Abstract: An artificial muscle actuator that includes a housing, a dielectric fluid housed within the housing, and an electrode pair positioned in the housing. The electrode pair includes a first electrode and a second electrode. The first electrode and the second electrode each include a metal film. The first electrode includes an insulation bilayer disposed on the metal film of the first electrode in an orientation facing the second electrode. In addition, the insulation bilayer includes an acryl-based polymer layer disposed on the metal film and a biaxially oriented polypropylene (BOPP) layer disposed on the acryl-based polymer layer.

Abstract: A multilayer capacitor includes: a body including internal electrodes stacked in a first direction; and first and second external electrodes disposed on the body. A portion of the first external electrode overlaps the body in the first direction and does not overlap a remainder of the first external electrode in the first direction. A portion of the second external electrode overlaps the body in the first direction and does not overlap a remainder of the second external electrode in the first direction. At least one of the external electrodes includes: a second electrode layer covering a first electrode layer, which covers one portion of an edge of the body. A width W1 of a portion of the first electrode layer, closest to the one portion of the edge, is narrower than a width W2 of an end of the second electrode layer, farthest from the first electrode layer.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric ceramic layers and internal electrode layers laminated alternately in a lamination direction, and a pair of external electrodes on both end portions in the length direction of the multilayer body and respectively connected to the internal electrode layers. The pair of external electrodes each include a base region covering at least each of the first and second end surfaces, connected to the internal electrode layers, and including Cu as a main component, a cover region on the base region to cover the base region, and including Ag as a main component, and a reaction region between the base region and the cover region including Cu included in the base region and Ag included in the cover region reacting with each other.

Abstract: A multilayer ceramic capacitor includes end-surface external electrodes and side-surface external electrodes. The end-surface external electrodes are respectively provided at end surfaces of a multilayer body and are respectively connected to end-surface connecting internal electrodes. The side-surface external electrodes are respectively provided at the side surfaces of the multilayer body and respectively connected to side-surface connecting internal electrodes. The end-surface connecting internal electrodes each include end surface opposing portion opposing the side-surface connecting internal electrode 15B adjacent in a lamination direction, and an end surface lead-out portion extending from the end surface opposing portion to one of the end-surface external electrodes.

Abstract: A broadband multilayer ceramic capacitor may include a first external terminal and a second external terminal. A bottom portion of the first external terminal may be spaced apart from a bottom portion of the second external terminal by a bottom external terminal spacing distance. A first active electrode layer may include a first active electrode connected with the first external terminal and a second active electrode connected with the second external terminal and co-planar with the first electrode. A second active electrode layer may include a third active electrode connected to the first external terminal and a fourth active electrode connected to the second external terminal and co-planar with the fourth electrode. The first active electrode may overlap the fourth active electrode in the longitudinal direction. A ratio of a length of the capacitor to the bottom external terminal spacing distance may be greater than about 4.

Abstract: A multilayer ceramic capacitor includes a multilayer body, and external electrodes on a portion of a side surface portion including four side surface of the multilayer body, and on a portion of a first main surface of the multilayer body. The first main surface includes first regions covered with the external electrodes and a second region exposed from the external electrodes. The first regions of the first main surface each include recesses therein. The recesses in each of the first regions each include a spherical curved wall surface. The recesses in each of the first regions each have an average inlet size of about 0.3 ?m or more and about 10.5 ?m or less.

Abstract: A method of manufacturing a filtered feedthrough assembly for use with an implantable medical device. The method may include gold brazing an insulator to a flange at first braze joint, and gold brazing a plurality of feedthrough wire to the insulator at second braze joints. The method may further include applying a first non-conductive epoxy to the first braze joint, and applying a second non-conductive epoxy to the second braze joint. The method may further include grit blasting a face of the flange, applying a conductive epoxy to the face of the flange, and attaching an EMI filter to the conductive epoxy such that it is grounded to the flange via the conductive epoxy and not via the first braze joint or the second braze joints.

Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.

Abstract: A component carrier with a first component carrier structure including a first stack which has at least one first electrically conductive layer structure and at least one first electrically insulating layer structure is disclosed. The at least one first electrically conductive layer structure has a first contact element which extends up to a first contact surface of the first stack. An electrically conductive connection medium is directly connected to the first contact element at the first contact surface by filling at least one recess of the first contact element. The at least one recess having a larger dimensioned cavity delimited by a smaller dimensioned surface profile.

