Abstract: A method of making nanostructured alloy particles includes milling a millbase in a pebble mill containing milling media. The millbase comprises: (i) silicon, and (ii) at least one of carbon or a transition metal, and wherein the nanostructured alloy particles are substantially free of crystalline domains greater than 50 nanometers in size. A method of making a negative electrode composition for a lithium ion battery including the nanostructured alloy particles is also disclosed.

Abstract: Disclosed is a conductive ink composition, a manufacturing method thereof, and a manufacturing method of a conductive thin film using the same, and more specifically, a conductive ink composition is provided that includes composite metal nanoparticles including first metal nanoparticles and second metal nanoparticles, and a polymer matrix. The polymer matrix is a composition including a polymer and a solvent, the first metal nanoparticles and the second metal nanoparticles are different metals, and the content of the composite metal nanoparticles is about 20 to about 25 wt %, the content of the polymer is about 5 to about 10 wt %, and the content of the solvent is about 65 to about 75 wt %, based on the total weight of the composition.

Abstract: According to example embodiments, a conductive paste includes a conductive component that contains a conductive powder and a titanium (Ti)-based metallic glass. The titanium-based metallic glass has a supercooled liquid region of about 5K or more, a resistivity after crystallization that is less than a resistivity before crystallization by about 50% or more, and a weight increase by about 0.5 mg/cm2 or less after being heated in a process furnace at a firing temperature. According to example embodiments, an electronic device and a solar cell may include at least one electrode formed using the conductive paste according to example embodiments.

Abstract: The invention relates to inorganic, intermetallic, inhomogeneous compounds having a magnetic resistance effect and an intrinsic field sensitivity of at least 7% at 1 T at room temperature. The invention further relates to a method for the production and use thereof, particularly as magnetic field sensors or in spin electronics.

Abstract: Disclosed are a resistive random-access memory (ReRAM) based on resistive switching using a resistance-switchable conductive filler and a method for preparing the same. When a resistance-switchable conductive filler prepared by coating a conductive filler with a material whose resistance is changeable is mixed with a dielectric material, the dielectric material is given the resistive switching characteristics without losing its inherent properties. Therefore, various resistance-switchable materials having various properties can be prepared by mixing the resistance-switchable conductive filler with different dielectric materials. The resulting resistance-switchable material shows resistive switching characteristics comparable to those of the existing metal oxide film-based resistance-switchable materials. Accordingly, a ReRAM device having the inherent properties of a dielectric material can be prepared using the resistance-switchable conductive filler.

Abstract: A conductive paste may include a conductive component and an organic vehicle. The conductive component may include an amorphous metal. The amorphous metal may have a lower resistivity after a crystallization process than before the crystallization process, and at least one of a weight gain of about 4 mg/cm2 or less and a thickness increase of about 30 ?m or less after being heated in a process furnace at a firing temperature.

Abstract: Electronic, in particular optical or optoelectronic, component comprising a device which comprises a thermoplastic material which has particles which comprise a core and a shell, wherein the shell is disposed on the surface of the core and wherein the core comprises aluminium.

Abstract: A composite resin material particle of the present invention includes: a resin material particle that is a material for producing a resin molding product; and a conductive nano-material, wherein a dispersion mixing layer, which is obtained by dispersedly mixing the conductive nano-material from the surface to the inside of the resin material particle, is formed over all of the surface or at least a part of the surface of the resin material particle, the conductive nano-material is dispersedly mixed within a resin material of the resin material particle in the dispersion mixing layer, and the whole of the dispersion mixing layer forms a conductive layer.

Abstract: The invention relates to a method for preparing an aqueous-based dispersion of metal nanoparticles comprising: (a) providing an aqueous suspension of a metal salt; (b) pre-reducing the metal salt suspension by a water soluble polymer capable of metal reduction to form a metal nuclei; and (c) adding a chemical reducer to form metal nanoparticles in dispersion. The invention further relates to aqueous-based dispersions of metal nanoparticles, and to compositions such as ink comprising such dispersions.

Abstract: An electrically conductive polymer compound is disclosed. The compound comprises a matrix comprising two polyolefin copolymers having different melt mass flow rates and electrically conductive functional additive particles dispersed in the matrix. The compound is useful for making extruded and molded plastic articles that need electrical conductivity.

