Abstract: Four non-magnetic substrate members are coupled in parallel with each other by a pair of guide plates, and a plurality of receiving grooves, which can slidably receive strip portions of lead frames, are formed in the upper surface of each substrate member in parallel with each other. Permanent magnets for attracting the lead frames are fixed in proximity to bottoms of the receiving grooves. Lead frames, to which electronic component elements are mounted, can be easily inserted into and taken out from the receiving grooves by simply sidewardly slid into and from the receiving grooves, and the lead frames inserted in the receiving grooves are stably held by the permanent magnets due to magnetic force.

Abstract: In order to properly hold a number of miniaturized electronic component chips so that processing such as formation of external electrodes can be efficiently performed, a holder having an adhesive face to be stuck to first end surfaces of a number of electronic component chips for holding the electronic component chips is employed. The number of electronic component chips being held by the holder are dipped in electrode paste, so that external electrodes are formed on second end surfaces thereof. Then, an adhesive face of another holder having stronger adhesion than the adhesive face of the first holder is stuck to the electronic component chips, whereby the number of electronic component chips are simultaneously transferred to this holder. The first end surfaces are then also dipped in electrode paste to form external electrodes thereon.

Abstract: The device is used for the mutual alignment of perforated printed circuit boards and pattern carriers, for example films. It consists of a support (10) with parallel pins (16) axially slidable and laterally immovable within guides disposed thereon. In order to achieve a very exact alignment of the printed circuit boards and the films in spite of unavoidable tolerances regarding the position and the diameter of the centering bores cooperating with the pins (16), the pins are substantially polygonal in cross-section, having parallel lateral surfaces with either chamfered or rounded corners. The corners of the pins taper from the support (10) toward their free ends. They furthermore can be retracted into the support (10) using an actuator to prevent the tilting of the printed circuit boards in the course of their removal.

Abstract: An optical receiver assembly includes a generally flat, stainless steel optical receiver mount for mounting a KOVAR hybrid detector package above a printed wiring board, the detector package having a light transmissive window, a cap, and a mounting flange, the flange being mechanically fastened to the underside of the receiver mount such that the cap protrudes through the opening therein.

Abstract: Four non-magnetic substrate members are coupled in parallel with each other by a pair of guide plates, and a plurality of receiving grooves, which can slidably receive strip portions of lead frames, are formed in the upper surface of each substrate member in parallel with each other. Permanent magnets for attracting the lead frames are fixed in proximity to bottoms of the receiving grooves. Lead frames, to which electronic component elements are mounted, can be easily inserted into and taken out from the receiving grooves by simply sidewardly slid into and from the receiving grooves, and the lead frames inserted in the receiving grooves are stably held by the permanent magnets due to magnetic force.

Abstract: According to this invention, there is provided a notch position aligning mechanism and a process for using the mechanism including a base which can be vertically movably inserted into a cassette through a lower opening of the cassette for storing a plurality of targets to be aligned having notches formed in edge portions of the targets wherein can be fitted, a rotating/supporting mechanism, including a first rotary member which is arranged on the base, and has a plurality of fitting grooves in which the notches of the targets can be fitted, a second rotary member which can be rotated and is arranged on the base, and a drive unit for rotating at least one of the first and second rotary members, the rotating/supporting mechanism supporting and rotating the targets using the first and second rotary members while the targets are spaced apart from the cassette, and a support member, arranged on the base, for supporting the targets having the notches fitted in the fitting grooves of the first rotary member to stop

Abstract: A wafer clamping member for clamping a wafer in a plasma reaction chamber. The clamping member has a design which minimizes particle contamination of the wafer and allows more wafers to be processed before it is necessary to clean built-up deposits from the clamping member. The clamping member includes a clamping portion which clamps an outer periphery of the wafer against a bottom electrode and a shadow portion which provides a gap between an inner edge of the clamping member and the upper surface of the wafer. The gap is open to the interior of the plasma reaction chamber and preferably has a height equal to about a mean free path of a gas activated to form a plasma in the plasma reaction chamber.

Abstract: This invention comprises various high production methods for simultaneously forming surface metallizations on a plurality of monolithic electronic modules. Each monolithic electronic module may comprise a single semiconductor chip or multiple semiconductor chips. The methods can employ a workpiece which automatically discontinues side surface metallization between different electronic modules in the stack. Multiple workpieces are interleaved within the stack between the electronic modules. Each workpiece may include a transfer layer(s) for permanent bonding to an end surface of an adjacent electronic module in the stack. This transfer layer may comprise an insulation layer, a metallization layer, an active circuit layer, or any combination thereof. End surface metallization can thus be provided contemporaneous with side surface metallization of multiple electronic modules.

