Solid Dielectric Type Patents (Class 29/25.42)
  • Patent number: 10814493
    Abstract: A capacitive or resistive tactile sensor having a conductive membrane, a flexible dielectric or weakly conductive sheet and a substrate having electrodes, and a method of manufacturing thereof. The flexible sheet has a first surface and an opposite second surface, the first surface and the second surface are uniformly distanced when at rest. The first surface is adapted to contact one of the conductive membrane or the substrate. The second surface is adapted to contact another one of the conductive membrane or the substrate. The body defines between the first and second surfaces, at a predetermined region, a plurality of laser ablated uniform cavities that are evenly distributed and operatively identical in order to provide a known compression index at the predetermined region of the flexible sheet.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: October 27, 2020
    Assignee: ROBOTIQ INC.
    Inventors: Vincent Duchaine, Thuy Hong Loan Le, Alexis Maslyczyk, Axay Kumar Rana
  • Patent number: 10811193
    Abstract: A capacitor component includes a porous body, a first electrode layer covering surfaces of pores of the porous body, a dielectric layer covering the first electrode layer, and a second electrode layer filling the pores of the porous body and covering the dielectric layer.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: October 20, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Hoon Ryou, Hyun Ho Shin, Byeong Cheol Moon, Chang Soo Jang, Tae Joon Park, Yun Hee Kim, Kyo Yeol Lee, Seung Mo Lim
  • Patent number: 10811191
    Abstract: An element body of a rectangular parallelepiped shape has a length in a height direction larger than a length in a width direction and has a length in a longitudinal direction larger than the length in the height direction. A terminal electrode is disposed at an end of the element body in the width direction and extends in the longitudinal direction. The element body includes a pair of principle surfaces opposing each other in the height direction, a pair of end surfaces opposing each other in the longitudinal direction, and a pair of side surfaces opposing each other in the width direction. The terminal electrode includes a conductor disposed on the side surface. The conductor includes a protrusion having a length in the longitudinal direction larger than a length in the height direction.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: October 20, 2020
    Assignee: TDK CORPORATION
    Inventors: Fumiaki Satoh, Toru Onoue, Takuto Okamoto
  • Patent number: 10770229
    Abstract: A dielectric composition contains: a base material powder containing BamTiO3 (0.995?m?1.010); a first accessory ingredient containing at least one element corresponding to a transition metal in Group 5 of the periodic table in a total content of 0.3 to 1.2 moles; a second accessory ingredient containing one of ions, oxides, carbides, and hydrates of Si in a content of 0.6 to 4.5 moles; a third accessory ingredient containing at least one element in Period 4 or higher; and a fourth accessory ingredient containing at least one element in Period 3, wherein 0.70×B?C+D?1.50×B and 0.20?D/(C+D)?0.80, in which B is a total content of the second accessory ingredient, C is a total content of the third accessory ingredient, and D is a total content of the fourth accessory ingredient.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: September 8, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Hyung Kang, Hyung Kyu Kim, Jong Hyun Cho, Du Won Choi, Yong Koo Kim, Hang Kyu Cho
  • Patent number: 10762319
    Abstract: A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: September 1, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo, Ying-Cheng Tseng
  • Patent number: 10755859
    Abstract: An element body of a rectangular parallelepiped shape includes a pair of principal surfaces opposing each other in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode disposed on an end portion of the element body in the third direction. When viewed from the third direction, a width of the element body in the second direction is the largest at a central position in the first direction, and gradually decreases from the central portion in the first direction. When viewed from the third direction, a position in which a length from one end to another end of the conductive resin layer in the second direction is the largest is located closer to the one principal surface than the central position.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: August 25, 2020
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Takehisa Tamura, Ken Morita, Atsushi Takeda
  • Patent number: 10746620
    Abstract: A pressure measure sheet having a sheet shape and having a pressure measure surface, the pressure measure sheet being adapted to be arranged on a surface of a measured object, includes: a plurality of pressure measure ports provided through the pressure measure surface; at least one connection port adapted to be connected to a side of a pressure measure device; and a coupler part including a plurality of through-tubes penetrating the plurality of pressure measure ports and the at least one connection port, in which the pressure measure sheet includes a region in which the plurality of through-tubes are arrayed in nonparallel.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: August 18, 2020
    Assignees: JAPAN AEROSPACE EXPLORATION AGENCY, TOKYO FLUID RESEARCH CO., LTD.