Abstract: A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated in a first direction, a first main surface including a first flat region facing in the first direction, and a second main surface including a second flat region facing in the first direction; and a pair of external electrodes connected to the internal electrodes and facing each other in a second direction orthogonal to the first direction, a dimension of the ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the ceramic body in a third direction orthogonal to the first and second directions, the first flat region being formed at a center portion of the first main surface in the second direction, the second flat region being formed at a center portion of the second main surface in the third direction.

Abstract: A multilayer capacitor includes a body including a dielectric layer and a plurality of internal electrodes stacked on each other having the dielectric layer interposed therebetween; and external electrodes including electrode layers positioned externally on the body and connected to the internal electrodes, respectively, wherein the body includes a first surface and a second surface, opposing each other, and to which the plurality of internal electrodes are respectively exposed, and a third surface and a fourth surface which are connected to the first surface and the second surface, and oppose each other in a direction in which the plurality of internal electrodes are stacked on each other, each of the electrode layers including a first region covering the first or second surface and a second region covering the third or fourth surface and having surface roughness lower than that of the first region.

Abstract: A multi-layer ceramic electronic component includes a multi-layer ceramic electronic component main body including a multi-layer body including stacked ceramic layers, stacked internal electrode layers, first and second main surfaces, first and second side surfaces, and first and second end surfaces, first and second external electrodes respectively on sides where the first and second end surfaces are located, and first and second metallic terminals respectively connected to the first and second external electrodes. The multi-layer ceramic electronic component main body and at least portion of the first and second metallic terminals are covered with an external material. The second main surface is connected to the metallic terminals. The first and second external electrodes cover a portion of the second main surface. A gap is provided between the multi-layer body and tips of the first and second external electrodes. The external material is in the gap.

Abstract: A ceramic electronic component includes: a ceramic body including main surfaces perpendicular to a first axis and end surfaces perpendicular to a second axis; and external electrodes covering the end surfaces and extending from the end surfaces to the main surfaces. The external electrode includes a surface layer portion including a Sn plating layer, and an inner layer portion including a Ni plating layer adjacent to the Sn plating layer and including rounded inner end portions on the main surfaces. In a cross-section perpendicular to a third axis, a ratio t2/t1 is 0.4 or more, where t2 is a thickness in the first axis direction of a portion where an inclination of a tangent line of an outer surface of the inner end portion to each main surface is 45°, and t1 is a maximum thickness in the first axis direction of the inner layer portion on each main surface.

Abstract: A ceramic electronic component includes an element body and at least one external electrode formed on the element body. The element body includes a dielectric and at least one internal electrode therein. The element body has a plurality of surfaces, and these surfaces include a first surface and a second surface opposite the first surface. Each external electrode includes a base layer and a plating layer formed on the base layer. The base layer is in contact with the internal electrode, contains a metal, and has a first end face adjacent to an outer periphery of the second surface of the element body. The plating layer has a second end face adjacent to an outer periphery of the first end face such that the first and second end faces form, in combination, a multilayer structure on the outer periphery of the second surface of the element body.

Abstract: A self-centering washer is positioned between the feedthrough and filter capacitor of a filtered feedthrough. The washer has openings through which first and second terminal pins extend. A first opening has an inner arcuate portion contacting the first terminal pin and an outer perimeter portion exposing the braze sealing the terminal pin to the insulator. A second opening has an inner arcuate portion contacting the second terminal pin and an outer perimeter portion exposing the braze sealing the terminal pin to the insulator. In an imaginary configuration with the first and second washer openings superimposed one on top of the other, the cumulative arcuate distance of the inner arcuate portions about one of the terminal pins, subtracting overlap, results in a gap between the superimposed washer openings that is less than a diameter of the first and second terminal pins so that the washer is prevented from lateral movement.

