Signal Isolator Patents (Class 250/551)
  • Patent number: 11362297
    Abstract: Provided is a display device. The display device includes a light emitting element layer including a plurality of light emitting elements, and a light control layer on the light emitting element layer and overlapping the light emitting element layer on a plane. At least one of the light emitting elements and the light control layer includes an amorphous carbon light emitter.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: June 14, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Yongchan Ju, Yisu Kim, Jongwoo Kim, Eung Seok Park, Wonmin Yun, Jaeheung Ha
  • Patent number: 11336469
    Abstract: A cable isolation system that includes a cable that includes a first end, a second end, and a cable transmission medium that extends between the first end and the second end. The cable isolation system also includes a first connector that is located on the first end of the cable, that is coupled to the at least one cable transmission medium, and a second connector that is located on the second end of the cable, that is coupled to the at least one cable transmission medium. A cable isolation device is provided in at least one of the cable, the first connector, or the second connector and transitions between a non-isolated state that allows data to be transmitted via the cable transmission medium, and an isolated state that prevents data from being transmitted via the cable transmission medium.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: May 17, 2022
    Assignee: Dell Products L.P.
    Inventor: Andrew Breedy
  • Patent number: 11322542
    Abstract: A light-emitting diode (LED) assembly comprises a plurality of LED cells and a driving circuit. Each of the LED cells includes an LED and a transistor. The LED includes first and second LED layers and an LED electrode. The first LED layer includes a III-V compound semiconductor. The second LED layer is over the first LED layer. The LED electrode is over the second LED layer. The first LED layer is free of an LED electrode. The transistor includes a drain region connected to the first LED layer. The driving circuit is configured to drive the LED cells.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: May 3, 2022
    Assignee: HARVATEK CORPORATION
    Inventors: Shyi-Ming Pan, Mam-Tsung Wang, Ping-Lung Wang
  • Patent number: 11264358
    Abstract: The technology relates to an integrated circuit (IC) package. The IC package may include a substrate. An IC die may be mounted to the substrate. One or more photonic modules may be attached to the substrate and one or more serializer/deserializer (SerDes) interfaces may connect the IC die to the one or more photonic modules. The IC die may be an application specific integrated circuit (ASIC) die and the one or more photonic modules may include a photonic integrated circuit (PIC) and fiber array. The one or more photonic modules may be mounted to one or more additional substrates which may be attached to the substrate via one or more sockets.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: March 1, 2022
    Assignee: Google LLC
    Inventors: Woon-Seong Kwon, Namhoon Kim, Teckgyu Kang, Ryohei Urata
  • Patent number: 11251327
    Abstract: Disclosed is a photocoupler comprising: at least two lead frames; an optical channel structure including a light-emitting chip, a light-sensing chip, and a light-transmissive encapsulant body, wherein the light-emitting chip and the light-sensing chip are mounted and bonded on the lead frame and are coplanar, a light-emitting surface of the light-emitting chip and a light-sensing surface of the light-sensing chip face toward the same direction, the light-transmissive encapsulant body encloses the light-emitting chip and the light-sensing chip; and a light-reflecting package encloses the light-transmitting package, and all enclosing contact surface where the light-reflecting outer package contacts the light-transmissive encapsulant body is an optical reflective surface, wherein the light-reflecting encapsulant body and the light-transmissive encapsulant body are formed by double molding and epoxy molding, so that the light-transmissive encapsulant body and the light-reflecting encapsulant body are easy to be s
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: February 15, 2022
    Assignee: CT Micro International Corporation
    Inventors: Poh-Loong Chew, Min-Chung Chiu
  • Patent number: 11233168
    Abstract: An embodiment of the present invention provides a window cover for a sensor package and a sensor package including the same, the window cover comprising: a body; an element receiving unit disposed in the body so as to receive a light emitting element and a light receiving element of the sensor package; and a radiating unit disposed at a position corresponding to the light emitting element in the element receiving unit so as to change light generated from the light emitting element to a predetermined beam range and radiate the same.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: January 25, 2022
    Assignee: AMOSENSE CO., LTD.