Abstract: The present invention is directed to a process for manufacture of base metal nano-particles using precious metal seed particles. The process comprises the steps of mixing at least one base metal precursor and at least one precious metal precursor in one or more polyol solvents, reacting the mixture at a temperature in the range of 110 to 150° C. to form precious metal seed particles (STEP A) and reacting the mixture at a temperature in the range of 180 to 220° C. to form the final metal particles (STEP B). Base metal particles of Co, Ni and Cu containing 100 to 10000 ppm of precious metals Ru, Pd, Pt or Ir are obtained. The resulting metal nano-particles with medium diameters of 20 to 200 nm are useful for electronic and catalytic applications and can be used as core materials for the manufacture core/shell type catalysts.

Abstract: A conductive metal via paste comprising particulate conductive metal, phosphorus-containing material, glass frit, and an organic vehicle. is particularly useful in providing the metallization of the holes in the silicon wafers of MWT solar cells. The result is a metallic electrically conductive via between the collector lines on the front side and the emitter electrode on the back-side of the solar cell. The paste can also be used to form the collector lines on the front-side of the solar cell and the emitter electrode on the back-side of the solar cell. Also disclosed are metal-wrap-through silicon solar cells comprising the fired conductive metal paste.

Abstract: An aqueous active material composition, an electrode, and a rechargeable lithium battery including the same, the aqueous active material composition including an active material; a binder; and a water-soluble cellulose mixture, wherein the water-soluble cellulose mixture includes a first cellulose compound having a degree of substitution of about 0.5 to about 0.9 and a second cellulose compound having a degree of substitution of about 1.1 to about 1.5.

Abstract: One embodiment of a quantum well structure comprises an active region including active layers that comprise quantum wells and barrier layers wherein some or all of the active layers are p type doped. P type doping some or all of the active layers improves the quantum efficiency of III-V compound semiconductor light emitting diodes by locating the position of the P-N junction in the active region of the device thereby enabling the dominant radiative recombination to occur within the active region. In one embodiment, the quantum well structure is fabricated in a cluster tool having a hydride vapor phase epitaxial (HVPE) deposition chamber with a eutectic source alloy. In one embodiment, the indium gallium nitride (InGaN) layer and the magnesium doped gallium nitride (Mg—GaN) or magnesium doped aluminum gallium nitride (Mg—AlGaN) layer are grown in separate chambers by a cluster tool to avoid indium and magnesium cross contamination.

Abstract: A conductive metal via paste comprising particulate conductive metal, a reactant that reacts at temperatures of 600° C. to 900° C. with at least one of the group consisting of Si, SiO2 and SiNx to form an insulating glass, and an organic vehicle is particularly useful in providing the metallization of the holes in the silicon wafers of MWT solar cells. The result is a metallic electrically conductive via between the collector lines on the front side and the emitter electrode on the back-side of the solar cell. The paste can also be used to form the collector lines on the front-side of the solar cell and the emitter electrode on the back-side of the solar cell. Also disclosed are metal-wrap-through silicon solar cells comprising the fired conductive metal paste.

Abstract: A joint compound for electrical connections is disclosed which includes an antioxidant base material and a quantity of stainless steel grit mixed with the antioxidant base material to provide improved mechanical pullout strength. The joint compound has a weight ratio of antioxidant to stainless steel grit in the range of from about 30:70 to about 90:10, preferably, from about 40:60 to about 70:30, and more preferably about 50:50. The stainless steel grit is cut wire having a diameter within the range of from about 0.012 inches to about 0.125 inches, with a preferred diameter within the range of from about 0.012 inches to about 0.030 inches, and 0.017 inches being a more preferred stainless steel grit diameter.

Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.

Abstract: The present invention relates to a conductive adhesive, a method for manufacturing the same, and an electronic device including the same. The conductive adhesive includes: a conductive particle; a low-melting alloy powder including an alloy including Sn and at least one material selected from the group consisting of Ag, Cu, Bi, Zn, In, and Pb; a nano powder; a first binder including a thermosetting resin; and a second binder including a rosin compound.

