With Means For Cooling Or Heating (epo) Patents (Class 257/E33.075)
  • Patent number: 9041192
    Abstract: Flip chip packages are described that include two or more thermal interface materials (TIMs). A die is mounted to a substrate by solder bumps. A first TIM is applied to the die, and has a first thermal resistance. A second TIM is applied to the die and/or the substrate, and has a second thermal resistance that is greater than the first thermal resistance. An open end of a heat spreader lid is mounted to the substrate such that the die is positioned in an enclosure formed by the heat spreader lid and substrate. The first TIM and the second TIM are each in contact with an inner surface of the heat spreader lid. A ring-shaped stiffener may surround the die and be connected between the substrate and heat spreader lid by the second TIM.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: May 26, 2015
    Assignee: Broadcom Corporation
    Inventors: Seyed Mahdi Saeidi, Sam Ziqun Zhao
  • Patent number: 9035326
    Abstract: Disclosed is a light emitting module capable of representing improved heat radiation and improved light collection. there is provided a light emitting module. The light emitting module includes a metallic circuit board formed therein with a cavity, and a light emitting device package including a nitride insulating substrate attached in the cavity of the metallic circuit board, at least one pad part on the nitride insulating substrate, and at least one light emitting device attached on the pad part.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: May 19, 2015
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Yun Min Cho
  • Patent number: 9029878
    Abstract: A lighting device with front carrier, rear carrier and plurality of light-emitting diode chips, which when in operation emits light and releases waste heat, wherein rear carrier is covered at least in selected locations by front carrier, light-emitting diode chips are arranged between rear carrier and front carrier to form array, light-emitting diodes are contacted electrically by rear and/or front carrier and immobilized mechanically by rear carrier and front carrier, front carrier is coupled thermally conductively to light-emitting diode chips and includes light outcoupling face remote from light-emitting diode chips, which light outcoupling face releases some of waste heat released by light-emitting diode chips into surrounding environment, each light-emitting diode chip is actuated with electrical nominal power of 100 mW or less when lighting device is in operation and has light yield of 100 lm/W or more.
    Type: Grant
    Filed: January 17, 2011
    Date of Patent: May 12, 2015
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Matthias Sabathil, Norwin von Malm, Lutz Hoeppel, Stefan Illek, Bernd Barchmann, Patrick Rode
  • Patent number: 9024350
    Abstract: A light emitting module is disclosed. The light emitting module includes a lead frame body, lead frame, a heat spreader, an intermediate heat sink, and at least one light emitting element (LED). The lead frame body defines a cavity which accurately registers the heat spreader and includes optical or reflective walls surrounding the light emitting elements soldered on metallized traces of the heat spreader. The lead frame body encases and supports portions of the lead frame. The lead frame extends from outside the body into the cavity to accurately align with solder pads of the heat spreader. All the pre-aligned mechanical, thermal and electrical contacts are then soldered by solder reflow process under tight environmental control to prevent damage to the light emitting element. A robust, healthy 3-dimensional optical-electro-mechanical assembly having a very low thermal resistance in a thermal path from its light emitting element to its intermediate heatsink is created.
    Type: Grant
    Filed: February 2, 2011
    Date of Patent: May 5, 2015
    Inventor: Ban P Loh
  • Patent number: 9018648
    Abstract: The present invention relates to a package structure for light-emitting diodes (LEDs). The package structure includes a substrate, a heat-dissipating structure disposed on the substrate, and a plurality of LED chips uniformly disposed on the heat-dissipating structure. The heat-dissipating structure has a central portion and at least one peripheral portion surrounding thereof. The central portion is capable of dissipating more heat than the peripheral portion. Thus, the temperature difference between the LED chips disposed on the central portion and the LED chips disposed on the peripheral portion can be reduced.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: April 28, 2015
    Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corporation
    Inventors: Kuo-Ming Chiu, Tsung-Chi Lee, Chia-Hao Wu, Meng-Sung Chou
  • Patent number: 9006770
    Abstract: A light emitting diode (LED) carrier assembly includes an LED die mounted on a silicon submount, a middle layer that is thermally conductive and electrically isolating disposed below the silicon submount, and a printed circuit board (PCB) disposed below the middle layer. The middle layer is bonded with the silicon submount and the PCB.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: April 14, 2015
    Assignee: TSMC Solid State Lighting Ltd.
