Abstract: A method includes forming a metal seed layer on a dielectric layer, and forming a patterned mask over the metal seed layer. An opening in the patterned mask is over a first portion of the dielectric layer, and the patterned mask overlaps a second portion of the dielectric layer. The method further includes plating a metal region in the opening, removing the patterned mask to expose portions of the metal seed layer, etching the exposed portions of the metal seed layer, performing a plasma treatment on a surface of the second portion of the dielectric layer, and performing an etching process on the surface of the second portion of the dielectric layer.

Abstract: Gas supply assemblies and reactors systems including the gas supply assemblies are disclosed. An exemplary gas supply assembly includes a vessel, a valve plate, a housing encasing the vessel and the valve plate, a gas feedthrough having a first end interior of the housing and a second end exterior of the housing, and one or more valves attached to the valve plate, wherein at least one valve is fluidly coupled to an interior of the vessel. The assemblies can further include a removable gas line having a first end coupled to the at least one valve and a second end coupled to the gas feedthrough. Additionally or alternatively, a gas supply assembly can include one or more valve plate leveling devices coupled to the valve plate.

Abstract: A unit verification method to be performed on a unit under test (UUT) comprises connecting a verification device to the UUT. The verification device applies a set of challenge signals to the UUT and then measures the responses of the UUT to the challenge signals. The responses of the UUT are based on the challenge signals and the physical properties of the UUT. A registration key is generated based on the measured responses and is stored. The registration key is unique to the UUT.

Abstract: A method includes forming a metal seed layer on a dielectric layer, and forming a patterned mask over the metal seed layer. An opening in the patterned mask is over a first portion of the dielectric layer, and the patterned mask overlaps a second portion of the dielectric layer. The method further includes plating a metal region in the opening, removing the patterned mask to expose portions of the metal seed layer, etching the exposed portions of the metal seed layer, performing a plasma treatment on a surface of the second portion of the dielectric layer, and performing an etching process on the surface of the second portion of the dielectric layer.

Abstract: In one exemplary embodiment, described herein are innovative techniques for reducing the attractive force between particles and a substrate surface to aid in the removal of particles from the substrate surface. More specifically, a multi-electrode chuck is utilized to assist in cleaning a substrate. The multi-electrode chuck is utilized to reduce the attractive forces between particles and the substrate and to move the loosened particles that are present on the substrate surface. The electrodes of the chuck are biased with alternating current (AC) voltages with a phase shift between the electrode bias waves. The resulting electric field wave on the substrate surface loosens the particles by polarizing the particles and moves the loosened particles across the substrate.

Abstract: A high volume system level testing of devices with POP structures such as POP memories includes a POP array that includes floating nests that can adjust in the XY direction in order to align individually with respective pads found on the DUTs. The floating nests also include a mechanically fixed PCB that is fixed to the nest and can either mate to a memory contactor array that can accept an unattached POP device such as a memory or can include an attached memory in order to accommodate different POP requirements. In a method, the POP array includes a number of floating nests with memory loaded are aligned and presented to their respective DUTs just prior to testing the combined DUT and POP memory assemblies.

Abstract: Microwave micro-strip or coplanar waveguide (CPW) transistor test fixtures have the top surface of the input and output blocks forming a convex shape, to allow the soft dielectric substrate to be stretched over the surface and establish secure and continuous ground contact with the block surface and eliminate spurious cavities and discontinuities.

Abstract: A work machine includes: a bed having a table positioned on the upper surface thereof; sidewalls positioned to the left and right of the bed and projecting to the rear of the rear surface of the bed; support members for each supporting the bed in relation to a floor surface by using two points on the sidewalls to the left and right of the bed, and using at least one other point; a vertically moving body for moving along a pair of left and right vertical guides positioned in the vertical direction down to the vicinity of the floor surface on the rear surface of the bed; and a vertical drive means for moving the vertically moving body as one of the abovementioned relative movements, and having a pair of left and right feed screws positioned in parallel with the vertical guides.

Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.

Abstract: A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.

