Solid Dielectric Type Patents (Class 29/25.42)
  • Patent number: 11170949
    Abstract: A winder includes a winding mechanism, a chamber housing the winding mechanism, at least one vacuum pump, and a product case. The winding mechanism is configured to wind a belt-shaped raw film around a winding core. The belt-shaped raw film is composed of a plurality of electrodes and a plurality of separating films. The at least one vacuum pump is configured to suck air into the chamber. The product case is configured to house a plurality of winding products each formed by winding the raw film with use of the winding mechanism disposed in the chamber.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: November 9, 2021
    Assignee: KAIDO MANUFACTURING CO., LTD.
    Inventors: Kosuke Kaito, Yoshihide Kitamura
  • Patent number: 11166376
    Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2?SA1/BW1?0.5 and 0.2?SA2/BW2?0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: November 2, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Woo Chul Shin, Ji Hong Jo
  • Patent number: 11152141
    Abstract: A ceramic multi-layer component and a method for producing a ceramic multi-layer component are disclosed. In an embodiment a ceramic multi-layer component includes a stack with ceramic layers and electrode layers arranged between them, wherein the ceramic layers and the electrode layers are arranged above one another along a stacking direction, wherein at least one first electrode layer extends along a first main extension direction from a first end region to a second end region of the first electrode layer, and wherein the at least one first electrode layer has a current-carrying capacity that decreases along the first main extension direction.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: October 19, 2021
    Assignee: TDK ELECTRONICS AG
    Inventors: Michael Hofstätter, Alfred Hofrichter, Thomas Feichtinger
  • Patent number: 11127531
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including an active layer, in which first and second internal electrodes are disposed with a dielectric layer interposed therebetween, the N number of each of the first and second internal electrodes being stacked to be alternately exposed from first and second external surfaces; and first and second external electrodes disposed on the first and second external surfaces of the ceramic body and connected to the first and second internal electrodes, respectively. The ceramic body further includes a cover layer disposed above or below the active layer. The cover layer includes a plurality of first and second dummy electrodes. A number (A>N) of the first and second dummy electrodes are stacked to be alternately exposed from the first and second external surfaces.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: September 21, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hyeok Kim, Jea Yeol Choi, Sang Soo Park, Hwi Dae Kim, Young Jun Cha
  • Patent number: 11114249
    Abstract: In a thin-film capacitor, an electrode terminal layer and an electrode layer of a capacitor portion are connected to electrode terminals by via conductors that is formed to penetrate an insulating layer in a thickness direction thereof, and a short circuit wiring in the thickness direction is realized by the via conductors. In the thin-film capacitor, an increase in the number of terminals in the plurality of electrode terminals is achieved, a decrease in length of a circuit wiring is achieved, and thus a thin-film capacitor with low-ESL has been achieved.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: September 7, 2021
    Assignee: TDK Corporation
    Inventors: Koichi Tsunoda, Mitsuhiro Tomikawa, Kazuhiro Yoshikawa, Kenichi Yoshida
  • Patent number: 11107635
    Abstract: A capacitor component includes a body including a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction, and including a first dielectric layer, and a first internal electrode and a second internal electrode disposed to oppose each other in the first direction with the first dielectric layer interposed therebetween, and a first side margin portion and a second side margin portion, respectively including a second dielectric layer, a first margin electrode, and a second margin electrode, disposed in parallel with the fifth and sixth surfaces of the body, and respectively disposed on the fifth and sixth surfaces of the body.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: August 31, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hwi Dae Kim, Sang Soo Park, Young Ghyu Ahn
  • Patent number: 11087925
    Abstract: A power capacitor unit including a casing, first and second layers of capacitor elements wherein the first layer of capacitor elements are stacked on the second layer of capacitor elements, a first busbar assembly connected to the capacitor elements of the first layer, a second busbar assembly connected to the capacitor elements of the second layer, wherein the first busbar assembly and the second busbar assembly are arranged between the first layer of capacitor elements and the second layer of capacitor elements, a heat conducting layer provided between the first busbar assembly and the second busbar assembly, wherein the heat conducting layer is in thermal contact with the casing, thereby conducting heat from the first busbar assembly and the second busbar assembly to the casing, and wherein the casing is electrically insulated from the first busbar assembly and the second busbar assembly.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: August 10, 2021
    Assignee: ABB Power Grids Switzerland AG
    Inventors: Biswajit Singh, Carl-Olof Olsson
  • Patent number: 11069944
    Abstract: Rolled-up energy storage elements, each including a rolled layer stack of layers which are arranged within a layer plane in an at least partially covering manner. In the layer stack, at least two layers are present which are at least partially electrically conductive, and at least one layer of a non-liquid electrolyte material is present, or at least one region between at least two layers of the rolled layer stack is present which comprises a liquid electrolyte. Either at least one of the layers that is at least partially electrically conductive includes at least partially a magnetic material, or an additional layer that includes at least partially a magnetic material in the layer stack.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: July 20, 2021
    Assignee: LEIBNIZ-INSTITUT FUER FESTKOERPER-UND WERKSTOFFFORSCHUNG DRESDEN E.V.
