Abstract: A ceramic electronic device includes a multilayer chip in which internal electrode layers are alternately stacked with dielectric layers, respectively, and are exposed alternately at a first surface and a second surface of the multilayer chip, wherein, in a capacity section in which the internal electrode layers exposed at the first and second surface overlap each other as viewed in the stacking direction, the dielectric layers are at least three dielectric layers, each dielectric layer including Sn, wherein a dielectric layer having a smaller Sn concentration is closer to an outermost end in the stacking direction than is a dielectric layer having a larger Sn concentration which is located at a center area in the stacking direction, in a relationship of at least two of the at least three dielectric layers in the capacity section.

Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other and third and fourth surfaces connected to the first and second surfaces and opposing each other, the body including dielectric layers and internal electrodes interposed between the dielectric layers, and an external electrode disposed on the body to be connected to the internal electrodes. The external electrode includes first and second plating layers respectively covering the third and fourth surfaces, a first electrode layer covering portions of the first and second surfaces and having one side surface in contact with one side surface of the first plating layer, a second electrode layer covering the portions of the first and second surfaces and having one side surface in contact with one side surface of the second plating layer, and third and fourth plating layers respectively covering the first and second plating layers.

Abstract: A multilayer ceramic capacitor includes an external electrode including an underlying electrode layer, a lower plating layer on the underlying electrode layer at a first end surface and a second end surface, and an upper plating layer on the lower plating layer. The underlying electrode layer is a thin film electrode including at least one selected from Ni, Cr, Cu, and Ti. The lower plating layer is a Cu plating layer including a lower layer region located closer to the multilayer body and an upper layer region located between the lower layer region and the upper plating layer, and the Cu plating layer in the lower layer region has a metal grain diameter smaller than that of the Cu plating layer located in the upper layer region.

Abstract: A multilayer ceramic electronic component includes a ceramic body including ceramic layers stacked in a first axis direction and internal electrodes disposed between the plurality of ceramic layers and alternately led out to respective sides along a second axis direction orthogonal to the first axis direction, and external electrodes connected to the internal electrodes and opposed to each other in the second axis direction across the ceramic body. The internal electrodes include first and second peripheral internal electrodes collectively disposed in first and second peripheral portions at respective outer sides in the first axis direction, respectively and central internal electrodes collectively disposed closer to a center in the first axis direction than the first and second peripheral internal electrodes, and each of the first and second peripheral internal electrodes has a higher content ratio of ceramic particles than each of the central internal electrodes.

Abstract: A wireless power transfer system is provided. The wireless power transfer system comprises a resonator comprising a capacitor. The capacitor comprises at least two active electrodes; and a passive electrode adjacent the active electrodes and configured to encompass the active electrodes to at least partially eliminate environmental influences affecting the active electrodes and to increase the overall capacitance of the system. The resonator further comprises at least one inductive coil electrically connected to the active electrodes, wherein the resonator is configured to extract power from a generated electric field via resonant electric field coupling.

Abstract: Provided is a heat dissipating capacitor comprising internal electrodes of opposing polarity forming a capacitive couple between external terminations. A dielectric is between the internal electrodes. The heat dissipating capacitor comprises at least one thermal dissipation layer and at least one thermal conductive termination wherein the thermal dissipation layer is in thermally conductive contact with the thermal conductive termination.

Abstract: A ceramic electronic device includes a multilayer chip in which dielectric layers and internal electrode layers are alternately stacked. In an outermost one of the internal electrode layers, a metal oxide containing a main component element constituting the internal electrode layers is provided on an outer main surface of the outermost one, and a formation depth of the metal oxide is 0.5 ?m or more and 5.0 ?m or less. A segregation layer containing a sub metal element different from the main component metal is present at an interface between at least one of the internal electrode layers other than the outermost one and one of the dielectric layers adjacent to the at least one of the internal electrode layers.

Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers and external electrodes disposed on the body and connected to the internal electrodes. The one of the internal electrodes includes Ni, Ba, Ti, O, and Tb, and a content of Tb relative to a sum of contents of Ni, Ba, Ti, O, and Tb is 0.45 to 3.0 wt %.