    Inventors: Masataka Kohzai, Yuzuru Yokokawa, Kazuomi Yamamoto, Yasushi Ito, Hideo Omotani
  • Patent number: 10741328
    Abstract: A multi-layer ceramic electronic component includes: first internal electrodes each including a first main electrode and a first drawn portion extending from the first main electrode to a first end surface facing in a first direction; and second internal electrodes each including a second main electrode and a second drawn portion extending from the second main electrode to a second end surface facing the first end surface in the first direction, the first and second internal electrodes being alternately laminated, the first drawn portion having a width dimension along a second direction that decreases toward the first end surface and having a predetermined width dimension in the first end surface, the second direction being orthogonal to the first direction, the second drawn portion having a width dimension along the second direction that increases toward the second end surface and having the predetermined width dimension in the second end surface.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: August 11, 2020
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Hiroyuki Hasegawa, Takashi Ogawa
  • Patent number: 10741334
    Abstract: An apparatus and associated method for an energy-storage device (e.g., a capacitor) having a plurality of electrically conducting electrodes including a first electrode and a second electrode separated by a non-electrically conducting region, and wherein the non-electrically conducting region further includes a non-uniform permittivity (K) value. In some embodiments, the method includes providing a substrate; fabricating a first electrode on the substrate; and fabricating a second electrode such that the second electrode is separated from the first electrode by a non-electrically conducting region, wherein the non-electrically conducting region has a non-uniform permittivity (K) value. The capacitor devices will find benefit for use in electric vehicles, of all kinds, uninterruptible power supplies, wind turbines, mobile phones, and the like requiring wide temperature ranges from several hundreds of degrees C. down to absolute zero, consumer electronics operating in a temperature range of ?55 degrees C.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: August 11, 2020
    Assignee: GranBlueTech, L.L.C.
    Inventor: John P. Snyder
  • Patent number: 10710336
    Abstract: Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: July 14, 2020
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Oscar Khaselev, Bin Mo, Monnir Boureghda, Michael T. Marczi, Bawa Singh
  • Patent number: 10715926
    Abstract: A MEMS component includes a MEMS sound transducer having a membrane structure and an assigned counterelectrode structure, and a circuit unit, which is electrically coupled to the MEMS sound transducer and which in a first operating mode of the MEMS sound transducer in the audio frequency range detects an audio output signal of the MEMS sound transducer on the basis of a deflection of the membrane structure relative to the counterelectrode structure, the deflection being brought about by an acoustic sound pressure change, and in a second operating mode of the MEMS sound transducer in the ultrasonic frequency range to drive and read the MEMS sound transducer as an ultrasonic transceiver.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: July 14, 2020
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Christian Bretthauer, Pedro Augusto Borrego Lambin Torres Amaral, Christoph Glacer
  • Patent number: 10714260
    Abstract: A multilayer ceramic capacitor includes a body including first and second internal electrodes facing each other with respective dielectric layers interposed therebetween, and first and second external electrodes disposed on an external surface of the body and electrically connected to the first and second internal electrodes, respectively. Each of the first and second external electrodes includes a first electrode layer containing any one selected from the group consisting of TiW, TiN, and TaN, or a combination thereof, and a second electrode layer disposed on the first electrode layer.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: July 14, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Min Cho, Young Wook Kim, Seung Mo Lim, Jung Min Kim
  • Patent number: 10668689
    Abstract: The present invention is related to a multi-layered thermoplastic elastomer (TPE) foam. Due to a specific formulation of the multi-layered TPE foam, adjacent layers of said TPE foam can be perfectly adhered to each other without adhesive or thermocompression after foaming. The present invention is also related to a specific process for forming a multi-layered foam.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: June 2, 2020
    Inventor: Yung-Teng Lee
  • Patent number: 10658940
    Abstract: A power converter including an inverter for converting electric power output from a power supply, a first power feeding bus connected to the inverter and to the positive side of the power supply, a second power feeding bus connected to the inverter and the negative side of the power supply, and a plurality of connection circuits including a resistant member and a capacitive member which are connected in series, connected between the first power feeding bus and the second power feeding bus, and having at least two or more different impedances.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: May 19, 2020
    Assignee: NISSAN MOTOR CO., LTD.
