Abstract: A III-nitride-based semiconductor device is provided. The III-nitride semiconductor device includes a silicon substrate having a surface with a periodic array of recesses formed therein. A discontinuous insulating layer is formed within each recess of the periodic array of recesses such that a portion of the silicon substrate surface between adjacent recesses is free from coverage of the discontinuous insulating layer. A first epitaxial III-nitride semiconductor layer is formed over the silicon substrate with the periodic array of recesses and discontinuous insulating layer formed thereon. A second III-nitride semiconductor layer is disposed over the first III-nitride semiconductor layer and has a bandgap greater than a bandgap of the first III-nitride semiconductor layer. At least one source and at least one drain are disposed over the second III-nitride semiconductor layer. A gate is also disposed over the second III-nitride semiconductor layer between the source and the drain.

Abstract: An igniter controls a current flowing in a coil unit for supplying a high voltage to a spark plug for use in an internal combustion engine. The igniter includes: a pyrogenic power element, a metal block, a lead frame, and a controller. The lead frame electrically connects the metal block and the coil unit to each other. The controller controls the operation of the power element. The power element is fixed directly to the metal block by soldering at a surface of the power element on one side, and is electrically connected to the controller at a surface of the power element on the other side. With this configuration, heat generated during the operation of the power element is transferred smoothly in a moment to the metal block. As a result, temperature increase at the power element is suppressed during the operation of the power element.

Abstract: Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, the electronic package comprises a mold layer having a first surface and a second surface opposite the first surface, and a plurality of first dies embedded in the mold layer. In an embodiment, each of the plurality of first dies has a surface that is substantially coplanar with the first surface of the mold layer. In an embodiment, the electronic package further comprises a second die embedded in the mold layer. In an embodiment, the second die is positioned between the plurality of first dies and the second surface of the mold layer.

Abstract: The present disclosure relates to a field effect transistor (FET) structure. The FET structure has a substrate, an active region, a dielectric layer provided over a channel of the active region and a gate provided over the dielectric layer. The active region comprises a source, a drain and the channel provided between the source and the drain. The active region is surrounded by an isolation trench, such that width edges of the channel are directly adjacent to the isolation trench. Current paths run between the source and the drain, through the channel. The FET is configured such that current paths running proximal to the channel edges are reduced or weaker in comparison to a dominant current path running through a center of the channel. One or more of the channel, the dielectric layer or the substrate can be modified or adapted to provide the reduced and dominant current paths.

Abstract: Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, the electronic package comprises a mold layer having a first surface and a second surface opposite the first surface, and a plurality of first dies embedded in the mold layer. In an embodiment, each of the plurality of first dies has a surface that is substantially coplanar with the first surface of the mold layer. In an embodiment, the electronic package further comprises a second die embedded in the mold layer. In an embodiment, the second die is positioned between the plurality of first dies and the second surface of the mold layer.

Abstract: A semiconductor device of the present invention includes a semiconductor layer of a first conductivity type having a cell portion and an outer peripheral portion disposed around the cell portion, formed with a gate trench at a surface side of the cell portion, and a gate electrode buried in the gate trench via a gate insulating film, forming a channel at a portion lateral to the gate trench at ON-time, the outer peripheral portion has a semiconductor surface disposed at a depth position equal to or deeper than a depth of the gate trench, and the semiconductor device further includes a voltage resistant structure having a semiconductor region of a second conductivity type formed in the semiconductor surface of the outer peripheral portion.

Abstract: A method of forming a semiconductor structure and the semiconductor structure are provided. The method includes the following operations. A semiconductor substrate is provided, in which a plurality of isolation grooves distributed at intervals are provided in the semiconductor substrate, and each of the isolation grooves includes a top region isolation groove and a bottom region isolation groove. A first protective layer covering the side wall of the top region isolation groove and the top of the semiconductor substrate is formed. Oxidation treatment is performed on the bottom region isolation groove to oxidize a part of the semiconductor substrate close to the bottom region isolation groove to form a second substrate isolation layer. A dielectric layer filling the isolation groove is formed. The first protective layer and the dielectric layer higher than the top of the semiconductor substrate are etched to form an isolation structure.