    Inventors: Yeun Ho Bang, In Tae Yeo, Seung Gon Park
  • Patent number: 11164987
    Abstract: In accordance with various embodiments of the disclosed subject matter, a phototransistor comprises an NPN or PNP phototransistor having a base including a Si-region, a Ge-region, and a Ge—Si interface region wherein photons are absorbed in the Ge region and conduction-band electrons are attracted to the interface region such that the electrons' mobility is enhanced thereby.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: November 2, 2021
    Assignee: United States of America as represented by the Secretary of the Air Force
    Inventors: Frank K. Hopkins, Shamus P. McNamara, John G. Jones
  • Patent number: 11158757
    Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: October 26, 2021
    Assignee: EPISTAR CORPORATION
    Inventors: Yi-Chieh Lin, Shiuan-Leh Lin, Yung-Fu Chang, Shih-Chang Lee, Chia-Liang Hsu, Yi Hsiao, Wen-Luh Liao, Hong-Chi Shih, Mei-Chun Liu
  • Patent number: 11156342
    Abstract: The illumination device comprises a plurality of illumination units (21), each illumination unit (21) comprising a light source (21.1) for emitting a radiation beam (21.1A) and at least one laser beam source (21.2) for emitting at least one laser beam (21.2A), and a plurality of actuator means (22), wherein each actuator means (22) is connected to an illumination unit (21) and is adapted to change an orientation of the illumination unit (21) based on a detected beam direction of the laser beam (21.2A).
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: October 26, 2021
    Assignee: ATLAS MATERIAL TESTING TECHNOLOGY GMBH
    Inventors: Peter March, Bernd Rudolph
  • Patent number: 11143627
    Abstract: A stacked optical filter arrangement includes a pneumatic liquid crystal layer stacked between a first and second transparent electrode layers, wherein the first transparent electrode layer includes electrode segments that are isolated from each other; first and second polarizer layers, wherein the pneumatic liquid crystal layer is stacked between the first polarizer layer and the second polarizer layer; a filter layer including filter segments, wherein at least two of the filter segments are wavelength sensitive filter segments, wherein at least two of the wavelength sensitive filter segments are transparent for different wavelengths; and optical channels, wherein each optical channel includes a portion of the pneumatic liquid crystal layer, a portion of the first electrode layer, one of the plurality of electrode segments of the second transparent electrode layer, a portion of the first polarizer layer, a portion of the second polarizer layer, and one of the plurality of filter segments.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: October 12, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventor: Saumitra Sanjeev Chafekar
  • Patent number: 11127672
    Abstract: A busbar assembly according to the present invention includes a first busbar formed by a conductive metal flat plate; a second busbar formed by a conductive metal flat plate, the second busbar disposed in the same plane as the first busbar with a gap being provided between opposing side surfaces of the first and second busbars; and an insulating resin layer filled in the gap so as to mechanically connect the opposing side surfaces of the first and second busbars. Preferably, the opposing side surface of at least one of the first and second busbars is an inclined surface that is closer to the opposing side surface of the other of the first and second busbars from one side toward the other side in the thickness direction.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: September 21, 2021
    Assignee: Suncall Corporation
    Inventor: Masaya Nakagawa
  • Patent number: 11056463
    Abstract: The present technology relates to a semiconductor apparatus, a production method, and an electronic apparatus that enable semiconductor apparatuses to be laminated and the laminated semiconductor apparatuses to be identified. A semiconductor apparatus that is laminated and integrated with a plurality of semiconductor apparatuses, includes a first penetrating electrode for connecting with the other semiconductor apparatuses and a second penetrating electrode that connects the first penetrating electrode and an internal device, the second penetrating electrode being arranged at a position that differs for each of the laminated semiconductor apparatuses. The second penetrating electrode indicates a lamination position at a time of lamination. An address of each of the laminated semiconductor apparatuses in a lamination direction is identified by writing using external signals after lamination. The present technology is applicable to a memory chip and an FPGA chip.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: July 6, 2021
    Assignee: SONY CORPORATION
    Inventors: Hiroshi Takahashi, Tomofumi Arakawa, Minoru Ishida
  • Patent number: 11050277
    Abstract: A power bank containing a rechargeable battery for wirelessly charging a portable device by induction power transmission, the power bank having a housing having a power transmission surface for placement adjacent a power receiving surface of a chargeable portable device and a reusable adhesive pad over at least part of the power transmission surface, made of an adhesive that is capable of removably sticking to the power receiving surface of a portable device for temporarily holding the surfaces adjacent each other with a protective cover for covering the adhesive pad when not in use and a recess in the housing opposite the power transmission surface for temporarily holding the cover.
