Abstract: A wire bonding apparatus is provided with: a bonding stage on which a semiconductor chip is mounted; a wire bonding unit including a capillary bonding a bonding wire to the semiconductor chip, a Z-axis drive section reciprocating the capillary, and a tool XY-stage causing the capillary and the Z-axis drive section to be moved along a two-dimensional plane intersecting a direction of reciprocation; and a base having an optical system and an optical system XY-stage causing the optical system to be moved along a two-dimensional plane intersecting a direction of reciprocation, the base having the wire bonding unit attached thereto. The wire bonding unit is attached to a first portion of the base, and the optical system XY-stage is attached to a second portion of the base which is separate from the first portion.

Abstract: Described herein are high intensity illumination systems including lighting arrays of lights, such as light emitting diodes, configured to illuminate a surface. The lighting arrays are configured to illuminate the surface with illumination comparable to or multiple times brighter than the ambient illumination, such as sunlight. Also described herein are methods of using a high intensity illumination system to illuminate a surface for applications including imaging, object detection, and object localization. The systems and methods described herein may be applied to a range of industries including farming, agriculture, construction, and autonomous vehicles.

Abstract: A device for determining a dimension of a tool having a cutting edge includes a first light source configured to emit light parallel to a first axis, an image sensor which is associatable with a second axis extending orthogonally to the image sensor and an analyzing unit. The first axis and the second axis are inclined relative to each other. The device is configured such that the light emitted from the first light source is reflectable by the cutting edge of the tool in such a way that light spots arranged in a line on the image sensor are generatable by the reflected light. The analyzing unit is configured to determine positions of the light spots. The dimension of the tool is determinable based on the positions of the light spots.

Abstract: A projection device includes a plurality of solid-state lighting sources driven by a DC drive power to sequentially provide a first light generated by a first number of light sources, a second light generated by a second number of light sources and a third light generated by a third number of light sources within a response cycle; and a color wheel having a first block, a second block and a third block, respectively corresponding to the first to third lights, so that the projection device sequentially outputs a first color light with a first brightness, a second color light with a second brightness and a third color light with a third brightness. The brightness of the first to third lights is controlled by number of light sources to be turn on.

Abstract: A method for acquiring images of a part to be inspected comprises the following steps framing the part with a digital video camera providing an illuminator comprising a plurality of illumination sources arranged to illuminate various portions of the part or to illuminate the part from different angles, wherein individual illumination sources or groups of illumination sources are controlled individually by means of an illumination control unit operationally connected to the digital video camera; controlling the video camera to take a series of shots of framed part, with each shot being defined by a preset exposure time with each shot and for the duration of the exposure time generating a part illumination condition through the illumination control unit by activating a portion of the individual illumination sources or groups of illumination sources so the sequence of shots is taken with different corresponding lighting conditions according to a preset lighting program.

Abstract: Proposed are a device and method for checking for a surface defect, using an image sensor. The device can increase accuracy in detecting defects of various types, shapes, or directions, and include: a frame part for providing a transport path of an object to be checked, along the lengthwise direction parallel to the ground surface; a transport part provided on one side of the frame part so as to transport the object to be checked, along the transport path; and an image sensor part provided in the middle of the transport path so as to capture an image of the surface of the object to be checked, from above the transported object to be checked.

Abstract: An artificial neural network-based method for detecting a surface type of an object includes: receiving a plurality of object images, wherein a plurality of spectra of the plurality of object images are different from one another and each of the object images has one of the spectra; transforming each object image into a matrix, wherein the matrix has a channel value that represents the spectrum of the corresponding object image; and executing a deep learning program by using the matrices to build a predictive model for identifying a target surface type of the object. Accordingly, the speed of identifying the target surface type of the object is increased, further improving the product yield of the object.

Abstract: Illumination testing is performed to passively check the health of a display of a shared device within a physical space, such as a conference room. A test pattern is output to the display within the physical space. Using a camera within the physical space, a test image of the physical space is captured while the test pattern is output to the display. A determination is then made as to whether the display is in a fail state by comparing the test image against a reference image depicting an expected illumination of the physical space according to the test pattern. Where the device is determined to be in a fail state, a notification indicating the fail state is transmitted to an administrator device to alert an administrator associated therewith of the fail state.

