Abstract: A conduit clamping device has an elongated substantially rigid base having a longitudinal axis. At least one axially extending elongated generally U-shaped channel is formed in the base and sized to receive at least a portion of a length of conduit of a given diameter. A lid is hingedly coupled to the base and relatively hingedly movable between an open position for permitting conduit to be placed in or removed from the channel and a closed position for grippingly engaging the conduit between the lid and the channel. A quantity of resilient material is mounted to at least one of the lid and the channel for resiliently, grippingly engaging the conduit when the lid is in the closed position.

Abstract: A system for splicing together heavy duty electric cables, especially underground cables, consisting of a static friction block and a clamping friction block located on ends of cables to be spliced. A block and tackle mechanism is interposed between the friction block and the clamping block to provide a force to move various elements on the cables to various and final predetermined locations to make up the splice. The block and tackle mechanism has a wind-up spool thereon to wind-up ends of cords of the block and tackle mechanism. The wind-up spool provides the necessary force to accomplish the move of the various elements.

Abstract: An aligning apparatus includes a loading plate to load at least one alignment object; first and second alignment bars to align the at least one alignment object loaded on the loading plate, wherein the first and second alignment bars are bent by a force greater than a threshold value when contacting the alignment object; and at least one driving unit to drive the first and second alignment bars in close and open directions toward and away from each other.

Abstract: A stage apparatus may include a first stage, a second stage movable with respect to the first stage, at least one flexure hinge to connect the first stage with the second stage, a plurality of actuators provided between the first stage and the second stage to push the first stage and the second stage and to be symmetric with respect to a center of the first stage and the second stage, and a controller to control the plurality of actuators to move one of the first stage and the second stage with respect to the other one of the first stage and the second stage. Thus, a position error of the stage can be reduced, which enables an ultra precision position control. Further, a piezoelectric driver using piezoelectric elements may be used as the actuator to decrease the position error more than a conventional driver such as a motor. The position error may be decreased to ±10 nm.

Abstract: The present invention provides a holder (20) for wafers (14) which makes it possible to more easily manipulate the wafer (14) and makes it more suitable than prior art devices for to liquid handling, wafer handling and on-wafer manipulation of substances, while it also makes it possible to align the wafer (14) accurately and furthermore allows to create a well controlled ambient in the neighbourhood of the wafer (14).

Abstract: There is provided a vertical heat treatment system capable of simplifying the structure of various mechanisms in the vicinity of an opening which is formed in a partition wall separating a housing-box transfer area from a treating-object transfer area (a wafer transfer area), and of contributing to space saving, when an object to be treated is carried in the vertical heat treatment system through the opening to carry out a predetermined treatment.

Abstract: A plurality of flexible printed circuit boards are held on a transfer carrier, which is formed by a base plate and a resin layer formed on an upper surface of the base plate. Reference pins are positioned at reference pin openings of the carrier base plate and reference holes of the flexible printed circuit boards are positioned at the reference pins in order to adhere the board to the carrier resin layer. Electronic parts are mounted on the flexible printed circuit board by bonding the electronic parts to bonding portions of the flexible printed circuit board.

Abstract: In a substrate holder for holding a circuit board onto which a viscous material for bonding electronic components is printed by use of a squeegee through a screen mask, a first holding area for holding the screen mask and a second holding area for holding the circuit board are provided on a base surface. The squeegee is supported by at least one of the first holding area and the second holding area. The squeegee is abutted against the circuit board being held to the second holding area, via the screen mask placed on the circuit board.

Abstract: Jig for adjusting curvature of a substrate permits to measure an amount of sag of the substrate coming from variation of a length of the slot or the support bar by varying the length of the slot or the support bar, thereby permitting easy fabrication of the cassette according to a trend of fabricating thinner substrate.