    Type: Grant
    Filed: February 11, 2019
    Date of Patent: June 29, 2021
    Assignee: MIWORLD ACCESSORIES LLC
    Inventor: Andrew Kanakis
  • Patent number: 10969284
    Abstract: There is provided an optical sensor that includes a base portion, an action portion, a reflecting member disposed at one of the base portion and the action portion, and a detection unit including a light source and a light receiving element disposed at the other one of the base portion and the action portion. In the optical sensor, a space between the detection unit and the reflecting member is filled with a light transmissive material, and a force and/or acceleration is detected due to the light receiving element detecting light emitted from the light source and reflected by the reflecting member.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: April 6, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventor: Chihiro Nagura
  • Patent number: 10965282
    Abstract: A power switching cell, and associated multi-level converter, include an input port capable of receiving a switching control signal, an input transistor linked by the gate to the input port, and by the source to a reference voltage, a self-biasing circuit comprising a self-biasing transistor linked by the gate to the drain of the input transistor, and a resistor connected in parallel between the gate and the source of the self-biasing transistor, and in series between the drain of the input transistor and the source of the self-biasing transistor, a power transistor, linked by the gate to the source of the self-biasing transistor and by the drain to a power supply voltage, and an isolating transistor linked by the gate and by the source to the gate and to the source of the power transistor, and by the drain to the output port of the cell.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: March 30, 2021
    Assignees: THALES, COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, UNIVERSITE DE LIMOGES
    Inventors: Olivier Jardel, Raymond Quere, Stéphane Piotrowicz, Philippe Bouysse, Sylvain Delage, Audrey Martin
  • Patent number: 10942551
    Abstract: This disclosure relates to a notebook computer including a computer body and a power transmission device which having an input port and an output port opposite to each other. The input port is configured to be electrically connected to a power supply. The output port is electrically connected to the computer body. The power transmission device includes an actuating circuit and a hold circuit. The actuating circuit is electrically connected between the input port and the output port. The hold circuit is connected in parallel to the actuating circuit.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: March 9, 2021
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Kuan-Wei Lee, Jui Hsiang Chen, I-Ko Song, Chun-Chi Lin
  • Patent number: 10935413
    Abstract: A fuel sensing system utilizes non-contact plastic optical fiber (POF) to optically sense the level of liquid fuel in a fuel tank. In one implementation, the fuel level sensing system includes the following elements: (i) a high-speed and high-power red laser diode; (ii) an ultra-high-sensitivity photon-counting avalanche photodiode; and (iii) a large-diameter and large-numerical-aperture graded-index POF. The fuel level is sensed when the avalanche photodiode first detects impinging light reflected by the POF end face and then detects impinging light reflected by the fuel surface in response to emission of a laser pulse by the red laser diode. A time delay detection circuit calculates the time interval separating the respective times of arrival. A fuel level calculator calculates the fuel level based on the time interval provided by the time delay detection circuit.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: March 2, 2021
    Assignee: The Boeing Company
    Inventors: Eric Y. Chan, Dennis G. Koshinz
  • Patent number: 10921348
    Abstract: A modular RF measuring device has a motherboard arranged centrally within the device so as to define a front side and a rear side, the front side and the rear side each comprising module interfaces.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: February 16, 2021
    Assignee: Rohde & Schwarz GmbH & Co. KG
    Inventors: Gottfried Holzmann, Heinrich Bichl, Sven Gollon
  • Patent number: 10886443
    Abstract: A light emitting device package includes a light emitting device that generates light, a body frame including a cavity in which the light emitting device is mounted, a molding material that fills the cavity, and absorbing pigments that convert the light generated by the light emitting device. The absorbing pigments have a peak value within a wavelength range of 490 to 520 nm and a full width at half maximum (FWHM) of 40 to 70 nm.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: January 5, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang Kyun Im, Tetsuya Shigeta, Ho Seop Lee, Seong-Phil Cho
  • Patent number: 10862477
