Noble Metal (gold, Silver, Ruthenium, Rhodium, Palladium, Osmium, Iridium, Platinum) Patents (Class 252/514)
  • Patent number: 11948785
    Abstract: The present invention relates to electron multiplier apparatus of the type used in ion detectors. In one form, the invention is an electron multiplier having two or more electron emissive surfaces, each having a different composition so as to together limit or overcome an acute gain effect on the electron multiplier due to the exposure of the two or more electron emissive surfaces to water molecules. Alternatively, the multiplier may have a single electron emissive surface of mixed composition comprising a first composition component and a second composition component so as to together limit or overcome an acute gain effect on the electron multiplier due to the exposure of the electron emissive surface to water molecules.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: April 2, 2024
    Assignee: ADAPTAS SOLUTIONS PTY LTD
    Inventors: Aditya Wakhle, Russell Jurek, Kevin Hunter
  • Patent number: 11930565
    Abstract: The present invention is an apparatus for curing composites out-of-autoclave and out-of-oven. The apparatus is a multilayered composite tool for shaping and curing composites. It also contains a sealant layer and composite resistive heating element on the tool's surface. This heating element provides heat to the composites during cure while binding it to the other layers, eliminating the need for external heat from autoclave and oven sources. A ceramic layer is applied to the top surface of the resistive heater for electrical insulation, heater protection and to provide a smooth surface for finish for the composite components being processed with the invention. A method for using the invention is also described. Finally, one embodiment of the invention is presented where a negative composite tool is created to apply additional pressure to the composite component during curing. This additional pressure enables the current invention to more closely mimic autoclave composite processing.
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: March 12, 2024
    Assignee: Mainstream Engineering Corporation
    Inventors: Anna P. Skinner, Kayla S. O'Neill, Rachna C. Igwe, Philip Cox, Justin J. Hill
  • Patent number: 11921415
    Abstract: Provided is an optical coating for a projection screen, containing the following components in parts by weight: 2-15 parts of light-absorbing material, 5-20 parts of aluminum silver powder, 20-60 parts of acrylate oligomer, 10-45 parts of diluent, 0.5-15 parts of photoinitiator, and 0.1-6 parts of auxiliary agent; the light-absorbing material is one or more of carbon black, lamp black, iron black, and aniline black, and has an average particle size of 20-2000 nm; the aluminum silver powder is flake-shaped and has an average particle size of 3-10 ?m.
    Type: Grant
    Filed: January 18, 2020
    Date of Patent: March 5, 2024
    Assignee: APPOTRONICS CORPORATION LIMITED
    Inventors: Kejian Cui, Fei Hu, Yi Li
  • Patent number: 11901325
    Abstract: Provided is a multilayer substrate including laminated semiconductor substrates each having a penetrating hole (hereinafter referred to as through hole) having a plated film formed in the inner surface. The multilayer substrate has excellent conduction characteristics and can be manufactured at low cost. Conductive particles are selectively present at a position where the through holes face each other as viewed in a plan view of the multilayer substrate. The multilayer substrate has a connection structure in which the facing through holes are connected by the conductive particles, and the semiconductor substrates each having the through hole are bonded by an insulating adhesive.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: February 13, 2024
    Assignee: DEXERIALS CORPORATION
    Inventors: Seiichiro Shinohara, Yasushi Akutsu, Tomoyuki Ishimatsu
  • Patent number: 11891533
    Abstract: The present invention relates to a metal fine particle-containing ink containing metal fine particles (a) dispersed therein with a polymer B, in which the ink contains an ink solvent S; a difference ?SP (|SP(S)?SP(B)|) between solubility parameters of the solvent S and the polymer B is not more than 1.5 (cal/cm3)0.5 wherein SP(S) and SP(B) are a solubility parameter of the ink solvent S and a solubility parameter of the polymer B, respectively, as measured by a Fedors method; and the SP(B) is not less than 9.5 (cal/cm3)0.5 and not more than 10.5 (cal/cm3)0.5, as well as a method for producing a printed material, which includes the step of applying the metal fine particle-containing ink to a printing substrate to form a metal coating film of the ink on the printing substrate under ordinary-temperature environments, thereby obtaining the printed material.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: February 6, 2024