Abstract: A method to produce a multilayer ceramic electronic component includes forming supports by an ink jet printing method to produce a green multilayer ceramic capacitor. A green ceramic layer and outer electrodes of the multilayer ceramic electronic component are formed by the ink jet printing method while the supports define peripheries of the green ceramic layer and the outer electrodes. When fired, the green multilayer ceramic electronic component is converted to a sintered multilayer ceramic electronic component, and the supports disappear by heating.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrodes alternately laminated therein, and two end surfaces opposing each other in a length direction, and two side surfaces opposing each other in a width direction, and two external electrodes respectively on the two end surfaces of the multilayer body. At least one of two opposed main surfaces of the multilayer ceramic capacitor includes raised portions provided respectively on one side and another side with a middle portion of the main surface interposed therebetween. The raised portions are each raised to become thicker in the lamination direction from the middle portion toward an outer periphery of the main surface.

Abstract: A ceramic electronic device includes an element body and an external electrode. The element body is formed by laminating a ceramic layer and an internal electrode layer. The external electrode is electrically connected to at least one end of the internal, electrode layer. The element body includes a boundary layer at an end of the ceramic layer. The ceramic layer includes a perovskite compound represented by ABO3 as a main component. The boundary layer includes Ba and Ti as a main component. The boundary layer includes 0.27-0.40 parts by mol of Ba, provided that a total of Ba and Ti included in the boundary layer is 1 part by mol.

Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and internal electrodes alternately disposed with the dielectric layers interposed therebetween; and an external electrode disposed on the capacitor body to be connected to one or more of the internal electrodes. Porosity of ends of the internal electrodes is less than 50% on an interfacial surface between a margin of the capacitor body in a width direction the capacitor body and the internal electrodes.

Abstract: An electronic component includes a substrate and side wires. The substrate includes a first major surface, a second major surface, and a side surface. The side wires are on the side surface of the substrate and spaced apart from each other in a direction along an outer periphery of the substrate when viewed in plan in a thickness direction of the substrate. At least a portion of each of the side wires is provided indirectly on the side surface of the substrate. The electronic component further includes an electrically insulating layer interposed between the side surface of the substrate and the at least a portion of each of the side wires. Each of the side wires includes a bent portion bent when viewed in plan in the thickness direction of the substrate.

Abstract: A multilayer electronic component includes: a body including an active portion including internal electrodes disposed alternately with dielectric layers and cover portions disposed on upper and lower surfaces of the active portion; and external electrodes including an electrode layer disposed on the body, and an average thickness of the cover portion is 14 to 17 ?m and a maximum thickness of the electrode layer is 5 to 20 ?m.

Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the pair of multilayer body main surfaces in the vicinity of the board. The interposer board is an alumina board. The board end surfaces each include a metal layer including a Zn-containing layer and a Cu layer on an outer periphery of the Zn-containing layer.

Abstract: A coil component includes a support substrate, a body having a first surface and a second surface opposing each other and having the support substrate disposed therein, a coil portion disposed on at least one surface of the support substrate and having an end of an outermost turn disposed closer to the first surface of the body than the second surface of the body, and a lead-out portion having a first surface connected to the end of the outermost turn and a second surface opposing the first surface of the lead-out portion and exposed to the first surface of the body. An area of the first surface of the lead-out portion is greater than an area of the second surface of the lead-out portion.

Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. One of the board main surfaces is in a vicinity of the electronic element and joined with a multilayer body main surface in a vicinity of the interposer board. The interposer board is an alumina board. At least one notch is in end regions including a board end surface, a board side surface in a vicinity thereof, a board main surface in a vicinity thereof, ridge portions between the board end surface and the board side surface, between the board end surface and the board main surface, and between the board side surface and the board main surface, and a corner portion between the board end surface, the board side surface, and the board main surface.

Abstract: A circuit board structure includes a circuit substrate having opposing first and second sides, a redistribution structure disposed at the first side, and a dielectric structure disposed at the second side. The circuit substrate includes a first circuit layer disposed at the first side and a second circuit layer disposed at the second side. The redistribution structure is electrically coupled to the circuit substrate and includes a first leveling dielectric layer covering the first circuit layer, a first thin-film dielectric layer disposed on the first leveling dielectric layer and having a material different from the first leveling dielectric layer, and a first redistributive layer disposed on the first thin-film dielectric layer and penetrating through the first thin-film dielectric layer and the first leveling dielectric layer to be in contact with the first circuit layer. The dielectric structure includes a second leveling dielectric layer disposed below the second circuit layer.

