Abstract: When a film is rewound, light is applied from light-emitting units to the film, and light that has passed through the film is detected by light-detecting units to detect a plurality of inclined defects in the film based on a change in the intensity of the light transmitted through the film. Slits oriented in the direction of the inclined defects are disposed in front of the light-emitting units and the light-detecting units. Detected signals outputted from the light-detecting units are transmitted to a processing device and processed thereby. The processing device processes the signals by approximating a maximum value array of extremal values of the signals in respective reference lengths of the film, with two functions in zones, and identifying a boundary between the zones as a position where a defect disappears.

Abstract: A device for controlling a continuous movement of an object with symmetry of revolution (1) comprises a conveyor (5) having two parallel guides, (6) and at least one pair of belts (8) stretched on the guides, between and on which these objects move at the level of the guides. These belts form an angle (11) between a top track and a lower track of each of the belts. The belts in the pair have the same direction of rotation around the guides, the same value of the measured angle (11) from the upper track to the lower track, and the same displacement speed. Preferably, the pair of belts consists of a single folded belt.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension, a presence of defects, and a thin film characteristic. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, flatness, a presence of defects, and a thin film characteristic. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Abstract: The inventive method and apparatus for detecting defects of a microscopic circuit pattern by imaging the pattern at high resolution comprises an objective lens for imaging the subject pattern, a laser illumination means for illuminating the pupil of the objective lens, means of diminishing the coherency of the laser illumination, an accumulative detector, and means of processing the signal detected by the detector. The method and apparatus are capable of imaging the subject pattern at high sensitivity and high speed based on the illumination by a short wavelength, which is indispensable for the enhancement of resolution, particularly based on a laser light source which is advantageous for practicing, with a resulting image being the same or better in quality as compared with an image resulting from the ordinary discharge tube illumination, whereby it is possible to detect microscopic defects at high sensitivity.

Abstract: An optical inspection device (1) that detects holes in an object to be inspected (11), comprising: a light source (41) that illuminates the object to be inspected by emitting illumination light from light-emitting points (41a) that are arranged in a linear or planar pattern; a fluorescent member (61), disposed on the opposite side from the light sources across the object to be inspected, having an incident surface (61A) on which the part of the illumination light emitted from the light source that passes through the holes in the object to be inspected falls incident, and a detection surface (61B) from which fluorescent light that is generated according to the incidence of the illumination light is emitted; and a photodetector (71) that detects fluorescent light that is emitted from the detection surface of the fluorescent member.

Abstract: A source of ultrasound waves or energy is directed at the wafer that is to be inspected in a direction that is essentially perpendicular with the surface of the wafer. The ultrasonic waves are intercepted and analyzed after these waves have passed through the wafer that is being inspected. From this analysis and comparing the captured waves or ultrasonic energy with the emitted ultrasonic waves, conclusions can be drawn on defects and other irregularities that are present in the medium, that is the wafer, through which the ultrasonic waves have passed.

Abstract: A method and apparatus for characterizing pixels in an image of an object surface by providing at least two images of the surface wherein each pixel has a unique location common to all of the images; comparing each pixel value at each location to an identification matrix; and identifying the region in which each pixel is located based on the comparison. The matrix can comprise a plurality of non-pixel values representing one or more regions, each of the regions defining at least one surface attribute. One embodiment provides at least two references images of a template using the same technique used to obtain each image of the surface, and creating the matrix using the reference images. Providing at least two images comprises providing a first and second image, wherein the surface is illuminated using a first and second source of illumination, or providing the first using a source of illumination and providing the second from the first.

Abstract: Detecting a defect in the sample is accomplished by photoacousticly exciting acoustic longitudinal, surface Rayleigh, and shear waves at a first point on a near surface of a sample; photoacoustically detecting acoustic waves at a second point spaced from the excitation first point for intercepting shear waves reflected from the far surface of the sample at approximately the angle of maximum shear wave propagation; and detecting the energy level of the intercepted reflected shear waves representative of the flaw in the sample.