    Inventors: Wei-Yu Yeh, Pei-Wen Ko, Chih-Hsuan Sun, Hsueh-Hung Fu
  • Patent number: 9000473
    Abstract: Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.
    Type: Grant
    Filed: August 19, 2011
    Date of Patent: April 7, 2015
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Eun Sung Lee, Sang Soo Jee, Kun Mo Chu, Se Yun Kim, Kyu Hyoung Lee, Sang Mock Lee
  • Patent number: 9000474
    Abstract: There is provided a wiring substrate. The wiring substrate includes: a heat sink; a first insulating layer on the heat sink; a wiring pattern on the first insulating layer, wherein the wiring pattern is configured to mount a light emitting element thereon; and a second insulating layer on the first insulating layer such that the wiring pattern is exposed from the second insulating layer.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: April 7, 2015
    Assignee: Shinko Electric Industries Co. Ltd.
    Inventors: Shigetsugu Muramatsu, Hiroshi Shimizu, Kazutaka Kobayashi
  • Patent number: 8987756
    Abstract: An LED luminaire has a dye-sensitized solar cell for converting light emitted from a light source to electric energy and uses the converted electric energy. Since the dye-sensitized solar cell plays a role of a diffusion plate, the LED luminaire may diffuse light and convert wasted light into power. Further, since energy consumption and green-house gas generation decrease, it is possible to provide an environment-friendly LED luminaire. Moreover, if the power generated by the dye-sensitized solar cell is used for cooling the LED luminaire, it is possible to enhance heat dissipation efficiency of the LED luminaire.
    Type: Grant
    Filed: December 29, 2010
    Date of Patent: March 24, 2015
    Assignee: University-Industry Cooperation Group Of Kyung Hee University
    Inventors: Jeong-Tai Kim, Won-Woo Kim, Geun-Young Yun
  • Patent number: 8963190
    Abstract: A light-emitting device includes a substrate having a front surface on which a semiconductor light-emitting element is mounted. A front cover is provided which thermally contacts the front surface of the substrate at a periphery of the semiconductor light-emitting element and is disposed on a front side of the substrate. A heat conduction path is formed along which heat generated by the semiconductor light-emitting element is conducted in order of the substrate and the front cover and the heat is radiated from a front surface of the front cover, so that a heat radiation property from a front surface of the light-emitting device is improved.
    Type: Grant
    Filed: August 25, 2010
    Date of Patent: February 24, 2015
    Assignees: Toshiba Lighting & Technology Corporation, Kabushiki Kaisha Toshiba
    Inventors: Ryotaro Matsuda, Kozo Ogawa, Makoto Sakai, Akiko Takahashi, Keiichi Shimizu, Kiyoshi Nishimura
  • Patent number: 8952407
    Abstract: A light emitting device package may be provided that includes: a package body which includes a first cavity and a second cavity which are formed to be depressed in at least a portion of the package body; a first light emitting device and a second light emitting device, each of which is disposed in the first cavity and the second cavity respectively; and a first fluorescent substance and a second fluorescent substance, each of which is filled in the first cavity and the second cavity respectively.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: February 10, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventor: Won Jin Son
  • Patent number: 8946757
    Abstract: Heat spreading substrate with embedded interconnects. In an embodiment in accordance with the present invention, an apparatus includes a metal parallelepiped comprising a plurality of wires inside the metal parallelepiped. The plurality of wires have a different grain structure than the metal parallelepiped. The plurality of wires are electrically isolated from the metal parallelepiped. The plurality of wires may be electrically isolated from one another.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: February 3, 2015
    Assignee: Invensas Corporation
    Inventors: Ilyas Mohammed, Masud Beroz
  • Patent number: 8936954
    Abstract: A low-cost integrated reflector and heat spreader for high-density high power solid-state (e.g., LED) lighting arrays includes a base structure onto which is applied a sacrificial material. A relatively thick thermal spray coating is applied over the base structure and sacrificial material. The sacrificial material is removed. A channel(s) is thereby provided within the thermal spray coating layer and in physical contact with the base structure. The channel may be filled with a cooling fluid. A pulsating heat pipe heat spreader may thereby be provided. A reflective material may be provided either over another surface of the base structure or alternatively over the thermal spray coating layer to provide a surface for reflecting and directing light emitted from a solid state light source that may be secured to the integrated reflector and heat spreader.
