Solid Dielectric Type Patents (Class 29/25.42)
  • Patent number: 11551867
    Abstract: The present invention provides a dielectric composition having high relative permittivity and insulation resistance at high temperature. The dielectric composition includes a main component expressed by a compositional formula (Sr1-x, Cax)m(Ti1-yHfy)O3-?N?, in which 0<x?0.15, 0<y?0.15, 0.90?m?1.15, and 0<??0.05 are satisfied.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: January 10, 2023
    Assignee: MAEDA & SUZUKI PATENT CO., LTD.
    Inventors: Masamitsu Haemori, Toshio Asahi, Hitoshi Saita
  • Patent number: 11551873
    Abstract: A method of producing a multi-layer ceramic electronic component includes: producing a multi-layer unit including ceramic layers that are laminated in a first direction, internal electrodes that are disposed between the ceramic layers, and a side surface that faces in a second direction orthogonal to the first direction, the internal electrodes being exposed on the side surface; sintering the multi-layer unit; and forming a side margin on the side surface of the sintered multi-layer unit.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: January 10, 2023
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Takayuki Hattori, Yuto Yamato
  • Patent number: 11551872
    Abstract: A multilayer ceramic capacitor includes a capacitive element including a ceramic layer, a first internal electrode layer, and a second internal electrode layer, the capacitive element including a first and second principal surfaces, first and second side surfaces, and first and second end surfaces. The first and second internal electrode layers respectively extend to the first and second end surfaces, at least a portion of each of the first and second end surfaces are covered with a conductor layer, a portion of the conductor layer is covered with an insulating portion, at least a portion of the conductor layer and at least a portion of the insulating portion are covered with the underlayer external electrode layer when viewed from the first end surface and the second end surface, and at least a portion of the underlayer external electrode layer is covered with a plating layer.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: January 10, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masahiro Wakashima
  • Patent number: 11538635
    Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers, an active region and upper and lower cover regions; first and second internal electrodes disposed with the dielectric layer interposed therebetween in the active region to be alternately exposed through both end surfaces of the body; and first and second external electrodes disposed on both ends of the body and connected to the first and second internal electrodes, respectively. The body further includes a buffer layer including first and second dummy electrodes disposed on a lower surface of the lower cover region to be spaced apart from each other in a length direction of the body, and a groove is recessed in a lower surface of the buffer layer.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: December 27, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyo Joong Kim, Dong Su Cho
  • Patent number: 11527359
    Abstract: A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion in which first and second internal electrodes are alternately laminated with respective dielectric layers interposed therebetween, and first and second external electrodes respectively disposed on surfaces of the ceramic body. The first and second internal electrodes are respectively exposed to surfaces of the ceramic body, and first and second protrusions, each including a carbon compound, are respectively disposed on end portions of the first and second internal electrodes exposed to the surfaces of the ceramic body.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: December 13, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Duk Yun, Young Hoon Song, Dong Hwi Shin, Seon Young Yoo, Yu Seop Lee
  • Patent number: 11503732
    Abstract: An electronic module includes a module substrate has an upper surface and a lower surface. The module substrate has a package pad array having package contact pads at the upper surface. The module substrate has a socket pad array having socket contact pads at the upper surface. The module substrate has guide pin locating pads associated with the socket pad array. The electronic module has an electronic package coupled to the package contact pads at the package pad array. The electronic module has guide pins surface mounted to the guide pin locating pads. The electronic module has a socket assembly coupled to the module substrate. The socket assembly has a socket housing holding socket contacts. The socket contacts are coupled to the socket contact pads at the socket pad array. The socket frame including pockets receiving the guide pins to locate the socket assembly relative to the module substrate.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: November 15, 2022
    Assignee: TE CONNECTIVITY SOLUTIONS GmbH
    Inventors: Brian Patrick Costello, Christopher William Blackburn
  • Patent number: 11501920
    Abstract: A multilayer ceramic electronic component includes a multilayer body, and an external electrode layer including a foundation electrode layer which is a fired layer. The multilayer body includes an inner layer portion including ceramic layers and inner conductive layers, and outer layer portions each including the ceramic layers. The foundation electrode layer includes an inner layer electrode portion adjacent to the inner layer portion and outer layer electrode portions respectively adjacent to the outer layer portions. The outer layer electrode portions respectively include high-content regions and low-content regions in order from an end surface of the multilayer body. The content of metal in the high-content regions is higher than the content of metal in the low-content regions.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: November 15, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takefumi Takahashi
