Free Metal Containing Patents (Class 252/512)
Noble metal (gold, silver, ruthenium, rhodium, palladium, osmium, iridium, platinum) (Class 252/514)
-
Patent number: 9758688Abstract: A composition is provided for forming a conductive film. The composition includes a metal compound, a reducing agent, an ionic compound and/or a polar compound, and a compound having at least one atom selected from a nitrogen atom, a sulfur atom and a phosphorus atom. The composition may be an ink composition for coating on an electronic device.Type: GrantFiled: September 20, 2013Date of Patent: September 12, 2017Assignee: Sumitomo Chemical Company, LimitedInventors: Takayuki Iijima, Ken Sakakibara, Hideyuki Higashimura
-
Patent number: 9738810Abstract: A coating material composition for providing coated films is disclosed. The coating material composition contains coated film forming resin (A), crosslinking agent (B), and resin beads (C), in which compression strength of the resin beads (C) at the time of the 10% pressurized deformation of an individual resin bead by means of a micro-compression tester lies between 0.1 MPa and 20 MPa and a recovery of the resin beads (C) following 90% pressurized deformation of an individual resin bead by means of a micro-compression tester is at least 80%.Type: GrantFiled: April 25, 2014Date of Patent: August 22, 2017Assignee: Akzo Nobel Coatings International B.V.Inventors: Takahiro Tsujita, Shinji Yagi, Nobuhiro Nishida, Yoshitomo Takeuchi
-
Patent number: 9732236Abstract: After there is prepared a conductive paste which contains fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, coarse copper particles having an average particle diameter of 0.3 to 20 ?m, a glycol solvent, such as ethylene glycol, and at least one of a polyvinylpyrrolidone (PVP) resin and a polyvinyl butyral (PVB) resin and wherein the total amount of the fine copper particles and the coarse copper particles is 50 to 90% by weight, the weight ratio of the fine copper particles to the coarse copper particles being in the range of from 1:9 to 5:5, the conductive paste thus prepared is applied on a substrate by screen printing to be preliminary-fired by vacuum drying, and then, fired with light irradiation by irradiating with light having a wavelength of 200 to 800 nm at a pulse period of 500 to 2000 ?s and a pulse voltage of 1600 to 3800 V to form a conductive film on the substrate.Type: GrantFiled: December 5, 2014Date of Patent: August 15, 2017Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Shuji Kaneda, Hidefumi Fujita, Daisuke Itoh
-
Patent number: 9670384Abstract: A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring substrate includes a thermosetting resin composition, conductive particles, and light-reflective insulating particles. The light-reflective insulating particles are formed by subjecting titanium oxide particles to a surface treatment with one kind selected from the group consisting of Al2O3, SiO, SiO2, ZnO, ZnO2, and ZrO2. The amount of the titanium oxide contained in the light-reflective insulating particles is 85 to 93%. The particle diameter of the light-reflective insulating particles is 0.2 to 0.3 ?m, and the particle diameter of the conductive particles is 2 to 10 ?m.Type: GrantFiled: February 24, 2012Date of Patent: June 6, 2017Assignee: DEXERIALS CORPORATIONInventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi
-
Patent number: 9673127Abstract: Embodiments described herein relate to silicone-based thermal interface materials which include a thermally conductive material and a silicone-based polymeric material having a solubility parameter that is not less than 9.09 cal1/2 cm?3/2.Type: GrantFiled: September 16, 2015Date of Patent: June 6, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Sarah K. Czaplewski, Joseph Kuczynski, Jason T. Wertz, Jing Zhang
-
Patent number: 9656438Abstract: A multi-layered film in the form of a hose-shaped outer film for an insert hose of a pipe rehabilitation system includes silver-colored pigments in at least two layers of the film, or a metallization applied on both outer layers of the film, or silver-colored pigments in at least one layer of the film and a metallization is applied on an outer layer of the film. At least one UV absorber is inserted in at least one or several layers of the film of the film. The entire film is permeable to UV light and visible light in a wavelength range from 200 to 800 nm at a rate of less than 0.1%, and is opaque. The UV radiation and visible radiation are reflected in a wavelength range from 200 to 800 nm.Type: GrantFiled: December 9, 2014Date of Patent: May 23, 2017Assignee: BUERGOFOL GMBHInventor: Kurt Stark
-