Abstract: A conductive adhesive comprising conductive particles including metal, a thermosetting resin, a flux activator, and preferably a rheology control agent is provided. A melting point of the conductive particles is preferably 220° C. or lower. The conductive adhesive is used for electrically connecting and adhering wiring members 4a, 4b to electrodes 3a, 3b connected to a solar battery cell 6.

Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.

Abstract: An electrically conductive adhesive (ECA) for repairing electrically conductive pad and trace interconnects and a method of repairing interconnect locations. The method of repairing at least one defect within the area of electrically conductive circuitized substrate traces and pads outside of a pristine center area incorporates an ECA and a forming gas plasma. The ECA contains a mixture of components that allow the adhesive to be adapted to specific requirements. Curing the adhesive results in effective electrical connections being formed between the adhesive and the base pad so that the metallurgies of the conductors and of the ECA are effectively combined to engage and repair the conductor defect.

Abstract: The present disclosure relates to methods for tuning the work function of a metal nanostructure-based conductive film by forming a dipole surface layer on individual metal nanostructures.

Abstract: The present invention relates to a conductive metal ink composition which is properly applied for roll-printing process to form conductive pattern with improved conductivity, and the method of preparing a conductive pattern using the same. The conductive metal ink composition comprises a conductive metal powder; an organic silver complex where an organic ligand including amine group and hydroxyl group binds with a silver (Ag) salt of aliphatic carboxylic acid; a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or lower at 25° C. and a second non-aqueous solvent having a vapor pressure of higher than 3 torr at 25° C.; and a coatability improving polymer.

Abstract: A conductive composition for a front electrode busbar of a silicon solar cell includes a metallic powder, a solder powder, a curable resin, a reducing agent, and a curing agent. A method of manufacturing a front electrode busbar of a silicon solar cell includes applying the composition to the front surface of the silicon solar cell wherein its front electrode finger line is formed. A substrate includes a front electrode busbar of a silicon solar cell, formed with a conductive composition. A silicon solar cell includes one or more electrodes containing a conductive composition including a conductive powder, a curable resin, a reducing agent, and a curing agent. A method of manufacturing the silicon solar cell includes forming a first electrode array with a first conductive composition, forming a second electrode, and forming a third electrode with a third conductive composition.

Abstract: A composition comprises a poly(arylene ether), a polyamide, electrically conductive filler, an impact modifier, and wollastonite wherein the wollastonite particles have an average length to diameter ratio less than or equal to 5 and a median particle size of 2 to 5 micrometers. Methods of making the composition are also described.

Abstract: To provide functional paste with etching activity and good electrical properties. Functional paste comprising a metal powder, an etching agent, a binder and an organic solvent.

Abstract: An exemplary printable composition comprises a liquid or gel suspension of a plurality of metallic nanofibers; a first solvent; and a viscosity modifier, resin, or binder. In various embodiments, the metallic nanofibers are between about 10 microns to about 100 microns in length, are between about 10 nm to about 120 nm in diameter, and are typically functionalized with a coating or partial coating of polyvinyl pyrrolidone or a similar compound. An exemplary metallic nanofiber ink which can be printed to produce a substantially transparent conductor comprises a plurality of metallic nanofibers; one or more solvents such as 1-butanol, ethanol, 1-pentanol, n-methylpyrrolidone, cyclohexanone, cyclopentanone, 1-hexanol, acetic acid, cyclohexanol, or mixtures thereof; and a viscosity modifier, resin, or binder such as polyvinyl pyrrolidone or a polyimide, for example.

Abstract: Provided is a copper nano paste that can be calcined at a relatively low temperature. The copper nano paste includes: a binder added in an amount of 0.1 to 30 parts by weight; an additive added in an amount of not more than 10 parts by weight; and copper particles added in an amount of 1 to 95 parts by weight, wherein the copper particles have a particle size of 150 nm or less, and the surfaces of the copper particles are coated with a capping material.

Abstract: A conductive metal paste composition including conductive metal particles including first metal particles having a particle size of less than 100 nm, and second metal particle of particle size greater than 100 nm, and a surface coated with a capping material; a binder; and a solvent, a method of manufacturing the same, and an electrode and a conductive circuit of an electronic device using the same. The paste composition containing two or more kinds of conductive metal particles with different particle sizes can secure high conductivity compared to a conventional metal pastes during low temperature or short-time medium and high temperature sintering.