    Inventors: Kentaro Shin, Kraisorn Throngnumchai, Tetsuya Hayashi, Akinori Okubo
  • Patent number: 10649528
    Abstract: A fabric-based item such as a fabric glove may include force sensing circuitry. The force sensing circuitry may include force sensor elements formed from electrodes on a compressible substrate such as an elastomeric polymer substrate. The fabric may include intertwined strands of material including conductive strands. Signals from the force sensing circuitry may be conveyed to control circuitry in the item using the conductive strands. Wireless circuitry in the fabric-based item may be used to convey force sensor information to external equipment. The compressible substrate may have opposing upper and lower surfaces. Electrodes for the force sensor elements may be formed on the upper and lower surfaces. Stiffeners may overlap the electrodes to help decouple adjacent force sensor elements from each other. Integrated circuits can be attached to respective force sensing elements using adhesive.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: May 12, 2020
    Assignee: Apple Inc.
    Inventors: Storrs T. Hoen, Daniel D. Sunshine, Aidan N. Zimmerman, Daniel A. Podhajny, Maurice P. May
  • Patent number: 10636549
    Abstract: An insulating sheet and a conductive terminal are provided in an electronic component, where at least one of the conductive terminals has a missing part, and where a remaining part positioned on both ends of the missing part is connected through a resistor element affixed to the insulating sheet.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: April 28, 2020
    Assignee: Molex, LLC
    Inventor: Toshihiro Niitsu
  • Patent number: 10629379
    Abstract: A capacitor component includes a body having a first surface and a second surface opposing each other and including a multilayer structure in which a plurality of dielectric layers are stacked and first and second internal electrodes are alternately disposed with respective dielectric layers interposed therebetween and exposed to the first surface and the second surface, respectively, first and second metal layers covering the first surface and the second surface and connected to the first and second internal electrodes, respectively, first and second ceramic layers covering the first and second metal layers, and first and second external electrodes covering the first and second ceramic layers and connected to the first and second metal layers to be electrically connected to the first and second internal electrodes, respectively.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: April 21, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Hyun Cho, Byeong Chan Kwon, Yong Jin Yun, Ki Pyo Hong, Jae Yeol Choi
  • Patent number: 10607784
    Abstract: A film capacitor includes a wound body in which a dielectric film and an electrode film are wound; and a pair of external electrodes provided respectively on a pair of end faces positioned in an axial direction of the wound body. The dielectric film includes an electrode-free portion provided on one end side in a width direction, continuously in a longitudinal direction of the dielectric film. The electrode film has a first projection portion on a surface on the other end side in the width direction, and the first projection portion has a string shape extending in the width direction.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: March 31, 2020
    Assignee: KYOCERA CORPORATION
    Inventor: Naoki Kikuchi
  • Patent number: 10545902
    Abstract: A device with a physical layer (PHY) core component, a PHY I/O component, a decoupling I/O component, and a decoupling core component, where the PHY core component is adjacent to the PHY I/O component, the PHY I/O component is adjacent to the decoupling I/O component, the decoupling I/O component is adjacent to the decoupling core component and is positioned a first distance away from the PHY core component, and the decoupling core component is adjacent to an edge of the device and is positioned a second distance away from the PHY core component.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: January 28, 2020
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Mark Moty Groissman, Alex Tetelbaum
  • Patent number: 10510487
    Abstract: A method of producing a multi-layer ceramic electronic component includes: preparing a multi-layer sheet including laminated ceramic sheets, and internal electrodes disposed between the ceramic sheets; cutting the multi-layer sheet to produce a multi-layer chip having a side surface from which the internal electrodes are exposed; removing a superficial layer of the side surface of the multi-layer chip; and providing a side margin to the side surface of the multi-layer chip, the superficial layer being removed from the side surface.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: December 17, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yasunari Kato, Joji Kobayashi, Toshimitsu Kogure
  • Patent number: 10510488
