Solid Dielectric Type Patents (Class 29/25.42)
  • Patent number: 10269498
    Abstract: A multi-layer ceramic capacitor includes a body. The body includes a capacitance forming unit, a cover, and a side margin. The capacitance forming unit includes ceramic layers laminated in a first direction and internal electrodes disposed between the ceramic layers. The cover covers the capacitance forming unit from the first direction. The side margin covers the capacitance forming unit from a second direction orthogonal to the first direction. The capacitance forming unit includes a surface layer portion adjacent to the cover. Ends of the internal electrodes in the second direction in the surface layer portion are curved toward the cover.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: April 23, 2019
    Assignee: Taiyo Yuden Co., Ltd.
    Inventor: Yoichi Kato
  • Patent number: 10262795
    Abstract: A multilayer ceramic electronic component includes a ceramic body in which dielectric layers and internal electrodes are alternately disposed. Ceramic-metal compound layers are disposed on interfaces between the internal electrodes and the dielectric layers. Additionally, in some examples, spaces between adjacent internal electrodes are fully occupied by the dielectric layers and the dielectric layers contain a ceramic-metal compound containing metal particle. The ceramic-metal compound layer may have an embossing type configuration or a dendrite type configuration.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: April 16, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong Seok Kim, Chung Eun Lee, Doo Young Kim, Ki Han Kim, Ji Ye Choi, Kyung Ryul Lee, Jae Yeol Choi, Soo Kyong Jo
  • Patent number: 10262807
    Abstract: An electrode foil that progresses an enlargement of the surface area of a dielectric film and that barely causes cracks which would even break a core part at the time of winding, a winding capacitor obtained by winding the electrode foil, an electrode foil manufacturing method, and a winding capacitor manufacturing method are provided. An electrode foil is formed of a belt-like foil, and has a surface enlarged part, a core part, and a plurality of separation parts. The surface enlarged part is formed on the surface of the foil, and the core part is a part remained when excluding the surface enlarged part within the foil. The separation part extends in a width direction of the belt in the surface enlarged part, dividing the surface enlarged part. The plurality of separation parts share bending stress when the electrode foil is wound, preventing concentration of stress.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: April 16, 2019
    Assignee: NIPPON CHEMI-CON CORPORATION
    Inventors: Yoshiyuki Narita, Kazuhiro Nagahara, Atsushi Tanaka, Shoji Ono
  • Patent number: 10256044
    Abstract: A method of manufacturing a multilayer ceramic electronic component includes forming external electrodes on end surfaces of a ceramic body, and more particularly, to forming external electrodes by attaching a sheet for forming an external electrode on a ceramic body. A multilayer ceramic electronic component thus formed has external electrodes with a thin and uniform thickness.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: April 9, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Bong Jun Juhng, Doo Young Kim, Ki Pyo Hong, You Na Kim, Hye Young Choi
  • Patent number: 10252940
    Abstract: A method of coating film in a roll. A film is wound into a roll with gaps between the layers of the film in the roll. A fluid is forced through the roll such that the fluid deposits a coating on at least one side of the film.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: April 9, 2019
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Andrew J. Ouderkirk, Robert R. Kieschke, Erin A. McDowell, Nicholas T. Gabriel, Eugene V. Johnson, Kelly S. Johnson
  • Patent number: 10249435
    Abstract: The invention relates to an electronic component. The electronic component 2 has an electrical assembly 3 having two electrical connections 4, 5 that are each formed on opposing faces of the assembly. For each connection 4, 5, the component has at least one electrically conductive connection element 9, 10 having a mounting foot 14, 15 for connection to a circuit carrier 22. According to the invention, the connection element 8, 9 has at least two metal layers 10, 11, 12, 13 at least on one section, wherein the metal layers are each formed from different metals and integrally connected to one another. Preferably, one metal layer 12, 13 from the metal layers has greater thermal conductivity than the other metal layer 10, 11.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: April 2, 2019
    Assignee: Robert Bosch GmbH
    Inventor: Thomas Peuser
  • Patent number: 10230553
    Abstract: Embodiments of the present disclosure provide methods and apparatus for providing feed forward equalization to a communication line by providing a resistance and a capacitance to the communication line. The method includes determining the resistance based on a desired value of feed forward equalization to provide to a communication line, determining the capacitance based on the desired value of feed forward equalization to provide to the communication line, providing a layer of resistive material between a first conductor and a second conductor of the communication line, wherein a dimension of the layer of resistive material is determined based on the determined resistance and providing a layer of dielectric material between the first conductor and the second conductor, wherein a dimension of the layer of dielectric material is determined based on the determined capacitance.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: March 12, 2019
    Assignee: International Business Machines Corporation
    Inventors: Thomas W. Liang, Matthew S. Doyle, John R. Dangler, Manuel Orozco, Layne A. Berge
  • Patent number: 10194535
    Abstract: A capacitor assembly is providing for adapting a replacement capacitor to an existing circuit board layout. The capacitor assembly has an adapter with a plate and the replacement capacitor affixed thereto, and the adapter has terminals which are connected to the leads of the replacement capacitor. The adapter further has leads, such as pins, extending downward from the plate, to electrically connect the capacitor assembly to the circuit board.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: January 29, 2019
    Assignee: Cornell Dubilier Marketing, Inc.
