Noble Metal (gold, Silver, Ruthenium, Rhodium, Palladium, Osmium, Iridium, Platinum) Patents (Class 252/514)
  • Patent number: 12243950
    Abstract: A paste (32) for use in metallization of a solar cell (12) includes an organic vehicle (44) and a mixture of copper-containing particles (46), metal-oxide-containing nanoparticles (50), and secondary oxide particles (52) different from the metal-oxide-containing nanoparticles (50). The secondary oxide particles (52) include particles (42) of a metal oxide and a metal of the metal oxide capable of reducing at least some of the metal-oxide-containing nanoparticles (50) to metal when heated. The organic vehicle (44) is capable of reducing the metal oxide of the secondary oxide particles (52) upon decomposition of the organic vehicle (44). A paste (32) includes a mixture of particles (42) including metallic copper particles (46), nanoparticles (50), and metal oxide particles (52) in the organic vehicle (44). The nanoparticles (50) include at least one oxide of nickel, copper, cobalt, manganese, and lead.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: March 4, 2025
    Assignee: Bert Thin Films, Inc.
    Inventors: Thad Druffel, Ruvini Dharmadasa
  • Patent number: 12194541
    Abstract: A method for producing a silver powder enables a low resistance when the silver powder is made into a paste to form an electrode without changing the type of surface treatment agent. A silver powder, which enables an electrode to have a low resistance when the silver powder is made into a paste to form the electrode, is obtained by adding an O/W-type emulsion containing micelles of a surface treatment agent having a volume-based cumulative 50% particle diameter D50 obtained by a laser diffraction particle size distribution analysis of 1.5 ?m or less to a slurry of a silver powder. The surface of the silver powder is coated with the surface treatment agent. The surface of the silver powder is further coated with a polyvalent carboxylic acid in a step of producing the silver powder.
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: January 14, 2025
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventor: Satoko Sugawara
  • Patent number: 12187870
    Abstract: In one or more embodiments, the present invention is directed to an electrically conductive polymer composition comprising a conductive metal filler material comprising a plurality of metal particles and one or more carbon-based filler material substantially homogenously dispersed throughout a polymer matrix, wherein the aspect ratio of the one or more carbon-based filler material is at least ten times greater than the aspect ratio of the conductive metal filler material comprising a plurality of metal particles. In one or more embodiment, the carbon-based filler material will comprise at least one of carbon nanotubes, multi-walled carbon nanotubes and edge-functionalized graphene.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: January 7, 2025
    Assignee: The University of Akron
    Inventors: Yu Zhu, Bryan D. Vogt, Clinton J. Taubert, Kun Chen
  • Patent number: 12187908
    Abstract: Resistive inks and method of making resistive inks that utilize a phthalonitrile resin as a curable component in the inks are disclosed. In one example, a resistive ink is provided. The resistive ink comprises a solvent, a thermally-curable phthalonitrile-based resin dissolved in the solvent, and one or more conductive fillers. In some examples, the phthalonitrile resin can comprise a B-staged material.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: January 7, 2025
    Assignee: The Boeing Company
    Inventors: Ashley M. Dustin, Xin Guan, Michael J. Ventuleth, Andrew P. Nowak, Shahriar Alam, Stella Fors
  • Patent number: 12171984
    Abstract: A catheter system may include a catheter lumen, first and second electrodes, and a sensor in communication with the first and second electrodes. The sensor may be configured to detect at least one of: a bulk volume of blood within a blood vessel and extravasation of a drug from the blood vessel into soft tissue adjacent the blood vessel. Other catheter systems may include a catheter lumen and a sensing chip coupled to the catheter lumen. The sensing chip may be configured to detect at least one of: a bulk volume of blood within a blood vessel and extravasation of a drug from the blood vessel into soft tissue adjacent the blood vessel.
