Abstract: A non-touch thermometer senses temperature from a digital infrared sensor is described. A microprocessor is operably coupled to a camera from which patient vital signs are determined. A digital signal representing a temperature without conversion from analog is transmitted from the digital infrared sensor. A temporal variation of images is generated from which a heart rate and the respiratory rate can be determined and displayed or stored.

Abstract: An polarization information acquisition unit includes a phase adjuster configured to adjust phases of two linearly polarized components of incident light, which oscillate in directions orthogonal to each other, a detector configured to transmit a polarized component oscillating in one direction and not to transmit a polarized component oscillating in a direction orthogonal to the one direction, the polarized components being included in light emitted from the phase adjuster, and a photoelectric convertor configured to photoelectrically convert a polarized component transmitted through the detector. The phase adjuster has at least three areas. The at least three areas include at least two areas having phase adjusting amounts different from each other, and at least two areas having an identical phase adjusting amounts and having slow axes whose directions are different from each other by 20 to 90 degrees inclusive.

Abstract: A video encoding apparatus, a video decoding apparatus and video decoding method are provided. The video decoding apparatus includes: a decoding unit receiving encoded data and reconstruct an intra prediction mode by decoding a bitstream of the encoded data; a dequantization unit dequantizing the quantized transformed residual block to reconstruct a transformed residual block; an inverse transform unit inversely transforming the transformed residual block to reconstruct a residual block; a prediction unit generating a predicted block by selectively using one of pixels of a neighboring block adjacent to a current block and a reference pixel generated by filtering the pixels of the neighboring block according to the intra prediction mode; and an addition unit adding the reconstructed residual block and the predicted block to reconstruct the current block.

Abstract: An optical sensor system having an extended elevation field of view and in which the optics are configured around an all-reflective four-mirror reimaging anastigmat used for afocal foreoptics and an all-reflective five-mirror reimaging anastigmat used for imaging optics.

Abstract: A thermal-type infrared sensor includes a thermopile; an electrical conduction path of the thermopile, the conduction path including at least one crossed section in which the conduction path is crossed; a first region that is closed or substantially closed and formed by part of the conduction path, the part of the conduction path including an output section of the conduction path and the at least one crossed section; and a second region that is closed or substantially closed and formed by another part of the conduction path having the at least one crossed section as a boundary. The first region and the second region do not overlap each other.

Abstract: An imager is provided that includes an integrated circuit. The integrated circuit includes at least one metal layer, a signal line extending in a first direction, and a pixel cell. The pixel cell includes imaging pixels and a metal interconnect. The imaging pixels include first, second, third, and fourth imaging pixels, arranged in two rows and two columns, each imaging pixel having a metal-insulator-metal (MiM) capacitor disposed on the at least one metal layer, the first and second imaging pixels being traversed by the signal line to receive signals from the signal line. The metal interconnect extends in a second direction different than the first direction and is coupled to the signal line and the third imaging pixel to transmit the signals to the third imaging pixel. The third imaging pixel is adjacent to the first imaging pixel and is disposed in a different column or row than the second imaging pixel.

Abstract: Terahertz imaging devices may comprise a focal plane array including a substrate and a plurality of resonance elements. The plurality of resonance elements may comprise a conductive material coupled to the substrate. Each resonance element of the plurality of resonance elements may be configured to resonate and produce an output signal responsive to incident radiation having a frequency between about a 0.1 THz and 4 THz range. A method of detecting a hazardous material may comprise receiving incident radiation by a focal plane array having a plurality of discrete pixels including a resonance element configured to absorb the incident radiation at a resonant frequency in the THz, generating an output signal from each of the discrete pixels, and determining a presence of a hazardous material by interpreting spectral information from the output signal.

Abstract: Presented is a video distribution system that includes a transmitter that receives an uncompressed source video signal and includes a compressor for compressing the uncompressed source video signal into a compressed video signal having a bandwidth lower than the bandwidth of the uncompressed source video signal, a reformatter configured for reformatting the compressed video signal to simulate an uncompressed video signal having a bandwidth lower than the bandwidth of the uncompressed video signal. The video distribution system also includes a receiver that receives the compressed video signal that simulates an uncompressed video signal and includes a decompressor configured for decompressing the compressed video signal that simulates an uncompressed video signal into a decompressed video signal, and output port configured for transmitting the decompressed video signal to a display.

