Abstract: A light-emitting diode (LED) string includes an electrically conductive wire and a plurality of LEDs. The LEDs are electrically connected to the wire in series along an axial length of the wire. The LED string may include a solder layer, with the LEDs electrically connected to the wire via the solder layer. A tube having an optional phosphor coating may circumscribe the wire and LEDs. When connected to a surface, the LED string emits light in a band of at least 180 degrees with respect to the surface. A light assembly includes a first surface and a first LED string configured as set forth above. The light assembly may include a second LED string positioned with respect to the surface and having additional LEDs configured to illuminate in response to a second control signal from the controller.

Abstract: A light emitting module including a substrate, a plurality of first light emitting diode (LED) chips and a plurality of second LED chips is provided. The substrate has a cross-shaped central region and a peripheral region surrounding the cross-shaped central region. The first LED chips are disposed on the substrate and at least located in the cross-shaped central region. The second LED chips are disposed on the substrate and at least located in the peripheral region. A size of each second LED chip is smaller than a size of each first LED chip. The number of the first LED chips located in the peripheral region is smaller than that in the cross-shaped central region. The number of the second LED chips located in the cross-shaped central region is smaller than that in the peripheral region.

Abstract: An illumination source includes a housing (101), at least one first light emitting diode (LED) (102) coupled to the housing and configured to emit green-shifted white light, at least one second LED (104) coupled to the housing and configured to emit blue-shifted white light, and at least one third LED (106) coupled to the housing and configured to emit at least one of a red-orange light and an amber light.

Abstract: This application describes an assembly suitable for emitting light, and methods of forming the same. The assembly includes a single crystal substrate with first and second surfaces, a plurality of LEDs in immediate contact with the first surface of the substrate. The LEDs are substantially crystal lattice matched with the substrate. The plurality of LEDs includes three or more LEDs that are not in electrical contact with any other LED, and there is a gap between each LED of the plurality and its nearest neighbor LED. The assembly includes phosphor-containing encapsulant layers overlying at least a portion of the LEDs.

Abstract: A LED security light includes a power supply unit, a light sensing unit, a motion sensor unit, a loading and power control unit, an external control unit and a light-emitting unit. In responding respectively to signals outputted from the light sensing unit and the motion sensor unit, the LED security light is turned on at dusk for generating different level illuminations performed by the light emitting unit and turned off at dawn. The light emitting unit includes one or a plurality of LEDs. The external control unit is for setting illumination characteristics of the light emitting unit. The power supply unit comprises a solar power module as a first power source and a backup battery module as a second power source.

Abstract: A method for forming an electronic label including using laser imaging to form a pattern of conductive lines on a conductive film, thereby forming a patterned conductive layer. A phosphorescent layer and a dielectric layer are added over the patterned conductive layer. A conductive trace layer is printed over the dielectric layer using a conductive ink including a pattern of conductive traces that overlap with the conductive lines of the patterned conductive layer to form an electric grid in a display area. One or more electronic components and a power source are added that are adapted to supply power and control signals to the electric grid.

Abstract: A first integrated circuit disposed in a region, in which a length of a first space in a device depth direction is largest, among two regions dividing an entire region of a first main surface of a signal processing circuit board into two in a device width direction. The first space is a space between the signal processing circuit board and a metal chassis, which is a member of the metal chassis and a back cover that opposes the first main surface on which the first integrated circuit is mounted. A first heat sink is disposed between the metal chassis and the back cover and has a plurality of fins. A length of each of the plurality of fins in the device depth direction is set according to a length of the first space in the device depth direction at a position of the fin in the device width direction.

Abstract: A light-emitting diode (LED) light source includes a plurality of electricity-conducting holding elements, and each electricity-conducting holding element is made of a thin metal sheet. The bendable LED light source increases installation of sufficient number of LED dies by lengthening the length of the LED light source. The LED light source is bent to form a spring-like helical structure and then is placed inside a lamp cover. The helical LED light source is fastened on a T-shaped element by a plurality of fastening elements and the T-shaped element is fixed on an insulated holder. Accordingly, a bulb-type LED lamp is implemented.