    Type: Grant
    Filed: March 15, 2023
    Date of Patent: December 24, 2024
    Assignee: Becton, Dickinson and Company
    Inventors: Chun Keat Ooi, Jithendra Kumar
  • Patent number: 12170155
    Abstract: This application discloses a conductive paste, a preparation method thereof, and a preparation method of a conductive film using the conductive paste. The conductive paste comprises: a thermoplastic polyurethane, conductive particles, and an organic solvent, the thermoplastic polyurethane and the conductive particles being proportionally mixed in the organic solvent, and the thermoplastic polyurethane being dispersed in the form of particles among the conductive particles. A thermoplastic polyurethane elastomer is used as a binder, and the conductive particles are mixed in the organic solvent containing the thermoplastic polyurethane elastomer. The conductive particles ensure the conductivity of the conductive film prepared using the conductive paste. The thermoplastic polyurethane has strong adhesion ability, and is suitable for use on the surface of most substrates, to form a conductive film with good adhesion and no cracking.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: December 17, 2024
    Assignees: TSINGHUA UNIVERSITY, TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Jianshi Tang, Zhenxuan Zhao, Yuan Dai, Wangwei Lee, Zhengyou Zhang, Jian Yuan, Huaqiang Wu, He Qian, Bin Gao
  • Patent number: 12163072
    Abstract: The present invention relates to an electrically conductive composition comprising a) a resin selected from the group consisting of epoxy (meth)acrylate, (poly)ester (meth)acrylate, urethane (meth)acrylate, silicone (meth)acrylate, poly(iso)butylene (meth)acrylate, (poly)isoprene (meth)acrylate, polybutylene (meth)acrylate and mixtures thereof; b) an acrylic monomer; c) an electrically conductive filler; and d) a curing agent. The composition is particularly suitable for use in a solar cell and/or a photovoltaic module, especially in the photovoltaic module, wherein the solar cells are shingled.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: December 10, 2024
    Assignee: Henkel AG & Co. KGaA
    Inventors: Marc Estruga Ortiga, Liesbeth Theunissen, Anja Henckens
  • Patent number: 12161052
    Abstract: Solid-state devices including a layer of a superconductor material epitaxially grown on a crystalline high thermal conductivity substrate, the superconductor material being one of TiNx, ZrNx, HfNx, VNx, NbNx, TaNx, MoNx, WNx, or alloys thereof, and one or more layers of a semiconducting or insulating or metallic material epitaxially grown on the layer of superconductor material, the semiconducting or insulating material being one of a Group III N material or alloys thereof or a Group 4b N material or SiC or ScN or alloys thereof.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: December 3, 2024
    Assignees: Cornell University, Govmt. of U.S.—Navy
    Inventors: Rusen Yan, Guru Bahadur Singh Khalsa, John Wright, H. Grace Xing, Debdeep Jena, D. Scott Katzer, Neeraj Nepal, Brian P. Downey, David J. Meyer
  • Patent number: 12152156
    Abstract: Self-sintering conductive inks can be printed and self-sintered with a simple and low-cost process mechanized by exothermic alkali metal and water reaction, with enhanced electrical and thermal performance by liquid metal fusion. Such self-sintering conductive inks may include a gallium-alkali metal component and a water absorbing gel component. After patterning, the self-sintering inks, on reaching a designed trigger temperature (including room temperature), may metallize through a two-step process. Initially the gallium-alkali metal component activates and reacts with water released from the water absorbing gel component. Then the exothermic reaction between the water and the alkali element creates an intense and highly localized heating effect, which liquefies all metallic components in the ink and, on cooling, creates a solid metal trace or interconnect. Post cooling, the metal trace or interconnect cannot be reflowed without a significant temperature increase or other energetic input.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: November 26, 2024
    Assignee: Science Applications International Corporation
    Inventors: John Timler, Xingcun C. Tong
  • Patent number: 12138987
    Abstract: A plate-type heat exchanger, in which plates are stacked on top of each other as a stack and connected to each other in a sealed manner, fluid channels being formed between adjacent plates in each case, the stack of plates being divided into a first stack region and a second stack region, the first stack region forming an evaporator having first fluid channels and second fluid channels, and the second stack region forming an internal heat exchanger having third fluid channels and fourth fluid channels.