Abstract: A boom mountable robotic arm for temporarily supporting an elongate conductor includes a rigid member such as a beam or beam assembly adapted for mounting onto the upper end of a boom for example using a boom adaptor, at least one electrically insulated support post mounted to the rigid member, where each post temporarily supports an elongate electrical conductor, and at least two rotation devices for selectively controllable rotation of the rigid member and the electrically insulated support posts about at least two corresponding axes of rotation.

Abstract: The present invention is directed towards a cable tie mount. The cable tie mount includes a body and a mount. The mount includes a top, a bottom, sides, and a channel therethrough. The body has a base member with a mounting hole and a receiving member with a locking hole. The receiving member extends at an angle from the base member. The mount is installed on the receiving member of the body such that the receiving member is positioned within the channel of the mount.

Abstract: A method of manufacturing an LED light bar comprises: providing a reflow oven and a clamping device mounted on a transmitting belt of the reflow oven, the reflow oven comprising a heating area and a cooling area; providing a semi-finished LED light bar comprising a printed circuit board and a plurality of LEDs arranged on the print circuit board with solder paste applied between the LEDs and the printed circuit board, and mounting the semi-finished LED light bar in the clamping device; and starting the reflow oven and thus the transmitting belt carrying the clamping device and the semi-finished LED light bar moving together to pass through the reflow oven, whereby the solder paste is firstly melted in the heating area and then solidified in the cooling area to fix the LEDs on the printed circuit board to form the LED light bar.

Abstract: A glass substrate-holding tool employed during the production of a reflective mask blank for EUV lithography includes an electrostatic chuck and a mechanical chuck. A caught and held portion of a glass substrate caught and held by the electrostatic chuck, and pressed portions of the glass substrate pressed by the mechanical chuck are located outside a quality-guaranteed region on each of a film deposition surface and a rear surface of the glass substrate. The sum of a catching and holding force applied to the glass substrate by the electrostatic chuck and a holding force applied to the glass substrate by the mechanical chuck is at least 200 kgf. A pressing force per unit area applied to the glass substrate by the mechanical chuck is at most 25 kgf/mm2.

Abstract: An electronic device holder includes a base with at least three adjustable-position retaining posts extending upwardly from the base to permit an electronic device to be secured at a position above the base by the retaining posts. A test lead restraint assembly may be used to capture and thereby stabilize a test lead extending from the electronic device during testing of the electronic device.

Abstract: A substrate processing system includes a processing unit, a substrate loading unit, a substrate unloading unit, and a carrying unit. A carrying device has a constitution in which a suction portion suctioning and holding a substrate is rotatable about an arm portion provided in a base portion and the substrate is rotated in the state where the substrate is held by a holding portion. A coating device has a constitution in which a liquid material is ejected from a nozzle to both surfaces of the substrate rotating in an upright state.

Abstract: A method is specified for the production of a flexible circuit configuration, which allows the manufacturing of such flexible circuits on a carrier film cost-effectively and with high precision. For this purpose, the carrier film is fastened at the beginning of the method on a rigid frame, which encloses an inner area, and spans the inner area using an inner surface. After finishing of a layer structure and optionally additional method steps, structures for flexible circuit configurations which are created over the inner surface may be cut out easily by cutting the flexible circuit configurations out of the inner surface as a cutout. Through the fastening of the carrier film on the frame, it is ensured during the various method steps of the production of the flexible circuit configuration that the carrier film, which is flexible per se, always forms a level foundation for the various method measures, in particular the photolithographic structuring of layers of a layer structure.

Abstract: The purpose of the invention is to provide a mounting apparatus that can mount a part such as a chip, etc. on a substrate effectively and precisely. A wafer is placed on the upper surface of turntable, which has opening section, and a backup section and a head section that hold a chip are lifted up and lowered respectively, at opening section. The wafer and the chip are contacted, pinched and held locally, and then they are heat-bonded. After that, the backup section and the head section are removed. Lift arms equipped on a holding table are inserted between the wafer and turntable, the wafer is lifted up, and opening section is moved relative to the wafer when turntable is rotated. The wafer is placed on turntable again and the bonding process is performed.

Abstract: A test support apparatus includes a base, a support bracket, a first positioning member mounted to the support bracket; and a positioning arm. The support bracket is pivotally mounted to the base and keeps an angle relative to the base. The support bracket supports a product. The positioning arm defines an elongated positioning slot. The positioning arm is mounted to the base. The first positioning member is positioned in different positions of the elongated positioning slot to change the angle.

