Noble Metal (gold, Silver, Ruthenium, Rhodium, Palladium, Osmium, Iridium, Platinum) Patents (Class 252/514)
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Publication number: 20140076620Abstract: Disclosed herein is a conductive particle, including: a base particle containing a metal; a seed particle formed on a surface of the base particle; and a first metal layer formed on the base particle, wherein the first metal layer includes a protrusion surrounding the seed particle. The conductive particle has excellent specific resistance characteristics when it is sintered because it has nanosized protrusions formed on the surface of a metal base particle.Type: ApplicationFiled: November 23, 2012Publication date: March 20, 2014Applicant: HANWHA CHEMICAL CORPORATIONInventors: Won-Il Son, You-Jin Sim, Seok-Heon Oh
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Publication number: 20140079954Abstract: A non-catalytic palladium precursor composition is disclosed, including a palladium salt and an organoamine, wherein the composition is substantially free of water. The composition permits the use of solution processing methods to form a palladium layer on a wide variety of substrates, including in a pattern to form circuitry or pathways for electronic devices.Type: ApplicationFiled: October 16, 2013Publication date: March 20, 2014Applicant: Xerox CorporationInventors: Yiliang Wu, Ping Liu
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Patent number: 8675343Abstract: There are provided a conductive paste for an external electrode, a multilayered ceramic electronic component using the same, and a fabrication method thereof. The conductive paste for external electrode includes: a conductive metal; and a conductive amorphous metal including a (Cu, Ni)-bZr-c(Al, Sn) that satisfies conditions of a+b+c=100, 20?a?60, 20?b?60, and 2?c?25. A degradation of connectivity between external electrodes and internal electrodes and defective plating due to a glass detachment may be solved.Type: GrantFiled: February 28, 2012Date of Patent: March 18, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung Jun Park, Sung Bum Sohn, Hyun Hee Gu, Chang Hoon Kim, Sang Hoon Kwon
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Publication number: 20140069488Abstract: A conductive member including: a base material; and a conductive layer disposed on the base material, wherein the conductive layer includes: a metal nanowire including a metal element (a) and having an average minor axis length of 150 nm or less; and a sol-gel cured product obtained by hydrolyzing and polycondensing an alkoxide compound of an element (b) selected from the group consisting of Si, Ti, Zr, and Al; and a ratio of the substance amount of the element (b) contained in the conductive layer to the substance amount of the metal element (a) contained in the conductive layer is in a range of from 0.10/1 to 22/1.Type: ApplicationFiled: October 24, 2013Publication date: March 13, 2014Applicant: FUJIFILM CORPORATIONInventors: Satoshi TANAKA, Shinichi NAKAHIRA, Yuki MATSUNAMI, Tomohito ASAI
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Publication number: 20140070148Abstract: According to example embodiments, a conductive powder includes a metallic glass and a coating on the surface of the metallic glass. The coating includes a metal. An article may include a sintered product of the conductive powder. A conductive paste may include the conductive powder. An electronic device may include a sintered product of the conductive paste.Type: ApplicationFiled: September 11, 2013Publication date: March 13, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Suk Jun KIM, Keum Hwan PARK, Eun Sung LEE, Se Yun KIM, Jin Man PARK, Sang Soo JEE
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Patent number: 8668847Abstract: A conductive paste including a conductive powder, a metallic glass, and an organic vehicle, wherein the metallic glass includes an alloy of at least two elements selected from an element having a low resistivity, an element which forms a solid solution with the conductive powder, or an element having a high oxidation potential, wherein the element having a low resistivity has a resistivity of less than about 100 microohm-centimeters, and the element having a high oxidation potential has an absolute value of a Gibbs free energy of oxide formation of about 100 kiloJoules per mole or greater.Type: GrantFiled: August 12, 2011Date of Patent: March 11, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Se-Yun Kim, Eun-Sung Lee, Sang-Soo Jee, Sang-Mock Lee
