Abstract: The technology relates to an integrated circuit (IC) package. The IC package may include a substrate. An IC die may be mounted to the substrate. One or more photonic modules may be attached to the substrate and one or more serializer/deserializer (SerDes) interfaces may connect the IC die to the one or more photonic modules. The IC die may be an application specific integrated circuit (ASIC) die and the one or more photonic modules may include a photonic integrated circuit (PIC) and fiber array. The one or more photonic modules may be mounted to one or more additional substrates which may be attached to the substrate via one or more sockets.

Abstract: To be able to check, from a remote location, a switching result of a power supply route, this communication system comprises: a plurality of terminal stations which each have a function of supplying power to a power supply path; a branching device which switches the power supply route, which includes a power supply path; and a monitoring device which, in response to one of the plurality of terminal stations transmitting to the branching device a switching signal specifying the power supply route, compares the voltages of the power supplied to the power supply paths respectively observed by the plurality of terminal stations, before and after transmission of the switching signal, and which, with the compared power supply voltages each having fluctuated by a first threshold or more, determines a switching result of the power supply route in the branching device.

Abstract: An optocoupler circuit includes first and second resistors, an optocoupler, a reference circuit, and a comparator. The optocoupler includes a light source and a phototransistor. The light source is connected to form a first voltage divider with the first resistor. The phototransistor is connected to form a second voltage divider with the second resistor. The optocoupler transitions an output of the second voltage divider between first and second levels. Magnitudes of the first and second levels are greater than zero. The reference circuit is configured to output a reference voltage. The comparator includes a first input and a second input. The first input receives an output of the first voltage divider. The second input receives the reference voltage. An output of the comparator transitions between a third level and a fourth level based on a comparison between the output of the first voltage divider and the reference voltage.

Abstract: A digital isolator can include: an encoding circuit configured to receive an input digital signal, and to generate an encoded signal according to the input digital signal; an isolation element having a primary winding, a first secondary winding, and a second secondary winding; a differential circuit configured to receive first and second differential signals, and to generate a difference signal according to the first and second differential signals; and a decoding circuit coupled with the differential circuit, and being configured to receive the difference signal, and to generate a target digital signal after decoding.

Abstract: Managing multiple devices, such as tracking beacons, is challenging, especially as the number of beacons increases. A beacon and a charging station are provided for managing the settings of the beacons. The beacon includes a display with a graphical user interface (GUI) for updating settings. The charging station includes charging ports and a display with a GUI for updating beacon settings.

Abstract: Described are a free space optical communications method, and a transmitter and a receiver. The method comprises: transmitting, by means of an optical signal, wireless data between a transmitter and a receiver; transmitting, between the transmitter and the receiver, a wireless detection signal different from the optical signal; detecting whether the wireless detection signal is blocked; and adjusting, according to a detection result, the transmission of the optical signal to reduce the intensity of the optical signal or suspend the transmission of the optical signal when the wireless detection signal is blocked.

Abstract: Managing multiple devices, such as tracking beacons, is challenging, especially as the number of beacons increases. A beacon and a charging station are provided for managing the settings of the beacons. The beacon includes a display with a graphical user interface (GUI) for updating settings. The charging station includes charging ports and a display with a GUI for updating beacon settings.

Abstract: Compact optical sources and methods for producing short and ultrashort optical pulses are described. A semiconductor laser or LED may be driven with a bipolar waveform to generate optical pulses with FWHM durations as short as approximately 85 ps having suppressed tail emission. The pulsed optical sources may be used for fluorescent lifetime analysis of biological samples and time-of-flight imaging, among other applications.

Abstract: A low-voltage circuit breaker includes at least one current sensor for determining the magnitude of the electric current of a conductor of the low-voltage circuit breaker; and at least one electromechanical switching unit for connecting and disconnecting at least two electrical contact points. In a first switching position of the movable contact point, two contact points are connected and in a second switching position the contact points are not connected to one another. The circuit breaker further includes at least one electronic switching unit having a semiconductor switching element, electrically conductive in a first switching state and electrically blocking in a second switching state; an electronic tripping unit, connected to the current sensor, the electronic switching unit and the electromechanical switching unit.