    Abstract: A multilayer ceramic capacitor includes a laminated body including ceramic layers, first internal electrode layers, and second internal electrode layers alternately laminated. First and second external electrodes provided on the laminated body include first diffusion portions defined by interdiffusion of the first internal electrode layers and the first external electrode at interfaces between the first internal electrode layers and the ceramic layers, and second diffusion portions defined by interdiffusion of the second internal electrode layers and the second external electrode at interfaces between the second internal electrode layers and the ceramic layers.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: December 17, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Atsushi Yasuda
  • Patent number: 10486379
    Abstract: A method for reducing the resistivity of a thermoplastic film containing carbon nanotubes includes connecting an electric power supply to the thermoplastic film containing carbon nanotubes and passing electric current through the thermoplastic film containing carbon nanotubes to heat the thermoplastic film to an elevated temperature and align carbon nanotubes within the thermoplastic film. The thermoplastic film is solid at room temperature.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: November 26, 2019
    Assignee: Goodrich Corporation
    Inventors: Jin Hu, Galdemir Cezar Botura, Casey Slane, Nathaniel Ching
  • Patent number: 10490356
    Abstract: A capacitor includes a body including a substrate and a capacitance layer disposed on the substrate. The substrate includes a plurality of first trenches penetrating from one surface of the substrate to an interior of the substrate, and a first capacitor layer disposed on the one surface of the substrate and in the first trenches. The first capacitor layer includes a first dielectric layer and first and second electrodes disposed on opposing sides thereof. The capacitance layer includes a plurality of second trenches penetrating from one surface of the capacitance layer to an interior of the capacitance layer, and a second capacitor layer disposed on the one surface of the capacitance layer and in the second trenches. The second capacitor layer includes a second dielectric layer and third and fourth electrodes disposed on opposing sides thereof. A method of manufacturing the capacitor is also provided.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: November 26, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Hoon Ryou, Dong Sik Yoo, Seung Hun Han, No Il Park, Seung Mo Lim, Hyun Ho Shin
  • Patent number: 10483828
    Abstract: An electric motor includes a plurality of SMD components arranged on a carrier of the motor, and a connection part for the SMD components together with an electrically conductive housing part of the motor. A contact spring electrically connects a plurality of SMD components to the housing part. The contact spring has a main section, a spring-type connection section that extends outwards from one side of the main section, and at least one spring-type contact section that extends outwards from the other side of the main section. The spring-type connection section of the contact spring includes a plurality of contact fingers for the SMD components.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: November 19, 2019
    Assignee: Continental Automotive GmbH
    Inventors: Werner Wallrafen, Daniel Muresan
  • Patent number: 10468191
    Abstract: A multilayer ceramic capacitor includes a stacked body and first and second external electrodes. When a dimension of the stacked body in a length direction is L0, a dimension of the stacked body in a width direction is W0, a dimension of the stacked body in a stacking direction is T0, a dimension of the first outer layer portion in the stacking direction is T1, a dimension of the second outer layer portion in the stacking direction is T2, a dimension of the first side margin in the width direction is W1, a dimension of the second side margin in the width direction is W2, a dimension of the first end margin in the length direction is L1, and a dimension of the second end margin in the length direction is L2, conditions of (L1+L2)/L0>(W1+W2)/W0 and (L1+L2)/L0>(T1+T2)/T0 are satisfied, and a condition of 0.244?(L1+L2)/L0?0.348 is satisfied.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: November 5, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Tadateru Yamada, Kazuo Hattori, Isamu Fujimoto
  • Patent number: 10460876