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Patent number: 8668848Abstract: A composition for the fabrication of reflective features using a direct-write tool is disclosed. The composition comprises metal nanoparticles having an average particle size less than 300 nm and which carry thereon a polymer for substantially preventing agglomeration of the nanoparticles, wherein the nanoparticles exhibit a metal-polymer weight ratio of 100:1 to 10:1. The composition further includes a vehicle for forming a dispersion with the metal nanoparticles. A number of electronic devices comprising a reflective layer formed from the composition are also disclosed. One example case provides an electronic device having a reflective electrode. The reflective electrode comprises a percolation network of the metal nanoparticles embedded in a matrix of the polymer and having an average particle size of less than 300 nm, wherein the reflective electrode is reflective in the visible light range and does not diffract incident light.Type: GrantFiled: December 4, 2012Date of Patent: March 11, 2014Assignee: Cabot CorporationInventors: Karel Vanheusden, Klaus Kunze, Hyungrak Kim, Aaron D. Stump, Allen B. Schult, Mark J. Hampden-Smith, Chuck Edwards, Anthony R. James, James Caruso, Toivo T. Kodas, Scott Thomas Haubrich, Mark H. Kowalski
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Publication number: 20140065387Abstract: The present invention relates to a dispersion comprising metallic, metal oxide or metal precursor nanoparticles and a polymeric dispersant, the dispersant comprising an anchor group with affinity for the metallic, metal oxide or metal precursor nanoparticles that is chemically bonded to a polymeric backbone characterized in that the dispersant has a 95 wt. % decomposition at a temperature below 300° C. as measured by Thermal Gravimetric Analysis. It further relates to metallic fluids or inks prepared from the dispersion and to the preparation of the dispersion and the metallic fluid or inks.Type: ApplicationFiled: December 19, 2011Publication date: March 6, 2014Applicant: AGFA-GEVAERT NVInventors: Xavier Andre, Dirk Bollen, Johan Loccufier
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Publication number: 20140065422Abstract: A stretchable conductive nanofiber includes a polymer nanofiber, and one-dimensional conductive nanoparticles that form a percolation network within the polymer nanofiber, and are oriented at an angle in a range of about 0° to about 45° with a respect to an axis of the polymer nanofiber.Type: ApplicationFiled: September 4, 2013Publication date: March 6, 2014Applicants: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION SOGANG UNIVERSITY, SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-won KIM, Jong-jin PARK, Bong-june SUNG, Kwan-woo SHIN
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Publication number: 20140061830Abstract: A conductive paste composition contains a source of an electrically conductive metal, an alkaline-earth-metal boron tellurium oxide, and an organic vehicle. An article such as a high-efficiency photovoltaic cell is formed by a process of deposition of the paste composition on a semiconductor device substrate (e.g., by screen printing) and firing the paste to remove the organic vehicle and sinter the metal and establish electrical contact between it and the device.Type: ApplicationFiled: September 3, 2013Publication date: March 6, 2014Applicant: E I DU PONT DE NEMOURS AND COMPANYInventors: ZHIGANG RICK LI, Kurt Richard Mikeska, David Herbert Roach, Carmine Torardi, Paul Douglas Vernooy
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Publication number: 20140063684Abstract: There is provided conductive paste composition for an external electrode including: a first metal powder particle having a spherical shape and formed of a fine copper; and a second metal powder particle coated on a surface of the first metal powder particle and having a melting point lower than that of the copper.Type: ApplicationFiled: December 20, 2012Publication date: March 6, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyu Ha LEE, Chang Joo LEE, Jae Hwan HAN, Hye Seong KIM, Chang Hoon KIM, Hyun Hee GU, Kyung Pyo HONG, Sung Koo KANG, Byoung Jin CHUN, Byung Jun JEON
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Publication number: 20140061831Abstract: A conductive paste composition contains a source of an electrically conductive metal, a Ti—Te—Li oxide, and an organic vehicle. An article such as a high-efficiency photovoltaic cell is formed by a process of deposition of the paste composition on a semiconductor substrate (e.g., by screen printing) and firing the paste to remove the organic vehicle and sinter the metal and establish electrical contact between it and the device.Type: ApplicationFiled: September 3, 2013Publication date: March 6, 2014Applicant: E I DU PONT DE NEMOURS AND COMPANYInventors: KURT RICHARD MIKESKA, David Herbert Roach, Carmine Torardi, Paul Douglas Vernooy
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Patent number: 8663439Abstract: A sputtering target for producing a metallic glass membrane characterized in comprising a structure obtained by sintering atomized powder having a composition of a ternary compound system or greater with at least one or more metal elements selected from Pd, Zr, Fe, Co, Cu and Ni as its main component (component of greatest atomic %), and being an average grain size of 50 ?m or less. The prepared metallic glass membrane can be used as a substitute for conventional high-cost bulk metallic glass obtained by quenching of molten metal. This sputtering target for producing the metallic glass membrane is also free from problems such as defects in the metallic glass membrane and unevenness of composition, has a uniform structure, can be produced efficiently and at low cost, and does not generate many nodules or particles. Further provided is a method for manufacturing such a sputtering target for forming the metallic glass membrane.Type: GrantFiled: November 4, 2005Date of Patent: March 4, 2014Assignees: JX Nippon Mining & Metals Corporation, Tohoku UniversityInventors: Atsushi Nakamura, Masataka Yahagi, Akihisa Inoue, Hisamichi Kimura, Shin-ichi Yamaura
