Signal Isolator Patents (Class 250/551)
  • Patent number: 10418507
    Abstract: To achieve an opto-reflector in which a distance to a detection target is shortened to be able to detect the position of the closer detection target, and thereby contributing to the reduction of the arrangement space. The opto-reflector (10) includes a plate-shaped substrate (11); a light emitting element (13) and a light receiving element (14) mounted on the substrate (11); light transmitting resin layer (12) which seals the light emitting element (13) and the light receiving element (14); and a light shielding portion (21) provided between the light emitting element (13) and the light receiving element (14). The light shielding portion (21) is formed at a height such that a part of light beam can be directly transferred between the light emitting element (13) and the light receiving element (14) via the light transmitting resin layer (12).
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: September 17, 2019
    Assignee: NEW JAPAN RADIO CO., LTD.
    Inventors: Fumiaki Ohno, Seiji Koike
  • Patent number: 10419131
    Abstract: This cyber-retro-reflector technology is a series of Architectures, representing staged deployments, including backward compatibility, of products with enhanced features, for integrating technologies and capabilities, of electronic and photonic systems to: (a) reduce power consumption for circuits and systems that are placed into ‘off’ and/or disabled states, including external interface portals of electronic and photonic systems, (b) increase and enhance intra-/inter-connectivity, interoperability, and functionality of a system and the aggregate of systems, (c) increase and enhance integrated capabilities leading to higher computational performance for the system and the aggregate of systems, (d) take full advantage of photonic capabilities, and (e) improve hacking detection.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: September 17, 2019
    Inventors: Paul Westmeyer, Renee Mazaheri
  • Patent number: 10347614
    Abstract: Solid state transducers with state detection, and associated systems and methods are disclosed. A solid state transducer system in accordance with a particular embodiment includes a support substrate and a solid state emitter carried by the support substrate. The solid state emitter can include a first semiconductor component, a second semiconductor component, and an active region between the first and second semiconductor components. The system can further include a state device carried by the support substrate and positioned to detect a state of the solid state emitter and/or an electrical path of which the solid state emitter forms a part. The state device can be formed from at least one state-sensing component having a composition different than that of the first semiconductor component, the second semiconductor component, and the active region. The state device and the solid state emitter can be stacked along a common axis.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: July 9, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Martin F. Schubert, Vladimir Odnoblyudov
  • Patent number: 10338326
    Abstract: Provided are a multi-channel optical subassembly structure allowing an optical unit including a light source photodetector chip to be fixed through an alignment jig after active alignment is performed on an individual or single light source photodetector chip by using the alignment jig capable of electrical coupling and one electrode pad and the other electrode pad of a thermoelectric element, which are wire-bonded, capable of performing active alignment for each light source photodetector chip, that is, for each channel, capable of replacing the optical unit and the alignment jig when a problem occurs in some or all channels, capable of improving optical coupling efficiency for each channel, and capable of addressing a time-consuming and economically expensive work in which an optical subassembly is discarded when some channels fail, and a method of packaging the structure.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: July 2, 2019
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jeong Eun Kim, Hyun Seo Kang, Keo Sik Kim, Sung Chang Kim, Young Sun Kim, Ji Hyoung Ryu, Hyoung Jun Park, Dong Hoon Son, Chan Il Yeo, Young Soon Heo
  • Patent number: 10340410
    Abstract: The present invention relates to an optocoupler including a light source having a body and electrical leads, a light detector having a diode stack a metal end cap and electrical leads, and an optical cavity including optically transparent material at least partially covering the body of the light source and the diode stack of the light detector. Also included is a reflective layer including optically reflective material surrounding the optical cavity. The electrical leads of the light source, the metal end cap and the electrical leads of the light detector protrude from the optical cavity and the reflective layer.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: July 2, 2019
    Assignee: HARRIS CORPORATION
    Inventors: Stuart D. Wood, Steven M. DeSmitt, Eugene G. Olczak
  • Patent number: 10333010
    Abstract: A photonic device having wide bandgap (WBG) materials which change electrical behaviors in response to low-intensity light is disclosed. The device comprises an optical waveguide located in an optical path of light to receive the light and to spatially confine the received light as guided light at a higher optical intensity than the received light; a wide bandgap (WBG) material located in an optical path of the guided light output by the optical waveguide; and two electrodes formed at two different locations on the WBG material to provide two electrical contacts of an electrical path within the WBG material, wherein the WBG material exhibits an electrical conductivity that varies with a level of the guided light output by the optical waveguide to turn on or off the electrical path between the two electrodes.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: June 25, 2019