Abstract: A method of fabricating an IC includes forming a layer stack thereon including silicon nitride layer on a first silicon oxide layer, with a second silicon oxide layer thereon on a substrate including a semiconductor material. The layer stack is etched to form ?1 trench that is at least 2 microns deep into the semiconductor material. A dielectric liner is formed on sidewalls and a bottom of the trench. A polysilicon layer is formed on the dielectric liner that fills the trench and extends lateral to the trench. Chemical mechanical planarization (CMP) processing stops on the silicon nitride layer to remove the polysilicon layer and the second silicon oxide layer to form a trench structure having a polysilicon fill. After the CMP processing, thermal oxidation oxidizes exposed regions of the polysilicon layer to form a polysilicon oxide layer. After the thermal oxidizing, the silicon nitride layer is removed.

Abstract: A semiconductor device with large memory capacity is provided. A semiconductor device includes first to fourth insulators, a first conductor, a second conductor, and a first semiconductor, and the first semiconductor includes a first surface and a second surface. A first side surface of the first conductor is included on the first surface of the first semiconductor, and a first side surface of the first insulator is included on a second side surface of the first conductor. The second insulator is included in a region including a second side surface and a top surface of the first insulator, a top surface of the first conductor, and the second surface of the first semiconductor. The third insulator is included on a formation surface of the second insulator, and the fourth insulator is included on a formation surface of the third insulator. The second conductor is included in a region overlapping the second surface of the first semiconductor in a region where the fourth insulator is formed.

Abstract: A semiconductor device is proposed. The semiconductor device includes a semiconductor body including a first main surface. A plurality of trench electrode structures extend in parallel along a first lateral direction. A first one of the plurality of trench electrode structures includes a gate electrode. A gate contact is electrically connected to the gate electrode in a gate contact area. The gate contact area is arranged in a first section along the first lateral direction. An isolation structure is arranged between the gate contact and the semiconductor body in the gate contact area. A bottom side of the isolation structure is arranged between a bottom side of the first one of the plurality of trench electrode structures and the first main surface along a vertical direction. The gate contact extends up to or below the first main surface along the vertical direction.

Abstract: A semiconductor device package structure is provided. The semiconductor device package structure includes a substrate having a first layer over a second layer. The first layer may have greater thermal conductivity than the second layer. The semiconductor device package structure further includes one or more dies coupled to the substrate. A heat spreader may have a first section coupled to a first surface of a first die of the one or more dies, and a second section coupled to the first layer.

Abstract: A device includes a semiconductor substrate, a gate dielectric over the semiconductor substrate, and a gate electrode over the gate dielectric. The gate electrode has a first portion having a first thickness, and a second portion having a second thickness smaller than the first thickness. The device further includes a source/drain region on a side of the gate electrode with the source/drain region extending into the semiconductor substrate, and a device isolation region. The device isolation region has a part having a sidewall contacting a second sidewall of the source/drain region to form an interface. The interface is overlapped by a joining line of the first portion and the second portion of the gate electrode.

Abstract: A JBS diode includes a substrate; a first semiconductor layer arranged on a first face of the substrate and having a first type of conductivity, the first semiconductor layer including a projecting portion delimited by a trench; a second semiconductor layer arranged on the projecting portion and having a second type of conductivity opposite to the first type of conductivity; an electrically insulating layer arranged at the bottom of the trench; a first electrode including a first portion in Schottky contact with the first semiconductor layer, the first portion being arranged on the electrically insulating layer and against a side wall of the projecting portion of the first semiconductor layer; a second portion in ohmic contact with the second semiconductor layer; a second electrode in ohmic contact with the substrate.

Abstract: Various multi-die arrangements and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing a semiconductor chip device is provided. A redistribution layer (RDL) structure is fabricated with a first side and second side opposite to the first side. An interconnect chip is mounted on the first side of the RDL structure. A first semiconductor chip and a second semiconductor chip are mounted on the second side of the RDL structure after mounting the interconnect chip. The RDL structure and the interconnect chip electrically connect the first semiconductor chip to the second semiconductor chip.

Abstract: A semiconductor device and method for manufacturing the same are provided. The method includes providing a semiconductor substrate, forming a porous low-k dielectric layer on the semiconductor substrate, forming a through-hole and a trench of a copper interconnect structure, performing a helium plasma treatment on an exposed surface of the porous low-k dielectric layer, performing a nitrogen plasma treatment on the exposed surface of the porous low-k dielectric layer to form a silicon nitride layer, performing an argon plasma treatment on the silicon nitride layer, and forming a diffusion barrier layer on bottoms and sidewalls of the through-hole and the trench of the copper interconnect structure. Through the successive helium, nitrogen and argon plasma treatments, the low-k dielectric layer has a smooth and dense surface that increases the adhesion strength between the low-k dielectric layer and the diffusion barrier layer to improve reliability and yield of the semiconductor device.