    Type: Grant
    Filed: August 12, 2022
    Date of Patent: November 12, 2024
    Assignee: Mahle International GmbH
    Inventor: Timo Feldkeller
  • Patent number: 12134720
    Abstract: One aspect of the present invention is an adhesive film comprising: a first adhesive layer; a metal layer; and a second adhesive layer in this order, wherein each of the first adhesive layer and the second adhesive layer comprises: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and the second conductive particle comprising a non-conductive core and a conductive layer provided on the core.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: November 5, 2024
    Assignee: Resonac Corporation
    Inventors: Tetsuyuki Shirakawa, Shinnosuke Iwamoto, Takahiro Fukui
  • Patent number: 12114403
    Abstract: The present invention is an apparatus for curing composites out-of-autoclave and out-of-oven. The apparatus is a multilayered composite tool for shaping and curing composites. It also contains a sealant layer and composite resistive heating element on the tool's surface. This heating element provides heat to the composites during cure while binding it to the other layers, eliminating the need for external heat from autoclave and oven sources. A ceramic layer is applied to the top surface of the resistive heater for electrical insulation, heater protection and to provide a smooth surface for finish for the composite components being processed with the invention. A method for using the invention is also described. Finally, one embodiment of the invention is presented where a negative composite tool is created to apply additional pressure to the composite component during curing. This additional pressure enables the current invention to more closely mimic autoclave composite processing.
    Type: Grant
    Filed: December 14, 2023
    Date of Patent: October 8, 2024
    Assignee: Mainstream Engineering Corporation
    Inventors: Anna P. Skinner, Kayla S. O'Neill, Rachna C. Igwe, Philip Cox, Justin J. Hill
  • Patent number: 12105018
    Abstract: Provided is a method capable of precisely, reproducibly and directly measuring, by an ellipsometry method, optical constants (refractive index n, extinction coefficient ?) of a fluorine-containing organosilicon compound thin film having a homogeneous surface with a small surface roughness and haze value. The method for measuring the optical constants of the thin film of the fluorine-containing organosilicon compound, includes: a step of forming the thin film of the fluorine-containing organosilicon compound on a base material, the thin film having, as surface roughnesses, an arithmetic mean roughness of smaller than 1.0 nm and a root mean square roughness of smaller than 2.0 nm, a haze value of smaller than 0.3 and a film thickness of 3 to 10 nm; and a step of measuring the optical constants of the thin film formed on the base material by the ellipsometry method.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: October 1, 2024
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Takashi Uchida
  • Patent number: 12103851
    Abstract: Graphene based sensor technology is described. Certain aspects relate to graphene containing ink formulations suitable for fabricating sensor electrodes via inkjet printing methods and to sensor electrodes produced from such ink formulations. Certain further aspects relate to processes for fabricating functionalized graphene materials for use in such ink formulations. Further still, certain aspects relate to sensors comprising graphene sensor electrodes.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: October 1, 2024
    Assignee: Altered Carbon Limited
    Inventors: Frazer John Barnes, Ali Rohafza
  • Patent number: 12096554
    Abstract: The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5.
    Type: Grant
    Filed: August 31, 2022
    Date of Patent: September 17, 2024
    Assignee: XEROX CORPORATION
    Inventors: Naveen Chopra, Barkev Keoshkerian, Chad Steven Smithson, Kurt I. Halfyard, Michelle N. Chretien
  • Patent number: 12084583
    Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: September 10, 2024
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Narahari Pujari, Jayaprakash Sundaramurthy, Siuli Sarkar, Ravindra M. Bhatkal
  • Patent number: 12077674
    Abstract: Disclosed herein are ink compositions for making a conductive palladium structure. For example, the ink composition can comprise a palladium salt and a complex of a complexing agent and a short chain carboxylic acid or salt thereof. In some embodiments, a second or third metal salt is included in the compositions. Also disclosed herein are methods for making and using such conductive ink compositions.
