pixels from the second thermal image that are saturated or nearly saturated with respect to the first dynamic range. The resulting final image generally comprises both a large dynamic range and high signal-to-noise ratio.

Abstract: Methods and apparatus to provide, from data from a single sensor, high-resolution imagery at a first frame rate, such as typical video frame rate, and lower-resolution imagery at a second frame rate, which is higher than the first rate. In one embodiment, the first frame rate data can be viewed by a user and the second frame rate data can be processed to identify an event of interest, such as pulsed light.

Abstract: A light receiving device includes a substrate having a principal surface and a back surface, the substrate containing GaSb semiconductor co-doped with a p-type dopant and an n-type dopant; a stacked semiconductor layer disposed on the principal surface of the substrate, the stacked semiconductor layer including an optical absorption layer; and an incident surface provided on the back surface of the substrate that receives an incident light. The optical absorption layer includes a super-lattice structure including a first semiconductor layer and a second semiconductor layer that are alternately stacked. In addition, the first semiconductor layer contains gallium and antimony as constituent elements. The second semiconductor layer is composed of a material different from a material of the first semiconductor layer.

Abstract: A heat generation point detection method comprises steps S01, S02 of applying a low frequency bias voltage to an integrated circuit S and acquiring a heat generation detection signal detected from the integrated circuit S in response thereto, steps S03, S04 of supplying a high frequency bias voltage to the integrated circuit S and acquiring a heat generation detection signal detected from the integrated circuit S in response thereto, steps S05 to S07 of detecting a phase shift between the low frequency bias voltage and the heat generation detection signal and a phase shift between the high frequency bias voltage and the heat generation detection signal, and a step S08 of calculating a change rate of the phase shift against a square root of the frequency of the bias voltage, based on those phase shifts, and acquiring depth information of a heat generation point from the change rate.

Abstract: Infrared detection device comprising at least one first bolometer able to detect at least a part of infrared radiation intended to be received by the infrared detection device, and a reading and compensation circuit of a first electrical signal intended to be outputted by the first bolometer, with the reading and compensation circuit comprising at least: one second bolometer coupled electrically to the first bolometer and insensitive to the infrared radiation intended to be received by the infrared detection device; one first reading circuit of said first electrical signal from which is subtracted a second electrical signal intended to be outputted by the second bolometer; one second reading circuit of an electrical voltage at the terminals of the first bolometer and/or of an electrical voltage at the terminals of the second bolometer, comprising a plurality of switches.

Abstract: In one example, a device includes a trench formed in a substrate. The trench includes a first end and a second end that are non-collinear. A first plurality of semiconductor pillars is positioned near the first end of the trench and includes integrated light sources. A second plurality of semiconductor pillars is positioned near the second end of the trench and includes integrated photodetectors.

Abstract: Disclosed are a solar cell and a method for fabricating the same. The solar cell according to the embodiment includes a back electrode layer on a support substrate; a light absorbing layer including a glass frit having sodium on the back electrode layer; and a front electrode layer on the light absorbing layer.