Noble Metal (gold, Silver, Ruthenium, Rhodium, Palladium, Osmium, Iridium, Platinum) Patents (Class 252/514)
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Patent number: 8486310Abstract: A composition containing fine silver particles which have a uniform particle size, can form a fine drawing pattern, and have a small environmental impact, a method for producing that composition, a method for producing fine silver particles, and a paste having fine silver particles are provided. The fine silver particles are produced by carrying out a fluid preparation step of preparing a reduction fluid, a silver reaction step, and a filtration/washing step. The reaction step is carried out by adding an aqueous silver nitrate fluid to a reduction fluid whose temperature has been increased to a range between 40 and 800 ° C. The aqueous silver nitrate fluid is added at a stretch. The composition containing fine silver particles is produced by dispersing the composition containing the fine silver particles in a polar fluid.Type: GrantFiled: July 20, 2011Date of Patent: July 16, 2013Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Yutaka Hisaeda, Toshihiko Ueyama
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Patent number: 8486308Abstract: A lead-free paste composition contains an electrically conductive silver powder, one or more glass frits or fluxes, and a lithium compound dispersed in an organic medium. The paste is useful in forming an electrical contact on the front side of a solar cell device having an insulating layer. The lithium compound aids in establishing a low-resistance electrical contact between the front-side metallization and underlying semiconductor substrate during firing.Type: GrantFiled: December 8, 2011Date of Patent: July 16, 2013Assignee: E I du Pont de Nemours and CompanyInventors: Steven Dale Ittel, Zhigang Rick Li, Kurt Richard Mikeska, Paul Douglas Vernooy
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Publication number: 20130175485Abstract: An electroconductive liquid resin composition including epoxy resin; a curing agent, such that an equivalent ratio of the curing agent to the epoxy resin ranges from 0.8 to 1.25, wherein at least one of the components is liquid; a curing promoter in an amount of 0.05 to 10 parts by mass, per total 100 parts by mass of the resin and agent; an electroconductive filler in an amount of 300 to 1,000 parts by mass, per total 100 parts by mass of the resin and agent; and particles of a thermoplastic resin which is solid at 25 degrees C. in an amount of 3 to 50 parts by mass, per total 100 parts by mass of the resin and agent, wherein when the composition is heated, an average diameter of the particles after heated becomes at least one and a half times an average diameter of the particles before heated.Type: ApplicationFiled: December 14, 2012Publication date: July 11, 2013Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventor: SHIN-ETSU CHEMICAL CO., LTD.
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Publication number: 20130168613Abstract: The high impact strength conductive adhesive is a mixture formed from a bisphenol A-based epoxy resin, a curing agent, and silver flakes. In one embodiment, the bisphenol A-based epoxy resin forms about 10.5 wt % of the mixture and the curing agent forms about 14.5 wt % of the mixture, the balance being silver flakes. In this embodiment, the curing agent is preferably an oligomeric polyamine curing agent, such as amidoamine-polyoxypropylenediamine t-butyl phenol. Each silver flake preferably has a tap density of between about 4.0 g/cm3 and about 5.8 g/cm3, and a surface area of between about 0.8 m2/g and about 0.3 m2/g. In an alternative embodiment, the bisphenol A-based epoxy resin forms about 11.7 wt % of the mixture and the curing agent forms about 16.3 wt % of the mixture, the balance being silver flakes.Type: ApplicationFiled: December 28, 2011Publication date: July 4, 2013Applicant: KING FAHD UNIVERSITY OF PETROLEUM AND MINERALSInventor: RAFIL A. BASHEER
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Publication number: 20130171405Abstract: A method of obstructing metal whisker growth that includes providing a conductive structure comprised of a whisker forming metal, and forming a composite coating on the whisker forming metal. The composite coating may include a matrix phase of a polymer and a dispersed phase of reinforcing particles. The reinforcing particles are incorporated into the polymer to provide the composite coating with mechanical properties that obstruct whiskers from penetrating through the composite coating.Type: ApplicationFiled: December 28, 2011Publication date: July 4, 2013Applicant: BAE SYSTEMS CONTROLS INC.Inventors: Stephan John Meschter, Stephen Arthur McKeown
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Publication number: 20130168612Abstract: This invention relates to sacrificial-metal pigments coated with an effective amount of at least one metal oxide or a combination of metal oxides such as a chromium-zirconium oxide, and the process for preparing said coated pigments and combination thereof with film-forming binders for coating metal substrates to inhibit corrosion. The coated sacrificial-metal pigments are electrically active to prevent corrosion of metal substrates that are more cathodic (electropositive) than the metal oxide coated metal pigments.Type: ApplicationFiled: August 1, 2012Publication date: July 4, 2013Applicant: United States of America as represented by the Secretary of the NavyInventors: Craig Matzdorf, William Nickerson