    Inventor: Oliver G. Schmidt
  • Patent number: 11063111
    Abstract: The present disclosure provides a semiconductor structure, including a bottom terminal, a middle terminal over the bottom terminal and separated from the bottom terminal by a high-k dielectric layer, a top terminal over the middle terminal and separated from the middle terminal by the high-k dielectric layer, and a silicon nitride layer over the top terminal and directly on the high-k dielectric layer.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: July 13, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventor: Tung-Jiun Wu
  • Patent number: 11049650
    Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode, the internal electrode including nickel and an alloying element, and an external electrode disposed on the body to be connected to the internal electrode. The internal electrode includes an alloy region and an alloying element region.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: June 29, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Il Song, Beom Seock Oh, Woo Chul Shin, Byung Rok Ahn, Kyoung Jin Cha
  • Patent number: 11011313
    Abstract: A multilayer ceramic capacitor includes a body having a dielectric layer and internal electrodes disposed to be alternately exposed to the third and fourth surfaces with the dielectric layer interposed therebetween. External electrodes include connection parts respectively formed on opposing surfaces of the body, band parts formed to extend from the connection parts to portions of side surfaces of the body, and corner parts in which the connection parts and the band parts are contiguous. A thickness of each of the external electrodes may be 50 nm to 2 ?m. The external electrodes may be formed using a barrel-type sputtering method. A ratio t2/t1 may satisfy 0.7 to 1.2, where t1 is a thickness of each connection part and t2 is a thickness of each band part. A ratio t3/t1 may satisfy 0.7 to 1.0, where t3 is a thickness of each corner part.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: May 18, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Joon Oh, Tae Joon Park, Sang Wook Lee, Sung Min Cho, Seung Mo Lim
  • Patent number: 10998135
    Abstract: A ceramic electronic component includes external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body. Each of the external electrodes includes an underlying metal layer, an intermediate metal layer, a conductive resin layer, an external metal layer. A tip angle ? between an outer face of a tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is 20° or smaller, and a tip angle ? between an outer face of a tip portion of the wraparound portion of the intermediate metal layer and a surface of the ceramic component body is 20° or smaller.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: May 4, 2021
    Assignee: Taiyo Yuden Co., Ltd
    Inventors: Satoshi Kobayashi, Takahisa Fukuda, Tomoaki Nakamura, Mikio Tahara, Naoki Saito, Kiyoshiro Yatagawa
  • Patent number: 10991518
    Abstract: An apparatus and associated method for an energy-storage device (e.g., a capacitor) having a plurality of electrically conducting electrodes including a first electrode and a second electrode separated by a non-electrically conducting region, and wherein the non-electrically conducting region further includes a non-uniform permittivity (K) value. In some embodiments, the method includes providing a substrate; fabricating a first electrode on the substrate; and fabricating a second electrode such that the second electrode is separated from the first electrode by a non-electrically conducting region, wherein the non-electrically conducting region has a non-uniform permittivity (K) value. The capacitor devices will find benefit for use in electric vehicles, of all kinds, uninterruptible power supplies, wind turbines, mobile phones, and the like requiring wide temperature ranges from several hundreds of degrees C. down to absolute zero, consumer electronics operating in a temperature range of ?55 degrees C.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: April 27, 2021
    Assignee: GranBlueTech, L.L.C.
