Abstract: A photocoupler includes: a support substrate; a MOSFET; a light receiving element; a light emitting element; and a bonding layer. The support substrate includes an insulating layer, input and output terminals. The MOSFET is bonded to the support substrate. The MOSFET has a first surface having an operation region. The light receiving element includes p-n junction and is bonded to the MOSFET. The light receiving element has first and second surfaces. The first surface includes a light reception region, a first electrode, and a second electrode. The light emitting element is connected to the input terminal. The light emitting element has first and second surfaces. The first surface includes first and second electrodes. The second surface has a light emitting region. The bonding layer is configured to bond the light emitting element to the light reception region.

Abstract: A solid state relay and method for enabling and disabling power to a load are disclosed. A fast turn-on circuit and fast turn-off circuit receive control signals in an isolated manner. The control signals allow only one of the fast turn-on circuit and fast turn-off circuit to be enabled at a time. A power switching circuit that enables power to be supplied to a load when the fast turn-on circuit is enabled and the fast turn-off circuit is disabled state, and disables the power from being supplied to the load when the fast turn-on circuit is disabled and the fast turn-off circuit is enabled. A power supply circuit provides isolated power used by the fast turn-on and fast turn-off circuits to drive or discharge a gate in the power switching circuit.

Abstract: A flexible electronic device including a component portion and at least one folded portion connected to the component portion is provided. The flexible electronic device has a plurality of flexed lines located on the single folded portion and a plurality of stress relief holes, wherein the stress relief holes are separated from each other, and at least a part of the stress relief holes is located on at least one of the flexed lines.

Abstract: Diode cell modules for use within photovoltaic systems, including lead frames including first leads extending from the first outlet terminal, second leads spaced from the first leads, second outlet terminals extending from the second leads, and diodes. In some examples, first leads define base portions connected to the first outlet terminal and diode portions extending from the base portions transverse to the first outlet terminal. In some examples, second leads may define a base portion and diode portions extending from the base portion substantially parallel to the diode portion of the first lead. In some examples, diodes may be in electrical contact with the diode portion of the first lead and with the diode portion of the second lead. In some examples, the first leads and second leads may be thermally conductive. In some examples, diodes may define die interfaces that are substantially fully engaged with diode portions of leads.

Abstract: A circuit for switching-on and/or switching-off an electrical load comprises an electrically conductive operator control element, an electrically operated lighting element that is looped-in between the operator control element and a live pole of an AC voltage source in such a way that current flows through the lighting element, as a result of which the lighting element emits light, when the operator control element is operated, an opto-electrical transducer is optically coupled to the lighting element, is shielded from ambient light and converts light emitted by the lighting element into electrical energy, and a switch that is electrically coupled to the opto-electrical transducer and connects the electrical load to a supply voltage (UV) or disconnects the electrical load from the said supply voltage, with the switch connecting the electrical load to the supply voltage when it is supplied with electrical energy by the opto-electrical transducer.

Abstract: The present disclosure relates to an electronic control apparatus for a vehicle using a sloped structure, and a manufacturing method thereof, in which an appropriate space is maintained with a housing body in order to maintain thermal glue applied onto the PCB when assembling an electronic control apparatus in a sliding manner, and the PCB is assembled by making the PCB be in contact with an upper housing body along a sloped structure formed in a distal end housing at a point at which the slide type assembling is ended, so that the thermal glue may be uniformly applied onto the PCB and be maintained during a slide type manufacturing process.

Abstract: Described is a light module interlock system comprising: an optical cable enabled to transmit light of a first wavelength and a second wavelength different than the first wavelength; a first light module enabled to provide the first wavelength to the optical cable; a second light module enabled to provide the second wavelength to the optical cable; a sensor enabled to detect the first wavelength transmitted by the optical cable, the sensor located at an opposite end of the optical cable as the first light module; and an interlock in communication with the sensor, the interlock enabled to: disable the second light module when the sensor fails to detect the first wavelength, such that the second wavelength is no longer provided to the optical cable.

Abstract: An optoelectronic device is disclosed. The optoelectronic device may be employed as a single or multi-channel opto-coupler that electrically isolates one circuit from another circuit. The opto-coupler may include one or more premolded cavities with a light-coupling medium contained therein. Walls of the one or more premolded cavities advantageously help shape the light-coupling medium during manufacture, therefore, resulting in a light path with controlled shape and dimensions.