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Publication number: 20130160844Abstract: This invention provides a thick-film composition for printing the front-side of a solar cell device having one or more insulating layers. The composition comprises a bismuth oxide comprising glass frit and antimony oxide as part of the glass frit or an additive. The invention further refers to a process for preparing a semiconductor device by use of the thick-film composition and an article, especially a solar cell comprising the semiconductor device. The solar cells show improved efficiency.Type: ApplicationFiled: December 20, 2012Publication date: June 27, 2013Applicant: HERAEUS PRECIOUS METALS GMBH & CO. KGInventor: HERAEUS PRECIOUS METALS GMBH & CO.KG
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Publication number: 20130161572Abstract: A conductive paste composition contains a source of an electrically conductive metal, a fusible material, a synthetic clay additive, and an optional etchant additive, dispersed in an organic medium. An article such as a photovoltaic cell is formed by a process having the steps of deposition of the paste composition on a semiconductor substrate by a process such as screen printing and firing the paste to remove the organic medium and sinter the metal and fusible material. The synthetic clay additive aids in establishing a low resistance electrical contact between the front side metallization and underlying semiconductor substrate during firing.Type: ApplicationFiled: December 21, 2011Publication date: June 27, 2013Applicant: E. I. DU PONT DE NEMOURS AND COMPANYInventors: Steven Dale Ittel, John Graeme Pepin
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Publication number: 20130161573Abstract: A lead-free conductive paste composition contains a source of an electrically conductive metal, a fusible material, an optional additive, and an organic vehicle. An article such as a high-efficiency photovoltaic cell is formed by a process of deposition of the lead-free paste composition on a semiconductor substrate (e.g., by screen printing) and firing the paste to remove the organic vehicle and sinter the metal and fusible material.Type: ApplicationFiled: December 21, 2011Publication date: June 27, 2013Applicant: E. I. DU PONT DE NEMOURS AND COMPANYInventors: Carmine Torardi, Paul Douglas Vernooy
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Patent number: 8470723Abstract: A low softening point glass composition, which is substantially free from lead, bismuth and antimony and comprises oxides of vanadium, phosphorous, tellurium and iron, a softening point of the composition being 380° C. or lower.Type: GrantFiled: January 14, 2010Date of Patent: June 25, 2013Assignee: Hitachi Powdered Metals Co., Ltd.Inventors: Takashi Naito, Shinichi Tachizono, Kei Yoshimura, Yuji Hashiba, Keiichi Kanazawa, Shinji Yamada, Satoru Amou, Hiroki Yamamoto, Takuya Aoyagi
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Publication number: 20130153835Abstract: When a substrate having a low heat resistance is used, heat treatment at approximately 120° C. at which deformation does not occur is desirable. When a low resistance is achieved regardless of the type of resin used for a conductive paste, a flexible design of a paste is possible according to purposes, and fields to which the paste could be applied are expanded. Thus, a conductive paste capable of forming a conductive film exhibiting a high conductivity even at low temperatures of approximately 120° C. regardless of whether the constituting resin is a thermosetting resin or a thermoplastic resin is provided. In a method for forming a conductive film, a conductive paste in which a dicarboxylic acid having 2 to 8 carbon atoms is added to a paste including silver nanoparticles coated with an organic substance having 2 to 6 carbon atoms, a dispersion medium, and a resin is used.Type: ApplicationFiled: October 28, 2011Publication date: June 20, 2013Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Takashi Hinotsu, Yuto Hiyama, Toshihiko Ueyama
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Publication number: 20130156632Abstract: The process for making silver powder particles with small size crystallites uses a combination of gum arabic and maleic acid with the reduction of a silver salt with ascorbic acid. Silver thick film paste containing these silver powder particles can be used in electronic applications to form electrodes for semiconductor devices and, in particular, solar cells.Type: ApplicationFiled: February 28, 2012Publication date: June 20, 2013Applicant: E. I. DU PONT DE NEMOURS AND COMPANYInventors: ROBERTO IRIZARRY, Haixin Yang