Abstract: A workpiece locating unit is receivable in a T-slot formed in a workpiece supporting table member and provides a pin or other locating device cooperable with a locating feature on a workpiece to aid in accurately positioning the workpiece on the work supporting surface of the table member. The unit has four corners each providing an abutment surface for engagement with one or the other of two vertical slot surfaces. Two diagonally opposite ones of the abutment surfaces are rigid and the other two diagonally opposite ones of the abutment surfaces are resilient. The resilient abutment surfaces resiliently engage the two vertical surfaces of the slot and urge the unit about a vertical axis to hold the rigid abutment surfaces engaged with the vertical slot surfaces eliminating lateral looseness between the unit and the table member and providing accurate positioning of the locating device of the unit as the unit is moved from one position to another along the length of the slot.

Abstract: A method and apparatus for electron or laser beam welding of semiconductor subassemblies to larger terminal members, without exposing semiconductor chips in such subassemblies to detrimental welding "flash".

Abstract: A rectangular substrate is cooled while it is processed under vacuum in a reaction chamber on a rectangular cooling pedestal having a cooling surface that has a downwardly curving convex shape. The substrate is clamped to the pedestal such that it conforms with a pedestal cooling surface profile. As a result the number of voids between the substrate surface and the pedestal cooling surface are minimized. This promotes consistent cooling of the substrate across the entire substrate surface when the substrate is processed at high RF power levels, by allowing the substrate to be subjected to high levels of backside cooling medium pressure which efficiently propagates heat across such gap from the substrate to the pedestal.

Abstract: A wafer cleaning tank including a tank body containing therein a cleaning solution, and wafer supporting device for substantially vertically supporting at least one wafer in the tank body, wherein the wafer supporting device includes a pair of confronting fixed wafer support members disposed in the tank body with a predetermined space therebetween and each having at least one side wafer-supporting portion, and a movable wafer support member vertically movably disposed centrally between the fixed wafer support members at a level below the fixed wafer support members and having at least one central wafer-supporting portion corresponding in position to the position of the side wafer-supporting portion of each of the fixed wafer support members, and wherein the side wafer-supporting portions and the central wafer-supporting portion jointly form a three-point support structure which supports the wafer at three points on the outer edge thereof.

Abstract: A substrate retention fixture including a base formed of a relatively flat plate with major surfaces and a substrate receiving area formed in one surface thereof with a plurality of openings adjacent the area and in communication therewith. A plurality of spools, one each positioned in each opening, and slideably mounted within the opening for movement between a substrate disengaged and a substrate engaged position. A plurality of springs, one each positioned in each opening, with the spring in each opening engaged with the spool in the opening and biasing the spool into the substrate engaged position. Alignment pins formed to engage and align a substrate positioned in the area, the alignment pins being mounted on one of the base and the plurality of spools.

Abstract: A jig is provided which is capable of being selective locked in place to support a work piece and quickly dropped out of place to allow the work in progress to pass by. The jig includes a plurality of fingers which can be selectively configured to support a variety of work pieces. The fingers can be easily reconfigured to handle a variety of work pieces without requiring modification of the basic jig structure.

Abstract: A slide actuated holding clamp for holding a connector stationary while a push test or pull test is performed on a conductor secured to the connector. The clamp comprises a main body portion having an opening formed therein, a locking member adapted to fit nestably substantially within the opening, and an actuating member adapted to fit nestably within a recessed portion in the locking member. The actuating member is pivotally coupled to an upper end portion of the locking member and the locking member is captively held within the opening in the main body portion by a locking pin. The locking member includes elongated openings which allow the locking member to be urged slidably longitudinally within the main body portion as the actuating member is moved in first and second longitudinal directions. The pivotal coupling of the actuating member and locking member allows the locking member to be urged pivotally into abutting engagement with a connector as the actuating member is moved in a first linear direction.

Abstract: A fixture clamps a plurality of lids onto a multi-chip module (MCM) integrated circuit for adhesively attaching the lids to cover a plurality of cavities in the module in which chips or dies are mounted. The fixture includes a base plate which is formed with recesses in which the lids and the module are fittingly retained with the lids properly positioned relative to the module. A pressure plate is guided onto the module by a pin assembly and presses the module against the base plate. A plurality of spring loaded clamps have first jaws that engage with the lids through respective holes in the base plate and second jaws that engage with the pressure plate. The clamp thereby clamps the lids and the pressure plate to the module. The assembly including the module, lids, pressure plate and clamps is then removed from the base plate to enable curing of an adhesive that bonds the lids to the module, and frees the base plate for reuse.