    Inventors: Phillip Eugene Whitmire, Samuel G. Parler, Jr., David Eugene Lawson
  • Patent number: 10179731
    Abstract: A transfer head array includes a base substrate, an interlayer isolation layer, plural transfer heads, and at least one shielding layer. The interlayer isolation layer is disposed on the base substrate, and the interlayer isolation layer has a flat top surface facing away from the base substrate. The transfer heads are arranged on the interlayer isolation layer. The shielding layer is disposed in the interlayer isolation layer.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: January 15, 2019
    Assignee: MIKRO MESA TECHNOLOGY CO., LTD.
    Inventors: Li-Yi Chen, Shih-Chyn Lin, Hsin-Wei Lee, Pei-Yu Chang
  • Patent number: 10181379
    Abstract: A composite sheet includes a ceramic green sheet having a lengthwise direction and a conductor film printed on the ceramic green sheet. The conductor film has a shape that has a longitudinal dimension extending in the lengthwise direction and a lateral dimension perpendicular or substantially perpendicular to the longitudinal direction. The conductor film includes a plurality of thickness-varied regions arranged in a row or a plurality of rows extending in the lengthwise direction while being dispersed in the lengthwise direction. The thickness-varied regions have a thickness that is different from a thickness of a portion of the conductor film excluding the thickness-varied regions.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: January 15, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshiharu Kubota, Hironori Tsutsumi
  • Patent number: 10172392
    Abstract: An aerosol delivery device is provided. The aerosol delivery device comprises a control component and a humidity sensor. The humidity sensor is configured to measure a property thereof that is variable with relative humidity in an environment of the aerosol delivery device to which the humidity sensor is exposed. The humidity sensor is also configured to generate a corresponding signal that indicates a value of the property from which the relative humidity is calculable. The control component, or the humidity sensor, is configured to calculate the relative humidity from the value indicated by the corresponding signal, and control operation of at least one functional element of the aerosol delivery device based on the relative humidity so calculated, including output of the relative humidity for presentation by a display.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: January 8, 2019
    Assignee: RAI Strategic Holdings, Inc.
    Inventors: Rajesh Sur, Eric T. Hunt, Stephen B. Sears
  • Patent number: 10177501
    Abstract: The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: January 8, 2019
    Assignee: CommScope Technologies LLC
    Inventors: Bernard Harold Hammond, Jr., David Patrick Murray, Ian Robert George
  • Patent number: 10176923
    Abstract: A ceramic electronic component includes a body, a first external electrode, and a second external electrode. The body includes a first end surface and a second end surface that face each other, surfaces each extending between the first end surface and the second end surface, an outer edge that is provided along the surfaces and includes recesses, the recesses extending from the first end surface and the second end surface along ridges of the surfaces, and a functional unit that is disposed inward relative to the outer edge. The first external electrode and the second external electrode respectively cover the first end surface and the second end surface and extend to come close to each other from the first end surface and the second end surface along the surfaces and the recesses.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: January 8, 2019
    Assignee: Taiyo Yuden Co., Ltd.