    Inventor: John P. Snyder
  • Patent number: 10984955
    Abstract: An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: April 20, 2021
    Assignee: KEMET Electronics Corporation
    Inventors: John Bultitude, John E. McConnell, Galen W. Miller
  • Patent number: 10978254
    Abstract: Disclosed are tantalum capacitors having enhanced volumetric efficiency, effective series resistance, effective series inductance, and high frequency performance when compared to existing tantalum capacitors. Also disclosed is a screening process for tantalum capacitors to enhance reliability.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: April 13, 2021
    Assignee: VISHAY SPRAGUE, INC.
    Inventors: Alex Eidelman, Yongjian Qiu, Pavel Vaisman, Yuri Stangrit, Rita Eisenberg, Natali Ostrovsky
  • Patent number: 10971302
    Abstract: A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are alternately stacked and the internal electrode layers are alternately exposed to two end faces; and external electrodes formed on the two end faces; wherein: a relationship “M??0.00002×EM+0.0012” is satisfied, when a length of end margins in a direction in which the two end faces face with each other is EM [?m] and a ratio of Mo [atm %] to a B site element [atm %] of a main component ceramic in the end margins is M, wherein the end margin is a region, in which internal electrode layers connected to one of the external electrodes without sandwiching internal electrode layers connected to the other of the external electrode, face with each other, in the multilayer chip.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: April 6, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Atsuhiro Yanagisawa, Yoshinori Shibata, Mikio Tahara
  • Patent number: 10957487
    Abstract: A multilayer ceramic capacitor includes a laminated body including dielectric layers and internal electrodes alternately laminated, and an external electrode provided on the surface of the laminated body and connected to the internal electrodes. The internal electrode includes a facing electrode portion facing another internal electrode with the dielectric layer provided therebetween, and an extended electrode portion extended from the facing electrode portion to the surface of the laminated body and connected to the external electrode. At least one layer of the internal electrodes includes a bent portion in the extended electrode portion. The distance between extended electrode portions adjacent to each other in the lamination direction narrows from the end portion of the facing electrode portion toward the bent portion, and widens from the bent portion toward the end portion of the extended electrode portion on the external electrode side.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: March 23, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Akira Ishizuka, Hiroyuki Hirano, Takatoshi Sueto, Masatoshi Yanagihara
  • Patent number: 10930437
    Abstract: A medical device capacitor assembly can include a capacitor including a plurality of anodes and cathodes, wherein the capacitor has a first major face, a second major face opposite the first major face, and a third face extending between the first major face and the second major face. A first insulating film can be sized and shaped to assemble against the first major face, and can include a first set of flaps sized and shaped to cover at least a portion of the third face. A second insulating film sized and shaped to assemble against the second major face, and can include a second set of flaps sized and shaped to cover at least a portion of the third face.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: February 23, 2021
    Assignee: Cardiac Pacemakers, Inc.