Abstract: A method of making a microelectronic assembly buying restraining a substrate in a fixture at room temperature, placing a flip chip on the substrate so that conductive bumps on the flip chip are aligned with contact pads on the substrate, heating the flip chip, the substrate and the fixture to reflow the conductive bumps on the flip chip, cooling the flip chip, substrate and fixture to solidify the conductive bumps and to mount the flip chip to the substrate, depositing an underfill between the flip chip and the substrate, curing the underfill by heating the flip chip, substrate, underfill and fixture to an elevated temperature, and removing the flip chip mounted substrate from the fixture.

Abstract: A printed circuit board support including a first member having a planar upper surface for supporting a printed circuit board. At least one second member is movably coupled to a first side of the first member and movable toward and away from the side of the movable member, and a bias source biases the second member in a direction away from the first member.

Abstract: An electrostatic chuck for preventing warpage of a ceramic layer and cooling gas leakage while providing enhanced electrostatic attraction and an improved detachment performance and its manufacturing method is disclosed. The chuck comprises at least one electrode (90, 91, 92) located in the middle of the ceramic layer (80) in its thickness direction, a cooling gas channel (81) is formed on a surface of the ceramic layer within an outer edge of the electrode and above the electrode, wherein the electrode extends beyond the cooling gas channel. Preferably the electrodes are shaped in the form of two interlocked structures comprising multiple interconnected C-shaped ring portion (91c, 92c).

Abstract: A process and system for mounting terminals with electric wires in cavities of connector housings. Press-connecting terminals are initially loaded in cavities arranged in an upper surface of a connector jig and electric wires are press-connected on the terminals in the jigs. Then, the terminals with electric wires are transferred from the connector jig to cavities arranged in a lower surface of a inserting jig by pins arranged to contact and push the terminals from below in the transfer direction. Then, the terminals are loaded from the inserting jig to cavities of connector housings from the back by blades arranged to contact and push the terminals from one end in the inserting directing.

Abstract: A carrier of circuit boards includes a base frame having a plurality of first card guides disposed on its upper surface, the first card guides for securing respective first side edges of a corresponding plurality of circuit boards, a plurality of second card guides for securing respective second side edges of the plurality of circuit boards, and a plurality of adjustment members, each being for individually adjusting a distance between a respective pair of one first card guide and one second card guide. A method of preparing a carrying arrangement for a plurality of circuit boards includes providing a carrier for the plurality of circuit boards. Groups of circuit boards having different vertical on-edge dimensions may be interconnected and/or tested by being placed together and individually snugly held on a single carrier shelf.

Abstract: A template for preparing a wiring harness allows for quick and accurate preparation of the harness for subsequent installation within a vehicle. The template has a base member with one or more stations attached thereto, the stations having channels and some discontinuities located on the side walls that form the channels. The harness is assembled within the channels and individual wire runs protrude through a particular discontinuity.

Abstract: A support slug (2) used for the heat treatment of a part (3), particularly for the hardening of a steel part, comprises a guide element (221) that is used to guide the part (3) towards a supporting surface (230) of the support slug (2) when said part is being positioned on the support slug. A ceramic element (23) including the supporting surface (230) is embedded in the metal body (20) of the support slug.

Abstract: A cathode-ray tube (CRT) holding device holds a CRT from the rear side by a rib section having a shape similar to that of a funnel of the CRT and extending in plural directions. The rib section has a section having shaped in a recessed groove, and a degaussing coil is disposed in the groove. The CRT holding device has a low cost and a raised recycling rate. Without increasing the number of parts, the degaussing coil can be mounted.

Abstract: A frame jig for a connector is provided in order to be able to easily confirm the kinds of electric wires to be inserted in a connector and the installation locations. The frame jig for a connector includes a holder having a recess and apertures adjacent every location that confronts a respective cavity of the connector retained in the recess. Additionally, at the peripheral rim of the recess at the upper face of the holder, side recesses are provided on the side faces of the holder. First ends of sample electric wires are inserted in the apertures which confront the installation cavities of the corresponding kinds of electric wires to be installed in the connector. The other end of the sample wires inserted into recesses formed in sides of the holder, and locking members are inserted into the side recesses.

Abstract: A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).

