Abstract: An interferometric and synthetic aperture THz incoherent imaging system is provided, in which a high-power electronic source such as a 0.094 THz Gunn Oscillator is integrated with a continuous-wave (CW) terahertz detection system in order to achieve a high signal-to-noise ratio. THz imaging of a point source located 10 m away from the detector array is presented. A 2-D THz reflective image is reconstructed with only four detectors using rotational synthesis.

Abstract: A thermal detector includes a substrate; a support member supported on the substrate interposed by a cavity; a heat-detecting element formed on the support member; a light-reflecting layer formed at a position spaced apart from the heat-detecting element in at least a portion of a peripheral region of the heat-detecting element on the support member; a light-absorbing layer formed on the heat-detecting element and the light-reflecting layer; and a thermal transfer member that is connected to the heat-detecting element by a connector, the thermal transfer member including a connecting portion connected to the heat-detecting element and a thermal collecting portion disposed inside the light-absorbing layer and having a surface area larger than a surface area of the connecting portion as seen in plan view, the thermal collecting portion being optically transmissive at least with respect to light of a prescribed wavelength.

Abstract: A thermographic imaging device includes a focal array portion including a planar arrangement of a plurality of light sensitive devices, and an aperture portion including a facing planar surface, an opposing planar surface, and an arrangement of a plurality of orifices that are communicative with the facing planar surface and the opposing planar surface, each infrared sensitive device of the plurality of infrared arranged in alignment with a corresponding orifice of the plurality of orifices.

Abstract: Provided is a resistor film comprising vanadium oxide as a main component, wherein metal-to-insulator transition is indicated in the vicinity of room temperature in temperature variations of electric resistance, there is no hysteresis in a resistance change in response to temperature variations or the temperature width is small at less than 1.5K even if there is hysteresis, and highly accurate measurement can be provided when used in a bolometer. Upon producing the resistor film comprising vanadium oxide as a main component by treating a coating film of an organovanadium compound via laser irradiation or the like, a crystalline phase and a noncrystalline (amorphous) phase are caused to coexist in the resistor film.

Abstract: A solution for evaluating an object using infrared data is provided. In particular, infrared data corresponding to the object is processed to enhance a set of signal features. The infrared data is analyzed to determine whether one or more anomalies are present.

Abstract: Method for collecting video files of one or more Leak Detection and Repair (LDAR) components, including receiving information pertaining to the one or more LDAR components within a specified area, recording a video of the LDAR components for a predetermined amount of time using a camera, associating the video with the information, and storing the video along with the information to a memory located in a computer.

Abstract: A camera has an infrared (IR) imaging subsystem that includes an IR detector. The camera also has a visual imaging subsystem for generating a visual image of an observed scene. The camera also has one or more distance measuring devices for obtaining distance related information regarding a distance from the camera to the scene and a processor arranged to receive distance related information from one or more distance measuring devices and process the received distance related information, wherein said processing comprises determining a distance to the scene based on the received distance related information. The IR imaging subsystem may also include an IR optical element for focusing IR radiation on the IR detector. The IR optical element may be operable to focus the IR radiation on the IR detector based on the determined distance.

Abstract: Disclosed herein are an infrared (IR) sensor and a sensing method using the same, in which disturbance by an external luminous object is removed using the IR sensor that irradiates IR light into a sensing area to sense an object, so that the position or distance of the object can be precisely and accurately sensed. An IR sensor includes an illumination unit that irradiates IR light into a sensing area; an image pickup device that obtains an IR image in the sensing area by sensing the IR light incident from the sensing area; and a control unit that controls the emission time at which the illumination unit irradiates the IR light and the pickup time of the image pickup device.

Abstract: A dual-mode includes a light source configured to project a structured illumination from which visible light can be filtered. The dual-mode imager also includes a detector configured to capture both the structured illumination and visible light from the scene. A temporal or spatial filter is used to selectively block visible light from one or more portions of the detector while passing the structured illumination to the one or more portions of the detector.