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Patent number: 8465677Abstract: An electrically conductive composition and a fabrication method thereof are provided. The electrically conductive structure includes a major conductive material and an electrically conductive filler of an energy delivery character dispersed around the major conductive material. The method includes mixing a major conductive material with an electrically conductive filler of an energy delivery character to form a mixture, coating the mixture on a substrate, applying a second energy source to the mixture while simultaneously applying a first energy source for sintering the major conductive material to form an electrically conductive composition with a resistivity smaller than 10×10?3?·cm.Type: GrantFiled: June 11, 2010Date of Patent: June 18, 2013Assignee: Industrial Technology Research InstituteInventors: Chun-An Lu, Hong-Ching Lin
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Publication number: 20130146820Abstract: A conductive paste is provided. The conductive paste includes a conductive powder and a resin composition. The resin composition includes a polyester acrylate oligomer, a hydroxyalkyl acrylate (HAA) and a polyvinylpyrrolidone (PVP) derivative. The conductive powder and the resin composition have a weight ratio of 40-85:15-60. The polyester acrylate oligomer, the hydroxyalkyl acrylate (HAA) and the polyvinylpyrrolidone (PVP) derivative have a weight ratio of 15-70:10-60:3-40.Type: ApplicationFiled: July 27, 2012Publication date: June 13, 2013Inventors: Kuo-Chan CHIOU, Jun-Rong Chen, Hsin-Mei Chen
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Publication number: 20130148261Abstract: There are provided a conductive paste for an external electrode, a multilayer ceramic electronic component using the same, and a method of manufacturing the same. More particularly, there are provided a conductive paste for an external electrode including: a conductive metal powder; and a spherical glass frit having an average particle size of 0.05 to 3.0 ?m, a multilayer ceramic electronic component using the same, and a method of manufacturing the same. According to the present invention, a spherical glass frit having fine particles may be applied at the time of preparing the conductive paste for an external electrode, thereby realizing external electrodes having excellent compactness at a low temperature and suppressing the occurrence of cracks, and thus, a multilayer ceramic electronic component having excellent reliability can be implemented.Type: ApplicationFiled: February 22, 2012Publication date: June 13, 2013Inventors: Hye Seong KIM, Kyu Ha Lee, Byung Jun Jeon, Hyun Hee Gu, Jae Young Park, Da Young Choi, Eun Joo Choi, Myung Jun Park, Chang Hoon Kim
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Publication number: 20130146342Abstract: The present invention relates to a pattern-forming composition used to form a conductive circuit pattern. The pattern-forming composition comprises Cu powders, a solder for electrically coupling the Cu powders, a polymer resin, a curing agent and a reductant. According to the present invention, a circuit pattern having superior conductivity can be formed at low cost.Type: ApplicationFiled: September 12, 2012Publication date: June 13, 2013Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Yong Sung EOM, Kwang-Seong Choi, Hyun-cheol Bae, Jung Hyun Noh, Jong Tae Moon
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Publication number: 20130146135Abstract: A conductive paste including a conductive powder, a metallic glass including aluminum (Al) and a first element which forms a solid solution with the aluminum (Al), and an organic vehicle.Type: ApplicationFiled: June 27, 2012Publication date: June 13, 2013Applicant: SAMSUNG ELECTRONICS CO. LTD.Inventors: Eun Sung LEE, Suk Jun KIM, Se Yun KIM, Jin Man PARK, Sang Soo JEE
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Patent number: 8460584Abstract: Processes for producing carboxylic acid-stabilized silver nanoparticles are disclosed. The processes comprise (a) forming a suspension of silver salt particles in a carboxylic acid; (b) forming a solution of an organohydrazine and a first organic solvent; (c) heating the suspension; (d) adding the solution to the suspension to form a mixture; and (e) reacting the mixture to form carboxylic acid-stabilized silver nanoparticles.Type: GrantFiled: October 14, 2008Date of Patent: June 11, 2013Assignee: Xerox CorporationInventors: Mahya Mokhtari, Marko Saban, Roger Earl Gaynor
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Publication number: 20130142963Abstract: A conductive metal composition comprising 50 to 94 wt % of silver particles having an average particle size in the range of 40 to 450 nm and having an aspect ratio of 3 to 1:1, 1 to 4 wt % of a thermoplastic polyester resin having a weight-average molar mass of 10000 to 150000, and 4 to 49 wt % of a diluent for the thermoplastic polyester resin.Type: ApplicationFiled: May 4, 2012Publication date: June 6, 2013Applicant: E.I. DU PONT DE NEMOURS AND COMPANYInventors: DANIEL KIRK, Dave Hui, Martin Sweet
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Publication number: 20130140069Abstract: A conductive bonding material includes: copper particles coated with either gallium or gallium alloy; and either tin particles or tin alloy particles. An electronic component includes: a wiring board having electrode pads; a component mounted on the wiring board and having a plurality of electrodes; a sealing resin covering the component; and a plurality of terminals coupled to a wiring line in the wiring board to an external substrate, wherein the plurality of electrodes being coupled to the electrode pads through a conductive bonding material containing copper particles coated with either gallium or gallium alloy particles and either tin particles or tin alloy particles.Type: ApplicationFiled: December 4, 2012Publication date: June 6, 2013Applicant: FUJITSU LIMITEDInventor: Fujitsu Limited