Abstract: A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and an internal electrode, alternately disposed in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion opposing each other in the first direction; and an external electrode disposed outside the body and connected to the internal electrode, wherein the cover portion contains fluorine (F), and A1 and A2 satisfy A2>A1, where A1 is an average size of a dielectric grain included in the cover portion, and A2 is an average size of a dielectric grain included in the dielectric layer.

Abstract: A multilayer ceramic capacitor includes ceramic layers, internal electrodes, opposed principal surfaces, opposed end surfaces, and opposed side surfaces, and external electrodes on a surface of the capacitive body. The external electrodes include Ni and Sn, and have a C-shape on the end surface of the capacitive body and the principal surfaces when a section parallel to the side surfaces is viewed, the C-shape external electrodes include a first region and a second region completely surrounding the first region, an area of Sn is greater than or equal to about 90% with respect to a total of an area of Ni and the area of Sn, and in the first region, the area of Sn is less than about 90% with respect to the total of the area of Ni and the area of Sn appearing in a measurement region.

Abstract: Cold-sprayed aluminum capacitors on lead frame metal foils are provided for applications in 3D power package integration. This additive manufacturing process allows pre-patterned low-temperature processing of aluminum electrodes on metal lead frames, insulated metal substrates or even heat-spreaders and cold-plates. Cold-sprayed capacitors can eliminate several process integration and reliability issues that are associated with traditional discrete surface-assembled capacitors.

Abstract: Described methods and systems user to manually activate or engage the pump from a remote location and/or to monitor the state of the sump pump (e.g., the water level, the pump condition, pipe conditions, etc.) when located at a remote location relative to the sump pump. A sump pump system may implement sensors configured to detect motion or acceleration of a sensor disposed in water in the sump basin or disposed on a sump pump or pipe. The sump pump system may analyze data from these sensors to identify diagnostic metrics or values that are transmitted to a user's user interface device, thereby notifying a user of conditions such as a stuck impeller, a blocked pipe, a dry pumping pump, etc.

Abstract: A ceramic electronic component includes an element body having a dielectric and internal electrodes, the element body having an upper surface, a lower surface, and side surfaces; external electrodes formed on multiple surfaces of the element body, and an oxide layer formed on the upper surface of the element body. Each of the external electrodes has a base layer and a plating layer, the base layer containing metal and having a lower part formed on the lower surface of the element body and a side part formed on one of the side surfaces of the element body and being connected to one or more of the internal electrodes, the plating layers being formed on the lower part of the corresponding base layer. The oxide layer has a surface roughness Ra that is equal to or greater than 0.20 micrometers.

Abstract: A multilayer ceramic capacitor includes dielectric layers and internal electrode layers. Internal electrode layers adjacent to a first main surface define first main surface-side internal electrode layers, and internal electrode layers adjacent to the second main surface define second main surface-side internal electrode layers, first solid solution layers including a second metal as a solid solution is provided at interfaces between the first main surface-side internal electrode layers and the dielectric layers, the interfaces being in the first main surface-side internal electrode layers, and second solid solution layers including the second metal as a solid solution is provided at interfaces between the second main surface-side internal electrode layers and the dielectric layers, the interfaces being in the second main surface-side internal electrode layers. A concentration of the second metal in the second solid solution layer is higher than that of the second metal in the first solid solution layer.

Abstract: A multilayer ceramic electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the exterior of the body. The dielectric layer includes a plurality of dielectric grains and a grain boundary present between the dielectric grains. A molar ratio (Al/Ti) of Al and Ti included in the grain boundary satisfies 0.022 to 0.028.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a capacitor over a substrate. The capacitor includes a plurality of conductive layers and a plurality of dielectric layers. The plurality of conductive layers and dielectric layers define a base structure and a first protrusion structure extending downward from the base structure towards a bottom surface of the substrate. The first protrusion structure comprises one or more surfaces defining a first cavity. A top of the first cavity is disposed below the base structure.

Abstract: A ceramic electronic device includes a multilayer structure having a substantially rectangular parallelepiped shape, a first cover layer, and a second cover layer that is provided on a second end of the multilayer structure in the stacking direction, a main component of the second cover layer being ceramic, a porosity of the second cover layer being higher than that of the first cover layer. Q=(A+B)/2C×100(%) is 0.5% or more and 1.6% or less, when, at an interface of the second cover layer on a side of the first cover layer, two heights of curvature portions of both ends of the interface are respectively a height A and a height B, and a shortest height from the first cover layer to the second cover layer is a height C.