Abstract: Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations such as solvent and plasma cleaning. In an example situation, a wafer that has been separated from a support plate can be cleaned. The wafer still needs to be handled carefully during such a cleaning operation. Various devices and methodologies that facilitate efficient handling of wafers and wafer-cleaning operations are disclosed.

Abstract: A susceptor support portion of the present invention includes a susceptor shaft and a substrate lift portion. The susceptor shaft includes a support column and a plurality of arms that extend radially from the support column, the substrate lift portion includes a support column and a plurality of arms that extend radially from the support column, the arm of the susceptor shaft includes a first arm, a second arm coupled to the first arm, and a third arm coupled to the second arm, from the support column side of the susceptor shaft, the second arm being provided with a through hole which passes through the second arm in a vertical direction, and a width of the first arm of the susceptor shaft is smaller than a width of the second arm of the susceptor shaft.

Abstract: An apparatus is provided for protecting a surface of interest from particle contamination, and particularly, during transitioning of the surface between atmospheric pressure and vacuum. The apparatus includes a chamber configured to receive the surface, and a protector plate configured to reside within the chamber with the surface, and inhibit particle contamination of the surface. A support mechanism is also provided suspending the protector plate away from an inner surface of the chamber. The support mechanism holds the protector plate within the chamber in spaced, opposing relation to the surface to provide a gap between the protector plate and the surface which presents a diffusion barrier to particle migration into the gap and onto the surface, thereby inhibiting particle contamination of the surface.

Abstract: A hardware retention mechanism comprising a frame including a first guide shoulder and a pivot point; an actuator arm including a first guide post; and a first shape memory alloy wire strung between the first guide shoulder and the first guide post that rotates the actuator arm between a locked position and an unlocked position. The actuator arm is rotatable around the pivot point between a locked position and an unlocked position. In some embodiments, the frame may further comprise a second guide shoulder, the actuator arm may further comprise a second guide post, and a second shape memory alloy wire may be strung between the second guide shoulder and the second guide post that rotates the actuator arm between an unlocked position and a locked position.

Abstract: A system and a method for protecting semiconductor wafers is disclosed. A preferred embodiment comprises a carrier with a central region and an exterior region. The exterior region preferably has a thickness that is greater than the central region, to form a cavity in the carrier. An adhesive is preferably placed into the cavity, and a semiconductor wafer is placed onto the adhesive. The edges of the semiconductor wafer are protected by the raised exterior region as well as the displaced adhesive that at least partially fills the area between the semiconductor wafer and the exterior region of the carrier.

Abstract: An apparatus for fixing an optical fiber hole insert in coordinate measurement, is provided. The apparatus includes a main body and a cover plate. The main body includes a front side surface, a back side surface and a support surface, a plurality of first grooves formed in the support surface and exposed at the front side surface, a plurality of second grooves formed in the support surface and exposed at the back side surface, and a through hole defined in the support surface. The first grooves is aligned with the respective second grooves, the first and second grooves communicate with the through hole and are configured for cooperatively receiving the optical fiber hole insert. The cover plate is configured for covering the support surface and coming into contact with the optical fiber hole insert. A method for measuring the optical fiber hole insert using the apparatus is also provided.

Abstract: A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.

Abstract: A device for centering circular wafers includes a support chuck for supporting a circular wafer to be centered upon its top surface, left, right and middle centering linkage rods and a cam plate synchronizing the rectilinear motion of the left, right and middle centering linkage rods. The left centering linkage rod includes a first rotating arm at a first end and rectilinear motion of the left centering linkage rod translates into rotational motion of the first rotating arm. The right centering linkage rod comprises a second rotating arm at a first end, and rectilinear motion of the right centering linkage rod translates into rotational motion of the second rotating arm. The first and second rotating arms are rotatable around an axis perpendicular to the top surface of the support chuck and comprise a curved edge surface configured to roll against the curved edge of the circular wafer. The middle centering linkage rod includes a third alignment arm at a first end.