Abstract: A quartz carrier having spaced, parallel grooved rods for holding a batch of semi-conductor wafers edgewise in upstanding, spaced, parallel relation is formed with a pair of flat end plates supporting the ends of the rods. The ends of the end plates extend laterally outwardly of the rods and support a pair of inverted “U”-shaped carrier support members extending along the length of the carrier. A tool having an carrier engaging rod mounted to a handle allows the user to insert the carrier engaging rod into one of the carrier support members to support the weight of the carrier. A rod mounted to the handle extends beyond the length of the wafer supporting grooved rods and engages the ends of the end plates to limit the rotation of the carrier about the carrier support member, enabling the user to raise and manipulate the carrier by means of the handle.

Abstract: A dual semiconductor wafer slippage, or loss, and water-resistant sensor holder for chemical mechanical polishing (CMP) semiconductor fabrication equipment is disclosed. The holder has a body and a cover. The body is designed to hold two wafer slippage sensors at an angle to a vertical plane, such as substantially fifteen degrees, and has a window to allow the sensors to detect wafer slippage. The cover is situated over the window of the body to prevent slurry from spraying and drying onto the sensors during high-pressure rinse cleaning of a platen of the CMP semiconductor fabrication equipment.

Abstract: The present invention relates to an apparatus that proactively ensures alignment (parallelism) of the connectors on the circuit board during the solder assembly of the connectors to the circuit board. The apparatus includes an alignment fixture that has been specifically designed to ensure parallelism of straddle-mounted connectors during the solder reflow assembly process. The fixture has connector slots and a circuit board slot. The slots help to detect whether the connectors meet the X- and Y-axis alignment requirements after the insertion process (after the connectors have been placed onto the circuit board). That is, if the X- and Y-axis alignment specifications are met, the circuit board with its attached connectors can be completely fitted into the slots of the alignment fixture.

Abstract: A jig for loosening electric wires of a wire harness passed through a grommet is disclosed. The jig includes a fixing-side clamping portion for clamping the one end of a wire harness, a guide rail extending in a longitudinal direction of the wire harness, a bearing slidably engaged with the guide rail; a lock portion for locking said bearing to the guide rail, a circular rotating member, supported by said bearing, for rotating the wire harness in a circumferential direction of the wire harness; and a movable-side clamping portion, integrally attached to the rotating member, for clamping the other end of the wire harness. The rotating member may have a spiral cam groove, and the bearing may have an engagement protrusion to be engaged with the cam groove so that when the one clamping portion is inverted, the rotating member can move in its longitudinal direction. The one clamping portion may include a rachet mechanism.

Abstract: Substrates are supported by height-adjustable supporting pins in automated equipping units. The supporting pins are composed of a tip and a foot part that is spring-borne relative to the tip. When the supporting pins are placed against an underside of the substrate, the supporting pins individually adapt to the contour of the underside of the substrate. The height position of the supporting pins is subsequently fixed. As a result, substrates having position and surface variations can be protected against sagging upon placement of components on the substrates during an automated equipping process.

Abstract: A tool for stabilizing slack fiber cable that has been withdrawn from a cable duct includes an inner sleeve portion for stabilizing the end portion of the cable remaining in the duct and a collar that is coupled to the sleeve and attaches to the exterior periphery of the duct. A set of cable-locking rollers is coupled to the collar and used to engage the slack portion of the cable and hold it in place as various fibers within the cable are repaired.

Abstract: A reconfigurable and customizable nest for a device under test. The reconfigurable nest includes a non-metallic nest plate and nesting blocks. The nesting blocks are positioned around the device under test using removable fastening elements such as double-stick tape. Using the removable fastening elements, the nest may be reconfigured for different devices under test. Once configured, the reconfigurable nest may be converted into a permanent nest by attaching each nesting block to the nest plate using a fastener such as a self-tapping screw.

