Abstract: A measurement apparatus measures position information of a measurement target in a first direction. The apparatus comprises a scope configured to capture an image of the measurement target and generate image data, and a processor configured to obtain, based on the image data, the position information of the measurement target in the first direction. The processor is configured to determines the position information of the measurement target in the first direction based on: provisional position information of the measurement target in the first direction obtained from the image data, and using a correction value which is output from a model by inputting, in the model, a feature quantity, of the image data, related to a second direction different from the first direction.

Abstract: The invention relates to a method for correcting a telecentricity error of an imaging device for semiconductor lithography having an illumination unit, an imaging optical unit, and a filter for correcting the telecentricity error, having the following method steps: determining the telecentricity error of the imaging device, designing a filter for correcting the telecentricity error, arranging the filter in the pupil plane of the illumination unit, determining the telecentricity error again, and repeating the method steps one to four until the telecentricity error falls below a specified telecentricity error. The invention furthermore relates to an imaging device for semiconductor lithography, which is configured for carrying out the method.

Abstract: Provided is an article position management apparatus that a receiver receives image data from a camera apparatus and that identifies a position of an article, based on an article marker attached to an article and a reference point marker whose coordinate information in an absolute coordinate system in a field is set in advance, the article marker and the reference point marker being included in the image data, when the camera apparatus is a mobile camera apparatus, and identifies the position of the article, based on the article marker included in the image, when the camera apparatus is a fixed camera apparatus.

Abstract: A sheet feeding device includes a sensor, a roller, and a support on which the sensor and the roller are disposed. The support supports the sensor and the roller so that the sensor and the roller contact a surface of the sheet roll. The sensor and the roller face toward an axial center of the sheet roll. The roller is spaced apart from the sensor in a circumferential direction of the sheet roll. The sensor has a detection accuracy capable of detecting a step at a leading end of the sheet roll.

Abstract: A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an “ideal” conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.

Abstract: An optical scanning system including a radiating source that outputs a light beam, a time varying beam reflector that reflects the light beam through a scan lens towards a transparent sample at an incident angle of plus or minus ten degrees from Brewster's angle, a focusing lens configured to be irradiated by light scattered from the transparent sample, and a detector that is irradiated by the light scattered from the transparent sample. The detector outputs a signal that indicates an intensity of light measured by the detector. None of the light scattered from the transparent sample is blocked. The light scattered from the transparent sample is scattered from the top surface of the transparent sample, the bottom surface of the transparent sample, or any location in between the top surface of the transparent sample and the bottom surface of the transparent sample.

Abstract: The present application relates to a wafer transfer module in a semiconductor manufacturing machine, relating to semiconductor integrated circuit manufacturing machines, wherein two sets of transmitter/receivers are provide on sidewalls of the wafer transfer module to monitor the travel position of an elevator, two sets of transmitter/receivers are provide on the sidewalls of the wafer transfer module to monitor the position of a transfer arm, a signal received by the receiver is transmitted to a control system such that the control system determines, according to the travel position of the elevator and the transfer arm position, whether the transfer arm can obtain a to-be-transferred wafer, thereby preventing the problem of a wafer scratch caused by an elevator position deviation or a transfer arm position deviation.

Abstract: A UE performs a cell activation process in a wireless network. The UE calculates a first automatic gain control (AGC) setting based on downlink signals from a base station. The downlink signals include a coarse beam reference signal, a fine beam reference signal, and a conversion indication that indicates a power conversion between the coarse beam reference signal and the fine beam reference signal. The UE further calculates a second AGC setting based on the first AGC setting and the conversion indication. The UE performs a cell search using one of the first AGC setting and the second AGC setting, and performs fine time-frequency tracking using the other of the first AGC setting and the second AGC setting.

Abstract: A method for calibrating a mirror of an interferometer system configured to measure a position of an object using two interferometers of the interferometer system that are arranged at opposite sides of the object and configured to measure the position of the object in the same X-direction, wherein two sets of measurements are obtained for different rotational orientations about an axis perpendicular to the X-direction to determine a shape of the mirror. There is also provided a position measuring method in which the obtained shape of the mirror is used to adjust measurements in the X-direction, a lithographic apparatus and a device manufacturing method making use of such a lithographic apparatus.