    Type: Grant
    Filed: May 14, 2023
    Date of Patent: September 3, 2024
    Assignee: ELECTRONINKS INCORPORATED
    Inventor: Steven Brett Walker
  • Patent number: 12065017
    Abstract: An interior trim of a motor vehicle. The interior trim includes a substrate with an outer side which faces an interior of the motor vehicle, a heating film with an outer surface which faces the interior of the motor vehicle, and a decorative layer. The heating film is attached to the outer surface of the substrate. The decorative layer is attached to the outer surface of the heating film. The heating film has no conducting paths and generates heat through an ohmic resistance of the heating film.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: August 20, 2024
    Assignee: K.L. KASCHIER- UND LAMINIER GMBH
    Inventor: Rembert Schulze Wehninck
  • Patent number: 12051771
    Abstract: A light emitting device includes a substrate, a reflective resin layer, and a light emitting element. The reflective resin layer is disposed on the substrate and contains a first reflective material and a first resin. The reflective resin layer including first flat part having a first thickness, a second flat part having a second thickness smaller than the first thickness, and a protruded part having a third thickness larger than the first thickness. The light emitting element is disposed on the second flat part of the reflective resin layer, with a portion of a lateral face of the protruded part of the reflective resin layer being in contact with a portion of a lateral face of the light emitting element.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: July 30, 2024
    Assignee: NICHIA CORPORATION
    Inventor: Satoshi Shirahama
  • Patent number: 12043778
    Abstract: A method for producing a quantum dot composition includes providing a preliminary quantum dot composition containing a quantum dot to which a ligand is bonded and a free ligand, providing an adsorbent to the preliminary quantum dot composition, adsorbing the free ligand to the adsorbent, and removing a modified adsorbent to which the free ligand is adsorbed to provide a purified quantum dot composition. A light emitting element including the purified quantum dot composition may have superior luminous efficiency.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: July 23, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Yunku Jung, Yunhyuk Ko, Minki Nam, Sooho Lee
  • Patent number: 12024471
    Abstract: The invention relates to A slurry composition, comprising: an inorganic powder; a dispersant; and a solvent wherein the dispersant is a block copolymer comprising at least one hydrophobic block A and at least one hydrophilic block B, and wherein the blocks A and B comprise repeating units represented by the following general formula (I) wherein R1 is selected from a hydrogen atom, a linear or branched alkyl group having 1 to 10 carbon atoms and a cyclic alkyl group having 4 to 6 carbon atoms, and wherein at least one carboxylic acid group or a salt thereof is covalently linked to the block copolymer.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: July 2, 2024
    Assignee: BYK-Chemie GmbH
    Inventors: Andreas Okkel, Guillaume Wojciech Jaunky, Yoshito Kitagawa
  • Patent number: 12020861
    Abstract: The subject matter described herein relates to laminated magnetic cores, methods of fabricating laminated magnetic cores, and electric devices using laminated magnetic cores. In some examples, a method for fabricating a laminated magnetic core includes depositing a first magnetic layer and depositing an interlamination layer of over the first magnetic layer. The interlamination layer comprises a partially conducting material having a conductivity greater than or equal to 10?4 S/cm and less than or equal to 105 S/cm. The method includes depositing a second magnetic layer over the interlamination layer. The method can include sequentially depositing additional interlamination layers and additional magnetic layers in an alternating fashion to produce the laminated magnetic core.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: June 25, 2024
    Assignee: The Trustees of the University of Pennsylvania
    Inventors: Mark George Allen, Min Soo Kim
  • Patent number: 12006258
    Abstract: The invention relates to the use of feldspar granules with a particular combination of oxide constituents in the manufacture of artificial agglomerate stone materials and to the agglomerate stone materials resulting thereof.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: June 11, 2024
    Assignee: Cosentino Research & Development, S.L.
    Inventors: Laura Perez Trigueros, Carmen Maria Montero Perez, Lucia Frattini, Javier Alvarez De Diego
  • Patent number: 12009459
    Abstract: A light-emitting device, a light-emitting assembly and an integrated circuit (IC) flip-chip are provided. The light-emitting device includes the IC flip-chip, a plurality of light-emitting diode (LED) flip-chips and a substrate. The IC flip-chip includes a plurality of flip-chip pads. The LED flip-chips are spaced apart from the IC flip-chip. The substrate carries the IC flip-chip and the LED flip-chips. The LED flip-chips have a plurality of electrodes, and the flip-chip pads of the IC flip-chip and the electrodes of the LED flip-chips are disposed on the substrate by way of soldering. The LED flip-chips are electrically coupled to the IC flip-chip through the substrate.