    Assignee: Lawrence Livermore National Security, LLC
    Inventor: Stephen Sampayan
  • Patent number: 10312952
    Abstract: In accordance with one or more embodiments, a transmission device includes a receiver configured to receive an interfering signal via an antenna. A transmitter is configured to generate first electromagnetic signals conveying first data. A coupler is configured to generate first guided electromagnetic waves in response to combined electromagnetic signals, wherein the first guided electromagnetic waves propagate, without requiring an electrical return path, along a surface of a transmission medium of a distributed antenna system. A cancellation circuit is configured to generate the combined electromagnetic signals, based on the interfering signal and the first electromagnetic signals, wherein the combined electromagnetic signals mitigate interference by the interfering signal with the first guided electromagnetic waves.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: June 4, 2019
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Thomas M. Willis, III, Giovanni Vannucci, Paul Shala Henry
  • Patent number: 10313025
    Abstract: An information-processing system having spherical and parabolic reflectors, optical signal processors, and detectors comprising optically active surfaces. The spherical reflector has an internal light-reflecting surface and a spherical processor with internal and external optically active surfaces, with its center coincident with that of the spherical reflector. The optical signal processor's internal and external surfaces include transmitters and detectors for transmitting and receiving a optically encoded signals along various distinct paths. A portion of the internal path coincides with a line that passes through the center of the sphere. Optical signals emitted from the external surface of the processing sphere and reflected by the internal surface of the external spherical reflector to neighboring regions of the processing sphere, enabling external relay of information around the sphere without congesting the internal cavity of the sphere.
    Type: Grant
    Filed: January 10, 2015
    Date of Patent: June 4, 2019
    Inventor: Gordon W. Rogers
  • Patent number: 10298226
    Abstract: A signal transmission device relating to a technique disclosed in the specification of the present application includes: an isolation transformer; an input-side circuit connected to an input side of the isolation transformer; and an output-side circuit connected to an output side of the isolation transformer. The output-side circuit includes a first differential circuit having a first input and a second input connected to the first terminal and the second terminal respectively. A reference potential of the first differential circuit is connected to the second terminal.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: May 21, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Motoki Imanishi, Kenichi Morokuma
  • Patent number: 10283699
    Abstract: A coupler is disclosed that employs hall-effect sensing technology. Specifically, the coupler is configured to produce an output voltage by converting the magnetic field generated by a current conductor at an input side. The output and input sides may be electrically isolated from one another but may be coupled via the hall-effect sensing technology, such as a hall-effect sensor. The output and input sides may be provided in an overlapping configuration.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: May 7, 2019
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Yin Yin Chew, Thiam Siew Gary Tay, Dominique Ho
  • Patent number: 10244638
    Abstract: A proximity sensor is provided according to the embodiments of the present disclosure, comprising: a sensor chip; a light-emitting device; a substrate, the sensor chip and the light-emitting device being located on the substrate; a transparent molding material covering a light-emitting surface of the light-emitting device; and a non-transparent molding material separating the transparent molding material from the sensor chip.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: March 26, 2019
    Assignee: STMICROELECTRONICS PTE LTD
    Inventor: Jing-En Luan
  • Patent number: 10209139
    Abstract: A temperature change detection apparatus for monitoring temperature change in various portions of a large space includes a trip logic unit configured to execute a trip operation based on receipt of a trip signal at the trip logic unit; a plurality of temperature sensors each including a sensing portion composed of optical fiber cable and each being configured to generate light information indicating an amount of Brillouin scattering that occurs within the sensing portion; a plurality of monitoring units configured such that each monitoring unit determines a temperature value corresponding to each temperature sensor connected to the monitoring unit based on an amount of Brillouin scattering indicated by the light information generated by each of the connected temperature sensors, an each monitoring unit generates a trip signal when a determined temperature value exceeds a running average by more than a threshold amount.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: February 19, 2019
    Assignee: GE-HITACHI NUCLEAR ENERGY AMERICAS LLC
    Inventors: Eric P. Loewen, Brett J. Dooies, Seth Ryan Paul Strege, Nicholas Francis O'Neill
  • Patent number: 10200032
    Abstract: An optoelectronic safety device for monitoring a machine movement includes an emitter/receiver device, control electronics, an electric line which includes at least two wires to transmit a supply voltage and a control signal, and a device provided so that the supply voltage and the control signal can be transmitted where the at least two wires is a two-wire electric line or, alternatively, a three-wire electric line.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: February 5, 2019
    Assignee: FRABA B.V.