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Publication number: 20140054511Abstract: The present invention provides a method for transferring phases of nanoparticles, which use a polymer with a molecular weight greater than 5,000 as a dispersant. The first step of the method of the present invention is to synthesize nanoparticles in the polymer aqueous solution. Next, an amphiphilic phase-transfer agent is added into the solution to coat the surface of nanoparticles with bipolar molecules, and then the mixture is added into an organic solvent to form a homogeneous solution. Finally, a salt and an alcohol are added into the homogeneous solution, and then an organic phase layer and an aqueous phase layer through a centrifugal method. The method of the present invention combines the advantages of aqueous process for preparing nanoparticles and transfers the same with a simple phase transferring process to obtain oil-phase nanoparticles, which can be applied to various fields.Type: ApplicationFiled: August 6, 2013Publication date: February 27, 2014Applicant: National Tsing Hua UniversityInventors: Kan-Sen CHOU, Yi-Chu CHEN
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Publication number: 20140054516Abstract: A method for manufacturing a nanowire is provided. A solvent is heated. A catalyst is added to the solvent. A metal compound is added to the solvent to form a metal nanowire. The metal nanowire is refined. In the refining of the metal nanowire, the catalyst and a refinement material to converting an insoluble material generated by the catalyst into a soluble material may be added to the solvent. The catalyst may include NaCl and at least one selected from the group consisting of Mg, K, Zn, Fe, se, Mn, P, Br and I.Type: ApplicationFiled: December 14, 2011Publication date: February 27, 2014Applicants: NANOPYXIS CO., LTD., LG INNOTEK CO., LTD.Inventors: Jong Woon Moon, Woo Ju Jeong, Joon Rak Choi, Soung Kyu Park, Won Jong Choi, Sang Hoon Lee, Yong Sang Lee, Hyeok Soo Seo
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Publication number: 20140054515Abstract: An exemplary printable composition comprises a liquid or gel suspension of a plurality of metallic nanofibers or nanowires; a first solvent; and a viscosity modifier, resin, or binder. In various embodiments, an exemplary metallic nanowire ink which can be printed to produce a substantially transparent conductor comprises a plurality of metallic nanowires at least partially coated with a first polymer comprising polyvinyl pyrrolidone having a molecular weight less than about 50,000; one or more solvents such as 1-butanol, ethanol, 1-pentanol, n-methylpyrrolidone, cyclohexanone, cyclopentanone, 1-hexanol, acetic acid, cyclohexanol, and mixtures thereof; and a second polymer or polymeric precursor such as polyvinyl pyrrolidone or a polyimide, having a molecular weight greater than about 500,000.Type: ApplicationFiled: November 5, 2013Publication date: February 27, 2014Inventors: Mark David Lowenthal, Mark Lewandowski, Jeffrey Baldridge, Lixin Zheng, David Michael Chesler
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Publication number: 20140048751Abstract: This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to photonic sintering. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to photonic sintering. The invention further provides devices containing electrical conductors made by these methods.Type: ApplicationFiled: August 20, 2012Publication date: February 20, 2014Applicant: E I DU PONT DE NEMOURS AND COMPANYInventors: VINCE ARANCIO, JAY ROBERT DORFMAN
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Publication number: 20140048116Abstract: In general, the present invention relates to electro-conductive pastes with salt additives with anions consisting of halogen and oxygen, and solar cells with high Ohmic sheet resistance, preferably photovoltaic solar cells. More specifically, the present invention relates to electro-conductive pastes, solar cell precursors, processes for preparation of solar cells, solar cells and solar modules. The present invention relates to an electro-conductive paste at least comprising as paste constituents: a) metallic particles; b) a glass frit; c) an organic vehicle; and d) a salt with an anion comprising an oxygen atom and a halogen atom.Type: ApplicationFiled: October 10, 2013Publication date: February 20, 2014Applicant: Heraeus Precious Metals GmbH & Co. KGInventors: Gerd SCHULZ, Daniel Zindel, Sebastian Unkelbach, Matthias HÖRTHEIS