    Type: Grant
    Filed: August 1, 2021
    Date of Patent: June 11, 2024
    Assignee: LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chen-Hsiu Lin, Min-Hsi Chen
  • Patent number: 11982637
    Abstract: A gas sensor includes a biomaterial comprising electrically-conductive protein nanowires and at least two electrodes. The at least two electrodes are in operative arrangement with the protein nanowires and configured to provide a signal indicative of a change in conductivity of the protein nanowires. The conductivity of the protein nanowires is responsive to a change in concentration of a gas exposed to the biomaterial, such as ammonia, or to a change in relative humidity.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: May 14, 2024
    Assignee: University of Massachusetts
    Inventors: Jun Yao, Derek R. Lovley, Alexander Smith, Xiaomeng Liu
  • Patent number: 11984522
    Abstract: A backside contact solar cell has, on a first main surface of a crystal silicon substrate, a p-type region having a p-conductive type and an n-type region having an n-conductive type, and a positive electrode formed on the p-type region and a negative electrode formed on the n-type region, wherein the positive electrode includes a laminated conductor of a first electric conductor which is formed on the p-type region and which includes a group III element and a second electric conductor which is laminated on the first electric conductor and which has a lower content ratio of the group III element than the first electric conductor, and the negative electrode includes the second electric conductor formed on the n-type region. In this way, a low-cost backside contact solar cell has a high photoelectric conversion efficiency.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: May 14, 2024
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hiroshi Hashigami, Takenori Watabe, Hiroyuki Ohtsuka
  • Patent number: 11976200
    Abstract: In one inventive concept, an ink includes a precursor of a graphene analogue, a thickener, and a solvent. In another inventive concept, an ink includes a graphene analogue, a thickener, and a solvent. In yet another inventive concept, an aerogel includes a three-dimensional printed structure having printed features comprised of two dimensional sheets of a graphene analogue.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: May 7, 2024
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: Swetha Chandrasekaran, Marcus A. Worsley
  • Patent number: 11967440
    Abstract: A paste for a reference electrode according to an embodiment of the present disclosure includes silver chloride powder and a carbon-based conductive material. The carbon-based conductive material may include at least one compound selected from the group consisting of carbon nanotubes, graphite, graphene, and carbon black. The reference electrode formed of the paste for a reference electrode according to an exemplary embodiment may provide improved mechanical properties and electrochemical properties.
    Type: Grant
    Filed: May 3, 2022
    Date of Patent: April 23, 2024
    Assignee: I-SENS, INC.
    Inventors: Young Jea Kang, In Seok Jeong, Chul Hyun Park, Suk Joon Kim, Yoon Beom Park
  • Patent number: 11958772
    Abstract: A glass frit according to this application may include a composition of P2O5, V2O5, TeO2, CuO, ZnO, and BaO configured to replace a conventional lead glass composition and enable a low temperature calcination. A coefficient of thermal expansion (CTE) of the glass frit may be matched with that of a glass substrate. The composition may not include an inorganic filler or at least reduce a content of an inorganic filler to reduce or prevent separation and breakage and to improve durability. The glass frit may be used as a paste for a vacuum glass assembly.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: April 16, 2024
    Assignee: LG ELECTRONICS INC.
    Inventors: Wongyu Choi, Young Seok Kim
  • Patent number: 11948785
    Abstract: The present invention relates to electron multiplier apparatus of the type used in ion detectors. In one form, the invention is an electron multiplier having two or more electron emissive surfaces, each having a different composition so as to together limit or overcome an acute gain effect on the electron multiplier due to the exposure of the two or more electron emissive surfaces to water molecules. Alternatively, the multiplier may have a single electron emissive surface of mixed composition comprising a first composition component and a second composition component so as to together limit or overcome an acute gain effect on the electron multiplier due to the exposure of the electron emissive surface to water molecules.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: April 2, 2024
    Assignee: ADAPTAS SOLUTIONS PTY LTD
    Inventors: Aditya Wakhle, Russell Jurek, Kevin Hunter
  • Patent number: 11930565
    Abstract: The present invention is an apparatus for curing composites out-of-autoclave and out-of-oven. The apparatus is a multilayered composite tool for shaping and curing composites. It also contains a sealant layer and composite resistive heating element on the tool's surface. This heating element provides heat to the composites during cure while binding it to the other layers, eliminating the need for external heat from autoclave and oven sources. A ceramic layer is applied to the top surface of the resistive heater for electrical insulation, heater protection and to provide a smooth surface for finish for the composite components being processed with the invention. A method for using the invention is also described. Finally, one embodiment of the invention is presented where a negative composite tool is created to apply additional pressure to the composite component during curing. This additional pressure enables the current invention to more closely mimic autoclave composite processing.