    Assignee: KAO CORPORATION
    Inventors: Tomohide Yoshida, Kosuke Muto
  • Patent number: 11884587
    Abstract: The present disclosure discloses a silicon-lithium-lead system, a conductive paste and a preparation method thereof, and belongs to the field of solar cells. A silicon-lead-lithium oxide frit includes the following composition: Sia—Pbb—Lic—(Bx—Aly—Biz)-Me-Of, where, 0<a<0.6, 0<b<0.8, 0<c<0.6, x+y+z=d, the x and the y are not zero at the same time, and the z is greater than zero. In the present disclosure, by adding B2O3 and Bi2O3, Al2O3 and Bi2O3, or B2O3, Al2O3 and Bi2O3 at the same time, the prepared frit has greater water resistance, and therefore, a solar cell prepared by using the conductive paste containing glass has good water resistance. In addition, the photoelectric conversion efficiency of the solar cell prepared by using the conductive paste prepared in the present disclosure can also be maintained, or even be slightly improved.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: January 30, 2024
    Assignee: JIANGSU RIYU PHOTOVOLTAIC NEW MATERIAL TECHNOLOGY CO. LTD
    Inventors: Li Yan, Rui Tian, Song Xu
  • Patent number: 11873403
    Abstract: Electric field grading compositions comprise a particulate cupric oxide dispersed in a matrix material, wherein the electric field grading composition has a threshold voltage, a breakdown voltage, and exhibits a reversible electric field switchable current-voltage relationship that substantially follows the equation: I=kV? wherein: I is current in amperes; k is a constant greater than 0; V is applied voltage in volts, wherein V is between the threshold voltage and the breakdown voltage, inclusive; and ? is a real number greater than 1. The electric field grading composition is useful for reducing electric field stress at a joint or termination of a conductive substrate. Articles including the electric field grading disposed on a surface of a conductive substrate are also disclosed.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: January 16, 2024
    Assignee: 3M Innovative Properties Company
    Inventor: Dipankar Ghosh
  • Patent number: 11873368
    Abstract: The present invention is directed to a two component (2K) composition comprising: (A) a first component comprising: a) at least one elastomer modified epoxy resin; b) at least one internally flexibilized epoxy resin which is characterized by a Shore D hardness, as measured with a durometer in accordance with ASTM D2240, of ?45 when cured with diethylene triamine; c) at least one chelate modified epoxy resin; and d) optionally at least one epoxy resin different from said resins a) to c); and, (B) a second component comprising: e) a curative which consists of at least one compound possessing at least two epoxide reactive groups per molecule, said curative being characterized by comprising at least one Mannich base.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: January 16, 2024
    Assignee: Henkel AG & Co. KGaA
    Inventors: Chunfu Chen, Leo Li, Chao Wang
  • Patent number: 11840647
    Abstract: The present invention refers to a recyclable conductive adhesive composition for LED packaging and preparation method thereof, and its recycling method and the obtained recycled conductive silver powder, wherein the recyclable conductive adhesive composition for LED packaging comprises epoxy resin, epoxy resin diluent, curing agent containing imine bond, amine curing agent, curing accelerator, wetting dispersant, coupling agent, defoamer and conductive silver powder. The epoxy curing agent containing imine bond adopted in the present invention can introduce the dynamic imine chemical bond into the epoxy resin matrix of the conductive adhesive by curing reaction, and can endow the epoxy resin matrix with degradable function by its imine bond's feature of occurring dynamic exchange reaction with amine solvent under heating condition, therefore the conductive silver powder in the conductive adhesive can be recycled and reused.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: December 12, 2023
    Assignee: Fujian Blue Ocean & Black Stone Technology Co., Ltd.