Abstract: A method for fabricating isolation device is disclosed. The method includes the steps of: providing a substrate; forming a shallow trench isolation (STI) in the substrate, the STI includes a first STI and a second STI, and the first STI surrounds a first device region and the second STI surrounds a second device region; forming a first doped region between and contact the first STI and the second STI; and forming a first gate structure on the first doped region, the first STI and the second STI.

Abstract: A semiconductor device having a plurality of transistors includes a termination area that features a transistor with an asymmetric gate.

Abstract: III-nitride materials are generally described herein, including material structures comprising III-nitride material regions and silicon-containing substrates. Certain embodiments are related to gallium nitride materials and material structures comprising gallium nitride material regions and silicon-containing substrates.

Abstract: Methods of forming a PFET dielectric cap with varying concentrations of H2 reactive gas and the resulting devices are disclosed. Embodiments include forming p-type and n-type metal gate stacks, each surrounded by SiN spacers; forming an ILD surrounding the SiN spacers; planarizing the ILD, the metal gate stacks, and the SiN spacers; determining at least one desired threshold voltage for the p-type metal gate stack; forming a first cavity in the p-type metal gate stack for each desired threshold voltage and a second cavity in the n-type metal gate stack; selecting a first nitride layer for each first cavity, the first nitride layer for each cavity having a concentration of hydrogen reactive gas based on the desired threshold voltage associated with the cavity; forming the first nitride layers in the respective first cavities; and forming a second nitride layer, with a hydrogen rich reactive gas, in the second cavity.

Abstract: On an EP substrate 1, an EP layer 2 having a conductivity type different from that of the EP substrate 1 is grown. With ion implantation, a well 5 having the same conductivity type as the EP layer 2 is formed, and a channel stop layer 10 is also formed. A dopant having a conductivity type different from that of the well 5 is diffused in the well 5 to form a pn junction 7 in the well 5. A plurality of cells 20 each having the diffusion layer 6 as one electrode and a rear surface 1a as the other electrode are formed as a TEG. Using the TEG, junction leakage currents from two depletion layers, a depletion layer 8 in the well and a depletion layer 4 at an interface between the EP layer 2 and the EP substrate 1, are measured.

Abstract: A semiconductor device including a cell region and a peripheral region around the cell region, the cell region including: a first semiconductor layer having a first conductivity type; a second semiconductor layer which is formed in an island shape on the surface of the first semiconductor layer and has a second conductivity type different from the first conductivity type; a third semiconductor layer which is formed in an island shape on the surface of the second semiconductor layer and has the first conductivity type; and a plurality of gate trenches penetrating the second semiconductor layer and reaching the inside of the first semiconductor layer, and a termination layer which is formed in an island shape in the surface of the first semiconductor layer and has the first conductivity type.

Abstract: An external direct connection usable for an embedded interconnect bridge package is described. In one example, a package has a substrate, a first semiconductor die having a first bridge interconnect region, and a second semiconductor die having a second bridge interconnect region. The package has a bridge embedded in the substrate, the bridge having a first contact area to connect to the first bridge interconnect region and a second contact area to connect to the second bridge interconnect region, and an external connection rail extending between the interconnect bridge and the first and second semiconductor dies to supply external connection to the first and second bridge interconnect regions.

Abstract: An image sensor includes a charge accumulation region of a first conductivity type, an isolating semiconductor region formed from an impurity semiconductor region of a second conductivity type, a channel stop region formed from an impurity semiconductor region of the second conductivity type which is located on the isolating semiconductor region, and an insulator arranged on the channel stop region. The insulator includes a first insulating portion arranged above the isolating semiconductor region via the channel stop region, a second insulating portion arranged adjacent to an outside of the first insulating portion, wherein thickness of the second insulating potion decreases with an increase in distance from the first insulating portion, and a third insulating portion formed on the first insulating portion, wherein the third insulating portion has upper and side faces connecting the upper face to an upper face of the second insulating portion.

Abstract: Semiconductor structures and methods for manufacturing the same are disclosed. The semiconductor structure comprises: a gate stack formed on a semiconductor substrate; a super-steep retrograde island embedded in said semiconductor substrate and self-aligned with said gate stack; and a counter doped region embedded in said super-steep retrograde island, wherein said counter doped region has a doping type opposite to a doping type of said super-steep retrograde island. The semiconductor structures and the methods for manufacturing the same facilitate alleviating short channel effects.