Abstract: A fused imaging device and method are disclosed. The device comprises a light source component, an image capture component, and a control component. The control component may be configured to control the light source component to illuminate a target object based on a preset plurality of first optimal lighting configurations. The control component may further control the image capture component to capture images of the target object to obtain multiple first images, under the illumination of the light source component and generate a target image of the target object, based on the first images. The control component may further adjust the incidence angle, pattern, and wavelength of the light source in the light source component, as well as the exposure, lens focus, and polarization of the image capture component, to detect target object defects in captured images of the target object.

Abstract: A fused imaging device and method are disclosed. The device comprises a light source component, an image capture component, and a control component. The control component may be configured to control the light source component to illuminate a target object based on a preset plurality of first optimal lighting configurations. The control component may further control the image capture component to capture images of the target object to obtain multiple first images, under the illumination of the light source component and generate a target image of the target object, based on the first images. The control component may further adjust the incidence angle, pattern, and wavelength of the light source in the light source component, as well as the exposure, lens focus, and polarization of the image capture component, to detect target object defects in captured images of the target object.

Abstract: The present disclosure provides an apparatus. The apparatus according to the present disclosure comprises: at least one first light source configured to irradiate illumination light to an object on a reference surface; at least one second light source configured to irradiate pattern light to the object, a plurality of cameras configured to capture one or more illumination images and one or more pattern images; and one or more processors configured to determine a plurality of outlines indicating edges of the object based on two or more images captured in different directions among the one or more illumination images and the one or more pattern images; determine a virtual plane corresponding to an upper surface of the object based on the plurality of outlines; and determine an angle between the virtual plane and the reference plane.

Abstract: An inspection device is provided, which is capable of detecting a short circuit failure even when a connector is provided on a wiring board. The inspection device is configured to inspect a short circuit failure generated at any connected part of a plurality of pins 153 to a wiring board via solder. The plurality of pins 153 is included in a connector provided on the wiring board. The inspection device includes: a wiring 11 connected to certain pins 153 of the plurality of pins 153; a second wiring 12 connected to remaining pins 153 of the plurality of pins 153; and a tester unit connected to the first wiring 11 and to the second wiring 12 so as to inspect insulation between the certain pins 153 and the remaining pins 153.

Abstract: A method and a device for measuring the topography and/or the gradients and/or the curvature of an optically active surface of an object are disclosed. The device allows the object to be arranged in a receiving region with a contact surface for contact with the object. Inside the device, there is a plurality of point light sources that provide light that is reflected at the surface to be measured of an object arranged in the receiving region. The device includes at least one camera with an objective assembly and an image sensor for detecting a brightness distribution which is produced on a light sensor by the light of the point light sources reflected at the surface to be measured.

Abstract: A semiconductor inspection system according to an embodiment includes first imaging unit capturing an image of a first lead of a semiconductor package from a first direction perpendicular to an upper surface, the semiconductor package including a sealing portion and the first lead, the sealing portion having the upper surface, the first lead extending sideward from the sealing portion; first calculation unit calculating a front length of the first lead from the image captured by the first imaging unit; second imaging unit capturing an image of the first lead from a second direction inclined to the upper surface; second calculation unit calculating an oblique length of the first lead from the image captured by the second imaging unit; and third calculation unit calculating an amount of floating of the first lead from a reference plane parallel to the upper surface, using the front length and the oblique length.

Abstract: An automated visualization tool in a command line environment allows complex log data to be represented by symbols and associated information for clarity of communication and better understanding of the associated design.

Abstract: Embodiments of an active or laser polarimeter are disclosed that transmit multiple independent and tunable temporally-multiplexed polarization states and record or image, at video rates if necessary, the polarized intensity or irradiance reflected or transmitted by objects illuminated by those states, and apply the recorded data to material and/or object classification and recognition using classification algorithms that exploit features of polarization signatures dependent on material type, texture, and/or object shape. The polarimeter also generally records and utilizes one or more passive polarization measurements in order to realize a hybrid active-passive polarimeter. The polarimeter channels are configured and tuned to access multi-dimensional signature spaces specified by existing signature models and/or measurements, with polarization-modulator settings derived by a newly-disclosed subspace-projection algorithm that maximizes a target contrast parameter.

Abstract: A substrate inspection apparatus according to an embodiment of the present invention comprises a projection unit, an illumination unit, an image acquisition unit and a processing unit. The projection unit irradiates an inspection target with light for obtaining three-dimensional shape information of the inspection target. The illumination unit irradiates the inspection target with at least two lights having different colors. The image acquisition unit acquires a first image by receiving light irradiated by the projection unit and reflected from the inspection target, and a second image by receiving the lights irradiated by the illumination unit and reflected from the inspection target. The processing unit acquires brightness information and color information from the first image and the second image, respectively, which are acquired by the image acquisition unit, and acquires at least a portion of a boundary by using the bright information and the color information.