Patent number: 9660128Abstract: Provided are a paste for preparing etching mask patterns and a manufacturing method of a silicon solar cell using the same. The paste composition for preparing mask patterns is used to form a selective emitter of a silicon solar cell, and includes inorganic powder, an organic solvent, a binder resin, and a plasticizer. The mask patterns prepared from the paste composition have good adhesion with a substrate, thereby preventing edge curling, and have good etching resistant characteristic in an etch-back process for forming a selective emitter, enabling formation of a stable emitter.Type: GrantFiled: October 12, 2010Date of Patent: May 23, 2017Assignee: LG CHEM, LTD.Inventor: Min-Seo Kim
-
Patent number: 9653350Abstract: Catalytic metal nanoparticles can be attached on a base. A pre-treatment method for plating includes a catalytic particle-containing film forming process of forming a catalytic particle-containing film on a surface of a substrate by supplying, onto the substrate, a catalytic particle solution which is prepared by dispersing the catalytic metal nanoparticles and a dispersing agent in a solvent containing water; a first heating process of removing moisture contained at least in the catalytic particle-containing film by heating the substrate to a first temperature; and a second heating process of polymerizing the dispersing agent to have a sheet shape by heating the substrate to a second temperature higher than the first temperature after the first heating process and fixing the catalytic metal nanoparticles on a base layer by covering the catalytic metal nanoparticles with the sheet-shaped dispersing agent.Type: GrantFiled: November 20, 2014Date of Patent: May 16, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Takashi Tanaka, Nobutaka Mizutani, Yusuke Saito, Mitsuaki Iwashita
-
Patent number: 9633755Abstract: The conductive composition contains at least (a) conductive metal fibers, and (b) at least one compound selected from a compound represented by the following Formula (1), a compound represented by the following Formula (2), and a compound having a partial structure represented by the following Formula (3). Each of R1 and R2 independently represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an acyl group, an aryloxycarbonyl group, an alkoxycarbonyl group, or a carbamoyl group. Each of R3, R4, R5, R6, R8, R9, R10, and R11 independently represents an alkyl group having 1 to 4 carbon atoms, and R7 represents a hydrogen atom or a substituent. R12 represents an alkyl group, an alkoxy group, an acyl group, or a hydrogen atom. * represents a bond.Type: GrantFiled: September 22, 2014Date of Patent: April 25, 2017Assignee: FUJIFILM CorporationInventors: Tokihiko Matsumura, Toyohisa Oya, Kazushi Furukawa
-
Patent number: 9623401Abstract: An exhaust gas purifying catalyst has enhanced NOx purification performance in a lean atmosphere, and a production method for producing an exhaust gas purifying catalyst includes sputtering a target material containing Ta and Rh to form composite fine metal particles respectively containing Ta and Rh.Type: GrantFiled: December 8, 2015Date of Patent: April 18, 2017Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Satoshi Nagao, Kazutoshi Akashi
-
Patent number: 9607726Abstract: A composition for forming a conductive film. The composition comprises a plurality of nanowires comprising silver; a latex comprising polymer particles; and an aqueous-based carrier.Type: GrantFiled: January 30, 2015Date of Patent: March 28, 2017Assignee: XEROX CORPORATIONInventor: Yiliang Wu
-
Patent number: 9608137Abstract: A composition for solar cell electrodes includes a conductive powder, a glass frit, an organic vehicle and a thixotropic agent, and has a first thixotropic index (TI I) of about 1.5 to about 4 as represented by the following Equation 1, and a second thixotropic index (TI II) of about 4 to about 8 as represented by the following Equation 2, both the first thixotropic index and the second thixotropic index being measured at 23° C. by a rotary viscometer. [Equation 1] TI I=(viscosity at 1 rpm/viscosity at 10 rpm) [Equation 2] TI II=(viscosity at 10 rpm/viscosity at 100 rpm).Type: GrantFiled: May 14, 2015Date of Patent: March 28, 2017Assignee: SAMSUNG SDI CO., LTD.Inventors: Seok Hyun Jung, Tae Joong Kim, Tae Joon Kim, Hun Gyu Song, Dong Il Shin
-