Abstract: The invention relates to an apparatus and a method for characterizing a microlithographic mask. According to one aspect, an apparatus according to the invention comprises at least one light source which emits coherent light, an illumination optical unit which produces a diffraction-limited light spot on the mask from the coherent light of the at least one light source, a scanning device, by use of which it is possible to implement a scanning movement of the diffraction-limited light spot relative to the mask, a sensor unit, and an evaluation unit for evaluating the light that is incident on the sensor unit and has come from the mask, an output coupling element for coupling out a portion of the coherent light emitted by the at least one light source, and an intensity sensor for capturing the intensity of this output coupled portion.

Abstract: A measurement system used in a manufacturing line for micro-devices includes: a plurality of measurement devices in which each device performs measurement processing on a substrate; and a carrying system to perform delivery of a substrate with the plurality of measurement devices. The plurality of measurement devices includes a first measurement device that acquires position information on a plurality of marks formed on a substrate, and a second measurement device that acquires position information on a plurality of marks formed on a substrate. Position information on a plurality of marks formed on a substrate can be acquired under a setting of a first predetermined condition in the first measurement device, and position information on a plurality of marks formed on another substrate can be acquired under a setting of a second predetermined condition different from the first predetermined condition in the second measurement device.

Abstract: An apparatus for and method of sensing alignment marks in which a self-referencing interferometer based sensor outputs standing images of the alignment marks and camera device is used to capture the images as output by the sensor and a detector is used to obtain phase information about the alignment marks from the images as output by the sensor.

Abstract: Embodiments of the present disclosure include methods of determining scribing offsets in a hybrid laser scribing and plasma dicing process. In an embodiment, the method comprises forming a mask above a semiconductor wafer. In an embodiment, the semiconductor wafer comprises a plurality of dies separated from each other by streets. In an embodiment, the method further comprises patterning the mask and the semiconductor wafer with a laser scribing process. In an embodiment, the patterning provides openings in the streets. In an embodiment, the method further comprises removing the mask, and measuring scribing offsets of the openings relative to the streets.

Abstract: An apparatus for the high throughput measurement of optical properties of liquid samples placed into the wells of a multiwell plate is disclosed. An optical fiber within a fiber bundle containing no corrective optics between the fiber ends and the well plate bottom illuminates the sample in order to induce fluorescence, and multiple fibers collect emission radiation and transmit it to a fluorescence detector such as a spectrometer. Other embodiments involve a light scattering illumination source with detection fibers located in either the same bundle containing the fluorescence monitoring fibers or an independent light scattering detection bundle for the measurement of static and/or dynamic light scattering. Some embodiments of the invention permit the measurement of phase analysis light scattering. Thus the measurement of multiple optical properties of a liquid sample may be made simultaneously or in succession. A method for these measurements is also disclosed.

Abstract: The techniques described herein relate to methods, apparatus, and computer readable media configured to determining a two-dimensional (2D) profile of a portion of a three-dimensional (3D) point cloud. A 3D region of interest is determined that includes a width along a first axis, a height along a second axis, and a depth along a third axis. The 3D points within the 3D region of interest are represented as a set of 2D points based on coordinate values of the first and second axes. The 2D points are grouped into a plurality of 2D bins arranged along the first axis. For each 2D bin, a representative 2D position is determined based on the associated set of 2D points. Each of the representative 2D positions are connected to neighboring representative 2D positions to generate the 2D profile.

Abstract: A panel alignment device for a display device includes a stage supporting a panel and including a transmitting portion that includes a first region having a first thickness and a second region having a second thickness greater than the first thickness, a head disposed over the stage and supporting a driving chip, a vision camera which is disposed under the stage, captures a first alignment mark of the panel through the first region, and captures a second alignment mark of the driving chip through the second region, and a controller which controls at least one of a movement and a rotation of each of the stage and the head based on first image information related to a position of the first alignment mark and second image information related to a position of the second alignment mark.

Abstract: The device includes a beam source for generating an electron beam, a beam guiding tube passed through an objective lens, an objective lens for generating a magnetic field in the vicinity of the specimen to focus the particles of the particle beam on the specimen, a control electrode having a potential for providing a retarding field to the particle beam near the specimen to reduce the energy of the particle beam when the beam collides with the specimen, a deflection system including a plurality of deflection units situated along the optical axis for deflecting the particle beam to allow scanning on the specimen with large area, at least one of the deflection units located in the retarding field of the beam, the remainder of the deflection units located within the central bore of the objective lens, and a detection unit to capture secondary electron (SE) and backscattered electrons (BSE).