  • Patent number: 11495409
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes having different sizes to each other, and having first and second surfaces of the first and second internal electrodes, opposing each other in a stacking direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces, and opposing each other; and first and second external electrodes.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: November 8, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hwi Dae Kim, Chan Yoon, Ji Hong Jo, Sang Soo Park, Woo Chul Shin
  • Patent number: 11476047
    Abstract: A multilayer electronic component includes a body in which internal electrodes including Ni and Sn and dielectric layers are alternately disposed, and external electrodes disposed on a surface of the body, connected to the internal electrodes, and including Cu and Sn, wherein the internal electrodes include an alloy including Ni, Cu, and Sn in a region in contact with the external electrodes, and Sn in an amount that satisfies the following formula: 1<C2/C1<13.5 in which C1 is the content of Sn of the internal electrodes at a central portion of the body and C2 is the content of Sn of the internal electrodes at a point 2 ?m away from a point at which the internal electrode and the external electrode are in contact with each other in an inward direction of the body.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: October 18, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woong Do Jung, Yu Hong Oh, Kyung Ryul Lee, Kun Ho Koo, Young Soo Yi
  • Patent number: 11460392
    Abstract: A non-contact fiber permeability measurement system includes a mold device, a fluid supplying device, a capacitance detecting device and a permeability converting device. The mold device includes an upper plate, a lower plate and a fluid inlet. The lower plate is parallel to and disposed below the upper plate for forming an accommodating space disposing a measured fibrous fabric insulated against the upper plate and the lower plate. The fluid inlet is disposed through the upper plate. The fluid supplying device is connected to the mold device and for providing a fluid perfused from the fluid inlet into the accommodating space. The capacitance detecting device is electrically connected to the upper plate and the lower plate. The permeability converting device is electrically connected to the capacitance detecting device and for receiving the capacitance detected via the capacitance detecting device to convert the capacitance to a permeability.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: October 4, 2022
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Yuan Yao, Cheng-Yi Yang
  • Patent number: 11450483
    Abstract: An electronic component includes an electronic component main body having a mounting surface with first and second baked electrodes located thereon at locations spaced apart from one another. A recess extends into the electronic component main body in the area between the first and second baked electrodes. The recess extends over at least a part of at least one of the first and second baked electrodes.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: September 20, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Toru Yaso
  • Patent number: 11418179
    Abstract: A capacitive digital isolator circuit includes: a signal emitting module; a signal receiving module; and a capacitive isolation module. The signal emitting module includes an edge Pulse-Coding modulator circuit, which modulates an input signal to generate a pair of differential modulated signals based on the input signal and transmits the pair of differential modulated signals to the signal receiving module. Each of the pair of differential modulated signals has twelve high-frequency pulses when the input signal has a rising edge and has six high-frequency pulses when the input signal has a falling edge. The signal receiving module includes an ultra-low power consumption high-speed comparator, a timer and a pulse counter. An output signal of the pulse counter has a rising edge when the pulse number of the comparator output signal is larger than nine and a falling edge when the pulse number is equal to or smaller than nine.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: August 16, 2022
    Assignee: SHANGHAI CHIPANALOG MICROELECTRONICS LTD.
    Inventor: Wanxin Ding
  • Patent number: 11411257
    Abstract: A hot swap battery module uses a smart chip and an ideal diode controller to control a power transistor so as to implement a multi-step charge or discharge. Consequently, battery modules which have different voltages or battery capacities can be immediately connected in parallel. When the hot swap battery module is hot swapped, the hot swap battery module also can avoid an excessive charge current or discharge current to damage itself.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: August 9, 2022
    Inventors: Chin-Ho Wang, Hsiao-Yang Wang
  • Patent number: 11393638
    Abstract: A Ti—Zr alloy in powder form is described. Sintered pellets containing the Ti—Zr alloy powder of the present invention, as well as capacitor anodes, are further described.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: July 19, 2022
    Assignee: GLOBAL ADVANCED METALS USA, INC.