Patent number: 9608136Abstract: A composition for solar cell electrodes includes a conductive powder, a glass frit, an organic vehicle and a thixotropic agent, and has a first thixotropic index (TI I) of about 1.5 to about 4 as represented by the following Equation 1, and a second thixotropic index (TI II) of about 4 to about 8 as represented by the following Equation 2, both the first thixotropic index and the second thixotropic index being measured at 23° C. by a rotary viscometer. [Equation 1] TI I=(viscosity at 1 rpm/viscosity at 10 rpm) [Equation 2] TI II=(viscosity at 10 rpm/viscosity at 100 rpm).Type: GrantFiled: April 10, 2014Date of Patent: March 28, 2017Assignee: SAMSUNG SDI CO., LTD.Inventors: Seok Hyun Jung, Tae Joong Kim, Tae Joon Kim, Hun Gyu Song, Dong Il Shin
-
Patent number: 9593264Abstract: An adhesive film, which can be bonded when heat-activated, comprising a) a polymer-metal blend comprising at least one adhesive which can be bonded when heat-activated, and at least one metal component melting in the temperature range from 50° C. to 400° C., and b) at least one fibrous, electrically conductive filler, the filler being present at least partly in the form of a bound fiber network with the metal component.Type: GrantFiled: July 10, 2012Date of Patent: March 14, 2017Assignee: tesa SEInventor: Klaus Keite-Telgenbüscher
-
Patent number: 9590535Abstract: A thermionic energy converter is provided that includes an anode, a cathode, where the anode is disposed opposite the cathode, and a suspension, where a first end of the suspension is connected to the cathode and a second end of the suspension is connected to the anode, where the suspension moveably supports the cathode above the anode to form a variable gap between the anode and the cathode, where the variable gap is capable of enabling a variable thermionic current between the anode and the cathode, where the thermionic converter is capable of an AC power output.Type: GrantFiled: July 17, 2013Date of Patent: March 7, 2017Assignee: The Board of Trustees of the Leland Stanford Junior UniversityInventors: Igor Bargatin, Roger T. Howe
-
Patent number: 9576697Abstract: A multilayer electronic component may include a multilayer body including a plurality of magnetic material layers, and an internal electrode disposed in the multilayer body. The internal electrode may contain a conductive metal and glass, and the glass contains a vanadium (V) oxide. Also, a conductive paste composition for an internal electrode includes a conductive metal and glass, wherein the glass contains a vanadium (V) oxide.Type: GrantFiled: September 12, 2014Date of Patent: February 21, 2017Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young Il Lee, So Yeon Song, Soo Hwan Son
-
Patent number: 9496136Abstract: A silicon nanoparticle fluid including a) a set of silicon nanoparticles present in an amount of between about 1 wt % and about 20 wt % of the silicon nanoparticie fluid; b) a set of HMW binder molecules present in an amount of between about 0 wt % and about 10 wt % of the silicon nanoparticle fluid; and c) a set of capping agent molecules, such that at least some capping agent molecules are attached to the set of silicon nanoparticles. Preferably, the silicon nanoparticle fluid is a shear thinning fluid.Type: GrantFiled: September 24, 2010Date of Patent: November 15, 2016Assignee: Innovalight, Inc.Inventors: Hyungrak Kim, Malcolm Abbott, Andreas Meisel, Elizabeth Tai, Augustus Jones, Dmitry Poplavskyy, Karel Vanheusden
-
Patent number: 9491802Abstract: Embodiments described herein provide for an on-chip alkali dispenser. The on-chip alkali dispenser includes a monolithic semiconductor substrate defining a trench therein, and an evaporable metal material disposed in the trench. A heating element is disposed proximate the evaporable metal material and configured to provide heat to the evaporable metal material. A getter material is disposed to sorb unwanted materials released from the evaporable metal material.Type: GrantFiled: February 11, 2013Date of Patent: November 8, 2016Assignee: Honeywell International Inc.Inventors: Jennifer S. Strabley, Karl D. Nelson, Robert Compton
-
Patent number: 9483147Abstract: Disclosed is a monolayer touch screen, which comprises: a transparent cover glass; a transparent emboss adhesive layer coated on a surface of the transparent cover glass, wherein the transparent emboss adhesive layer has multiple grooves that are located at non-visible region; a metallic mesh layer embedded in the transparent emboss adhesive layer, and the metallic mesh layer are located at a visible region; a hairline finishing layer deposited on the surface of the multiple grooves; and an ink layer coated on the hairline finishing layer. Hairline finishing layer of such monolayer touch screen deposits directly on the surface of multiple grooves of transparent emboss adhesive layer, compared to the traditional touch screen, such monolayer touch screen is thinner and has a hairline finishing effect. Also disclosed is a method for manufacturing the monolayer touch screen.Type: GrantFiled: August 15, 2013Date of Patent: November 1, 2016Assignee: Shenzhen O-Film Tech Co., Ltd.Inventors: Genchu Tang, Shengcai Dong, Wei Liu, Bin Tang