Abstract: A terahertz wave detecting device includes a wavelength filter and a detection part. The wavelength filter is configured to convert terahertz waves to heat. The detection part is configured to detect the heat converted by the wavelength filter. The wavelength filter includes a wavelength selection layer and a terahertz wave absorption layer. The wavelength selection layer is configured to transmit terahertz waves of a prescribed wavelength among the terahertz waves. The terahertz wave absorption layer is provided in contact with the wavelength selection layer and the detection part, and contains a material for absorbing the terahertz waves of the prescribed wavelength.

Abstract: An infrared sensor, comprising at least one pixel comprising a first sensor and a second sensor, wherein the first and second sensors are dissimilar.

Abstract: A lightweight, low volume, inexpensive LADAR sensor incorporating 3-D focal plane arrays is adapted specifically for personal electronic appliances. The present invention generates, at high speed, 3-D image maps and object data at short to medium ranges. The techniques and structures described may be used to extend the range of long range systems as well, though the focus is on compact, short to medium range ladar sensors suitable for use in personal electronic devices. 3-D focal plane arrays are used in a variety of physical configurations to provide useful new capabilities to a variety of personal electronic appliances.

Abstract: An optical sensor includes a visible light sensor includes a visible light sensing transistor and an infrared light sensor includes an infrared light sensing transistor, wherein the visible light sensing transistor receives a first driving voltage through a first driving voltage line, the infrared light sensing transistor receives a second driving voltage through a second driving voltage line, and the visible light sensing transistor and the infrared light sensing transistor receive a reference voltage through a reference voltage line.

Abstract: An imaging device for real-time display of image data on a local display and on a remote display is disclosed. In some embodiments, the imaging device can include an imaging engine, a memory device for storing image data, and a processor for receiving the image data from the imaging engine, storing the image data in the memory device, retrieving the image data from the memory device, and transmitting the image data to both a local display and remote display so that the image data can be viewed on both the remote display and local display simultaneously.

Abstract: The present invention describes a method of modifying an image in a video that includes the step of capturing a visible light image of an area, where the visible light image captured at a first frame rate. The method in addition includes the step of capturing a corresponding infrared light image of an area, the infrared light image being captured when the area is illuminated with an infrared light source, the infrared light image captured at the substantially the same frame rate as the visible light image. Based on the infrared light image, at least a subset of the human perceptible characteristics of the captured visible light image are modified.

Abstract: An optical element includes a semiconductor layer having an energy band gap larger than a photon energy of light, and a plurality of electrodes in electrical contact with the semiconductor layer. At least one of the electrodes forms a Schottky junction between the electrode and the semiconductor layer; the Schottky junction has a barrier height smaller than the photon energy of the light. At least part of a junction surface between the electrode that forms the Schottky junction and the semiconductor layer includes a light irradiation surface arranged to be irradiated with the light from a surface of the semiconductor layer without the electrodes, and a portion of a coupling structure arranged to be coupled to a terahertz wave that is generated or detected through the irradiation with the light.

Abstract: A non-destructive approach for the 3D localization of buried hot spots in electronic device architectures by use of Lock-in Thermography (LIT). The 3D analysis is based on the principles of thermal wave propagation through different material layers and the resulting phase shift/thermal time delay. With more complex multi level stacked die architectures it is necessary to acquire multiple LIT results at different excitation frequencies for precise hot spot depth localization. Additionally, the use of multiple time-resolved thermal waveforms, measured in a minimized field of view on top of the hot spot location, can be used to speed up the data acquisition. The shape of the resulting waveforms can be analyzed to further increase the detection accuracy and confidence level.

Abstract: A dual-mode includes a light source configured to project a structured illumination from which visible light can be filtered. The dual-mode imager also includes a detector configured to capture both the structured illumination and visible light from the scene. A temporal or spatial filter is used to selectively block visible light from one or more portions of the detector while passing the structured illumination to the one or more portions of the detector.