    Inventors: Wanshuang Liu, Yi Wei, Hebin Luo
  • Patent number: 11832655
    Abstract: The heating array includes first heating elements arranged in an elongated array, the first heating elements spanning from a first end to a second end of the elongated array, a midsection of each one of the first heating elements bowing concentrically outward from a radial centerline running longitudinally through the first end and the second end, the first heating elements being configured to flex concentrically inward when a hoop force is applied to sides of the elongated array.
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: December 5, 2023
    Assignee: Philip Morris USA Inc.
    Inventors: Olivier Greim, Felix Fernando, Charles Higgins
  • Patent number: 11819914
    Abstract: A silver powder containing: silver particles; and an adherent that is attached to surfaces of the silver particles and contains a metal oxide that has a melting point lower than a melting point of silver.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: November 21, 2023
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventor: Masanori Fujii
  • Patent number: 11814544
    Abstract: The present disclosure relates to a substrate in which an antimicrobial coating agent including urushiol and an inorganic antimicrobial agent is fixed and coated onto the surface, and a method for antimicrobial coating on the surface of the substrate.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: November 14, 2023
    Assignee: LG CHEM, LTD.
    Inventors: Minsung Park, Soonhee Kang, Kwang Seoung Jeon
  • Patent number: 11817269
    Abstract: A multilayer capacitor includes a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body, wherein each of the first and second external electrodes includes a conductive resin layer including a resin, a plurality of metal particles, and a conductive connection portion connecting portions of the plurality of metal particles to each other, and in the conductive resin layer, a volume ratio of metal particles spaced apart from the conductive connection portion, among the plurality of metal particles, to a sum of the plurality of metal particles and the conductive connection portion is greater than 0% and less than 4.9%.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: November 14, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong Je Choi, Jung Min Kim, Ji Hye Han, Byung Woo Kang, Hye Jin Park, Sang Wook Lee, Bon Seok Koo, Jung Won Lee
  • Patent number: 11817415
    Abstract: Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer includes sinterable metallic particles and an organic component, the precursor layer has a phase separation structure that is a sea-island structure or a co-continuous structure, and in a SEM surface observation image on at least one surface of the precursor layer, a maximum value among each diameter of the largest inscribed circle for a region occupied by each phase of the phase separation structure is 1 ?m or more and 50 ?m or less.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: November 14, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventors: Satoshi Honda, Yuki Sugo, Nao Kamakura
  • Patent number: 11802074
    Abstract: A high-tension busbar silver paste applied to the N-type solar cell is prepared by mixing a silver powder (a mixture of a spherical silver powder A having a median particle size of 700-900 nm and a tapped density of 5-6 g/mL and a spherical silver powder B having a medium particle size of 280-450 nm and a tapped density of 4-5 g/mL), an organic vehicle (a mixture of 3-5 wt % of polyvinyl butyral resin and 5-10 wt % of acrylic resin as a main resin) and a glass powder (copper-bismuth-manganese-tellurium series glass powder having a medium particle size of 0.7-1 ?m and a softening temperature of 600-800° C.); the silver paste has large welding tension, in which the welding tension of the front busbar line is 4 N or more.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: October 31, 2023
    Assignee: NANTONG T-SUN NEW ENERGY CO., LTD.