    Abstract: A rapid testing read out integrated circuit (ROIC) includes phase-change material (PCM) radio frequency (RF) switches residing on an application specific integrated circuit (ASIC). Each PCM RF switch includes a PCM and a heating element transverse to the PCM. The ASIC is configured to provide amorphizing and crystallizing electrical pulses to a selected PCM RF switch. The ASIC is also configured to determine if the selected PCM RF switch is in an OFF state or in an ON state. In one implementation, a testing method using the ASIC is disclosed.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: December 8, 2020
    Assignee: Newport Fab, LLC
    Inventors: David J. Howard, Gregory P. Slovin, Nabil El-Hinnawy
  • Patent number: 10854646
    Abstract: A PIN photodetector includes an n-type semiconductor layer, an n-type semiconductor cap layer, a first plurality of p-type regions located within the n-type semiconductor cap layer and separated from one another by a distance d1, and an absorber layer located between the n-type semiconductor layer and the n-type semiconductor cap layer including the first plurality of p-type regions. The plurality of p-type regions are electrically connected to one another to provide an electrical response to light incident to the PIN photodetector.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: December 1, 2020
    Assignee: ATTOLLO ENGINEERING, LLC
    Inventors: Jonathan Geske, Andrew Hood, Michael MacDougal
  • Patent number: 10798104
    Abstract: A vehicle includes a lower security network (LSN) and higher security network (HSN) having therebetween a read only filter and path in parallel to respectively exclusively pass data from the LSN to the HSN, and from the HSN to the LSN. The vehicle includes a gateway controller configured to alter a duty cycle associated with the filter according to utilization of the HSN to alter a data rate through the filter but not through the path.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: October 6, 2020
    Assignee: Ford Global Technologies, LLC
    Inventors: Omar Makke, Jalal Mohammed Makke
  • Patent number: 10790883
    Abstract: A communications system 10 comprises a source arrangement 12 of periodic waves. The source arrangement is configured to generate an interferometric wave pattern having a plurality of lobes 18.1 to 18.13. Each lobe has a main axis 20 diverging from an origin 22 at the source arrangement and a null 24 between any two adjacent lobes. At least one sensor arrangement 26 is provided for the waves. The sensor arrangement comprises a first sensor 28 and a second sensor 30 which are spaced from one another. A first signal source 40 is connected to the source arrangement 12 via a phase shift arrangement 41 to generate a first interferometric wave pattern 18 which illuminates the first sensor 28 more than the second sensor 30. A second signal source 42 is connected to the source arrangement via the phase shift arrangement to generate a second interferometric pattern 46 which is off-set from the first interferometric pattern and which illuminates the second sensor more than the first sensor.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: September 29, 2020
    Assignee: POYNTING ANTENNAS (PTY) LIMITED
    Inventor: Andries Petrus Cronje Fourie
  • Patent number: 10734534
    Abstract: A method of producing an optical sensor at wafer-level, comprising the steps of providing a wafer having a main top surface and a main back surface and arrange at or near the top surface of the wafer at least one first integrated circuit having at least one light sensitive component. Furthermore, providing in the wafer at least one through-substrate via for electrically contacting the top surface and back surface and forming a first mold structure by wafer-level molding a first mold material over the top surface of the wafer, such that the first mold structure at least partly encloses the first integrated circuit. Finally, forming a second mold structure by wafer-level molding a second mold material over the first mold structure, such that the second mold structure at least partly encloses the first mold structure.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: August 4, 2020
    Assignee: ams AG
    Inventors: Harald Etschmaier, Gregor Toschkoff, Thomas Bodner, Franz Schrank
  • Patent number: 10690538
    Abstract: An optical sensor module includes a support unit, a light-receiving unit and a light-emitting unit. The support unit includes a main plate, and a side plate inclined relative to the main plate. The light-receiving unit includes a photodetector disposed on the main plate and having a light-receiving surface located away from the main plate, and a light-blocking member covering part of the photodetector. The light-emitting unit emits light toward an imaginary line perpendicular to the light-receiving surface, and is disposed on the side plate. A wearable device including the optical sensor is also disclosed.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: June 23, 2020
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORP.