    Inventor: Aaron Louis Floeter
  • Patent number: 10903007
    Abstract: A multi-layer ceramic electronic component includes a ceramic body including a multi-layer unit, a side margin, and ridges. The multi-layer unit includes a capacitance forming unit including ceramic layers laminated in a first direction and internal electrodes disposed between the ceramic layers, a cover that covers the capacitance forming unit in the first direction, and a side surface facing in a second direction orthogonal to the first direction. The side margin covers the side surface. The ridges are rounded and extend in a third direction orthogonal to the first and second directions. The capacitance forming unit includes a first region disposed at a center portion in the first direction, and a second region disposed between the cover and the first region, end portions of the internal electrodes in the second direction in the second region being positioned inward in the second direction relative to those in the first region.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: January 26, 2021
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Ryo Ono, Tetsuhiko Fukuoka, Shoji Kusumoto, Akihiko Kono
  • Patent number: 10894165
    Abstract: The present invention provides a feedthrough device including: a feedthrough substrate made of an insulator and having a first surface and a second surface; at least one first feedthrough conductor having a terminal exposed to the first surface of the feedthrough substrate and a body connected to the terminal and not exposed to the outside of the feedthrough substrate; and at least one second feedthrough conductor having a terminal exposed to the second surface of the feedthrough substrate and a body connected to the terminal and not exposed to the outside of the feedthrough substrate, and corresponding to the first feedthrough conductor in a one-to-one manner to be paired therewith, wherein a body of each first feedthrough conductor and a body of each second feedthrough conductor corresponding thereto are arranged to be capacitively coupled with each other.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: January 19, 2021
    Inventor: Kyou Sik Min
  • Patent number: 10894164
    Abstract: Flexible semi-hermetic implantable medical device (IMD) structure, including a flexible device body, at least one flexible lead and at least one respective transition unit, for respectively coupling each flexible lead to the flexible device body, the flexible device body including a plurality of hermetically sealed components, at least one electrical cable harness and an external flexible polymer structure, each one of the hermetically sealed components including at least one hermetically sealed electrical connection and at least some of the hermetically sealed components including at least one separation dome, the electrical cable harness for electrically and mechanically coupling the plurality of hermetically sealed components together and the external flexible polymer structure for encapsulating the hermetically sealed components, the electrical cable harness and the respective transition unit.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: January 19, 2021
    Assignee: NewPace Ltd.
    Inventors: Gera Strommer, Avraham Broder, Dan Seter, Mordechay Mocha, Ziv Belsky, Itzhak Shmarak, Jonathan Bar Or
  • Patent number: 10892102
    Abstract: A multi-layer ceramic capacitor includes: a ceramic body including ceramic layers laminated along one axial direction, first and second internal electrodes alternately disposed between the ceramic layers, first and second end surfaces to which the first and second internal electrodes are respectively drawn, a first end margin that forms an interval between the first end surface and the second internal electrodes, and a second end margin that forms an interval between the second end surface and the first internal electrodes; and first and second external electrodes that respectively cover the first and second end surfaces and are respectively connected to the first and second internal electrodes, the multi-layer ceramic capacitor satisfying the following relationship: SE?S/400+300, where S (?m) represents an area of the ceramic body and SE (?m) represents a total area of the first and second internal electrodes in cross sections of the first and second end margins.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: January 12, 2021
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Jyouji Ariga, Katsuo Sakatsume, Masumi Ishii, Takeshi Nosaki, Norihiro Arai, Yasushi Inoue
  • Patent number: 10872726
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other with one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. The dielectric layer includes dielectric grains, a grain boundary is present between at least two dielectric grains of the dielectric grains, and a Si/Ti mole ratio in the grain boundary satisfies 15% to 40%.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: December 22, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kum Jin Park, Kwang Hee Nam, Young Bin Jeong, Myung Woo Lee, Jong Han Kim
  • Patent number: 10872727
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other with one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. The dielectric layer includes dielectric grains, a grain boundary is present between at least two dielectric grains of the dielectric grains, and a Si/Ti mole ratio in the grain boundary satisfies 15% to 40%.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: December 22, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kum Jin Park, Kwang Hee Nam, Young Bin Jeong, Myung Woo Lee, Jong Han Kim
  • Patent number: 10854388
    Abstract: A ceramic electronic component includes a ceramic body, a sintered metal film, and a metal terminal. The ceramic body includes internal electrodes. The sintered metal film has a joint surface having a surface roughness Ra of 0.200 ?m or less. The sintered metal film is connected to the internal electrodes and formed on a surface of the ceramic body. The metal terminal is jointed to the joint surface.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: December 1, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Masaki Mochigi, Kazuya Sato, Yousuke Nakada
  • Patent number: 10854385
    Abstract: A method for producing a ceramic substrate that includes a substrate body having ceramic layers and columnar projecting electrodes on a first primary surface of the substrate body. The method includes a step of preparing electrode formation sheets for forming the projecting electrodes, a step of perforating the electrode formation sheets with through holes and filling the through holes with a first electrically conductive paste containing a first electrically conductive powder, a step of building a composite multilayer body by stacking ceramic green sheets and the electrode formation sheets on a first primary surface of the stack of ceramic green sheets. The first electrically conductive powder contains electrically conductive metal(s) and anti-sintering ceramic(s) that controls the sintering of particles of the electrically conductive metal(s), with at least part of the surface of the particles of the electrically conductive metal(s) covered with the anti-sintering ceramic(s).