    Inventors: Ping Mao, Shu Zhang, Yulong Guan, Huan Yang
  • Patent number: 11791269
    Abstract: Electrical interconnect bridge technology is disclosed. An electrical interconnect bridge can include a bridge substrate formed of a mold compound material. The electrical interconnect bridge can also include a plurality of routing layers within the bridge substrate, each routing layer having a plurality of fine line and space (FLS) traces. In addition, the electrical interconnect bridge can include a via extending through the substrate and electrically coupling at least one of the FLS traces in one of the routing layers to at least one of the FLS traces in another of the routing layers.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: October 17, 2023
    Assignee: Intel Corporation
    Inventors: Srinivas V. Pietambaram, Rahul N. Manepalli
  • Patent number: 11776707
    Abstract: An electrically conductive paste includes: an elastic binder; and a conductive filler. The conductive filler includes: at least one spherical conductive filler, at least one plate-like conductive filler, and at least one rod-like conductive filler. In an embodiment, the spherical filler has a mean particle diameter, measured in accordance with ISO 21501-2:2019-11 of at most 200 ?m.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: October 3, 2023
    Assignee: CARL FREUDENBERG KG
    Inventors: Stanislaus Schmidt, Benno Schmied, Ivan Schmalzel, Marco Sutter
  • Patent number: 11772406
    Abstract: A print feedstock has a base material and a marker material, the base material and the marker material having different physical properties. A system to validate objects includes at least one printer to print feedstock onto an object, the feedstock comprising a base material and a marker material, the base material and a marker material having different properties, a device to create a unique identifier for the object based upon a pattern of the feedstock, and a store in which the unique identifier can be stored.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: October 3, 2023
    Assignee: XEROX CORPORATION
    Inventors: Warren Jackson, Janos Veres, Yujie Zhu, Jennifer L. Belelie, Robert A. Street, Ping Mei, Kent Evans
  • Patent number: 11776868
    Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.
    Type: Grant
    Filed: March 20, 2023
    Date of Patent: October 3, 2023
    Assignee: Laird Technologies, Inc.
    Inventors: Jason L. Strader, Richard F. Hill
  • Patent number: 11773271
    Abstract: Hybrid particles having improved electrical conductivity and thermal and chemical stabilities are disclosed. The hybrid particles are for use in conductive pastes. The hybrid particles include a nanoparticle selected from a graphene-containing material, a dichalcogenide material, a conducting polymer, or a combination thereof encapsulated in a conducting metal. The hybrid particles include a nanoparticle selected from a graphene-containing material, a dichalcogenide material, or a combination thereof encapsulated in a conducting polymer, and optionally further in a conducting metal. Suitable conducting metals include nickel or silver. Suitable conducting polymers include polyaniline, polypyrrole, or polythiophene. Suitable dichalcogenide materials include MoS2 or MoSe2. The hybrid particles can further include a conducting polymer layer on an outer surface of the conducting metal. Methods of making the hybrid particles are also disclosed.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: October 3, 2023
    Assignee: University of South Florida
    Inventor: Manoj Kumar Ram
  • Patent number: 11757108
    Abstract: A method for sealing fuel cell components includes providing a fuel cell component and a screen printing system. A seal can be applied to a predetermined location on the fuel cell component via the screen printing system. The seal can be cured and bonded. A fuel cell can include a plurality of fuel cell components. A seal can be disposed between each of the fuel cell components. The seal is printed via a screen printing process.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: September 12, 2023
    Assignee: HYZON MOTORS INC.
    Inventor: Jie Chen
  • Patent number: 11747365
    Abstract: An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: September 5, 2023
    Assignees: KABUSHIKI KAISHA NIHON MICRONICS, TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Toshinori Omori, Kazuya Goto, Yasuaki Osanai, Takashi Akiniwa, Takeki Sugisawa, Takeshi Kondo, Shintaro Abe, Maki Watanabe
  • Patent number: 11735737
    Abstract: An object of the present invention is to provide a binder which exhibits excellent dispersibility of a conductive assistant; a slurry composition and an electrode, each of which uses this binder; and an electricity storage device which is provided with this electrode. The present invention relates to a binder for an electricity storage device, in which a loss tangent tan ? in a linear region of an aqueous dispersion liquid of 0.5% by mass of the binder and 4.6% by mass of a conductive assistant satisfies tan ?>1 in a strain dispersion measurement under measurement conditions of a measurement temperature of 25° C. and a frequency of 1 Hz, and the conductive assistant is an acetylene black having an average particle diameter of 30 nm or more and 40 nm or less and a specific surface area of 65 m2/g or more and 70 m2/g or less; a slurry composition and an electrode, each of which uses this binder; an electricity storage device which is provided with this electrode; and the like.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: August 22, 2023