    Inventor: Chen-Hsiu Lin
  • Patent number: 10686534
    Abstract: A method for optical interconnection between semiconductor chips according to an embodiment include converting an electrical signal to an optical signal, transmitting the optical signal to a second substrate disposed above or below a first substrate using an optical transmitter provided on the first substrate, receiving the optical signal using an optical detector provided on the second substrate, and converting the received optical signal to an electrical signal. Accordingly, using a mid-infrared wavelength range of light that is transparent to semiconductor materials such as silicon and next-generation high-mobility materials, it is possible to enable interconnection between stacked semiconductor chips without using metal wiring.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: June 16, 2020
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jaehoon Han, Sanghyeon Kim, Hyunsu Ju, Jin-Dong Song
  • Patent number: 10680611
    Abstract: A key of an optical mechanical keyboard, having a base plate, a circuit board, an optical switch, a rotating member, a key cap, a pressing cylinder, a primary spring, and a secondary spring. A ring-shaped fastening member is provided on the base plate, and a side wall of the ring-shaped fastening member is provided with two opposing first light-admitting slots, and a keystroke impact slot is respectively provided at two sides of and between the opposing first light-admitting slots. The key has a simple structure and is lightweight and slim, and enables generation of a clear sound upon striking a key.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: June 9, 2020
    Inventor: Jianping Li
  • Patent number: 10605730
    Abstract: Compact optical sources and methods for producing short and ultrashort optical pulses are described. A semiconductor laser or LED may be driven with a bipolar waveform to generate optical pulses with FWHM durations as short as approximately 85 ps having suppressed tail emission. The pulsed optical sources may be used for fluorescent lifetime analysis of biological samples and time-of-flight imaging, among other applications.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: March 31, 2020
    Assignee: Quantum-Si Incorporated
    Inventors: Jonathan M. Rothberg, Jason W. Sickler, Lawrence C. West, Faisal R. Ahmad, Brendan Huang, Paul E. Glenn, Jonathan C. Schultz, Jose Camara
  • Patent number: 10545198
    Abstract: A magnetic sensor including: a substrate with a main surface; at least two magnetoresistive effect elements formed on the main surface and connected to a power terminal of a bridge circuit; at least two magnetoresistive effect elements formed on the main surface and connected to a ground terminal of the bridge circuit; a first region in which one of the at least two magnetoresistive effect elements connected to the power terminal and one of the at least two magnetoresistive effect elements connected to the ground terminal are disposed; a second region in which another of the at least two magnetoresistive effect elements connected to the power terminal and another of the at least two magnetoresistive effect elements connected to the ground terminal are disposed; and a bias coil including a first bias application part for applying a bias magnetic field to the first region and a second bias application part for applying a bias magnetic field to the second region.
    Type: Grant
    Filed: November 18, 2015
    Date of Patent: January 28, 2020
    Assignee: HITACHI METALS, LTD.
    Inventors: Yasunori Takaki, Yasunori Abe, Makoto Kawakami
  • Patent number: 10530403
    Abstract: In accordance with one or more embodiments, a transmission device includes a receiver configured to receive an interfering signal via an antenna. A transmitter is configured to generate first electromagnetic signals conveying first data. A coupler is configured to generate first guided electromagnetic waves in response to combined electromagnetic signals, wherein the first guided electromagnetic waves propagate, without requiring an electrical return path, along a surface of a transmission medium of a distributed antenna system. A cancellation circuit is configured to generate the combined electromagnetic signals, based on the interfering signal and the first electromagnetic signals, wherein the combined electromagnetic signals mitigate interference by the interfering signal with the first guided electromagnetic waves.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: January 7, 2020
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Thomas M. Willis, III, Giovanni Vannucci, Paul Shala Henry
  • Patent number: 10484087
    Abstract: An optical transmission device includes a first light emitting element, a second light emitting element, and a detection unit. The first light emitting element is configured to emit light. The second light emitting element is configured to emit light. The second light emitting element is connected in parallel with the first light emitting element and is configured to deteriorate earlier than the first light emitting element. The detection unit is configured to detect whether the second light emitting element is deteriorated.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: November 19, 2019
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Akemi Murakami, Junichiro Hayakawa, Hideo Nakayama, Tsutomu Otsuka
  • Patent number: 10419131
    Abstract: This cyber-retro-reflector technology is a series of Architectures, representing staged deployments, including backward compatibility, of products with enhanced features, for integrating technologies and capabilities, of electronic and photonic systems to: (a) reduce power consumption for circuits and systems that are placed into ‘off’ and/or disabled states, including external interface portals of electronic and photonic systems, (b) increase and enhance intra-/inter-connectivity, interoperability, and functionality of a system and the aggregate of systems, (c) increase and enhance integrated capabilities leading to higher computational performance for the system and the aggregate of systems, (d) take full advantage of photonic capabilities, and (e) improve hacking detection.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: September 17, 2019
    Inventors: Paul Westmeyer, Renee Mazaheri
  • Patent number: 10418507
    Abstract: To achieve an opto-reflector in which a distance to a detection target is shortened to be able to detect the position of the closer detection target, and thereby contributing to the reduction of the arrangement space. The opto-reflector (10) includes a plate-shaped substrate (11); a light emitting element (13) and a light receiving element (14) mounted on the substrate (11); light transmitting resin layer (12) which seals the light emitting element (13) and the light receiving element (14); and a light shielding portion (21) provided between the light emitting element (13) and the light receiving element (14). The light shielding portion (21) is formed at a height such that a part of light beam can be directly transferred between the light emitting element (13) and the light receiving element (14) via the light transmitting resin layer (12).