Abstract: The invention alleviates a burden on a user relating to an image inspection device based on photometric stereo and multi-spectral imaging. An illumination device 3 has three or more illumination blocks that irradiate a workpiece 2 with illumination beams from different directions, respectively. A camera 4 generates images of the workpiece 2. An image processing device 5 irradiates the workpieces 2 sequentially with illumination beams from light emitting elements of different lighting colors and generates a plurality of spectral images. The image processing device 5 sequentially turns on the three or more illumination blocks in units of blocks and generates a plurality of direction images. The image processing device 5 generates a color inspection image based on the plurality of spectral images and executes color inspection. The image processing device 5 generates a shape inspection image based on the plurality of direction images and executes shape inspection.

Abstract: A system includes a robotic device for moving an inspection tool, a scanner coupleable to the robotic device such that the robotic device is configured to automatically move the scanner to collect data associated with a surface of the object, and a computer system configured to determine a surface profile associated with the surface of the object based on the data, and generate a tool path for inspecting the object using the inspection tool based on the surface profile.

Abstract: An electronic device (101, 200, 300, 400) is provided comprising optically transmissive electrical components (102, 103, 205-210, 303, 304, 405-410, 413-418) and optically transmissive computer structures such as boards (105, 201-203) or enclosures (302, 311-313). The components of the electronic device communicate through optical signals (212, 214, 309, 314, 422, 428) that propagate freely within the electronic device. That is, the optical signals are not guided and may or may not travel through the optically transmissive structures and components. This enables increased communication paths and reduced number of physical connections between various parts of the electronic device. The components may be placed in a single plane or in a three-dimensional layout and still communicate via the light signals. The invention enables an adaptable layout of an electronic device which is easily constructed.

Abstract: A board inspection apparatus system includes a first apparatus, a second apparatus, a third apparatus and an information transfer section. The first apparatus acquires first three-dimensional information of a solder paste on a board, and inspects whether the solder paste is formed good by a first tolerance based on the first three-dimensional information. The second apparatus mounts an electronic component on the board to join the electronic component and the solder paste. The third apparatus acquires second three-dimensional information of a solder joint, and inspects whether the electronic component is mounted good by a second tolerance based on the second three-dimensional information. The information transfer section transfers the first three-dimensional information to the third apparatus, or transfers the second three-dimensional information to the first apparatus. Thus, a more effective inspection condition may be established, and a rate of defect for each apparatus may be greatly reduced.

Abstract: A method for capturing three-dimensional photographic lighting of a spherical lighting device is described. Calculation of boundaries of the spherical lighting device based on lighting properties of at least one light source in a set location of the spherical lighting device is performed. A mapping of multitude points of the spherical lighting device to three-dimensional vectors of at least one camera device using a logical grid is performed. A measurement of brightness of the logical grid of the spherical lighting device is performed. The method further comprises determining brightest grid point of the logical grid of the spherical lighting device, wherein the brightest grid point of the logical grid is measured within a region brightness of the spherical lighting device. The method further comprises calculating the region of brightness of the spherical lighting device based on the determined brightest grid point of the logical grid.

Abstract: A photometric processing part calculates a normal vector of a surface of a workpiece from a plurality of luminance images acquired by a camera in accordance with the photometric stereo method, and performs synthesis processing of synthesizing at least two images out of an inclination image made up of pixel values based on the normal vector calculated from the plurality of luminance images and at least one reduced image of the inclination image, to generate an inspection image showing a surface shape of the inspection target. In particular, a characteristic size setting part sets a characteristic size which is a parameter for giving weight to a component of a reduced image at the time of performing the synthesis processing. The photometric processing part can generate a different inspection image in accordance with the set characteristic size.

Abstract: A semiconductor component mounting apparatus includes an image sensing unit, electrode detection unit, and determination unit. The image sensing unit is configured to obtain image data of a plurality of electrodes arranged on a mounting surface of a semiconductor component. The electrodes are divided into a plurality of groups based upon functions of the electrodes. The electrode detection unit is configured to identify the electrodes in each of the groups, and to detect, for each of the electrodes, whether the electrode is lacking or not by using the image data. Each of the groups has a preset permissible number of lacking electrodes. The determination unit is configured to determine, based on the number of the lacking electrodes detected by the electrode detection unit and the permissible number of lacking electrodes preset to the group, whether the semiconductor component is a defective or a non-defective.