Abstract: A multilayer ceramic capacitor includes a substantially rectangular parallelepiped multilayer body including dielectric ceramic layers and internal electrode layers laminated alternately in the lamination direction, first and second main surfaces opposed to each other in the lamination direction, first and second lateral surfaces opposed to each other in the width direction orthogonal or substantially orthogonal to the lamination direction, and first and second end surfaces opposed to each other in the length direction orthogonal or substantially orthogonal to the lamination direction and the width direction, and a pair of external electrodes at both ends of the multilayer body in the length direction to cover at least the first and second end surfaces, and connected to the internal electrode layers. A first protrusion is provided at each of four corners on a surface of at least one of the first and second main surfaces having a substantially rectangular shape.

Abstract: A capacitor structure and a power convertor are provided by the present disclosure. The capacitor structure includes a housing and at least one core arranged inside the housing, and two electrodes of the capacitor structure are respectively led out from two ends of the housing. Thus, the pole piece required in a case that electrodes are led from the same end of the housing is omitted, thereby saving material cost. Besides, the housing and the core are respectively hollow structures, and the internal heat of the capacitor structure can be ventilated and dissipated through the corresponding hollow part, thereby improving the heat dissipation performance of the capacitor structure. In addition, by arranging the fin heat dissipation teeth on the housing, the heat dissipation area can be increased to further improve the heat dissipation efficiency.

Abstract: An energy storage system and energy storage module for providing electrical energy to a generator start energy system or other electrically driven system. One or more ultracapacitors are included within the energy storage module for storing and providing electrical charge via a two-post electrical connection of the energy storage module. A mountable housing of the energy storage module provides a variety of mounting orientations within a compartment of the generator start energy system or other electrically driven system.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; an external electrode disposed on the body; and a bonding layer disposed between the body and the external electrode. The bonding layer has a thickness less than a thickness of the external electrode.

Abstract: A flexible printed circuit board (FPCB) including a pattern circuit layer. The pattern circuit layer has a pattern fuse embedded therein, and the pattern fuse includes a first conductive wire made of a metal and having a spiral structure, and a second conductive wire made of a metal and having a spiral structure. The first conductive wire and the second conductive wire have a double helix structure.

Abstract: A multilayer capacitor includes a body including a dielectric layer and first and second internal electrodes stacked on each other and having the dielectric layer interposed therebetween; a pair of first external electrodes respectively disposed on first and second corners of the body, which are not adjacent to each other, and connected to the first internal electrode; a pair of second external electrodes respectively disposed on third and fourth corners of the body, which are not adjacent to each other, and connected to the second internal electrode; and a reinforcing portion disposed on a surface of the body, not covered by at least one of the first and second external electrodes, and including a sintered ceramic body.

Abstract: A method of producing a multilayer ceramic electronic component includes a lamination step of producing a laminate by laminating green sheets each with an internal electrode layer formed thereon, an isotropic pressing step of subjecting the laminate to isotropic pressing, a flattening step of shaving one or both of main surfaces of the isotropic pressed laminate to flatten the one or both of the main surfaces of the laminate, and a rigid pressing step of pressing the flattened laminate from both of the main surfaces with a rigid body on each of the main surfaces.

Abstract: A multilayer ceramic capacitor that includes a ceramic body including a stack of a plurality of dielectric layers and a plurality of first and second internal electrodes; and first and second external electrodes provided at each of both end faces of the ceramic body. Each of the plurality of dielectric layers contain Ba, Ti, P and Si. The plurality of dielectric layers include an outer dielectric layer located on an outermost side in the stacking direction; an inner dielectric layer located between the first and second internal electrodes; and a side margin portion in a region where the first and second internal electrodes do not exist. In at least one of the outer dielectric layer, the inner dielectric layer and the side margin portion, the P and the Si segregate in at least one of grain-boundary triple points of three ceramic particles.

Abstract: A capacitor assembly, configured for a high-voltage application, contains an active capacitor part, a housing for accommodating the active capacitor part and an insulating medium for the electrical insulation of the active capacitor part. A flexible-shape inlay is arranged between the insulating medium and the housing and connected electrically thereto. Ideally the capacitor assembly is part of a converter assembly.

