Abstract: An apparatus for optically inspecting particles and/or defects correlates sizes of particles and/or defects to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

Abstract: A method and a measuring instrument for determining the position of an edge to be measured on a pattern on a substrate are described. A complete, nonlinear model intensity profile, which identifies the edge to be measured, of a model edge is ascertained and stored, and a desired edge position xk is defined therein with subpixel accuracy. A camera image of the substrate having the edge to be measured is acquired, and a one-dimensional measured intensity profile of the edge to be measured is determined therefrom. The model intensity profile is identified in the measured intensity profile with an indication of its location xm relative to a reference point. The desired position p of the edge to be measured is determined with subpixel accuracy as p=xm+xk.

Abstract: A process for obtaining an object image of at least one object (40) is described, wherein at least two partial images of the object (40) are taken under differing object conditions which are formed on the object with spatial patterns, wherein a non-linear dependence of the light detectable from the object point on the object conditions given at the object point exists and the partial images contain different contributions of various space frequency components of the object structure, and the desired object image is determined from the partial images by reconstruction of the space frequency components. Optical systems for implementing this type of process are also described.

Abstract: A method of quickly and accurately inspecting the stitching accuracy at which regions of a lithographic pattern are stitched at boundaries. The numerous regions of the lithographic pattern are exposed or delineated, one at a time. Inspected regions are scanned with a charged-particle beam to detect secondary electrons. The obtained signal is stored as an inspected image in an image memory, together with positional data about the inspected regions. After completion of acceptance of images from all the inspected regions, the inspected image is compared with a separately prepared reference image by an image processing unit. Pattern elements in the inspected regions corresponding to the reference image are extracted. Deviations at field boundaries or the like can be detected from the relative positions of these pattern elements, if any.

Abstract: An image processing device and method are provided. In a method of reading an image signal from a solid-state image-pickup element where a plurality of unit pixels including a transistor for detecting a light signal and a photo diode are arranged in a matrix, shift data applied to a line for reading out an image signal, which outputs a signal for selecting a line for reading out an image signal, is output to a shift register connected to a line for reading out an image signal, when the number of lines between line for reading out an image signal and line for clearing an image signal are equal to or less than the number of lines in the matrix and the condition for picking an image up is changed.

Abstract: Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result.

Abstract: An apparatus and method for handling microelectronic workpieces initially positioned in a container. The container can be changeable from a first configuration where the microelectronic workpiece is generally inaccessible within the container to a second configuration where the microelectronic workpiece is accessible for removal from the container. The apparatus can include a container access device positionable proximate to an aperture of an enclosure that at least partially encloses a region for handling a microelectronic workpiece. The container access device can be movably positioned proximate to the aperture to change the configuration of the container from the first configuration to the second configuration. A container support can be positioned proximate to the aperture and can be configured to move the container to a fixed, stationary position relative to the aperture when the container is in the second configuration.

Abstract: A sensor device for determining the intensity of incident light is provided. The sensor device includes a characteristic element, through which light striking the sensor device can pass depending on the direction from which light strikes the sensor device; a light-sensitive sensor element, which can detect the light having passed through the orientation characteristic element; and an absorption element, which can absorb the light striking the sensor device and/or the light having passed through the orientation characteristic element in such a way that the amount of light striking the light-sensitive sensor element does not exceed a predetermined value, whereby the absorption element is a reflective surface.

Abstract: An adaptive median filter (40) provides dynamic detection and correction of digital image defects which are caused by defective or malfunctioning elements of a radiation detector array (20). The adaptive median filter receives (100) lines of pixel values of a digital image that may have defects and a user-defined defect threshold. The lines of pixel values are scanned on a pixel-by-pixel basis using a kernel of n×n pixels, where the kernel contains the candidate pixel being examined (120). Each kernel is numerically reordered (130) and a median value is calculated (140). A defect threshold value is calculated by multiplying the user-defined defect threshold criteria and the candidate pixel value (150). A reference value is calculated by subtracting the candidate pixel value and the median value (160). The reference value is compared to the defect threshold value (170).

Abstract: Process and apparatus for determining properties of a traveling material web. The process includes simultaneously illuminating a plurality of measuring points on the material web with electromagnetic radiation, and imaging, through at least one optical device, the plurality of measuring points on one detection surface of at least one detector. The device includes at least one radiation source for illuminating a plurality of measuring points on the material web, at least one detector having a detection surface, and at least one optical device for imaging of the measuring points on the detection surface of the at least one detector.

Abstract: An apparatus and method for handling and/or pre-processing microelectronic workpieces. In one embodiment, the apparatus includes an input/output station configured to removably receive a plurality of microelectronic workpieces at an input/output location, a transfer station, and a first transfer device that moves the microelectronic workpieces directly between the input/output location and the transfer station. A second transfer device moves the microelectronic workpieces directly from the transfer station to at least one process station. The transfer station can include a pre-process station configured to identify and/or align the microelectronic workpieces. The apparatus can further include a storage station configured to support a plurality of microelectronic workpieces and can be positioned to at least partially overlap the pre-process station.

Abstract: A printhead alignment sensor for an ink jet printer includes at least two terminals defining a gap therebetween. An electrical measuring device detects a change in an electrical parameter between two of the terminals when ink is in the gap between the at least two terminals.

Abstract: A method and apparatus for imaging material. A section of a medium is photographed with a first camera having a first field of view. The medium is advanced along a feed direction and the section is photographed with a second camera having a second field of view. At least one of the first field of view and the second field of view is shifted from a nominal location by one or more reflective surfaces. An actual advance of the medium is compared with an intended advance of the medium and it is determined whether at least one of a media advance error and a dimensional change in the media exists in response to the comparing step.