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Publication number: 20130140501Abstract: This silver-coated spherical resin includes: a spherical resin; and silver coated on a surface of the spherical resin, wherein an amount of the silver is in a range of 2 to 80 parts by mass with respect to 100 parts by mass of the silver-coated spherical resin, and a crystallite diameter of the silver measured by X-ray diffractometry is in a range of 18 to 24 nm. This method for producing a silver-coated spherical resin includes: a process of subjecting a spherical resin to a pretreatment using an aqueous solution of a tin compound; and a subsequent process of subjecting the spherical resin to an electroless silver plating using a reducing agent, wherein, during the pretreatment, a temperature of the aqueous solution of the tin compound is set to be in a range of 20 to 45° C.Type: ApplicationFiled: August 17, 2011Publication date: June 6, 2013Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Akira Nakabayashi, Shigeharu Sasaki, Kazutoshi Yamamoto, Maki Yamaguchi
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Publication number: 20130140500Abstract: A paste composition for a solar cell electrode includes: a mixture of conductive powders, a glass frit, and an organic vehicle, and the mixture of conductive powders includes about 1 wt % to about 10 wt % of a first conductive powder having an average particle diameter (Dx) from about 1 nm to about 100 nm, and about 90 wt % to about 99 wt % of a second conductive powder having an average particle diameter (D50) from about 0.5 ?m to about 5 ?m.Type: ApplicationFiled: August 23, 2012Publication date: June 6, 2013Inventors: Seok Hyun JUNG, Jung Chul LEE, Hyun Joo JUNG, Jae Ho KIM
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Patent number: 8454859Abstract: An exemplary printable composition comprises a liquid or gel suspension of a plurality of metallic nanofibers or nanowires; a first solvent; and a viscosity modifier, resin, or binder. In various embodiments, the metallic nanofibers are between about 10 microns to about 100 microns in length, are between about 10 nm to about 120 nm in diameter, and are typically functionalized with a coating or partial coating of polyvinyl pyrrolidone or a similar compound. An exemplary metallic nanofiber ink which can be printed to produce a substantially transparent conductor comprises a plurality of metallic nanofibers; one or more solvents such as 1-butanol, ethanol, 1-pentanol, n-methylpyrrolidone, cyclohexanone, cyclopentanone, 1-hexanol, acetic acid, cyclohexanol, or mixtures thereof; and a viscosity modifier, resin, or binder such as polyvinyl pyrrolidone or a polyimide, for example.Type: GrantFiled: August 29, 2012Date of Patent: June 4, 2013Assignee: NthDegree Technologies Worldwide IncInventors: Mark David Lowenthal, Jeffrey Baldridge, Mark Lewandowski, Lixin Zheng, David Michael Chesler
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Publication number: 20130133934Abstract: This invention relates to compositions and methods related to biocompatible conductive inks. In a preferred embodiment the inks are printable onto biocompatible substrates and are used in the creation of biocompatible medical devices, in general, the inks comprise a plurality of particles. In one embodiment, the particles have a particle surface and an agent on the particle surface, the agent configured to prevent the particles from agglomerating when the particles are in a solution, the agent also configured to allow adjacent particle surfaces to be in contact when the particles are not in the solution due to an opening in the agent.Type: ApplicationFiled: February 23, 2011Publication date: May 30, 2013Applicant: UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC.Inventors: Glen P. Flores, Christopher D. Batich
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Publication number: 20130134363Abstract: A paste composition for solar cell electrodes includes conductive particles, a glass frit, an organic binder and a solvent. The conductive particles include at least two groups of conductive particle having different particle diameter distributions. The conductive particle may have an average particle diameter (D50?) of about 1.85 ?m or less and a particle diameter (D90?) at 90% of the cumulative particle diameter distribution of about 3.10 ?m or less.Type: ApplicationFiled: August 27, 2012Publication date: May 30, 2013Inventors: Dae Seop SONG, Young Wook CHOI, Sang Hyun YANG