-
Patent number: 9466569Abstract: A semiconductor device includes a semiconductor substrate having a first major surface and a second major surface opposite the first major surface. A via extends through the substrate. The via is filled with conductive material and extends to at least the first major surface of the substrate. A thermal expansion inhibitor is over and in direct contact with the via proximate the first major surface. The thermal expansion inhibitor exerts a compressive stress on the conductive material closest to the thermal expansion inhibitor compared to the conductive material at a further distance from the thermal expansion inhibitor.Type: GrantFiled: November 12, 2014Date of Patent: October 11, 2016Assignee: Freescale Semiconductor, Inc.Inventors: Mehul D. Shroff, Douglas M. Reber
-
Patent number: 9447308Abstract: A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu—Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7.0 to 14 weight percent, all based on weight of the curable silicone composition; wherein the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method.Type: GrantFiled: March 13, 2014Date of Patent: September 20, 2016Assignee: DOW CORNING CORPORATIONInventors: John Albaugh, Brian Chislea, Adriana Zambova
-
Patent number: 9418958Abstract: An anisotropic conductive adhesive includes an epoxy adhesive containing an epoxy compound and a curing agent and conducive particles dispersed in the epoxy adhesive. When elastic moduluses at 35° C., 55° C., 95° C., and 150° C. of a cured product of the anisotropic conductive adhesive are denoted by EM35, EM55, EM95, and EM150, respectively, and change rates in the elastic modulus between 55° C. and 95° C. and between 95° C. and 150° C. are denoted by ?EM55-95 and ?EM95-150, respectively, the following expressions (1) to (5) are satisfied 700 Mpa?EM35?3000 MPa??(1) EM150<EM95<EM55<EM35??(2) ?EM55-95<?EM95-150??(3) 20%??EM55-95??(4) 40%??EM95-150??(5).Type: GrantFiled: December 12, 2013Date of Patent: August 16, 2016Assignee: DEXERIALS CORPORATIONInventors: Hidetsugu Namiki, Shiyuki Kanisawa, Genki Katayanagi
-
Patent number: 9399723Abstract: A pressure-sensitive adhesive composition comprising a) a polymer-metal blend comprising at least one pressure-sensitive adhesive and at least one metal component melting in the temperature range from 50° C. to 400° C., and b) at least one fibrous, electrically conductive filler, the filler being present at least partly in the form of a bound fiber network with the metal component.Type: GrantFiled: July 10, 2012Date of Patent: July 26, 2016Assignee: tesa SEInventor: Klaus Keite-Telgenbüscher
-
Patent number: 9390830Abstract: There is provided a conductive paste for screen printing. The conductive paste includes: metal nanoparticles (Y) having a surface coated with a polymer compound having a branched polyalkyleneimine chain and a polymer chain selected from the group consisting of a polyoxyalkylene chain, a polymer chain composed of a polyvinyl alcohol, a polymer chain composed of a water-soluble poly(meth)acrylic acid, a polyacylalkyleneimine chain, and a polymer chain composed of a polyacrylamide; an aliphatic monocarboxylic acid having 6 to 10 carbon atoms and/or succinic anhydride; and an organic solvent (B). A polyalkylene glycol is used as the organic solvent (B).Type: GrantFiled: December 21, 2010Date of Patent: July 12, 2016Assignee: DIC CORPORATIONInventors: Shou Inagaki, Hideki Etori, Hiroshi Isozumi, Masanori Kasai
-
Patent number: 9375965Abstract: Water soluble marking compounds comprising a transition metal oxyanion and at least one ammonium cation, comprising a nitrogen atom at least one further group selected from the group consisting of OH, COOH, NH2, NHC1-5 alkyl, and N(C1-5 alkyl)2, wherein the two C1-5 alkyl may be the same type of alkyl or different alkyls, may be used to obtain clear imageable coatings.Type: GrantFiled: August 12, 2011Date of Patent: June 28, 2016Inventors: Adam O'Rourke, Martin Walker, Richard Cook, Anthony Jarvis
-
Patent number: 9373738Abstract: Provided is a solar module with improved reliability. A solar module (1) is provided with a solar cell (10), a wiring member (11), a resin adhesive layer (12), and a buffer region (40). The wiring member (11) is electrically connected to the solar cell (10). The resin adhesive layer (12) bonds the solar cell (10) and the wiring member (11) to one another. The buffer region (40) is provided at least partially between the wiring member (11) and the solar cell (10). The buffer region (40) contains a non-crosslinked resin.Type: GrantFiled: February 18, 2014Date of Patent: June 21, 2016Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Kenichi Maki, Haruhisa Hashimoto