Abstract: The detection device comprises a cold finger which performs the thermal connection between a detector and a cooling system. The cold finger comprises at least one side wall at least partially formed by an area made from the amorphous metal alloy. Advantageously, the whole of the cold finger is made from the amorphous metal alloy.

Abstract: A lightweight infrared sensor that detects a temperature at a portion spaced apart from a circuit substrate with high accuracy, is installed on the circuit substrate easily and stably, and includes an insulating film; a first and a second heat sensitive elements are disposed on one surface of the insulating film separately; a first conductive film on the insulating film that is connected to the first heat sensitive element; a second conductive film connected to the second heat sensitive element; an infrared reflection film on the other surface of the insulating film so as to face the second heat sensitive element; a plurality of terminal electrodes formed on one end of the insulating film and fitted into an external connector; an edge reinforcing plate adhered to one end of one surface of the insulating film; and a mounting hole that is formed on the other end.

Abstract: An infrared ray detecting element includes: a substrate having a cavity; an infrared ray detecting portion including, sequentially stacked, a lower electrode layer, a detection layer, and an upper electrode layer; first and second support portions which support the infrared ray detecting portion above the cavity; and first and second external lead portions for leading electrical signals outputted from the infrared ray detecting portion, to the outside. The first support portion includes, sequentially stacked, a first upper wiring pattern, a first insulating layer, and a first lower wiring pattern. The upper electrode layer is connected to the first external lead portion via the first upper wiring pattern. The second support portion includes, sequentially stacked, a second upper wiring pattern, a second insulating layer, and a second lower wiring pattern. The lower electrode layer is connected to the second external lead portion via the second lower wiring pattern.

Abstract: Readout integrated circuits placed underneath the suspended sensing elements detect changes of electrical resistance of sensing elements and digitize the signals with digital to analog convertor for each element. Readout electronics provides low parasitics, high signal to noise ratio, high data rate, high dynamic range and instantaneous global readout.

Abstract: Techniques are described to form an absorption stack proximate to a thermopile sensor. In one or more implementations, a thermopile sensor is formed proximate to a semiconductor wafer. An absorption stack is formed proximate to the semiconductor wafer and includes a first layer, a second layer, and a third layer. The first layer may be a material having absorption and/or reflective characteristics. The second layer may be a material having wave phase shift characteristic characteristics. The third layer may be a material having a reflective characteristic.

Abstract: A method of actuating a plurality of probes. Each probe may be made of two or more materials with different thermal expansion coefficients which are arranged such that when the probe is illuminated by an actuation beam it deforms to move the probe relative to a sample. Energy is delivered to the probes by sequentially illuminating them with an actuation beam via an objective lens in a series of scan sequences. Two or more of the probes are illuminated by the actuation beam in each scan sequence and the actuation beam enters the objective lens at a different angle to an optical axis of the objective lens for each probe which is illuminated in a scan sequence. The actuation beam is controlled so that different amounts of energy are delivered to at least two of the probes by the actuation beam during at least one of the scan sequences.

Abstract: An infrared detection device including an infrared heat detector and a connection pad each spaced apart from an etching stop layer by a non-zero distance substantially equal relatively to each other, wherein first and second electrically conducting vias are respectively electrically connected to first and second portions of a metal line of a penultimate level of electrical interconnections, and wherein an empty space formed in a first inter-metal dielectric layer surrounds the first electrically conducting via and extends under the infrared heat detector.

Abstract: A camera, computer program, and method for determining and displaying temperature rates of change for regions within the camera's field of view. More specifically, the embodiments provide for the continuous, real-time temperature measurement and display of a region within the camera's field of view, and further for the real-time processing and display of the temperature rates of change for the region.