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: September 17, 2019
    Assignee: NEW JAPAN RADIO CO., LTD.
    Inventors: Fumiaki Ohno, Seiji Koike
  • Patent number: 10347614
    Abstract: Solid state transducers with state detection, and associated systems and methods are disclosed. A solid state transducer system in accordance with a particular embodiment includes a support substrate and a solid state emitter carried by the support substrate. The solid state emitter can include a first semiconductor component, a second semiconductor component, and an active region between the first and second semiconductor components. The system can further include a state device carried by the support substrate and positioned to detect a state of the solid state emitter and/or an electrical path of which the solid state emitter forms a part. The state device can be formed from at least one state-sensing component having a composition different than that of the first semiconductor component, the second semiconductor component, and the active region. The state device and the solid state emitter can be stacked along a common axis.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: July 9, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Martin F. Schubert, Vladimir Odnoblyudov
  • Patent number: 10340410
    Abstract: The present invention relates to an optocoupler including a light source having a body and electrical leads, a light detector having a diode stack a metal end cap and electrical leads, and an optical cavity including optically transparent material at least partially covering the body of the light source and the diode stack of the light detector. Also included is a reflective layer including optically reflective material surrounding the optical cavity. The electrical leads of the light source, the metal end cap and the electrical leads of the light detector protrude from the optical cavity and the reflective layer.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: July 2, 2019
    Assignee: HARRIS CORPORATION
    Inventors: Stuart D. Wood, Steven M. DeSmitt, Eugene G. Olczak
  • Patent number: 10338326
    Abstract: Provided are a multi-channel optical subassembly structure allowing an optical unit including a light source photodetector chip to be fixed through an alignment jig after active alignment is performed on an individual or single light source photodetector chip by using the alignment jig capable of electrical coupling and one electrode pad and the other electrode pad of a thermoelectric element, which are wire-bonded, capable of performing active alignment for each light source photodetector chip, that is, for each channel, capable of replacing the optical unit and the alignment jig when a problem occurs in some or all channels, capable of improving optical coupling efficiency for each channel, and capable of addressing a time-consuming and economically expensive work in which an optical subassembly is discarded when some channels fail, and a method of packaging the structure.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: July 2, 2019
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jeong Eun Kim, Hyun Seo Kang, Keo Sik Kim, Sung Chang Kim, Young Sun Kim, Ji Hyoung Ryu, Hyoung Jun Park, Dong Hoon Son, Chan Il Yeo, Young Soon Heo
  • Patent number: 10333010
    Abstract: A photonic device having wide bandgap (WBG) materials which change electrical behaviors in response to low-intensity light is disclosed. The device comprises an optical waveguide located in an optical path of light to receive the light and to spatially confine the received light as guided light at a higher optical intensity than the received light; a wide bandgap (WBG) material located in an optical path of the guided light output by the optical waveguide; and two electrodes formed at two different locations on the WBG material to provide two electrical contacts of an electrical path within the WBG material, wherein the WBG material exhibits an electrical conductivity that varies with a level of the guided light output by the optical waveguide to turn on or off the electrical path between the two electrodes.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: June 25, 2019
    Assignee: Lawrence Livermore National Security, LLC
    Inventor: Stephen Sampayan
  • Patent number: 10313025
    Abstract: An information-processing system having spherical and parabolic reflectors, optical signal processors, and detectors comprising optically active surfaces. The spherical reflector has an internal light-reflecting surface and a spherical processor with internal and external optically active surfaces, with its center coincident with that of the spherical reflector. The optical signal processor's internal and external surfaces include transmitters and detectors for transmitting and receiving a optically encoded signals along various distinct paths. A portion of the internal path coincides with a line that passes through the center of the sphere. Optical signals emitted from the external surface of the processing sphere and reflected by the internal surface of the external spherical reflector to neighboring regions of the processing sphere, enabling external relay of information around the sphere without congesting the internal cavity of the sphere.