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: March 12, 2024
    Assignee: Mainstream Engineering Corporation
    Inventors: Anna P. Skinner, Kayla S. O'Neill, Rachna C. Igwe, Philip Cox, Justin J. Hill
  • Patent number: 11921415
    Abstract: Provided is an optical coating for a projection screen, containing the following components in parts by weight: 2-15 parts of light-absorbing material, 5-20 parts of aluminum silver powder, 20-60 parts of acrylate oligomer, 10-45 parts of diluent, 0.5-15 parts of photoinitiator, and 0.1-6 parts of auxiliary agent; the light-absorbing material is one or more of carbon black, lamp black, iron black, and aniline black, and has an average particle size of 20-2000 nm; the aluminum silver powder is flake-shaped and has an average particle size of 3-10 ?m.
    Type: Grant
    Filed: January 18, 2020
    Date of Patent: March 5, 2024
    Assignee: APPOTRONICS CORPORATION LIMITED
    Inventors: Kejian Cui, Fei Hu, Yi Li
  • Patent number: 11901325
    Abstract: Provided is a multilayer substrate including laminated semiconductor substrates each having a penetrating hole (hereinafter referred to as through hole) having a plated film formed in the inner surface. The multilayer substrate has excellent conduction characteristics and can be manufactured at low cost. Conductive particles are selectively present at a position where the through holes face each other as viewed in a plan view of the multilayer substrate. The multilayer substrate has a connection structure in which the facing through holes are connected by the conductive particles, and the semiconductor substrates each having the through hole are bonded by an insulating adhesive.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: February 13, 2024
    Assignee: DEXERIALS CORPORATION
    Inventors: Seiichiro Shinohara, Yasushi Akutsu, Tomoyuki Ishimatsu
  • Patent number: 11891533
    Abstract: The present invention relates to a metal fine particle-containing ink containing metal fine particles (a) dispersed therein with a polymer B, in which the ink contains an ink solvent S; a difference ?SP (|SP(S)?SP(B)|) between solubility parameters of the solvent S and the polymer B is not more than 1.5 (cal/cm3)0.5 wherein SP(S) and SP(B) are a solubility parameter of the ink solvent S and a solubility parameter of the polymer B, respectively, as measured by a Fedors method; and the SP(B) is not less than 9.5 (cal/cm3)0.5 and not more than 10.5 (cal/cm3)0.5, as well as a method for producing a printed material, which includes the step of applying the metal fine particle-containing ink to a printing substrate to form a metal coating film of the ink on the printing substrate under ordinary-temperature environments, thereby obtaining the printed material.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: February 6, 2024
    Assignee: KAO CORPORATION
    Inventors: Tomohide Yoshida, Kosuke Muto
  • Patent number: 11884587
    Abstract: The present disclosure discloses a silicon-lithium-lead system, a conductive paste and a preparation method thereof, and belongs to the field of solar cells. A silicon-lead-lithium oxide frit includes the following composition: Sia—Pbb—Lic—(Bx—Aly—Biz)-Me-Of, where, 0<a<0.6, 0<b<0.8, 0<c<0.6, x+y+z=d, the x and the y are not zero at the same time, and the z is greater than zero. In the present disclosure, by adding B2O3 and Bi2O3, Al2O3 and Bi2O3, or B2O3, Al2O3 and Bi2O3 at the same time, the prepared frit has greater water resistance, and therefore, a solar cell prepared by using the conductive paste containing glass has good water resistance. In addition, the photoelectric conversion efficiency of the solar cell prepared by using the conductive paste prepared in the present disclosure can also be maintained, or even be slightly improved.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: January 30, 2024
    Assignee: JIANGSU RIYU PHOTOVOLTAIC NEW MATERIAL TECHNOLOGY CO. LTD
    Inventors: Li Yan, Rui Tian, Song Xu
  • Patent number: 11873403
    Abstract: Electric field grading compositions comprise a particulate cupric oxide dispersed in a matrix material, wherein the electric field grading composition has a threshold voltage, a breakdown voltage, and exhibits a reversible electric field switchable current-voltage relationship that substantially follows the equation: I=kV? wherein: I is current in amperes; k is a constant greater than 0; V is applied voltage in volts, wherein V is between the threshold voltage and the breakdown voltage, inclusive; and ? is a real number greater than 1. The electric field grading composition is useful for reducing electric field stress at a joint or termination of a conductive substrate. Articles including the electric field grading disposed on a surface of a conductive substrate are also disclosed.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: January 16, 2024