Abstract: A plurality of electric wires of a wire harness have a filler applied to predetermined waterproofing portions thereof. A sheet is wound on a peripheral surface of a bundle of electric wires to which the filler has been applied, and the sheet-wound waterproofing portion is repeatedly pressed from opposite sides. By such pressing, a relative displacement of the electric wires and the filler can be accelerated and the filler can be spread and filled securely in the waterproofing portion.

Abstract: A wafer space supporting apparatus is installed on a support chuck to relieve physical stress caused by thermal expansion or contraction of an object to be fabricated and adjusts itself to support the object to compensate for thermal expansion and contraction as well as minimize hard defects generated. The wafer space supporting apparatus includes a plurality of sliding pockets sunken into the supporting surface of the chuck, and sliding pads respectively floating-coupled in the sliding pockets such that they are spaced apart from the supporting surface so that they may adapt to expansions and contractions of an object to be fabricated, thereby preventing or minimizing any hard defects or physical stress.

Abstract: A workpiece table assembly is configured to hold a plurality of workpieces (e.g. conductive strands) so that the workpieces can be modified (e.g. bent). In one embodiment, the workpiece table assembly advantageously comprises a table, a saddle, a lift mechanism, and a die. The saddle is advantageously recessed below the table and raised or lowered by the lift mechanism. The table advantageously has a top surface with holes adapted to accept quick-release pins from a step-off board. The step-off board also has notches to accept and position the strands for die pressing. In one exemplary operation, the step-off board is used to stagger the strands over the down-positioned saddle. The saddle is then raised by the lift mechanism and the die placed within the saddle on top of the strands. A force is applied to the die to bend the strands.

Abstract: A circuit board stripper includes a deck having a top pattern plate for supporting circuit boards. The deck defines a plurality of first through-holes and the pattern plate defines a plurality of second through-holes aligned with the first through-holes. A slider is movable under the deck, and has a top face formed with a plurality of slopes under the aligned through-holes of the deck and the pattern plate. A plurality of lifting pins extend upward through the aligned through-holes, and are each formed with a bottom wheel adapted to roll on corresponding one of the slopes of the deck so that the lifting pins are lifted up when the slider is moved in a first direction and are lowered down when the slider is moved in an opposite second direction. Additionally, there is a pneumatic cylinder having a ram for moving the slider in the directions.

Abstract: A method in which an alignment tool consisting of a nest and guide tool is used to align an LGA module in the nest and then the LGA module is removed from the nest and aligned with a circuit card by the use of the guide tool.

Abstract: An apparatus and method for positioning packaged semiconductor devices having different rectangular shapes and sizes. A positioning apparatus includes an adjustable alignment guide releasably coupled to a base. The adjustable alignment guide may be positioned along a first axis to partially define a recess into which the packaged semiconductor devices are placed during positioning. The positioning apparatus may also include additional adjustable alignment guides that may be positioned along the first or a second axis to further define the recess into which the packaged semiconductor device is to placed during positioning. The adjustable alignment guides may have alignment surfaces against which the integrated circuit rests when placed into the recess that is partially defined by the alignment surfaces.

Abstract: A mechanism for adjusting an object in terms of its position along a vertical axis, and its rotational orientation about either two orthogonal horizontal axes or about a vertical and a horizontal axis, utilizes a set of electric motors in conjunction with a mechanical guiding structure that substantially restricts the movement of the object to the desired translational and rotational directions.

Abstract: An improved hoop support for semiconductor wafers reduces contamination of the wafer during edge beveling operations through the use of support pins that make only line contact with the wafer. The support pins are spaced around the periphery of the hoop and possess a triangular cross section. Two intersecting sides of the pins form an edge that defines the line contact with the wafer. These intersecting sides are preferably inclined relative to the wafer at an angle of between 60 and 80 degrees.

Abstract: An apparatus is provided to assist a user in aligning and sizing a plurality of spaced-apart channels to be formed in a cleat connected to a power generator housing so as to secure a plurality of leads extending from a power generator through the housing. The apparatus includes a main member to which secondary members removably and movingly connect to align with the leads. Channel sizers connect to the secondary members to register the diameter of each lead. The apparatus first aligns with and registers the diameter of each lead and is then positioned adjacent the housing to assist the user in correctly spacing and forming holes in a support structure such as a cleat. Related methods are also provided for aligning and sizing channels to be formed in a cleat or other support structure to secure the leads extending from the power generator through the housing.