    Inventors: Christian Lilienthal, Omar Al Attar
  • Patent number: 10175422
    Abstract: A modular optical device having a set of optoelectronic modules that enables the device to operate, e.g., as a WDM or multichannel transceiver. In an example embodiment, the set of optoelectronic modules includes a laser module, a modulator module, and an optical-to-electrical converter module, all mounted on the same circuit board and optically and electrically connected for the intended application. Each of the optoelectronic modules comprises a respective stack of integrated circuits, at least one of which is a photonic integrated circuit (PIC). Some of the PICs may be configurable for different applications, with the configuration setup being carried out using electrical control signals and/or optical connections of the PICs.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: January 8, 2019
    Assignees: Alcatel-Lucent USA Inc., NOKIA OF AMERICA CORPORATION
    Inventors: Po Dong, Gabriel Charlet
  • Patent number: 10170658
    Abstract: An optical device includes a substrate, a light emitter, a light detector, a conductive structure, and an opaque material. The light emitter, the light detector and the conductive structure are disposed on a surface of the substrate and are electrically connected to traces on the surface of the substrate. The light emitter includes an emitting area facing the substrate. The light detector includes a receiving area facing the substrate. The light emitter emits light within a range of wavelengths, and the substrate passes the light emitted by the light emitter. The opaque material is disposed on the substrate, and absorbs or attenuates the light within the range of wavelengths.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: January 1, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Hsuan Tsai, Lu-Ming Lai
  • Patent number: 10115714
    Abstract: According to one embodiment, a semiconductor device includes a first semiconductor element having a first surface, a second semiconductor element having a lower surface bonded to the first surface of the first semiconductor element, a gel-like silicone that covers an upper surface of the second semiconductor element, and a resin portion that covers the gel-like silicone and the first surface of the first semiconductor element.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: October 30, 2018
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Naoya Takai
  • Patent number: 10074639
    Abstract: Disclosed examples include integrated circuits with a leadframe structure, a first circuit structure including a light source configured to generate a light signal along an optical path, a second circuit structure including a light sensor facing the optical path to receive the light signal, and a molded package structure enclosing portions of the leadframe structure, the molded package structure having a cavity defined by an interior surface of the molded package structure, the optical path extending in the cavity between the first and second circuit structures.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: September 11, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Barry Jon Male, Benjamin Cook, Robert Alan Neidorff, Steve Kummerl
  • Patent number: 10075246
    Abstract: An optical isolator is provided. The optical isolator includes a printed circuit board having a first surface and a second surface opposite the first surface. The printed circuit board has a recess extending only partially through the board. The first photoelement has an active surface and is mounted relative to the first surface of the printed circuit board. A second photoelement has an active surface and is mounted relative to the second surface. The second photoelement is configured to interact with the first photoelement. At least one of the first and second photoelements has its active surface disposed at least partially in the recess. A portion of the printed circuit board is interposed between the first and second photoelements.
    Type: Grant
    Filed: September 26, 2013
    Date of Patent: September 11, 2018
    Assignee: MICRO MOTION, INC.
    Inventors: Kirk Allan Hunter, Jared James Dreier, Jordan Dennis Lucht, Samuel Ethan Messenger
  • Patent number: 10069574
    Abstract: An optical system, an optocoupler, and an isolation device are provided. The disclosed optical system includes at least one photodetector that receives light energy and converts the light energy into one or more electrical signals. The disclosed optical system further includes a comparator module that receives the one or more electrical signals from the at least one photodetector and compares the one or more electrical signals against two different reference values to determine whether a power supply fault condition has occurred for a light source that emitted the light energy and to determine a logic signal conveyed to the at least one photodetector via the light energy emitted by the light source.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: September 4, 2018
    Assignee: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
    Inventor: HongLei Chen
  • Patent number: 10069566
    Abstract: A photoelectric conversion assembly is proposed. The photoelectric conversion module comprises three parts, photoelectric conversion module, a printed circuit board (PCB) and a hybrid cable. The photoelectric conversion module comprises an interposer, at least one optical element configured on the interposer, and an optical bench for the printed circuit board and the interposer configured thereon. Electrical wires are used for coupling to the printed circuit board. An optical ferrule is used for engaging with the photoelectric conversion module and an optical fiber component. A plug is used for electrically connecting the printed circuit board. A first lens array is configured under the interposer. A mirror is configured under the first lens array. A second lens array is configured left side of the mirror.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: September 4, 2018
    Assignee: AQUAOPTICS CORP.