-
Patent number: 9362522Abstract: An object is to improve productivity related to a laser light irradiation step in a bonding technique of substrates using glass frit. A highly airtight sealing structure or a highly airtight light-emitting device, which can be manufactured with high productivity, is provided. When a glass layer by melting glass frit or a sintered body by sintering glass frit is irradiated with laser light, in order to increase the efficiency, a light-absorbing material is attached to a surface of the glass layer. The laser light irradiation is performed on the light-absorbing material and the glass layer. The substrates are fixed with the glass layer therebetween.Type: GrantFiled: October 22, 2013Date of Patent: June 7, 2016Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Shuji Fukai, Yusuke Kubota, Mika Jikumaru, Takeshi Nishi, Akihisa Shimomura, Yoji Nagano, Daiki Nakamura
-
Patent number: 9351398Abstract: Thick film conductive inks for electronic devices, methods for making electronic devices using thick film conductive inks, and electronic devices fabricated by such methods are provided herein. In one example, a thick film conductive ink includes an organic portion and an inorganic portion. The inorganic portion is dispersed in the organic portion to define a paste. The inorganic portion includes metallic copper powder, cupric oxide, and elemental boron. The thick film conductive ink includes substantially no glass.Type: GrantFiled: April 4, 2013Date of Patent: May 24, 2016Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLCInventors: Lisa M. Albaugh, David A. Smith, Timothy J. Guse
-
Patent number: 9343232Abstract: There is provided a conductive paste composition for an external electrode, the conductive paste composition including a polymer resin, spherical first conductive metal particles included in the polymer resin and being hollow in at least a portion thereof, and second conductive metal particles of a flake shape included in the polymer resin and being hollow in at least a portion thereof.Type: GrantFiled: October 23, 2013Date of Patent: May 17, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hwan Han, Byoung Jin Chun, Kyung Pyo Hong, Hyun Hee Gu, Byung Jun Jeon
-
Patent number: 9318255Abstract: A coil component that includes a drum-shaped core with an upper flange and a lower flange, a winding wound around the core, and an exterior resin between the upper flange and lower flange of the core. The exterior resin includes an inorganic filler at 91 to 95 mass % with respect to the exterior resin, and a resin that has more than one glass transition temperature and has a phase-separated structure. A flange spacing distance between the upper flange and the lower flange is 1.0 mm or less.Type: GrantFiled: September 17, 2014Date of Patent: April 19, 2016Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Hiroyuki Masaki, Nobuyuki Kinami, Hiroshi Marusawa
-
Patent number: 9318243Abstract: Provided are a conductive pattern forming method and a composition for forming a conductive pattern by photo irradiation or microwave heating, capable of increasing the conductivity of the conductive pattern. A conductive pattern is formed by preparing a composition for forming a conductive pattern comprising, copper particles each having a copper oxide thin film on the entirety or a part of the surface thereof, copper oxide particles, a reducing agent such as a polyhydric alcohol, a carboxylic acid, or a polyalkylene glycol, and a binder resin; forming a printed pattern having any selected shape on a substrate using this composition for forming a conductive pattern; and subjecting the printed pattern to photo irradiation or microwave heating to generate a sintered body of copper.Type: GrantFiled: November 26, 2012Date of Patent: April 19, 2016Assignee: SHOWA DENKO K.K.Inventor: Hiroshi Uchida
-
Patent number: 9285610Abstract: A nanostructure and method for assembly thereof are disclosed. The nanostructure includes a gain medium nanoparticle; an output coupler nanoparticle being discrete from and linked to the gain medium nanoparticle; and a plurality of metal nanoparticles being linked about the gain medium nanoparticle, wherein the gain medium nanoparticle and the output coupler nanoparticle are included in the nanostructure in a one to one ratio.Type: GrantFiled: August 5, 2013Date of Patent: March 15, 2016Assignee: BAE Systems Information and Electronic Systems Integration Inc.Inventors: Idan Mandelbaum, Tadd C. Kippeny
