Abstract: The present invention relates to a waveguide-to-microstrip line transition package for superconducting film characterization. The package allows propagation and impedance properties thin-film microwave line superconductor to be characterized at millimeter wave frequencies as a function of frequency. The superconducting film's kinetic inductance can be varied by applying direct current along the ground plane via spring loaded probe. When implemented with a non-superconducting metal housing the present invention is highly suitable for measuring resonators with the quality factor, Q, ranges from 100 to 1×104. Through the use of a housing realized from an appropriate superconducting bulk material or coating the upper end of this range of applicability can be readily extended to >1×106.

Abstract: A thermal apparatus (1) which comprises at least one primary circuit (P1) in which a heat transfer primary fluid is moved, in a reciprocating movement, by a displacement device, and at least one heat exchange interface (I1,1, I1,2), of the primary fluid, in which a secondary fluid that unidirectionally in a secondary circuit (S1,1, S1,2). The apparatus is characterized in that the exchange interface (I1,1, I1,2) comprises at least one heat exchange zone (ZN, ZN+1, Z?N, Z?N+1) in which the primary fluid and the secondary fluid flow unidirectionally and countercurrent with respect to one another.

Abstract: A solar cell is discussed. The solar cell according to an embodiment includes a photoelectric conversion unit including a first conductive type region and a second conductive type region formed on the same side of the photoelectric conversion unit; and an electrode formed on the photoelectric conversion unit and including an adhesive layer formed on the photoelectric conversion unit and an electrode layer formed on the adhesive layer, wherein the adhesive layer has a coefficient of thermal expansion that is greater than a coefficient of thermal expansion of the photoelectric conversion unit and is less than a coefficient of thermal expansion of the electrode layer.

Abstract: A composite material part having a matrix made of ceramic, at least for the most part, is fabricated by a method including making a fiber preform from silicon carbide fibers containing less than 1 at % oxygen; depositing a boron nitride interphase on the fibers of the preform, deposition being performed by chemical vapor infiltration at a deposition rate of less than 0.3 ?m/h; performing heat treatment to stabilize the boron nitride of the interphase, after the interphase has been deposited, without prior exposure of the interphase to an oxidizing atmosphere and before depositing matrix layer on the interphase, the heat treatment being performed at a temperature higher than 1300° C. and not less than the maximum temperature to be encountered subsequently until the densification of the preform with the matrix has been completed; and thereafter, densifying the perform with a matrix that is made of ceramic, at least for the most part.

Abstract: An electrical cable raceway for an aircraft, the electrical cable raceway being formed at least in part from a ceramic material.

Abstract: Reinforced high temperature superconducting silver wire and materials, and methods of producing reinforced high temperature superconducting silver composite wire. More specifically reinforcement materials and assemblies for attaining much higher stress, bend and surface indent tolerances at practical conductor dimensions are described. The reinforced wire or methods can include a silver wire core and a layer of high strength reinforcing metal.

Abstract: A method including depositing a suspension of a colloid comprising an amount of nano-particles of a ceramic material on a substrate; and thermally treating the suspension to form a thin film. A method including depositing a plurality of nano-particles of a ceramic material to pre-determined locations across a surface of a substrate; and thermally treating the plurality of nano-particles to form a thin film. A system including a computing device comprising a microprocessor, the microprocessor coupled to a printed circuit board through a substrate, the substrate comprising at least one capacitor structure formed on a surface, the capacitor structure comprising a first electrode, a second electrode, and a ceramic material disposed between the first electrode and the second electrode, wherein the ceramic material comprises columnar grains.

Abstract: A method for producing a thin layer device such as a superconductive device excellent in mechanical strength and useful as a submillimeter band receiver is provided. The thin layer device is produced by forming a multilayer structure substance comprising an NbN/MgO/NbN-SIS junction on an MgO temporary substrate, then forming SiO2, as a substrate, on said multilayer structure substance, and subsequently removing the MgO temporary substrate by etching. A superconductive device (a thin layer device) produced by a method of the present invention has excellent performance and high mechanical strength, and therefore introduction to a waveguide for a submillimeter band is also easy.

Abstract: A method for forming improved superconducting composites having improved Jc values by assembling octagonal or curved octagonal elements which when assembled allow for formation of uniformly continuously spaced voids. The voids are then filled with a metal, alloy, intermetallic substance, or ceramic oxide. The assembly of the octagonal elements and the filling of the voids is performed in a metal can. Accordingly, the flexibility in design of the present invention allows control of the performance of the superconductor and is cost effective.

Abstract: An electronic assembly includes a first substrate and a second substrate. The first substrate includes a first surface having a first plurality of conductive traces formed on an electrically non-conductive layer. The second substrate includes a first surface having a second plurality of conductive traces formed thereon and a second surface having a third plurality of conductive traces formed thereon. A first electronic component is electrically coupled to one or more of the plurality of conductive traces on the first surface of the second substrate. At least one of a plurality of conductive interconnects is incorporated within each solder joint that electrically couples one or more of the conductive traces formed on the second surface of the second substrate to one or more of the conductive traces formed on the first substrate.