    Inventors: Chia-Chi Chang, Tung-An Lee, Shih-Jye Yo
  • Patent number: 10038438
    Abstract: A driving circuit including: a voltage detector that detects the sum voltage of a positive bias voltage and a negative bias voltage, the negative bias voltage or the positive bias voltage; and a switching element that is connected to the control terminal of a power element and the negative side of a negative-voltage power supply; wherein, when the value of the detection target voltage becomes lower than a voltage setting value or when a voltage between the control terminal and the reference terminal in the power element increases in a state where the value of the detection target voltage is lower than the voltage setting value, the voltage detector turns on the switching element to thereby supply, between the above terminals in the power element, a voltage of 0V or lower.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: July 31, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kosuke Nakano, Keisuke Iwasawa, Takayoshi Miki, Hiroshi Nakatake
  • Patent number: 10014659
    Abstract: An optical source is described. This optical source includes a set of semiconductor optical amplifiers, with a semiconductor other than silicon, which provides an optical gain medium. In addition, a photonic chip, optically coupled to the set of semiconductor optical amplifiers, includes optical paths. Each of the optical paths includes an optical waveguide and a distributed-Bragg-reflector (DBR) ring resonator. The DBR ring resonator at least partially reflects a given tunable wavelength in an optical signal provided by a given semiconductor optical amplifier. Moreover, the DBR ring resonator includes a different number of grating periods than DBR ring resonators in the remaining optical paths, and the DBR ring resonators in the optical paths have a common radius.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: July 3, 2018
    Assignee: Oracle International Corporation
    Inventors: Jock Bovington, Xuezhe Zheng, Ashok V. Krishnamoorthy
  • Patent number: 10003364
    Abstract: In accordance with one or more embodiments, a transmission device includes a receiver configured to receive an interfering signal via an antenna. A transmitter is configured to generate first electromagnetic signals conveying first data. A coupler is configured to generate first guided electromagnetic waves in response to combined electromagnetic signals, wherein the first guided electromagnetic waves propagate, without requiring an electrical return path, along a surface of a transmission medium of a distributed antenna system. A cancellation circuit is configured to generate the combined electromagnetic signals, based on the interfering signal and the first electromagnetic signals, wherein the combined electromagnetic signals mitigate interference by the interfering signal with the first guided electromagnetic waves.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: June 19, 2018
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Thomas M. Willis, III, Giovanni Vannucci, Paul Shala Henry
  • Patent number: 9971108
    Abstract: The application provides methods of forming a fiber coupling device comprising a substrate, the substrate having a substrate surface and at least one optoelectronic and/or photonic element, and further comprising at least one fiber coupling alignment structure that is optically transmissive. The method comprises a) applying a polymerizable material to the substrate surface, b) selectively polymerizing, using a method of 3D lithography, a region of the polymerizable material so as to convert the region of the polymerizable material into a polymer material, thereby forming at least one fiber coupling alignment structure, and c) cleaning the substrate and the polymer material from remaining non-polymerized polymerizable material, thereby exposing the at least one fiber coupling alignment structure of the fiber coupling device.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: May 15, 2018
    Assignee: Corning Optical Communications LLC
    Inventors: Michael de Jong, Andreas Matiss, Martin Spreemann, Eric Stephan ten Have
  • Patent number: 9954672
    Abstract: A digital signal input circuit including an isolating circuit and a voltage determining circuit is presented, where a first port of an input end of the isolating circuit receives a digital signal, an output end of the isolating circuit outputs the digital signal, and when the isolating circuit is open, the isolating circuit is configured to output a first level, or when the isolating circuit is closed, the isolating circuit is configured to output a second level; and the voltage determining circuit is configured to determine, according to a level of the digital signal, whether the isolating circuit is open or closed. According to the digital signal input circuit, the voltage determining circuit determines a level of a digital signal, thereby correctness of digital signal level conversion is increased.