-
Patent number: 9287018Abstract: A method for preparing silver-based electrical contact materials with fiber-like arrangement of reinforcing nanoparticles includes (1) uniformly mixing reinforcement powders and silver matrix powders for ball milling; (2) pouring the obtained composite powders and silver matrix powders into a powder mixing machine for powder mixing; (3) cold isostatic pressing; (4) sintering; (5) hot pressing; and (6) hot extruding to obtain silver-based electrical contact materials with fiber-like arrangement of reinforcing nanoparticles. The method of the present invention can obtain silver-based electrical contact materials with fiber-like arrangement of reinforcing nanoparticles with no specific requirement on processing deformation, and the plasticity and ductility of the reinforcing phase. Furthermore, it has simple processes, low cost and no particular requirements on the equipment.Type: GrantFiled: April 11, 2011Date of Patent: March 15, 2016Assignee: Wenzhou Hongfeng Electrical Alloy Co., Ltd.Inventors: Lesheng Chen, Xiao Chen, Gengxin Qi, Chengfa Mu
-
Patent number: 9281447Abstract: The method for synthesizing indium phosphide nanoparticles using indium trichloride as an indium raw material and tris(dimethylamino)phosphine as a phosphorus raw material, includes a preparation step of mixing the indium raw material, the phosphorus raw material, an organic solvent having a boiling point of 170° C. or higher, and a particle surface ligand to obtain a mixture solution and a synthesis step of synthesizing the indium phosphide nanoparticles by heating the mixture solution to 150° C. or higher but lower than 170° C. In the method, the particle surface ligand is an aliphatic amine having a carbon number of 18 or more, and the indium trichloride is an anhydride.Type: GrantFiled: November 27, 2013Date of Patent: March 8, 2016Assignee: FUJIFILM CorporationInventor: Makoto Kikuchi
-
Patent number: 9275773Abstract: The present invention relates to a dispersion comprising metallic, metal oxide or metal precursor nanoparticles and a polymeric dispersant, the dispersant comprising an anchor group with affinity for the metallic, metal oxide or metal precursor nanoparticles that is chemically bonded to a polymeric backbone characterized in that the dispersant has a 95 wt. % decomposition at a temperature below 300° C. as measured by Thermal Gravimetric Analysis. It further relates to metallic fluids or inks prepared from the dispersion and to the preparation of the dispersion and the metallic fluid or inks.Type: GrantFiled: December 19, 2011Date of Patent: March 1, 2016Assignee: Agfa-Gevaert N.V.Inventors: Xavier André, Dirk Bollen, Johan Loccufier
-
Patent number: 9257727Abstract: An assembled battery includes a conductive filler, a first cell, a second cell. The first cell includes a flat first electrode tab made of aluminum or an aluminum alloy. The second cell includes a flat second electrode tab made of aluminum or an aluminum alloy. The second electrode tab is electrically connected to the first electrode tab through the conductive filler intervening between the first cell and the second cell and through weld surfaces of the first cell and the second cell which are at least partly welded to each other.Type: GrantFiled: March 20, 2008Date of Patent: February 9, 2016Assignee: Kabushiki Kaisha ToshibaInventors: Yasuhiro Harada, Norio Takami, Hiroki Inagaki, Yoshinao Tatebayashi
-
Patent number: 9255205Abstract: The method for manufacturing a silver particle-containing composition according to the invention is directed to a method for manufacturing a silver particle-containing composition coated with a fatty acid and includes a step (A) of preparing silver particles coated with a first fatty acid (a) with 3 to 7 carbon atoms, a second fatty acid (b) with 2 to 20 carbon atoms, and a solvent in which the first and second fatty acids can disperse, respectively, a step (B) of adding the silver particles coated with the first fatty acid (a) and the second fatty acid (b) into the solvent, and a step (C) of substituting the second fatty acid (b) for the first fatty acid (a) coating the silver particles after the addition step.Type: GrantFiled: October 28, 2011Date of Patent: February 9, 2016Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Yu Saito, Shinya Sasaki
-