    Inventors: Mary Krause, Aamir Abid, Aijun Yin, Lei Wang, Craig Sungail, Geoffrey Smith
  • Patent number: 11369800
    Abstract: The present invention is directed to an EMI feedthrough filter terminal assembly. The EMI feedthrough filter terminal assembly comprises: a feedthrough filter capacitor having a plurality of first electrode layers and a plurality of second electrode layers, a first passageway therethrough having a first termination surface conductively coupling the plurality of first electrode layers, a second termination surface conductively coupling the plurality of second electrode layers; a feedthrough ferrule conductively coupled to the feedthrough filter capacitor via the second termination surface; at least one conductive terminal pin extending through the passageway in conductive relation with the plurality of first electrode layers; an insulator fixed to the feedthrough ferrule for conductively isolating the conductive terminal pin from the feedthrough ferrule; and a laminated insulative layer between the insulator and the feedthrough filter capacitor.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: June 28, 2022
    Assignee: KYOCERA AVX Components Corporation
    Inventors: Don Dollar, Rigoberto Rios
  • Patent number: 11280692
    Abstract: A pressure sensor device in a pressure sensor module includes a membrane that is conductive and deformable under pressure, fixed electrodes each including an electrode surface opposed to the membrane, and a dielectric film disposed on the electrode surface of each of the fixed electrodes. The fixed electrodes are disposed in a direction from the center of the membrane toward an outer portion.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: March 22, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Ryohei Hamazaki
  • Patent number: 11278958
    Abstract: A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.
    Type: Grant
    Filed: May 7, 2015
    Date of Patent: March 22, 2022
    Assignee: GIESECKE+DEVRIENT MOBILE SECURITY GMBH
    Inventor: Ando Welling
  • Patent number: 11257621
    Abstract: A multilayer ceramic electronic component includes a ceramic body including pluralities of first and second internal electrodes alternately disposed to face each other with respective dielectric layers interposed therebetween. First and second external electrodes are disposed on external surfaces of the ceramic body and are respectively electrically connected to the first and second external electrodes. A first dummy electrode is disposed in a margin portion of the ceramic body adjacent the first internal electrode in a third direction, and a second dummy electrode is disposed in a margin portion of the ceramic body adjacent the second internal electrode in the third direction. A distance (Ld) between the first and second dummy electrodes in a second direction, and a length (Lm) of each margin portion between one of the first and second internal electrodes and an external surface of the ceramic body in the second direction, satisfy Ld?Lm.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: February 22, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Jung Kim, Do Young Jeong, Eun Hee Jeong, Min Hyang Kim
  • Patent number: 11248977
    Abstract: The present invention relates to a method for cancelling effects of changes in interconnection capacitances on capacitive sensor readings, and an apparatus configure to perform such method. The sensor readings are provided by a capacitive sensor connected with an interface circuitry. The interface circuitry has at least two interconnections comprising a sensor interconnection and a compensating interconnection. The method comprises obtaining a total sensor capacitance value from the capacitive sensor, and obtaining a total compensating interconnection capacitance value from the compensating interconnection, calculating a compensated sensor capacitance value by reducing the obtained total compensating interconnection capacitance value multiplied with a weight coefficient from the obtained total sensor capacitance value and providing at an output of the interface circuitry an electrical signal corresponding to the compensated sensor capacitance value.