    Type: Grant
    Filed: December 9, 2013
    Date of Patent: January 20, 2015
    Assignee: Palo Alto Research Center Incorporated
    Inventors: John S. Paschkewitz, Eric J. Shrader
  • Patent number: 8890196
    Abstract: A solid-state light source has light emitting diodes embedded in a thermally conductive translucent luminescent element. The thermally conductive translucent luminescent element has optically translucent thermal filler and at least one luminescent element in a matrix material. A leadframe is electrically connected to the light emitting diodes. The leadframe distributes heat from the light emitting diodes to the thermally conductive translucent luminescent element. The thermally conductive translucent luminescent element distributes heat from light emitting diodes and the thermally conductive translucent luminescent element.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: November 18, 2014
    Assignee: Goldeneye, Inc.
    Inventors: Scott M. Zimmerman, William R. Livesay, Richard L. Ross, Eduardo DeAnda
  • Patent number: 8883564
    Abstract: A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C—BN, silicon carbide, and alumina and have an average particle diameter of 10-100 ?m; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 ?m, a thermal conductivity at 25° C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150° C. of 4×106 to 7.5×10?6/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: November 11, 2014
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hideki Hirotsuru, Satoshi Higuma, Shinya Narita, Yoshihiko Tsujimura
  • Patent number: 8872195
    Abstract: A light emitting device package including a package body including a plurality of first ceramic layers, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, and a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, wherein the heat dissipation member is provided with an expanded portion at a region corresponding to a boundary of different first ceramic layers.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: October 28, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Byung Mok Kim, Bo Hee Kang, Ha Na Kim, Hiroshi Kodaira, Yuichiro Tanda, Satoshi Ozeki
  • Patent number: 8872330
    Abstract: A thin-film semiconductor component having a carrier layer and a layer stack which is arranged on the carrier layer, the layer stack containing a semiconductor material and being provided for emitting radiation, wherein a heat dissipating layer provided for cooling the semiconductor component is applied on the carrier layer. A component assembly is also disclosed.
    Type: Grant
    Filed: July 16, 2007
    Date of Patent: October 28, 2014
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Siegfried Herrmann, Berthold Hahn
  • Patent number: 8866183
    Abstract: An LED module includes: a package having electrodes provided on the outer surface of opposing sidewalls, and a light-emitting element connected to the electrodes and mounted on the package; a base member having a copper metal; an insulating layer stacked on the surface of the base member and having an insulating material; and a conductive wiring pattern connected to the electrodes by soldering and formed on the surface of the insulating layer. The insulating layer has a through-hole formed by removing a part of the section where the package is positioned, and a heat dissipation unit formed by soldering between the back surface of the package and the base member, which face one another with the through-hole interposed therebetween.
    Type: Grant
    Filed: September 26, 2011
    Date of Patent: October 21, 2014
    Assignee: Panasonic Industrial Devices Sunx Co., Ltd.
    Inventors: Sachio Higuchi, Takashi Tanaka, Mitunori Mizoguti, Tsuyoshi Inui, Atsuo Fukuda
  • Patent number: 8829556
    Abstract: A large area, flexible, OLED assembly has improved thermal management by providing a metal cathode of increased thickness of at least 500 nm. A thermal heat sink trace may be used as alternative or in conjunction with the increased thickness cathode where the trace leads from a central region of the OLED toward a perimeter region, or by other backsheet thermal management designs. External heat sinking, for example to a plate, fixture, etc. may be additionally used or in conjunction with the increased thickness cathode and/or backsheet design to provide further thermal management.