Patent number: 9251925Abstract: There are provided a conductive paste for external electrodes and a multilayer ceramic electronic component using the same. The conductive paste includes a conductive metal powder including conductive metal particles; and a conductive amorphous metal powder including amorphous metal particles having a(Si, B)-b(Li, K)-c(V, Mn) in which a+b+c=100, 20?a?60, 10?b?40, and 2?c?25 are satisfied.Type: GrantFiled: July 3, 2013Date of Patent: February 2, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Bum Suk Kang, Hew Young Kim, Jeong Ryeol Kim, Chang Hoon Kim, Dong Hoon Kim, Doo Young Kim
-
Patent number: 9228262Abstract: A catalyst solution includes a precious metal nanoparticle and a polymer having a carboxyl group and a nitrogen atom. The catalyst solution is useful for a catalyzing an electroless process for plating metal on non-conductive surfaces.Type: GrantFiled: June 16, 2015Date of Patent: January 5, 2016Inventors: Wenjia Zhou, Suk Kwan Kwong, Chit Yiu Chan, Kwok-Wai Yee
-
Patent number: 9223059Abstract: There is provided a benzocyclobutene compound represented by Formula (1) where n is an integer from 0 to 2, R1 and R2 are each independently selected from a hydrogen atom and a saturated hydrocarbon group having 1 to 5 carbon atoms, and A is selected from a direct bond and a substituted or unsubstituted chain saturated divalent hydrocarbon group having 1 to 20 carbon atoms.Type: GrantFiled: June 25, 2013Date of Patent: December 29, 2015Assignee: Canon Kabushiki KaishaInventor: Seiji Okada
-
Patent number: 9206502Abstract: A sputtering target including an oxide A and InGaZnO4, the oxide A having a diffraction peak in regions A to K at 2?=7.0° to 8.4°, 30.6° to 32.0°, 33.8° to 35.8°, 53.5° to 56.5°, 56.5° to 59.5°, 14.8° to 16.2°, 22.3° to 24.3°, 32.2° to 34.2°, 43.1° to 46.1°, 46.2° to 49.2°, and 62.7° to 66.7°.Type: GrantFiled: April 27, 2012Date of Patent: December 8, 2015Assignee: IDEMITSU KOSAN CO., LTD.Inventors: Misa Sunagawa, Masayuki Itose, Mami Nishimura, Masashi Kasami
-
Patent number: 9190188Abstract: This invention provides a method for using a polymer thick film copper conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film copper conductor composition to photonic sintering. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to photonic sintering. The invention further provides devices containing electrical conductors made by these methods. The invention also provides a polymer thick film copper conductor composition.Type: GrantFiled: June 13, 2013Date of Patent: November 17, 2015Assignee: E I DU PONT DE NEMOURS AND COMPANYInventor: John D Summers
-
Patent number: 9183967Abstract: An electroconductive paste comprising first copper particles having a specific surface area of about 0.15-1.0 m2/g, second copper particles having a specific surface area of about 0.5-2.5 m2/g, glass frit and an organic vehicle. According to another embodiment of the invention, the first copper particles are about 60-80 wt. % of the paste, while the content of the second copper particles is up to about 20 wt. % of the paste. According to another embodiment, the glass frit is lead-free and is about 1-10 wt. % of the paste. Preferably, the glass frit comprises a boron-zinc-barium oxide glass frit. According to another embodiment, the paste further comprises copper oxide. Another embodiment of the invention relates to an electroconductive paste comprising about 60-95 wt. % copper component, a boron-zinc-barium oxide glass frit, and an organic vehicle.Type: GrantFiled: September 10, 2013Date of Patent: November 10, 2015Assignee: Heraeus Precious Metals North America Conshohocken LLCInventors: Samson Shahbazi, Mark Challingsworth, Steve Grabey, Ryan Persons
-
Patent number: 9153355Abstract: A paste composition for a solar cell electrode, a solar cell electrode fabricated using the same, and a solar cell including the electrode, the paste composition including a mixture of conductive powders, the mixture of conductive powders including about 30 wt % to about 55 wt % of a first spherical powder having an average particle diameter D50 of 1.5 ?m or less; about 3 wt % to about 8 wt % of a flake powder having an average particle diameter D50 of about 2 ?m to about 3.5 ?m; and a balance of a second spherical powder having an average particle diameter D50 of greater than 1.5 ?m; glass fit; and an organic vehicle.Type: GrantFiled: September 5, 2012Date of Patent: October 6, 2015Assignee: CHEIL INDUSTRIES, INC.Inventors: Young Wook Choi, Sang Hyun Yang, Dae Seop Song
-
Patent number: 9129725Abstract: A paste composition contains an electrically conductive silver powder, one or more glass frits or fluxes, and a lithium compound dispersed in an organic medium. The paste is useful in forming an electrical contact on the front side of a solar cell device having an insulating layer. The lithium compound aids in establishing a low-resistance electrical contact between the front-side metallization and underlying semiconductor substrate during firing.Type: GrantFiled: December 9, 2011Date of Patent: September 8, 2015Assignee: E I DU PONT DE NEMOURS AND COMPANYInventors: Steven Dale Ittel, Zhigang Rick Li, Kurt Richard Mikeska, Paul Douglas Vernooy