Abstract: A flexible display apparatus and an adjusting apparatus which is designed to move the flexible display apparatus from a stowing position into a usage position are included in a display device for a motor vehicle. The adjusting apparatus is designed to bend the flexible display apparatus from the stowing position into the usage position.

Abstract: Provided is a lighting device, comprising: a light source module comprising: at least one light source disposed on a printed circuit board; and a resin layer disposed on the printed circuit board so that the light source is embedded; a light reflection member formed on at least any one of one side surface and another side surface of the resin layer; and a diffusion plate having an upper surface which is in contact with an upper part of the light source module, and a side wall which is integrally formed with the upper surface and formed to extend in a lower side direction and which is adhered to the light reflection member, whereby flexibility of the product itself can be secured, and durability and reliability of the product can be also improved.

Abstract: A lighting or indicating device for motor vehicles comprises an enclosure formed by a housing and an outer lens, the enclosure receiving a printed circuit carrying at least one light source and an optical device. The housing comprises means for fastening the stack formed by the printed circuit and the optical device, so as to fix together the housing, the printed circuit carrying at least one light source and the optical device, the printed circuits being sandwiched between the housing and the optical device.

Abstract: Different wavelength conversion materials, or different concentrations of a wavelength conversion material are used to encapsulate the light emitting elements of different colors of a hybrid light emitting module. In an embodiment of this invention, second light emitting elements (170) of a particular color are encapsulated with a transparent second encapsulant (120;420;520), while first light emitting elements (160) of a different color are encapsulated with a wavelength conversion first encapsulant (110;410;510). In another embodiment of this invention, a particular second set of second and third light emitting elements (170,580) of different colors is encapsulated with a different encapsulant than another first set of first light emitting elements (160).

Abstract: A lighting device can include a base substrate, a plurality of LED light sources disposed in a center area of the base substrate in a first direction, and a resin layer stacked in a structure which covers the plurality of LED light sources. One or more printed circuit boards can be disposed on the base substrate.

Abstract: Disclosed is an alternating current dimming drive circuit for an LED, comprising a rectification unit and N stages of LED direct current drive circuits. In the ith stage of LED direct current drive circuit, a first end of the ith voltage sampling unit and an input end of the ith LED light source module directly or indirectly receive the output voltage of the rectification unit; a voltage division end of the ith voltage sampling unit is connected to a second input end of the ith switch unit; and a first input end of the ith switch unit is connected to an output end of the ith LED light source module, and an output end of the ith switch unit, a second end of the ith voltage sampling unit and a second output end of the rectification unit are grounded. When the ith switch unit is switched on, the first to the ith LED light source modules emit light.

Abstract: A light emitting device includes a support member having a mounting surface. The support member includes an insulating member having top surface and a plurality of side surfaces, a first metal pattern disposed on the top surface of the insulating member, and a second metal pattern disposed on the side surface of the insulating member such that a side surface of the second metal pattern is continuous with a top surface of the first metal pattern. The light emitting device further includes a light emitting element mounted on the mounting surface at a location of the first metal pattern, and a bonding member that bonds the light emitting element to the mounting surface. The bonding member covers at least a portion of the first metal pattern and at least a portion of the second metal pattern.

Abstract: The present disclosure provides a method for forming a light-emitting device and a light-emitting device formed thereby. The method comprises the steps of providing a transparent substrate, forming multiple pairs of electrode pins on the transparent substrate wherein each pair of electrode pins comprises two electrode pins, providing multiple LED dies on the transparent substrate wherein each LED die comprises two electrodes, providing multiple pairs of metal wires wherein each pair of metal wires comprises two metal wires correspondingly connecting the two electrodes of each LED die with the two electrode pins of each pair of electrode pins, and cutting the transparent substrate to form multiple light-emitting devices.

Abstract: Light indicator which comprises a support body to which multiple rows of LEDs and multiple lenses are fixed, each of which positioned in front of the corresponding row of LEDs, and provided with a rear surface directed towards the LEDs, and with a front surface directed in the sense opposite the aforesaid rear surface. In addition, the light indicator comprises multiple coupling bodies, each of which extended between two ends thereof, of which a rear end is engaged with the support body, and a front end is provided with a first bent portion engaged in abutment against the front surface of the corresponding lens in order to retain the latter integral with the support body itself.