    Type: Grant
    Filed: November 12, 2018
    Date of Patent: February 15, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Heikki Kuisma
  • Patent number: 11222748
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween; and an external electrode, wherein the ceramic body comprises an active portion including a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween to form capacitance and a cover portion formed in upper and lower portions of the active portion, wherein a plurality of internal electrodes in the upper region and the lower region of the active portion is disposed inwardly of an outer side surface of the ceramic body to be spaced apart by a predetermined distance from the body portion, and the plurality of internal electrodes in the central region of the active portion and the internal electrodes having the same polarities are connected to each other via vias.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: January 11, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gi Seok Jeong, Sun Cheol Lee, Ho In Jun
  • Patent number: 11211188
    Abstract: In a stepwise structure formed in a multilayer coil component, a difference occurs in a shrinkage amount between a maximum film thickness portion in which the number of layers is large and a minimum film thickness portion in which the number of layers is small due to portions different in the number of layers of coil parts (that is, upper coil part, lower coil part, and connecting part) adjacent to each other like the maximum film thickness portion and the minimum film thickness portion, readily causing a crack by an inner stress due to the difference in the shrinkage amount. In a multilayer coil component according to the present disclosure, a stress relaxation part overlapping with a maximum film thickness portion whose shrinkage amount is large is provided to relax inner stress in a stepwise structure, resulting in prevention of a crack.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: December 28, 2021
    Assignee: TDK CORPORATION
    Inventors: Yusuke Nagai, Takashi Suzuki, Hidekazu Sato, Takashi Endo, Kouichi Kakuda, Kunihiko Kawasaki, Shinichi Kondo, Yuya Ishima, Shinichi Sato, Masaki Takahashi
  • Patent number: 11201009
    Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet containing a ceramic powder and forming an internal electrode pattern on the ceramic green sheet using a conductive paste containing conductive metal particles and an additive. A ceramic laminate is formed by stacking the ceramic green sheets on which the internal electrode pattern is formed. A ceramic body including dielectric layers and internal electrodes is formed by sintering the ceramic laminate. An average number of conductive metal particles in the internal electrode pattern in a thickness direction is more than 2 and 5 or less.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: December 14, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyoung Jin Cha, Seung Heui Lee, Hyun Soo Oh, Hyung Soon Kwon, Ji Hong Jo
  • Patent number: 11201010
    Abstract: A multilayer capacitor includes a capacitor body including first and sixth surfaces; including an active region including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, and cover regions disposed on an upper surface and a lower surface of the active region; and having one end of each of the first and second internal electrodes exposed through the third and fourth surfaces, respectively; and first and second external electrodes respectively disposed on the third and fourth surfaces of the capacitor body. Each of the cover regions has a plurality of holes.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: December 14, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yeang Jun Kim, Gam Woo Kim, Jae Won Kim, Jin Kyung Joo
  • Patent number: 11170949
    Abstract: A winder includes a winding mechanism, a chamber housing the winding mechanism, at least one vacuum pump, and a product case. The winding mechanism is configured to wind a belt-shaped raw film around a winding core. The belt-shaped raw film is composed of a plurality of electrodes and a plurality of separating films. The at least one vacuum pump is configured to suck air into the chamber. The product case is configured to house a plurality of winding products each formed by winding the raw film with use of the winding mechanism disposed in the chamber.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: November 9, 2021
    Assignee: KAIDO MANUFACTURING CO., LTD.