Abstract: A media carrier, adapted to hold a plurality of pieces of magnetic media, is disclosed. This media carrier can be placed on the workpiece support, or platen, allowing the magnetic media to be processed. In some embodiments, the media carrier is designed such that only one side of the magnetic media is exposed, requiring a robot or other equipment to invert each piece of media in the carrier to process the second side. In other embodiments, the media carrier is designed such that both sides of the magnetic media are exposed. In this scenario, the media carrier is inverted on the platen to allow processing of the second side.

Abstract: Methods and apparatuses are disclosed for rinsing the interface area of a liquid and air boundary after a substrate cleaning process using gas barrier. In some embodiments, a protective chuck having an inner gas ring and an outer liquid ring can be used to clean the area under the edge of the protective chuck. A gas flowing outward from the gas ring can enable a liquid to flow outward from the liquid ring, rinsing the outer portion of the protective chuck. The interface rinsing process can enable combinatorial processing of a substrate, providing multiple isolated processing regions on a single substrate with different material and processing conditions.

Abstract: A boom mountable robotic arm for includes a beam pivotally mounted on a boom mounting adaptor, at least two electrically insulated support posts mounted to and spaced apart along the beam, and at least a first rotation coupling and a plurality of second rotation couplings. The first rotation coupling provides pivotal mounting of the beam on the boom mounting adaptor so as to provide selectively controllable rotation of the beam in a substantially vertical plane. The second rotation couplings provide selectively controllable rotation of the electrically insulated support posts about corresponding second axes of rotation between a retracted position substantially laid flush along the beam and a pick-up position ready to receive a conductor being supported. An actuated scissor linkage is mounted to the beam and the boom mounting adaptor for selectively adjusting an angular position of the beam relative to the boom mounting adaptor.

Abstract: Disclosed is a gripper for use with a disk clamp end effecter in a disk drive manufacturing process used for mounting a disk clamp to a disk in the manufacturing of a disk drive. The gripper comprises: a disk gripper housing, a lip seal gripper mounted to the disk gripper housing, and a vacuum channel. The lip seal gripper includes an upper portion that fits into the disk gripper housing and a lower portion that has a surface. The surface is configured to extend around the disk clamp to press against the disk clamp. The vacuum channel extends from the upper portion of the lip seal gripper to the lower portion of the lip seal gripper to provide a vacuum to the lip seal gripper such that the surface of the lip seal gripper is gripped by the vacuum to the surface of the disk clamp around the disk clamp.

Abstract: A method and apparatus for depositing a phosphor using transfer molding. The method includes: forming a plurality of light-emitting devices on a wafer and rearranging the light-emitting devices on a carrier substrate according to luminance characteristics of the plurality of light-emitting devices by examining the luminance characteristics of the plurality of light-emitting devices; depositing the phosphor on the rearranged light-emitting devices using transfer molding; and separating the light-emitting devices on the carrier substrate.

Abstract: A main shaft drive includes a supply groove that opens to a friction surface, that extends so as to surround a main shaft within a contact range where the friction surface and a pressing surface oppose each other, and that includes an intersecting groove and a discharge opening. The intersecting groove extends in a direction of intersection with a circumference in which a rotational center of the main shaft is a center. The discharge opening is connected to a location that is outside the contact range. By opening a nozzle hole, used for supplying lubricant, towards the supply groove, as the main shaft rotates, four intersecting grooves move relative to the contact range, so that the lubricant is supplied to the four moved intersecting grooves. Therefore, the lubricant easily reaches a location within the contact range where the friction surface and the pressing surface oppose each other.

Abstract: A production system for manufacturing a workpiece comprises an index system including a plurality of index devices removably mounted on the workpiece at known longitudinally spaced locations therealong, and a longitudinally extending index member releasably engaged with at least two of the index devices such that a position and orientation of the index member are fixed relative to the workpiece by the index devices, the index member having position-indicating features distributed therealong. The production system further comprises a machine module mounted for longitudinal movement along the index member and operable to perform an operation, the machine module being operable to detect the position-indicating features on the index member and thereby determine a position of the machine module relative to the workpiece.