Abstract: An improved light-emitting diode (LED) light fixture can include a circuit board, multiple LED clusters, and a master power controller. The LED clusters can be arranged on the circuit board and can include at least seven LEDs electrically connected in series and a regulator circuit. The LEDs of an LED cluster can be arranged such that one LED is located at a central point of the LED cluster and the remaining LEDs are arranged in a circular geometry around the center LED. The master power controller can be coupled to the circuit board and can be configured to control power provided to the LED clusters.

Abstract: An illumination device with a number of light sources arranged in at least two groups of light sources that are individually controllable. The first group of light sources (203) have light collectors (209) such as internal reflection (TIR) lenses, mixers or other lenses placed over them to collect and convert light of the light sources into a number of light source beams. The second group of light sources (205) pass light through diffusing areas (215) of a diffuser (213) in the form of a diffusion cover included in the lamp housing to diffuse the light and create a background light for the first group of light sources. The light from the first group of light sources pass through non diffusing regions (211) of the diffuser cover without the light being diffused. The second group of light sources are interleaved with the first group by the diffuser having one or several diffusion areas between non diffusion areas.

Abstract: A light bulb assembly comprising a base, a helical body portion, a LED assembly and an electrical drive. The base includes a cap electrically connectable to a power source. The helical body portion has an outer cylindrical upstanding portion. The helical body portion extends from the base upwardly and has a helical groove disposed along an outer surface. The LED assembly has a strip including a plurality of LED elements that are in a spaced apart orientation. The strip is positionable in the helical groove of the helical body portion. The electrical drive is configured to supply power from the power source to the LED elements. The electrical drive is positioned within the cavity created by at least one of the base and the helical body portion.

Abstract: A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.

Abstract: The present invention relates to a transparent electronic display board and a method of manufacturing the same. More particularly, the transparent electronic display board uses front light-emitting elements and rear light-emitting elements and/or both-sided light-emitting elements, whereby the number of light-emitting elements that can be installed in the transparent electronic display board can be increased. Thereby, the quality of an image displayed on the transparent electronic display board can be markedly improved.

Abstract: A light-emitting module (3a-c; 23; 26; 33a-c) comprising a plurality of light-sources (12a-e; 27a-h) arranged in at least a first and a second column (18a-b; 28a-c) arranged side by side and extending along a first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c); and a plurality of connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b), each being electrically connected to a corresponding one of the light-sources (3a-c; 23; 26; 33a-c) for enabling supply of electrical power thereto. Each connector terminal pair (13a-b, 14a-b, 15a-b, 16a-b 17a-b) comprises a first connector terminal (13a, 14a, 15a, 16a 17a) and a second connector terminal (13b, 14b, 15b, 16b 17b) being arranged at opposite sides of the light-emitting module (3a-c; 23; 26; 33a-c).

Abstract: Provided is a light emitting apparatus that causes no lateral light leakage, enables easy assembly, and allows free selection of the shape of a reflection frame. The light emitting apparatus includes an LED device which is flip-chip mounted on a substrate, a phosphor layer placed on a light emitting surface of the LED device, a reflective resin having a recessed portion formed on the upper surface thereof, the reflective resin covering the side surface of the LED device and the side surface of the phosphor layer, and a reflection frame having a protruded portion formed on the lower surface thereof, the reflection frame being fixed on or above the phosphor layer and the reflective resin by engaging the protruded portion with the recessed portion of the reflective resin.

Abstract: Device for providing comprising: A panel having rigid layer having a patterned electrical circuit thereon. An array of illuminating units, each unit being formed by at least one rigid element and a portion of the rigid layer; and including: a rigid optical dispersing element, a light source sandwiched within the panel for generating light from electrical energy, and an electrical conductor. The electrical conductor being the primary heat sink for the light source, the light source being primarily cooled via conduction. The electrical conductor and the optical dispersing element being dimensioned and arranged within the unit such that the electrical conductor does not materially impede transmission of light generated by the light source to the outside of the device. The electrical conductor transmitting electrical and thermal energy received from the light source away from the unit.