Abstract: A capacitive pressure transducer includes a shielded spacer positioned between the capacitor electrodes and driven with a separate voltage source.

Abstract: A capacitor includes: a capacitor element; a pair of external electrodes provided at opposite ends of the capacitor element; and a pair of metal caps and or a metal foil, the pair of metal caps each covering a corresponding one of the pair of external electrodes, the metal foil covering at least part of the capacitor element.

Abstract: Various techniques and apparatus permit fabrication of superconductive circuits. A niobium/aluminum oxide/niobium trilayer may be formed and individual Josephson Junctions (JJs) formed. A protective cap may protect a JJ during fabrication. A hybrid dielectric may be formed. A superconductive integrated circuit may be formed using a subtractive patterning and/or additive patterning. A superconducting metal layer may be deposited by electroplating and/or polished by chemical-mechanical planarization. The thickness of an inner layer dielectric may be controlled by a deposition process. A substrate may include a base of silicon and top layer including aluminum oxide. Depositing of superconducting metal layer may be stopped or paused to allow cooling before completion. Multiple layers may be aligned by patterning an alignment marker in a superconducting metal layer.

Abstract: A Dynamic Random Access Memory (DRAM) capacitor and a preparation method therefor are provided. The DRAM capacitor includes a dielectric layer, and the dielectric layer includes a high dielectric material layer, and low dielectric loss material layers provided on both side surfaces of the high dielectric material layer.

Abstract: A multilayer ceramic capacitor includes a laminate and an external electrode connected to the internal electrode layer. The laminate includes a central layer portion in which an internal electrode layer and a dielectric ceramic layer are alternately laminated, and a covering portion covering an outer surface of the central layer portion in the lamination direction and the width direction. A region where the main surface meets the lateral surface in the laminate is defined as a corner portion that is rounded, and a distance from the corner portion to an internal electrode closest to the corner portion is about 20 ?m or less.

Abstract: A method of producing an all-solid-state battery includes forming an insulating layer-attached stack unit including an insulating layer and a stack unit that includes a positive electrode layer, a solid electrolyte layer and a negative electrode layer; performing a dielectric breakdown test on the insulating layer included in the insulating layer-attached stack unit, and determining that the insulating layer-attached stack unit is a non-defective product if no dielectric breakdown is present; forming an electrode member having both ends by disposing the two insulating layer-attached stack units at the both ends, the insulating layer-attached stack unit being determined to be a non-defective product; accommodating the electrode member in a case; and assembling a restraint member to the outside of the case to produce an all-solid-state battery.

Abstract: Disclosed is a broadband capacitor in which an electrode unit comprises a main electrode and a plurality of side electrodes so as to facilitate changing of capacitance value. The disclosed broadband capacitor is formed by alternately stacking a first electrode set, which comprises a first main electrode and a plurality of side electrodes spaced apart from the first main electrode, and a second electrode set, which comprises a second main electrode and a plurality of side electrodes spaced apart from the second main electrode.

Abstract: A multilayer ceramic capacitor includes a multilayer body including first inner electrodes and second inner electrodes stacked in layers and dielectric layers, the multilayer body including a first outer electrode receiving portion at one end thereof in one direction, a second outer electrode receiving portion at the other end thereof in the one direction, and a main portion between the first and second outer electrode receiving portions, a first outer electrode over the first outer electrode receiving portion, and a second outer electrode over the second outer electrode receiving portion. A level difference exists at a boundary between the main portion and the first outer electrode receiving portion and at a boundary between the main portion and the second outer electrode receiving portion. An area of a cross section at a central position of the main portion in the one direction is greater than areas of cross sections at a position of the first outer electrode and at a position the second outer electrode.

Abstract: Presented herein are implantable medical devices that include an insulator extending through a hermetically-sealed biocompatible housing. A plurality of feedthrough pins, which include at least a first feedthrough pin, a second feedthrough pin, and at least one ground feedthrough pin extend through the insulator. An electrically shielding member is disposed at the outer surface of the insulator so as to provide a grounding barrier between the first and second feedthrough pins.