Abstract: A method of inspecting a pattern formed on a substrate, comprising the steps of emitting an ultraviolet laser beam from a light source, polarizing the ultraviolet laser beam, scanning the polarized ultraviolet laser beam on a pupil of an objective lens, illuminating a sample with the polarized ultraviolet laser beam after the polarized ultraviolet light beam has passed through the objective lens, analyzing light reflected from the sample as a result of the illuminating step after the reflected light has passed through the objective lens, detecting an image of the sample formed by the analyzed light with a time delay integration sensor, outputting signals corresponding to the detected image of the sample from the time delay integration sensor in parallel, and processing the parallel signals outputted from the time delay integration sensor to detect a defect of a pattern on the sample.

Abstract: In an inspection system for planar objects having periodic structures, programmable optical Fourier filtering in the focal plane of a telecentric lens system is used to directly identify physical phenomena indicative of non-periodic defects. Lens assemblies and a coherent optical source are used to generate and observe a spatial Fourier transform of a periodic structure in the Fourier plane. Optical Fourier filtering (OFF) is performed in the focal plane using an electrically programmable and electrically alignable spatial light modulator. The spatial light modulator with high signal to noise ratio is electrically reconfigurable according to a feedback-driven, filter construction and alignment algorithm. The OFF enhances any non-periodic components present in the Fourier plane and final image plane of the object. A system having a plurality of inspection channels provides high-throughput inspection of objects with small non-periodic defects while maintaining high detection sensitivity.

Abstract: An apparatus for determining the fitness of a bank note by sensing the bank note transported along a transport path by a transport device. The apparatus includes a plurality of identical sensor and illumination units positioned along each side of the transport path whereby the sensor and illumination units are focused at a single predetermined section of the transport path.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension and a presence of defects. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Abstract: Laser lights having a plurality of wavelengths from DUV to VUV range are used to inspect defects of a pattern at high speeds and in a high sensitivity using high light-output lasers, while solving a temporal/spatial coherence problem caused by using lasers as light source. This reduces the laser light temporal/spatial coherence. Further, to correct chromatic aberration caused by illumination with VUV and DUD lights, the lights of the VUV and DUV wavelengths are arranged in a coaxial illumination relation. The chromatic aberration left uncorrected is detected such that a detection optical path is branched into two optical path systems corresponding to respective wavelengths and an image sensor is placed on an image plane of each wavelength.

Abstract: According to the present invention, there is disclosed a defect detection apparatus comprising an illuminating unit which irradiates an inspection object with illuminating light, and an image pickup unit which picks up an image of diffracted light from the inspection object to perform defect inspection of the inspection object from image data picked up by the image pickup unit, the apparatus further comprising a diffraction angle calculation unit to obtain the diffraction angle of the illuminating light with respect to the inspection object, which is optimum for picking up the image of the diffracted light, based on design information of the inspection object, and an illuminating setting unit which sets the angle of incidence of the illuminating unit to the diffraction angle calculated by the diffraction angle calculation unit.

Abstract: A method and apparatus for parallel processing of data without the need for cross-communication or synchronization between processing nodes is provided. The system is especially suitable for use in a wafer inspection system for the semiconductor industry. Embodiments include scanning a small area of the wafer, and distributing pixel data among a plurality of processing nodes, each of which accept and process an optimal amount of pixel data independently of the other processing nodes, thereby enabling increased throughput without increasing system complexity.

Abstract: A surface inspection apparatus is constructed of an illumination unit for irradiating a wafer with illumination radiation for inspection, and a radiation receiving unit having a CCD imaging device for detecting an image of the wafer by converging regularly reflected radiation from the wafer. The wafer surface is inspected based on the image detected by the CCD imaging device. An incident angle i and a wavelength &lgr; of the use-for-inspection illumination radiation with which the illumination unit irradiates the wafer, are set to satisfy the following conditional formula: &lgr;/(sin i+1)≦p  (1) where p is a pattern repetitive pitch.