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Patent number: 8450392Abstract: This invention relates to the field of an electromagnetic (EM) field shielding paint compositions, in particular, those capable of providing substantially non metallic finish. The paint composition finds particular use in attenuating EM signals that may be used to carry data between communication devices, especially mobile phone and wi-fi devices. EM field shielding paints are typically available in jet-black or bright metallic finishes and usually possess limited scratch & abrasion resistance. The paint composition provides a one-pot solution to furnish a composition which has the visual appearance of a domestic type paint i.e. one with a non-metallic finish, with the ability to shield electromagnetic radiation. The composition comprises a supported metallic flake and a pigment, which have been provided in a narrowly defined range to furnish a desirable non-metallic appearance and possess electromagnetic shielding properties.Type: GrantFiled: January 28, 2009Date of Patent: May 28, 2013Assignee: Qinetiq LimitedInventors: Shahid Hussain, Christopher Robert Lawrence, Philip Mark Shryane Roberts
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Publication number: 20130126799Abstract: An electroconductive film including: electroconductive fibers, wherein the electroconductive film satisfies the following expression: 0.01<X/A<0.9, where X/A is an atomic ratio of X to A, where X is an amount of elements constituting the electroconductive fibers in the electroconductive film and X is an amount of halogen elements in the electroconductive film.Type: ApplicationFiled: December 20, 2012Publication date: May 23, 2013Applicant: FUJIFILM CORPORATIONInventor: FUJIFILM CORPORATION
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Publication number: 20130126798Abstract: The problems can be solved by using a method for producing a metal nanoparticle colloid, which comprises the steps of S1: mixing, into a nonpolar hydrocarbon oil having a vapor pressure of 10?3 Torr or less at room temperature, organic molecules having both a hydrophilic group and a lipophilic group and having in the end of the hydrophilic group an N, S, P, or O atom or having at the hydrophilic group a functional group of an NH2 group, an NH group, an SH group, a PO group, or an OH group to prepare a base liquid, and S2: placing the base liquid in a rotatable vacuum drum and charging a non-magnetic metal material in a crucible provided in the vacuum drum, and depositing the vapor of the non-magnetic metal material on the base liquid which adheres to the inner wall of the vacuum drum and rotates together with the rotating drum under conditions such that the inside of the vacuum drum is under a reduced pressure and the vacuum drum is rotated, and a task of the present invention is to provide a method for produType: ApplicationFiled: May 31, 2011Publication date: May 23, 2013Inventor: Isao Nakatani
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Publication number: 20130130435Abstract: The invention relates to a thick film conductive composition comprising metal particles wherein the specific surface area of the silver particles measured by BET according to ISO 9277 is equal to or more than 1.8 m2/g; manganese oxide; glass particles; and an organic vehicle.Type: ApplicationFiled: November 8, 2012Publication date: May 23, 2013Applicant: HERAEUS PRECIOUS METALS GMBH & CO. KGInventor: Heraeus Precious Metals GmbH & Co. KG
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Publication number: 20130130020Abstract: There is provided an electrode paste composition, an electrode for an electronic device using the same, and a method of manufacturing the same. The electrode for an electronic device includes: a substrate; a thin film layer formed on the substrate, the thin film layer including reduced graphene oxide (rGO); and an oxide layer formed between the substrate and the thin film layer. The electrode for an electronic device may have excellent uniform resistivity and electrical conductivity since the electrode is formed by coating the substrate with a solution containing graphene oxide having superior dispersibility and reducing the graphene oxide.Type: ApplicationFiled: September 14, 2012Publication date: May 23, 2013Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woon Chun Kim, Kang Heon Hur
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Patent number: 8444882Abstract: An anisotropic conductive film is provided that does not have a light-reflecting layer on a light emitting diode element which causes costs to increase when a light emitting device that uses an LED element is flip-chip mounted, and that does not cause emission efficiency to deteriorate. Further, a light emitting device that uses such an anisotropic conductive film is provided. This anisotropic conductive film has a structure in which a light-reflecting insulating adhesive layer and an anisotropic conductive adhesive layer are laminated, wherein the light-reflecting insulating adhesive layer has a structure in which light-reflecting particles are dispersed in an insulating adhesive. The light emitting device has a structure in which a light emitting diode element is flip-chip-mounted on a substrate, with this anisotropic conductive film provided between a connection terminal on the substrate and a bump for connection of the light emitting diode element.Type: GrantFiled: February 22, 2010Date of Patent: May 21, 2013Assignee: Sony Chemical & Information Device CorporationInventors: Shiyuki Kanisawa, Hiroyuki Kumakura, Hidetsugu Namiki