    Type: Grant
    Filed: September 1, 2011
    Date of Patent: September 9, 2014
    Assignee: General Electric Company
    Inventors: Deeder Aurongzeb, James Michael Kostka, Gary Robert Allen
  • Patent number: 8823036
    Abstract: There is provided a light emitting diode package having at least two heat sinks. The light emitting diode package includes a main body, at least two lead terminals fixed to the main body, and at least two heat sinks of electrically and thermally conductive materials, the heat sinks being fixed to the main body. The at least two heat sinks are separated from each other. Thus, high luminous power can be obtained mounting a plurality of light emitting diode dies in one LED package. Further, it is possible to embody polychromatic lights mounting LED dies emitting different wavelengths of light each other in the LED package.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: September 2, 2014
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Kwan Young Han, Kwang Il Park, Jae Ho Cho, Jung Hoo Seo, Seong Ryeol Ryu
  • Patent number: 8823035
    Abstract: Solid state light sources based on LEDs mounted on or within thermally conductive luminescent elements provide both convective and radiative cooling. Low cost self-cooling solid state light sources can integrate the electrical interconnect of the LEDs and other semiconductor devices. The thermally conductive luminescent element can completely or partially eliminate the need for any additional heatsinking means by efficiently transferring and spreading out the heat generated in LED and luminescent element itself over an area sufficiently large enough such that convective and radiative means can be used to cool the device.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: September 2, 2014
    Inventors: William R. Livesay, Scott M. Zimmerman, Richard L. Ross, Eduardo DeAnda
  • Patent number: 8816364
    Abstract: The present invention supplied a display apparatus using plastic substrate instead of glass substrate, which can solve such problems that the plastic substrate has a low heat conductivity and its heat release performance becomes bad so that it is difficult to obtain stable performance and reliability. In the display apparatus being formed by bonding semiconductor thin film element on a plastic substrate, a thin film metal layer is formed on surface of the semiconductor thin film element for promoting heat release.
    Type: Grant
    Filed: July 23, 2012
    Date of Patent: August 26, 2014
    Assignee: Oki Data Corporation
    Inventors: Takahito Suzuki, Tomohiko Sagimori, Hiroyuki Fujiwara, Tomoki Igari, Yusuke Nakai, Hironori Furuta, Mitsuhiko Ogihara
  • Patent number: 8796717
    Abstract: An LED package is provided. The LED package comprises a metal plate, circuit patterns, and an LED. The metal plate comprises grooves. The insulating layer is formed on the metal plate. The circuit patterns are formed on the insulating layer. The LED is electrically connected with the circuit pattern on the insulating layer.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: August 5, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventor: Kyung Ho Shin
  • Patent number: 8785961
    Abstract: Heat spreading substrate. In an embodiment in accordance with the present invention, an apparatus includes a first conductive layer, a first insulating layer disposed in contact with the first conductive layer and a thermally conductive layer disposed in contact with the first insulating layer, opposite the first conductive layer. The faces of the first conductive layer, the first insulating layer and the thermally conductive layer are substantially co-planar; and a sum of widths of faces of the first conductive layer, the first insulating layer and the thermally conductive layer is greater than a height of the faces. The first conductive layer and the first insulating layer may include rolled materials.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: July 22, 2014
    Assignee: Invensas Corporation
    Inventor: Gabriel Z. Guevara
  • Patent number: 8786074
    Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: July 22, 2014
    Assignee: TrueLight Corporation
    Inventors: Cheng Ju Wu, Hung-Che Chen, I Han Wu, Shang-Cheng Liu, Jin Shan Pan
  • Patent number: 8786073
    Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: July 22, 2014
    Assignee: TrueLight Corporation
    Inventors: Cheng Ju Wu, Hung-Che Chen, I Han Wu, Shang-Cheng Liu, Jin Shan Pan
  • Patent number: 8772813
    Abstract: Provided is an LED package. It is easy to control luminance according to the luminance and an angle applicable. Since heat is efficiently emitted, the LED package is easily applicable to a high luminance LED. The manufacturing process is convenient and the cost is reduced. The LED package includes a substrate, an electrode, an LED, and a heatsink hole. The electrode is formed on the substrate. The LED is mounted in a side of the substrate and is electrically connected to the electrode. The heatsink hole is formed to pass through the substrate, for emitting out heat generated from the LED.