Abstract: A multilayer capacitor includes: a capacitor body including dielectric layers and first and second internal electrodes, and having first to six surfaces; first and second side portions disposed on the fifth and sixth surfaces of the capacitor body, respectively, and having roughnesses on surfaces thereof; a first external electrode disposed on the third surface of the capacitor body and parts of the first and second side portions and connected to the first internal electrodes; and a second external electrode disposed on the fourth surface of the capacitor body and parts of the first and second side portions and connected to the second internal electrodes.

Abstract: A ceramic electronic component includes an element body including a dielectric and internal electrodes; a pair of external electrodes respectively formed on side surfaces of the element body, each of the external electrodes including a base layer and a plating layer formed on at least a part of the base layer, the base layer of each of the external electrodes containing metal and being formed to continuously cover a portion of a lower surface of the element body and the corresponding side surface of the element body connected to the lower surface, the base layer of each of the external electrodes being electrically connected to one or more of the internal electrodes; and an insulating layer formed on an upper surface of the element body, the insulating layer having a thickness that is less than a thickness of the plating layer of each of the external electrodes.

Abstract: A multilayer capacitor includes a capacitor body having first to sixth surfaces, including a plurality of first and second dielectric layers and a plurality of internal electrodes stacked; and first and second external electrodes. The internal electrode includes first and second internal electrodes, a first floating electrode disposed between the first and second internal electrodes on the first dielectric layer, and second and third floating electrodes disposed on the second dielectric layer. The second floating electrode overlaps a portion of the first internal electrode and a portion of the first floating electrode, and the third floating electrode overlaps a portion of the second internal electrode and a portion of the first floating electrode. a/L is 0.113 or more, in which L is a length of the capacitor body, and a is a distance between the first floating electrode and the first or second internal electrodes.

Abstract: A polycarbonate-polysiloxane includes specific amounts of first carbonate units having the structure wherein R1 is a C6-C16 divalent aromatic group, second carbonate units having the structure wherein R2 is a C17-C40 divalent aromatic group having the structure wherein Rf, Rg, Rh, Ri, Rj, Rk, Xb, j, m, n, x, and y are defined herein. The polycarbonate-polysiloxane is useful for forming thin extruded films, which in turn are useful for fabricating electrostatic film capacitors.

Abstract: A stacked capacitor includes a capacitor stack. The capacitor stack includes a base plate having a first surface and a second opposing surface, a first dielectric layer on or over the base plate, and a first conductive plate on or over the first dielectric layer. A second dielectric layer is on or over the first conductive plate. A second conductive plate on or over the second dielectric layer. The capacitor stack has at least one sloped side with at least one slope with respect to the second surface of the base plate.

Abstract: A capacitor component includes a body having a first surface and a second surface opposing each other and including a multilayer structure in which a plurality of dielectric layers are stacked and first and second internal electrodes are alternately disposed with respective dielectric layers interposed therebetween and exposed to the first surface and the second surface, respectively, first and second metal layers covering the first surface and the second surface and connected to the first and second internal electrodes, respectively, first and second ceramic layers covering the first and second metal layers, and first and second external electrodes covering the first and second ceramic layers and connected to the first and second metal layers to be electrically connected to the first and second internal electrodes, respectively.

Abstract: A capacitor component includes: a body including a dielectric layer and an internal electrode layer; and an external electrode disposed on the body, and connected to the internal electrode layer. A surface color of the body is R?30, G?30, B?40 based on R/G/B, and a dielectric constant of the dielectric layer is 2000 or more and 4000 or less.

Abstract: An element body is formed with a through hole to be open at a first main surface and a second main surface opposing each other. A through-conductor includes a first portion located inside the through hole and a second portion protruding from the second main surface. A case surrounds the element body and is electrically insulating. A cover surrounds the second portion and is electrically insulating. A first resin is contained in the case and coats the element body. A second resin is contained in the cover and is located in a space between an inner surface of the element body and the first portion. The second resin has an electrical resistivity less than an electrical resistivity of the first resin.