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Publication number: 20140051242Abstract: A representative printable composition comprises a liquid or gel suspension of a plurality of metallic particles; a plurality of semiconductor particles; and a first solvent. The pluralities of particles may also be comprised of an alloy of a metal and a semiconductor. The composition may further comprise a second solvent different from the first solvent. In a representative embodiment, the first solvent comprises a polyol or mixtures thereof, such as glycerin, and the second solvent comprises a carboxylic or dicarboxylic acid or mixtures thereof, such as glutaric acid. In various embodiments, the metallic particles and the semiconductor particles are nanoparticles between about 5 nm to about 1.5 microns in any dimension. A representative metallic and semiconductor particle ink can be printed and annealed to produce a conductor.Type: ApplicationFiled: August 16, 2012Publication date: February 20, 2014Applicant: NthDegree Technologies Worldwide Inc.Inventors: Vera Nicholaevna Lockett, Mark David Lowenthal, Neil O. Shotton, William Johnstone Ray, Tricia Youngbull, Theodore I. Kamins
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Publication number: 20140048752Abstract: The present invention relates to a method of manufacturing a solar cell electrode, comprising: preparing a semiconductor substrate having a preformed electrode on a front side, a back side, or both of the front and the back side of the semiconductor substrate; applying a conductive paste onto the preformed electrode, wherein the conductive paste comprises a conductive powder, an amorphous saturated polyester resin with glass transitional temperature (Tg) of 50° C. or lower, and an organic solvent; drying the applied conductive paste; putting a tab electrode on the dried conductive paste; and soldering the tab electrode.Type: ApplicationFiled: April 10, 2013Publication date: February 20, 2014Applicant: E I DU PONT DE NEMOURS AND COMPANYInventor: HIDEKI AKIMOTO
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Publication number: 20140042376Abstract: A nanostructure and method for assembly thereof are disclosed. The nanostructure includes a gain medium nanoparticle; an output coupler nanoparticle being discrete from and linked to the gain medium nanoparticle; and a plurality of metal nanoparticles being linked about the gain medium nanoparticle, wherein the gain medium nanoparticle and the output coupler nanoparticle are included in the nanostructure in a one to one ratio.Type: ApplicationFiled: August 5, 2013Publication date: February 13, 2014Applicant: BAE Systems Information and Electronic Systems Integration Inc.Inventors: Idan Mandelbaum, Tadd C. Kippeny
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Publication number: 20140042375Abstract: A paste composition for solar cell electrodes includes a conductive powder, a glass frit, and an organic vehicle. The glass fit includes about 5 wt % to about 55 wt % of Bi2O3, about 10 wt % to about 40 wt % of TeO2, and a balance of PbO.Type: ApplicationFiled: March 11, 2013Publication date: February 13, 2014Inventors: Eun Kyung KIM, Young Wook CHOI, Hun Gyu SONG, Jung Chul LEE
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Patent number: 8647535Abstract: A metal seed composition useful in seeding a metal diffusion barrier or conductive metal layer on a semiconductor or dielectric substrate, the composition comprising: a nanoscopic metal component that includes a metal useful as a metal diffusion barrier or conductive metal; an adhesive component for attaching said nanoscopic metal component on said semiconductor or dielectric substrate; and a linker component that links said nanoscopic metal component with said adhesive component. Semiconductor and dielectric substrates coated with the seed compositions, as well as methods for depositing the seed compositions, are also described.Type: GrantFiled: January 7, 2011Date of Patent: February 11, 2014Assignee: International Business Machines CorporationInventors: Kelly Malone, Habib Hichri
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Publication number: 20140037941Abstract: This invention is directed to a polymer thick film conductive composition that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.Type: ApplicationFiled: October 10, 2013Publication date: February 6, 2014Applicant: E I Du Pont De Nemours And CompanyInventors: JAY ROBERT DORFMAN, Vincenzo Arancio
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Publication number: 20140035995Abstract: Provided are aerosol jet uncoated and coated (e.g., glass-coated) metal conductive ink compositions that can be deposited onto a substrate using, for example, aerosol jet printing and direct-write methods such as Aerosol Jet (e.g., Optomec M 3D) deposition and methods of aerosol jet deposition of the aerosol jet uncoated and coated metal conductive ink compositions. Also provided are aerosol jet UV curable dielectric ink compositions that exhibit transparency, storage stability, and very good print quality and print stability, thereby enabling the formation of very fine dielectric features on a variety of substrates.Type: ApplicationFiled: December 7, 2011Publication date: February 6, 2014Applicant: Sun Chemical CorporationInventors: Joe Chou, Michael Mcallister, Philippe Schottland