    Type: Grant
    Filed: April 29, 2013
    Date of Patent: July 8, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventor: Wan Ho Kim
  • Patent number: 8759843
    Abstract: An optical/electrical transducer device has housing, formed of a thermally conductive section and an optically transmissive member. The section and member are connected together to form a seal for a vapor tight chamber. Pressure within the chamber configures a working fluid to absorb heat during operation of the device, to vaporize at a relatively hot location as it absorbs heat, to transfer heat to and condense at a relatively cold location, and to return as a liquid to the relatively hot location. The transducer device also includes a wicking structure mounted within the chamber to facilitate flow of condensed liquid of the working fluid from the cold location to the hot location. At least a portion of the wicking structure comprises semiconductor nanowires, configured as part of an optical/electrical transducer within the chamber for emitting light through and/or driven by light received via the transmissive member.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: June 24, 2014
    Assignee: ABL IP Holding LLC
    Inventors: David P. Ramer, Jack C. Rains, Jr.
  • Patent number: 8759869
    Abstract: A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: June 24, 2014
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Tae Won Seo, Zhbanov Alexander, Dae Won Kim
  • Patent number: 8754423
    Abstract: Embodiments provide a light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member inserted into the package body to thermally come into contact with the light emitting device, and a anti-fracture layer placed on the heat dissipation member. The anti-fracture layer vertically overlaps with at least a partial peripheral region of the heat dissipation member.
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: June 17, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Byung Mok Kim, Bo Hee Kang, Ha Na Kim, Hiroshi Kodaira, Yuichiro Tanda, Satoshi Ozeki
  • Patent number: 8754437
    Abstract: The invention relates to an LED module (1) comprising at least one light-emitting diode (LED) (3) and at least one heat sink (2) for active cooling, having at least one coolant channel (6) through which a cooling fluid flows. The dimensions of the at least one coolant channel (6) are selected so that a predominantly laminar flow of the fluid is set up in the at least one coolant channel (5) during operation of the LED module (1).
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: June 17, 2014
    Assignee: OSRAM Gesellschaft mit beschraenkter Haftung
    Inventors: Alexander Faller, Moritz Kaiser, Martin Reuter
  • Patent number: 8742563
    Abstract: A component and a method for producing a component are disclosed. The component comprises an integrated circuit, a housing body, a wiring device overlapping the integrated circuit and the housing body, and one or more external contact devices in communication with the wiring device.
    Type: Grant
    Filed: November 29, 2010
    Date of Patent: June 3, 2014
    Assignee: Intel Mobile Communications GmbH
    Inventors: Thorsten Meyer, Harry Hedler, Markus Brunnbauer
  • Patent number: 8741694
    Abstract: Embodiments of the present disclosure describe semiconductor device packaging techniques and devices that incorporate a heat spreader into the insulating material of a packaged semiconductor device. In one embodiment, a device comprising a semiconductor device is coupled to a substrate, and insulating material covers (i) a portion of the semiconductor device and (ii) a portion of the substrate. The device also comprises a heat spreader embedded in the insulating material and the heat spreader is isolated from the substrate at least in part by the insulating material.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: June 3, 2014
    Assignee: Marvell International Ltd.
