Abstract: An inspection beam such as laser beam is scanned two-dimensionally on an inspection surface of a circuit board with a plurality of lands while allowing its reflected beam from the inspection surface to be received by a beam receiving section. The beam receiving section is formed by a device, such as a semiconductor position sensitive detector, which is capable of producing an output which varies according to a reflected beam brightness and reflected beam receiving position (which reflects the height level of the reflection surface). On the basis of the output of the beam receiving section, reflected beam brightness information and height level information at respective positions on the inspection surface are prepared. From the reflected beam brightness information at the respective positions, an existing region of each of the lands on the inspection surface can be fixed.

Abstract: A solder testing apparatus comprising image processing means for performing image processing on an image of an appearance of a soldered portion to identify shape characterizing amounts for the soldered portion; and defect determining means for performing good/bad determination on the soldered portion from data derived by the image processing means and data from test parameter storing means for storing shape characterizing amounts at design time, wherein tested-object standard shape estimating means is included for extracting shape characterizing amounts of a non-defective soldered portion by statistically processing shape characterizing amounts for soldered portions identified by the image processing means, and defect determining parameters stored in the test parameter storing means are updated based on standard shape values from the tested-object standard shape estimating means, so that a highly reliable test is realized by setting defect determining parameters based on actual shapes and dimensions of leads

Abstract: A method and an apparatus for the measurement and inspection of integrated circuit. Such an apparatus includes a camera for sensing an image of the integrated circuit (IC), an oblique light source, and a reflector. The camera has an optical axis passing through the IC normal to the plane of the IC. The oblique light source radiates light on the IC obliquely to the plane of the IC such that at least a portion of the oblique light source is positioned on one side of the optical axis. The reflector is positioned on the opposite side of the optical axis relative the portion of the oblique light source for reflecting light that crosses the optical axis from the oblique light source to the camera, such that at least a portion of the IC interposes between the portion of the oblique light source and the reflector. As a result, the shape of that portion of the IC is imaged on the camera by backlighting. The leads on the IC can be inspected in this manner.

Abstract: A variable intensity lighting system for use with a machine vision apparatus for capturing high contrast images of articles to be inspected, such as semiconductor packages, includes an LED or optical fiber element and flash lamp array configured in multiple segments which are operable to be controlled as to light output intensity by a programmable intensity control circuit operably connected to a microprocessor. The intensity control circuit includes multiple digital potentiometers operable to control selected segments of the lighting array. The control circuit is adapted to control up to 64 segments of the lighting array individually at 64 incremental intensity levels, respectively. The control circuit may include a light failure module to detect a segment failure or a reversed connection.

Abstract: Disclosed are apparatus and method for inspecting leads of an IC placed on a setting table. The apparatus comprises an optical image recognition part for scanning the setting table, a device for moving the recognition palt with respect to the setting table, a position detection palt for detecting a position of the recognition part on the basis of an output signal thereof, and a control part for controlling the device on the basis of a signal of the position detection pait so that the recognition part is positioned at an optimal position above the setting table. The setting table is scanned stepwise, and the optimal position is a position that the value of the output signal is maximized. The recognition pall is positioned at the optimal position. The arrangement and the status of the leads of the IC are inspected automatically in a short period of time, and productivity increases.

Abstract: An inspection system and method uses a first illumination apparatus to illuminate one or more features, such as solder balls on an electronic component or other protruding surfaces or features on an object being inspected. Once the object being inspected is illuminated, a first reflected image of the plurality of features is captured by an illumination detection device. The first reflected image is stored in an image buffer. The object being inspected is then illuminated by at least one additional illumination apparatus. Each additional illumination apparatus is selected so that it differs from the other illumination apparatuses in either geometrical arrangement, degree of diffusion or illumination characteristic. An additional reflected image of the object is then captured by the illumination detection device while the object is illuminated by each additional illumination apparatus. Each additional reflected image is also stored in an image buffer.

Abstract: The present invention provides method and apparatus for determining lead integrity of IC devices characterized by an inspection arrangement which comprises optical elements for back lighting the leads disposed on either side of a trackway for the travel of the IC device thereon. The optical elements are arranged in such a fashion as to simultaneously produce a sharp backlit silhouette image of the leads protruding from either or both sides of the IC device. In accordance with the invention, means are provided for continuously and automatically feeding IC devices through an inspection station in the apparatus where an illumination source through the optical elements directs an intense light beam so that a sharp silhouette or backlit outline of the leads on both sides of the IC device is simultaneously obtained. A single camera is disposed to face the opposing direction of the illumination and optics to receive the silhouette or backlit outline of the IC device leads, as well as the top surface of the device.