Abstract: A device for holding wafer-shaped articles, such as semiconductor wafers, is equipped with a series of pins that are brought into contact with a peripheral edge of the wafer-shaped article, under control of a common gear ring or a series of conjointly operated gear sectors. In the regions of the gear ring or gear sectors engaging the pin assemblies, those elements are designed to yield more readily than other regions of the gear ring or gear sectors, to accommodate differential thermal expansion of the chuck components in the vicinity of the pin assemblies.

Abstract: A flexure assembly comprising a flexure stack comprising a plurality of individual webs connected together with a force in an x-direction to produce a friction in a z-direction orthogonal to the x-direction between the plurality of webs, the friction holding the plurality of webs in engagement. In some embodiments, the flexure assembly includes a second flexure stack fixedly spaced from the first stack comprising a second plurality of individual webs connected together with a second force in the x-direction to produce a second friction in the z-direction between the second plurality of webs. The flexure assembly may be used, for example, for supporting a workpiece such as a slider row bar in a lapping machine.

Abstract: Provided is an apparatus for guiding and aligning a semiconductor chip package. The apparatus may include an insert, a plate above the insert, and an adapter. The insert may be configured to house various sizes of semiconductor chip packages. The plate may be configured to move vertically with respect to the insert. The adapter may be coupled to the plate and may be configured to guide at least one semiconductor chip package into the insert and to perform alignment of the at least one semiconductor chip package. In accordance with example embodiments, the at least one semiconductor chip package may have a size corresponding to at least one of the various sizes.

Abstract: Improved durability and longevity of spin chucks is achieved by using a composite support pin structure in which a pin body of a chemically inert plastic includes a hollow cavity containing an insert formed from a material whose Young's modulus is greater than that of the inert plastic.

Abstract: A device for providing support to an LCD and its corresponding components during various manufacturing steps. A first carrier section is positioned on a work surface and is then loaded with an LCD as well as drivers to be bonded to the tabs of the LCD. Once the desired work has been performed a second carrier section is mated with the first carrier section and a closing means is utilized to position the two carrier sections in a closed position. Once the two carrier sections have been placed in a closed position about the LCD and other components, the entire piece may be safely removed from its position on the work surface for further processing, storage, etc. Exemplary embodiments also relate to a method of providing support to an LCD and its corresponding components during various manufacturing steps.

Abstract: A sputtering bracket includes a curved plate body, a plurality of frames, and a plurality of fastening members. The body defines a plurality of through holes and has an inner concave side. The frames are pivotally connected with the curved plate body and received in the respective through holes. Each frame is rotatable relative to the curved plate body such that either one of opposite sides thereof can be exposed at the inner concave side. The fastening members are mounted on the curved plate body body, and are spring-loaded for resilient engagement with the respective frames.

Abstract: A substrate carrier for performing a deposition process comprises a supporting element and a cover element. The supporting element having a through hole is used to carry a substrate. The cover element is removably engaged with the supporting element, so as to secure the substrate therebetween and expose a deposition surface of the substrate from the through hole.

Abstract: A substrate support device including a support member having a lower-surface support section to support a lower surface of a substrate; and a position restriction section provided on the lower-surface support section, the position restriction section being formed to surround a periphery of the substrate supported on the lower-surface support section and restrict a position of the substrate. At least one of the lower-surface support section and the position restriction section includes a base material and a protective film formed to cover the base material and prevent at least one of wear and chemical erosion to which the base material will be subject. The substrate support device further includes, for example, a base that supports the support member, and a driving structure that moves the support member in a relative fashion with respect to the base, and is constructed as a substrate transport device.

Abstract: A system for fluidic coupling and uncoupling of fluidic conduits and a microfluidic chip, wherein the fluidic conduits are connected mechanically to a first structural part and the microfluidic chip is carried by a second structural part. The structural parts are moved perpendicularly toward and away from each other by means of a mechanism provided for this purpose. Outer ends of the fluidic conduits can thus be moved over a determined distance substantially perpendicularly to the outer surface of the microfluidic chip and connecting openings in the outer surface of the microfluidic chip. This enables accurate realization of fluidic coupling and uncoupling without the occurrence of undesirable moments of force and with minimal risk of damage to the fluidic conduits or the connecting openings. With such system requirements which can be set in respect of convenience, speed, temperature resistance, sealing, chemical resistance, reproducibility and so forth, can be fulfilled.