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Publication number: 20130119322Abstract: There is provided a conductive sintered layer forming composition and a conductive sintered layer forming method that can lower heating temperature and shorten heating time for a process of accelerating sintering or bonding by sintering of metal nano-particles coated with an organic substance. The conductive sintered layer forming composition may be obtained by utilizing a phenomenon that particles may be sintered at low temperature by mixing silver oxide with metal particles coated with the organic substance and having a grain size of 1 nm to 5 ?m as compared to sintering each simple substance. The conductive sintered layer forming composition of the invention is characterized in that it contains the metal particles whose surface is coated with the organic substance and whose grain size is 1 nm to 5 ?m and the silver oxide particles.Type: ApplicationFiled: January 9, 2013Publication date: May 16, 2013Applicant: Hitachi Ltd.Inventors: Eiichi Ide, Toshiaki Morita, Yusuke Yasuda, Hiroshi Hozoji
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Publication number: 20130120898Abstract: There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other, while having the dielectric layer interposed therebetween; and first external electrodes electrically connected to first and second internal electrodes and second external electrodes formed on the first external electrodes, wherein the first and second external electrodes include a conductive metal and a glass, and when the second external electrodes are divided into three equal parts in a thickness direction, an area of the glass in central parts thereof with respect to an area of the central parts is 30 to 80%. Therefore, sealing properties of a chip is improved, whereby a multilayer ceramic electronic component having improved reliability may be implemented.Type: ApplicationFiled: August 10, 2012Publication date: May 16, 2013Inventors: Myung Jun PARK, Sang Hoon Kwon, Chang Hoon Kim, Hyun Hee Gu, Jae Young Park, Da Young Choi, Kyu Ha Lee, Byung Jun Jeon
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Publication number: 20130118572Abstract: A conductive paste includes a conductive powder, a metallic glass having a glass transition temperature of less than or equal to about 600° C. and a supercooled liquid region of greater than or equal to 0 K, and an organic vehicle, and an electronic device and a solar cell include an electrode formed using the conductive paste.Type: ApplicationFiled: November 9, 2012Publication date: May 16, 2013Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventor: Samsung Electronics Co., Ltd.
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Patent number: 8440110Abstract: Disclosed is a method for producing a metal particle dispersion wherein a metal compound is reduced by using carbodihydrazide represented by the formula (1) below or a polybasic acid polyhydrazide represented by the formula (2) below (wherein R represents an n-valent polybasic acid residue) in a liquid medium. By reducing the metal compound in the presence of a compound having a function preventing discoloration of the metal, there can be obtained a metal particle dispersion having excellent discoloration preventing properties. Metal particles produced by such methods have a uniform particle diameter and are excellent in dispersion stability. By using a conductive resin composition or conductive ink containing a metal particle dispersion obtained by such production methods, there can be formed a conductive coating film, such as a conductive circuit or an electromagnetic layer, having good characteristics.Type: GrantFiled: March 30, 2011Date of Patent: May 14, 2013Assignee: Toyo Ink Mfg Co., Ltd.Inventors: Kaori Sakaguchi, Kinya Shiraishi
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Publication number: 20130112261Abstract: An organic vehicle used in the manufacture of electroconductive silver paste. The organic vehicle comprises an organic binder, a surfactant, and an organic solvent. The preferred embodiment of the invention utilizes at least one of PVP, PMMA, or PVB as the organic binder, allowing for high compatibility with the metallic particles and resulting in an electroconductive paste with low viscosity for fine line printability. Another aspect of the invention relates to an electroconductive paste composition. The preferred embodiment utilizes metallic particles, glass frit, and an organic vehicle comprising a binder, namely at least one of PVP, PMMA, or PVB, a surfactant, and an organic solvent.Type: ApplicationFiled: November 2, 2012Publication date: May 9, 2013Applicant: Heraeus Precious Metals North America Conshohocken LLCInventor: Heraeus Precious Metals North America Conshoh
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Publication number: 20130114212Abstract: An electrically conductive material used in the formation of heat-releasing filled via holes in an electronic component-incorporated multilayer circuit board with a heat radiation member, in which the electrically conductive material comprises metal particles as a conductive metal which is a mixture of a first conductive metal consisting of silver (Ag) or copper (Cu) and a second conductive metal consisting of tin (Sn), and a ratio of the atomicity of tin to the atomicity of silver or copper and tin is 27 to 40%, and an electronic device using the same.Type: ApplicationFiled: November 5, 2012Publication date: May 9, 2013Applicant: DENSO CORPORATIONInventor: DENSO CORPORATION