    Inventors: Kosuke Kaito, Yoshihide Kitamura
  • Patent number: 11166376
    Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2?SA1/BW1?0.5 and 0.2?SA2/BW2?0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: November 2, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Woo Chul Shin, Ji Hong Jo
  • Patent number: 11152141
    Abstract: A ceramic multi-layer component and a method for producing a ceramic multi-layer component are disclosed. In an embodiment a ceramic multi-layer component includes a stack with ceramic layers and electrode layers arranged between them, wherein the ceramic layers and the electrode layers are arranged above one another along a stacking direction, wherein at least one first electrode layer extends along a first main extension direction from a first end region to a second end region of the first electrode layer, and wherein the at least one first electrode layer has a current-carrying capacity that decreases along the first main extension direction.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: October 19, 2021
    Assignee: TDK ELECTRONICS AG
    Inventors: Michael Hofstätter, Alfred Hofrichter, Thomas Feichtinger
  • Patent number: 11127531
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including an active layer, in which first and second internal electrodes are disposed with a dielectric layer interposed therebetween, the N number of each of the first and second internal electrodes being stacked to be alternately exposed from first and second external surfaces; and first and second external electrodes disposed on the first and second external surfaces of the ceramic body and connected to the first and second internal electrodes, respectively. The ceramic body further includes a cover layer disposed above or below the active layer. The cover layer includes a plurality of first and second dummy electrodes. A number (A>N) of the first and second dummy electrodes are stacked to be alternately exposed from the first and second external surfaces.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: September 21, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hyeok Kim, Jea Yeol Choi, Sang Soo Park, Hwi Dae Kim, Young Jun Cha
  • Patent number: 11114249
    Abstract: In a thin-film capacitor, an electrode terminal layer and an electrode layer of a capacitor portion are connected to electrode terminals by via conductors that is formed to penetrate an insulating layer in a thickness direction thereof, and a short circuit wiring in the thickness direction is realized by the via conductors. In the thin-film capacitor, an increase in the number of terminals in the plurality of electrode terminals is achieved, a decrease in length of a circuit wiring is achieved, and thus a thin-film capacitor with low-ESL has been achieved.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: September 7, 2021
    Assignee: TDK Corporation
    Inventors: Koichi Tsunoda, Mitsuhiro Tomikawa, Kazuhiro Yoshikawa, Kenichi Yoshida
  • Patent number: 11107635
    Abstract: A capacitor component includes a body including a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction, and including a first dielectric layer, and a first internal electrode and a second internal electrode disposed to oppose each other in the first direction with the first dielectric layer interposed therebetween, and a first side margin portion and a second side margin portion, respectively including a second dielectric layer, a first margin electrode, and a second margin electrode, disposed in parallel with the fifth and sixth surfaces of the body, and respectively disposed on the fifth and sixth surfaces of the body.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: August 31, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hwi Dae Kim, Sang Soo Park, Young Ghyu Ahn
  • Patent number: 11087925
    Abstract: A power capacitor unit including a casing, first and second layers of capacitor elements wherein the first layer of capacitor elements are stacked on the second layer of capacitor elements, a first busbar assembly connected to the capacitor elements of the first layer, a second busbar assembly connected to the capacitor elements of the second layer, wherein the first busbar assembly and the second busbar assembly are arranged between the first layer of capacitor elements and the second layer of capacitor elements, a heat conducting layer provided between the first busbar assembly and the second busbar assembly, wherein the heat conducting layer is in thermal contact with the casing, thereby conducting heat from the first busbar assembly and the second busbar assembly to the casing, and wherein the casing is electrically insulated from the first busbar assembly and the second busbar assembly.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: August 10, 2021
    Assignee: ABB Power Grids Switzerland AG
    Inventors: Biswajit Singh, Carl-Olof Olsson
  • Patent number: 11069944
    Abstract: Rolled-up energy storage elements, each including a rolled layer stack of layers which are arranged within a layer plane in an at least partially covering manner. In the layer stack, at least two layers are present which are at least partially electrically conductive, and at least one layer of a non-liquid electrolyte material is present, or at least one region between at least two layers of the rolled layer stack is present which comprises a liquid electrolyte. Either at least one of the layers that is at least partially electrically conductive includes at least partially a magnetic material, or an additional layer that includes at least partially a magnetic material in the layer stack.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: July 20, 2021
    Assignee: LEIBNIZ-INSTITUT FUER FESTKOERPER-UND WERKSTOFFFORSCHUNG DRESDEN E.V.