Abstract: A receiver chip for use in an imaging system includes a plurality of receiver dies, each of the receiver dies comprising one or more receiver circuits; a die interconnection layer located on top of the plurality of receiver dies; a quarter wave dielectric layer located on top of the die interconnection layer; and a plurality of antennae located on the quarter wave dielectric layer, each of the plurality of antennae corresponding to a respective receiver circuit, wherein the plurality of antennae are connected to the one or more receiver circuits through the quarter wave dielectric layer and the die interconnection layer by respective vias, such that a distance between a topmost layer of the die interconnection layer and the plurality of antennae is determined by a thickness of the quarter wave dielectric layer.

Abstract: A solution for evaluating a vehicle using infrared data is provided. In particular, evaluation data for the vehicle is obtained, which includes infrared data for a plurality of sides of the vehicle as well as vehicle identification data for distinguishing the vehicle from another vehicle. The infrared data is processed to enhance a set of signal features. Additional non-infrared based data also can be obtained for evaluating the vehicle. The evaluation data is analyzed to determine whether one or more anomalies are present. The anomaly(ies) can be correlated with a possible problem with a component of the vehicle. Data on the anomaly, problem, and/or vehicle identification can be provided for use on another system, such as a remote inspection station, maintenance system, and/or the like.

Abstract: A microbolometer comprises an array of sensor elements or ‘pixels’ each individually responsive to generate an output indicative of the intensity of infrared radiation incident thereupon. In practice there are significant non-uniformities in the response of each pixel and further processing of the outputs must take place to generate an accurate image. These non-uniformities are dealt with by means of individual correction factors to be applied to the outputs of each pixel in the image. Commonly, the correction used provides a constant offset (1pt) and a linear gain correction (2pt). As the optimal values of these corrections drifts over time it is still necessary to provide further correction.

Abstract: An uncooled infrared imaging element includes a pixel region, a device region, and a support substrate. The pixel region includes heat-sensitive pixels. The heat-sensitive pixels are arranged in a matrix and change current-voltage characteristics thereof in accordance with receiving amounts of infrared. The device region includes at least one of a drive circuit and a readout circuit which includes a MOS transistor. The drive circuit drives the heat-sensitive pixels. The readout circuit detects signals of the heat-sensitive pixels. The support substrate is provided with a cavity region to be under pixel region and the MOS transistor.

Abstract: A method and apparatus for horizon control in a mining operation where fresh product 3 is cut from a seam 1. The cutting exposes a fresh cut product face 25. The fresh cut product face 25 is observed at a position immediately adjacent a cutter 11. Any temperature contrast regions from an IR observation between an upper limit of observation and a lower limit of observation are noted. At least one height co-ordinate position of a temperature contrast region 33 is determined and an output signal provided of the determined height co-ordinate position so that the output signal can be used as a horizon datum for horizontal control.

Abstract: An apparatus for multi-spectral imaging includes a microbolometer array comprising a two-dimensional array of microbolometer detectors that are configured to respond to energy having a first range of wavelengths comprising a first plurality of spectral bands. The apparatus also includes a wideband window configured to allow energy having a second range of wavelengths to reach the microbolometer array. The second range of wavelengths comprises a second plurality of spectral bands. The apparatus additionally includes optics configured to focus the energy from a scene towards the microbolometer array. The apparatus further includes a processor configured to generate an output based on a response of the microbolometer array to energy having a third range of wavelengths comprising a third plurality of spectral bands. There is substantial overlap between the first, second, and third range of wavelengths and the first, second, and third plurality of spectral bands.

Abstract: A solid state imaging device includes an array of active pixels and an infrared cut filter formed over the sensor. Optionally, a slot in the infrared cut filter allows infrared illumination to reach the sensor to be detected by pixels covered by a visually opaque filter and surrounded by pixels of special types that limit charge leakage and enable high dynamic range sensing of infrared illumination. A ratio of average infrared signal to average brightness indicates an amount of infrared illumination reaching the imaging device.