Abstract: A capacitor integrated structure, a capacitor unit and a manufacturing process thereof are provided. The manufacturing process of capacitor units includes the steps of: forming a plurality of capacitor stacking structures on a substrate having an insulation layer thereon; performing a first cut on insulation dividers provided between the adjacent capacitor stacking structures to form a plurality of recesses that expose first conductive portion and second conductive portion of each of the capacitor stacking structures; filling a metallic material in the recesses to form a plurality of metallic dividers that are electrically connected to the first conductive portion and the second conductive portion of each of the capacitor stacking structures; performing a second cut on the metallic dividers to form a plurality of independent capacitor units; and forming metallic walls on two opposite sides of each of the capacitor units, so as to provide a capacitor unit having two end electrodes.

Abstract: A modified Ni—Ti—Ta dielectric material for multi-layer ceramic capacitor (MLCC) and a low-temperature preparation method thereof are provided. By using characteristics that radii of the Cu2+ ion and (Al1/2Nb1/2)4+ ion are close to those of Ni and Ti elements, respectively, Cu2+, Al3+ and Nb5+ ions are introduced into a Ni0.5Ti0.5TaO4 matrix for partial substitution, a negative temperature coefficient of dielectric constant of ?220±30 ppm/° C. is provided while a sintering temperature is significantly reduced, and deterioration factors of loss caused by sintering aids is reduced, so that the dielectric material applied to radio frequency MLCC with low loss, low cost and good process stability is prepared.

Abstract: A ceramic electronic device includes a multilayer structure in which each of a plurality of internal electrode layers and each of three or more of dielectric layers of which a main component is ceramic are alternately stacked. The three or more of dielectric layers include Sn. A dielectric layer having a smaller Sn concentration is closer to an outermost end in a stacking direction than a dielectric layer having a larger Sn concentration and being located on a center side of the stacking direction, in a relationship of at least two of the three or more of dielectric layers.

Abstract: A multilayer electronic component includes a body including a plurality of internal electrodes and a dielectric layer disposed between the plurality of internal electrodes; and an external electrode disposed on the body and connected to the plurality of internal electrodes, wherein each of the plurality of internal electrodes includes a plurality of nickel layers, and a heterogeneous material layer provided between the plurality of nickel layers.

Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode layer; and an external electrode disposed on one surface of the body, wherein the external electrode includes first electrode layers disposed on the one surface of the body to be spaced apart from each other, and covering a region of the one surface of the body through which the internal electrode layer is exposed; a second electrode layer including a base resin and a conductive connection portion disposed in the base resin, and disposed on the one surface of the body to cover the first electrode layers; and an intermetallic compound disposed only between each of the first electrode layers and the second electrode layer.

Abstract: In a metallized film 1, n electrode portions 20, which are metal deposition portions, are formed in parallel on one surface of a dielectric film 2 having a film width corresponding to n capacitor elements, n being an even number of 2 or more. Each electrode portion 20 is provided with a plurality of inclined margins 31 and 32, which are metal non-deposition portions extending at an angle with respect to a film width direction, at a regular interval in a film length direction. Across a center line Lc virtually extending in the film length direction at the center in the film width direction, the inclined margins 31 of the electrode portion 20 located on one side in the film width direction, and the inclined margins 32 of the electrode portion 20 located on the other side in the film width direction are inclined in opposite directions so as to be line-symmetric with respect to the center line Lc.

Abstract: Relatively low noise capacitors are provided for surface mounted applications. Electro-mechanical vibrations generate audible noise, which are otherwise relatively reduced through modifications to MLCC device structures, and/or their mounting interfaces on substrates such as printed circuit boards (PCBs). Different embodiments variously make use of flexible termination compliance so that surface mounting has reduced amplitude vibrations transmitted to the PCB. In other instances, side terminal and transposer embodiments effectively reduce the size of the mounting pads relative to the case of the capacitor, or a molded enclosure provides standoff, termination compliance and clamping of vibrations.

Abstract: Disclosed herein is an electrochemical device forming a chip-capacitor or a super-capacitor. The electrochemical device includes: a ceramic substrate having a nonconductive ceramic layer, a current collecting layer disposed on a nonconductive ceramic layer and made of ceramic or cermet, and a metal layer arranged on outer surfaces of the nonconductive ceramic layer and the current collecting layer; an electrode having a positive electrode and a negative electrode and formed on the current collecting layer; and a nonconductive ceramic packaging module located on the ceramic substrate to accommodate electrolyte therein, wherein the metal layer is exposed to the outside of the nonconductive ceramic packaging module.