Abstract: Semiconductor photodetectors are provided that may enable optimized usage of an active detector array. The semiconductor photodetectors may have a structure that can be produced and/or configured as simply as possible. A radiation detector system is also provided.

Abstract: An integrated circuit is formed by providing a heavily doped substrate of a first conductivity type, forming a lightly doped lower epitaxial layer of the first conductivity type over the substrate, implanting dopants of the first conductivity type into the lower epitaxial layer in an area for a shallow component and blocking the dopants from an area for a deep component, forming a lightly doped upper epitaxial layer over the lower epitaxial layer and activating the implanted dopants to form a heavily doped region. The shallow component is formed over the heavily doped region, and the deep component is formed outside the heavily doped region, extending through the upper epitaxial layer into the lower epitaxial layer.

Abstract: For simplifying the dual-damascene formation steps of a multilevel Cu interconnect, a formation step of an antireflective film below a photoresist film is omitted. Described specifically, an interlayer insulating film is dry etched with a photoresist film formed thereover as a mask, and interconnect trenches are formed by terminating etching at the surface of a stopper film formed in the interlayer insulating film. The stopper film is made of an SiCN film having a low optical reflectance, thereby causing it to serve as an antireflective film when the photoresist film is exposed.

Abstract: An integrated circuit chip is formed with a circuit layer, a trap rich layer and through-semiconductor-vias. The trap rich layer is formed above the circuit layer. The through-semiconductor-vias are also formed above the circuit layer. In some embodiments, the circuit layer is included in a wafer, and the trap rich layer and through-semiconductor-vias are included in another wafer. The two wafers are bonded together after formation of the trap rich layer and through-semiconductor-vias. Additionally, in some embodiments, yet another wafer may also be bonded to the wafer that includes the trap rich layer and through-semiconductor-vias. Furthermore, in some embodiments, another circuit layer may be formed in the wafer that includes the trap rich layer and through-semiconductor-vias.

Abstract: A semiconductor device is provided which includes a semiconductor substrate having a first surface, an active area and a peripheral area. The semiconductor device further includes least one channel stop trench formed in the semiconductor substrate, wherein the channel stop trench extends from the first surface at least partially into the semiconductor substrate and is arranged between the active area and the peripheral area. At least one electrode is arranged in the channel stop trench. The semiconductor substrate includes at least a peripheral contact region, which is arranged in the peripheral area at the first surface of the semiconductor substrate. A conductive layer is provided and in electrical contact with the electrode arranged in the channel stop trench and in electrical contact with the peripheral contact region. The conductive layer is electrically connected to the semiconductor substrate merely in the peripheral area and electrically insulated from the semiconductor substrate in the active area.

Abstract: Disclosed herein is a semiconductor device including a gate insulating film formed over a semiconductor substrate, and a gate electrode formed over the gate insulating film, wherein the gate insulating film is so provided as to protrude from both sides of the gate electrode, and the gate electrode includes a wholly silicided layer.

Abstract: A semiconductor device is provided which includes a semiconductor substrate having a first surface, an active area and a peripheral area. The semiconductor device further includes least one channel stop trench formed in the semiconductor substrate, wherein the channel stop trench extends from the first surface at least partially into the semiconductor substrate and is arranged between the active area and the peripheral area. At least one electrode is arranged in the channel stop trench. The semiconductor substrate includes at least a peripheral contact region, which is arranged in the peripheral area at the first surface of the semiconductor substrate. A conductive layer is provided and in electrical contact with the electrode arranged in the channel stop trench and in electrical contact with the peripheral contact region. The conductive layer is electrically connected to the semiconductor substrate merely in the peripheral area and electrically insulated from the semiconductor substrate in the active area.

Abstract: A semiconductor device is provided which includes a semiconductor substrate having a first surface, an active area and a peripheral area. The semiconductor device further includes least one channel stop trench formed in the semiconductor substrate, wherein the channel stop trench extends from the first surface at least partially into the semiconductor substrate and is arranged between the active area and the peripheral area. At least one electrode is arranged in the channel stop trench. The semiconductor substrate includes at least a peripheral contact region, which is arranged in the peripheral area at the first surface of the semiconductor substrate. A conductive layer is provided and in electrical contact with the electrode arranged in the channel stop trench and in electrical contact with the peripheral contact region. The conductive layer is electrically connected to the semiconductor substrate merely in the peripheral area and electrically insulated from the semiconductor substrate in the active area.