    Assignee: 3M Innovative Properties Company
    Inventor: Dipankar Ghosh
  • Patent number: 11873368
    Abstract: The present invention is directed to a two component (2K) composition comprising: (A) a first component comprising: a) at least one elastomer modified epoxy resin; b) at least one internally flexibilized epoxy resin which is characterized by a Shore D hardness, as measured with a durometer in accordance with ASTM D2240, of ?45 when cured with diethylene triamine; c) at least one chelate modified epoxy resin; and d) optionally at least one epoxy resin different from said resins a) to c); and, (B) a second component comprising: e) a curative which consists of at least one compound possessing at least two epoxide reactive groups per molecule, said curative being characterized by comprising at least one Mannich base.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: January 16, 2024
    Assignee: Henkel AG & Co. KGaA
    Inventors: Chunfu Chen, Leo Li, Chao Wang
  • Patent number: 11840647
    Abstract: The present invention refers to a recyclable conductive adhesive composition for LED packaging and preparation method thereof, and its recycling method and the obtained recycled conductive silver powder, wherein the recyclable conductive adhesive composition for LED packaging comprises epoxy resin, epoxy resin diluent, curing agent containing imine bond, amine curing agent, curing accelerator, wetting dispersant, coupling agent, defoamer and conductive silver powder. The epoxy curing agent containing imine bond adopted in the present invention can introduce the dynamic imine chemical bond into the epoxy resin matrix of the conductive adhesive by curing reaction, and can endow the epoxy resin matrix with degradable function by its imine bond's feature of occurring dynamic exchange reaction with amine solvent under heating condition, therefore the conductive silver powder in the conductive adhesive can be recycled and reused.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: December 12, 2023
    Assignee: Fujian Blue Ocean & Black Stone Technology Co., Ltd.
    Inventors: Wanshuang Liu, Yi Wei, Hebin Luo
  • Patent number: 11832655
    Abstract: The heating array includes first heating elements arranged in an elongated array, the first heating elements spanning from a first end to a second end of the elongated array, a midsection of each one of the first heating elements bowing concentrically outward from a radial centerline running longitudinally through the first end and the second end, the first heating elements being configured to flex concentrically inward when a hoop force is applied to sides of the elongated array.
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: December 5, 2023
    Assignee: Philip Morris USA Inc.
    Inventors: Olivier Greim, Felix Fernando, Charles Higgins
  • Patent number: 11819914
    Abstract: A silver powder containing: silver particles; and an adherent that is attached to surfaces of the silver particles and contains a metal oxide that has a melting point lower than a melting point of silver.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: November 21, 2023
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventor: Masanori Fujii
  • Patent number: 11817269
    Abstract: A multilayer capacitor includes a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body, wherein each of the first and second external electrodes includes a conductive resin layer including a resin, a plurality of metal particles, and a conductive connection portion connecting portions of the plurality of metal particles to each other, and in the conductive resin layer, a volume ratio of metal particles spaced apart from the conductive connection portion, among the plurality of metal particles, to a sum of the plurality of metal particles and the conductive connection portion is greater than 0% and less than 4.9%.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: November 14, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong Je Choi, Jung Min Kim, Ji Hye Han, Byung Woo Kang, Hye Jin Park, Sang Wook Lee, Bon Seok Koo, Jung Won Lee
  • Patent number: 11814544
    Abstract: The present disclosure relates to a substrate in which an antimicrobial coating agent including urushiol and an inorganic antimicrobial agent is fixed and coated onto the surface, and a method for antimicrobial coating on the surface of the substrate.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: November 14, 2023
    Assignee: LG CHEM, LTD.