    Type: Grant
    Filed: October 9, 2017
    Date of Patent: April 24, 2018
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Jianzhao Li
  • Patent number: 9946274
    Abstract: A temperature control apparatus is provided. The temperature control apparatus includes an analog to digital (AD) converter digital-converting a measurement value transmitted from a plurality of temperature sensors; a control means comparing the measurement value transmitted from the AD converter with a preset desired value to perform PID calculation; and an output unit transmitting, to outside, a pulse width modulation (PWM) control signal transmitted form the control means, wherein an input-side isolator for isolation for each temperature sensor is provided between the AD converter and the temperature sensor, the input-side isolator is connected to each of the temperature sensors, and the control means sequentially operates the input-side isolators.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: April 17, 2018
    Assignee: LSIS CO., LTD.
    Inventor: Yong Gak Sin
  • Patent number: 9939596
    Abstract: An optical integrated circuit (IC) package includes an optical IC including an optical IC substrate, an optical IC including an optical IC substrate, an electrical integrated circuit device (EICD) on the optical IC substrate, at least one optical device spaced apart from the EICD on the optical IC substrate, an optical interface on a first side of the optical IC substrate, an electrical interface located on a second side of the optical IC substrate, and an encapsulation member configured to encapsulate the optical IC, the EICD, the at least one optical device, the optical interface, and the electrical interface.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: April 10, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ho-chul Ji, Keun-yeong Cho, In-sung Joe
  • Patent number: 9923500
    Abstract: Techniques are described for providing, in a gate driver circuit, a compensation current to compensate for parasitic displacement current induced during the rising edge of an output voltage at an output gate of the gate driver circuit. In one example, the techniques of the disclosure include activating, by a bridge driver circuit for a direct-current (DC) motor, a driver of the bridge driver circuit and measuring, by the bridge driver circuit, a parasitic current of the driver during a rise time of an output gate voltage of the driver. In response to the measured parasitic current, generating, by the bridge driver circuit, a compensation current; and outputting, by the bridge driver circuit and to the output gate of the of the driver, the compensation current.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: March 20, 2018
    Assignee: Infineon Technologies AG
    Inventors: Detlef Ummelmann, Ansgar Pottbaecker
  • Patent number: 9893679
    Abstract: Methods, systems, and devices for high voltage and/or high frequency modulation. In one aspect, an optoelectronic modulation system includes an array of two or more photoconductive switch units each including a wide bandgap photoconductive material coupled between a first electrode and a second electrode, a light source optically coupled to the WBGP material of each photoconductive switch unit via a light path, in which the light path splits into multiple light paths to optically interface with each WBGP material, such that a time delay of emitted light exists along each subsequent split light path, and in which the WBGP material conducts an electrical signal when a light signal is transmitted to the WBGP material, and an output to transmit the electrical signal conducted by each photoconductive switch unit. The time delay of the photons emitted through the light path is substantially equivalent to the time delay of the electrical signal.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: February 13, 2018
    Assignee: Lawrence Livermore National Security, LLC
    Inventor: Stephen Sampayan
  • Patent number: 9865832
    Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.
    Type: Grant
    Filed: July 13, 2015
    Date of Patent: January 9, 2018
    Assignee: APPLE INC.
    Inventors: Andreas Bibl, Kapil V. Sakariya, Charles R. Griggs, James Michael Perkins
  • Patent number: 9865765
    Abstract: A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed on a substrate. The optical barrier is disposed between the emitter and the detector for shielding the excess optical signal. A package material is used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: January 9, 2018
    Assignee: SensoTek technology Corp.