Abstract: A light detection element includes a semiconductor substrate, a light absorbing layer of a first conductivity type formed on the semiconductor substrate, a cap layer of a first conductivity type formed on the light absorbing layer, and a semiconductor region of a second conductivity type formed within the cap layer and forming a pn junction with the cap layer. A depletion layer formed around the semiconductor region does not reach the light absorbing layer in a case where a reverse bias is not applied to the pn junction, and exceeds a position amounting to 50% of a thickness of the light absorbing layer from the cap layer side in a case where a reverse bias of 20 V is applied to the pn junction.

Abstract: A powered device includes a photoelectric conversion element, a detector and a signal outputter. The photoelectric conversion element converts feed light into electric power. The detector detects a magnitude of the electric power being transmitted from the photoelectric conversion element to a load. The signal outputter outputs a detection signal of the detector to outside of the powered device. The detection signal is a signal indicating an envelope of a modulated wave that is output by the load.

Abstract: Provided is a display device. The display device includes a light emitting element layer including a plurality of light emitting elements, and a light control layer on the light emitting element layer and overlapping the light emitting element layer on a plane. At least one of the light emitting elements and the light control layer includes an amorphous carbon light emitter.

Abstract: A cable isolation system that includes a cable that includes a first end, a second end, and a cable transmission medium that extends between the first end and the second end. The cable isolation system also includes a first connector that is located on the first end of the cable, that is coupled to the at least one cable transmission medium, and a second connector that is located on the second end of the cable, that is coupled to the at least one cable transmission medium. A cable isolation device is provided in at least one of the cable, the first connector, or the second connector and transitions between a non-isolated state that allows data to be transmitted via the cable transmission medium, and an isolated state that prevents data from being transmitted via the cable transmission medium.

Abstract: A light-emitting diode (LED) assembly comprises a plurality of LED cells and a driving circuit. Each of the LED cells includes an LED and a transistor. The LED includes first and second LED layers and an LED electrode. The first LED layer includes a III-V compound semiconductor. The second LED layer is over the first LED layer. The LED electrode is over the second LED layer. The first LED layer is free of an LED electrode. The transistor includes a drain region connected to the first LED layer. The driving circuit is configured to drive the LED cells.

Abstract: The technology relates to an integrated circuit (IC) package. The IC package may include a substrate. An IC die may be mounted to the substrate. One or more photonic modules may be attached to the substrate and one or more serializer/deserializer (SerDes) interfaces may connect the IC die to the one or more photonic modules. The IC die may be an application specific integrated circuit (ASIC) die and the one or more photonic modules may include a photonic integrated circuit (PIC) and fiber array. The one or more photonic modules may be mounted to one or more additional substrates which may be attached to the substrate via one or more sockets.

Abstract: Disclosed is a photocoupler comprising: at least two lead frames; an optical channel structure including a light-emitting chip, a light-sensing chip, and a light-transmissive encapsulant body, wherein the light-emitting chip and the light-sensing chip are mounted and bonded on the lead frame and are coplanar, a light-emitting surface of the light-emitting chip and a light-sensing surface of the light-sensing chip face toward the same direction, the light-transmissive encapsulant body encloses the light-emitting chip and the light-sensing chip; and a light-reflecting package encloses the light-transmitting package, and all enclosing contact surface where the light-reflecting outer package contacts the light-transmissive encapsulant body is an optical reflective surface, wherein the light-reflecting encapsulant body and the light-transmissive encapsulant body are formed by double molding and epoxy molding, so that the light-transmissive encapsulant body and the light-reflecting encapsulant body are easy to be s

Abstract: An embodiment of the present invention provides a window cover for a sensor package and a sensor package including the same, the window cover comprising: a body; an element receiving unit disposed in the body so as to receive a light emitting element and a light receiving element of the sensor package; and a radiating unit disposed at a position corresponding to the light emitting element in the element receiving unit so as to change light generated from the light emitting element to a predetermined beam range and radiate the same.

Abstract: In accordance with various embodiments of the disclosed subject matter, a phototransistor comprises an NPN or PNP phototransistor having a base including a Si-region, a Ge-region, and a Ge—Si interface region wherein photons are absorbed in the Ge region and conduction-band electrons are attracted to the interface region such that the electrons' mobility is enhanced thereby.

Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.

Abstract: The illumination device comprises a plurality of illumination units (21), each illumination unit (21) comprising a light source (21.1) for emitting a radiation beam (21.1A) and at least one laser beam source (21.2) for emitting at least one laser beam (21.2A), and a plurality of actuator means (22), wherein each actuator means (22) is connected to an illumination unit (21) and is adapted to change an orientation of the illumination unit (21) based on a detected beam direction of the laser beam (21.2A).

Abstract: A stacked optical filter arrangement includes a pneumatic liquid crystal layer stacked between a first and second transparent electrode layers, wherein the first transparent electrode layer includes electrode segments that are isolated from each other; first and second polarizer layers, wherein the pneumatic liquid crystal layer is stacked between the first polarizer layer and the second polarizer layer; a filter layer including filter segments, wherein at least two of the filter segments are wavelength sensitive filter segments, wherein at least two of the wavelength sensitive filter segments are transparent for different wavelengths; and optical channels, wherein each optical channel includes a portion of the pneumatic liquid crystal layer, a portion of the first electrode layer, one of the plurality of electrode segments of the second transparent electrode layer, a portion of the first polarizer layer, a portion of the second polarizer layer, and one of the plurality of filter segments.

Abstract: A busbar assembly according to the present invention includes a first busbar formed by a conductive metal flat plate; a second busbar formed by a conductive metal flat plate, the second busbar disposed in the same plane as the first busbar with a gap being provided between opposing side surfaces of the first and second busbars; and an insulating resin layer filled in the gap so as to mechanically connect the opposing side surfaces of the first and second busbars. Preferably, the opposing side surface of at least one of the first and second busbars is an inclined surface that is closer to the opposing side surface of the other of the first and second busbars from one side toward the other side in the thickness direction.

Abstract: The present technology relates to a semiconductor apparatus, a production method, and an electronic apparatus that enable semiconductor apparatuses to be laminated and the laminated semiconductor apparatuses to be identified. A semiconductor apparatus that is laminated and integrated with a plurality of semiconductor apparatuses, includes a first penetrating electrode for connecting with the other semiconductor apparatuses and a second penetrating electrode that connects the first penetrating electrode and an internal device, the second penetrating electrode being arranged at a position that differs for each of the laminated semiconductor apparatuses. The second penetrating electrode indicates a lamination position at a time of lamination. An address of each of the laminated semiconductor apparatuses in a lamination direction is identified by writing using external signals after lamination. The present technology is applicable to a memory chip and an FPGA chip.

Abstract: A power bank containing a rechargeable battery for wirelessly charging a portable device by induction power transmission, the power bank having a housing having a power transmission surface for placement adjacent a power receiving surface of a chargeable portable device and a reusable adhesive pad over at least part of the power transmission surface, made of an adhesive that is capable of removably sticking to the power receiving surface of a portable device for temporarily holding the surfaces adjacent each other with a protective cover for covering the adhesive pad when not in use and a recess in the housing opposite the power transmission surface for temporarily holding the cover.

Abstract: There is provided an optical sensor that includes a base portion, an action portion, a reflecting member disposed at one of the base portion and the action portion, and a detection unit including a light source and a light receiving element disposed at the other one of the base portion and the action portion. In the optical sensor, a space between the detection unit and the reflecting member is filled with a light transmissive material, and a force and/or acceleration is detected due to the light receiving element detecting light emitted from the light source and reflected by the reflecting member.

Abstract: A power switching cell, and associated multi-level converter, include an input port capable of receiving a switching control signal, an input transistor linked by the gate to the input port, and by the source to a reference voltage, a self-biasing circuit comprising a self-biasing transistor linked by the gate to the drain of the input transistor, and a resistor connected in parallel between the gate and the source of the self-biasing transistor, and in series between the drain of the input transistor and the source of the self-biasing transistor, a power transistor, linked by the gate to the source of the self-biasing transistor and by the drain to a power supply voltage, and an isolating transistor linked by the gate and by the source to the gate and to the source of the power transistor, and by the drain to the output port of the cell.