Abstract: A surface examining apparatus irradiates an examinatorial light from a projector on a examined body that runs in a Z-direction. The projector is arranged at a distance from the surface of the examined body in a Y-direction orthogonal to the surface thereof and arranged inwardly of outer ends of the examined body in the width direction thereof in the X-direction orthogonal to the Z-direction and the Y-direction, and which detects the light that has passed through the examined body thereby to examine surface defects of the examined body. A light shielding unit is provided, which includes a light shielding member arranged between the projector and the examined body and shields the examinatorial light that is going to travel outwards from the outer end in the width direction of the examined body, and a moving unit that moves the light shielding member in the X-direction and in the Y-direction.

Abstract: There is provided a mask pattern inspection system for detecting a defect candidate of a mask pattern and determining whether or not the defect candidate indicates a true defect. An image-recording section records a defect-detecting image obtained by a confocal microscope, and a defect candidate-detecting section extracts only a G signal from RGB signals included in the defect-detecting image to thereby detect a defect candidate. This makes it possible to detect the defect candidate from the defect-detecting image with accuracy. Further, a pattern data-processing section carries out an FIR filtering process on pattern data used for designing the mask to convert the pattern data to inspecting image data, and compares the defect-detecting image and the inspecting image data with each other.

Abstract: A laser beam L from a laser 2 is introduced from an introducing surface into a transparent substrate 1 by using mirrors 31 and 32. The laser beam introduced through the transparent substrate 1 repeats a total reflection on the surfaces (main surfaces and end surfaces) of the transparent substrate 1 and enters a state in which the laser beam is almost confined in the substrate 1. When an ununiform portion such as a scratch exists on the surface of the transparent substrate 1, however, total reflecting conditions are not satisfied and the light leaks out of the ununiform portion. The leaked light is formed as an image on a CCD 6 by a lens system 7 and an image process is executed by an image processing apparatus 12. In a detected image, the ununiform portion in which the scratch or the like exists is brightly seen in a linear or a dot form in a black background, so that the ununiform portion such as a very fine scratch can be detected.

Abstract: An inspection tool or inspection system can be utilized to determine whether the appropriate pattern is on a reticle. The reticle can be associated with EUV lithographic tools. The system utilizes at least two wavelengths of light. The light is directed to the reticle at the at least two wavelengths of light and detected by a detector. The image associated with the first wavelength is subtracted from or otherwise processed with respect to the image associated with the second wavelength to improve contrast ratio.

Abstract: An automated optical inspection system with improved accuracy achieved by reducing the negative effects of extraneous light. The system includes a light trap behind a two-way mirror.

Abstract: The invention relates to a device for wrapping bodies, in particular harvested material bales (1) of hay, straw or wilted green crop, at least one wrapping material web being drawn off from a wrapping material supply (8) during the wrapping process and a means being provided which signals a tear in the wrapping material web or that the wrapping material supply (8) has been used up. In order to improve the device and to develop a simple and in particular cheaper solution, it is proposed according to the invention that at least one optical sensor (14, 15), ultrasonic sensor or sensor for electromagnetic waves/fields of different frequency ranges be associated with the wrapping material web portion (18) between wrapping material supply (8) and the body (1) and disposed stationarily.

Abstract: A defect inspection apparatus for inspecting a fine circuit pattern with high resolution to detect a defective portion is constructed to have an objective lens for detecting an image of a sample, a laser illumination unit for illuminating the sample through the objective lens, a unit for reducing the coherence of the laser illumination, an accumulation type detector, and a unit for processing the detected image signal.

Abstract: An image reading method and apparatus allow reading light to be incident on a film to obtain projected light and read the thus obtained projected light photoelectrically to perform reading of an image recorded on the film. In the method and apparatus, at least one of a scratch and a foreign matter on the film is detected based on two respective reading results obtained using types of reading light in different states of diffusion such as a parallel light and a perfectly diffused light from two light sources, respectively. The method and apparatus are capable of surely detecting a scratch on the film, or dirt or foreign matter adhered to the film and correcting it as required, whereupon high-quality images having no image deterioration due to the scratch, the dirt or foreign matter can be reproduced in a consistent manner.