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Publication number: 20140038346Abstract: The present invention provides a thick-film paste for printing the front side of a solar cell device having one or more insulating layers and a method for doing so. The thick-film paste comprises a source of an electrically conductive metal and a lead-vanadium-based oxide dispersed in an organic medium. The invention also provides a semiconductor device comprising an electrode formed from the thick-film paste.Type: ApplicationFiled: August 3, 2012Publication date: February 6, 2014Applicant: E I DU PONT DE NEMOURS AND COMPANYInventors: KENNETH WARREN HANG, Esther Kim, Brian J. Laughlin, Kurt Richard Mikeska, Ahmet Cengiz Palanduz
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Patent number: 8641929Abstract: Provided is a bonding material which enables formation of a bonded article in nitrogen, and can exhibit bonding strength to withstand practical use while having reduced bonding fluctuations between samples without a heat treatment procedure under pressurized or high temperature conditions. The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 carbon atoms or less; a dispersion medium having a boiling point of 230° C. or higher; and a flux component including an organic matter having at least two carboxyl groups. Particularly, it is preferable to use the silver nanoparticles and submicron silver particles in combination.Type: GrantFiled: June 10, 2011Date of Patent: February 4, 2014Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama
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Patent number: 8642686Abstract: A conductor layer is formed on one surface of a base insulating layer. The conductor layer is composed of a pair of rectangular collector portions and drawn-out conductor portions extending in long-sized shapes from the collector portions, respectively. Cover layers are formed on the base insulating layer to cover respective given portions of the conductor layer. A paste composition containing a compound represented by the formula (1) is used as a material for the cover layer.Type: GrantFiled: August 30, 2011Date of Patent: February 4, 2014Assignee: Nitto Denko CorporationInventors: Shinichi Inoue, Hiroyuki Hanazono, Hirofumi Ebe
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Patent number: 8641927Abstract: A conductive paste including a combination of: a conductive powder, a metallic glass, and a dispersing agent represented by the following Chemical Formula 1 R1-L1-(OR2)n—(OR3)m—O-L2-COOH.??Chemical Formula 1 In Chemical Formula 1, R1 is a substituted or unsubstituted C5 to C30 branched alkyl group, R2 and R3 are each independently a substituted or unsubstituted C2 to C5 alkylene group, L1 is a substituted or unsubstituted C6 to C30 arylene group, L2 is a single bond or a C1 to C4 alkylene group, n and m are each independently integers ranging from 0 to about 30, and 3?n+m?30.Type: GrantFiled: March 15, 2011Date of Patent: February 4, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Sang-Soo Jee, Eun-Sung Lee, Se-Yun Kim, Sang-Mock Lee, Seung Yeon Lee
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Publication number: 20140026953Abstract: Electroconductive paste compositions, particularly for solar cells, contain electroconductive metal particles, glass particles, and an organic vehicle. The electroconductive metal particles are provided as a mixture of silver powder particles and at least one selected from nickel powder, tin (IV) oxide powder, and core-shell particles having a silver shell and a core of nickel and/or tin (IV) oxide. The pastes may be used in the manufacture of contacts or electrodes for the front side or back side of solar cells.Type: ApplicationFiled: January 17, 2012Publication date: January 30, 2014Applicant: Heraeus Precious Metals North America Conshohocken LLCInventors: Weiming Zhang, Jerome Moyer, Tung T. Pham
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Publication number: 20140030509Abstract: A conductive composition that is sinterable comprises (i) micron- or submicron-sized silver flakes or powders and (ii) a fluxing agent, or an oxygenated solvent, or a peroxide. The composition can be used to adhere semiconductor dies with silver backing to copper-, silver-, or gold lead-frames at sintering temperatures of ?250° C. without the application of pressure.Type: ApplicationFiled: March 14, 2013Publication date: January 30, 2014Applicant: Henkel CorporationInventors: Harry Richard Kuder, Juliet Grace Sanchez