Abstract: This disclosure relates to a notebook computer including a computer body and a power transmission device which having an input port and an output port opposite to each other. The input port is configured to be electrically connected to a power supply. The output port is electrically connected to the computer body. The power transmission device includes an actuating circuit and a hold circuit. The actuating circuit is electrically connected between the input port and the output port. The hold circuit is connected in parallel to the actuating circuit.

Abstract: A fuel sensing system utilizes non-contact plastic optical fiber (POF) to optically sense the level of liquid fuel in a fuel tank. In one implementation, the fuel level sensing system includes the following elements: (i) a high-speed and high-power red laser diode; (ii) an ultra-high-sensitivity photon-counting avalanche photodiode; and (iii) a large-diameter and large-numerical-aperture graded-index POF. The fuel level is sensed when the avalanche photodiode first detects impinging light reflected by the POF end face and then detects impinging light reflected by the fuel surface in response to emission of a laser pulse by the red laser diode. A time delay detection circuit calculates the time interval separating the respective times of arrival. A fuel level calculator calculates the fuel level based on the time interval provided by the time delay detection circuit.

Abstract: A modular RF measuring device has a motherboard arranged centrally within the device so as to define a front side and a rear side, the front side and the rear side each comprising module interfaces.

Abstract: A light emitting device package includes a light emitting device that generates light, a body frame including a cavity in which the light emitting device is mounted, a molding material that fills the cavity, and absorbing pigments that convert the light generated by the light emitting device. The absorbing pigments have a peak value within a wavelength range of 490 to 520 nm and a full width at half maximum (FWHM) of 40 to 70 nm.

Abstract: A rapid testing read out integrated circuit (ROIC) includes phase-change material (PCM) radio frequency (RF) switches residing on an application specific integrated circuit (ASIC). Each PCM RF switch includes a PCM and a heating element transverse to the PCM. The ASIC is configured to provide amorphizing and crystallizing electrical pulses to a selected PCM RF switch. The ASIC is also configured to determine if the selected PCM RF switch is in an OFF state or in an ON state. In one implementation, a testing method using the ASIC is disclosed.

Abstract: A PIN photodetector includes an n-type semiconductor layer, an n-type semiconductor cap layer, a first plurality of p-type regions located within the n-type semiconductor cap layer and separated from one another by a distance d1, and an absorber layer located between the n-type semiconductor layer and the n-type semiconductor cap layer including the first plurality of p-type regions. The plurality of p-type regions are electrically connected to one another to provide an electrical response to light incident to the PIN photodetector.

Abstract: A vehicle includes a lower security network (LSN) and higher security network (HSN) having therebetween a read only filter and path in parallel to respectively exclusively pass data from the LSN to the HSN, and from the HSN to the LSN. The vehicle includes a gateway controller configured to alter a duty cycle associated with the filter according to utilization of the HSN to alter a data rate through the filter but not through the path.

Abstract: A communications system 10 comprises a source arrangement 12 of periodic waves. The source arrangement is configured to generate an interferometric wave pattern having a plurality of lobes 18.1 to 18.13. Each lobe has a main axis 20 diverging from an origin 22 at the source arrangement and a null 24 between any two adjacent lobes. At least one sensor arrangement 26 is provided for the waves. The sensor arrangement comprises a first sensor 28 and a second sensor 30 which are spaced from one another. A first signal source 40 is connected to the source arrangement 12 via a phase shift arrangement 41 to generate a first interferometric wave pattern 18 which illuminates the first sensor 28 more than the second sensor 30. A second signal source 42 is connected to the source arrangement via the phase shift arrangement to generate a second interferometric pattern 46 which is off-set from the first interferometric pattern and which illuminates the second sensor more than the first sensor.

Abstract: A method of producing an optical sensor at wafer-level, comprising the steps of providing a wafer having a main top surface and a main back surface and arrange at or near the top surface of the wafer at least one first integrated circuit having at least one light sensitive component. Furthermore, providing in the wafer at least one through-substrate via for electrically contacting the top surface and back surface and forming a first mold structure by wafer-level molding a first mold material over the top surface of the wafer, such that the first mold structure at least partly encloses the first integrated circuit. Finally, forming a second mold structure by wafer-level molding a second mold material over the first mold structure, such that the second mold structure at least partly encloses the first mold structure.