Abstract: Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a charge director adhered to the organic acid film.

Abstract: The present invention is to provide a device capable of having an easy production process and achieving a long lifetime. A device comprising a substrate, two or more electrodes facing each other disposed on the substrate and a positive hole injection transport layer disposed between two electrodes among the two or more electrodes, wherein the positive hole injection transport layer comprises a transition metal-containing nanoparticle containing at least a transition metal compound including a transition metal oxide, a transition metal and a protecting agent, or at least the transition metal compound including the transition metal oxide, and the protecting agent.

Abstract: A conductive pattern-forming composition is obtained by loading a silicone rubber composition comprising a curable organopolysiloxane and a curing agent with conductive submicron particles.

Abstract: The present invention relates to a conductive metal ink composition which is properly applied for roll-printing process to form conductive pattern, and the method of preparing a conductive pattern using the same. The conductive metal ink composition comprises a conductive metal powder; a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or lower at 25° C. and a second non-aqueous solvent having a vapor pressure of higher than 3 torr at 25° C.; and a coatability improving polymer and is coated for forming the conductive pattern by the roll printing method.

Abstract: In OLEDs, improved efficiency is obtained by compounds which can form inter alia electron injection layers of the formula (I) wherein R1 is a 1-5 ring aryl (including polycyclic), aralkyl or heteroaryl group which is optionally substituted with one or more C1-C4 alkyl, alkoxy or cyano; R2 and R3 together form a 1-5 ring aryl (including polycyclic), aralkyl or heteroaryl group which is optionally substituted with C1-C4 alkyl, alkoxy or cyano; R4 is hydrogen, C1-C4 alkyl or aryl; and Ar is monocyclic, bicyclic or tricyclic aryl or heteroaryl which is optionally substituted with one or more C1-C4-alkyl or alkoxy groups, or an oligomer thereof.

Abstract: There is provided a conductive filler with high heat resistance which can be melt-bonded under reflow heat treatment conditions for a lead-free solder and, after the bonding, does not melt under the same heat treatment conditions. The conductive filler is characterized in that, as measured by differential scanning calorimetry, it has at least one metastable metal alloy phase observed as an exothermic peak and has at least one melting point observed as an endothermic peak in each of the 210 to 240° C. range and the 300 to 450° C. range, and that the filler, upon heat treatment at 246° C., gives a bonded object which has, as measured by differential scanning calorimetry, no melting point observed as an endothermic peak in the 210 to 240° C. range or has a melting endotherm calculated from an endothermic peak area in the 210 to 240° C. range, the melting endotherm being 90% or less of the melting endotherm of the filler before bonding calculated from an endothermic peak area in the 210 to 240° C. range.

Abstract: A sintered indium oxide comprising niobium as an additive, wherein the ratio of the number of niobium atoms relative to the total number of atoms of all metal elements contained in the sintered compact is within a range of 1 to 4%, the relative density is 98% or higher, and the bulk resistance is 0.9 m?·cm or less. Provided are a sintered compact of indium oxide system and a transparent conductive film of indium oxide system, which have characteristics of high transmittance in the short wavelength and long wavelength ranges since the carrier concentration is not too high even though the resistivity thereof is low.

Abstract: Compositions, and methods of making thereof, comprising from about 1% to about 5% of a perfluorinated sulfonic acid ionomer or a hydrocarbon-based ionomer; and from about 95% to about 99% of a solvent, said solvent consisting essentially of a polyol; wherein said composition is substantially free of water and wherein said ionomer is uniformly dispersed in said solvent.

Abstract: A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition, conductive particles, and light-reflective insulating particles. The light-reflective insulating particles are at least one of inorganic particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, and aluminum oxide, or resin-coated metal particles formed by coating the surface of scale-like or spherical metal particles with an insulating resin.