Abstract: A device for retaining an electronically readable card in an electronic device includes a substantially V-shaped resilient retainer dimensioned to engage a portion of the card while the rest of the card remains exposed for electronic reading purposes. The resilient retainer is held in the electronic device by a clip having a first detent member. The retainer includes a second detent member which engages the first detent member as the retainer enters the slit during insertion of the card into the electronic device. The thicknesses of the retainer and the card and the width of the slit are selected so that the resilient retainer is firmly held in the electronic device.

Abstract: An electrostatic chuck for releasably holding a workpiece comprising a substrate formed by a pair of dielectric elements, each being a single crystal, with at least one electrode embedded therebetween, and a voltage source coupled to each electrode. The chuck is preferably fabricated from two substantially planar dielectric members sandwiched around a brazing compound which become electrodes after the assembly is heated and then cooled.

Abstract: A compound clamp ring secures a semiconductor wafer having a wafer flat portion to a wafer pedestal during wafer processing while maintaining a continuous seal between the wafer edges and the wafer pedestal to prevent leakage of coolant gases circulated at the backside of the wafer into the process environment. The clamp ring has an annular wafer clamp surface adapted to press a round portion of the wafer into sealing abutment with the wafer pedestal. A cavity formed in the clamp ring securely receives a comb-like array of resilient flexures that are adapted to apply a yieldable bias to the flat portion of the wafer to complete the seal between the wafer and the pedestal at the flat portion of the wafer; and encloses the flexures to shield the flexures from process gases.

Abstract: A modular device for assembling, wiring harnesses, cables and the like includes a number of elongate elements, a number of cable guiding means, each of the cable guiding means being selectively positionable along different points along the length of one of the elongate elements, and a number of securement means for removably securing the elongate elements in a fixed relationship.

Abstract: A clamp for optical fiber couplers manufacturing apparatus comprises a slotted member having a slot into which optical fibers are inserted and having an opening outwardly winder from the slot so that the optical fibers are introduced into the slot, and a pushing member movably disposed adjacent the slot for pushing the optical fibers through the opening into the slot, wherein the slotted member is away from the pushing member when the fibers are not clamped, and the slotted member is fixed at a position where the slotted member clamps the fibers.

Abstract: In a rack bar (12) for immersion electroplating of printed circuit boards (14) elongated spring clips (34) are provided for clamping the printed circuit boards, which spring clips extend substantially in the direction of the rack bar, are rigidly connected to the rack bar at one of their ends and are movable with their other end contacting the printed circuit board between a clamping position and a disengagement position in which the spring clip is lying as a whole beside the printed circuit board. This arrangement permits an easy frontal loading and unloading of the printed circuit boards, has little wear and allows a great exploitation also of the edge area of the printed circuit board.

Abstract: A removable stiffener, which is made of titanium so that it will not be wetted by solder, consists of a thick, straight center member with wedge-shaped feet evenly spaced along its length. A latching pin is included on one end. The stiffener also includes flanges made of thinner stock, running the length of the stiffener on both sides. These flanges strengthen the center member and hold it perpendicular to the card on which the stiffener is installed. The stiffener requires a one-half inch wide channel on the card and a special pattern of slots. To install the stiffener, the feet are inserted part-way into the slots with the latching pin of the stiffener oriented near the latching slot of the card. The card is then bent gently away from the stiffener while the stiffener is being pushed forward so that the latching pin and the latching slot align and engage. When the card springs back the stiffener is latched in place.

Abstract: Apparatus for coating the surface of an object with a coating material are disclosed. The apparatus comprise a vacuum chuck assembly suitable for holding the object to be coated in a downward, i.e., inverted position, and a coating material applicator movably positioned beneath the vacuum chuck assembly to traverse the surface of the object in a generally parallel direction to the surface. The vacuum chuck assembly provides a means for temperature control as well as a means for establishing a vacuum for holding the object in the inverted position.