    Inventors: Chender Chen, Chenglin Liu, Shiann-Ming Liou
  • Patent number: 8704262
    Abstract: A solid state light source with LEDs in thermal contact to thermally conductive translucent elements where light emitted from the LEDs is directed to emerge from the heat dissipating surfaces of the elements. The thermally conductive translucent elements are arranged or combined with a reflector to form a light recycling cavity. The outside surfaces of the thermally conductive translucent elements forming the cavity become luminescent as the light emitted by the LEDs on the inside of the cavity is continually reflected and recycled until a very high percentage of the light emitted by the LEDs is eventually transmitted through and emitted uniformly and omnidirectionally. Simultaneously, the heat from the LEDs conducts through and to the luminescent outside surfaces of the elements of the cavity, which radiatively and convectively cool the light source thereby eliminating the need for bulky appended heat sinks.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: April 22, 2014
    Assignee: Goldeneye, Inc.
    Inventors: William R. Livesay, Scott M. Zimmerman, Richard L. Ross, Eduardo DeAnda
  • Patent number: 8698180
    Abstract: An LED lighting assembly integrated with dielectric liquid lens, including: a heat dissipation substrate; an LED chip, located on the heat dissipation substrate; a transparent material, covering the heat dissipation substrate and the LED chip and having a curved surface; a transparent liquid, located above the transparent material; a transparent layer, located above the transparent liquid; a first dielectric liquid, located above the transparent layer; a second dielectric liquid, located above the first dielectric liquid and having a curved surface, wherein the second dielectric liquid has a second dielectric constant smaller than a first dielectric constant of the first dielectric liquid; a transparent electrode layer, located above the second dielectric liquid for applying a control voltage to generate a dielectric force on the second dielectric liquid; and an enclosing body.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: April 15, 2014
    Assignee: Lustrous Technology Ltd.
    Inventors: Jer-Liang Yeh, Chun-Wen Chen
  • Patent number: 8692265
    Abstract: A lighting device is provided. The lighting device comprises a first substrate and a plurality of second substrates. The plurality of second substrates are separately and electrically connected to the first substrate and comprise a light emitting device.
    Type: Grant
    Filed: July 10, 2012
    Date of Patent: April 8, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventor: Jun Seok Park
  • Patent number: 8659042
    Abstract: A low-cost integrated reflector and heat spreader for high-density high power solid-state (e.g., LED) lighting arrays includes a base structure onto which is applied a sacrificial material. A relatively thick thermal spray coating is applied over the base structure and sacrificial material. The sacrificial material is removed. A channel(s) is thereby provided within the thermal spray coating layer and in physical contact with the base structure. The channel may be filled with a cooling fluid. A pulsating heat pipe heat spreader may thereby be provided. A reflective material may be provided either over another surface of the base structure or alternatively over the thermal spray coating layer to provide a surface for reflecting and directing light emitted from a solid state light source that may be secured to the integrated reflector and heat spreader.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: February 25, 2014
    Assignee: Palo Alto Research Center Incorporated
    Inventors: John S. Paschkewitz, Eric Shrader
  • Patent number: 8659047
    Abstract: A light emitting device includes a substrate having an element mounting area in a principal surface thereof. The light emitting device also includes at least one light emitting element mounted in the element mounting area of the substrate. The light emitting device also includes a heat transfer member provided on the substrate. The heat transfer member has a thermal conductivity different from thermal conductivity of the substrate so as to form uneven thermal resistance distribution in the element mounting area. Thermal resistance in a heat radiation path through the substrate for release of heat emitted from the light emitting element changes with the mounting position of the light emitting element.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: February 25, 2014
    Assignee: Stanley Electric Co., Ltd.
    Inventor: Ryosuke Kondo
  • Patent number: 8648379
    Abstract: Provided is a light emitting diode (LED) lamp assembly having an increased light incidence angle by fixing unit LED lamps fixed on a substrate at various angles. The LED lamp assembly includes a substrate having a socket portion and an LED mounting portion, first unit LED modules installed on both surfaces of the substrate and irradiating light onto the both surfaces of the substrate in a frontward direction, and second unit LED modules irradiating light onto the both surface of the substrate in directions other than the frontward direction. In the LED lamp assembly, since first and second unit LED modules having light irradiation units formed at different positions are installed on both surfaces of a single substrate, light can be irradiated in a radial direction.