    Inventors: Feng-Jung Hsu, Chu-Yuan Yang, Yuan-Ching Hsu, Yi-Hua Chang
  • Patent number: 9837969
    Abstract: According to one embodiment, a transimpedance circuit includes: a transimpedance amplifier that converts a current signal into a voltage signal, a reference voltage generating circuit that generates a reference voltage signal, and a comparator that generates a pulse signal corresponding to the current signal in accordance with a voltage level of the voltage signal and a voltage level of the reference voltage signal. The transimpedance amplifier includes a first transistor that amplifies the current signal, a voltage converter that converts the current signal into a voltage signal, and a bypass circuit that allows the current signal to be bypassed when the current signal which flows through a control terminal of the first transistor exceeds a predetermined value.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: December 5, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Yukio Tsunetsugu
  • Patent number: 9806824
    Abstract: There is provided a power supply receiver-transmitter device, a wireless power supply receiver, and a wireless power supply transmitter which allow wireless power supply transmission and wireless data transmission and reception, and improve the usability thereof. The wireless power supply receiver-transmitter device includes: a wireless power supply receiver (PR) including a power receiver unit (RU) and a first data transmitter/receiver unit (DRU); a wireless power supply transmitter (PT) including a power transmitter unit (TU); and a second data transmitter/receiver unit (DTU). The wireless power supply receiver (PR) wirelessly receives electric power transmitted from the wireless power supply transmitter (PT), and the first data transmitter/receiver unit (DRU) bidirectionally transmits and receives data to/from the second data transmitter/receiver units (DTU) through optical communications.
    Type: Grant
    Filed: September 26, 2013
    Date of Patent: October 31, 2017
    Assignee: ROHM CO., LTD.
    Inventors: Ken Nakahara, Masayuki Kitagawa
  • Patent number: 9780271
    Abstract: In at least one embodiment of the method, the method is used to produce optoelectronic semiconductor components. A lead frame assemblage includes a plurality of lead frames. The lead frames each includes at least two lead frame parts and the lead frames in the lead frame assemblage are electrically connected to one another by connecting webs. The lead frame assemblage is fitted on an intermediate carrier. At least a portion of the connecting webs is removed and/or interrupted. Additional electrical connecting elements are fitted between adjacent lead frames and/or lead frame parts. A potting body mechanically connects the lead frame parts of the individual lead frames to one another. The resulting structure is singulated to form the semiconductor components.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: October 3, 2017
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Tobias Gebuhr, Michael Zitzlsperger
  • Patent number: 9778101
    Abstract: An optical detecting module includes a housing, a light emitting component, an optical detecting component and an optical signal collecting component. The light emitting component is disposed inside the housing. The optical detecting component is disposed inside the housing to receive an optical detecting signal generated by the light emitting component. The optical signal collecting component is utilized to hold the light emitting component for signal collection. The optical signal collecting component includes an output portion, a bottom portion and at least one lateral portion. The light emitting component is disposed on the bottom portion, and an optical positive signal of the optical detecting signal is projected out of the housing through the output portion. The lateral portion is bent from the bottom portion to reflect an optical lateral signal of the optical detecting signal, and the optical lateral signal is projected out of the housing through the output portion.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: October 3, 2017
    Assignee: PixArt Imaging Inc.
    Inventors: Cheng-Lin Yang, Hung-Ching Lai, Chi-Chih Shen
  • Patent number: 9739962
    Abstract: Plastic optical fiber data communication links. Particularly, plastic optical fiber data communication links for embedded applications. More particularly, unique packaging approaches to constructing a very small, low cost, but high performance optical link, which may operate at 1 gigabits per second (Gbps) or faster.
    Type: Grant
    Filed: May 14, 2014
    Date of Patent: August 22, 2017
    Assignee: Vixar
    Inventors: Mary Brenner, Klein Johnson, William Hogan, Dave Shelander
  • Patent number: 9716083
    Abstract: An optical apparatus includes a substrate 1, a wiring pattern 8 formed on the substrate 1, a light-receiving element 3 and a light-emitting element 2 provided on the substrate 1 and spaced apart from each other in a direction x, a light-transmitting resin 4 covering the light-receiving element 3, a light-transmitting resin 5 covering the light-emitting element 2, and a light-shielding resin 6 covering the light-transmitting resin 4 and the light-transmitting resin 5. The wiring pattern 8 includes a first light-blocking portion 83 interposed between the light-shielding resin 6 and the substrate 1 and positioned between the light-receiving element 3 and the light-emitting element 2 as viewed in x-y plane. The first light-blocking portion 83 extends across the light-emitting element 2 as viewed in the direction x.
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: July 25, 2017
    Assignee: ROHM CO., LTD.
    Inventors: Yuji Makimura, Okimoto Kondo
  • Patent number: 9704622
    Abstract: An optical transconductance varistor system having a modulated radiation source configured to provide modulated stimulus, a wavelength converter operably connected to the modulated radiation source to produce a modulated stimulus having a predetermined wavelength, and a wide bandgap semiconductor photoconductive material in contact between two electrodes. The photoconductive material is operably coupled, such as by a beam transport module, to receive the modulated stimulus having the predetermined wavelength to control a current flowing through the photoconductive material when a voltage potential is present across the electrodes.