Abstract: A system and method for optimizing fixed and temporal noise in an infrared imaging system. The system may use correction tables with correction factors, each correction factor indexed to a plurality of system parameters.

Abstract: A two fields-of-view system has both fields of view imaged simultaneously to the same image plane. For example, an optical system comprising of two or more FOV where a common dual band focal plane array is used in order to image both spectral bands independently. Each spectral band is passed through a common imager, but split off by a beam splitter so that each spectral band sees a different field of view centered at the same point. The two fields of view are separated spectrally but enabled to be imaged simultaneously due to the spectral separation of the focal plane array and the use of a beam splitter. Such a system allows viewing two fields of view simultaneously.

Abstract: An infrared sensor, comprising at least one pixel comprising a first sensor and a second sensor, wherein the first and second sensors are dissimilar.

Abstract: The systems and methods disclosed herein address issues of cost and weight that prevent other threat detection systems intended to detect and identify locations of incoming munitions fire such as RPGs, anti-tank missiles, and other such weapons, from being used more broadly. Systems and methods disclosed herein relate, in part, to a portable, optical sensor that has a 360-degree horizontal field of view and a selectable vertical field of view that can cover up to 90 degrees. Variations of systems and methods discussed herein are meant for use and transport by an individual or group of individuals, and do not require significant support electronics or power supplies in excess of a typical car-battery in size and weight. Other embodiments may be vehicle mounted, or may be further enhanced to work with other detection or response systems.

Abstract: A microbolometer is disclosed, including a bottom dielectric of a bridge structure; a detector layer disposed above the bottom dielectric, the detector layer comprised of a metal-doped vanadium pentaoxide material; and a top dielectric disposed above the detector layer.

Abstract: A thermographic imaging device includes a focal array portion including a planar arrangement of a plurality of light sensitive devices, and an aperture portion including a facing planar surface, an opposing planar surface, and an arrangement of a plurality of orifices that are communicative with the facing planar surface and the opposing planar surface, each infrared sensitive device of the plurality of infrared arranged in alignment with a corresponding orifice of the plurality of orifices.

Abstract: A broadband imager, which is able to image both IR and visible light, is disclosed. In one embodiment, an IR sensitive region of an IR pixel underlies the R, G, B sensitive regions of R, G, and B visible pixels. Therefore, the IR pixel receives IR light through a same surface area of the photosensor through which the R, G, and B pixels receive visible light. However, the IR light generates electron-hole pairs deeper below the common surface area shared by the RGB and IR pixels, than visible light. The photosensor also has a charge accumulation region for accumulating charges generated in the IR sensitive region and an electrode above the charge accumulation region for providing a voltage to accumulate the charges generated in the IR pixel.

Abstract: A photocathode apparatus is constructed by a transparent body adapted to receive incident light, and a metal cover layer formed on a surface of the transparent body. The incident light reaches an incident/reflective surface of the metal cover layer through the surface of the transparent body to excite surface plasmon resonance light in the incident/reflective surface of the metal cover layer, thus emitting photoelectrons from a photoelectric surface of the metal cover layer opposite to the incident/reflective surface thereof by the photoelectric effect of one of the surface plasmon resonance photons and its second harmonic generation wave.

Abstract: A solution for evaluating a vehicle using infrared data is provided. In particular, evaluation data for the vehicle is obtained, which includes infrared data for a plurality of sides of the vehicle as well as vehicle identification data for distinguishing the vehicle from another vehicle. The infrared data is processed to enhance a set of signal features. Additional non-infrared based data also can be obtained for evaluating the vehicle. The evaluation data is analyzed to determine whether one or more anomalies are present. The anomaly(ies) can be correlated with a possible problem with a component of the vehicle. Data on the anomaly, problem, and/or vehicle identification can be provided for use on another system, such as a remote inspection station, maintenance system, and/or the like.