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Publication number: 20140023907Abstract: A printed energy storage device includes a first electrode, a second electrode, and a separator between the first and the second electrode. At least one of the first electrode, the second electrode, and the separator includes frustules, for example of diatoms. The frustules may have a uniform or substantially uniform property or attribute such as shape, dimension, and/or porosity. A property or attribute of the frustules can also be modified by applying or forming a surface modifying structure and/or material to a surface of the frustules. A membrane for an energy storage device includes frustules. An ink for a printed film includes frustules.Type: ApplicationFiled: July 17, 2013Publication date: January 23, 2014Inventors: Vera N. Lockett, John G. Gustafson, Mark D. Lowenthal, William J. Ray
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Publication number: 20140023854Abstract: A silicon dioxide sol includes tetraethyl silicate, sodium silicate, dimethylformamide, absolute ethanol, hydrochloric acid and water. A surface treatment method for metal substrate using the silicon dioxide sol and articles manufactured by the method is also provided, the surface treatment providing significantly better ant-corrosion and anti-wear properties for the metal substrate.Type: ApplicationFiled: December 20, 2012Publication date: January 23, 2014Applicants: FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.Inventors: TING DING, DA-HUA CAO
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Publication number: 20140021417Abstract: To provide a paste composition capable of forming a silver electrode having a high bond strength and a low contact resistance, and to provide a solar cell endowed with a high conversion efficiency and excellent reliability, the solar cell including an electrode formed using such a paste composition, a silver electrode-forming paste composition includes a silver powder, a glass component and an organic medium, and the glass component includes tellurium-loaded glass frit which is glass frit having a tellurium compound supported on surfaces thereof. This silver electrode-forming paste composition can be produced by a method which includes the steps of: preparing tellurium-loaded glass frit sintering the mixture in the temperature range of (Tm?35)° C. to (Tm+20)° C.; and dispersing the glass component and the silver powder in an organic medium using the tellurium-loaded glass frit as at least part of the glass component.Type: ApplicationFiled: July 18, 2013Publication date: January 23, 2014Inventors: Tomohisa KOIKE, Shinji SENDA, Masayuki DOIZAKI, Tsuyoshi ISHIMARU, Kazutaka NAKAYAMA
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Patent number: 8632700Abstract: Disclosed is an electrically conductive feature on a substrate, and methods and compositions for forming the same, wherein the electrically conductive feature includes metallic anisotropic nanostructures and is formed by injetting onto the substrate a coating solution containing the conductive anisotropic nanostructures.Type: GrantFiled: February 25, 2009Date of Patent: January 21, 2014Assignee: Cambrios Technologies CorporationInventor: Adrian Winoto
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Patent number: 8628693Abstract: Composite particles of a metal particle within a crosslinked, cored dendrimer are described. Additionally, methods of making the composite particles and compositions that contain the composite particles are described.Type: GrantFiled: March 5, 2008Date of Patent: January 14, 2014Assignee: 3M Innovative Properties CompanyInventors: Michael S. Wendland, Neal A. Rakow, Mary I. Buckett
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Publication number: 20140008588Abstract: The present invention provides a metal paste composition which can obtain the calcined bodies having low volume resistivity in a wiring substrate after calcining. More specifically, the present invention provides a metal paste composition comprising a metal, an aliphatic polycarbonate, and an organic solvent.Type: ApplicationFiled: March 6, 2012Publication date: January 9, 2014Applicants: OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE, SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Nobutaka Fujimoto, Tomoki Kawakita, Ryou Miyabara, Masami Nakamoto, Toshinobu Ohno, Mari Yamamoto, Yukiyasu Kashiwagi
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Publication number: 20140008112Abstract: Electrically conductive polymeric compositions curable at temperatures below 250° C. are disclosed. The compositions are particularly well suited for forming electrodes used in association with certain solar cells.Type: ApplicationFiled: September 28, 2011Publication date: January 9, 2014Inventors: Hong Jiang, Aziz S. Shaikh
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Publication number: 20140007937Abstract: An electroconductive paste contains an electroconductive powder, a non-lead-type glass frit, a binder resin, and a solvent, wherein the solvent contains at least one first solvent such as texanol that contains at least one of a carboxylate group and a hydroxyl group and at least one second solvent such as propylene carbonate that does not contain the carboxylate and the hydroxyl group and has a hydrogen-bond term among the Hansen solubility parameters of 7 (J/cm3)1/2 or less. A light-receiving surface electrode 3 is formed by using this electroconductive paste. By this, an electroconductive paste for forming an electrode of a solar cell having a good printing property and having good cell characteristics, and a solar cell manufactured by using this electroconductive paste are realized.Type: ApplicationFiled: August 9, 2013Publication date: January 9, 2014Applicant: MURATA MANUFACTURING CO., LTD.Inventor: Yorinobu Maeda