    Type: Grant
    Filed: March 9, 2015
    Date of Patent: July 11, 2017
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: Hoang T. Nguyen, Brent C. Stuart
  • Patent number: 9692518
    Abstract: A DP-QPSK optical transmitter includes an outer MZM comprising a first parent MZM comprising a first child MZM and a second child MZM that modulates a QPSK signal with a first polarization. A second parent MZM includes a first child MZM and a second child MZM that modulates a QPSK signal with a second polarization. The outer Mach-Zehnder modulator multiplexes the first and second polarization embedded into a dual-polarization QPSK signal generation. A first optical detector detects the QPSK signal generated by the first parent MZM with the first polarization. A second optical detector optical detects the QPSK signal generated by the second parent Mach-Zehnder modulator with the second polarization. A bias control circuit generates bias signals on at least one output that stabilize the DP-QPSK signal in response to signals generated by the first and second optical detector using electrical time division multiplexing.
    Type: Grant
    Filed: July 17, 2013
    Date of Patent: June 27, 2017
    Assignee: Finisar Corporation
    Inventors: Suhas P. Bhandare, Heider N. Ereifej, Kyu Kim, Mark Colyar
  • Patent number: 9684074
    Abstract: An optical sensor arrangement, in particular an optical proximity sensor arrangement comprises a three-dimensional integrated circuit further comprising a first layer comprising a light-emitting device, a second layer comprising a light-detector and a driver circuit. The driver circuit is electrically connected to the light-emitting device and to the light-detector to control the operation of the light-emitting device and the light-detector. A mold layer comprising a first light-barrier between the light-emitting device and the light-detector configured to block light from being transmitted directly from the light-emitting device to the light-detector.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: June 20, 2017
    Assignee: AMS AG
    Inventors: Franz Schrank, Eugene G. Dierschke, Martin Schrems
  • Patent number: 9685578
    Abstract: A photocoupler comprises a light emitting element, a light-sensing element, a transparent inner encapsulant body, an outer covering body, and two conductive frames. An optically reflective surface is formed on the outer covering body directly in contact with the dome encapsulant portion of the transparent inner encapsulant body. A portion of the light emitted by the light emitting element is reflected to the light-sensing element through the optically reflective surface, and the other portion of the light emitted from the light emitting element is directly emitting to the light-sensing element through the dome encapsulant portion. The present invention applies the optically reflective surface to minimize the overlapping area between the two conductive frames, and reduces the capacitance value, and increases the CMRR in a manner that the photocoupler of the present invention is able to meet the standard of electrical characteristics as required.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: June 20, 2017
    Inventor: Poh-Loong Chew
  • Patent number: 9671903
    Abstract: An apparatus has a first ring of infrared emitters and a second ring of infrared detectors positioned adjacent to the first ring. A controller applies signals to the first ring and collects signals from the second ring.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: June 6, 2017
    Assignee: Sensing Electromagnetic Plus Corp.
    Inventors: Matteo Piovanelli, Alessandro Levi, Silvano Furlan
  • Patent number: 9673801
    Abstract: This disclosure provides example methods, devices, and systems for a three-lead electronic switch system adapted to replace a mechanical switch. A device is disclosed that includes a sensor, a current limiting circuit, an output switching circuit comprising a first switching device and a second switching device, and a three lead interface circuit in communication with the output switching circuit and the current limiting circuit. The device includes an electronic switching circuit in communication with the sensor, the current limiting circuit, and the output switching circuit. The electronic switching circuit is configured to drive the first and second switching devices in complementary conduction states responsive to determining the output of the sensor relative to a threshold voltage. The output switching circuit includes a first terminal, a second terminal, and a return terminal that are configured to provide power to the electronic switching circuit while providing an indication of the conduction states.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: June 6, 2017
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: Wolf S. Landmann
  • Patent number: 9613716
    Abstract: A semiconductor system may include a first semiconductor device including a first pad group. The semiconductor system may include a second semiconductor device including a second pad group which is configured for input and output of signals from and to a third semiconductor device. The second semiconductor device may include a selective transfer unit configured to electrically couple the third pad group to the first pad group or to an interface unit electrically coupled to the first pad group, in response to a test mode enable signal.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: April 4, 2017
    Assignee: SK HYNIX INC.