Abstract: A detection apparatus that detects a mark formed on a substrate is provided. The detection apparatus comprises a detection optical system that irradiates light on the mark on the substrate held by a stage and detects an image of the mark, and a processor that performs a detection process of the mark based on the image of the mark. The processor finds a detection value indicating a position of the mark in an observation field of the detection optical system based on the image of the mark, finds a subregion in which the mark is located among a plurality of subregions in the observation field, and corrects the detection value based on a correction value corresponding to the found subregion among correction values predetermined for the plurality of subregions, respectively.

Abstract: An image pickup apparatus includes a stage configured to support a sample at a plurality of support points, a bending data acquisition unit configured to acquire bending data corresponding to a bending of the sample supported on the stage, a height information detection unit configured to detect a height of the sample supported on the stage, a difference value calculation unit configured to calculate a difference value between a height indicated by height information and a height indicated by the bending data at each of a plurality of points on the sample, a correction data calculation unit configured to calculate correction data based on the difference value, and an estimation unit configured to calculate estimation data for estimating the height of the sample by correcting the bending data using the correction data.

Abstract: A measuring equipment, applied to carry a workpiece to be measured, includes a main base and a positioning device. The main base includes a measuring center axis. The positioning device includes at least two positioning elements. Each of the at least two positioning elements is disposed movably on the main base, and each of the at least two positioning elements is moved with respect to the measuring center axis. An identical distance is there from each of the at least two positioning elements to the measuring center axis. Each of the at least two positioning elements is used for the workpiece to contact and to be positioned to the measuring center axis.

Abstract: A method and device for enhancing alignment performance of a lithographic device can provide an optimal alignment light source type to perform alignment according to product features. Overlay performance of the product can be improved, wafer reject can be reduced, and production efficiency can be enhanced.

Abstract: There are provided an overlay measuring device and a method for controlling a focus and a program therefor. An overlay measuring device controlling a focus in one embodiment includes an objective lens; a memory; a lens focus actuator operating the objective lens to adjust a distance between the objective lens and a wafer; and a processor controlling operations of the memory and the lens focus actuator, wherein the processor is configured to obtain a first height value in relation to each site of the wafer, match the obtained first height value and a corresponding site and store the same, and as initial measurement in relation to each site of the wafer starts, control the lens focus actuator, based on the stored first height value of the site, to control a Z-axis movement of the objective lens.

Abstract: According to one embodiment, a position measuring apparatus includes a substrate holding part, a projection part, a liquid supply part, an imaging part, a position measuring part, and a control unit. The substrate holding part is configured to hold a substrate including at least part of a circuit pattern. The projection part is configured to irradiate the substrate held on the substrate holding part with illumination light, and to transmit reflected light from the substrate, of the illumination light radiated on the substrate. The liquid supply part is configured to supply a liquid into a space between the substrate held on the substrate holding part and the projection part. The imaging part is configured to receive the reflected light transmitted through the projection part, and to generate an image signal based on the reflected light. The position measuring part is configured to obtain positional information on a position of the substrate holding part.

Abstract: A die bonding apparatus includes a first illumination device for irradiating a die with light along an optical axis of a photographing device, and a second illumination device that is located above the first illumination device and irradiates the die with light having a predefined angle with respect to the optical axis. The second illumination device includes a second light emitting section, and a light path control member that limits a light path of second irradiation light emitted from the second light emitting section. The second illumination device is disposed in such a way that the second irradiation light, the light path of which is limited by the light path control member, passes through the cylinder of the first illumination device, and the top surface of the die is irradiated with the second irradiation light.

Abstract: An apparatus for measuring a height of a substrate for processing in a lithographic apparatus is disclosed. The apparatus comprises a first sensor for sensing a height of the substrate over a first area. The apparatus also comprises a second sensor for sensing a height of the substrate over a second area. The apparatus further comprises a processor adapted to normalize first data corresponding to a signal from the first sensor with a second sensor footprint to produce a first normalized height data, and to normalize second data corresponding to a signal from the second sensor with a first sensor footprint to produce a second normalized height data. The processor is adapted to determine a correction to a measured height of the substrate based on a difference between the first and second normalized height data.