    Inventor: Oliver G. Schmidt
  • Patent number: 11063111
    Abstract: The present disclosure provides a semiconductor structure, including a bottom terminal, a middle terminal over the bottom terminal and separated from the bottom terminal by a high-k dielectric layer, a top terminal over the middle terminal and separated from the middle terminal by the high-k dielectric layer, and a silicon nitride layer over the top terminal and directly on the high-k dielectric layer.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: July 13, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventor: Tung-Jiun Wu
  • Patent number: 11049650
    Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode, the internal electrode including nickel and an alloying element, and an external electrode disposed on the body to be connected to the internal electrode. The internal electrode includes an alloy region and an alloying element region.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: June 29, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Il Song, Beom Seock Oh, Woo Chul Shin, Byung Rok Ahn, Kyoung Jin Cha
  • Patent number: 11011313
    Abstract: A multilayer ceramic capacitor includes a body having a dielectric layer and internal electrodes disposed to be alternately exposed to the third and fourth surfaces with the dielectric layer interposed therebetween. External electrodes include connection parts respectively formed on opposing surfaces of the body, band parts formed to extend from the connection parts to portions of side surfaces of the body, and corner parts in which the connection parts and the band parts are contiguous. A thickness of each of the external electrodes may be 50 nm to 2 ?m. The external electrodes may be formed using a barrel-type sputtering method. A ratio t2/t1 may satisfy 0.7 to 1.2, where t1 is a thickness of each connection part and t2 is a thickness of each band part. A ratio t3/t1 may satisfy 0.7 to 1.0, where t3 is a thickness of each corner part.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: May 18, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Joon Oh, Tae Joon Park, Sang Wook Lee, Sung Min Cho, Seung Mo Lim
  • Patent number: 10998135
    Abstract: A ceramic electronic component includes external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body. Each of the external electrodes includes an underlying metal layer, an intermediate metal layer, a conductive resin layer, an external metal layer. A tip angle ? between an outer face of a tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is 20° or smaller, and a tip angle ? between an outer face of a tip portion of the wraparound portion of the intermediate metal layer and a surface of the ceramic component body is 20° or smaller.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: May 4, 2021
    Assignee: Taiyo Yuden Co., Ltd
    Inventors: Satoshi Kobayashi, Takahisa Fukuda, Tomoaki Nakamura, Mikio Tahara, Naoki Saito, Kiyoshiro Yatagawa
  • Patent number: 10991518
    Abstract: An apparatus and associated method for an energy-storage device (e.g., a capacitor) having a plurality of electrically conducting electrodes including a first electrode and a second electrode separated by a non-electrically conducting region, and wherein the non-electrically conducting region further includes a non-uniform permittivity (K) value. In some embodiments, the method includes providing a substrate; fabricating a first electrode on the substrate; and fabricating a second electrode such that the second electrode is separated from the first electrode by a non-electrically conducting region, wherein the non-electrically conducting region has a non-uniform permittivity (K) value. The capacitor devices will find benefit for use in electric vehicles, of all kinds, uninterruptible power supplies, wind turbines, mobile phones, and the like requiring wide temperature ranges from several hundreds of degrees C. down to absolute zero, consumer electronics operating in a temperature range of ?55 degrees C.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: April 27, 2021
    Assignee: GranBlueTech, L.L.C.
    Inventor: John P. Snyder
  • Patent number: 10984955
    Abstract: An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: April 20, 2021
    Assignee: KEMET Electronics Corporation
    Inventors: John Bultitude, John E. McConnell, Galen W. Miller
  • Patent number: 10978254
    Abstract: Disclosed are tantalum capacitors having enhanced volumetric efficiency, effective series resistance, effective series inductance, and high frequency performance when compared to existing tantalum capacitors. Also disclosed is a screening process for tantalum capacitors to enhance reliability.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: April 13, 2021
    Assignee: VISHAY SPRAGUE, INC.