Abstract: An optoelectronic device includes an optoelectronic component that receives or generates radiation, a frame having a cavity, the optoelectronic component being arranged in said cavity, a connection carrier to which the optoelectronic component is fixed, and a cover covering the cavity and forming a radiation passage area for the radiation, wherein a beam path from the optoelectronic component to the radiation passage area is free of an encapsulation material for the optoelectronic component.

Abstract: According to an embodiment, a semiconductor device includes a primary side lead, a light-emitting element electrically connected to the primary side lead, and a thyristor-type light-receiving element. The light-receiving element includes a first face for detecting light emitted from the light-emitting element, and a second face provided on an opposite side of the first face. The light-receiving element includes an anode electrode, a cathode electrode, and a gate electrode that are provided on the first face. The device further includes a secondary side first lead electrically connected to the anode electrode, a secondary side second lead electrically connected to the cathode electrode, and a secondary side third lead electrically connected to the gate electrode. The secondary side third lead is connected to the second face of the light-receiving element.

Abstract: A semiconductor device used for a semiconductor relay includes: a first diode; a second diode; an electric field shield film for covering the second semiconductor island region, where the second diode is formed; and a wiring for electrically connecting the first diode to the second diode. The wiring is arranged so as to cross above a silicon oxide film surrounding the second semiconductor island region. The electric field shield film is positioned below the wiring, and has a cutout portion in an overlapping region which overlaps the wiring. By forming the cutout portion, end portions of the electric field shield film is arranged to be shifted. Therefore, formation of a deep concave portion which is based on a concave portion on the silicon oxide film and a step of the electric field shield film over the entire width of the wiring can be prevented, and the disconnection of the wiring can be prevented.

Abstract: An optocoupler arrangement for signal transmission with galvanic separation includes a first optocoupler with a first input path and a first output path, a second optocoupler with a second input path and a second output path, wherein the first and second input paths are arranged in series with a connecting switching device, and wherein an actuation circuit has first and second input signals as inputs, and first, second and third outputs as outputs, and the actuation circuit is configured such that, as a function of a first switching state related to the first and second signal inputs, the connecting switching device is actuated, and with respect to either a second or a third switching state, either a first switching device assigned to the first input path of the first optocoupler or a second switching device assigned to the second input path of the second optocoupler is actuated.

Abstract: A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.

Abstract: An LED package structure for preventing lateral light leakage includes a substrate unit, a light-emitting unit, a light-transmitting unit and a light-shielding unit. The substrate unit includes a circuit substrate. The light-emitting unit includes at least one LED chip disposed on the circuit substrate and electrically connected to the circuit substrate. The light-transmitting unit includes a light-transmitting gel body disposed on the circuit substrate for enclosing the LED chip. The light-transmitting gel body has a first light-transmitting portion disposed on the circuit substrate for enclosing the LED chip and at least one second light-transmitting portion projected upwardly from the first light-transmitting portion and corresponding to the LED chip, and the second light-transmitting portion has a light output surface. The light-shielding unit includes a light-shielding gel body disposed on the circuit substrate for exposing the light output surface of the second light-transmitting portion.

Abstract: A system for delivering optical power over an optical conduit includes at least one optical power source delivering optical power to multiple outlet nodes in accordance with a multiple power access methodology.

Abstract: A diode circuit includes a switching element having a first terminal and a second terminal. The switching element includes a control electrode for controlling electrical conductance between the first and second terminals. A diode has a cathode electrode connected to the first terminal of the switching element and an anode electrode connected to the control electrode of the switching element. An impedance element is connected in parallel to the diode. The switching element and the diode each comprise a gallium nitride-based semiconductor component. The switching element and the diode may optionally be disposed on the same semiconductor substrate. The diode circuit may optionally be included in a direct current to direct current converter device or other devices.

Abstract: An opto-isolator with a correction circuit is disclosed. The correction circuit is configured to make adjustments for degradation of the light source of the opto-isolator. The correction circuit may comprise a photodetector for detecting degradation of the light source of the opto-isolator. When the light source degrades below a predetermined level, the correction circuit may be configured to make adjustments.