Abstract: An alignment system includes a light source for emitting a light. An alignment mark is disposed on a substrate for receiving the light. The alignment mark includes a first pattern and a second pattern disposed on the substrate. The first pattern includes a first region and a second region. The second pattern includes a third region and a fourth region. The first region and the third region are symmetrical with respective to a symmetrical axis. The second region and the fourth region are symmetrical with respective to the symmetrical axis. The first region includes first mark lines parallel to each other. The second region includes second mark lines parallel to each other. A first pitch is disposed between the first mark lines adjacent to each other. A second pitch is disposed between the second mark lines adjacent to each other. The first pitch is different from the second pitch.

Abstract: An exposure method of performing an exposure operation of exposing a substrate via a projection optical system is provided. The method includes executing, in an exposure period in which the exposure operation is performed, aberration correction of the projection optical system to correct an aberration generated by performing the exposure operation, measuring, in a non-exposure period succeeding the exposure period, in which the exposure operation is not performed, an aberration of the projection optical system, and correcting the aberration of the projection optical system using a correction amount adjusted based on a result of the measurement so as to reduce a correction residual in the aberration correction of the projection optical system.

Abstract: A method of pattern alignment is provided. The method includes identifying a reference pattern positioned below a working surface of a wafer. The wafer is exposed to a first pattern of actinic radiation. The first pattern is a first component of a composite pattern. The first pattern of actinic radiation is aligned using the reference pattern. The wafer is exposed to a second pattern of actinic radiation. The second pattern is a second component of the composite pattern and exposed adjacent to the first pattern. The second pattern of actinic radiation is aligned with the first pattern of actinic radiation using the reference pattern.

Abstract: A three-dimensional target capable of serving as a positioning reference, including, on a useful face, a first structure and a second structure. The first structure defines a planar reference face divided up between at least a first portion whose surface is reflective according to a diffuse reflection, and a second portion whose surface is reflective according to a specular reflection, the second portion being divided up according to a series of localized zones positioned in the first portion. The second structure has an inclined face relative to the planar reference face. Applicable to three-dimensional optical measurement of the relative position between a first object and a second object.

Abstract: An apparatus may include a clamp to clamp a substrate wherein the clamp is arranged opposing a back side of the substrate; and an illumination system, disposed to direct radiation to the substrate, when the substrate is disposed on the clamp, wherein the radiation comprises a radiation energy, equal to or above a threshold energy to generate mobile charge in the substrate, where the illumination system is disposed to direct radiation to the back side of the substrate.

Abstract: A transfer printing method and a transfer printing apparatus. The transfer method includes: transferring a plurality of devices formed on an original substrate to a transfer substrate; obtaining first position information of positions of the plurality of devices on the transfer substrate; obtaining second position information of corresponding positions, on a target substrate, of devices to be transferred; comparing the first position information with the second position information to obtain first target position information recording a first transfer position; and aligning the transfer substrate with the target substrate and performing a site-designated laser irradiation on at least part of devices on the transfer substrate corresponding to the first transfer position, simultaneously, according to the first target position information, so as to transfer the at least part of the devices from the transfer substrate to the target substrate.

Abstract: The control unit controls the relative position in an optical axis direction of the projection system and the relative position in a direction perpendicular to an optical axis direction at a third timing after a second timing based on a first distribution of illumination light detected by the detection system at a first timing and a second distribution of illumination light detected by the detection system at the second timing after the first timing, the illumination light detected at the first and second timings having passed through the first and second marks.

Abstract: An optical height detection system in a charged particle beam inspection system. The optical height detection system includes a projection unit including a modulated illumination source, a projection grating mask including a projection grating pattern, and a projection optical unit for projecting the projection grating pattern to a sample; and a detection unit including a first detection grating mask including a first detection grating pattern, a second detection grating mask including a second detection grating pattern, and a detection optical system for forming a first grating image from the projection grating pattern onto the first detection grating mask and forming a second grating image from the projection grating pattern onto the second detection grating masks. The first and second detection grating patterns at least partially overlap the first and second grating images, respectively.

Abstract: Apparatus inspects the presence/absence of foreign substance on object having inspection region and non-inspection region arranged outside the inspection region. The apparatus includes sensor for illuminating the object and output, as image, result acquired by detecting light from region including the inspection region, and processor for detecting foreign substance based on inspection region image acquired by excluding non-inspection region image, which is image of the non-inspection region, from the image output from the sensor. The non-inspection region image includes first part generated by light from predetermined part of the non-inspection region of the inspected object and second part whose pixel value is continuous from pixel value of the first part and the processor specifies the second part based on fact that the pixel value of the second part is continuous from that of the first part.