    Abstract: A multi-layer ceramic capacitor includes a body including a multi-layer unit and a side margin, and an external electrode. The multi-layer unit includes ceramic layers laminated in a first direction, first and second internal electrodes alternately disposed between the ceramic layers, an end surface oriented in a second direction orthogonal to the first direction, the first internal electrode being drawn from the end surface, an end margin disposed between the end surface and the second internal electrode, and a side surface oriented in a third direction orthogonal to the former directions, the internal electrodes being exposed to the side surface. The side margin covers the side surface. The external electrode includes an entry portion and covers the body from the side of the end surface, the entry portion being disposed on the end margin and entering a gap between the side surface and the side margin from the end surface.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: October 29, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Ryo Ono, Tetsuhiko Fukuoka, Shoji Kusumoto, Akihiko Kono
  • Patent number: 10453615
    Abstract: A method for manufacturing a multilayer ceramic electronic component includes preparing a laminate including internal electrodes stacked through a ceramic green sheet, the internal electrodes being exposed on a surface of the laminate, heating a functional sheet while the functional sheet is in contact with a predetermined surface of the laminate, on which the internals electrode are exposed, cooling the heated functional sheet, and forming a covering layer formed of the functional sheet on the predetermined surface of the laminate by punching out the functional sheet having been cooled with the laminate.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: October 22, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Daiki Fukunaga, Masatsugu Kato
  • Patent number: 10437331
    Abstract: A fabric-based item such as a fabric glove may include force sensing circuitry. The force sensing circuitry may include force sensor elements formed from electrodes on a compressible substrate such as an elastomeric polymer substrate. The fabric may include intertwined strands of material including conductive strands. Signals from the force sensing circuitry may be conveyed to control circuitry in the item using the conductive strands. Wireless circuitry in the fabric-based item may be used to convey force sensor information to external equipment. The compressible substrate may have opposing upper and lower surfaces. Electrodes for the force sensor elements may be formed on the upper and lower surfaces. Stiffeners may overlap the electrodes to help decouple adjacent force sensor elements from each other. Integrated circuits can be attached to respective force sensing elements using adhesive.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: October 8, 2019
    Assignee: Apple Inc.
    Inventors: Storrs T. Hoen, Daniel D. Sunshine, Aidan N. Zimmerman, Daniel A. Podhajny, Maurice P. May
  • Patent number: 10434316
    Abstract: Flexible implantable subcutaneous heart device (HD) structure, including a flexible device body, at least one flexible lead and at least one respective transition unit, the transition unit for respectively coupling each flexible lead to the flexible device body, the flexible device body including a plurality of inner components and a respective plurality of hollow outer units, the hollow outer units for encasing and protecting the inner components, each one of the hollow outer units including at least one hollow rigid element and a hollow flexible element, the hollow flexible element coupled with the hollow rigid element for enabling the outer unit a degree of flexibility, wherein the hollow flexible element is covered with a covering and wherein the flexible device body is covered with a polymer.
    Type: Grant
    Filed: September 6, 2015
    Date of Patent: October 8, 2019
    Assignee: NewPace Ltd.
    Inventors: James Kelley, Jack Amir, Moty Mocha, Gera Strommer, Avraham Broder, Robert Fishel
  • Patent number: 10438913
    Abstract: An integrated circuit includes pads formed on a back end of the line surface, and decoupling capacitor stacks monolithically formed about the pads. Solder balls are formed on the pads and connect to metal layers within the decoupling capacitor stacks to reduce noise and voltage spikes between the solder balls.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: October 8, 2019
    Assignee: International Business Machines Corporation
    Inventor: Effendi Leobandung
  • Patent number: 10420949
    Abstract: A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of forming a ceramic body in a green state, or, stacking discrete layers of ceramic in a green state upon one another and laminating together. The ceramic body has a first side opposite a second side. At least one via hole is formed straight through the ceramic body extending between the first and second sides. At least one via hole is filled with a conductive paste. The ceramic body and the conductive paste are then dried. The ceramic body and the conductive paste are isostatically pressed at above 1000 psi to remove voids and to form a closer interface for sintering. The ceramic body and the conductive paste are sintered together to form the feedthrough dielectric body. The feedthrough dielectric body is hermetically sealed to a ferrule.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: September 24, 2019
    Assignee: Greatbatch Ltd.