Abstract: An optical sensor module includes a support unit, a light-receiving unit and a light-emitting unit. The support unit includes a main plate, and a side plate inclined relative to the main plate. The light-receiving unit includes a photodetector disposed on the main plate and having a light-receiving surface located away from the main plate, and a light-blocking member covering part of the photodetector. The light-emitting unit emits light toward an imaginary line perpendicular to the light-receiving surface, and is disposed on the side plate. A wearable device including the optical sensor is also disclosed.

Abstract: A method for optical interconnection between semiconductor chips according to an embodiment include converting an electrical signal to an optical signal, transmitting the optical signal to a second substrate disposed above or below a first substrate using an optical transmitter provided on the first substrate, receiving the optical signal using an optical detector provided on the second substrate, and converting the received optical signal to an electrical signal. Accordingly, using a mid-infrared wavelength range of light that is transparent to semiconductor materials such as silicon and next-generation high-mobility materials, it is possible to enable interconnection between stacked semiconductor chips without using metal wiring.

Abstract: A key of an optical mechanical keyboard, having a base plate, a circuit board, an optical switch, a rotating member, a key cap, a pressing cylinder, a primary spring, and a secondary spring. A ring-shaped fastening member is provided on the base plate, and a side wall of the ring-shaped fastening member is provided with two opposing first light-admitting slots, and a keystroke impact slot is respectively provided at two sides of and between the opposing first light-admitting slots. The key has a simple structure and is lightweight and slim, and enables generation of a clear sound upon striking a key.

Abstract: Compact optical sources and methods for producing short and ultrashort optical pulses are described. A semiconductor laser or LED may be driven with a bipolar waveform to generate optical pulses with FWHM durations as short as approximately 85 ps having suppressed tail emission. The pulsed optical sources may be used for fluorescent lifetime analysis of biological samples and time-of-flight imaging, among other applications.

Abstract: A magnetic sensor including: a substrate with a main surface; at least two magnetoresistive effect elements formed on the main surface and connected to a power terminal of a bridge circuit; at least two magnetoresistive effect elements formed on the main surface and connected to a ground terminal of the bridge circuit; a first region in which one of the at least two magnetoresistive effect elements connected to the power terminal and one of the at least two magnetoresistive effect elements connected to the ground terminal are disposed; a second region in which another of the at least two magnetoresistive effect elements connected to the power terminal and another of the at least two magnetoresistive effect elements connected to the ground terminal are disposed; and a bias coil including a first bias application part for applying a bias magnetic field to the first region and a second bias application part for applying a bias magnetic field to the second region.

Abstract: In accordance with one or more embodiments, a transmission device includes a receiver configured to receive an interfering signal via an antenna. A transmitter is configured to generate first electromagnetic signals conveying first data. A coupler is configured to generate first guided electromagnetic waves in response to combined electromagnetic signals, wherein the first guided electromagnetic waves propagate, without requiring an electrical return path, along a surface of a transmission medium of a distributed antenna system. A cancellation circuit is configured to generate the combined electromagnetic signals, based on the interfering signal and the first electromagnetic signals, wherein the combined electromagnetic signals mitigate interference by the interfering signal with the first guided electromagnetic waves.

Abstract: An optical transmission device includes a first light emitting element, a second light emitting element, and a detection unit. The first light emitting element is configured to emit light. The second light emitting element is configured to emit light. The second light emitting element is connected in parallel with the first light emitting element and is configured to deteriorate earlier than the first light emitting element. The detection unit is configured to detect whether the second light emitting element is deteriorated.

Abstract: To achieve an opto-reflector in which a distance to a detection target is shortened to be able to detect the position of the closer detection target, and thereby contributing to the reduction of the arrangement space. The opto-reflector (10) includes a plate-shaped substrate (11); a light emitting element (13) and a light receiving element (14) mounted on the substrate (11); light transmitting resin layer (12) which seals the light emitting element (13) and the light receiving element (14); and a light shielding portion (21) provided between the light emitting element (13) and the light receiving element (14). The light shielding portion (21) is formed at a height such that a part of light beam can be directly transferred between the light emitting element (13) and the light receiving element (14) via the light transmitting resin layer (12).