    Inventor: Takashi Asai
  • Patent number: 10170245
    Abstract: Disclosed herein is a multilayer capacitor comprising: a laminate in which a plurality of first sheets and second sheets are alternately laminated, wherein the first sheets and the second sheets are disposed in a direction perpendicular to a mounting surface; a first inner electrode formed on the first sheets, wherein the first electrode is exposed through upper, lower, and first lateral surfaces of the laminate; a second inner electrode that is formed on the second sheets and has a horizontally symmetrical shape with respect to the first inner electrode; a sealing portion encapsulating the first and second inner electrodes exposed through two lateral surfaces of the laminate; and an external electrode that is electrically connected to the first and second inner electrodes exposed through the upper and lower surfaces of the laminate.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: January 1, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hae Suk Chung, Jae Yeol Choi, Hyun Woo Kim, Dong Su Cho
  • Patent number: 10159845
    Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: December 25, 2018
    Assignee: Second Sight Medical Products, Inc.
    Inventors: Robert J. Greenberg, Alfred E. Mann, Dao Min Zhou, Neil Talbot, Jerry Ok, Gailland R. Nolan
  • Patent number: 10163572
    Abstract: A ceramic-wound-capacitor includes a first-electrically-conductive-layer, a dielectric-layer, a second-electrically-conductive-layer, and a protective-coating. The dielectric-layer is formed of lead-lanthanum-zirconium-titanate (PLZT). The protective-coating has a thickness of less than ten micrometers (10 ?m) and provides electrical isolation between the first-electrically-conductive-layer and the second-electrically-conductive-layer of the ceramic-wound-capacitor.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: December 25, 2018
    Assignee: DELPHI TECHNOLOGIES IP LIMITED
    Inventors: Manuel Ray Fairchild, Ralph S. Taylor, David W. Ihms, Celine Wk Wong
  • Patent number: 10153088
    Abstract: A capacitor with a first voltage layer guided around the capacitor structure, so that the first voltage layer and the second planar electrode of the capacitor form an overlap region in which the first voltage layer and the second planar electrode are arranged, parallel to one another and separated from one another by a gap, on a base side of the capacitor directly one above the other, wherein the first voltage layer is arranged on an outer side of the second planar electrode, which outer side is averted from the capacitor structure).
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: December 11, 2018
    Assignee: Robert Bosch GmbH
    Inventor: Martin Kessler
  • Patent number: 10141277
    Abstract: An integrated circuit includes pads formed on a back end of the line surface, and decoupling capacitor stacks monolithically formed about the pads. Solder balls are formed on the pads and connect to metal layers within the decoupling capacitor stacks to reduce noise and voltage spikes between the solder balls.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: November 27, 2018
    Assignee: International Business Machines Corporation
    Inventor: Effendi Leobandung
  • Patent number: 10141114
    Abstract: A multi-layer ceramic capacitor includes: a body, a first external electrode, and a second external electrode. The body includes a first end surface and a second end surface that face each other, a side surface that extends between the first end surface and the second end surface, a first recess that extends along a first ridge of the first end surface and the side surface, a second recess that extends along a second ridge of the second end surface and the side surface, a first internal electrode that is drawn to the first end surface and the first recess, and a second internal electrode that faces the first internal electrode and is drawn to the second end surface and the second recess. The first external electrode covers the body from the first end surface. The second external electrode covers the body from the second end surface.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: November 27, 2018
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Ryo Ono, Tetsuhiko Fukuoka
  • Patent number: 10134530
    Abstract: An improved solid electrolytic capacitor, and method of making the solid electrolytic capacitor, is described. The solid electrolytic capacitor comprises a pressed powder anode and a braided lead wire extending from the anode. A dielectric is on the anode and a cathode is on the dielectric.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: November 20, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: James L. Piller, Christian Guerrero
  • Patent number: 10128046
    Abstract: The invention provides a process for making ceramic film capacitors, the process comprising supplying a flexible substrate, depositing a first electrode on a first region of the flexible substrate, wherein the first electrode defines a first thickness, overlaying the first electrode with a dielectric film; and depositing a second electrode on the ceramic film, wherein the second electrode defines a second thickness. Also provided is a capacitor comprising flexible substrate, a first electrode deposited on said flexible substrate, a dielectric overlaying the first electrode; and a second electrode deposited on said dielectric.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: November 13, 2018
    Assignee: UCHICAGO ARGONNE, LLC
    Inventors: Beihai Ma, Uthamalingam Balachandran, Stephen E. Dorris, Tae H. Lee
  • Patent number: 10115525
    Abstract: An electronic component includes a body including a capacitance portion having dielectric layers formed of a dielectric material, internal electrodes and a cover portion covering at least one surface of the capacitance portion, the cover portion including cover layers formed of a dielectric material, the cover portion including a plurality of first and second cover layers that are stacked alternately, and an external electrode disposed on the body, the external electrode connected to the internal electrodes, wherein average diameters of dielectric grains included in the first and second cover layers are different from each other.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: October 30, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Hoon Kim, Ha Jung Song, Jong Ho Lee, Ki Yong Lee