Abstract: A vibration detection apparatus for, for example, ultrasound/AE, with Fiber Bragg Grating (FBG), is used for elastic wave detection generated by a material impact and ultrasonic defect detection. Disadvantageously, the apparatus cannot detect ultrasound and has degraded performance at variable temperatures and strains. In response, a highly sensitive, small and light vibration detection apparatus is provided. FBG reflection light is lased by using a fiber laser. The intensity of the lased reflection light from the FBG is converted into an electrical signal. Thus, the ultrasound vibration or the like is detected. A vibration detection system includes an optical amplifier 42, an optical circulator 43, and an optical coupler 45. An FBG 44 and an entry/exit port of the optical circulator are connected by an optical fiber. The optical coupler and the optical amplifier are inserted between an entry port and an exit port of the optical circulator. The entry port and the exit port are connected by an optical fiber.

Abstract: A power module for high/low voltage insulation is provided. The power module includes a first substrate, a second substrate and an insulating substrate. The first substrate includes a first control circuit and a light source, wherein the first control circuit controls the light source to emit light. The second substrate includes a light-sensing part, a second control circuit and a power device. The light-sensing part receives the light of the light source of the first substrate to send a sensing information. The second control circuit correspondingly drives the power device in accordance with the sensing information. The insulating substrate is disposed between the first substrate and second substrate.

Abstract: A compact radiation-modulated transconductance varistor device having both a radiation source and a photoconductive wide bandgap semiconductor material (PWBSM) integrally formed on a substrate so that a single interface is formed between the radiation source and PWBSM for transmitting PWBSM activation radiation directly from the radiation source to the PWBSM.

Abstract: Embodiments of the present disclosure provide optical link handshake techniques and configurations. In one embodiment, an optical module includes a laser driver corresponding with a channel of the optical module, a signal detector corresponding with the channel, and a link handshake state machine configured to control the laser driver to generate a connect pulse of a link handshake process to test an optical link between the channel and a corresponding channel of another optical module and monitor the signal detector to detect a connect pulse from the another optical module. Other embodiments may be described and/or claimed.

Abstract: A photocoupler includes: a support substrate; a MOSFET; a light receiving element; a light emitting element; and a bonding layer. The support substrate includes an insulating layer, input and output terminals. The MOSFET is bonded to the support substrate. The MOSFET has a first surface having an operation region. The light receiving element includes p-n junction and is bonded to the MOSFET. The light receiving element has first and second surfaces. The first surface includes a light reception region, a first electrode, and a second electrode. The light emitting element is connected to the input terminal. The light emitting element has first and second surfaces. The first surface includes first and second electrodes. The second surface has a light emitting region. The bonding layer is configured to bond the light emitting element to the light reception region.

Abstract: An optoelectronic semiconductor component is provided, having a connection carrier (2), an optoelectronic semiconductor chip (1), which is arranged on a mounting face (22) of the connection carrier (2), and a radiation-transmissive body (3), which surrounds the semiconductor chip (1), wherein the radiation-transmissive body (3) contains a silicone, the radiation-transmissive body (3) comprises at least one side face (31) which extends at least in places at an angle ? of <90° to the mounting face (22) and the side face (3) is produced by a singulation process.

Abstract: A switching mode power supply, having: an input port; an output port; an energy storage component and a pair of power switches coupled between input port and the output port; an error amplifier configured to generate an amplified error signal based on the feedback signal and the reference signal; an error comparator configured to generate a frequency control signal based on the amplified error signal and the first sawtooth signal; a peak current generator configured to generate a peak current signal based on the frequency control signal; a peak current comparator configured to generate a current limit signal based on the peak current signal and the current sense signal; and a logic circuit configured to generate a switching signal to control the power switches based on the frequency control signal and the current limit signal.

Abstract: The present invention provides a semiconductor device capable of selecting a desired circuit (step-down circuit (or step-up/step-down circuit) and step-up circuit) on the user side at low cost. A semiconductor device according to the present invention includes a diode element and a switching element (IGBT). An anode terminal of the diode element and one main electrode terminal of the switching element are adjacently arranged at a predetermined distance from each other. In addition, a cathode terminal of the diode element and the other main electrode terminal of the switching element are adjacently arranged at another predetermined distance from each other.