    Type: Grant
    Filed: January 10, 2015
    Date of Patent: June 4, 2019
    Inventor: Gordon W. Rogers
  • Patent number: 10312952
    Abstract: In accordance with one or more embodiments, a transmission device includes a receiver configured to receive an interfering signal via an antenna. A transmitter is configured to generate first electromagnetic signals conveying first data. A coupler is configured to generate first guided electromagnetic waves in response to combined electromagnetic signals, wherein the first guided electromagnetic waves propagate, without requiring an electrical return path, along a surface of a transmission medium of a distributed antenna system. A cancellation circuit is configured to generate the combined electromagnetic signals, based on the interfering signal and the first electromagnetic signals, wherein the combined electromagnetic signals mitigate interference by the interfering signal with the first guided electromagnetic waves.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: June 4, 2019
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Thomas M. Willis, III, Giovanni Vannucci, Paul Shala Henry
  • Patent number: 10298226
    Abstract: A signal transmission device relating to a technique disclosed in the specification of the present application includes: an isolation transformer; an input-side circuit connected to an input side of the isolation transformer; and an output-side circuit connected to an output side of the isolation transformer. The output-side circuit includes a first differential circuit having a first input and a second input connected to the first terminal and the second terminal respectively. A reference potential of the first differential circuit is connected to the second terminal.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: May 21, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Motoki Imanishi, Kenichi Morokuma
  • Patent number: 10283699
    Abstract: A coupler is disclosed that employs hall-effect sensing technology. Specifically, the coupler is configured to produce an output voltage by converting the magnetic field generated by a current conductor at an input side. The output and input sides may be electrically isolated from one another but may be coupled via the hall-effect sensing technology, such as a hall-effect sensor. The output and input sides may be provided in an overlapping configuration.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: May 7, 2019
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Yin Yin Chew, Thiam Siew Gary Tay, Dominique Ho
  • Patent number: 10244638
    Abstract: A proximity sensor is provided according to the embodiments of the present disclosure, comprising: a sensor chip; a light-emitting device; a substrate, the sensor chip and the light-emitting device being located on the substrate; a transparent molding material covering a light-emitting surface of the light-emitting device; and a non-transparent molding material separating the transparent molding material from the sensor chip.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: March 26, 2019
    Assignee: STMICROELECTRONICS PTE LTD
    Inventor: Jing-En Luan
  • Patent number: 10209139
    Abstract: A temperature change detection apparatus for monitoring temperature change in various portions of a large space includes a trip logic unit configured to execute a trip operation based on receipt of a trip signal at the trip logic unit; a plurality of temperature sensors each including a sensing portion composed of optical fiber cable and each being configured to generate light information indicating an amount of Brillouin scattering that occurs within the sensing portion; a plurality of monitoring units configured such that each monitoring unit determines a temperature value corresponding to each temperature sensor connected to the monitoring unit based on an amount of Brillouin scattering indicated by the light information generated by each of the connected temperature sensors, an each monitoring unit generates a trip signal when a determined temperature value exceeds a running average by more than a threshold amount.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: February 19, 2019
    Assignee: GE-HITACHI NUCLEAR ENERGY AMERICAS LLC
    Inventors: Eric P. Loewen, Brett J. Dooies, Seth Ryan Paul Strege, Nicholas Francis O'Neill
  • Patent number: 10200032
    Abstract: An optoelectronic safety device for monitoring a machine movement includes an emitter/receiver device, control electronics, an electric line which includes at least two wires to transmit a supply voltage and a control signal, and a device provided so that the supply voltage and the control signal can be transmitted where the at least two wires is a two-wire electric line or, alternatively, a three-wire electric line.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: February 5, 2019
    Assignee: FRABA B.V.