Abstract: The invention relates to a method for measuring the deformation of a specimen without contact with the specimen. The surface of the measured specimen is partly illuminated by a laser light having uniform intensity. A speckle image is produced due to the local quality of the surface and is reproduced via an optical image sent onto a light-sensitive sensor. At least one reference speckle is selected by an evaluator unit from the totality of the speckles of the speckle image. The displacement of the reference speckle on the sensor is evaluated as the measure of the change that occurred in the specimen. In addition, the invention provides a device for performing this method.

Abstract: A system for monitoring a latent image exposed in a photo resist during semiconductor manufacture is provided. The system includes one or more light sources, each light source directing light to the latent image and/or one or more gratings exposed on one or more portions of a wafer. Light reflected from the latent image and/or the gratings is collected by a signature system, which processes the collected light. Light passing through the latent image and/or gratings may similarly be collected by the signature system, which processes the collected light. The collected light is analyzed and can be employed to generate feedback information to control the exposure. The collect light is further analyzed and can be employed to generate feed forward information that can be employed to control post exposure processes including development and baking processes.

Abstract: In a method for determining alignment of line formations of a web, a radiation source emitting radiation and a detector with numerous radiation sensors for sensing the radiation are provided. The radiation source and the detector are reciprocated together simultaneously transversely across the web. During reciprocation across the web, at least one measuring location of the web is irradiated by the radiation source and measured values, based on local radiation intensities are measured by the radiation sensors of the detector. The measured values are communicated to a computer. The computer generates, based on the measured values and the relative positions of the radiation sensors to one another, a local structural image of the at least one measuring location of the web.

Abstract: A method of measuring the thickness of a thin layer, by which the thickness of a top layer formed on the surface of a wafer can be detected in real time, and an apparatus therefor. This method includes irradiating light onto a cell and obtaining luminance from reflected light, detecting the thickness of a thin layer in an oxide site which is adjacent to the cell, repeating the irradiating and detecting steps to obtain a plurality of luminance values from cells formed on the wafer and a plurality of thickness values of thin layers in oxide sites that are adjacent to the cells, and employing a thickness calculation formula for calculating the thickness of a top layer using the plurality of luminance values and plurality of thickness values obtained in the prior steps.

Abstract: The roughness measuring method and roughness measuring apparatus enable accurate measurement of the surface roughness of a work with no cutoff values specified. An auxiliary storage device storing therein a plurality of cutoff values is included in a data processing apparatus of the roughness measuring apparatus. These cutoff values are read by a CPU. Then, the CPU uses a filter having a plurality of cutoff values to calculate a plurality of temporary evaluation values for each evaluation length corresponding to a plurality of cutoff values from measurement data, and obtains a maximum value out of these temporary evaluation values. Then, the CPU controls an evaluation value outputting device to have this maximum value outputted to a monitor as an effective evaluation value of the roughness of the measurement area in the cutoff value with the calculated maximum value falling within its roughness range.

Abstract: A conveying system includes a conveyor for advancing items thereon; and an image-capturing apparatus for detecting individual items on the conveyor and for generating image signals representing an image of the items. The image-capturing apparatus includes an illuminating unit formed of a matrix composed of a plurality of light-emitting diodes; a picture-capturing unit for receiving light rays emitted by the matrix and modified by an item situated in a path of the light rays and for generating the image signals; and a control unit connected to the matrix and the picture-capturing unit for a pulsed illumination of the matrix.

Abstract: The invention relates to a method and apparatus for determining the color and/or composition of a material. A sample of the material is illuminated with at least three separate illumination bands singly or in combination, said illumination bands collectively substantially spanning at least the visible range. The light reflected or transmitted by the sample is measured with at least four light detector elements responsive to light in wavelength bands which substantially span the visible range when the sample is illuminated. The width of the illumination bands differs in such a manner that the illumination bands are narrowest near the expected fluorescence absorption bands.

Abstract: A cigarette filter rod system comprises a plug combiner machine having a knife located downstream from a sensor. The knife generates a trigger signal which prompts an Inspection Unit to locate a previously stored frame of sensor data corresponding the rod which was cut by the knife. The Inspection Unit applies thresholds to the frame of sensor data to determine the location of filter segment boundaries, and then determines whether air rings are present in the data. The Inspection Unit then compares measurements made on the frame of sensor data with a pre-stored recipe indicating expected values for the frame. Statistical data is sent to a Human-Machine Interface Unit for analysis and display. The system performs filter rod rejection and cut registration based on the analysis performed by the Inspection Unit and the Human-Machine Interface.

Abstract: An apparatus and method that automatically recognizes a print medium. The device includes a print medium sensor for detecting the kind of print media, and outputting a detection signal; a detection signal processor for receiving and processing the detection signal output from the print medium sensor, and outputting a digital detection signal; and a microprocessor for receiving the digital detection signal processed and output from the detection signal processor, and determining the kind of print media according to the level of the digital detection signal applied.

Abstract: An apparatus and method for inspecting a printed circuit board, whereby a list of windows encompassing respective regions of the printed circuit board are generated. The windows are then scanned, and data representing the respective regions is captured and stored. The captured data includes data relating to a plurality of pixels for each window. Next, data relating to a plurality of adjacent pixels is retrieved, and values of the adjacent pixels are summed. Finally, either the data relating to the plurality of adjacent pixels or the sum of adjacent pixel values is selected for use in subsequent processing. The apparatus and method is especially useful for determining an average brightness level for each window.