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: December 1, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kumiko Ishikawa, Seiji Fujita, Tsutomu Sasaki
  • Patent number: 10814493
    Abstract: A capacitive or resistive tactile sensor having a conductive membrane, a flexible dielectric or weakly conductive sheet and a substrate having electrodes, and a method of manufacturing thereof. The flexible sheet has a first surface and an opposite second surface, the first surface and the second surface are uniformly distanced when at rest. The first surface is adapted to contact one of the conductive membrane or the substrate. The second surface is adapted to contact another one of the conductive membrane or the substrate. The body defines between the first and second surfaces, at a predetermined region, a plurality of laser ablated uniform cavities that are evenly distributed and operatively identical in order to provide a known compression index at the predetermined region of the flexible sheet.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: October 27, 2020
    Assignee: ROBOTIQ INC.
    Inventors: Vincent Duchaine, Thuy Hong Loan Le, Alexis Maslyczyk, Axay Kumar Rana
  • Patent number: 10811193
    Abstract: A capacitor component includes a porous body, a first electrode layer covering surfaces of pores of the porous body, a dielectric layer covering the first electrode layer, and a second electrode layer filling the pores of the porous body and covering the dielectric layer.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: October 20, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Hoon Ryou, Hyun Ho Shin, Byeong Cheol Moon, Chang Soo Jang, Tae Joon Park, Yun Hee Kim, Kyo Yeol Lee, Seung Mo Lim
  • Patent number: 10811191
    Abstract: An element body of a rectangular parallelepiped shape has a length in a height direction larger than a length in a width direction and has a length in a longitudinal direction larger than the length in the height direction. A terminal electrode is disposed at an end of the element body in the width direction and extends in the longitudinal direction. The element body includes a pair of principle surfaces opposing each other in the height direction, a pair of end surfaces opposing each other in the longitudinal direction, and a pair of side surfaces opposing each other in the width direction. The terminal electrode includes a conductor disposed on the side surface. The conductor includes a protrusion having a length in the longitudinal direction larger than a length in the height direction.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: October 20, 2020
    Assignee: TDK CORPORATION
    Inventors: Fumiaki Satoh, Toru Onoue, Takuto Okamoto
  • Patent number: 10770229
    Abstract: A dielectric composition contains: a base material powder containing BamTiO3 (0.995?m?1.010); a first accessory ingredient containing at least one element corresponding to a transition metal in Group 5 of the periodic table in a total content of 0.3 to 1.2 moles; a second accessory ingredient containing one of ions, oxides, carbides, and hydrates of Si in a content of 0.6 to 4.5 moles; a third accessory ingredient containing at least one element in Period 4 or higher; and a fourth accessory ingredient containing at least one element in Period 3, wherein 0.70×B?C+D?1.50×B and 0.20?D/(C+D)?0.80, in which B is a total content of the second accessory ingredient, C is a total content of the third accessory ingredient, and D is a total content of the fourth accessory ingredient.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: September 8, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Hyung Kang, Hyung Kyu Kim, Jong Hyun Cho, Du Won Choi, Yong Koo Kim, Hang Kyu Cho
  • Patent number: 10762319
    Abstract: A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: September 1, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo, Ying-Cheng Tseng
  • Patent number: 10755859