    Inventors: Christian Lilienthal, Omar Al Attar
  • Patent number: 10175422
    Abstract: A modular optical device having a set of optoelectronic modules that enables the device to operate, e.g., as a WDM or multichannel transceiver. In an example embodiment, the set of optoelectronic modules includes a laser module, a modulator module, and an optical-to-electrical converter module, all mounted on the same circuit board and optically and electrically connected for the intended application. Each of the optoelectronic modules comprises a respective stack of integrated circuits, at least one of which is a photonic integrated circuit (PIC). Some of the PICs may be configurable for different applications, with the configuration setup being carried out using electrical control signals and/or optical connections of the PICs.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: January 8, 2019
    Assignees: Alcatel-Lucent USA Inc., NOKIA OF AMERICA CORPORATION
    Inventors: Po Dong, Gabriel Charlet
  • Patent number: 10170658
    Abstract: An optical device includes a substrate, a light emitter, a light detector, a conductive structure, and an opaque material. The light emitter, the light detector and the conductive structure are disposed on a surface of the substrate and are electrically connected to traces on the surface of the substrate. The light emitter includes an emitting area facing the substrate. The light detector includes a receiving area facing the substrate. The light emitter emits light within a range of wavelengths, and the substrate passes the light emitted by the light emitter. The opaque material is disposed on the substrate, and absorbs or attenuates the light within the range of wavelengths.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: January 1, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Hsuan Tsai, Lu-Ming Lai
  • Patent number: 10115714
    Abstract: According to one embodiment, a semiconductor device includes a first semiconductor element having a first surface, a second semiconductor element having a lower surface bonded to the first surface of the first semiconductor element, a gel-like silicone that covers an upper surface of the second semiconductor element, and a resin portion that covers the gel-like silicone and the first surface of the first semiconductor element.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: October 30, 2018
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Naoya Takai
  • Patent number: 10075246
    Abstract: An optical isolator is provided. The optical isolator includes a printed circuit board having a first surface and a second surface opposite the first surface. The printed circuit board has a recess extending only partially through the board. The first photoelement has an active surface and is mounted relative to the first surface of the printed circuit board. A second photoelement has an active surface and is mounted relative to the second surface. The second photoelement is configured to interact with the first photoelement. At least one of the first and second photoelements has its active surface disposed at least partially in the recess. A portion of the printed circuit board is interposed between the first and second photoelements.
    Type: Grant
    Filed: September 26, 2013
    Date of Patent: September 11, 2018
    Assignee: MICRO MOTION, INC.
    Inventors: Kirk Allan Hunter, Jared James Dreier, Jordan Dennis Lucht, Samuel Ethan Messenger
  • Patent number: 10074639
    Abstract: Disclosed examples include integrated circuits with a leadframe structure, a first circuit structure including a light source configured to generate a light signal along an optical path, a second circuit structure including a light sensor facing the optical path to receive the light signal, and a molded package structure enclosing portions of the leadframe structure, the molded package structure having a cavity defined by an interior surface of the molded package structure, the optical path extending in the cavity between the first and second circuit structures.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: September 11, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Barry Jon Male, Benjamin Cook, Robert Alan Neidorff, Steve Kummerl
  • Patent number: 10069566
    Abstract: A photoelectric conversion assembly is proposed. The photoelectric conversion module comprises three parts, photoelectric conversion module, a printed circuit board (PCB) and a hybrid cable. The photoelectric conversion module comprises an interposer, at least one optical element configured on the interposer, and an optical bench for the printed circuit board and the interposer configured thereon. Electrical wires are used for coupling to the printed circuit board. An optical ferrule is used for engaging with the photoelectric conversion module and an optical fiber component. A plug is used for electrically connecting the printed circuit board. A first lens array is configured under the interposer. A mirror is configured under the first lens array. A second lens array is configured left side of the mirror.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: September 4, 2018
    Assignee: AQUAOPTICS CORP.
    Inventors: Chia-Chi Chang, Tung-An Lee, Shih-Jye Yo