Abstract: A display device in which pixels constituted by light emitting elements arranged on a substrate are arranged in a matrix, the substrate comprises: a canopy disposed at the upper or lower end of the pixels; and at least two kinds of anti-reflective components that are formed at a peripheral edge of the light emitting element and with different reflection angles with respect to incident light.

Abstract: The present disclosure provides a method for manufacturing a light-emitting device, comprising: providing a first substrate; providing a semiconductor stack on the first substrate, the semiconductor stack comprising a first conductive type semiconductor layer, a light-emitting layer on the first conductive type semiconductor layer, and a second conductive type semiconductor layer on the light-emitting layer, wherein the semiconductor stack is patterned and comprises a plurality of blocks of semiconductor stack separated from each other, and wherein the plurality of blocks of semiconductor stack comprise a first block of semiconductor stack and a second block of semiconductor stack; performing a separating step to separate the first block of semiconductor stack from the first substrate, and the second block of semiconductor stack remained on the first substrate; providing a permanent substrate comprising a first surface, a second surface, and a third block of semiconductor stack on the first surface; and bondi

Abstract: A light bulb includes an Edison style base, light emitting diode circuitry coupled to the base, a bulb sealed about the base and extending above the base, an elongated filament substrate supported by the base and extending into the bulb above the base, a light emitting diode channel supported by the filament substrate, coupled to the light emitting diode circuitry, and extending into the bulb above the base, and an inert gas disposed within the bulb.

Abstract: A light emitting device includes a substrate, a plurality of micro light emitting chips, a plurality of reflective structures and a plurality of conductive bumps. The substrate has a plurality of pads. The micro light emitting chips are disposed on the substrate in dispersion, and each of the micro light emitting chips includes a light emitting layer. The reflective structures are disposed around the micro light emitting chips in dispersion, and at least cover the micro light emitting layers of the light emitting chips. The conductive bumps are disposed corresponding to the micro light emitting chips and located between the micro light emitting chips and the substrate, wherein the micro light emitting chips are electrically connected to the pads of the substrate through the conductive bumps.

Abstract: Disclosed is a display device. The display device includes a light source; a wavelength conversion member converting a wavelength of light output from the light source; a display panel to which the light is incident; a heat transfer part adjacent to the light source and the wavelength conversion member; and a heat dissipation part connected to the heat transfer part.

Abstract: An LED lighting assembly includes a circuit board, a number of light emitting diodes (LEDs) overlying the circuit board, and optical element is proximate each LED and separate from other optical elements. Each optical element includes a first portion and a second portion that intersects with the first portion in a region between the first and second portions. The first and second portions are shaped so that at least one surface normal of the first portion intersects with at least one surface normal of the second portion, and the first and second portions are configured so that light from the associated LED exits the associated optical element through the first and the second portions. Each optical element also includes a third portion extending beyond the region between the first portion and the second portion in a direction away from the associated LED.

Abstract: A device and method may include, in a display device, emitting visible light in a humanly imperceptible manner and sensing said light to verify operation of the display device.

Abstract: A semiconductor light emitting device that achieves miniaturization and high brightness is provided. The semiconductor light emitting device has a light extraction surface (6) parallel to a lamination direction of a semiconductor layer (2). The semiconductor light emitting device includes a light guide member (3) placed on the semiconductor layer (2) and having a sloped surface (7) with a side surface opposite to the light extraction surface (6) sloped to the light extraction surface and a light-reflecting member (4) placed on a surface of the light guide member including at least the sloped surface of the light guide member.

Abstract: A lighting device comprising first, second and third groups of solid state light emitters, the first group emitting light having a dominant wavelength of 430 to 490 nm, the second group at 525 to 575 (in some devices 540 to 575 nm), the third group at 610 to 640 nm. In some devices, wavelength of light from emitters in first and second groups, and light from second and third groups, differs by at least 70 nm. Some devices emit light having CRI Ra of at least 70 when first, second and third groups of emitters are illuminated. Also, a lighting arrangement comprising first, second and third groups as above, in addition to a fourth emitter emitting light of dominant wavelength outside the ranges for the first, second and third groups, and not more than 10 nm different from a dominant wavelength of a color on an item to be illuminated.