    Assignee: FUJIFILM WAKO PURE CHEMICAL CORPORATION
    Inventors: Kaho Mori, Tomoyuki Mori, Kazuki Takimoto, Masahiro Takano, Kei Kawano
  • Patent number: 11715579
    Abstract: An electronic device is provided. The device comprises a singulated carrier portion, a substrate molded onto the singulated carrier portion, and conductive traces disposed on the substrate. The substrate comprises a polymer composition that includes an aromatic polymer and an electrically conductive filler, wherein the polymer composition exhibits a surface resistivity of from about 1×1012 ohms to about 1×1018 ohms as determined in accordance with ASTM D257-14.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: August 1, 2023
    Assignee: Ticona LLC
    Inventor: Young Shin Kim
  • Patent number: 11710599
    Abstract: A ceramic electronic device includes an element body and an external electrode. The element body is formed by laminating a ceramic layer and an internal electrode layer. The external electrode is electrically connected to at least one end of the internal electrode layer. The external electrode includes a baked electrode layer. The baked electrode layer includes a first region and a second region. The first region is contacted with an end surface of the element body and located near a joint boundary with the element body. The second region is located outside the first region and constituting an outer surface of the baked electrode layer. The first region includes a first glass having a predetermined composition. The second region includes a second glass having a predetermined composition.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: July 25, 2023
    Assignee: TDK CORPORATION
    Inventors: Toshihiro Iguchi, Yuichiro Sueda, Ryota Namiki, Yasuhiro Okui, Atsushi Watanabe
  • Patent number: 11700733
    Abstract: A photoelectric conversion element according to an embodiment of the present disclosure includes: a first electrode and a second electrode facing each other; and a photoelectric conversion layer provided between the first electrode and the second electrode, and including a first organic semiconductor material, a second organic semiconductor material, and a third organic semiconductor material that have mother skeletons different from one another. The first organic semiconductor material is one of fullerenes and fullerene derivatives. The second organic semiconductor material in a form of a single-layer film has a higher linear absorption coefficient of a maximal light absorption wavelength in a visible light region than a single-layer film of the first organic semiconductor material and a single-layer film of the third organic semiconductor material. The third organic semiconductor material has a value equal to or higher than a HOMO level of the second organic semiconductor material.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: July 11, 2023
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yuta Hasegawa, Nobuyuki Matsuzawa, Yoshiaki Obana, Ichiro Takemura, Norikazu Nakayama, Masami Shimokawa, Tetsuji Yamaguchi, Iwao Yagi, Hideaki Mogi
  • Patent number: 11697612
    Abstract: The present disclosure discloses a low LOI tellurium-lithium-silicon-zirconium frit system and a conductive paste and application thereof, and belongs to the field of conductive paste. In the low LOI tellurium-lithium-silicon-zirconium frit system, components of the frit are 24%-40% TeO2, 18%-24% Li2O, 4%-13% SiO2, 0-2% ZrO2, and a balance MOx, and M is one or a mixture of Na, K, Mg, Ca, Sr, Ti, V, Cr, Mo, W, Mn, Cu, Ag, Zn, Cd, B, Al, Ga, Tl, Ge, Pb, P, and Bi. There is no need to add additional surfactants, a viscosity change of the conductive paste prepared after standing for 30 days is less than 20%, the conductive paste has good stability, the water related weight loss of inorganic oxide of the conductive paste is less than 1.6%, and the application performance of the conductive paste is not affected after standing for 30 days.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: July 11, 2023
    Assignee: JIANGSU RIYU PHOTOVOLTAIC NEW MATERIAL TECHNOLOGY CO. LTD
    Inventors: Li Yan, Song Xu, Rui Tian
  • Patent number: 11676833
    Abstract: A protective sheeting for use in processing a semiconductor-sized wafer includes a protective film and a cushioning layer attached to a back surface of the protective film. At least in a central area of the protective sheeting, no adhesive is applied to a front surface and a back surface of the protective sheeting, the central area having an outer diameter which is equal to or larger than an outer diameter of the semiconductor-sized wafer. Further, a protective sheeting for use in processing a wafer has a protective film and a cushioning layer attached to a back surface of the protective film, wherein, on an entire front surface and an entire back surface of the protective sheeting, no adhesive is applied. A handling system for a semiconductor-sized wafer and to a combination of a wafer and the protective sheeting are also described.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: June 13, 2023
    Assignee: DISCO CORPORATION
    Inventor: Karl Heinz Priewasser
  • Patent number: 11652197