    Inventors: Alex Eidelman, Yongjian Qiu, Pavel Vaisman, Yuri Stangrit, Rita Eisenberg, Natali Ostrovsky
  • Patent number: 10971302
    Abstract: A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are alternately stacked and the internal electrode layers are alternately exposed to two end faces; and external electrodes formed on the two end faces; wherein: a relationship “M??0.00002×EM+0.0012” is satisfied, when a length of end margins in a direction in which the two end faces face with each other is EM [?m] and a ratio of Mo [atm %] to a B site element [atm %] of a main component ceramic in the end margins is M, wherein the end margin is a region, in which internal electrode layers connected to one of the external electrodes without sandwiching internal electrode layers connected to the other of the external electrode, face with each other, in the multilayer chip.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: April 6, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Atsuhiro Yanagisawa, Yoshinori Shibata, Mikio Tahara
  • Patent number: 10957487
    Abstract: A multilayer ceramic capacitor includes a laminated body including dielectric layers and internal electrodes alternately laminated, and an external electrode provided on the surface of the laminated body and connected to the internal electrodes. The internal electrode includes a facing electrode portion facing another internal electrode with the dielectric layer provided therebetween, and an extended electrode portion extended from the facing electrode portion to the surface of the laminated body and connected to the external electrode. At least one layer of the internal electrodes includes a bent portion in the extended electrode portion. The distance between extended electrode portions adjacent to each other in the lamination direction narrows from the end portion of the facing electrode portion toward the bent portion, and widens from the bent portion toward the end portion of the extended electrode portion on the external electrode side.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: March 23, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Akira Ishizuka, Hiroyuki Hirano, Takatoshi Sueto, Masatoshi Yanagihara
  • Patent number: 10930437
    Abstract: A medical device capacitor assembly can include a capacitor including a plurality of anodes and cathodes, wherein the capacitor has a first major face, a second major face opposite the first major face, and a third face extending between the first major face and the second major face. A first insulating film can be sized and shaped to assemble against the first major face, and can include a first set of flaps sized and shaped to cover at least a portion of the third face. A second insulating film sized and shaped to assemble against the second major face, and can include a second set of flaps sized and shaped to cover at least a portion of the third face.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: February 23, 2021
    Assignee: Cardiac Pacemakers, Inc.
    Inventor: Aaron Louis Floeter
  • Patent number: 10903007
    Abstract: A multi-layer ceramic electronic component includes a ceramic body including a multi-layer unit, a side margin, and ridges. The multi-layer unit includes a capacitance forming unit including ceramic layers laminated in a first direction and internal electrodes disposed between the ceramic layers, a cover that covers the capacitance forming unit in the first direction, and a side surface facing in a second direction orthogonal to the first direction. The side margin covers the side surface. The ridges are rounded and extend in a third direction orthogonal to the first and second directions. The capacitance forming unit includes a first region disposed at a center portion in the first direction, and a second region disposed between the cover and the first region, end portions of the internal electrodes in the second direction in the second region being positioned inward in the second direction relative to those in the first region.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: January 26, 2021
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Ryo Ono, Tetsuhiko Fukuoka, Shoji Kusumoto, Akihiko Kono
  • Patent number: 10894165
    Abstract: The present invention provides a feedthrough device including: a feedthrough substrate made of an insulator and having a first surface and a second surface; at least one first feedthrough conductor having a terminal exposed to the first surface of the feedthrough substrate and a body connected to the terminal and not exposed to the outside of the feedthrough substrate; and at least one second feedthrough conductor having a terminal exposed to the second surface of the feedthrough substrate and a body connected to the terminal and not exposed to the outside of the feedthrough substrate, and corresponding to the first feedthrough conductor in a one-to-one manner to be paired therewith, wherein a body of each first feedthrough conductor and a body of each second feedthrough conductor corresponding thereto are arranged to be capacitively coupled with each other.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: January 19, 2021
    Inventor: Kyou Sik Min
  • Patent number: 10894164
    Abstract: Flexible semi-hermetic implantable medical device (IMD) structure, including a flexible device body, at least one flexible lead and at least one respective transition unit, for respectively coupling each flexible lead to the flexible device body, the flexible device body including a plurality of hermetically sealed components, at least one electrical cable harness and an external flexible polymer structure, each one of the hermetically sealed components including at least one hermetically sealed electrical connection and at least some of the hermetically sealed components including at least one separation dome, the electrical cable harness for electrically and mechanically coupling the plurality of hermetically sealed components together and the external flexible polymer structure for encapsulating the hermetically sealed components, the electrical cable harness and the respective transition unit.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: January 19, 2021
    Assignee: NewPace Ltd.