Abstract: An apparatus (40) for providing consistent, non-jamming registration of a semiconductor wafer (46) undergoing process work includes a plate (42) upon which the wafer (46) is laid flat. A flat (45) of the wafer (46) is registered against two rollers (43') that are fixedly mounted to the plate (42). A third roller (43), also fixedly mounted to the plate (42), registers a first point (47) along the circumference of the wafer (46). A fourth roller (48) is fixedly mounted to a bracket (50) that is movable approximately along the radius of the wafer (46). A force (54) is applied to this bracket (50) resulting in the fourth roller (48) applying a force against the wafer (46). This resultant force, coupled with the rotating capability of the rollers (43, 43', 48), allows the wafer (46) to rotate into a proper registration position. A second embodiment (60) that incorporates essentially these same force and rotation dynamics through the use of flexures (64, 66, 68) is also disclosed.

Abstract: A fiber holding chuck comprising a silica glass rod having a fiber groove or fiber chuck for an optical fiber. The optical fiber lies in the fiber groove, and a clamping mechanism holds the optical fiber in place. The fiber holding chuck positions the optical fiber without damaging the fiber in order to align the fiber with another fiber. The clamping mechanism maintains the position of the aligned fiber. The fiber chuck mounts in a chuck groove of a chuck mounting fixture. The chuck mounting fixture attaches to a fiber positioning mechanism, and the positioning mechanism positions the chuck mounting fixture along with the fiber chuck and the optical fiber to align and splice two optical fibers together while reducing the risk of damage to the optical fiber.

Abstract: A wiring guide bar extending vertically through a protector case and projecting from the upper end thereof is vertically movably supported by an elastic member. In installing a protector cover on the protector case, the elastic member is compressed to locate the upper end of the wiring guide bar below the upper end of the protector case.

Abstract: A plurality of ring trays supporting loaded treatment objects are arranged in parallel at predetermined spacing in the vertical axis direction and are supported by rods at a minimum of three locations separated from the rod couplings. Cutouts are provided in each ring tray that do not extend to the ring tray center open area. Supporting teeth are provided on the arms driven by drive devices and are inserted via the cutouts. The supporting teeth straddle the ring tray and are shifted relatively on both sides of the vertical direction, and can exchange the wafers between the ring tray and the supporting teeth. By this, problems occurring with regard to various types of heat treatment of the treatment objects, such as treatment object slippage, can be prevented. In addition, a plurality of treatment objects can be exchanged at one time, thereby allowing the exchanging time to be shortened.

Abstract: An alignment fixture for use in sealing integrated circuit packages including a body having rectangular alignment cavities therein for receiving components of integrated circuit packages. The body is inclined at an angle relative to a horizontal reference plane. The rectangular alignment cavities are rotated at 451/2 angle relative to a longitudinal axis of the body.

Abstract: A splash protector assembly for printed wiring boards includes splash protector rails for permitting printed wiring boards to be coupled together without additional aids as they are conveyed in a given conveying direction across different conveying planes through soldering machines. The splash protector rails include successive front and rear splash protector rails as seen in the given conveying direction. Each of the splash protector rails are L-shaped and define a longer leg being in an upright position during use, and a shorter leg. Each of the splash protector rails have springs for clamping the printed wiring boards. The longer leg of the rear splash protector rail has hooks and the longer leg of the front splash protector has braces for hanging the rear splash protector rail from the front splash protector rail of the next printed wiring board, and the braces prevent the printed wiring boards from becoming unhung as they are conveyed across meeting points of the different conveying planes.

Abstract: An improved clamping ring apparatus is disclosed comprising a clamping ring means for yieldably engaging a generally circular semiconductor wafer to peripherally clamp the wafer to a support pedestal to provide a peripheral seal between the wafer and the surface of the pedestal facing the wafer, adjacent the generally circular end edge of the wafer by providing a central generally circular opening in the clamping ring and a series of slots which radially extend outwardly from the central opening in the clamping ring means to thereby divide the inner portion of the clamping ring means into a series of yieldable fingers inwardly extending toward the central opening in the clamping ring means.

Abstract: A system capable of automatically compensating for the thickness of a workpiece which comprises: at least one actuator assembly which comprises a vacuum chuck capable of supporting a workpiece thereon vacuum means capable of providing the vacuum chuck with sufficient vacuum for maintain the workpiece in contact with the vacuum chuck, the vacuum means including a centrally located vacuum conduit portion, means for adjustably securing the vacuum chuck to the vacuum conduit portion, actuator means rotatably disposed about the vacuum conduit portion, and means for reciprocally moving the actuator means such that its movement produces a similar reciprocal movement by the vacuum chuck; motor means and gear assembly connected to the means for reciprocally moving the actuator means; means for detecting the thickness of the workpiece; and means for controlling the motor means and gear assembly so as to move the actuator means, whereby the height of the workpiece can be automatically and continuously adjusted to the va

Abstract: A multi heater block of a wire bonder including a multi heater block of such a wire bonder in which one heater may be used in various kinds of packages having different paddle size.