    Abstract: An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: May 16, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Masafumi Kuramoto, Satoru Ogawa, Katsuaki Suganuma, Keun-Soo Kim
  • Patent number: 11639025
    Abstract: Methods and apparatus for fabricating high-resolution thin-layer metal patterns and 3D Metal structures are provided. The methods and apparatus operate via photo-(stereo)lithography at room temperature. The printed metal patterns, for example silver patterns, exhibit high electrical conductivity, comparable to or better than the conductivity of the silver printed by current laser sintering or thermal annealing at high temperature.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: May 2, 2023
    Assignee: The Regents of the University of California
    Inventors: Ximin He, Xingyun Yang, Dong Wu, Mutian Hua
  • Patent number: 11639453
    Abstract: An electrically conductive material includes an anionic polymer having a polymer backbone that is bonded to a plurality of terminal catechol moieties and a plurality of terminal sulfonate moieties. It also includes a cationic polymer including poly(3,4-ethylenedioxythiophene).
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: May 2, 2023
    Assignee: Florida State University Research Foundation, Inc.
    Inventors: Hoyong Chung, Minkyu Kim
  • Patent number: 11634355
    Abstract: The present disclosure discloses a ceramic glass powder and a solar cell metallization paste containing the ceramic glass powder, and belongs to the technical field of solar cells. The present disclosure provides a novel formula mode of a glass powder including a crystallization nucleus component and a glass network component, that is, a formula of a ceramic glass powder that has a special crystallization behavior, a low crystallinity before sintering and a high crystallinity after the sintering, and a conductive metallization paste containing the ceramic glass powder is further obtained. The present disclosure solves the technical problem that by using metallization pastes in the prior art, a balance between corrosion of a silicon wafer and an ohmic contact is difficult to achieve. The efficiency of a solar cell is improved.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: April 25, 2023
    Assignee: JIANGSU RIYU PHOTOVOLTAIC NEW MATERIAL TECHNOLOGY
    Inventors: Song Xu, Rui Tian
  • Patent number: 11635863
    Abstract: An object of the present invention is to provide a conductive film further improved in at least any of mechanical characteristics, electrical characteristics, and optical characteristics while enjoying improvement in transparency by the thinning of a fine metal wire, and a conductive film roll, an electronic paper, a touch panel, and a flat-panel display comprising the same.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: April 25, 2023
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Takeshi Kamijo, Kazuma Komatsu, Akira Ikeda, Sora Hida, Tetsuro Sugimoto
  • Patent number: 11628642
    Abstract: A thread made from extruded silicone rubber that is cross-linked after the extrusion and woven into a fabric having warp threads and/or weft threads and a coating including cross-linked silicone rubber, the thread or the coating including a fluorinated rubber portion. The invention also relates to a method for producing such threads and woven fabrics. The object of the invention is to improve thermal and chemical resistance. To this end the fluorinated rubber part is produced only by surface fluorination of the cross-linked thread or the coating by means of a fluorinated gas.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: April 18, 2023
    Assignee: HUECK Rheinische GmbH
    Inventor: Rolf Espe
  • Patent number: 11628501
    Abstract: Composite particles sinterable at a low temperature and allow forming a sintered body that exhibits a large extension are provided. The composite particles include microparticles having an average crystallite diameter of 0.6 to 10 ?m and containing a metal, and nanoparticles adhered to a surface of the microparticle, having an average crystallite diameter of 3 to 100 nm, and containing a metal of a same kind as the metal contained in the microparticle.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: April 18, 2023
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Daiki Kuboyama, Akira Kato, Jyunya Murai
  • Patent number: 11620028
    Abstract: An object of the present invention is to provide a conductive film further improved in at least any of mechanical characteristics, electrical characteristics, and optical characteristics while enjoying improvement in transparency by the thinning of a fine metal wire, and a conductive film roll, an electronic paper, a touch panel, and a flat-panel display comprising the same.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: April 4, 2023
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Takeshi Kamijo, Kazuma Komatsu, Akira Ikeda, Sora Hida, Tetsuro Sugimoto
  • Patent number: 11621101
    Abstract: Disclosed are conductive composites comprising a polymer, a conductor selected from metals and metal alloys, and a thickening agent.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: April 4, 2023
    Assignee: THE BOEING COMPANY
    Inventors: Ashley M. Dustin, Andrew P. Nowak, Xin N. Guan, Adam F. Gross, Richard E. Sharp
  • Patent number: 11610831
    Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: March 21, 2023
    Assignee: Laird Technologies, Inc.