Abstract: An ultrasonic transducer device includes a patterned film stack disposed on first regions of a substrate, the patterned film stack including a metal electrode layer and a bottom cavity layer formed on the metal electrode layer. The ultrasonic transducer device further includes a planarized insulation layer disposed on second regions of the substrate layer, a cavity formed in a membrane support layer and a CMP stop layer, the CMP stop layer including a top layer of the patterned film stack and the membrane support layer formed over the patterned film stack and the planarized insulation layer. The ultrasonic transducer device also includes a membrane bonded to the membrane support layer. The CMP stop layer underlies portions of the membrane support layer but not the cavity.

Abstract: Disclosed herein are embodiments of high Q, temperature stable materials with low dielectric constants. In particular, a two-phase material can form based on the rutile phase of titanium oxide along with a spinel structure of ZnAl2O4. This material can have a dielectric constant below 15 which is simultaneously temperature stable.

Abstract: A method of manufacturing an electronic component includes preparing an unfired multilayer body, bonding one of first and second side surfaces of each unfired multilayer body to an adhesive sheet such that the unfired multilayer bodies are in at least one row, polishing the other side surface of each unfired multilayer body by rotating a polishing surface of a rotary polishing machine in contact with the other side surface of each unfired multilayer body, and forming a first insulating layer on the polished other side surface, wherein in the polishing the other side surface, at least one of the rotary polishing machine and the adhesive sheet is moved relative to the other to form a polish groove in the length direction, and the rotary polishing machine has a cylindrical shape and includes an outer circumferential surface that defines the polishing surface.

Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and first and second internal electrodes and having first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, first and second side portions disposed on the fifth and sixth surfaces of the capacitor body, respectively, and first and second external electrodes disposed on the third and fourth surfaces of the capacitor body, respectively, and connected to the first and second internal electrodes, respectively. The first and second internal electrodes have protrusions at one-side edge in a direction perpendicular to the fifth and sixth surfaces of the capacitor body.

Abstract: A method for manufacturing a multilayer electronic component includes: preparing first ceramic green sheets on which first internal electrode patterns are formed spaced apart from each other and second ceramic green sheets on which second internal electrode patterns are formed spaced apart from each other; forming a ceramic green sheet stack by stacking the first ceramic green sheets and the second ceramic green sheets for the first internal electrode patterns and the second internal electrode patterns to be cross-stacked on each other; obtaining a multilayer body by cutting the ceramic green sheet stack to have a side surface to which distal edges of the first and second internal electrode patterns are exposed; adhering an adhesive layer to the side surface to which the distal edges of the first and second internal electrode patterns of the multilayer body are exposed; and peeling the adhesive layer from the side surface.

Abstract: An artificial muscle actuator that includes a housing, a dielectric fluid housed within the housing, and an electrode pair positioned in the housing. The electrode pair includes a first electrode and a second electrode. The first electrode and the second electrode each include a metal film. The first electrode includes an insulation bilayer disposed on the metal film of the first electrode in an orientation facing the second electrode. In addition, the insulation bilayer includes an acryl-based polymer layer disposed on the metal film and a biaxially oriented polypropylene (BOPP) layer disposed on the acryl-based polymer layer.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric ceramic layers and internal electrode layers laminated alternately in a lamination direction, and a pair of external electrodes on both end portions in the length direction of the multilayer body and respectively connected to the internal electrode layers. The pair of external electrodes each include a base region covering at least each of the first and second end surfaces, connected to the internal electrode layers, and including Cu as a main component, a cover region on the base region to cover the base region, and including Ag as a main component, and a reaction region between the base region and the cover region including Cu included in the base region and Ag included in the cover region reacting with each other.

Abstract: A multilayer capacitor includes: a body including internal electrodes stacked in a first direction; and first and second external electrodes disposed on the body. A portion of the first external electrode overlaps the body in the first direction and does not overlap a remainder of the first external electrode in the first direction. A portion of the second external electrode overlaps the body in the first direction and does not overlap a remainder of the second external electrode in the first direction. At least one of the external electrodes includes: a second electrode layer covering a first electrode layer, which covers one portion of an edge of the body. A width W1 of a portion of the first electrode layer, closest to the one portion of the edge, is narrower than a width W2 of an end of the second electrode layer, farthest from the first electrode layer.