    Type: Grant
    Filed: February 6, 2013
    Date of Patent: February 11, 2014
    Assignee: Ledlitek Co., Ltd.
    Inventors: Eun Sung Kim, Hee Yong Choi, Hwang Ryong Kim
  • Patent number: 8648344
    Abstract: An organic light-emitting display device comprises: a lower substrate; an upper substrate facing the lower substrate; and a spacer formed in a sealed space between the lower substrate and the upper substrate and dividing the space into two or more sections; wherein air holes are formed in the spacer and allow air to flow between the sections of the space.
    Type: Grant
    Filed: August 12, 2011
    Date of Patent: February 11, 2014
    Assignee: Samsung Display Co., Ltd.
    Inventors: Kwang-Hae Kim, Sun Park, Chun-Gi You
  • Publication number: 20140034993
    Abstract: A semiconductor device according to an embodiment includes a heat dissipation member having a first upper surface, the first upper surface being provided with grooves formed on the first upper surface; a bonding member provided on the heat dissipation member and burying the grooves; and a wiring substrate provided on the bonding member, the wiring substrate having a second upper surface and a lower surface opposite to the second upper surface, the wiring substrate including a semiconductor unit and a bonding electrode, the semiconductor unit being provided on the second upper surface and including a light emitting layer, the bonding electrode being provided on the lower surface, the bonding electrode being bonded to the heat dissipation member via the bonding member.
    Type: Application
    Filed: September 13, 2012
    Publication date: February 6, 2014
    Applicant: Toshiba Lighting & Technology Corporation
    Inventor: Kazuo SHIMOKAWA
  • Patent number: 8633502
    Abstract: The invention of the present application provides a lighting apparatus that has superior waterproofing property, durability, impact resistance, and pressure resistance and that can be used in various places such as a construction site, a plastic greenhouse, a poultry house, water, or seawater. The invention of the present application provides a lighting apparatus in which electric wires are connected to a substrate 3 on which light-emitting diodes 31, 32, and 33 are mounted and synthetic resin material is used to closely cover the electric wires 52 and 53, the substrate 3, and the light-emitting diodes 31, 32, and 33 in an integrated manner.
    Type: Grant
    Filed: December 14, 2010
    Date of Patent: January 21, 2014
    Assignees: Suzuden Company, Limited, Suzuden Hanbai Company, Limited
    Inventor: Hiroaki Kawashima
  • Patent number: 8629476
    Abstract: A light-emitting apparatus package of the present invention includes (i) an electrically insulated ceramic substrate, (ii) a first concave section formed in the direction of thickness of the ceramic substrate so as to form a light exit aperture in a surface of the ceramic substrate, (iii) a second concave section formed within the first concave section in the further direction of thickness of the ceramic substrate so that one or more light-emitting devices are provided therein, (iv) a wiring pattern for supplying electricity, which is provided in the first concave section, and (v) a metalized layer having light-reflectivity, which is (a) provided between the light-emitting device and the surface of the second concave section of the substrate, and (b) electrically insulated from the wiring pattern.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: January 14, 2014
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Tsukasa Inoguchi
  • Patent number: 8618573
    Abstract: A layered substrate includes a first substrate including an upper surface, a lower surface, a peripheral surface between peripheral edges of the upper surface and the lower surface, and a cut portion cut into the peripheral surface and passing through the upper surface and the lower surface, and a second substrate including an upper surface, a lower surface, and a peripheral surface between peripheral edges of the upper surface and the lower surface, and the lower surface of the second substrate layered on the upper surface of the first substrate and closing the cut portion of the first substrate from above. The second substrate includes a heat conductor that is thermally connected to an element to be mounted on the upper surface of the second substrate, the heat conductor configured to thermally extend to the cut portion of the first substrate.