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Patent number: 8623242Abstract: Disclosed is a method suitable for large-scale producing silver nanostructures including nanoparticles and nanowires with high crystallization and purity in a short period of time. In this method, silver particles with mean diameter less than 200 nm and silver nanowires with length in micrometers are produced through a microwave-assisted wet chemistry method. Tens to hundreds grams of silver nanoparticles and nanowires are obtained in minutes by microwave irradiation treatment to a precursor pre-made by highly concentrated silver salt solution and other additives. These silver nanoparticles and nanowires have good dispersibility and are ideal for forming conductive adhesives.Type: GrantFiled: December 11, 2009Date of Patent: January 7, 2014Assignee: Jiangsu Nanowell Advanced Materials Sci & Tech. Co., Ltd.Inventors: Qingkui Jiang, Zhenyu Chang, Mingyuan Ge, Yonghao Lu
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Publication number: 20140001419Abstract: A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring substrate includes a thermosetting resin composition, conductive particles, and light-reflective insulating particles. The light-reflective insulating particles are formed by subjecting titanium oxide particles to a surface treatment with one kind selected from the group consisting of Al2O3, SiO, SiO2, ZnO, ZnO2, and ZrO2. The amount of the titanium oxide contained in the light-reflective insulating particles is 85 to 93%. The particle diameter of the light-reflective insulating particles is 0.2 to 0.3 ?m, and the particle diameter of the conductive particles is 2 to 10 ?m.Type: ApplicationFiled: February 24, 2012Publication date: January 2, 2014Applicant: DEXERIALS CORPORATIONInventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi
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Publication number: 20140001422Abstract: A composition of a silver-conjugated compound composite containing (1) a silver-conjugated compound composite containing a silver particle with a Feret diameter of 1,000 nm or less and a conjugated compound having a weight average molecular weight of 3.0×102 or more being adsorbed to the silver particles and (2) an ionic compound. The ionic compound may be a compound having a structure represented by the following Formula (hh-1): [Chem. 1] Mm?+aX?n??b??(hh-1) wherein Mm?+ represents a metal cation, X?n?? represents an anion, a and b each independently represent an integer of 1 or more, and when Mm?+ and X?n?? are each plurally present, they may be the same as or different from each other.Type: ApplicationFiled: March 15, 2012Publication date: January 2, 2014Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Takayuki Iijima, Hideyuki Higashimura
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Publication number: 20140000942Abstract: The present invention relates to a conductive ink composition including metal particles, a first solvent having a vapor pressure of 3 torr or less at 25° C., a second solvent having a vapor pressure of more than 3 torr at 25° C., and metal carboxylate, a printing method using the same, and a conductive pattern manufactured by using the same.Type: ApplicationFiled: March 14, 2012Publication date: January 2, 2014Applicant: LG CHEM LTD.Inventors: Jiehyun Seong, Joo Yeon Kim, Young Chang Byun, Jung Hyun Seo, Seung Heon Lee
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Publication number: 20140001421Abstract: Systems and methods for fabricating nanostructures using other nanostructures as templates. A method includes mixing a dispersion and a reagent solution. The dispersion includes nanostructures such as nanowires including a first element such as copper. The reagent solution includes a second element such as silver. The second element at least partially replaces the first element in the nanostructures. The nanostructures are optionally washed, filtered, and/or deoxidized.Type: ApplicationFiled: June 26, 2013Publication date: January 2, 2014Applicant: NthDegree Technologies Worldwide Inc.Inventors: Vera N. Lockett, Mark D. Lowenthal, William J. Ray, John Gustafson
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Publication number: 20140001420Abstract: A method for the synthesis of new metal based metal nanoparticles by the combination of conducting polymers and room temperature ionic liquids to produce nanoparticle electro-catalysts with very high catalytic activity and controllable size and high surface area to volume ratios.Type: ApplicationFiled: September 30, 2011Publication date: January 2, 2014Inventors: Lawrence T. Drzal, In-Hwan Do