    Abstract: An element body of a rectangular parallelepiped shape includes a pair of principal surfaces opposing each other in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode disposed on an end portion of the element body in the third direction. When viewed from the third direction, a width of the element body in the second direction is the largest at a central position in the first direction, and gradually decreases from the central portion in the first direction. When viewed from the third direction, a position in which a length from one end to another end of the conductive resin layer in the second direction is the largest is located closer to the one principal surface than the central position.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: August 25, 2020
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Takehisa Tamura, Ken Morita, Atsushi Takeda
  • Patent number: 10746620
    Abstract: A pressure measure sheet having a sheet shape and having a pressure measure surface, the pressure measure sheet being adapted to be arranged on a surface of a measured object, includes: a plurality of pressure measure ports provided through the pressure measure surface; at least one connection port adapted to be connected to a side of a pressure measure device; and a coupler part including a plurality of through-tubes penetrating the plurality of pressure measure ports and the at least one connection port, in which the pressure measure sheet includes a region in which the plurality of through-tubes are arrayed in nonparallel.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: August 18, 2020
    Assignees: JAPAN AEROSPACE EXPLORATION AGENCY, TOKYO FLUID RESEARCH CO., LTD.
    Inventors: Masataka Kohzai, Yuzuru Yokokawa, Kazuomi Yamamoto, Yasushi Ito, Hideo Omotani
  • Patent number: 10741328
    Abstract: A multi-layer ceramic electronic component includes: first internal electrodes each including a first main electrode and a first drawn portion extending from the first main electrode to a first end surface facing in a first direction; and second internal electrodes each including a second main electrode and a second drawn portion extending from the second main electrode to a second end surface facing the first end surface in the first direction, the first and second internal electrodes being alternately laminated, the first drawn portion having a width dimension along a second direction that decreases toward the first end surface and having a predetermined width dimension in the first end surface, the second direction being orthogonal to the first direction, the second drawn portion having a width dimension along the second direction that increases toward the second end surface and having the predetermined width dimension in the second end surface.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: August 11, 2020
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Hiroyuki Hasegawa, Takashi Ogawa
  • Patent number: 10741334
    Abstract: An apparatus and associated method for an energy-storage device (e.g., a capacitor) having a plurality of electrically conducting electrodes including a first electrode and a second electrode separated by a non-electrically conducting region, and wherein the non-electrically conducting region further includes a non-uniform permittivity (K) value. In some embodiments, the method includes providing a substrate; fabricating a first electrode on the substrate; and fabricating a second electrode such that the second electrode is separated from the first electrode by a non-electrically conducting region, wherein the non-electrically conducting region has a non-uniform permittivity (K) value. The capacitor devices will find benefit for use in electric vehicles, of all kinds, uninterruptible power supplies, wind turbines, mobile phones, and the like requiring wide temperature ranges from several hundreds of degrees C. down to absolute zero, consumer electronics operating in a temperature range of ?55 degrees C.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: August 11, 2020
    Assignee: GranBlueTech, L.L.C.