Abstract: Multiple scans of the same object are obtained, where for any given line on the object to be scanned, the angle of the illumination is different for each scan. The different scans are obtained from different rows of photosensors that are separated. Because the angles of illumination are different, the resulting shadows in each scan are different. The multiple scans may be combined into a single composite color image. In a composite image, a dust particle may generate a series of overlapping shadows, where each shadow is a different color. Searching the composite image for the unique pattern of colors may identify artifacts or defects. Alternatively, the data for one scanned image may be compared to the data for another scanned image, and any differences may be due to shadows, which may indicate defects.

Abstract: There is disclosed a web of record members of the composite label web, tag and linerless types with cracks or fissures through the webs so that the position of the web can be detected by an optical detector. Apparatus can be used to convert the web into more usable form which includes for provision of optically detectable cracks or fissures in the web. These cracks are made by crushing the web locally between one or more crushing cutters and a back-up roll which cooperates with zero clearance. The method and apparatus can produce a reliably detectable web at low cost. The optical detector includes a source of light and a bicell detector between which the web with the cracks or fissures passes. The bicell detector produces a first output signal representing the amount of light impinging on a first portion of the detector and a second output signal representing the amount of light impinging on a second portion of the detector.

Abstract: In order to detect pin-holes or tears in a foil (16), during deformation of the foil (16), the transmission of light through the foil is measured continuously by means of at least one light source (22) situated on one side of the foil (16) and at least one of the light sensors (24) on the other side of the foil (16). The light source (22) is integrated in a shaping-punch (14) and the light sensors (24) are situated in a die (12) which is employed along with the punch (14). The pin-hole detector (10) enables pin-holes or tears formed during the deformation of the foil to be detected on-line in a single shaping step closely resembling actual working practice.

Abstract: A device and associated method useful for determining whether a disk has a chipped edge. The preferred device includes a laser that radiates a laser beam to the disk in the vicinity of its edge. The preferred device also includes a radiation detector for detecting electromagnetic radiation from the laser after the radiation has been transmitted, reflected, retracted or scattered by the disk. A chip in the vicinity of the edge of the disk will direct the electromagnetic radiation differently than an intact disk edge. Therefore, the radiation detector can utilize changes in the detected electromagnetic radiation in order to determine whether the edge of the disk is intact or whether it has a defect, such as an edge chip.

Abstract: A currency note condition recognition apparatus and method uses a programmed microelectronic CPU to execute program instructions stored in a PROM to read in pixel data from an optical imaging section, including LEDs and photodiodes for generating signals which can be converted to a first image of a currency note being transported along the path of travel. The CPU receives position and skew data detected by external sensors for sensing the position and skew of the note.

Abstract: A testing apparatus for an opening state of a hole in a semiconductor device includes a laser light radiating system. The semiconductor device has the conductive layer and the insulating layer formed on the conductive layer, and the hole is formed in the insulating layer at aim to reach the conductive layer. The laser light radiating system radiates to a hole, a laser light having a wave length determined based on a work function of a material of a conductive layer and a work function of a material of an insulating layer. A detector detects photoelectrons emitted through a portion of the hole to which the laser light is irradiated. A charge supplementing mechanism supplies electrons to the conductive layer.

Abstract: A method of reviewing classification data and image data for defects detected in a series of semiconductor manufacturing processes. An inspection wafer is selected from a production lot of wafers and is inspected after the completion of each of the series of semiconductor manufacturing processes. The classification data for each defect is sent to a defect management system and an image for selected defects is sent to an image storage system. Identification data is sent to the defect management system and the image storage system. The image storage system sends a cookie to the defect management system allowing the defect management system to identify defects having an image. A operator controlled review station allows an operator to select defects for review that have an image available for review.