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Publication number: 20140001414Abstract: The present invention relates to a composition for a one-part die attach adhesives material useful for packaging semi-conductors including HB-LED. The composition of the present invention includes a thermal and electrical conductive filler, a polymer matrix and a solvent which form a material with high thermal conductivity, low curing temperature and high self-life temperature. The present invention also relates to a method of preparing said composition by mixing a size-selected and surface-modified filler formulation, a polymer matrix and a non-reactive organic solvent together followed by curing the mixture at a low temperature.Type: ApplicationFiled: March 22, 2012Publication date: January 2, 2014Applicant: NANO AND ADVANCED MATERIALS INSTITUTE LIMITEDInventors: Chenmin Liu, Dong Lu, Xianxin Lang, Bo Wang, Zhiying Li
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Patent number: 8617427Abstract: Electrically conductive polymeric compositions adapted for use in forming electronic devices are disclosed. The compositions are thermally curable at temperatures less than about 250° C. Compositions are provided which may be solvent-free and so can be used in processing or manufacturing operations without solvent recovery concerns. The compositions utilize (i) fatty acid modified epoxy acrylate and/or methacrylate monomer(s) and/or oligomer(s), (ii) fatty acid modified polyester acrylate and/or methacrylate monomer(s) and/or oligomer(s), or combinations of (i) and (ii). Also described are electronic assemblies such as solar cells using the various compositions and related methods.Type: GrantFiled: October 22, 2009Date of Patent: December 31, 2013Assignee: Heraeus Precious Metals North America Conshohocken LLCInventors: Hong Jiang, Aziz S. Shaikh
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Patent number: 8617688Abstract: The present invention provides a conductive paste comprising flake conductive fillers having a 99% cumulative particle size of 25 ?m or less and a binder resin as essential components. The flake conductive fillers are metal particles having a silver-copper alloy surface layer. The conductive paste according to the present invention is fused with a part of a copper foil circuit to which the conductive paste is to be connected during connection by heating and pressurization, and has high electrical conductivity and high fill ration in a via hole. Thus, the conductive paste according to the present invention provides a multilayer printed wiring board that has high reliability of connection and excellent interlayer connection.Type: GrantFiled: May 18, 2006Date of Patent: December 31, 2013Assignee: Sumitomo Electric Industries, Ltd.Inventors: Yoshio Oka, Hitoshi Takii, Noriki Hayashi
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Patent number: 8617428Abstract: Thick film resistor paste compositions, and methods for making the thick film compositions are disclosed. The compositions include a resistor composition dispersed in an organic vehicle. The resistor composition has 3 to 60% by weight RuO2 conductive material, 5 to 75% by weight Ag conductive material, 15 to 60% by weight glass frit and optionally up to 10% by weight copper oxide or precursor thereof, and up to 20% by weight bismuth oxide or precursor thereof. The resistor composition when printed to a dry thickness and fired at a temperature between 750° C. and 950° C. achieves a sheet resistivity between 10 and 10,000 milliohms/square and a hot temperature coefficient of resistivity of 1000 ppm/C or higher. The fired resistor composition may achieve a resistance thickness ratio (Rtr) value between 0.75 and 1.50.Type: GrantFiled: November 9, 2011Date of Patent: December 31, 2013Assignee: E I du Pont de Nemours and CompanyInventors: Marc H. LaBranche, Kenneth Warren Hang
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Publication number: 20130341571Abstract: A metallic composite composition containing: a metallic composite in which a conjugated compound having a molecular weight of 200 or more is adsorbed to a metallic nanostructure having an aspect ratio of 1.5 or more, and an ionic compound, with the proviso that when the ionic compound is a conjugated compound, the ionic compound is a conjugated compound having a molecular weight of less than 200. A mixture containing the metallic composite composition and a conjugated compound having a molecular weight of 200 or more. The ionic compound may be a compound having a structure represented by Formula (hh-1) below: [Chem. 1] Mm?+aX?n??b??(hh-1) wherein Mm?+ represents a metal cation, X?n?? represents an anion, a and b each independently represent an integer of 1 or more, and when each of Mm?+ and X?n?? is plurally present, they each may be the same as or different from each other.Type: ApplicationFiled: March 15, 2012Publication date: December 26, 2013Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Takayuki Iijima, Hideyuki Higashimura