Abstract: According to one embodiment, a semiconductor device includes first, second, and third molded bodies. The first molded body covers a first light emitting element, a part of a lead electrically connected to the first light emitting element, a first light receiving element configured to detect a light emitted from the first light emitting element, and a part of a lead electrically connected to the first light receiving element with a first resin. The second molded body covers a second light emitting element, a part of a lead electrically connected to the second light emitting element, a second light receiving element configured to detect a light emitted from the second light emitting element, and a part of a lead electrically connected to the second light receiving element with the first resin. The third molded body molds the first and the second molded bodies as one body using a second resin.

Abstract: System for controlling electrical equipment units on an offshore structure comprising an explosion proof housing closable with a panel door, at least one controller module mountable in the housing, arranged for autonomously controlling an electrical equipment unit, wherein the panel door comprises an operating module arranged for operating the at least one controller module and for providing status indication of the at least one controller module.

Abstract: A coupling and various methods of use of the coupling. In one embodiment a coupling is provided for use with an appliance operated by a power supply, which coupling allows mounting/dismounting of the appliance without electrical isolation from the supply, said coupling comprising: a) a mounting member having a first encapsulated transformer element and suitable controls connectable to the power supply, said member being suitable for fixing to a structure; and b) a holder member engageable with said mounting member and suitable for holding or for connecting thereto an appliance, said holder member including a second encapsulated transformer element able to conduct power to an appliance.

Abstract: An optoelectronic device is disclosed. The optoelectronic device may be employed as a single or multi-channel opto-coupler that electrically isolates one circuit from another circuit. The opto-coupler may include one or more folded leads that establish an enhanced isolation gap. The enhanced isolation gap increases the creepage distance of the opto-coupler and increases operational voltages that can be accommodated by the opto-coupler.

Abstract: An optical coupling device includes an optical coupling member, at least one photoelectric converter, and at least one optical fiber. The optical coupling member has a first surface, on which at least one first lens is provided, a second surface, on which at least one second lens is provided, and a reflective surface. The photoelectric converter faces the first lens of the optical coupling member, and the optical fiber faces the second lens of the optical coupling member. The optical coupling device satisfies a condition of 0.3<?<0.9; ?=NA1/NA2, where NA1 is a numerical aperture of the photoelectric converter; NA2 is a numerical aperture of the optical fiber.

Abstract: An optical isolator is provided. The optical isolator includes a printed circuit board having a first surface and a second surface opposite the first surface. The printed circuit board has a recess extending only partially through the board. The first photoelement has an active surface and is mounted relative to the first surface of the printed circuit board. A second photoelement has an active surface and is mounted relative to the second surface. The second photoelement is configured to interact with the first photoelement. At least one of the first and second photoelements has its active surface disposed at least partially in the recess. A portion of the printed circuit board is interposed between the first and second photoelements.

Abstract: A photocoupler comprises a light emitting element, a light-sensing element, a transparent inner encapsulant body, an outer covering body, and two conductive frames on which. An optically reflective surface is in contact and formed between the dome enclosing portion of the transparent inner encapsulant body and the outer encapsulant body. A portion of the light emitted by the light emitting element is reflected to the light-sensing element through the optically reflective surface, and the other portion of the light emitted from the light emitting element is directly emitting to the light-sensing element through the transparent inner encapsulant body. The present invention applies the optically reflective surface to minimize the overlapping area between the two conductive frames, and reduces the capacitance value, and increases the CMRR in a manner that the photo coupler of the present invention is able to meet the standard of electrical characteristics as required.

Abstract: A photointerrupter includes a base, a light emitting element, a light receiving element, a light-transmissive detector resin member covering the light receiving element, a light-transmissive emitter resin member covering the light emitting element, and a light shield layer covering the detector resin member and the emitter resin member. The emitter resin member is spaced apart from the detector resin member with an intervening clearance between them. The detector resin member includes a light incidence surface exposed from the light shield layer, and the emitter resin member includes a light output surface exposed from the light shield layer. The light incidence surface and the light output surface are arranged to face the clearance between the two resin members.

Abstract: A first sealing resin seals a space between a light emitting element and an insulating member, and a second sealing resin seals a space between a light receiving element and the insulating member. The first sealing resin includes a plurality of first particles having a refractive index higher than that of the first sealing resin. The content ratio of the first particles in the first sealing resin changes stepwise or continuously as the particles approach the insulating member from the light-emitting element. The content ratio of the first particles in the first sealing resin in a range up to 10 ?m from the light emitting element is higher than the content ratio of the first particles in the first sealing resin in a range up to 10 ?m from the insulating member.