Abstract: A method for 3-dimensional vision inspection of objects, such as microelectronic components, which have protrusions as features to be inspected, such as input/output contact balls, is disclosed. The method comprises the steps of determining interior and exterior parameters of a stereo camera system, forming a rectified stereo camera system with a rectified camera coordinate system from the parameters of the stereo cameras determined above. A pair of images of the object having a plurality of co-planar protrusions on one surface is captured by the stereo cameras system and is transformed into the rectified coordinate system to form a pair of rectified images. Conjugate points of each protrusion are then determined in the rectified images for the measurement of its location, co-planarity and height. Various configurations of the apparatus for capturing the images and processing the image data are also disclosed.

Abstract: This application relates to an apparatus and method for providing patterned illumination fields for use within process control and article inspection applications. More specifically, it pertains to the use of patterned illuminators to enable visual surface inspection of polished objects such as ball bearings. The use of patterned illuminators properly disposed in relation to a polished part under inspection allows small surface imperfections such as scratches and pits to become visible against the normal surface background. The use of carefully engineered illuminators facilitates advantageous defect-site scattering from generally dark field sources. The patterned nature of the illuminators defined by this invention allows the complete surface of three-dimensional parts to be effectively highlighted using dark field illumination fields.

Abstract: An apparatus for inspecting defects in a circuit pattern is described. The apparatus includes at least one laser unit for radiating a laser beam onto a first end of a circuit pattern formed on a substrate. The apparatus also includes a capacitor sensor disposed opposite a second end of the circuit pattern, which is connected to the first end of the circuit pattern through a via hole, in a non-contact manner. The apparatus also includes a voltage source connected to the capacitor sensor and configured to apply a voltage. The apparatus also includes a measurement unit connected to the capacitor sensor and configured to detect variation in impedance generated in the capacitor sensor.

Abstract: An illumination device for use with a product inspection machine inspecting products according to at least one characteristic using pulsed illumination for inspection in two wavelengths. The invention includes a plurality of arrays of semiconductor light sources from which a wavelength may be selected, either specifically or by combination of specific semiconductor light sources, for impinging on passing product and at least one array of semiconductor light sources from which the same wavelength may be selected and which provides intensity equal to the plurality of arrays impinging on a background surface for detection and comparison.

Abstract: A calibration and part inspection method for the inspection of ball grid array, BGA, devices. Two cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A first camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into a second camera and a second additional mirror or prism located below the bottom plane of the reticle reflects the opposite side view of the reticle pattern mask through prisms or mirrors into a second camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution.

Abstract: An objective lens system opposing an imaged surface of semiconductor device, and imaging lens system arranged between this objective lens system and image sensor is used to inspect a lower component of the semiconductor device without being influence by an upper component. The F value of objective lens system is made into 1.5 or less, and an imaged surface is photographed and inspected. The imaging lens system also has several lenses with different focal distances. According to the desired magnification, a predetermined lens among the plurality of lenses is arranged in the predetermined location of an optical axis, and the other lenses are evacuated from an optical axis.

Abstract: An apparatus for three dimensional inspection of an electronic part which has a camera and illuminator for imaging a first view of the electronic part. An optical element is positioned to reflect a different view of the electronic part into the camera, and the camera thus provides an image of the electronic part having differing views of the electronic part. An image processor applies calculations on the differing views to calculate a three dimensional position of at least one portion of the electronic part.

Abstract: An illumination device for use with a product inspection machine inspecting products according to at least one characteristic using pulsed illumination for inspection in two wavelengths. The invention includes a plurality of arrays of semiconductor light sources from which a wavelength may be selected, either specifically or by combination of specific semiconductor light sources, for impinging on passing product and at least one array of semiconductor light sources from which the same wavelength may be selected and which provides intensity equal to the plurality of arrays impinging on a background surface for detection and comparison.

Abstract: For generating an image for inspection of a substrate, a camera is provided above this substrate with an optical axis orienting downward and a plurality of multi-colored light emitting members are set around the optical axis of the camera so as to be within a specified angular range with respect to a target area on the substrate. The camera is operated to generate an image of the target area for inspection while switched-on conditions of these light emitting members are being controlled such that the colors and angles of light illuminating this target area are varied according to a specified kind of the purpose of this inspection.