  • Patent number: 10102977
    Abstract: A high density energy storage system including a giant-colossal dielectric thin film material electrically insulating between two electrodes configured to have increased overlapping surface area.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: October 16, 2018
    Assignee: Smart Hybrid Systems Incorporated
    Inventor: James W. Andrakin
  • Patent number: 10092749
    Abstract: An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed on a circuit board within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: October 9, 2018
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Robert Shawn Johnson, Warren S. Dabney, Thomas Marzano, Richard L. Brendel, Christopher Michael Williams, Holly Noelle Moschiano, Keith W. Seitz, John E. Roberts
  • Patent number: 10083780
    Abstract: Provided is a surface mount resistor that can be stably mounted without the need for lead wires to be to flattened. The surface mount resistor includes a first resistive element and a second resistive element arranged in parallel, the first resistive element having first lead wires at opposite ends thereof, and the second resistive element having second lead wires at opposite ends thereof. The first resistive element and the second resistive element are integrated by being covered with a sheath. The first lead wires and the second lead wires are arranged such that they protrude outward in a direction of an axis beyond the sheath. The first lead wires and the second lead wires are bent alongside surfaces and a bottom surface of the sheath.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: September 25, 2018
    Assignee: KOA CORPORATION
    Inventor: Takashi Naito
  • Patent number: 10083795
    Abstract: A multilayer ceramic capacitor includes a ceramic body which is unlikely to be cracked. A dimension in a length direction L is referred to as L0. A distance in the length direction L is referred to as L1 between an end in the length direction L of a portion of a first external electrode located on a first principal surface and an end of a second internal electrode closer to the first end surface. The ratio L1/L0 is about 0.05 to about 0.35.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: September 25, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hiroto Itamura
  • Patent number: 10068708
    Abstract: A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: September 4, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Maurice Perea, R Allen Hill, Reggie Phillips
  • Patent number: 10062508
    Abstract: A three terminal capacitor includes a capacitor element including first through sixth surfaces, first-side and second-side outer electrodes, a center outer electrode between the first-side and second-side outer electrodes, and conductor layers. The conductor layers include a pair of outermost conductor layers that are respectively nearest to the fifth and sixth surfaces, and thicknesses of the pair of outermost conductor layers are greater than a thickness of a center conductor layer nearest to a center of the capacitor element in a width direction.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: August 28, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hirobumi Adachi, Mitsuru Ikeda, Hitoaki Kimura
  • Patent number: 10056192
    Abstract: A multilayer ceramic capacitor includes: a pair of external electrodes; a first internal electrode containing a base metal and coupled to one of the external electrodes; a dielectric layer stacked on the first internal electrode and containing a ceramic material and the base metal; and a second internal electrode stacked on the dielectric layer, containing the base metal, and coupled to another one of the external electrodes, wherein a concentration of the base metal in each of five regions, which are equally divided regions of a region between locations 50 nm away from the first and second internal electrodes in a stacking direction between the first and second internal electrodes, is within ±20% of an average of the concentrations of the base metal in the five regions, and the dielectric layer has a thickness of 0.6 ?m or less.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: August 21, 2018
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Katsuya Taniguchi, Koichiro Morita, Minoru Ryu, Yoshiki Iwazaki
  • Patent number: 10056190
    Abstract: A multilayer ceramic electronic component and a method of manufacturing the same are provided. The multilayer ceramic electronic component includes a ceramic body including dielectric layers, and internal electrodes alternately disposed on the dielectric layers and containing a ceramic additive disposed therein; and external electrodes formed on an outer portion of the ceramic body and electrically connected to the internal electrodes. The ceramic additive is disposed in the internal electrode at a position spaced apart from a boundary between the internal electrode and the dielectric layer by a predetermined distance.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: August 21, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Heui Lee, Seung Ho Lee, Kyoung Jin Cha, Min Gon Lee
  • Patent number: 10037849
    Abstract: A capacitor includes a pair of electrodes and a metalized dielectric layer disposed between the pair of electrodes, in which the metalized dielectric layer has a plurality of metal aggregates distributed within a dielectric material. The distribution is such that a volume fraction of metal in the metalized dielectric layer is at least about 30%. Meanwhile, the plurality of metal aggregates are separated from one another by the dielectric material. A method for forming a metal-dielectric composite may include coating a plurality of dielectric particles with a metal to form a plurality of metal-coated dielectric particles and sintering the plurality of metal-coated dielectric particles at a temperature of at least about 750° C. to about 950° C. to transform the metal coatings into discrete, separated metal aggregates.