Abstract: An electrically programmable device with embedded EEPROM and method for making thereof. The method includes providing a substrate including a first device region and a second device region, growing a first gate oxide layer in the first device region and the second device region, and forming a first diffusion region in the first device region and a second diffusion region and a third diffusion region in the second device region. Additionally, the method includes implanting a first plurality of ions to form a fourth diffusion region in the first device region and a fifth diffusion region in the second device region. The fourth diffusion region overlaps with the first diffusion region.

Abstract: A semiconductor device is provided which includes a semiconductor substrate having a first surface, an active area and a peripheral area. The semiconductor device further includes least one channel stop trench formed in the semiconductor substrate, wherein the channel stop trench extends from the first surface at least partially into the semiconductor substrate and is arranged between the active area and the peripheral area. At least one electrode is arranged in the channel stop trench. The semiconductor substrate includes at least a peripheral contact region, which is arranged in the peripheral area at the first surface of the semiconductor substrate. A conductive layer is provided and in electrical contact with the electrode arranged in the channel stop trench and in electrical contact with the peripheral contact region. The conductive layer is electrically connected to the semiconductor substrate merely in the peripheral area and electrically insulated from the semiconductor substrate in the active area.

Abstract: A semiconductor device in which a desired device is formed, comprising a semiconductor substrate having a first impurity region of a first conductivity type provided around an edge of a region in which the desired device is formed, and a second impurity region of the first conductivity type provided in a scribe region of the semiconductor substrate; wherein a channel stopper is formed between the first impurity region and the second impurity region.

Abstract: A susceptor for epitaxial layer forming apparatus provided in a layer forming chamber of an epitaxial layer forming apparatus includes: a recessed portion which is provided to accommodate a semiconductor wafer therein and has an approximately circular shape in plan view; and a protruding portion which is provided in the recessed portion in order to support the semiconductor wafer and has an approximately circular shape in plan view. The diameter of the protruding portion is smaller than that of the recessed portion, and the diameter of the protruding portion is set to be a size allowing reaction gas supplied for vapor-phase growth reaction to circulate through an entire boundary between the protruding portion and the semiconductor wafer when the semiconductor wafer is placed in the recessed portion.

Abstract: A gate conductor structure is provided having a barrier region between a N-type device and a P-type device, wherein the barrier region minimizes or eliminates cross-diffusion of dopant species across the barrier region. The barrier region comprises at least one sublithographic gap in the gate conductor structure. The sublithographic gap is formed by using self-assembling copolymers to form a sublithographic patterned mask over the gate conductor structure. According to one embodiment, at least one sublithographic gap is a slit or line that traverses the width of the gate conductor structure. The sublithographic gap is sufficiently deep to minimize or prevent cross-diffusion of the implanted dopant from the upper portion of the gate conductor. According to another embodiment, the sublithographic gaps are of sufficient density that cross-diffusion of dopants is reduced or eliminated during an activation anneal such that changes in Vt are minimized.

Abstract: A method for fabricating an in-plane switching LCD device includes forming a data line and a light-shielding layer on a substrate, forming a pixel electrode line and an active region with a polycrystalline silicon thin film, forming a first insulating layer on the substrate, forming a gate electrode and a common electrode line on the first insulating layer, forming a second insulating layer on the substrate, forming a first contact hole that exposes at least portions of the data line and the active region, and forming a connection electrode that connects at least portions of the exposed data line and the active region.

Abstract: A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element. Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 ?m or more and to 10.0 ?m or less and preferably to 1.0 ?m or more and to 5.0 ?m or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.

Abstract: A new method of forming a composite etching stop layer is described. An etching stop layer is deposited on a substrate wherein the etching stop layer is selected from the group consisting of: silicon carbide, silicon nitride, SiCN, SiOC, and SiOCN. A TEOS oxide layer is deposited by plasma-enhanced chemical vapor deposition overlying the etching stop layer. The composite etching stop layer has improved moisture resistance, better etching selectivity, and lower dielectric constant than other etching stop layers.

Abstract: A dynamic random access memory (DRAM) structure and a fabricating process thereof are provided. In the fabricating process, a channel region is formed with a doped region having identical conductivity as the substrate in a section adjacent to an isolation structure. The doped region is formed in a self-aligned process by conducting a tilt implantation implanting ions into the substrate through the upper portion of the capacitor trench adjacent to the channel region after forming the trench but before the definition of the active region.