Abstract: A method and system are provided for inspecting electronic components mounted on printed circuit boards utilizing both 3-D and 2-D data associated with the components and the background on which they are mounted on the printed circuit board. Preferably, a 3-D scanner in the form of a solid state dual detector laser images the components and solder paste on the printed circuit board to obtain the 3-D and 2-D data. Then, a high speed image processor processes the 3-D data to find the locations of the leads and the solder paste. Then, the high speed image processor processes the 2-D data together with the locations of the leads and the solder paste to distinguish the leads from the solder paste. The high speed image processor may calculate centroids of feet of the leads, average height of the feet and border violation percentage of the solder paste.

Abstract: The invention provides a method and an apparatus for determining a height of a point on a wire loop. A height gauge device is positioned over the point on the wire loop to be measured. Incident light is projected from the height gauge device for illuminating the point. The height gauge device receives reflected light produced from the incident light and a processor coupled to the height gauge device determines from a characteristic of the reflected light the height of the said point relative to a reference surface. Further methods and apparatus for finding a position and height of a highest point on the wire loop are also provided.

Abstract: A three-dimensional optical inspection system reconstructs a three-dimensional image of the shape of the surface of an at least partially specular object resident on a printed circuit board by capturing two or more two-dimensional images of the object under different illumination configurations. The diffuse reflection, as well as the specular reflection can be used to reconstruct the three-dimensional image using any reconstruction method, such as photometric stereo. The different illumination configurations can be achieved using an illumination source including light-emitting elements arranged in concentric circular arrays, in which each of the circular arrays is divided into sections. Each section is independently controlled to selectively activate the sections to illuminate the object in a pre-established illumination pattern.

Abstract: Manufacturing lines include inspection systems for monitoring the quality of parts produced. Manufacturing lines for making semiconductor devices generally inspect each fabricated part. The information obtained is used to fix manufacturing problems in the semiconductor fab plant. A machine-vision system for imaging an object having a first side and a second side includes an imager, and an optics apparatus that images two or more views of the first side of the object and images two or more views of the second side of the object. The two or more views of the first side and the second side of the object are each from different angles. The object includes at least one major surface. A divider background surface is placed near the at least one major surface of the object to obtain separate images of features of the object on the first side of the object and features of the object on the second side of the object.

Abstract: A first inspection functionality is provided to obtain information about a first attribute at a conductor location on an electrical circuit. A second inspection functionality is provided to obtain information about a second attribute at the conductor location. A combination of first attribute information and second attribute information is analyzed to determine an inspection attribute of the conductor at the conductor location. Attribute information may relate to one or more of: reflectance, fluorescence or height.

Abstract: A method and system create a geometric object model for use in machine vision inspection. A pixel image representation of an object is acquired. Based on this pixel image representation, part models for the parts of the object are generated. Each part model corresponds to a different part of the object. From the part models of the object, a model for the entire object can be created. Using this created object model, a test inspection is performed on a set of test images, and each of the test images is associated with a set of known inspection measurements. The test inspection produces a set of testing inspection measurements. If the test inspection yields satisfactory performance, the object models created are stored.

Abstract: A machine-vision system and method are described for simultaneously imaging different sides of an object. The system includes an imager and optics that images two or more views of the first side of the object and of the second side. The views of the first side and the views of the second side of the object are each from different angles. A divider background surface is placed near a major surface of the object to obtain separate images of features of the object on the first side of the object and on the second side. In one embodiment, the divider diffuses light to back light the features on the object on the first side and back light the features on the second side of the object. In some embodiments, the information obtained is used to fix manufacturing problems in a semiconductor fabrication plant.

Abstract: An inspection method for cream solder for determining whether or not the shape of the cream solder is appropriate based on information on the height of the cream solder by irradiating light from substantially besides in two directions opposing each other through a lighting means to the cream solder so as to obtain at least two images and obtaining a difference between the obtained images.

Abstract: A bonding apparatus that includes a bonding tool through which a wire passes and which performs bonding on a workpiece, a position detection camera which takes images of the workpiece, a reference member which is disposed in a specified position, and an optical assembly which conducts the image of the tool and reference member to the position detection camera. A lens used in the position detection camera and a lens installed in the optical assembly are arranged so that such lenses construct an afocal optical system.

Abstract: A bonding method and apparatus that uses a position detection camera which takes images of a workpiece and a light path conversion device which directs the image of an area near the lower end of a capillary to the position detection camera. The image acquired by the position detection camera is processed, and an execution is made so as, for instance, to measure the diameter of a ball formed on a wire extending from the lower end of the capillary, to measure the tail length extending from the lower end of the capillary, to measure the ball position from the undersurface of the capillary, to observe the bending of the tail of the wire, to inspect the external appearance of the capillary, and to measure the amplitude of vibration of the capillary when an ultrasonic vibration is applied to the capillary.