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Patent number: 8435426Abstract: The electrical contact enhancing coating is a composition that includes finely divided precious metal particles mixed with a dielectric carrier to form a coating. The dielectric carrier is a vegetable oil (preferably soybean-based) carrier of the type used as a dielectric coolant in power transformers, and is preferably high in antioxidant content. In a first embodiment, the precious metal is 100% silver having an average particle size of about 5-10 ?m. In a second embodiment, the precious metal is about 65-85% silver and 15-35% gold (average particle size 0.5-1.8 ?m), by weight. In a third embodiment, the precious metal is about 65-85% silver, 12.5-30% gold, and 2.5-5% palladium (average particle size 0.5-1.8 ?m), by weight. The precious metals may be cryogenically treated prior to mixing with the dielectric carrier.Type: GrantFiled: March 22, 2011Date of Patent: May 7, 2013Inventors: Brian K. Kyle, Timothy R. Mrock
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Patent number: 8435424Abstract: A solvent-free conductive paste composition including (a) a binder, (b) an initiator, (c) a glass powder and (d) a conductive powder; and a solar cell element having an electrode or wire made by coating and sintering the conductive paste composition coated on a silicon semiconductor substrate. The conductive paste composition is solvent-free so that it will not cause environmental problems with respect to the evaporation of solvents and will not be easy to spread out. The conductive paste composition facilitates the development of fine wire and high aspect ratio designs and can efficiently enhance the photoelectric conversion efficiency.Type: GrantFiled: December 22, 2009Date of Patent: May 7, 2013Assignee: Eternal Chemical Co., Ltd.Inventor: Tsai-Fa Hsu
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Publication number: 20130105841Abstract: A light-reflective conductive particle for an anisotropic conductive adhesive used for connecting a light-emitting element to a wiring board by anisotropic conductive connection includes a core particle covered with a metal material and a light reflecting layer formed of a light-reflective inorganic particle having a refractive index of 1.52 or greater on the surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or greater include a titanium oxide particle, a zinc oxide particle, and an aluminum oxide particle. The coverage of the light reflecting layer on the surface of the core particle is 70% or more.Type: ApplicationFiled: April 20, 2011Publication date: May 2, 2013Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATIONInventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi
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Publication number: 20130104973Abstract: A conductive paste includes a conductive powder, a metallic glass, an inorganic additive for fire-through, and an organic vehicle, and an electronic device and a solar cell including an electrode formed using the conductive paste.Type: ApplicationFiled: September 6, 2012Publication date: May 2, 2013Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang Soo JEE, Suk Jun KIM, Haeng Deog KOH, Yun Hyuk CHOI, Eun Sung LEE
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Publication number: 20130108931Abstract: An embodiment of this invention is directed to a positive electrode composition that includes a first group of granules that contain about 30% by volume of at least one metal or electrically-conductive carbon, or combinations thereof; and a second group of granules that contain at least about 60% by volume of a metallic salt, and less than about 30% by volume of a metal. A porous structure based on a material that is resistant to non-passivating oxidation and alkaline electrolysis may be used in place of the second group of granules. An article that includes a positive electrode based on such a composition is also described, as well as related energy storage devices.Type: ApplicationFiled: October 31, 2011Publication date: May 2, 2013Applicant: GENERAL ELECTRIC COMPANYInventors: Richard Louis Hart, Michael Alan Vallance, Karthick Vilapakkam Gourishankar, Hari Nadathur Seshadri, Anbarasan Viswanathan
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Publication number: 20130099177Abstract: The present invention is directed to a thick film silver paste comprising (i) silver, (ii) Al2O3, and (iii) a Pb—Te—O all dispersed in an organic medium. The present invention is further directed to an electrode formed from the paste and a semiconductor device and, in particular, a solar cell comprising such an electrode. The electrodes provide good adhesion and good electrical performance.Type: ApplicationFiled: September 20, 2012Publication date: April 25, 2013Applicant: E I DU PONT DE NEMOURS AND COMPANYInventor: E I DU PONT DE NEMOURS AND COMPANY
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Publication number: 20130099178Abstract: The present invention is directed to an electroconductive silver thick film paste composition comprising Ag, a glass frit and rhodium resinate, Cr2O3 or a mixture thereof all dispersed in an organic medium. The present invention is further directed to an electrode formed from the paste composition and a semiconductor device and, in particular, a solar cell comprising such an electrode. The paste is particularly useful for forming a tabbing electrode.Type: ApplicationFiled: September 25, 2012Publication date: April 25, 2013Applicant: E I DU PONT DE NEMOURS AND COMPANYInventor: E I DU PONT DE NEMOURS AND COMPANY