Abstract: A low-cost, compact, high-reliability optical sensor device has an optical sensor element mounted in a package comprised of a light shielding glass lid substrate, a part of which has a light filter function, adhered to a light shielding glass substrate having a cavity. In a through hole in the light shielding glass lid substrate, glass having a function of absorbing infrared light and transmitting visible light by its own property is embedded. The light shielding glass substrate is made of glass having light shielding property as its own property.

Abstract: An optical communication device includes a light emitting element including a light emitting surface, a first substrate coating the light emitting element, a light receiving element including a light receiving surface, a second substrate coating the light receiving element, a planar optical waveguide, a first reflecting element including a first sloped surface, and a second reflecting element including a second sloped surface. The first substrate includes a first supporting surface. The first supporting surface defines a first light guiding hole spatially corresponding to the light emitting surface. The second substrate includes a second supporting surface. The second supporting surface defines a second light guiding hole spatially corresponding to the light receiving surface. The planar optical waveguide is positioned on the first supporting surface and the second supporting surface.

Abstract: The internal propagation of radiation between a radiation source and radiation detector mounted within a sensor package is prevented by the use of an optical isolator. The optical isolator is formed by the combination of a baffle mounted between the source and detector and a groove formed in an upper surface of the sensor package between the source and detector. A bottom of the groove is positioned adjacent to an upper edge of the baffle.

Abstract: A power module for high/low voltage insulation is provided. The power module includes a first substrate, a second substrate and an insulating substrate. The first substrate includes a first control circuit and a light source, wherein the first control circuit controls the light source to emit light. The second substrate includes a light-sensing part, a second control circuit and a power device. The light-sensing part receives the light of the light source of the first substrate to send a sensing information. The second control circuit correspondingly drives the power device in accordance with the sensing information. The insulating substrate is disposed between the first substrate and second substrate.

Abstract: A method for making an optical receiver assembly that can receive optical signals via an input optical fiber and can generate output electrical signals, including the following steps: providing an open-ended cavity formed of insulating material, such as a ceramic, comprising a base, peripheral sidewalls, and an open end opposite the base, the outside surface of the base defining a first surface and the inside surface of the base defining a second surface; disposing a first conductive region on a portion of the first surface and a second conductive region on a portion of the second surface; mounting, on the first surface, a semiconductor photodetector device having an active region for communicating optically with the input optical fiber, and coupling an electrical output of the photodetector device with the first conductive region; mounting, on the second surface, an amplifier that is electrically coupled with the second conductive region and produces the output electrical signals; and providing at least one

Abstract: The invention discloses an electrical isolator circuit comprising: an input stage comprising a transmitter of an opto-isolator; and an output stage comprising: a receiver of the opto-isolator; an active circuit in series with the receiver between the receiver and a power rail of the output stage; a first resistor connected to an output of the active circuit, and an input for the application of a predetermined voltage to the active circuit, the output stage being configured such that a varying output voltage is developed across the first resistor in response to input of a high voltage AC signal to the input stage. Ideally the output stage is operable to clamp the voltage across the receiver at the level of the predetermined voltage, thereby allowing for an increase in the load resistor and variable output resistor without increasing the time constant to unacceptably having regards to switching requirements.

Abstract: Methods and systems for a photonically enabled complementary metal-oxide semiconductor (CMOS) chip are disclosed. The CMOS chip may comprise a plurality of lasers, a microlens, a turning mirror, and an optical bench, and may generate optical signals utilizing the lasers, focus the optical signals utilizing the microlens, and reflect the optical signals at an angle defined by the turning mirror. The reflected optical signals may be transmitted into the photonically enabled CMOS chip, which may comprise a non-reciprocal polarization rotator, comprising a latching faraday rotator. The CMOS chip may comprise a reciprocal polarization rotator, which may comprise a half-wave plate comprising birefringent materials operably coupled to the optical bench. The turning mirror may be integrated in the optical bench and may reflect the optical signals to transmit through a lid operably coupled to the optical bench.