    Inventors: Jason L. Strader, Richard F. Hill
  • Patent number: 11596089
    Abstract: A method for shielding components includes the steps of providing a component and applying at least one coating region, designed to shield from a magnetic and/or an electrical field, to the component by a thermal and/or kinetic spraying method such that a first arrangement space is shielded from a second arrangement space.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: February 28, 2023
    Assignee: Bayerische Motoren Werke Aktiengesellschaft
    Inventor: Wolfram Wagener
  • Patent number: 11588238
    Abstract: An antenna assembly includes a plurality of antenna elements, a microstrip feed network that is configured to supply power to the plurality of antenna elements, and one or more resistors disposed within the microstrip feed network proximate to one or more of the plurality of antenna elements. The resistors are configured to control sidelobes of the antenna assembly.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: February 21, 2023
    Assignee: THE BOEING COMPANY
    Inventor: John E. Rogers
  • Patent number: 11553862
    Abstract: An electrode measuring the presence of an analyte is described as one embodiment. The electrode includes a working conductor with an electrode reactive surface and a first reactive chemistry that is responsive to the analyte. The electrode further includes a first transport material that enables flux of the first analyte to the first reactive chemistry and a second transport material that supplies a reactant to the first reactive chemistry. Wherein the first reactive chemistry does not contact the electrode reactive surface while at least partially shadowing a portion of the electrode reactive surface.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: January 17, 2023
    Assignee: PercuSense, Inc.
    Inventors: Rajiv Shah, Bradley Liang, Katherine Wolfe, Ellen Messer, Shaun Pendo
  • Patent number: 11522193
    Abstract: Systems and methods utilizing water soluble (aqueous) PAA-based polymer binders for silicon-dominant anodes may include an electrode coating layer on a current collector, where the electrode coating layer is formed from silicon and a pyrolyzed water soluble PAA-based polymer blend, wherein the water soluble PAA-based polymer blend comprises PAA and one or more additional water-soluble polymer components. The electrode coating layer may include more than 70% silicon and the anode may be in a lithium ion battery.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: December 6, 2022
    Assignee: Enevate Corporation
    Inventors: Sanjaya D. Perera, Benjamin Park, Younes Ansari
  • Patent number: 11520451
    Abstract: An object of the present invention is to provide a conductive film further improved in at least any of mechanical characteristics, electrical characteristics, and optical characteristics while enjoying improvement in transparency by the thinning of a fine metal wire, and a conductive film roll, an electronic paper, a touch panel, and a flat-panel display comprising the same.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: December 6, 2022
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Takeshi Kamijo, Kazuma Komatsu, Akira Ikeda, Sora Hida, Tetsuro Sugimoto
  • Patent number: 11515459
    Abstract: The present invention relates to a micro light-emitting diode display panel and a method for producing the same. A backplane and a light-emitting diode display layer are subjected to a bonding process to form eutectic structures between the backplane and light-emitting diodes of the light-emitting diode display layer. Then, an adhesive bonding layer including a resin material and conducting materials is formed on a surface of the backplane, and a heating process is performed, thereby causing the conducting materials to form a plurality of metallic bridge connection structures. Therefore, a bonding between the light-emitting diode and the backplane is reinforced, and tensile strength of the micro light-emitting diode display panel is enhanced.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: November 29, 2022
    Assignees: Interface Technology (ChengDu) Co., Ltd., Interface Optoelectronics (ShenZhen) Co., Ltd., General Interface Solution Limited
    Inventors: Ping-Hsiang Kao, Po-Lun Chen, Chun-Ta Chen, Po-Ching Lin, Ya-Chu Hsu, Chia-Ming Fan, Chien-Yu Huang
  • Patent number: 11510314
    Abstract: The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: November 22, 2022