Abstract: A three-dimensional position and orientation tracking system comprises one or more pattern tags, each comprising a plurality of contrasting portions, a tracker for obtaining image information about the pattern tags, a database with geometric information describing patterns on pattern tags; and a controller for receiving and processing the image information from the tracker, accessing the database to retrieve geometric information, and comparing the image information with the geometric information. The contrasting portions are arranged in a rotationally asymmetric pattern and at least one of the contrasting portions on a pattern tag comprising a perimeter with a polygonal shape. The pattern tags may be borne on tracking markers that have a three-dimensional shaped surface. The tracking system can be implemented in a surgical monitoring system in which the pattern tags are attached to tracking markers or are themselves tracking markers.

Abstract: A system and method for optimizing fixed and temporal noise in an infrared imaging system. The system may use correction tables with correction factors, each correction factor indexed to a plurality of system parameters.

Abstract: Apparatus, systems, and methods related to focal plane arrays can be used in a variety of applications. In various embodiments, focal plane arrays can be fabricated on a wafer integration level based on arrangement of a flexible conductive layer for photosensitive pixels of the focal plane arrays. Arrangement of a flexible conductive layer allows for a number of architectures of focal plane arrays. Additional apparatus, systems, and methods are disclosed.

Abstract: Methods for detecting a horizon in an image with a plurality of pixels can include the step of blurring the image with a noise filter, then dividing the image into an M×N matrix of sub-blocks S. For each sub-block S, horizon features can be coarse-extracted by defining an r-dimensional vector having P feature values for each sub-block S and clustering each r-dimensional vectors into two clusters using a k-means statistical analysis. The corresponding sub-blocks S corresponding to the two clusters can be masked with a binary mask. The methods can further include the step of fine-extracting the horizon features at a pixel level for each sub-block Si, j and sub-block Si?1, j when the binary mask changes value from sub-block Si?1 j to said sub-block Si, j, for i=1 to M and j=1 to N.

Abstract: A system for use in identifying a user includes a portable emitter transported with the user. The emitter includes a quantum cascade laser configured to emit a thermal beam identifying a location of the user in response to a command, the thermal beam having a wavelength between approximately 2 ?m and approximately 30 ?m.

Abstract: A photonic sensor, comprising: a platform, a temperature sensor on the platform; and a structure formed on or as part of the platform.

Abstract: An infrared thermal imaging system includes a focal plane array (FPA) of infrared detectors, read out integrated circuitry (ROIC) operatively coupled to the FPA, and a microcontroller having at least one video display interface operatively coupled to the ROIC. The FPA is configured to generate an output signal in response to infrared radiation impinging upon the infrared detectors. The microcontroller is configured to send data to the ROIC via the at least one video display interface, the data including non-uniformity correction terms for correcting non-uniformities of the FPA.

Abstract: A thermal imaging camera with a repositionable focal plane array (FPA) is disclosed. An active portion of the FPA is used by the camera to generate a thermal image. The FPA may be positioned such that a defect in the FPA is located in an unused and inactive portion of the FPA.

Abstract: An event gathering method includes: storing cost information between nodes which manages by associating a transmission node identifier and a reception node identifier with a first communication cos, the communication occurring between nodes including a sensor node which transmits an event and an intermediate node which relays the event; modifying or storing the event; gathering cost information between modules which manages by associating a transmission module identifier and a reception module identifier with a second communication cost of a occurred event; extracting a pattern candidate which assigns modules to first nodes as deployment pattern candidates which manages by associating a module identifier with a node identifier; computing a total communication cost based on the cost information between modules and the cost information between nodes; selecting a deployment pattern candidate having the smallest total communication cost; and deploying the modules in the first nodes based on a selected deployment

Abstract: Thermo-optical array devices and methods of processing thermo-optical array devices are disclosed. One method of processing thermo-optical array devices includes forming a (001) oriented titanium dioxide material on a bolometer material, and forming a vanadium dioxide material on the (001) oriented titanium dioxide material. One thermo-optical array device includes a bolometer material, a titanium dioxide material on the bolometer material, and a vanadium dioxide material on the titanium dioxide material, wherein the vanadium dioxide material has an optical transition temperature of less than 67 degrees Celsius.