Abstract: There is provided an optical system, including a light source, a control unit, and at least one juxtaposed double grating element, including a first grating and a second grating having grating functions, the gratings being spaced apart at a constant distance from each other, each of the two gratings having a center and at least one edge and comprising at least one sequence of a plurality of lines, wherein the spacing between the lines gradually changes from the center of the grating to the edges, the sequence of the plurality of lines of at least one of the gratings has a radial symmetry, and wherein the first grating diffracts a light wave from the light source towards the second grating and is further diffracted by the second grating as an output light wave in a given direction.

Abstract: A particle collection cartridge includes a first side having a particle intake region, a second side having a particle inspection region, supply and uptake reels, a tape guide, tape, a first pin, and a second pin. The tape is wound about the supply reel, extends to the first pin, across the tape guide, to the second pin, and terminates at the uptake reel. The tape includes an adhesive surface to collect particles entering the particle intake region. The first and second pins are fixed to not rotate.

Abstract: A target for use in the measurement of misregistration between layers formed on a wafer in the manufacture of semiconductor devices, the target including a first pair of periodic structures (FPPS) and a second pair of periodic structures (SPPS), each of the FPPS and the SPPS including a first edge, a second edge, a plurality of first periodic structures formed in a first area as part of a first layer and having a first pitch along a first pitch axis, the first pitch axis not being parallel to either of the first edge or second edge, and a plurality of second periodic structures formed in a second area as part of a second layer and having the first pitch along a second pitch axis, the second pitch axis being generally parallel to the first pitch axis.

Abstract: A pick and place machine includes a feeder system configured to feed components to a picking location, a dispensing head configured to pick fed components from the picking location, a vision system configured to detect features of components picked by the dispensing head. The vision system includes an image capture device pointed in a direction. The pick and place machine further includes an illumination device that includes a plurality of light sources each configured to produce light having a controlled thickness and at a controlled angle relative to the direction. The controlled angle is configured to be non-normal with respect to the direction at which the image capture device is pointed.

Abstract: An apparatus adapted to examine a paper web includes a rotatable first bobbin, a rotatable second bobbin, and a first testing device. The first bobbin has a paper we wound thereabout that has transverse bands spaced apart along a length thereof. The second bobbin is arranged to receive the paper web from the first bobbin with a paper web path defined between the first and second bobbins. The first testing device is disposed along the paper web path and is arranged to nondestructively measure a diffusivity of one of the transverse bands of the paper web.

Abstract: A management method of managing a processing apparatus that performs processing of a member, includes setting, in a case where adjustment of the processing apparatus is performed, an offset value to control the processing apparatus such that variance between results of processing by the processing apparatus before and after the adjustment is reduced.

Abstract: A method for simulation of lithography overlay is disclosed which comprises storing alignment parameters used to align a semiconductor wafer prior to a lithography step; storing process control parameters used during the lithography step on the semiconductor wafer, storing overlay parameters measured after the lithography step, calculating alternative alignment parameters and alternative process control parameters. The alternative alignment parameters and the alternative process control parameters are added to cleansed overlay parameters to obtain simulated lithography overlay data.

Abstract: Methods and apparatus for determining an intensity profile of a radiation beam. The method comprises providing a diffraction structure, causing a relative movement of the diffraction structure relative to the radiation beam from a first position, wherein the radiation beam does not irradiate the diffraction structure to a second position, wherein the radiation beam irradiates the diffraction structure, measuring, with a radiation detector, diffracted radiation signals produced from a diffraction of the radiation beam by the diffraction structure as the diffraction structure transitions from the first position to the second position or vice versa, and determining an intensity profile of the radiation beam based on the measured diffracted radiation signals.

Abstract: A method for aligning a wafer image with a reference image, comprising: searching for a targeted reference position on the wafer image for aligning the wafer image with the reference image; and in response to a determination that the targeted reference position does not exist: defining a current lock position and an area that encloses the current lock position on the wafer image; computing an alignment score of the current lock position; comparing the alignment score of the current lock position with stored alignment scores of positions previously selected in relation to aligning the wafer image with the reference image; and aligning the wafer image with the reference image based on the comparison.