-
Patent number: 9095275Abstract: Disclosed herein are novel contact sensors. The contact sensors disclosed herein include a conductive composite material formed of a polymer and a conductive filler. In one particular aspect, the composite materials can include less than about 10 wt % conductive filler. Thus, the composite material of the contact sensors can have physical characteristics essentially identical to the polymer, while being electrically conductive with the electrical resistance proportional to the load on the sensor. The sensors can provide real time dynamic contact information for joint members under conditions expected during use. In one particular aspect, the sensor can be used to properly balance the knee ligaments in a total knee replacement surgery.Type: GrantFiled: June 3, 2010Date of Patent: August 4, 2015Inventor: Andrew C. Clark
-
Patent number: 9093192Abstract: This silver-coated spherical resin includes: a spherical resin; and silver coated on a surface of the spherical resin, wherein an amount of the silver is in a range of 2 to 80 parts by mass with respect to 100 parts by mass of the silver-coated spherical resin, and a crystallite diameter of the silver measured by X-ray diffractometry is in a range of 18 to 24 nm. This method for producing a silver-coated spherical resin includes: a process of subjecting a spherical resin to a pretreatment using an aqueous solution of a tin compound; and a subsequent process of subjecting the spherical resin to an electroless silver plating using a reducing agent, wherein, during the pretreatment, a temperature of the aqueous solution of the tin compound is set to be in a range of 20 to 45° C.Type: GrantFiled: August 17, 2011Date of Patent: July 28, 2015Assignees: MITSUBISHI MATERIALS CORPORATION, Mitsubishi Materials Electronic Chemicals Co., Ltd.Inventors: Akira Nakabayashi, Shigeharu Sasaki, Kazutoshi Yamamoto, Maki Yamaguchi
-
Patent number: 9090785Abstract: The present invention relates to a silver ink composition comprising: silver complexes obtained by reacting one or more silver compounds selected from chemical formula 1 with one or more ammonium carbamate-based compounds or ammonium carbonate-based compounds selected from chemical formula 2 to chemical formula 4; and oxime-based compounds.Type: GrantFiled: April 20, 2012Date of Patent: July 28, 2015Assignee: INKTEC CO., LTD.Inventors: Kwang-Choon Chung, Hyun Nam Cho, Ji Hoon Yoo, Dae Sang Han
-
Patent number: 9088014Abstract: A method of manufacturing a secondary battery, using an electrode plate having an electrode mixture layer formed from an electrode mixture paste, includes performing wet preliminary kneading to knead a powder and a solvent with a stirrer, while measuring kneading torque, determining a mixing ratio of the powder to the solvent used in the wet preliminary kneading in the case where the kneading torque once increases as kneading time passes from start of kneading, reaches a peak value, and then decreases, as a desirable mixing ratio, and performing main kneading to mix and knead the powder and the solvent of the electrode mixture paste, at the mixing ratio determined as the desirable mixing ratio, at a shearing speed that does not exceed a speed of shearing a mixture of the powder and the solvent with the stirrer during the wet preliminary kneading, and producing the electrode mixture paste.Type: GrantFiled: January 30, 2013Date of Patent: July 21, 2015Assignee: Toyota Jidosha Kabushiki KaishaInventors: Tomohide Sumi, Takumi Mio
-
Patent number: 9082899Abstract: Electrically conductive polymeric compositions adapted for use in forming electronic devices are disclosed. The compositions are thermally curable at temperatures less than about 250° C. Compositions are provided which may be solvent-free and so can be used in processing or manufacturing operations without solvent recovery concerns. The compositions utilize (i) fatty acid modified epoxy acrylate and/or methacrylate monomer(s) and/or oligomer(s), (ii) fatty acid modified polyester acrylate and/or methacrylate monomer(s) and/or oligomer(s), or combinations of (i) and (ii). Also described are electronic assemblies such as solar cells using the various compositions and related methods.Type: GrantFiled: October 17, 2013Date of Patent: July 14, 2015Assignee: Heraeus Precious Metals North America Conshohocken LLCInventors: Hong Jiang, Aziz S. Shaikh