Abstract: An array camera may be formed from an array of lenses, an array of corresponding apertures, and an array of corresponding image sensors. The array of apertures may be configured so that some image sensors receive light through apertures of different size than other image sensors. Providing apertures of smaller size increases the F/# of an array camera and increases the depth-of-field in a captured image. The array of image sensors may include a near-infrared image sensor. Providing an image sensor array with a near-infrared image sensor may enhance depth information in captured images or increase night vision capabilities of an array camera. Combining an array of image sensors that includes a near-infrared sensor with an array of apertures having different aperture diameters may allow increased depth-of-field imaging, enhanced extraction of depth information from an image, improved night vision, enhanced image clarity or other improvements.

Abstract: A high-speed room-temperature imaging system, especially for electromagnetic radiation in the GHz and THz frequency range, is based on the sensor consisting of a matrix of plasmonic semiconductor detectors. The imaging system comprises a radiation source module, a terahertz beam director module, a plasmonic imaging sensor module, and a signal processing module. Entire image is formed simultaneously providing for high-speed image acquisition. Images can be acquired either at a single frequency (discrete spectrum) or wide frequency bands (continuous spectrum). The imaging system can be used in defectoscopy, inspection, medical and other applications.

Abstract: A hybrid solid state imaging focal plane array (FPA) for night vision systems achieves a high dynamic range from deeply overcast starlight to full daylight by interleaving non-avalanche photodiode (NAP) pixels with APD pixels in a single imaging plane controlled by a common readout circuit. The APD pixels provide high performance at low light levels, while the NAP pixels provide unsaturated images in full daylight. The APD pixels can be Discrete. In low light the readout circuit can disable the NAP pixels and interpolate the NAP pixels using the APD signals. In daylight the readout circuit can do the opposite. The FPA can be digitally fused with sensors in a separate plane such as InGaAs APD's that detect wavelengths outside of the visible band. The NAP pixels can outnumber the APD pixels, for example by three-to-one. The APD's can be silicon for visible light, or InGaAs for SWIR light.

Abstract: An apparatus and method for a wafer level vacuum package uncooled microbolometer focal plane array (FPA) on a wafer level substrate with a thin film getter-reflector (G-R). The G-R removes gas from the vacuum package and is reflective in the frequency band of the FPA. Sensor pixels are supported about a quarter-wavelength above the G-R which is within the perimeter of the imaging array. The package is evacuated through a single aperture, and vacuum is maintained for the lifetime of the FPA. Imaging sensor size is reduced while maintaining resolution by reducing non-imaging area.

Abstract: Methods, camera, and a computer-readable medium for registering on a camera display infrared and visible light images of a target scene taken from different points of view causing a parallax error.

Abstract: An imaging system allows a user to view thermal information about a scene by utilizing double-exposure holography or interferometry to determine the motion of an array of thermo-mechanical detector members.

Abstract: This aims to provide a DOI type radiation detector in which scintillation crystals arranged two-dimensionally on a light receiving surface to form rectangular section groups in extending directions of the light receiving surface of a light receiving element are stacked up to make a three-dimensional arrangement and responses of the crystals that have detected radiation are made possible to identify at response positions on the light receiving surface, so that a three-dimensional radiation detection position can be obtained. In the DOI type radiation detector, scintillation crystals are right triangle poles extending upwards from the light receiving surface and the response positions on the light receiving surface are characterized. With this structure, DOI identification of a plurality of layers can be carried out by simply performing an Anger calculation of a light receiving element signal.

Abstract: A terahertz wave detecting device includes a wavelength filter and a detection part. The wavelength filter is configured to convert terahertz waves to heat. The detection part is configured to detect the heat converted by the wavelength filter. The wavelength filter includes a wavelength selection layer and a terahertz wave absorption layer. The wavelength selection layer is configured to transmit terahertz waves of a prescribed wavelength among the terahertz waves. The terahertz wave absorption layer is provided in contact with the wavelength selection layer and the detection part, and contains a material for absorbing the terahertz waves of the prescribed wavelength.