    Type: Grant
    Filed: November 8, 2014
    Date of Patent: July 31, 2018
    Assignee: APRICOT MATERIALS TECHNOLOGIES, LLC
    Inventor: Liang Chai
  • Patent number: 10034100
    Abstract: A sound transducer structure includes a membrane and a counter electrode. The membrane includes a first main surface in a sound transducing region made of a membrane material, and an edge region. The counter electrode includes a second main surface arranged in parallel to the first main surface of the membrane on a side of a free volume opposite the first main surface of the membrane. A plurality of elevations extend in the sound transducing region from the second main surface of the counter electrode into the free volume. The membrane and the counter electrode are arranged to provide a capacity therebetween. The membrane comprises a corrugation groove extending in the sound transducing region from the first main surface of the membrane into the free volume.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: July 24, 2018
    Assignee: Infineon Technologies AG
    Inventors: Alfons Dehe, Stefan Barzen, Marc Fueldner
  • Patent number: 10022513
    Abstract: A resuscitator has a patient airway interface device, a bag, a flow passage coupled between the bag and patient airway interface device, and a sensor assembly. The patient airway interface device may be a mask or an endotracheal tube. The sensor assembly has a display, at least one sensor coupled to the flow passage and configured to provide a measurement of at least one parameter, and a processor coupled to the display and the at least one sensor. The processor is configured to receive the measurement from the sensor and provide information on the display based on the received measurement. The information may include a current breath rate, a pressure-vs-time curve, and guidance to the user to assist in achieving a target breath rate.
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: July 17, 2018
    Assignee: VYAIRE MEDICAL CONSUMABLES LLC
    Inventors: Christopher Varga, Dennis White, Michael McMahon
  • Patent number: 10012609
    Abstract: A sachet includes a first wing made of a flexible material and having a first perimeter region circumscribing a first central region; a second wing made of the flexible material; a hinge connecting the first and second wings along a common boundary; an adhesive material applied to the perimeter region on the first wing; a first electrically conducting electrode formed on the first wing within the central region of the perimeter region; a second electrically conducting electrode formed on the second wing in a region that is opposed to and in alignment with the first contact area on the first wing; an array of contact pads formed on at least one of the first and second wings; first and second conducting traces electrically connecting first and second groups of one or more contact pads among the array of contact pads to the first and second electrodes, respectively.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: July 3, 2018
    Assignee: Nucleus Scientific Inc.