Abstract: A vision system for a vehicle includes a color camera disposed at a vehicle and having an exterior rearward field of view. The color camera includes an imaging array of photosensing pixels and at least one color filter disposed at or in front of at least some of the photosensing pixels. An image processor is operable to process image data captured by the color camera. Processing of captured image data by the image processor includes utilization of a color correction algorithm that includes a color correction matrix. The color correction matrix algorithm may utilize a 3×3 color correction matrix. The color correction algorithm may include a color correction matrix algorithm and a histogram algorithm that function to determine a color correction for the captured image data.

Abstract: The invention provides a lighting unit comprising a source of blue light, a source of green light, a first source of red light comprising a first red luminescent material, configured to provide red light with a broad band spectral light distribution, and a second source of red light comprising a second red luminescent material, configured to provide red light with a spectral light distribution comprising one or more red emission lines. Especially, the first red luminescent material comprises (Mg,Ca,Sr)AlSiN3:Eu and/or (Ba,Sr,Ca)2Si5-xAlxOxN8-x:Eu, and the second red luminescent material comprises K2SiF6:Mn.

Abstract: A self cooling light effects device for use in a standard light bulb socket having a socket adaptor, surface embedded LEDs as means to generate light effects, means to control light effects, and means for cooling. Fiber optic cables provide further light effects. Means to control 5 light effects may include a logic board. Means for cooling may be any combination of fans, heat sinks, heat pipes, thermoelectric cooling, a heat conductive filler, and a heat conductive housing.

Abstract: The present disclosure relates to a method for manufacturing a LED package structure. First, a support plate including a top surface is provided. An annular groove is defined on the top surface and a protruding portion on the support plate is surrounded by the annular groove. Second, a reflecting layer is formed on surfaces and periphery portions of the annular groove. Then, a wiring pattern is formed on the top surface corresponding to the protruding portion. An insulting layer is formed in spaces of the wiring pattern and the annular groove. The support plate is removed and a receiving groove is formed by the insulting layer and the corresponding protruding portion. Finally, a LED chip is received in the receiving groove and bonded on the wiring pattern to obtain a LED package structure. A LED package structure made by the above method is also provided.

Abstract: A LED backlight module including a LED string and a driving apparatus is provided. The driving apparatus comprises a sensing resistor, an adjustable voltage-divider circuit, a comparator, a power converter and a control circuit. The sensing resistor is coupled between a cathode of the LED string and a ground potential and generates a feedback voltage. The adjustable voltage-divider circuit generates a reference voltage according to a dividing ratio which is controlled by a first signal set and a second signal set. The comparator compares the feedback voltage and the reference voltage, and generates a control signal accordingly. The power converter provides a DC voltage to an anode of the LED string according to the control signal. The control circuit counts a disable period of a dimming signal to generate the first signal set, and counts an enable period of the dimming signal to generate the second signal set.

Abstract: A lighting device has an array of light emitting diodes (LEDs), an adhesion layer having portions with photo-activated electrical conductivity over the LEDs, and electrically charged scattering particles adhered by electrostatic attraction to the adhesion layer portions, thereby forming scattering regions that are self-aligned to the light emitting diodes. A method for manufacturing the lighting device includes photo-activating the adhesion layer using light output from the light emitting diodes to locally vary the conductivity of the adhesion layer; and attaching electrically charged scattering particles to the adhesion layer by electrostatic attraction.

Abstract: A LED lamp includes an optically transmissive enclosure and a base connected to the enclosure. LEDs are mounted on a ribbon for emitting light when energized though an electrical path from the base. The mounting ribbon for the LEDs has a surface that is positioned adjacent an interior surface of the enclosure for transmitting heat from the plurality of LEDs to the enclosure.