Abstract: A wafer loading system positioning method and device, comprising a loading system, having a base and a rear plate for docking on a positioning frame of a production equipment. The main characteristic thereof is that the loading system in an upper part of the rear plate has a holding seat and the positioning frame in an upper part of a front side has an upward extending positioning element. Two eccentric cams on the holding seat and the positioning element allow to adjust a relative position of the holding seat with respect to the positioning element. A lifting mechanism enables raising of the loading system for lifting said holding seat above said positioning element, so as to enable said holding seat to engage with said positioning element.

Abstract: A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped and provided with standardized indexing holes to allow processing of circuit boards on processing equipment configured for lead frame-based processing.

Abstract: A power clamp apparatus, comprised of, a single metal body with an interior cavity running there through, a unit assembly which is inserted into said interior cavity, and said unit assembly including, a piston for slidable back and forth movement within said cavity, a lower portion of said cavity acting as a chamber for said piston, a piston rod connected to said piston, a floating head member on the piston rod, a link mechanism connected proximate to an upper end of said piston rod, a lower cap member which closes off said cavity near a bottom end of said metal body, an upper cap member which closes off the metal body proximate to a top end thereof after said unit assembly is inserted into said cavity, a drive shaft inserted through apertures in a generally transverse position through said metal body, with a central portion of said drive shaft inside the metal body being connected to an end of said link mechanism, a clamp arm attached to said drive shaft on the outside of said metal body, and wherein when sa

Abstract: A waterproofing jig is provided that includes a support body having parallel receiving chambers configured to contain electric wires in a juxtaposed manner. Nozzle holes are formed in the support body to eject a sealant into the receiving chambers. The waterproofing jig fills clearances between electric wires with a sealant within a small space and readily enhances waterproofing of the clearances.

Abstract: A work pallet for processing optical fiber. The work pallet may be configured to manage lengths of optical fiber for an automated manufacturing process. In this regard, the pallet may be configured to organize and maintain individual fibers in one or more desired positions to facilitate a manufacturing process. For example, the pallet may be employed for an automated fusion splicing process in which pairs of optical fibers are spliced to each other to establish an optical circuit. The pallet presents a platform on which corresponding fibers of an optical fiber module or other device may be arranged in an organized fashion for fiber preparation, fusion splicing, fiber recoating, post-processing storage and the like. The pallet may employ a cross-lacing arrangement in which the fibers extend in opposite directions across the pallet to control fiber slack associated with subsequent fusion splicing or other processing of the fiber pairs.

Abstract: An installation apparatus of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.

Abstract: A fixture to couple an integrated circuit to a circuit board is disclosed and claimed. The fixture includes a base member and a holder to retain the circuit board in a selected position relative to the base member. A clamp assembly is included to hold a package containing the integrated circuit in a predetermined position on the circuit board and to cause electrical contact between the integrated circuit and the circuit board.

Abstract: A cassette tub for holding at least one wafer cassette in a tilted position for accessing by a robot blade by utilizing a cassette tub pin assembly to ensure the tilt angle of the wafer cassette is described. The cassette tub is filled with water such that wafers during a chemical mechanical polishing process may be stored therein without any residual slurry solution solidified on the surface of the wafer, and thus eliminating the generation of any contaminating particles or abrasive particles which may cause severe scratching in a subsequent chemical mechanical polishing process. The cassette tub pin assembly is securely mounted to a mounting reel in the cassette tub such that the angle of the wafer cassette is ensured.