Abstract: A deposition chamber for forming a deposited layer on a wafer having a mixing chamber is disclosed having a wafer support device for supporting the wafers in the mixing chamber, a nozzle located above the wafer support device which can eject the gas/particle mixture into the mixing chamber toward the wafer, a gas outlet device at the bottom end of the chamber from the gas nozzle which allows the gas to exit the chamber and a deionizing device located above the wafer support device and below the nozzle to deionize the gas/particle mixture thereby encouraging uniform deposition of the particles on the wafer. This deposition chamber may also comprise an exhaust fan below the gas outlet device.

Abstract: A surface mounting method for mounting an electronic part having a great number of contacts onto a circuit board. A jig provided with dummy contacts is prepared whose size, number and arrangement are substantially the same as those of contacts of an electronic part to be mounted on a circuit board. The dummy contacts of the jig are then fitted with mating contacts which are to be fitted with the contacts of the electronic part. Thereafter, the jig provided with the dummy contacts fitted with the mating contacts is mounted onto the circuit board at a predetermined position thereon. The mating contacts are then mounted and fixed onto the circuit board. The jig is then removed from the circuit board. The contacts of the electronic part are then fitted with the mating contacts fixed to the circuit board. As an alternative, double ended socket contact members are prepared, each having socket contacts on both ends.

Abstract: A mold used in producing printed wiring board is disclosed. The mold comprises upper dies and lower dies for sandwiching a printed wiring board therebetween, thereby performing drilling, punching or the like, one of said upper dies and lower dies having a press surface which is provided with concave or convex portions for absorbing steps caused by forming a printed wiring circuit on the printed wiring board.

Abstract: A fixture which includes a lower base for supporting and protecting the front surface of a semiconductor wafer and a clamp. The lower base has an upper end having a central surface portion recessed from a peripheral surface portion for supporting by means of an O ring the peripheral portion of the front surface of the wafer. The clamp rests on a peripheral portion of the back surface of the wafer with the remaining back surface exposed to the backside etching process. A pin and hole arrangement help align the clamp to the base. Holes in the base equalize pressure on both sides of the wafer.

Abstract: A slide actuated holding clamp for holding a connector block stationary while a push test is performed on a conductor secured to the connector. The clamp comprises a body portion having a bore extending longitudinally therethrough and a portion forming a channel. A locking member is pivotally disposed within the channel and includes a locking finger portion and a lower shoulder portion. An actuating member is slidably disposed within the channel and includes a pin member extending transversely therethrough which causes the locking member to move pivotally such that the locking finger portion is moved outwardly of the channel when the actuating member is moved in a first direction. When the actuating member is moved in a longitudinally opposite second direction, the pin member abuttingly engages the lower shoulder portion, thereby causing the locking member to move pivotally such that the locking finger portion is retracted to a position within the channel.

Abstract: A process platform for wafer carriers having a floor and a handle extending upwardly from the floor to define two floor portions for engaging wafer carriers on either side of the handle. The floor portions feature structures for orienting the wafer carriers either parallel or perpendicular to the handle and a peripheral gridwork of openings to permit fluid to flow easily through the floor to the wafer carriers. The handle features openings to permit fluid flow therethrough and bifurcated portions extending between the handle and side portions of the floor to lend stiffness to the platform.

Abstract: A fixture for positioning high density packaged integrated circuits for tinning which includes a clamp bar assembly pivotally attached to a base. The base includes recessed nests in which the high density packages are positioned. The high density packages are secured in the nests by the clamp bar assembly. The top surfaces of the high density packages are protected from the solder wave by the base. A predetermined spacing and orientation of the nests ensures proper tinning.

Abstract: An apparatus for holding a wafer cassette on a platform of a wafer processing system is described. The apparatus includes a first guiding member and a second guiding member. The first guiding member is mounted on the platform of the wafer processing system. The second guiding member is mounted on the platform of the wafer processing system at a corresponding position of the first guiding member. The first and second guiding members define an interior boundary within which the wafer cassette is secured. The interior boundary matches an outline of a lower portion of the water cassette. The first and second guiding members together guide the water cassette to be precisely loaded into the interior boundary defined by the first and second guiding members. When the wafer cassette is located in the interior boundary defined by the first and second guiding members, the first and second guiding members prevent the wafer cassette from moving horizontally on the platform.