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Publication number: 20130099179Abstract: A composition for the fabrication of reflective features using a direct-write tool is disclosed. The composition comprises metal nanoparticles having an average particle size less than 300 nm and which carry thereon a polymer for substantially preventing agglomeration of the nanoparticles, wherein the nanoparticles exhibit a metal-polymer weight ratio of 100:1 to 10:1. The composition further includes a vehicle for forming a dispersion with the metal nanoparticles. A number of electronic devices comprising a reflective layer formed from the composition are also disclosed. One example case provides an electronic device having a reflective electrode. The reflective electrode comprises a percolation network of the metal nanoparticles embedded in a matrix of the polymer and having an average particle size of less than 300 nm, wherein the reflective electrode is reflective in the visible light range and does not diffract incident light.Type: ApplicationFiled: December 4, 2012Publication date: April 25, 2013Applicant: Cabot CorporationInventors: Cabot Corporation, Tu N. Nguyen, Tu N. Nguyen
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Publication number: 20130099176Abstract: The present invention provides an electrode composition for inkjet printing, which can be used to form an electrode having a uniform thickness on a curved substrate by inkjet printing, and a method for manufacturing an electrode for a dye-sensitized solar cell using the same. In particular, the present invention provides an electrode composition for inkjet printing, the electrode composition including about 10 to 40 wt % of platinum nanoparticles, about 1 to 10 wt % of polymer surface stabilizer, and about 40 to 89 wt % of solvent.Type: ApplicationFiled: January 26, 2012Publication date: April 25, 2013Applicant: HYUNDAI MOTOR COMPANYInventors: Yong Jun Jang, Sang Hak Kim, Won Jung Kim, Yong Gu Kim, Mi Yeon Song, In Woo Song, Ji Yong Lee, Ki Chun Lee
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Publication number: 20130092225Abstract: An electroconductive paste composition, particularly for solar cells, contains silver particles, glass particles, an organic vehicle, and at least one additive. The additive may be tantalum pentoxide or fine, electrically conductive, metal particles, such as gold and/or platinum group metals. When used to form an electrical contact on a solar cell, such a paste provides for enhanced adhesion of the contact to the cell and improved electron transmission.Type: ApplicationFiled: May 15, 2012Publication date: April 18, 2013Inventors: Tung T. PHAM, Weiming Zhang
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Publication number: 20130095995Abstract: Processes for the surface-modification of flyash and industrial applications thereof are described in this invention, which involve surface-sensitization, surface-activation, and subsequent Cu or Ag coating of as-received flyash particles in a conventional electroless bath. These new surface-modification processes offer efficient and cost-effective alternatives to conventional processes which modify the surface of flyash particles with a costlier Sn—Pd catalyst-system. Flyash processed with the inventive processes is also suitable for a greater number of industrial applications relative to that processed with the costlier Sn—Pd catalyst-system.Type: ApplicationFiled: September 12, 2012Publication date: April 18, 2013Inventors: Satyajit Vishnu Shukla, Krishna Gopakumar Werrier, Baiju Vijayan Kishakkekillkoodayii, Thachan Shijitha
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Publication number: 20130092884Abstract: The present invention is directed to an electroconductive thick film paste composition comprising Ag and a Pb-free bismuth-tellurium-oxide both dispersed in an organic medium. The present invention is further directed to an electrode formed from the paste composition and a semiconductor device and, in particular, a solar cell comprising such an electrode. The present invention is also directed to the bismuth-tellurium oxide that is a component of thick film pastes.Type: ApplicationFiled: April 3, 2012Publication date: April 18, 2013Applicant: E.I. Du Pont De Nemours And CompanyInventors: KENNETH WARREN HANG, Yueli Wang
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Patent number: 8419981Abstract: A conductive paste composition and an electrode prepared using the same, the conductive paste composition including a conductive powder a binder resin; and a solvent, wherein the conductive powder includes a flake type powder having an average particle diameter (D50) of about 1.2 ?m to about 3.0 ?m, and a spherical powder having an average particle diameter (D50) of about 0.2 ?m to about 2.0 ?m, the flake type powder and the spherical powder are present in a weight ratio of about 1:0.4 to about 1:2, and the conductive powder and the binder resin are present in a weight ratio of about 1:0.04 to about 1:0.08.Type: GrantFiled: August 15, 2011Date of Patent: April 16, 2013Assignee: Cheil Industries, Inc.Inventor: Young Wook Choi