Abstract: A system for performing an operation relating to a printed wiring board, including a first supporting table having a planar first supporting surface, a portion of the first supporting table that defines the first supporting surface being formed of a ferromagnetic material; a plurality of supporting members each of which has a seat portion having a bottom surface which is seated on the first supporting surface, and a support surface opposite to the bottom surface, a portion of the seat portion being formed of a permanent magnet, each supporting member being attached, owing to a magnetic force of the permanent magnet, to the first supporting surface to support a back surface of the wiring board; an operation performing device which performs an operation for a front surface of the wiring board whose back surface is supported by the respective support surfaces of the supporting members; a second supporting table which is provided in a vicinity of the first supporting table and has a second supporting surface whic

Abstract: A positioning target for a printed circuit board made of base layers and by at least two pressing processes has a first width, a second width formed in the first width, a left margin and a right margin formed on opposite sides of the second width and immediately adjacent to the second width, a first length, a second length formed in the first length, a top margin and a bottom margin. An area formed by a mix of the second width and the second length is for the laminated printed circuit board and multiple positioning holes are respectively defined in two adjacent margins horizontally respective to end sides of two adjacent margins.

Abstract: The present invention relates to a heating system for use with a transport carrier. The present invention makes the workability of a transport carrier compatible with the maintenance of positioning accuracy and imparts a general-purpose property. An electric wire-hanging member is provided on which a plurality of bundles of electric wires are hung in a parallel. A holder is provided for retaining the electric wire-connecting parts which are formed in bundles of electric wires on the electric wire-hanging member. Further, an electric wire sandwiching system for regulating the retention of at least the electric wire-connecting parts side of the bundles of electric wires which are hung on the electric wire-hanging member and for releasably retaining the connected bundles of electric wires.

Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. A heater and a heat sink can be included in the bottom assembly to allow for temperature cycle testing of the wafer. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects. Mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated.

Abstract: A device particularly adapted to engage an irregular bottom surface of an object and then carry that object includes a support block. In the support block is a set of longitudinally spaced apart upright bores. On each side of the bores in a top wall of the block is a guide channel for a slide bar. Ends of these bars operatively connect with a reciprocating mechanism attached to one end of the block. In each bore is a sleeve having an inner opening formed with an upper section for a spring. An upper and lower end coil of a coil portion of each spring connects with an arm that projects outwardly. The upper arms fit respectively in upward facing slots in one slide bar while the lower arms fit respectively in downward facing slots in the other slide bar. In the sleeve inner openings and extending respectively through the coil portion of each springs is a support pin. Top ends of these pins fit in openings in a top cover plate fastened to the support block top wall.

Abstract: A vacuum chuck/insert assembly (100) for firmly supporting a semiconductor wafer (106) during wafer processing. The vacuum chuck comprises a chuck (102) and a removable insert (104). The chuck includes a base (108) and a plurality of spacers (112) for holding the insert in spaced relationship to the base of the chuck. The chuck further includes first and second vacuum seals (116, 118) and vacuum ports (128) extending through the base of the chuck. The insert includes a base (132) and a plurality of spacers (136) for holding the wafer in spaced relationship to the base of the insert. The insert further includes a vacuum seal (140) and vacuum ports (146) extending through the base of the insert. During operation, vacuum applied to the vacuum chuck/insert assembly holds the insert firmly in contact with the chuck and the wafer firmly in contact with the insert.

Abstract: An exemplary embodiment is a fixture for securing hard stops to a substrate. The fixture has a base which provides support to the fixture. The base has a cavity configured for nestably supporting a substrate. A top plate is mounted on the base, the top plate is configured for mounting the substrate. An alignment plate is disposed on the top plate separate from the base. An adjusting plunger assembly is coupled to the base. The adjusting plunger assembly is configured for use with attaching a hard stop to the substrate. A plunger is coupled to the base substantially perpendicular to the adjusting plunger assembly. The plunger is configured for use with supporting the substrate. A method of using a fixture is disclosed comprising disposing a substrate in a base of the fixture and mounting a hard stop to the substrate. An adhesive is disposed between the hard stop and the substrate. The substrate is mounted between a plunger and a top plate. The hard stop on the substrate is aligned with an alignment plate.