    Inventors: Gera Strommer, Avraham Broder, Dan Seter, Mordechay Mocha, Ziv Belsky, Itzhak Shmarak, Jonathan Bar Or
  • Patent number: 10892102
    Abstract: A multi-layer ceramic capacitor includes: a ceramic body including ceramic layers laminated along one axial direction, first and second internal electrodes alternately disposed between the ceramic layers, first and second end surfaces to which the first and second internal electrodes are respectively drawn, a first end margin that forms an interval between the first end surface and the second internal electrodes, and a second end margin that forms an interval between the second end surface and the first internal electrodes; and first and second external electrodes that respectively cover the first and second end surfaces and are respectively connected to the first and second internal electrodes, the multi-layer ceramic capacitor satisfying the following relationship: SE?S/400+300, where S (?m) represents an area of the ceramic body and SE (?m) represents a total area of the first and second internal electrodes in cross sections of the first and second end margins.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: January 12, 2021
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Jyouji Ariga, Katsuo Sakatsume, Masumi Ishii, Takeshi Nosaki, Norihiro Arai, Yasushi Inoue
  • Patent number: 10872726
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other with one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. The dielectric layer includes dielectric grains, a grain boundary is present between at least two dielectric grains of the dielectric grains, and a Si/Ti mole ratio in the grain boundary satisfies 15% to 40%.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: December 22, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kum Jin Park, Kwang Hee Nam, Young Bin Jeong, Myung Woo Lee, Jong Han Kim
  • Patent number: 10872727
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other with one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. The dielectric layer includes dielectric grains, a grain boundary is present between at least two dielectric grains of the dielectric grains, and a Si/Ti mole ratio in the grain boundary satisfies 15% to 40%.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: December 22, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kum Jin Park, Kwang Hee Nam, Young Bin Jeong, Myung Woo Lee, Jong Han Kim
  • Patent number: 10854385
    Abstract: A method for producing a ceramic substrate that includes a substrate body having ceramic layers and columnar projecting electrodes on a first primary surface of the substrate body. The method includes a step of preparing electrode formation sheets for forming the projecting electrodes, a step of perforating the electrode formation sheets with through holes and filling the through holes with a first electrically conductive paste containing a first electrically conductive powder, a step of building a composite multilayer body by stacking ceramic green sheets and the electrode formation sheets on a first primary surface of the stack of ceramic green sheets. The first electrically conductive powder contains electrically conductive metal(s) and anti-sintering ceramic(s) that controls the sintering of particles of the electrically conductive metal(s), with at least part of the surface of the particles of the electrically conductive metal(s) covered with the anti-sintering ceramic(s).
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: December 1, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kumiko Ishikawa, Seiji Fujita, Tsutomu Sasaki
  • Patent number: 10854388
    Abstract: A ceramic electronic component includes a ceramic body, a sintered metal film, and a metal terminal. The ceramic body includes internal electrodes. The sintered metal film has a joint surface having a surface roughness Ra of 0.200 ?m or less. The sintered metal film is connected to the internal electrodes and formed on a surface of the ceramic body. The metal terminal is jointed to the joint surface.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: December 1, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Masaki Mochigi, Kazuya Sato, Yousuke Nakada
  • Patent number: 10814493
    Abstract: A capacitive or resistive tactile sensor having a conductive membrane, a flexible dielectric or weakly conductive sheet and a substrate having electrodes, and a method of manufacturing thereof. The flexible sheet has a first surface and an opposite second surface, the first surface and the second surface are uniformly distanced when at rest. The first surface is adapted to contact one of the conductive membrane or the substrate. The second surface is adapted to contact another one of the conductive membrane or the substrate. The body defines between the first and second surfaces, at a predetermined region, a plurality of laser ablated uniform cavities that are evenly distributed and operatively identical in order to provide a known compression index at the predetermined region of the flexible sheet.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: October 27, 2020
    Assignee: ROBOTIQ INC.
    Inventors: Vincent Duchaine, Thuy Hong Loan Le, Alexis Maslyczyk, Axay Kumar Rana