    Inventors: Min Chang Kim, Woo Yeol Shin, Noh Hyup Kwak
  • Patent number: 9583413
    Abstract: A semiconductor device includes a first chip coupled to an electrical insulator, and a sintered heat conducting layer disposed between the electrical insulator and the first chip.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: February 28, 2017
    Assignee: Infineon Technologies AG
    Inventors: Ivan Nikitin, Joachim Mahler, Thomas Behrens
  • Patent number: 9585233
    Abstract: The invention relates to a digital bus interface for an operating device for a lighting means comprising: a transmitting branch and a receiving branch, wherein the receiving branch has a current source (Q90, Q95, R90, R91), which can be fed from a bus that carries voltage in the idle state, wherein the current source supplies at least the transmitting branch with energy and the transmitting branch has an optocoupler (U91), wherein an electrical energy store (C95) is provided in the receiving branch, which electrical energy store is charged by the current source and discharges via a resistor (100) in series with the secondary side of the optocoupler (U91) of the transmitting branch.
    Type: Grant
    Filed: October 9, 2014
    Date of Patent: February 28, 2017
    Assignee: Tridonic GmbH & Co KG
    Inventors: Frank Lochmann, Markus Schertler
  • Patent number: 9559787
    Abstract: The alignment accuracy between light emitting elements, light receiving elements, and an insulating film is improved. A photocoupling device manufacturing method includes preparing a first lead frame having a first frame part supporting light receiving elements and a second lead frame having a second frame part supporting light emitting elements. The method also includes superposing the first and the second lead frame such that the light receiving elements and the light emitting elements mutually oppose via a first light-transmissive resin covering the light receiving elements, a second light-transmissive resin covering the light emitting elements, and an insulating film sheet positioned between the first and the second light-transmissive resin. The insulating film sheet includes body parts positioned between the light receiving elements and the light emitting elements, joining parts joined to the body parts, and a third frame part fixed between the first and the second frame part.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: January 31, 2017
    Assignee: Renesas Electronics Corporation
    Inventor: Ryuta Yaginuma
  • Patent number: 9523586
    Abstract: Methods and apparatus for sealed communication interfaces are disclosed. One example apparatus includes a translucent portion of a sealing gasket to allow signals to pass therethrough, a sealing wall of the gasket to define a substantially environmentally-isolated zone proximate the translucent portion, and a transmitter to transmit a signal across the translucent portion. The example apparatus also includes a receiver to detect a reflected signal corresponding to the transmitted signal, where the detection enables data communications across the translucent portion, and where the reflected signal is to be reflected from a surface on an opposite side of the translucent portion from the transmitter and receiver.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: December 20, 2016
    Assignee: ITRON GLOBAL SARL
    Inventors: Matthieu Torres, Denis Guillot-Jerome, Vincent Rigomier
  • Patent number: 9496247
    Abstract: A camera module and method of making same, includes a substrate of conductive silicon having top and bottom surfaces, a sensor device, and an LED device. The substrate includes a first cavity formed into the bottom surface of the substrate and has an upper surface, an aperture extending from the first cavity upper surface to the top surface of the substrate, and a second cavity formed into the top surface of the substrate and having a lower surface. The sensor device includes at least one photodetector, is disposed at least partially in the first cavity, and is mounted to the first cavity upper surface. The LED device includes at least one light emitting diode, is disposed at least partially in the second cavity, and is mounted to the second cavity lower surface.
    Type: Grant
    Filed: August 20, 2014
    Date of Patent: November 15, 2016
    Assignee: Optiz, Inc.
    Inventors: Vage Oganesian, Zhenhua Lu
  • Patent number: 9472536
    Abstract: A semiconductor device includes first, second, and third molded bodies. The first molded body covers a first light emitting element, a part of a lead electrically connected to the first light emitting element, a first light receiving element configured to detect a light emitted from the first light emitting element, and a part of a lead electrically connected to the first light receiving element with a first resin. The second molded body covers a second light emitting element, a part of a lead electrically connected to the second light emitting element, a second light receiving element configured to detect a light emitted from the second light emitting element, and a part of a lead electrically connected to the second light receiving element with the first resin. The third molded body molds the first and the second molded bodies as one body using a second resin.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: October 18, 2016
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Atsushi Takeshita, Hidetomo Tanaka