    Type: Grant
    Filed: August 13, 2012
    Date of Patent: December 31, 2013
    Assignees: Citizen Electronics Co., Ltd., Citizen Holdings Co., Ltd.
    Inventors: Miharu Sugiura, Junji Miyashita
  • Patent number: 8619825
    Abstract: A light-emitting device reliably supplying electric power to a light-emitting element on a supporting base and securing heat dissipation, and a method of manufacturing the light-emitting device are provided. A light-emitting device includes: a light-emitting element arranged on a first supporting base; a package covering the first supporting base and the light-emitting element therewith, and supporting the first supporting base; and a thermal conductive member having ends which are bonded to the light-emitting element and the package, respectively, so as to also have a wiring function.
    Type: Grant
    Filed: February 17, 2010
    Date of Patent: December 31, 2013
    Assignee: Sony Corporation
    Inventors: Hiroyuki Fukasawa, Hiroshi Nishida
  • Patent number: 8614456
    Abstract: An LED die (3) is arranged with an adhesive (4) on an LED PCB (6). The LED PCB (6) has on the side opposite to the LED die (3) rear side contacts (7). Through this a self-contained LED lamp is formed, which e.g. can be applied by means of SMT to a board (9) or introduced into a lamp socket. In accordance with the invention, the rear side contacts (7) cover at least the half area, preferably the entire area apart from necessary exceptions, of the LED PCB (6). Through this, the heat can be discharged with slight thermal resistance. Preferably a cooling body (11) is arranged on the rear side of the board (9). In this case it is expedient if the board (9) has through-contacts for increasing the thermal conductivity.
    Type: Grant
    Filed: June 9, 2004
    Date of Patent: December 24, 2013
    Assignee: Tridonic Optoelectronics GmbH
    Inventor: Günther Leising
  • Patent number: 8610136
    Abstract: A LED Chip-on-Board (COB) module comprises a plurality of LED die arranged on a substrate in one or more radially concentric rings about a center point such that each LED die is azimuthally offset from neighboring LED die. The module includes thermal conduction pads each having lateral dimensions at least as large as the combined lateral dimensions of the LED die attached to it and a total surface area at least five times larger than the total surface area of all the LED die attached to it. At the same time, the total light emission area of the module is no greater than four times larger than the combined total surface emission area of all the individual LED die disposed on the substrate. A variety of configurations are possible subject to these criteria, which permit good packing density for enhanced brightness while ensuring optimal heat transfer. A method of manufacturing the module is also provided.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: December 17, 2013
    Assignee: PhotonStar LED Limited
    Inventors: Majd Zoorob, Thomas David Matthew Lee
  • Patent number: 8598606
    Abstract: A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces. The first metal face includes an insulating layer and a conductive layer on the insulating layer. The conductive layer is patterned to provide first and second conductive traces that connect to a semiconductor light emitting device. The second metal face may include heat sink fins therein. A flexible film including an optical element, such as a lens, also may be provided, overlying the semiconductor light emitting device.
    Type: Grant
    Filed: January 30, 2009
    Date of Patent: December 3, 2013
    Assignee: Cree, Inc.
    Inventor: Gerald H. Negley
  • Patent number: 8598616
    Abstract: Disclosed are a light emitting device and a light unit using the same. The light emitting device includes a body, a light emitting diode installed in the body, a plurality of lead frames disposed in the body and electrically connected to the light emitting diode; and a heat dissipation member received in the body, thermally connected to the light emitting diode, and having a plurality of heat dissipation fins exposed from a lower surface of the body.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: December 3, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventor: Gun Kyo Lee
  • Patent number: 8598597
    Abstract: A semiconductor device includes: a semiconductor element; a wiring board including a connection terminal to be electrically connected to the semiconductor element; and a metal plate disposed between the semiconductor element and the wiring board; wherein the metal plate is provided with an opening for exposing the connection terminal to the semiconductor element.
    Type: Grant
    Filed: October 25, 2006
    Date of Patent: December 3, 2013
    Assignee: Sony Corporation
    Inventor: Kiyoshi Yamauchi