    Inventor: John P. Snyder
  • Patent number: 10710336
    Abstract: Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: July 14, 2020
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Oscar Khaselev, Bin Mo, Monnir Boureghda, Michael T. Marczi, Bawa Singh
  • Patent number: 10714260
    Abstract: A multilayer ceramic capacitor includes a body including first and second internal electrodes facing each other with respective dielectric layers interposed therebetween, and first and second external electrodes disposed on an external surface of the body and electrically connected to the first and second internal electrodes, respectively. Each of the first and second external electrodes includes a first electrode layer containing any one selected from the group consisting of TiW, TiN, and TaN, or a combination thereof, and a second electrode layer disposed on the first electrode layer.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: July 14, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Min Cho, Young Wook Kim, Seung Mo Lim, Jung Min Kim
  • Patent number: 10715926
    Abstract: A MEMS component includes a MEMS sound transducer having a membrane structure and an assigned counterelectrode structure, and a circuit unit, which is electrically coupled to the MEMS sound transducer and which in a first operating mode of the MEMS sound transducer in the audio frequency range detects an audio output signal of the MEMS sound transducer on the basis of a deflection of the membrane structure relative to the counterelectrode structure, the deflection being brought about by an acoustic sound pressure change, and in a second operating mode of the MEMS sound transducer in the ultrasonic frequency range to drive and read the MEMS sound transducer as an ultrasonic transceiver.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: July 14, 2020
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Christian Bretthauer, Pedro Augusto Borrego Lambin Torres Amaral, Christoph Glacer
  • Patent number: 10668689
    Abstract: The present invention is related to a multi-layered thermoplastic elastomer (TPE) foam. Due to a specific formulation of the multi-layered TPE foam, adjacent layers of said TPE foam can be perfectly adhered to each other without adhesive or thermocompression after foaming. The present invention is also related to a specific process for forming a multi-layered foam.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: June 2, 2020
    Inventor: Yung-Teng Lee
  • Patent number: 10658940
    Abstract: A power converter including an inverter for converting electric power output from a power supply, a first power feeding bus connected to the inverter and to the positive side of the power supply, a second power feeding bus connected to the inverter and the negative side of the power supply, and a plurality of connection circuits including a resistant member and a capacitive member which are connected in series, connected between the first power feeding bus and the second power feeding bus, and having at least two or more different impedances.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: May 19, 2020
    Assignee: NISSAN MOTOR CO., LTD.
    Inventors: Kentaro Shin, Kraisorn Throngnumchai, Tetsuya Hayashi, Akinori Okubo
  • Patent number: 10649528
    Abstract: A fabric-based item such as a fabric glove may include force sensing circuitry. The force sensing circuitry may include force sensor elements formed from electrodes on a compressible substrate such as an elastomeric polymer substrate. The fabric may include intertwined strands of material including conductive strands. Signals from the force sensing circuitry may be conveyed to control circuitry in the item using the conductive strands. Wireless circuitry in the fabric-based item may be used to convey force sensor information to external equipment. The compressible substrate may have opposing upper and lower surfaces. Electrodes for the force sensor elements may be formed on the upper and lower surfaces. Stiffeners may overlap the electrodes to help decouple adjacent force sensor elements from each other. Integrated circuits can be attached to respective force sensing elements using adhesive.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: May 12, 2020
    Assignee: Apple Inc.
    Inventors: Storrs T. Hoen, Daniel D. Sunshine, Aidan N. Zimmerman, Daniel A. Podhajny, Maurice P. May
  • Patent number: 10636549
    Abstract: An insulating sheet and a conductive terminal are provided in an electronic component, where at least one of the conductive terminals has a missing part, and where a remaining part positioned on both ends of the missing part is connected through a resistor element affixed to the insulating sheet.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: April 28, 2020
    Assignee: Molex, LLC
    Inventor: Toshihiro Niitsu
  • Patent number: 10629379
    Abstract: A capacitor component includes a body having a first surface and a second surface opposing each other and including a multilayer structure in which a plurality of dielectric layers are stacked and first and second internal electrodes are alternately disposed with respective dielectric layers interposed therebetween and exposed to the first surface and the second surface, respectively, first and second metal layers covering the first surface and the second surface and connected to the first and second internal electrodes, respectively, first and second ceramic layers covering the first and second metal layers, and first and second external electrodes covering the first and second ceramic layers and connected to the first and second metal layers to be electrically connected to the first and second internal electrodes, respectively.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: April 21, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Hyun Cho, Byeong Chan Kwon, Yong Jin Yun, Ki Pyo Hong, Jae Yeol Choi