Abstract: To obtain low resistance and high adhesion at the same time in a solar cell electrode, a conductive paste is offered. A conductive paste for solar cell electrode contains conductive powder, organic medium and glass frit which is mixture of more than one kind of glass frit such as a mixture of glass frit containing at least PbO and glass frit containing at least Bi2O3.

Abstract: An activator composition for forming an activator-containing region on a substrate for activating a chemical reaction to form a conductive metal region on the substrate, the composition being suitable for thermal inkjet printing, the composition comprising a single phase aqueous composition including one or more curable materials and one or more co-solvents for the curable material(s); and an activator for reaction to form a conductive metal region. Conductive metal regions may be formed on the resulting activator-containing regions by a metallisation reaction such as electroless deposition.

Abstract: A method for making a polycrystalline composition, wherein the method includes the steps of a) preparing a precursor material, b) heating the precursor material to a reaction temperature in the presence of a precursor vapor supplied from a source at a preselected partial pressure, for a sufficient time to initiate an interaction between the precursor material and the precursor vapor to form a heated precursor material, and c) cooling the heated precursor material at a predetermined cooling rate, optionally, in the presence of the precursor vapor supplied at a partial pressure, to yield the polycrystalline composition.

Abstract: Embodiments of the invention relate to a silicon semiconductor device, and a conductive silver paste for use in the front side of a solar cell device.

Abstract: The invention relates to a method for preparing an aqueous-based dispersion of metal nanoparticles comprising: (a) providing an aqueous suspension of a metal salt; (b) pre-reducing the metal salt suspension by a water soluble polymer capable of metal reduction to form a metal nuclei; and (c) adding a chemical reducer to form metal nanoparticles in dispersion. The invention further relates to aqueous-based dispersions of metal nanoparticles, and to compositions such as ink comprising such dispersions.

Abstract: A negative electrode including: a current collector; a negative active material layer formed on the current collector; and a polymer coating layer that is formed on the negative active material layer and comprises a fluorinated acrylate type polymer.

Abstract: A conductive paste includes a conductive powder, a metallic glass, and an organic vehicle. The metallic glass includes a first element, a second element having a higher absolute value of Gibbs free energy of oxide formation than the first element, and a third element having an absolute value of Gibbs free energy of oxide formation of about 1000 kJ/mol or less at a baking temperature and a eutectic temperature with the conductive powder of less than about 1000° C. An electronic device and a solar cell may include an electrode formed using the conductive paste.

Abstract: A subject is to provide a material capable of obtaining a transparent conductive film having an excellent conductivity, optical transparency, environmental resistance, process resistance and close contact in a single application process, and to provide a transparent conductive film and a device element using the same. The means is to prepare a coating forming composition containing at least one kind of materials selected from the group of metal nanowires and metal nanotubes as a first component, polysaccharides and a derivative thereof as a second component, a thermosetting resin compound as a third component, and water as a fourth component to obtain a transparent conductive film by using the coating.

Abstract: A conductive paste includes a conductive powder, a metallic glass, and an organic vehicle. The metallic glass may be an alloy including a first element with an atomic radius that satisfies the following equation: (r1?rn)/(r1+rn/2)×100?9% In the equation, r1 may be an atom radius of the first element, rn may be an atom radius of other elements included in the metallic glass, and n may be an integer ranging from 2 to 10.

Abstract: The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, solar cells and/or solar modules. The adhesives comprise at least one resin component, at least one nitrogen-containing curative, at least one low melting point metal filler, and optionally at least one electrically conductive filler, which is different from the metal filler.

Abstract: A light-reflective conductive particle for an anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a core particle coated with a metal material and a light-reflecting layer formed from light-reflective inorganic particles having a refractive index of 1.52 or more on a surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or more include titanium oxide particles, zinc oxide particles, or aluminum oxide particles.

Abstract: A metal seed composition useful in seeding a metal diffusion barrier or conductive metal layer on a semiconductor or dielectric substrate, the composition comprising: a nanoscopic metal component that includes a metal useful as a metal diffusion barrier or conductive metal; an adhesive component for attaching said nanoscopic metal component on said semiconductor or dielectric substrate; and a linker component that links said nanoscopic metal component with said adhesive component. Semiconductor and dielectric substrates coated with the seed compositions, as well as methods for depositing the seed compositions, are also described.