Abstract: Panoramic imaging systems including rotatable mirrors are provided. A panoramic imaging system includes a rotatable platform, an imaging device mounted to the rotatable platform, and a mirror rotatably mounted to the rotatable platform. The mirror is positioned in an optical path of the imaging device. The mirror and the imaging device are oriented such that the mirror and imaging device are in the same plane, an optical axis of the imaging device is substantially perpendicular to an axis of rotation of the rotatable platform, and an axis of rotation of the mirror is substantially parallel to the axis of rotation of the rotatable platform when the mirror is in an initial position.

Abstract: An integrated diode array and a corresponding manufacturing method are provided. The integrated diode array includes a substrate having an upper side, and a plurality of blocks of several diodes, which are positioned in a planar manner and are suspended at the substrate above a cavity situated below them in the substrate. The blocks are separated from one another by respective gaps, and within a specific block, the individual diodes are electrically insulated from one another by first STI trenches situated between them.

Abstract: A mounting structure between the spectral filter and optical sensor includes one or more beads of epoxy that are bonded to the face of the sensor at locations adjacent and bonded to the edge of the spectral filter around its perimeter. Placement of the epoxy so that it bonds to the edge of the spectral filter improves the robustness of the package to sheer stresses. Placement of the epoxy at the edge, suitably in discrete spot bonds, also avoids putting epoxy in the optical path, contaminating the optically active area or using epoxy to control the gap height. Alignment of the spectral filter in the plane (x,y) may be achieved using fiducial marks on the sensor and filter. Alignment of the spectral filter out of the plane (z) may be achieved using incompressible spacer balls that set the gap height precisely to the diameter of the ball. Alternately, the spectral filter may be placed in direct contact with the optically active area of the sensor.

Abstract: A method for presenting a thermal image within a visible light image includes the steps of: identifying an outline of each object of interest within the visible light image; and, selecting an area of the visible light image, whose edge corresponds to the outline of each object of interest, in which to present the thermal image. An alternative method includes the steps of: identifying an area of interest within the thermal image; and selecting another area, separate from the area of interest, from which to remove a portion of the thermal image in order to display the visible light image therein. The visible light and thermal images are captured by a system that includes a visible light camera module and an infrared camera module. The visible light and thermal images are displayed on a display of the system, and selections are made via an interactive element of the system.

Abstract: An infrared detector may be provided that includes: a micro-bolometer active cell which detects infrared and outputs a current signal; and a reference cell which includes a plurality of connected warm cells having the same structure and electrical characteristics as those of the micro-bolometer active cell, has the same electrical resistance value and average self-heating amount as those of the micro-bolometer active cell, and generates a reference current signal for the micro-bolometer active cell.

Abstract: Disclosed is an organic light emitting display device. The organic light emitting display device includes a display panel including a plurality of pixels formed in intersection areas between a plurality of gate lines, a plurality of data lines, and a plurality of sensing lines, a gate driver supplying a gate signal to the gate lines, a plurality of data driving ICs including a data driver, supplying data voltages to the data lines, and a sensing unit including a plurality of ADCs that each sense characteristic change of a driving transistor included in a corresponding pixel to generate sensing data, a memory storing a gain error and offset error of each ADC, and a timing controller correcting the sensing data on a basis of the gain error and offset error, modulating input data on a basis of the corrected sensing data, and supplying the modulated data to the data driving ICs.

Abstract: A system for use in identifying a user includes a portable emitter transported with the user. The emitter includes a quantum cascade laser configured to emit a thermal beam identifying a location of the user in response to a command, the thermal beam having a wavelength between approximately 2 ?m and approximately 30 ?m.

Abstract: A readout circuit for an uncooled infrared focal plane array includes: a first biasing circuit for generating a detection output signal; a second biasing circuit for generating a first reference output signal; a first integration circuit; and an analog-to-digital circuit including: a ramp signal generating circuit for generating a ramp signal according to a second reference microbolometer of a third biasing circuit. In the readout circuit, subtracting and amplifying the detection output signal and the first reference output signal are provided by the integrator at an analog domain, while ratio counting is provided by an analog-to-digital converter during analog-to-digital conversion. Furthermore, a column level integrated readout channel utilizes only one reference microbolometer, and the chip level ramp signal generator also utilizes only one reference microbolometer. Therefore, a chip area is further saved, and noise sources are decreased.