    Inventors: Ian W. Hunter, Grant W. Kristofek, Dean Ljubicic
  • Patent number: 10014113
    Abstract: The electronic device sheet comprises a pair of electrode layers, a dielectric layer provided between the pair of electrode layers, and one or more insulation patch members provided on one of principal surfaces of the dielectric layer, wherein the number of the insulation patch members is 1 or more and 1000 or less per 1 cm2 of the principal surface, and the total area of the insulation patch members is 10 ?m2 or larger and 3 mm2 or smaller per 1 cm2 of the principal surface.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: July 3, 2018
    Assignee: TDK CORPORATION
    Inventors: Junji Aotani, Shigeaki Tanaka, Yoshihiko Yano
  • Patent number: 10014110
    Abstract: A multilayer ceramic capacitor includes an external electrode that is unlikely to be peeled. First and second external electrodes each include base layers provided over a ceramic body and including a metal and glass, and Cu plated layers provided over the base layers. The multilayer ceramic capacitor includes a reactive layer. The reactive layer contains about 5 atomic % to about 15 atomic % of Ti, about 5 atomic % to about 15 atomic % of Si, and about 2 atomic % to about 10 atomic % of V.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: July 3, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yasuhiro Nishisaka, Takehisa Sasabayashi, Satoshi Muramatsu
  • Patent number: 9998842
    Abstract: A fabrication method of an acoustic wave device includes: forming a metal layer between regions that are located on a piezoelectric substrate and in which acoustic wave chips are to be formed, at least a part of a region of the metal layer extending to an extension direction of a dicing line for separating the acoustic wave chips; and scanning the dicing line of the piezoelectric substrate by a laser beam so that the at least a part of the region of the metal layer is not irradiated with the laser beam.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: June 12, 2018
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Tooru Nishidate
  • Patent number: 9974183
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including: an active part with dielectric layers interposed with a plurality of first and second internal electrodes; an upper cover part above the active part; a lower cover part below the active part and having a thickness greater than that of the upper cover part; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively, wherein the first and second external electrodes are disposed on respective end surfaces of the ceramic body in a length direction and on a lower surface of the ceramic body in a thickness direction and are not disposed on an upper surface of the ceramic body in the thickness direction.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: May 15, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Eun Hyuk Chae, Hyun Hee Gu, Jong Ho Lee, Jae Yeol Choi
  • Patent number: 9959957
    Abstract: A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: May 1, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Seiji Tsuda, Shogo Nakayama, Takeshi Iseki, Kazutoshi Matsumura
  • Patent number: 9947561
    Abstract: A semiconductor encapsulation apparatus for encapsulating a semiconductor device on a substrate, the apparatus comprising a mold comprising a cavity pressure zone that is configured to be at a molding process pressure during molding, a base vacuum pump conduit connecting a base vacuum pump to the cavity pressure zone, a base vacuum valve located along the base vacuum pump conduit such that the base vacuum pump is in fluid communication with the cavity pressure zone when the base vacuum valve is open, a reservoir vacuum pump conduit connecting a reservoir vacuum pump to the base vacuum pump conduit, and a reservoir vacuum valve located along the reservoir vacuum pump conduit such that the reservoir vacuum pump is in fluid communication with the base vacuum pump conduit when the reservoir vacuum valve is open.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: April 17, 2018
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Teng Hock Kuah, Chee Toh Teh, Shu Chuen Ho, Kai Wu, Chin Chong Lee
  • Patent number: 9934909
    Abstract: In an embodiment, a multilayer ceramic capacitor 10 has the first external electrode 12 and second external electrode 13 provided with a space between them on the other height-direction surface f6 of the capacitor body 11 in the length direction, where the width Wa of the other height-direction surface f6 of the capacitor body 11 is smaller than the width W of the one height-direction surface f5. The multilayer ceramic capacitor can improve yield and help reduce cost by allowing several of the conditions to be found non-defective in the appearance inspection.
    Type: Grant
    Filed: November 7, 2016
    Date of Patent: April 3, 2018
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Yusuke Kowase
  • Patent number: 9908400
    Abstract: A container for a refrigerated fluid having an external container and an internal container between which an evacuated intermediate space is situated, which contains a superinsulator formed by several, separated layers of foil provided with a metal layer, is used as a storing device for electric energy. The foils act as foil capacitors and are electrically contacted so that an electric voltage can be applied to corresponding electric terminals on the exterior side of the container. In the container, a metal layer can be provided on both surfaces of the foil(s), and the foil(s) may consist of a material with a semiconductor characteristic. The foil capacitors are electrically connectable in series or parallel, and the electrical contacting of the foil metal surfaces can take place via a suspension structure of the internal container in the external container.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: March 6, 2018
    Assignee: Bayerische Motoren Werke Aktiengesellschaft
    Inventors: Michael Bauer, Torsten Franke
  • Patent number: 9892853
    Abstract: LTCC devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a matrix of titanates of alkaline earth metals, the matrix doped with at least one selected from rare-earth element, aluminum oxide, silicon oxide and bismuth oxide.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: February 13, 2018
    Assignee: Ferro Corporation
    Inventors: Walter J. Symes, Jr., Gregory R. Prinzbach, John J. Maloney, James E. Henry, Orville W. Brown, Srinivasan Sridharan, Yie-Shein Her, Stanley Wang, George E. Graddy, Jr., George E. Sakoske
  • Patent number: 9887257
    Abstract: In one embodiment, a capacitor structure includes a substrate, a dielectric stack, a first conductor segment, a second conductor segment and a shielding conductor segment. The dielectric stack is formed on the substrate. A first layer of the dielectric stack includes a plurality of conductor segments routed only in a first direction. A first conductor segment among the multiple conductor segments may be biased to a first voltage. The second conductor segment among the multiple conductor segments may be biased to a second voltage. The shielding conductor segment may be biased to the second voltage and is formed at an end of the first conductor segment. In addition to that, the capacitances for the capacitor structure may be adjusted while the footprint of the capacitor structure is fixed.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: February 6, 2018
    Assignee: Altera Corporation
    Inventors: Yan Cui, Queennie Suan Imm Lim, Shuxian Chen
  • Patent number: 9887040
    Abstract: A multilayer electronic component includes a first capacitor including a first capacitor body and first and second external electrodes disposed on outer surfaces of the first capacitor body; and a second capacitor including a second capacitor body and third and fourth external electrodes disposed on outer surfaces of the second capacitor body and electrically connected to the first capacitor. The first and third external electrodes are connected to each other by a first metal terminal enclosing portions of a lower surface of the first external electrode to an upper surface of the third external electrode, and the second and fourth external electrodes are connected to each other by a second metal terminal enclosing portions of a lower surface of the second external electrode and an upper surface of the fourth external electrode.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: February 6, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS, CO. LTD.