Abstract: This cyber-retro-reflector technology is a series of Architectures, representing staged deployments, including backward compatibility, of products with enhanced features, for integrating technologies and capabilities, of electronic and photonic systems to: (a) reduce power consumption for circuits and systems that are placed into ‘off’ and/or disabled states, including external interface portals of electronic and photonic systems, (b) increase and enhance intra-/inter-connectivity, interoperability, and functionality of a system and the aggregate of systems, (c) increase and enhance integrated capabilities leading to higher computational performance for the system and the aggregate of systems, (d) take full advantage of photonic capabilities, and (e) improve hacking detection.

Abstract: Solid state transducers with state detection, and associated systems and methods are disclosed. A solid state transducer system in accordance with a particular embodiment includes a support substrate and a solid state emitter carried by the support substrate. The solid state emitter can include a first semiconductor component, a second semiconductor component, and an active region between the first and second semiconductor components. The system can further include a state device carried by the support substrate and positioned to detect a state of the solid state emitter and/or an electrical path of which the solid state emitter forms a part. The state device can be formed from at least one state-sensing component having a composition different than that of the first semiconductor component, the second semiconductor component, and the active region. The state device and the solid state emitter can be stacked along a common axis.

Abstract: Provided are a multi-channel optical subassembly structure allowing an optical unit including a light source photodetector chip to be fixed through an alignment jig after active alignment is performed on an individual or single light source photodetector chip by using the alignment jig capable of electrical coupling and one electrode pad and the other electrode pad of a thermoelectric element, which are wire-bonded, capable of performing active alignment for each light source photodetector chip, that is, for each channel, capable of replacing the optical unit and the alignment jig when a problem occurs in some or all channels, capable of improving optical coupling efficiency for each channel, and capable of addressing a time-consuming and economically expensive work in which an optical subassembly is discarded when some channels fail, and a method of packaging the structure.

Abstract: The present invention relates to an optocoupler including a light source having a body and electrical leads, a light detector having a diode stack a metal end cap and electrical leads, and an optical cavity including optically transparent material at least partially covering the body of the light source and the diode stack of the light detector. Also included is a reflective layer including optically reflective material surrounding the optical cavity. The electrical leads of the light source, the metal end cap and the electrical leads of the light detector protrude from the optical cavity and the reflective layer.

Abstract: A photonic device having wide bandgap (WBG) materials which change electrical behaviors in response to low-intensity light is disclosed. The device comprises an optical waveguide located in an optical path of light to receive the light and to spatially confine the received light as guided light at a higher optical intensity than the received light; a wide bandgap (WBG) material located in an optical path of the guided light output by the optical waveguide; and two electrodes formed at two different locations on the WBG material to provide two electrical contacts of an electrical path within the WBG material, wherein the WBG material exhibits an electrical conductivity that varies with a level of the guided light output by the optical waveguide to turn on or off the electrical path between the two electrodes.

Abstract: An information-processing system having spherical and parabolic reflectors, optical signal processors, and detectors comprising optically active surfaces. The spherical reflector has an internal light-reflecting surface and a spherical processor with internal and external optically active surfaces, with its center coincident with that of the spherical reflector. The optical signal processor's internal and external surfaces include transmitters and detectors for transmitting and receiving a optically encoded signals along various distinct paths. A portion of the internal path coincides with a line that passes through the center of the sphere. Optical signals emitted from the external surface of the processing sphere and reflected by the internal surface of the external spherical reflector to neighboring regions of the processing sphere, enabling external relay of information around the sphere without congesting the internal cavity of the sphere.

Abstract: In accordance with one or more embodiments, a transmission device includes a receiver configured to receive an interfering signal via an antenna. A transmitter is configured to generate first electromagnetic signals conveying first data. A coupler is configured to generate first guided electromagnetic waves in response to combined electromagnetic signals, wherein the first guided electromagnetic waves propagate, without requiring an electrical return path, along a surface of a transmission medium of a distributed antenna system. A cancellation circuit is configured to generate the combined electromagnetic signals, based on the interfering signal and the first electromagnetic signals, wherein the combined electromagnetic signals mitigate interference by the interfering signal with the first guided electromagnetic waves.