Abstract: A ball-arranging substrate comprising a substrate with a main surface, a plurality of ball-arranging holes formed on the main surface for sucking and holding minute electroconductive balls at the locations corresponding to those of electrodes formed on a semiconductor device or a printed circuit board, wherein when light illuminates the ball-arranging surface to allow optical recognition of the arrangement of the minute electroconductive balls by means of the light reflected by the minute electroconductive balls and by the main surface, the wave length of the light of the light source is set in the range of 300 to 900 nm, and the reflectivity is made not more than 50% based on the light source. A reflective mirror should be provided on the rear surface of the substrate opposite to the light source, in the case when the substrate is transparent to the irradiated light.

Abstract: A semiconductor device lead inspection apparatus and method are provided for capturing images of the semiconductor edges and leads along two optical axes which have different directions in a plane perpendicular to the semiconductor device edge. One image is a direct backlit image of the device. A second image taken along a direction corresponding to a second optical axis is reflected into a direction corresponding to the first optical axis. By forming two images it is possible to locate the leads of the semiconductor device in three dimensions.

Abstract: An illuminating and optical apparatus for inspecting soldering of an inspecting part on a PCB includes an illuminating and optical apparatus collecting light emitted by first and second illuminating units. The first and second illuminating units each includes lamps arranged in rows around a view axis of large and small view cameras at a predetermined angle, wherein the large and small view cameras draw sufficient light reflected by the inspecting part and obtain different view sizes of images in accordance with the sizes of the inspecting part. An illuminating and optical apparatus collects light emitted by the first and second illuminating units.

Abstract: A pick and place machine is disclosed which includes an on-head linescan sensor, and at least one additional optical sensor. The at least one additional sensor can be an off-head linescan sensor, an off-head or on-head 2D camera, an on-head shadow (e.g. one which shadows or images the profile of a component onto a detector, such as a LaserAlign®) sensor, an off-head or on-head coplanarity sensor, or an on-head or off-head fiducial camera. The additional optical sensor is disposed to provide essential placement information in the form of orientation information or inspection information. Combinations of the aforementioned additional sensor can also be used in embodiments of the present invention of the pick-and-place machine. The present invention is particularly useful with multi-head component placement machines, although it is usable with single head machines as well.

Abstract: A method and apparatus is disclosed for non-contact, on-line inspection of objects including a ball grid array package by means of a shadow moiré technique combined with a novel flash phase-shifting method. The grid pitch size, ball height, ball diameter, missing ball, coplananity can be determined or measured within several seconds. The apparatus includes a camera for viewing the object, a plurality of light sources arranged in a line for illuminating the object to be inspected, a frame grabber for capturing images of the object, an I/O adapter card for controlling the light sources and a personal computer for data processing. The individual components are integrated into system which provides a three dimensional map which is obtained quantitatively using a novel algorithm. The system can provide coplananity data, as well as data relating to grid pitch, ball height, ball diameter, and missing ball information.

Abstract: A method and apparatus are disclosed for refining a rough geometric description (GD) and a rough pose of an object having extensions. The invention locates anchor points within an image of the object and uses the anchor points to align in at least one dimension the rough GD. In one embodiment, the anchor points are the tips of the extensions of the object; the rough GD of the object is then aligned along the angular orientation indicated by the tips. Thereafter, other dimensions of the rough GD and the rough pose are measured, measuring the dimensions having less unknowns first. The rough GD and the rough pose are then updated to provide the refined GD and refined pose. For one measurement, an extent of a region is measured using the expected area of region to threshold the region and segment it from the remainder of the image before measuring the extent of the region. An application of refining a GD of a leaded object is disclosed.

Abstract: A device for exposure of the peripheral area of a film circuit board in which the edge of the copper foil can be exactly determined and the position of the irradiation area can be controlled with high precision is obtained in that a resist (R) in the peripheral area of a conductive foil located on a film circuit board (TP) is irradiated with exposure light and is thus exposed, while the film circuit board (TP) in which there are perforation holes (PH) with a stipulated pitch to one another, is transported, in that an optical detector (4) is used as the sensor for determining the edge part of the conductive foil, in that the sensor light emitted onto the edge part of the conductive foil is received by a light receiving part (4b), in that the optical detector (4b) is subjected to motion control in the direction which orthogonally intersects the transport direction, such that the amount of light reception is constant and in that the area irradiated with the exposure light is moved by the same amount as the optic