Abstract: Security systems can be used to detect a visitor. The security system can include a camera that is configured to take a video of the visitor. As well, the security system can be configured to transmit the video of the visitor to a remote computing device. The video of the visitor can be displayed on the remote computing device. The security system can be attached to a light socket.

Abstract: On-board non-uniformity correction calibration methods for a microbolometer focal plane array in a thermal camera are disclosed. The methods include performing first calculations in the processor unit of the thermal camera to generate and apply a set of coarse correction bias voltages to the detector elements. The method also includes performing calculations in the external computer based on image data collected by the thermal camera with the coarse correction bias voltages applied to the detector elements to generate a set of fine correction bias voltages. The method also includes downloading the fine correction bias voltages to the thermal camera and applying the fine correction voltages to the detector elements to establish a fine calibration of the microbolometer focal plane array.

Abstract: In accordance with the invention, an improved image sensor includes an array of germanium photosensitive elements integrated with a silicon substrate and integrated with silicon readout circuits. The silicon transistors are formed first on a silicon substrate, using well known silicon wafer fabrication techniques. The germanium elements are subsequently formed overlying the silicon by epitaxial growth. The germanium elements are advantageously grown within surface openings of a dielectric cladding. Wafer fabrication techniques are applied to the elements to form isolated germanium photodiodes. Since temperatures needed for germanium processing are lower than those for silicon processing, the formation of the germanium devices need not affect the previously formed silicon devices. Insulating and metallic layers are then deposited and patterned to interconnect the silicon devices and to connect the germanium devices to the silicon circuits.

Abstract: An organic light emitting display device includes a display panel including a plurality of pixels having an organic light emitting diode and a pixel circuit; a gate driver to supply the plurality of pixels with a scan signal, a sensing signal, and a driving voltage; a data driver to supply data voltages and a reference voltage to the plurality of pixels in a driving mode, and sense voltages charged into the plurality of pixels in a sensing mode; a discharging driving unit to initialize voltages of a plurality of sensing power lines when the display device switches from the driving mode to the sensing mode; a timing controller to control the gate driver, the data driver, and the discharging driving unit to operate in and switch between the driving mode and the sensing mode; and a memory to store compensation data for the plurality of pixels.

Abstract: A wide field-of-view infrared optical imaging system with extended spectral coverage into the 1.0 to 2.5 ?m wavelength range. In one example, an optical imaging system includes an imaging detector sensitive to light in a wavelength range of at least 1.0 ?m to 5.0 ?m, and a plurality of lenses optically coupled together and configured to focus incoming light onto the imaging detector, the plurality of lenses each comprised of a material that is transparent to the light in the wavelength range of at least 1.0 ?m to 5.0 ?m, wherein a pupil of the optical imaging system is located external to the plurality of lenses between the plurality of lenses and the imaging detector.

Abstract: Various techniques are provided for performing detection using a focal plane array (FPA). For example, in one embodiment, a unit cell of an FPA may be implemented to support rapid sampling in response to one or more laser pulses reflected from an object or feature of interest. An FPA implemented with such unit cells may be used, for example, in an imaging system capable of detecting a plurality of two dimensional image frames and providing a three dimensional image using the detected two dimensional image frames. Other applications of such rapid sampling unit cells are also contemplated.

Abstract: A solid-state imaging device 2A includes a CCD-type solid-state imaging element 10 having an imaging plane 12 formed of M×N pixels that are two-dimensionally arrayed in M rows and N columns and N signal readout circuits 20 arranged on one end side in the column direction for each of the columns with respect to the plane 12 and for outputting electrical signals according to the magnitudes of charges taken out of the respective columns, respectively, a C-MOS-type semiconductor element 50 for digital-converting and sequentially outputting as serial signals electrical signals output from the circuits 20 for each of the columns, a heat transfer member 80 having a main surface 81a and a back surface 81b, and a cooling block 84 provided on the surface 81b, and the semiconductor element 50 and the surface 81a of the heat transfer member 80 are bonded to each other.