Abstract: Embodiments of the present invention include a substrate holder apparatus comprising a plate configured with an opening designed to receive a substrate; and a plurality of gripper assemblies disposed around the opening and configured to hold the substrate at a predetermined position within the opening such that the substrate is substantially coplanar with respect to a surface of the plate, at least one of the gripper assemblies comprising: a support element configured to grip an outside edge of the substrate, the support element mounted to a mount assembly configured to be attached to the substrate holder apparatus such that the support element holds the substrate at the predetermined position with respect to the plate.

Abstract: A substrate holder and method for using it to move a substrate. The holder comprises a frame having an inner periphery defining a first opening for receiving the substrate, and a shoulder projecting laterally inward from the inner periphery of the frame for supporting the substrate in the first frame opening. The shoulder has an inner periphery defining a second opening smaller than the first opening for receiving a substrate support. The holder and a substrate therein is moved to a position above the substrate support and then lowered to a position in which the shoulder of the holder is positioned below a top surface of the substrate support and the substrate is deposited on the top surface of the substrate support.

Abstract: A bench for the support and manufacturing of parts with complex geometry includes a support base on which one or more mobile units of support/manufacturing move. The mobile units of support/manufacturing can move and relocate independently from other ones on the surface of the support base. The mobile units of support/manufacturing include at least two adhesion feet configured to connect to anchoring elements distributed on the surface of the support base. The anchoring points are distributed on the surface of the support base with a predefined distribution according to a geometry, such that the distance between any anchoring point, and the corresponding anchoring element, from any other said anchoring point, and the corresponding anchoring organ, in the immediate vicinity of the anchoring point and the corresponding anchoring organ, is constant and equal to the radius of a predefined circle.

Abstract: Provided is a substrate suction apparatus which has a vacuum suction mechanism and an electrostatic attraction mechanism, and improves planarity of a subject to be processed by improving uniformity in vacuum suction power. A method for manufacturing such substrate suction apparatus is also provided. A substrate suction apparatus (1) is provided with a base board (2), a dielectric body (3), an electrostatic attraction mechanism (4) and a vacuum suction mechanism (5). Specifically, the dielectric body (3) is composed of a downmost dielectric layer (31), an intermediate dielectric layer (32) and a topmost dielectric layer (33). The electrostatic attraction mechanism (4) is composed of attraction electrodes (41, 42) and a direct current power supply. The vacuum suction mechanism (5) is composed of a groove (51), a suction channel (52), a porous dielectric body (3) and the porous attraction electrodes (41, 42).

Abstract: In a first aspect, a method of manufacturing a substrate is provided wherein an end effector mounted substrate is attempted to be placed, that is put, onto a substrate support, such as a pedestal or slotted support of a substrate carrier, and the effectiveness of the put is verified by a sensor associated with the end effector. In one embodiment, the verification takes place during the retraction motion of the end effector and is accomplished by sensing the presence, absence, or location of the substrate on the substrate support. The sensor may be a through beam sensor, and may be mounted on, coupled to or otherwise move with the end effector adapted to carry the substrate. Numerous other aspects are described.

Abstract: A holding/turning device for touch-sensitive flat objects, in particular wafers, with a distance positioning device which is arranged for holding the object perpendicular to the object plane at a defined distance, a lateral positioning device, arranged for positioning the object in the object plane and for rotating together with the object about a rotational axis perpendicular to the object plane, and with a rotational drive, coupled with the lateral positioning device, providing a driving force for rotating the object about the rotational axis, wherein the driving force can be applied to the object by the lateral positioning device. The distance positioning device is adapted for holding the object without involving contact, and is decoupled from the rotational drive in such a way that the distance positioning device does not rotate together with the object.

Abstract: An apparatus for supporting a semiconductor workpiece includes a heating system configured to cause thermally-induced motion of the semiconductor workpiece by heating a surface of the workpiece relative to a bulk of the workpiece. The thermally-induced motion includes vertical motion of an outer edge region of the workpiece and a center of the workpiece relative to each other. The apparatus further includes a support system configured to allow the thermally-induced motion including the vertical motion of the outer edge region of the workpiece and the center of the workpiece relative to each other while supporting the workpiece.