    Inventors: Seung Hyun Ra, Yong Gyu Han
  • Patent number: 9881744
    Abstract: An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: January 30, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: John E. McConnell, Garry L. Renner, John Bultitude
  • Patent number: 9847172
    Abstract: An embedded device includes a multilayer body including dielectric layers and internal electrode layers interposed between adjacent dielectric layers; external electrodes disposed on external surfaces of the multilayer body to apply electric charges having different polarities to adjacent internal electrode layers, the external electrodes containing a conductive material; first copper layers disposed on external surfaces of the external electrodes to cover the external electrodes; and second copper layers disposed on the first copper layers to cover the first copper layers. An average particle diameter of powder particles of the first copper layers is greater than an average particle diameter of powder particles of the second copper layers.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: December 19, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Seong Kim, Eun Sang Na, Jin Sung Kim, Ok Nam Kim, Tae Hyeok Kim, Jin Man Jung
  • Patent number: 9842692
    Abstract: A composite sheet includes a ceramic green sheet having a lengthwise direction and a conductor film printed on the ceramic green sheet. The conductor film has a shape that has a longitudinal dimension extending in the lengthwise direction and a lateral dimension perpendicular or substantially perpendicular to the longitudinal direction. The conductor film includes a plurality of thickness-varied regions arranged in a row or a plurality of rows extending in the lengthwise direction while being dispersed in the lengthwise direction. The thickness-varied regions have a thickness that is different from a thickness of a portion of the conductor film excluding the thickness-varied regions.
    Type: Grant
    Filed: October 27, 2014
    Date of Patent: December 12, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshiharu Kubota, Hironori Tsutsumi
  • Patent number: 9842693
    Abstract: A multilayer ceramic capacitor includes an element body, a first terminal electrode, a second terminal electrode, and a plurality of internal electrodes. The plurality of internal electrodes include a plurality of first internal electrodes, a plurality of second internal electrodes, a plurality of third internal electrodes, and a plurality of fourth internal electrodes. The element body includes a plurality of first and second regions. The first regions are located between the first internal electrodes opposed with each other. The second regions are located between the first internal electrodes opposed to each other through the third internal electrodes, and between the second internal electrodes opposed to each other through the fourth internal electrodes. The first regions and the second regions are alternately located in the first direction.
    Type: Grant
    Filed: December 4, 2015
    Date of Patent: December 12, 2017
    Assignee: TDK CORPORATION
    Inventors: Masahiro Iwama, Kenya Tamaki, Fumiaki Satoh, Kenta Yamashita
  • Patent number: 9831417
    Abstract: To perform poling treatment in a simple procedure by dry process. A magnetic field poling device includes a first holding part configured to hold a film-to-be-poled (2); a second holding part configured to hold a magnet generating a magnetic field B to the film-to-be-poled (2); and a moving mechanism configured to move the first holding part or the second holding part in a direction perpendicular to the direction of the magnetic field B.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: November 28, 2017
    Assignee: YOUTEC CO., LTD.
    Inventors: Takeshi Kijima, Yuuji Honda, Tomoyuki Araki