Abstract: An optoelectronic device is disclosed. The optoelectronic device may be employed as a single or multi-channel opto-coupler that electrically isolates one circuit from another circuit. The opto-coupler may include one or more folded leads that establish an enhanced isolation gap. The enhanced isolation gap may include an interruption in the insulation of the opto-coupler between the light source and the light detector. In addition, this interruption may further include a efficiency enhancer, or lens, to direct light emitted from the light source. Accordingly, the creepage distance and operational voltages of the opto-coupler can be increased while maintaining high efficiency levels.

Abstract: An optical sensor having at least one optical transmitting unit for production of a transmitted light beam, a photosensitive flat detector with semitransparent characteristics, through which the transmitted light beam passes, and which re-receives reflection light beams, i.e., from an object, and an evaluation unit for the photoelectric current of the photosensitive flat detector, at least for detection of an object. The photosensitive flat detector advantageously includes an organic polymer layer comprising a photosensitive substrate. An “Organic Photosensitive Diode” (OPD) is particularly advantageously used as the photosensitive flat detector with semitransparent characteristics.

Abstract: An apparatus and method for providing an isolated high-speed digital interface for communicating high-speed digital data within a vehicle. In architecture, the interface includes one or more input terminals and one or more output terminals. Each output terminal being associated with one of the one or more input terminals without any electrically conductive path existing between the output terminal and the input terminal, and instead the input terminal and the output terminal are coupled to one another by an optical coupling. The present invention can also be viewed as a method that can be broadly summarized by the following steps, providing at least one input terminal for receiving data and providing at least one output terminal. Wherein the output terminal is associated with the one input terminal without any electrically conductive path existing between the output terminal and the input terminal, are coupled to one another by an optical coupling.

Abstract: Optical apparatus includes a device package, with a radiation source contained in the package and configured to emit a beam of coherent radiation. A diffractive optical element (DOE) is mounted in the package so as to receive and diffract the radiation from the radiation source into a predefined pattern comprising multiple diffraction orders. An optical detector is positioned in the package so as to receive and sense an intensity of a selected diffraction order of the DOE.

Abstract: An optocoupler arrangement for signal transmission with galvanic separation includes a first optocoupler with a first input path and a first output path, a second optocoupler with a second input path and a second output path, wherein the first and second input paths are arranged in series with a connecting switching device, and wherein an actuation circuit has first and second input signals as inputs, and first, second and third outputs as outputs, and the actuation circuit is configured such that, as a function of a first switching state related to the first and second signal inputs, the connecting switching device is actuated, and with respect to either a second or a third switching state, either a first switching device assigned to the first input path of the first optocoupler or a second switching device assigned to the second input path of the second optocoupler is actuated.

Abstract: A semiconductor relay includes two MOSFETs; a light emitting element; a light-receiving drive element for switching on and off the two MOSFETs; two output and two input conductor plates electrically connected to the two MOSFETs and the light emitting element, respectively; and an encapsulating resin encapsulating the two MOSFETs, the light emitting element, the light-receiving drive element, the two output and the two input conductor plates. The two output and two input conductor plates includes terminal portions which protrude outside the encapsulating resin and are mounted on a common printed circuit board. Further, the two output conductor plates includes mount portions on which the two MOSFETs are mounted or on which drain electrodes of the two MOSFETs are connected, and the mount portions are encapsulated by the encapsulating resin in such an orientation that a thickness direction of the mount portions intersects that of the printed circuit board.

Abstract: An apparatus including a housing defining at least one interior cavity; at least one optical sensor located within the at least one interior cavity of the housing adjacent a first portion of the housing; wherein the first portion of the housing includes a plurality of distributed optical windows through the housing. A housing part of an apparatus including a housing wall comprising a plurality of distributed micro-windows through the housing wall.

Abstract: According to a receiving circuit includes a light receiving element, a signal voltage generation portion, a comparator, a reference voltage generation portion and a switch. The light receiving element receives a light signal and outputs a light current corresponding to the light signal. The signal voltage generation portion converts the light current into a signal voltage and outputs the signal voltage. The comparator compares the signal voltage with a first threshold value or a second threshold value. The reference voltage generation portion outputs a reference voltage input to the comparator. The switch changes the reference voltage to one of the first threshold value and the second threshold value based on an output of the comparator.

Abstract: An isolation apparatus and method are provided for bi-directional communication over a single wire link without circuit latch up. The isolation is provided by two identical but independent switching circuits designed to eliminate latch up while controlling two optical isolators in a bi-directional mode of operation.