    Inventors: Keith W. Seitz, Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Dallas J. Rensel, Brian P. Hohl
  • Patent number: 10420374
    Abstract: An electronic smoke comprises a puff detection sub-assembly module. The puff detection sub-assembly comprises a first conductive surface, a second conductive surface and an insulated ring spacer separating the first and the second conductive surfaces at an effective separation distance. The first conductive surface, the second conductive surface and the insulated ring spacer are housed inside a metallic can. The first conductive surface is electrically connected to the metal can by a first conductive ring which is disposed between the first conductive surface and a ceiling portion of the metal can. The second conductive surface is electrically connected to an output terminal through a second conductive ring, the second conductive ring elevating the puff detection sub-assembly above a floor portion of the metal can and urging the first conductive ring against a ceiling portion of the metal can.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: September 24, 2019
    Assignee: Altria Client Services LLC
    Inventor: Loi Ying Liu
  • Patent number: 10373744
    Abstract: A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: August 6, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Seiji Tsuda, Shogo Nakayama, Takeshi Iseki, Kazutoshi Matsumura
  • Patent number: 10366836
    Abstract: An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: July 30, 2019
    Assignee: KEMET Electronics Corporation
    Inventors: John Bultitude, John E. McConnell, Galen W. Miller
  • Patent number: 10366830
    Abstract: A surface mount electronic component includes an element including a dielectric layer that includes a first main surface and a second main surface, a first external electrode disposed on the first main surface, a second external electrode disposed on the second main surface, a first metal terminal connected to the first external electrode, a second metal terminal connected to the second external electrode, and an exterior material covering at least a portion of the element, the first and second external electrodes, and the first and second metal terminals. Upper and lower surfaces of the exterior material are flat or substantially flat.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: July 30, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masaki Fukuda, Yuji Fukada, Jinya Furui, Takashi Inoue, Takashi Yamamoto
  • Patent number: 10367082
    Abstract: The present invention provides a method for manufacturing a secondary cell having a plurality of unit cells 21 that are connected in parallel, including, a step to prepare sheet-shaped unit cells each having a structure that a first electrode layer, a metal oxide semiconductor layer, a charging layer, and a second electrode layer are layered, a step to form a cell sheet by connecting the laminated unit cells in parallel, a step to measure a capacity of the cell sheet, and a step to connect a unit cell for capacity adjustment to the cell sheet in parallel when the capacity is smaller than a specification value.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: July 30, 2019
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Tomokazu Saito, Yuki Sato
  • Patent number: 10349186
    Abstract: An MEMS microphone is disclosed, which comprises a substrate and a vibrating diaphragm and a back electrode which are located above the substrate, a plurality of comb tooth parts are formed in edge positions of the vibrating diaphragm, and the plurality of comb tooth parts are distributed in a peripheral direction of the vibrating diaphragm at intervals, wherein a position between every two adjacent comb tooth parts on the vibrating diaphragm is connected to the substrate via an insulating layer; and the comb tooth parts on the vibrating diaphragm are at least partially overlapped with the substrate, and a clearance exists between the comb tooth parts and the substrate and is configured as an airflow circulation channel. The microphone of the present invention has better impact resistance and can avoid intrusion of dust.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: July 9, 2019
    Assignee: Goertek Inc.