Abstract: A multilayer ceramic capacitor includes end-surface external electrodes and side-surface external electrodes. The end-surface external electrodes are respectively provided at end surfaces of a multilayer body and are respectively connected to end-surface connecting internal electrodes. The side-surface external electrodes are respectively provided at the side surfaces of the multilayer body and respectively connected to side-surface connecting internal electrodes. The end-surface connecting internal electrodes each include end surface opposing portion opposing the side-surface connecting internal electrode 15B adjacent in a lamination direction, and an end surface lead-out portion extending from the end surface opposing portion to one of the end-surface external electrodes.

Abstract: A broadband multilayer ceramic capacitor may include a first external terminal and a second external terminal. A bottom portion of the first external terminal may be spaced apart from a bottom portion of the second external terminal by a bottom external terminal spacing distance. A first active electrode layer may include a first active electrode connected with the first external terminal and a second active electrode connected with the second external terminal and co-planar with the first electrode. A second active electrode layer may include a third active electrode connected to the first external terminal and a fourth active electrode connected to the second external terminal and co-planar with the fourth electrode. The first active electrode may overlap the fourth active electrode in the longitudinal direction. A ratio of a length of the capacitor to the bottom external terminal spacing distance may be greater than about 4.

Abstract: A multilayer ceramic capacitor includes a multilayer body, and external electrodes on a portion of a side surface portion including four side surface of the multilayer body, and on a portion of a first main surface of the multilayer body. The first main surface includes first regions covered with the external electrodes and a second region exposed from the external electrodes. The first regions of the first main surface each include recesses therein. The recesses in each of the first regions each include a spherical curved wall surface. The recesses in each of the first regions each have an average inlet size of about 0.3 ?m or more and about 10.5 ?m or less.

Abstract: A method of manufacturing a filtered feedthrough assembly for use with an implantable medical device. The method may include gold brazing an insulator to a flange at first braze joint, and gold brazing a plurality of feedthrough wire to the insulator at second braze joints. The method may further include applying a first non-conductive epoxy to the first braze joint, and applying a second non-conductive epoxy to the second braze joint. The method may further include grit blasting a face of the flange, applying a conductive epoxy to the face of the flange, and attaching an EMI filter to the conductive epoxy such that it is grounded to the flange via the conductive epoxy and not via the first braze joint or the second braze joints.

Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.

Abstract: A component carrier with a first component carrier structure including a first stack which has at least one first electrically conductive layer structure and at least one first electrically insulating layer structure is disclosed. The at least one first electrically conductive layer structure has a first contact element which extends up to a first contact surface of the first stack. An electrically conductive connection medium is directly connected to the first contact element at the first contact surface by filling at least one recess of the first contact element. The at least one recess having a larger dimensioned cavity delimited by a smaller dimensioned surface profile.

Abstract: A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated in a first direction, a first main surface including a first flat region facing in the first direction, and a second main surface including a second flat region facing in the first direction; and a pair of external electrodes connected to the internal electrodes and facing each other in a second direction orthogonal to the first direction, a dimension of the ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the ceramic body in a third direction orthogonal to the first and second directions, the first flat region being formed at a center portion of the first main surface in the second direction, the second flat region being formed at a center portion of the second main surface in the third direction.

Abstract: A ceramic electronic component includes: a ceramic body including main surfaces perpendicular to a first axis and end surfaces perpendicular to a second axis; and external electrodes covering the end surfaces and extending from the end surfaces to the main surfaces. The external electrode includes a surface layer portion including a Sn plating layer, and an inner layer portion including a Ni plating layer adjacent to the Sn plating layer and including rounded inner end portions on the main surfaces. In a cross-section perpendicular to a third axis, a ratio t2/t1 is 0.4 or more, where t2 is a thickness in the first axis direction of a portion where an inclination of a tangent line of an outer surface of the inner end portion to each main surface is 45°, and t1 is a maximum thickness in the first axis direction of the inner layer portion on each main surface.