Abstract: Apparatus for semiconductor wafer manufacture in which a susceptor has an annular rotor for supporting a wafer substrate with a substrate surface facing downwards. The rotor has an annular flange overlying a body of the susceptor and the structure is such that a flow of rotor driving gas may be directed up from the body and against the flange while crystalline layers are being formed on the undersurface of the substrate.

Abstract: Conductor feeding apparatus for selectively feeding conductors selected from a group or from feeding all of the conductors in the group comprises first and second clamping assemblies which are moveable towards and away from each other between remote and proximate positions. Each clamping assembly has a clamp for each one of the conductors. When it is desired to feed selected conductors, the selected conductors are clamped in the first clamping assembly and the non-selected conductors are clamped in the second clamping assembly. The second clamping assembly is moved towards the first clamping assembly so that the ends of the selected conductors project beyond the second clamping assembly. The projecting ends are gripped in a conductor puller and pulled along the feed paths.

Abstract: The wafer alignment fixture is provided with a cassette support which can be slid between two positions on a base plate. In one position, the cassette support is aligned with a roller in order to align notched wafers with each other. In the second position, the cassette support is aligned with a second roller so as to effect alignment of wafers having flats.

Abstract: A plurality of light-emitting/receiving sections respectively include light-emitting sections arranged to correspond to substrates to be detected and light-receiving sections for receiving beams from the light-emitting sections. The substrates to be detected are a predetermined number of substrates arranged and accommodated at predetermined intervals in a substrate accommodating section. A moving section relatively moves the plurality of light-emitting/receiving sections and the substrates to be detected in directions cross or perpendicular to each other.

Abstract: A wafer cooling apparatus characterized by a chamber, a pedestal disposed within the chamber and a mechanism for lowering a semiconductor wafer onto an upper surface of the pedestal. The upper surface of the pedestal is grooved to allow gas trapped between the wafer and the pedestal surface to escape around the periphery of the wafer, thereby minimizing the tendency of the wafer to "skate" across the surface of the pedestal on a thin layer of gas. The method involves extending a number of pins through a grooved cooling surface of the pedestal to contact a wafer, and retracting the pins into the pedestal to lower the wafer to the cooling surface and to force gas trapped between the wafer and the pedestal into the grooves of the pedestal.

Abstract: In a wire bonding method and apparatus to bond electrodes on pellets to leads on lead frames, substrates, when such a bonding is performed, a portion of the lead away from bonding point of the lead is pressed by a pressing section of pressing arm which is moved vertically and horizontally by lead pressing device.

Abstract: A board stiffener (50) of rigid construction of high heat resistance material having recesses (62) to be secured to a large circuit board (10) over a plurality of electrical articles having contacts (24) soldered to the board, such as electrical connectors (20). The board stiffener (50) is mounted firmly to the board at locations near each recess (62) in abutment with top surfaces (34) of connectors (20) and provides resistance against warping by the board (10) during high temperature soldering operations. The board stiffener (50) can have channels (68,70) along the bottom surface (52) and the recess surfaces (72,74) to enable flow of solvent during flux cleaning following soldering operations.

Abstract: Apparatus (11) is robotically operated to pick up an optical element such as a ball lens (12) or an optical fiber, place it in a groove or depression (13) of a substrate (14), and apply pressure to it so that it is bonded to the substrate. The tool comprises a retracting element holder (17) surrounding a bonding tool (16). A vacuum channel (18) communicates with the element holder so that, by the application of a vacuum, it can pick up an optical element. The tool then moves the element to place it, for example, in a depression (13) of a substrate, whereupon the vacuum is released, thereby to allow the element to nest between opposing sidewalls of the depression. The retracting holder element is simultaneously retracted vertically upwardly so as to expose a bonding surface of the bonding tool. After the element has nested in the groove, the bonding tool contacts the element and forces it against opposite sidewalls to effect a thermo-compression bond of the optical element with the sidewalls.

Abstract: An electrostatic chuck 8 assembly includes, from top to bottom: a top multilayer ceramic insulating layer 10; an electrostatic pattern layer 12 having a conductive electrostatic pattern 16 disposed on a multilayer ceramic substrate; a multilayer ceramic support layer 20; and, a heat sink base 30 having a backside cooling channels machined therein. Layers 12, 12 and 20 are bonded together using multilayer ceramic techniques and the heatsink base 30 is brazed to the bottom of the multilayer ceramic support layer 20.