Abstract: A thermal imaging microelectronic device including: a support, a plurality of metal levels for interconnecting electronic components formed on the support, an array of thermal detectors formed on the support, each detector including a membrane with which radiant energy may be absorbed and one or more electric signals may be provided depending on the absorbed radiant energy, and a readout circuit that reads out the electric signals from the membrane, the readout circuit being integrated to the support, and at least several of the detectors having a readout circuit provided with an integrator including at least one integration capacitor disposed facing the membrane, the capacitor having at least one upper plate made in a given interconnection metal level of the plurality of interconnection metal levels.

Abstract: A sensor for night vision applications is provided, wherein the sensor comprises a semiconductor absorption layer of composition that limits long wavelength response cutoff to between 1.25 to 1.4 ?m wavelength. The selection of this cutoff frequency provides improved dark current performance, thereby requiring less cooling of the sensor. Consequently, energy consumption is reduced, as the sensor does not require active cooling, so that the sensor is particularly beneficial for mobile night vision applications where battery weight is of high importance.

Abstract: An infrared imaging element according to an embodiment includes: a semiconductor substrate including a stacked structure of a silicon first substrate, and a first insulation film, first cavities being provided on a surface of the first substrate; an infrared detection unit provided in the semiconductor substrate and including, detection cells provided respectively over the first cavities, each of the detection cells having diodes and a second insulation film, the first insulation film converting incident infrared rays to heat, the diodes converting the heat obtained by the first insulation film to an electric signal, a third insulation film having a top face located at a greater distance from the semiconductor substrate as compared with a top face of the second insulation film; and a second substrate provided over the third insulation film. A second cavity is formed between the second substrate and the infrared detection unit.

Abstract: A microbolometer is disclosed, including a bottom dielectric of a bridge structure; a detector layer disposed above the bottom dielectric, the detector layer comprised of a metal-doped vanadium pentaoxide material; and a top dielectric disposed above the detector layer.

Abstract: An image sensor of an aspect includes a first photodetector array and a second photodetector array. The second photodetector array is coupled under the first photodetector array. Photodetectors of the second photodetector array are coupled under corresponding photodetectors of the first photodetector array. The image sensor includes a thickness of a photocarrier generation material optically coupled between the corresponding photodetectors of the first and second arrays. Other image sensors, methods of making the image sensors, methods of using the image sensors, and color filter patterns for such image sensors are also disclosed.

Abstract: There is disclosed an imaging system comprising: a first integrated circuit including a photodiode array comprising a plurality of integrating photodiode elements formed in an array of rows and columns, the integrated circuit providing a plurality of output signals corresponding to an output of each photodiode; and a second integrated circuit for receiving as inputs the plurality of output signals from the first integrated circuit and including a plurality of multiplexers corresponding to the number of columns in the array, the outputs signals from a respective column forming inputs to a respective multiplexer, each multiplexer for selectively connecting one of the output signals to a multiplexer output, wherein each multiplexer is selectively switched between the plurality of output signals by a plurality of control lines, the number of control lines corresponding to the number of rows in the array.

Abstract: The present invention relates to a method of processing images obtained from a photosensitive detector of the type notably produced by semiconductor material deposition techniques. The method consists in correcting an image acquired by the detector with a gain image. According to the invention, a temperature gain drift correction image is applied to the acquired image as a function of a temperature measured by the detector during the acquisition of the image. The invention also relates to a photosensitive detector in which the temperature gain drift correction means are included, independently of the gain image.

Abstract: A system and method for providing an apparatus for detecting radiance at a plurality of wavelengths is disclosed. The system and method includes an arrayed pixel sensor with a plurality of sub-pixel sections including a first sub-pixel section configured to detect radiance received from a radiating body at a first wavelength and a second sub-pixel section configured to detect radiance received from the radiating body at a second wavelength. The system and method also determines a ratio of the radiance detected at the first wavelength and the radiance detected at the second wavelength to determine a temperature of the radiating body based on the ratio.