Abstract: Various embodiments disclosed herein describe a divided-aperture infrared spectral imaging (DAISI) system that is adapted to acquire multiple IR images of a scene with a single-shot (also referred to as a snapshot). The plurality of acquired images having different wavelength compositions that are obtained generally simultaneously. The system includes at least two optical channels that are spatially and spectrally different from one another. Each of the at least two optical channels are configured to transfer IR radiation incident on the optical system towards an optical FPA unit comprising at least two detector arrays disposed in the focal plane of two corresponding focusing lenses. The system further comprises at least one temperature reference source or surface that is used to dynamically calibrate the two detector arrays and compensate for a temperature difference between the two detector arrays.

Abstract: A method for thermographic imaging is described. The method captures a plurality of thermal images of a surface of an object, at non-linear intervals over a period of time, each of the thermal images being associated with temporal data. The method then processes the plurality of thermal images and the temporal data, and identifies features within the object based on the processing.

Abstract: A target marking system includes a light source configured to emit a beam of thermal radiation and to impinge the beam onto a target. The system also includes a detector configured to collect radiation passing from the target to the detector along a path. The radiation passing from the target in response to impingement of the beam onto the target. The system further includes an optics assembly disposed optically upstream of the detector along the path. The optics assembly includes at least one of an afocal power changer, a camera objective, a catadioptric lens, and a zoom system configured to condition the radiation passing from the target to the detector.

Abstract: An infrared detector including an array of detection bolometers each having a bolometric membrane suspended above a substrate, and associated with each bolometer: a detection branch, including the bolometer and a circuit performing a biasing according to a voltage set point, a compensation branch, including a compensation bolometer thermalized to the substrate, a circuit performing a biasing according to a voltage set point, an integrator for generating a voltage by integrating a difference between the currents flowing through said branches, a circuit generating a quantity depending on substrate temperature, including: a bolometer thermalized to the substrate, and a circuit for biasing the bolometer, and a circuit for generating the voltage set points according to said quantity. When the array is exposed to a uniform reference scene, the average of the differences between currents flowing through said branches is within the integrator dynamic range for a substrate temperature range from ?30° C.-90° C.

Abstract: A terahertz electromagnetic wave generator according to the present disclosure includes: a substrate; a thermoelectric material layer which is supported by the substrate and which has a surface; and a pulsed laser light source system which locally heats the thermoelectric material layer with an edge of the surface of the thermoelectric material layer irradiated with pulsed light, thereby generating a terahertz electromagnetic wave from the thermoelectric material layer.

Abstract: An infrared conversion device includes: a substrate (122); and a metal fine particle layer (123) formed on the substrate (122), wherein the metal fine particle layer (123) is formed with metal fine particles (124) and a dielectric material (125) that fills gaps between the metal fine particles (124) and absorbs incident infrared rays. Alternatively, an infrared conversion device detects infrared rays converted into visible light by detecting a change caused in the permittivity of a light receiving material (125) by infrared absorption as a change in the intensity of scattering light based on local plasmon resonance.

Abstract: A divided-aperture infrared spectral imaging (DAISI) system that is structured to provide identification of target chemical content in a single imaging shot based on spectrally-multiplexed operation. The system is devoid of spectral scanning acquisition of infrared (IR) spectral signatures of target content with an IR detector and does not require content.

Abstract: The present invention relates to a device for radiating or receiving an electromagnetic wave. The device includes a substrate including a recess coated by a material that reflects the electromagnetic wave, a metal portion that radiates or receives the electromagnetic wave, and an electronic element connected to the metal portion on the substrate. The metal portion includes a portion provided above an opening of the recess and a portion which is located on the substrate and connected to the electronic element.

Abstract: A terahertz wave detection device includes a wavelength filter transmitting terahertz waves having a predetermined wavelength, and a detection portion detecting the terahertz waves having the predetermined wavelength that have passed through the wavelength filter by converting the terahertz waves into heat, wherein the wavelength filter includes a metal layer having a plurality of holes communicating with an incident surface onto which the terahertz waves are incident and an emission surface from which the terahertz waves having the predetermined wavelength are emitted, and a dielectric portion filling in the plurality of holes and made of a dielectric, wherein the plurality of holes are formed with a predetermined pitch along a direction that is perpendicular to a normal line of the incident surface.