  • Patent number: 10607784
    Abstract: A film capacitor includes a wound body in which a dielectric film and an electrode film are wound; and a pair of external electrodes provided respectively on a pair of end faces positioned in an axial direction of the wound body. The dielectric film includes an electrode-free portion provided on one end side in a width direction, continuously in a longitudinal direction of the dielectric film. The electrode film has a first projection portion on a surface on the other end side in the width direction, and the first projection portion has a string shape extending in the width direction.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: March 31, 2020
    Assignee: KYOCERA CORPORATION
    Inventor: Naoki Kikuchi
  • Patent number: 10545902
    Abstract: A device with a physical layer (PHY) core component, a PHY I/O component, a decoupling I/O component, and a decoupling core component, where the PHY core component is adjacent to the PHY I/O component, the PHY I/O component is adjacent to the decoupling I/O component, the decoupling I/O component is adjacent to the decoupling core component and is positioned a first distance away from the PHY core component, and the decoupling core component is adjacent to an edge of the device and is positioned a second distance away from the PHY core component.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: January 28, 2020
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Mark Moty Groissman, Alex Tetelbaum
  • Patent number: 10510488
    Abstract: A multilayer ceramic capacitor includes a laminated body including ceramic layers, first internal electrode layers, and second internal electrode layers alternately laminated. First and second external electrodes provided on the laminated body include first diffusion portions defined by interdiffusion of the first internal electrode layers and the first external electrode at interfaces between the first internal electrode layers and the ceramic layers, and second diffusion portions defined by interdiffusion of the second internal electrode layers and the second external electrode at interfaces between the second internal electrode layers and the ceramic layers.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: December 17, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Atsushi Yasuda
  • Patent number: 10510487
    Abstract: A method of producing a multi-layer ceramic electronic component includes: preparing a multi-layer sheet including laminated ceramic sheets, and internal electrodes disposed between the ceramic sheets; cutting the multi-layer sheet to produce a multi-layer chip having a side surface from which the internal electrodes are exposed; removing a superficial layer of the side surface of the multi-layer chip; and providing a side margin to the side surface of the multi-layer chip, the superficial layer being removed from the side surface.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: December 17, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yasunari Kato, Joji Kobayashi, Toshimitsu Kogure
  • Patent number: 10486379
    Abstract: A method for reducing the resistivity of a thermoplastic film containing carbon nanotubes includes connecting an electric power supply to the thermoplastic film containing carbon nanotubes and passing electric current through the thermoplastic film containing carbon nanotubes to heat the thermoplastic film to an elevated temperature and align carbon nanotubes within the thermoplastic film. The thermoplastic film is solid at room temperature.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: November 26, 2019
    Assignee: Goodrich Corporation
    Inventors: Jin Hu, Galdemir Cezar Botura, Casey Slane, Nathaniel Ching
  • Patent number: 10490356
    Abstract: A capacitor includes a body including a substrate and a capacitance layer disposed on the substrate. The substrate includes a plurality of first trenches penetrating from one surface of the substrate to an interior of the substrate, and a first capacitor layer disposed on the one surface of the substrate and in the first trenches. The first capacitor layer includes a first dielectric layer and first and second electrodes disposed on opposing sides thereof. The capacitance layer includes a plurality of second trenches penetrating from one surface of the capacitance layer to an interior of the capacitance layer, and a second capacitor layer disposed on the one surface of the capacitance layer and in the second trenches. The second capacitor layer includes a second dielectric layer and third and fourth electrodes disposed on opposing sides thereof. A method of manufacturing the capacitor is also provided.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: November 26, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Hoon Ryou, Dong Sik Yoo, Seung Hun Han, No Il Park, Seung Mo Lim, Hyun Ho Shin
  • Patent number: 10483828
    Abstract: An electric motor includes a plurality of SMD components arranged on a carrier of the motor, and a connection part for the SMD components together with an electrically conductive housing part of the motor. A contact spring electrically connects a plurality of SMD components to the housing part. The contact spring has a main section, a spring-type connection section that extends outwards from one side of the main section, and at least one spring-type contact section that extends outwards from the other side of the main section. The spring-type connection section of the contact spring includes a plurality of contact fingers for the SMD components.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: November 19, 2019
    Assignee: Continental Automotive GmbH
    Inventors: Werner Wallrafen, Daniel Muresan