    Assignee: XEROX CORPORATION
    Inventors: Naveen Chopra, Barkev Keoshkerian, Chad Steven Smithson, Kurt I. Halfyard, Michelle N. Chretien
  • Patent number: 11478177
    Abstract: A physiological signal collection electrode comprises a signal collection pad having a skin contact portion, a signal output pad and an elongate bridging portion interconnecting the signal collection pad and the signal output pad. The signal collection pad, the signal output portion and the bridging portion are integrally molded of a flexible, conductive and resilient material. The width of the bridging portion is substantially smaller than that of the skin contact portion. A narrowed bridging portion operates to concentrate collected physiological signals collected by the skin contact portion before the signals are output to the signal output pad. An elongate bridging portion reduces skin covering area for better wearer comfort as well as providing better resiliency to the electrode when the bridging portion is extended.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: October 25, 2022
    Assignee: Dayton Technologies Limited
    Inventor: Paul Anthony Yuen
  • Patent number: 11483936
    Abstract: Provided is a method for producing a joined body, the method including a first step of preparing a laminated body which includes a first member having a metal pillar provided on a surface thereof, a second member having an electrode pad provided on a surface thereof, and a joining material provided between the metal pillar and the electrode pad and containing metal particles and an organic compound, and a second step of heating the laminated body to sinter the joining material at a predetermined sintering temperature, in which the joining material satisfies the condition of the following Formula (I): (M1?M2)/M1×100?1.0??(I) [in Formula (I), M1 represents a mass of the joining material when a temperature of the joining material reaches the sintering temperature in the second step, and M2 represents a non-volatile content in the joining material.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: October 25, 2022
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Hideo Nakako, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki Kawana, Motohiro Negishi, Yuichi Yanaka
  • Patent number: 11466181
    Abstract: The present disclosure relates to a metal particle-containing composition contains at least one thermosetting resin (R), a hardening agent (H), and at least three types of metal particles (P) different from one another. The metal particles (P) contain a solder alloy particle (P1) containing a tin alloy containing at least one metal (A), wherein the metal (A) is a metal that forms a eutectic crystal with tin at a eutectic temperature of 200° C. or lower, at least one metal particle (P2) containing a metal (B) having a melting point exceeding 420° C. in a bulk, the metal particle (P2) having a melting point higher than a solidus temperature of the solder alloy particle (P1), and at least one metal particle (P3) containing a metal (C) that forms an intermetallic compound with a metal contained in the solder alloy particle (P1).
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: October 11, 2022
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Norzafriza Nitta, Tomohiro Ishii, Hidemichi Fujiwara
  • Patent number: 11444240
    Abstract: Methods, systems, and devices are disclosed for enhancement of spin-orbit torque. In one aspect, a magnetic device includes a magnetic tunneling junction (MTJ), including a free magnetic layer, a pinned magnetic layer and a non-magnetic junction layer between the free magnetic layer and the pinned magnetic layer, and a spin Hall effect metal layer that includes one or more insertion metal layers operable to introduce interfacial scattering of electrons flowing in the spin Hall metal layer to increase the spin current that interacts with and changes the magnetization of the free magnetic layer of the MTJ.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: September 13, 2022
    Assignee: Cornell University
    Inventors: Robert A. Buhrman, Lijun Zhu
  • Patent number: 11407030
    Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 ?m and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 ?m·% (preferably 1.5 to 10.5 ?m·%).
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: August 9, 2022
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Atsushi Ebara, Kenichi Inoue, Yoshiyuki Michiaki, Takahiro Yamada, Masahiro Yoshida