    Inventors: Minsung Park, Soonhee Kang, Kwang Seoung Jeon
  • Patent number: 11817415
    Abstract: Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer includes sinterable metallic particles and an organic component, the precursor layer has a phase separation structure that is a sea-island structure or a co-continuous structure, and in a SEM surface observation image on at least one surface of the precursor layer, a maximum value among each diameter of the largest inscribed circle for a region occupied by each phase of the phase separation structure is 1 ?m or more and 50 ?m or less.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: November 14, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventors: Satoshi Honda, Yuki Sugo, Nao Kamakura
  • Patent number: 11802074
    Abstract: A high-tension busbar silver paste applied to the N-type solar cell is prepared by mixing a silver powder (a mixture of a spherical silver powder A having a median particle size of 700-900 nm and a tapped density of 5-6 g/mL and a spherical silver powder B having a medium particle size of 280-450 nm and a tapped density of 4-5 g/mL), an organic vehicle (a mixture of 3-5 wt % of polyvinyl butyral resin and 5-10 wt % of acrylic resin as a main resin) and a glass powder (copper-bismuth-manganese-tellurium series glass powder having a medium particle size of 0.7-1 ?m and a softening temperature of 600-800° C.); the silver paste has large welding tension, in which the welding tension of the front busbar line is 4 N or more.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: October 31, 2023
    Assignee: NANTONG T-SUN NEW ENERGY CO., LTD.
    Inventors: Ping Mao, Shu Zhang, Yulong Guan, Huan Yang
  • Patent number: 11791269
    Abstract: Electrical interconnect bridge technology is disclosed. An electrical interconnect bridge can include a bridge substrate formed of a mold compound material. The electrical interconnect bridge can also include a plurality of routing layers within the bridge substrate, each routing layer having a plurality of fine line and space (FLS) traces. In addition, the electrical interconnect bridge can include a via extending through the substrate and electrically coupling at least one of the FLS traces in one of the routing layers to at least one of the FLS traces in another of the routing layers.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: October 17, 2023
    Assignee: Intel Corporation
    Inventors: Srinivas V. Pietambaram, Rahul N. Manepalli
  • Patent number: 11772406
    Abstract: A print feedstock has a base material and a marker material, the base material and the marker material having different physical properties. A system to validate objects includes at least one printer to print feedstock onto an object, the feedstock comprising a base material and a marker material, the base material and a marker material having different properties, a device to create a unique identifier for the object based upon a pattern of the feedstock, and a store in which the unique identifier can be stored.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: October 3, 2023
    Assignee: XEROX CORPORATION
    Inventors: Warren Jackson, Janos Veres, Yujie Zhu, Jennifer L. Belelie, Robert A. Street, Ping Mei, Kent Evans
  • Patent number: 11776707
    Abstract: An electrically conductive paste includes: an elastic binder; and a conductive filler. The conductive filler includes: at least one spherical conductive filler, at least one plate-like conductive filler, and at least one rod-like conductive filler. In an embodiment, the spherical filler has a mean particle diameter, measured in accordance with ISO 21501-2:2019-11 of at most 200 ?m.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: October 3, 2023
    Assignee: CARL FREUDENBERG KG
    Inventors: Stanislaus Schmidt, Benno Schmied, Ivan Schmalzel, Marco Sutter
  • Patent number: 11776868
    Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.
    Type: Grant
    Filed: March 20, 2023
    Date of Patent: October 3, 2023
    Assignee: Laird Technologies, Inc.
    Inventors: Jason L. Strader, Richard F. Hill
  • Patent number: 11773271
    Abstract: Hybrid particles having improved electrical conductivity and thermal and chemical stabilities are disclosed. The hybrid particles are for use in conductive pastes. The hybrid particles include a nanoparticle selected from a graphene-containing material, a dichalcogenide material, a conducting polymer, or a combination thereof encapsulated in a conducting metal. The hybrid particles include a nanoparticle selected from a graphene-containing material, a dichalcogenide material, or a combination thereof encapsulated in a conducting polymer, and optionally further in a conducting metal. Suitable conducting metals include nickel or silver. Suitable conducting polymers include polyaniline, polypyrrole, or polythiophene. Suitable dichalcogenide materials include MoS2 or MoSe2. The hybrid particles can further include a conducting polymer layer on an outer surface of the conducting metal. Methods of making the hybrid particles are also disclosed.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: October 3, 2023
    Assignee: University of South Florida
    Inventor: Manoj Kumar Ram
  • Patent number: 11757108
    Abstract: A method for sealing fuel cell components includes providing a fuel cell component and a screen printing system. A seal can be applied to a predetermined location on the fuel cell component via the screen printing system. The seal can be cured and bonded. A fuel cell can include a plurality of fuel cell components. A seal can be disposed between each of the fuel cell components. The seal is printed via a screen printing process.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: September 12, 2023
    Assignee: HYZON MOTORS INC.
    Inventor: Jie Chen