    Inventors: Junkai Zhan, Mengjin Cai, Zonglin Zhou
  • Patent number: 10342130
    Abstract: A mounted structure includes an electronic component including external electrodes, a wiring substrate including lands, and joint portions composed of a solder joint material and configured to join the external electrodes and the lands. The external electrodes respectively include coatings that cover a principal surface of a body, which is opposed to the wiring substrate, and coatings that cover end surfaces of the body, which are opposed to each other in the length direction. A distance De between the coatings in the length direction and a distance Dl between the lands in the length direction satisfy a condition of 0.91?Dl/De?1.09.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: July 2, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kiyoyuki Nakagawa
  • Patent number: 10330539
    Abstract: A high precision high reliability and quick response thermosensitive chip and manufacturing method thereof is provided, including a thermosensitive ceramic semiconductor substrate; glass protective layers are alternately spray-coated and sintered on the two surfaces of the thermosensitive ceramic semiconductor substrate; and the two surfaces of the thermosensitive ceramic semiconductor substrate having the glass protective layers are printed with metal electrode layers. The thermosensitive chip achieves quick response, accurate control of resistance precision and has high precision; in addition, the glass protective layers thereof enable the thermosensitive chip to have high reliability.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: June 25, 2019
    Assignee: EXSENSE ELECTRONICS TECHNOLOGY CO., LTD
    Inventors: Wenting Chen, Zhaoxiang Duan, Jun Yang, Qixing Bai, Limin Tang, Jiankai Ye
  • Patent number: 10327077
    Abstract: A microphone includes: a substrate configured to have a through hole formed at a central portion thereof; a vibration membrane disposed to cover the through hole on the substrate to include a slit pattern in which slit patterns are arranged in a plurality of lines along a circular edge thereof; a fixed membrane separately mounted at an upper portion of the vibration membrane with an air layer therebetween to have a plurality of air inlets that extend therebetween in a direction of the air layer; and a support layer configured to support the fixed membrane separately mounted on the vibration membrane.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: June 18, 2019
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventor: Ilseon Yoo
  • Patent number: 10269498
    Abstract: A multi-layer ceramic capacitor includes a body. The body includes a capacitance forming unit, a cover, and a side margin. The capacitance forming unit includes ceramic layers laminated in a first direction and internal electrodes disposed between the ceramic layers. The cover covers the capacitance forming unit from the first direction. The side margin covers the capacitance forming unit from a second direction orthogonal to the first direction. The capacitance forming unit includes a surface layer portion adjacent to the cover. Ends of the internal electrodes in the second direction in the surface layer portion are curved toward the cover.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: April 23, 2019
    Assignee: Taiyo Yuden Co., Ltd.
    Inventor: Yoichi Kato
  • Patent number: 10262795
    Abstract: A multilayer ceramic electronic component includes a ceramic body in which dielectric layers and internal electrodes are alternately disposed. Ceramic-metal compound layers are disposed on interfaces between the internal electrodes and the dielectric layers. Additionally, in some examples, spaces between adjacent internal electrodes are fully occupied by the dielectric layers and the dielectric layers contain a ceramic-metal compound containing metal particle. The ceramic-metal compound layer may have an embossing type configuration or a dendrite type configuration.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: April 16, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong Seok Kim, Chung Eun Lee, Doo Young Kim, Ki Han Kim, Ji Ye Choi, Kyung Ryul Lee, Jae Yeol Choi, Soo Kyong Jo
  • Patent number: 10262807
    Abstract: An electrode foil that progresses an enlargement of the surface area of a dielectric film and that barely causes cracks which would even break a core part at the time of winding, a winding capacitor obtained by winding the electrode foil, an electrode foil manufacturing method, and a winding capacitor manufacturing method are provided. An electrode foil is formed of a belt-like foil, and has a surface enlarged part, a core part, and a plurality of separation parts. The surface enlarged part is formed on the surface of the foil, and the core part is a part remained when excluding the surface enlarged part within the foil. The separation part extends in a width direction of the belt in the surface enlarged part, dividing the surface enlarged part. The plurality of separation parts share bending stress when the electrode foil is wound, preventing concentration of stress.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: April 16, 2019
    Assignee: NIPPON CHEMI-CON CORPORATION
    Inventors: Yoshiyuki Narita, Kazuhiro Nagahara, Atsushi Tanaka, Shoji Ono