Abstract: In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

Abstract: LED lamp (100) including a lens (206) and an LED (204). The lens (206) has a parabolic section (506) defined about axis (510) and a focus (514). The parabolic section (506) includes a surface traverse to the axis (510) and extending from the axis (510) to a periphery of the parabolic section (506) at a first end of the parabolic section (506). The parabolic section (506) includes a channel (512) extending along the axis (512) at least partially inside the parabolic section (506) at a second end of the parabolic section (506). The LED (204) is disposed in the channel (512) at the focus (514). First light rays are internally reflected in the lens (206) and collimated through the surface. Second light rays are transmitted through the lens (206) and the surface in parallel to the axis (510). Third light rays are refracted by the surface toward the axis (510).

Abstract: Embodiments relate to a lighting device that includes or retains a plurality of solid-state light emitters and is capable of providing one or more of omni-directional lighting and task lighting. Other embodiments relate to modular lighting systems for providing the same.

Abstract: Solid state lighting apparatuses and related methods are described. In certain embodiments, a solid state lighting apparatus adapted to operate with alternating current (AC) received from an AC power source is provided. The lighting apparatus can include a substrate and an array of solid state light emitters arranged on or supported by the substrate. Multiple solid state light emitter sets of the array can be arranged to be activated and/or deactivated at different times relative to one another during a portion of an AC cycle. The lighting apparatus can also include at least one reflective structure arranged between one or more solid state light emitters and at least one driver circuit component, to reduce or eliminate absorption by the driver circuit component(s) of light generated by the solid state light emitter(s).

Abstract: A semiconductor light emitting device that achieves miniaturization and high brightness is provided. The semiconductor light emitting device has a light extraction surface (6) parallel to a lamination direction of a semiconductor layer (2). The semiconductor light emitting device includes a light guide member (3) placed on the semiconductor layer (2) and having a sloped surface (7) with a side surface opposite to the light extraction surface (6) sloped to the light extraction surface and a light-reflecting member (4) placed on a surface of the light guide member including at least the sloped surface of the light guide member.

Abstract: A stacked assembly of light emitting devices includes a first light emitting device, a second light emitting device and a sealing member. The first light emitting device includes a first substrate member extending in a longitudinal direction and defining a plurality of through-holes, and a plurality of first light emitting elements arranged on the first substrate member. The second light emitting device is arranged to overlap with the first light emitting device. The second light emitting device includes a second substrate member extending in the longitudinal direction, and a plurality of second light emitting elements arranged on the second substrate and exposed respectively through the through-holes. The sealing member seals the first light emitting elements and the second light emitting elements.

Abstract: A light emitting diode (LED) device includes a substrate, a light emitting diode (LED) die mounted to the substrate configured to emit electromagnetic radiation, a lens covering the (LED) die, and a lens protective structure configured to protect the lens and a lens bonding layer from electromagnetic radiation emitted by the light emitting diode (LED) die and from reflected electromagnetic radiation within the lens. The lens protective structure can also be configured to reflect electromagnetic radiation increasing light extraction from the (LED) device. A method for fabricating the (LED) device includes the step of forming an opaque lens protective structure on the lens or on the lens bonding layer configured to protect the lens and the lens bonding layer from electromagnetic radiation emitted by the light emitting diode (LED) die and from reflected electromagnetic radiation within the lens.

Abstract: A method for correcting a magnification in image measurements is implemented using a computer device including one or more processors coupled to a user interface and one or more memory devices. The method includes acquiring a plurality of images of a target. Each image is acquired at a different distance from the target. The method also includes determining a distance between a lens used in acquiring the plurality of images and the target and determining a magnification of each acquired image. The method further includes determining a magnification correction with respect to a reference, determining a change in a size of the target, and outputting the determined change in a size of the target.

Abstract: A light emitting device includes a flexible substrate, at least one light emitting element, a sealing resin and an adhesion layer. The flexible substrate includes a flexible base member and a plurality of wiring portions disposed on one surface of the base member. The light emitting element is arranged on a first surface of the flexible substrate and electrically connected to the wiring portions. The sealing resin seals the light emitting element. The adhesion layer is arranged on a second surface of the flexible substrate different from the first surface of the flexible substrate. The adhesion layer has a small thickness portion corresponding at least to a region on the first surface where the at least one light emitting element is arranged. The small thickness portion of the adhesion layer has a thickness smaller than a thickness of regions of the adhesion layer other than the portion.