Abstract: A multilayer capacitor includes a body including a dielectric layer and a plurality of internal electrodes stacked on each other having the dielectric layer interposed therebetween; and external electrodes including electrode layers positioned externally on the body and connected to the internal electrodes, respectively, wherein the body includes a first surface and a second surface, opposing each other, and to which the plurality of internal electrodes are respectively exposed, and a third surface and a fourth surface which are connected to the first surface and the second surface, and oppose each other in a direction in which the plurality of internal electrodes are stacked on each other, each of the electrode layers including a first region covering the first or second surface and a second region covering the third or fourth surface and having surface roughness lower than that of the first region.

Abstract: A multi-layer ceramic electronic component includes a multi-layer ceramic electronic component main body including a multi-layer body including stacked ceramic layers, stacked internal electrode layers, first and second main surfaces, first and second side surfaces, and first and second end surfaces, first and second external electrodes respectively on sides where the first and second end surfaces are located, and first and second metallic terminals respectively connected to the first and second external electrodes. The multi-layer ceramic electronic component main body and at least portion of the first and second metallic terminals are covered with an external material. The second main surface is connected to the metallic terminals. The first and second external electrodes cover a portion of the second main surface. A gap is provided between the multi-layer body and tips of the first and second external electrodes. The external material is in the gap.

Abstract: A ceramic electronic component includes an element body and at least one external electrode formed on the element body. The element body includes a dielectric and at least one internal electrode therein. The element body has a plurality of surfaces, and these surfaces include a first surface and a second surface opposite the first surface. Each external electrode includes a base layer and a plating layer formed on the base layer. The base layer is in contact with the internal electrode, contains a metal, and has a first end face adjacent to an outer periphery of the second surface of the element body. The plating layer has a second end face adjacent to an outer periphery of the first end face such that the first and second end faces form, in combination, a multilayer structure on the outer periphery of the second surface of the element body.

Abstract: A self-centering washer is positioned between the feedthrough and filter capacitor of a filtered feedthrough. The washer has openings through which first and second terminal pins extend. A first opening has an inner arcuate portion contacting the first terminal pin and an outer perimeter portion exposing the braze sealing the terminal pin to the insulator. A second opening has an inner arcuate portion contacting the second terminal pin and an outer perimeter portion exposing the braze sealing the terminal pin to the insulator. In an imaginary configuration with the first and second washer openings superimposed one on top of the other, the cumulative arcuate distance of the inner arcuate portions about one of the terminal pins, subtracting overlap, results in a gap between the superimposed washer openings that is less than a diameter of the first and second terminal pins so that the washer is prevented from lateral movement.

Abstract: A method to produce a multilayer ceramic electronic component includes forming supports by an ink jet printing method to produce a green multilayer ceramic capacitor. A green ceramic layer and outer electrodes of the multilayer ceramic electronic component are formed by the ink jet printing method while the supports define peripheries of the green ceramic layer and the outer electrodes. When fired, the green multilayer ceramic electronic component is converted to a sintered multilayer ceramic electronic component, and the supports disappear by heating.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrodes alternately laminated therein, and two end surfaces opposing each other in a length direction, and two side surfaces opposing each other in a width direction, and two external electrodes respectively on the two end surfaces of the multilayer body. At least one of two opposed main surfaces of the multilayer ceramic capacitor includes raised portions provided respectively on one side and another side with a middle portion of the main surface interposed therebetween. The raised portions are each raised to become thicker in the lamination direction from the middle portion toward an outer periphery of the main surface.

Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and internal electrodes alternately disposed with the dielectric layers interposed therebetween; and an external electrode disposed on the capacitor body to be connected to one or more of the internal electrodes. Porosity of ends of the internal electrodes is less than 50% on an interfacial surface between a margin of the capacitor body in a width direction the capacitor body and the internal electrodes.

Abstract: An electronic component includes a substrate and side wires. The substrate includes a first major surface, a second major surface, and a side surface. The side wires are on the side surface of the substrate and spaced apart from each other in a direction along an outer periphery of the substrate when viewed in plan in a thickness direction of the substrate. At least a portion of each of the side wires is provided indirectly on the side surface of the substrate. The electronic component further includes an electrically insulating layer interposed between the side surface of the substrate and the at least a portion of each of the side wires. Each of the side wires includes a bent portion bent when viewed in plan in the thickness direction of the substrate.