Abstract: A method of forming a via contact structure using a dual damascene technique is provided. The method includes forming a lower interconnection line on a semiconductor substrate and sequentially forming an inter-metal dielectric layer and a hard mask layer on the semiconductor substrate having the lower interconnection line. The hard mask layer and the inter-metal dielectric layer are successivley patterned to form a via hole that exposes the lower interconnnection line. A sacrificial layer filling the via hole is formed on the hard mask layer. The sacrificial layer and the hard mask layer are patterned to form a first sacrificial layer pattern having an opening that crosses over the via hole and a second sacrificial layer pattern that remains in the via hole and to simultaneously form a hard mask pattern underneath the first sacrificial layer pattern.

Abstract: An advanced back-end-of-line (BEOL) metallization structure is disclosed. The structure includes a bilayer diffusion barrier or cap, where the first cap layer is formed of a dielectric material preferably deposited by a high density plasma chemical vapor deposition (HDP CVD) process, and the second cap layer is formed of a dielectric material preferably deposited by a plasma-enhanced chemical vapor deposition (PE CVD) process. A method for forming the BEOL metallization structure is also disclosed. The invention is particularly useful in interconnect structure comprising low-k dielectric material for the inter-layer dielectric (ILD) and copper for the conductors.

Abstract: An advanced back-end-of-line (BEOL) metallization structure is disclosed. The structure includes a bilayer diffusion barrier or cap, where the first cap layer is formed of a dielectric material preferably deposited by a high density plasma chemical vapor deposition (HDP CVD) process, and the second cap layer is formed of a dielectric material preferably deposited by a plasma-enhanced chemical vapor deposition (PE CVD) process. A method for forming the BEOL metallization structure is also disclosed. The invention is particularly useful in interconnect structures comprising low-k dielectric material for the inter-layer dielectric (ILD) and copper for the conductors.

Abstract: This invention pertains to a method for producing hydrogenated silicon oxycarbide (H:SiOC) films having low dielectric constant and a light transmittance of 95% or more for light with a wavelength in the range of 400 nm to 800 nm. The method comprises reacting a methyl-containing silane in a controlled oxygen environment using plasma enhanced or ozone assisted chemical vapor deposition to produce the films. Because of the transmittance the resulting films are useful in the formation of display devices.

Abstract: This invention pertains to a method for producing hydrogenated silicon oxycarbide (H:SiOC) films having low dielectric constant. The method comprises reacting an methyl-containing silane in a controlled oxygen environment using plasma enhanced or ozone assisted chemical vapor deposition to produce the films. The resulting films are useful in the formation of semiconductor devices and have a dielectric constant of 3.6 or less.

Abstract: Guard ring diffusions in the termination of a MOSgated device are laterally spaced from one another and are disposed beneath and are insulated from the termination field plate which extends from the periphery of the device active area.

Abstract: A major object of the present invention is to provide an improved semiconductor device so as to be able to reduce gate electric field concentration at a channel edge, suppress decrease in the threshold during MOSFET operation and reduce the leakage current. A gate insulation film is formed on a semiconductor substrate. A gate electrode is formed on the semiconductor substrate with the gate insulation film therebetween. The dielectric constant of the gate insulation film is not uniform in the surface.

Abstract: To provide a semiconductor apparatus that secures high ESD protection capability and yet reduces leak current. Cut sections 64-1 and 64-2 are provided in end sections of a second edge 62 of a drain region 22. When a distance between a first edge 60 of a source region 20 and the second edge 62 in an intermediate area is defined as L1, a distance between the first edge 60 and end edges 52-1 and 52-2 of a channel stopper non-implanted region 50 is defined as L1, a relation of L2? L1 is established. By providing the channel stopper non-implanted region 50, the ESD protection capability is improved. Also, by providing the cut sections 64-1 and 64-2 in a manner to satisfy the relation that is L2 is not less than L1, leak current is reduced. The source region 20 may also be provided with a cut section.

Abstract: An integrated circuit and manufacturing method therefor is provided having a semiconductor substrate with a semiconductor device. A device dielectric layer is formed on the semiconductor substrate. A channel dielectric layer on the device dielectric layer has an opening formed therein. A barrier layer, which has been implanted with a compounding material, lines the channel opening. A conductor core fills the opening over the barrier layer. The barrier layer having a dielectric layer proximate portion of a barrier compound varying into a conductor core proximate portion of a pure barrier material.