  • Patent number: 10256044
    Abstract: A method of manufacturing a multilayer ceramic electronic component includes forming external electrodes on end surfaces of a ceramic body, and more particularly, to forming external electrodes by attaching a sheet for forming an external electrode on a ceramic body. A multilayer ceramic electronic component thus formed has external electrodes with a thin and uniform thickness.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: April 9, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Bong Jun Juhng, Doo Young Kim, Ki Pyo Hong, You Na Kim, Hye Young Choi
  • Patent number: 10252940
    Abstract: A method of coating film in a roll. A film is wound into a roll with gaps between the layers of the film in the roll. A fluid is forced through the roll such that the fluid deposits a coating on at least one side of the film.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: April 9, 2019
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Andrew J. Ouderkirk, Robert R. Kieschke, Erin A. McDowell, Nicholas T. Gabriel, Eugene V. Johnson, Kelly S. Johnson
  • Patent number: 10249435
    Abstract: The invention relates to an electronic component. The electronic component 2 has an electrical assembly 3 having two electrical connections 4, 5 that are each formed on opposing faces of the assembly. For each connection 4, 5, the component has at least one electrically conductive connection element 9, 10 having a mounting foot 14, 15 for connection to a circuit carrier 22. According to the invention, the connection element 8, 9 has at least two metal layers 10, 11, 12, 13 at least on one section, wherein the metal layers are each formed from different metals and integrally connected to one another. Preferably, one metal layer 12, 13 from the metal layers has greater thermal conductivity than the other metal layer 10, 11.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: April 2, 2019
    Assignee: Robert Bosch GmbH
    Inventor: Thomas Peuser
  • Patent number: 10230553
    Abstract: Embodiments of the present disclosure provide methods and apparatus for providing feed forward equalization to a communication line by providing a resistance and a capacitance to the communication line. The method includes determining the resistance based on a desired value of feed forward equalization to provide to a communication line, determining the capacitance based on the desired value of feed forward equalization to provide to the communication line, providing a layer of resistive material between a first conductor and a second conductor of the communication line, wherein a dimension of the layer of resistive material is determined based on the determined resistance and providing a layer of dielectric material between the first conductor and the second conductor, wherein a dimension of the layer of dielectric material is determined based on the determined capacitance.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: March 12, 2019
    Assignee: International Business Machines Corporation
    Inventors: Thomas W. Liang, Matthew S. Doyle, John R. Dangler, Manuel Orozco, Layne A. Berge
  • Patent number: 10194535
    Abstract: A capacitor assembly is providing for adapting a replacement capacitor to an existing circuit board layout. The capacitor assembly has an adapter with a plate and the replacement capacitor affixed thereto, and the adapter has terminals which are connected to the leads of the replacement capacitor. The adapter further has leads, such as pins, extending downward from the plate, to electrically connect the capacitor assembly to the circuit board.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: January 29, 2019
    Assignee: Cornell Dubilier Marketing, Inc.
    Inventors: Phillip Eugene Whitmire, Samuel G. Parler, Jr., David Eugene Lawson
  • Patent number: 10179731
    Abstract: A transfer head array includes a base substrate, an interlayer isolation layer, plural transfer heads, and at least one shielding layer. The interlayer isolation layer is disposed on the base substrate, and the interlayer isolation layer has a flat top surface facing away from the base substrate. The transfer heads are arranged on the interlayer isolation layer. The shielding layer is disposed in the interlayer isolation layer.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: January 15, 2019
    Assignee: MIKRO MESA TECHNOLOGY CO., LTD.
    Inventors: Li-Yi Chen, Shih-Chyn Lin, Hsin-Wei Lee, Pei-Yu Chang
  • Patent number: 10181379
    Abstract: A composite sheet includes a ceramic green sheet having a lengthwise direction and a conductor film printed on the ceramic green sheet. The conductor film has a shape that has a longitudinal dimension extending in the lengthwise direction and a lateral dimension perpendicular or substantially perpendicular to the longitudinal direction. The conductor film includes a plurality of thickness-varied regions arranged in a row or a plurality of rows extending in the lengthwise direction while being dispersed in the lengthwise direction. The thickness-varied regions have a thickness that is different from a thickness of a portion of the conductor film excluding the thickness-varied regions.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: January 15, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshiharu Kubota, Hironori Tsutsumi