Abstract: Provided is a lithography apparatus capable of detecting the abnormal holding of an original in a shorter period of time. The lithography apparatus is configured to form a pattern on a substrate through use of the original, and includes: a holding unit configured to hold the original on which a first mark is formed; a measuring unit configured to pick up an image of the first mark; and a control unit configured to: cause the measuring unit to obtain the image of the first mark on the original held by the holding unit with a focus position of the measuring unit being adjusted to a reference position; and determine that the original is being abnormally held by the holding unit when a change in a first contrast, which is a contrast of the image of the first mark with respect to a reference contrast, falls out of an allowable range.

Abstract: Embodiments may include inductors with embedded magnetic cores and methods of making such inductors. In an embodiment, an integrated circuit package may include an integrated circuit die with a multi-phase voltage regulator electrically coupled to the integrated circuit die. In such embodiments, the multi-phase voltage regulator may include a substrate core and a plurality of inductors. The inductors may include a conductive through-hole disposed through the substrate core and a plugging layer comprising a dielectric material surrounding the conductive through-hole. In an embodiment, a magnetic sheath is formed around the plugging layer. In an embodiment, the magnetic sheath is separated from the plated through hole by the plugging layer. Additionally, a first layer comprising a dielectric material may be disposed over a first surface of the magnetic sheath, and a second layer comprising a dielectric material may be disposed over a second surface of the magnetic sheath.

Abstract: In some embodiments, a reticle structure is provided. The reticle structure includes a reticle stage and a reticle mounted on the reticle stage. The reticle stage includes plural first burls and plural second burls, in which the second burls are disposed on a center of the reticle stage and the first burls disposed on an edge of the reticle stage such that the first burls surround the second burls. The reticle includes a base material and a pattern layer overlying the base material. The base material is secured on the first and second burls of the reticle stage. The pattern layer includes plural first gratings, and each of the first burls is vertically aligned with one of the first gratings.

Abstract: According to one embodiment, there is provided a semiconductor device manufacturing system, including a storage unit, a specifying unit, a determination unit and an adjustment unit. The storage unit stores device information indicating a relationship between image formation performance of an exposure device used for manufacturing a semiconductor device and mechanical operation accuracy. The specifying unit specifies a constraint of the mechanical operation accuracy according to the device information and the required image formation performance. The determination unit determines whether or not a correction parameter of an exposure condition satisfies the constraint. The adjustment unit adjusts the correction parameter according to a determination result of the determination unit.

Abstract: A thickness measuring apparatus for measuring the thickness of a workpiece held on a chuck table includes the followings: a light source configured to emit white light; an optical branching unit configured to branch, to a second optical path, reflected light applied from the light source to the workpiece held on the chuck table via a first optical path and reflected from the workpiece; a diffraction grating disposed in the second optical path; an image sensor configured to detect an optical intensity signal of light separated into each wavelength by the diffraction grating; and a thickness output unit configured to generate a spectral interference waveform on the basis of the optical intensity signal detected by the image sensor, determine the thickness on the basis of the spectral interference waveform, and output the thickness.

Abstract: A detection apparatus includes an image pickup unit and a processor which detects a position of a mark using a two-dimensional image of the mark. The processor generates a one-dimensional signal having a plurality of peaks by accumulating images included in a detection region, detects peaks in which differences between values of the peaks and a reference value are equal to or larger than a threshold value and peaks in which differences between values of the peaks and the reference value are smaller than the threshold value from among the plurality of generated peaks and obtains a failure region in the mark, resets the detection region such that the differences between the values of the detected peaks and the reference value become smaller than the threshold value, generates a one-dimensional signal by accumulating images included in the reset detection region, and detects a position of the mark.

Abstract: A camera system includes an image sensor, a wavelength filter, and an imaging optical system. The image sensor has an image capturing plane. The imaging optical system is configured to have light coming from a subject passed through the wavelength filter and imaged on the image capturing plane. The wavelength filter has a perpendicularly incident region and an obliquely incident region. On the perpendicularly incident region, a principal ray, which has passed through the imaging optical system, is incident perpendicularly. On the obliquely incident region, a principal ray, which has passed through the imaging optical system, is incident obliquely. The image sensor has sensitivity to a light ray having a predetermined wavelength. The light ray having the predetermined wavelength is transmitted at a higher transmittance through at least a part of the obliquely incident region than through the perpendicularly incident region.