Electric Condenser Making Patents (Class 29/25.41)
  • Patent number: 10871407
    Abstract: Sensor devices comprise a sensor die having a first membrane between a first outside surface and a buried cavity, and a second membrane between the buried cavity and a recessed section of the sensor die forming a backside cavity, wherein the first and second membranes oriented vertically adjacent one another. The sensor die comprises first and second members that are attached together, the buried cavity is formed between the members, and the first member comprises the first diaphragm and the second member comprises the second diaphragm. The membranes are configured to enable sensing over different ranges. Electrical sensing elements are in the sensor die for measuring movement of each of the first and second sensing membranes over the different ranges. Electrical contacts connected with sensing elements are exposed along a sensor die surface for providing an output signal for monitoring by an external device.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: December 22, 2020
    Assignee: MEASUREMENT SPECIALTIES, INC.
    Inventors: Ya-Mei Chen, James Hoffman
  • Patent number: 10739218
    Abstract: Pressure sensors having ring-tensioned membranes are disclosed. A tensioning ring is bonded to a membrane in a manner that results in the tensioning ring applying a tensile force to the membrane, flattening the membrane and reducing or eliminating defects that may have occurred during production. The membrane is bonded to the sensor housing at a point outside the tensioning ring, preventing the process of bonding the membrane to the housing from introducing defects into the tensioned portion of the membrane. A dielectric may be introduced into the gap between the membrane and the counter electrode in a capacitive pressure sensor, resulting in an improved dynamic range.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: August 11, 2020
    Assignee: THE ALFRED E. MANN FOUNDATION FOR SCIENTIFIC RESEARCH
    Inventors: Siegmar Schmidt, William A. Dai, Boon Khai Ng
  • Patent number: 10670019
    Abstract: A pump assembly for use in an additive manufacturing system includes a viscosity pump having a first end and a second end wherein the first end has a cross sectional area greater than a cross sectional area of the second end. The viscosity pump has a conical shaped inner surface defining a pump chamber, an inlet proximate the first end and an outlet proximate the second end. The viscosity pump includes an impeller having an axis of rotation, where the impeller has a shaft positioned through the first end of the first housing and into the pump chamber. The impeller includes a distal tip-end at a distal end of the shaft wherein the impeller is configured to be axially displaced within the pump chamber of the viscosity pump parallel to the axis of rotation. An actuator is coupled to a proximal end of the impeller, wherein the actuator is configured to move the impeller parallel to the axis of rotation.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: June 2, 2020
    Assignee: STRATASYS, INC.
    Inventors: Robert L. Zinniel, J. Samuel Batchelder
  • Patent number: 10604405
    Abstract: A method for forming a microelectromechanical systems (MEMS) device may include performing a first silicon-on-nothing process to form a first cavity in a substrate. The method may include depositing an epitaxial layer on a surface of the substrate. The method may include performing a second silicon-on-nothing process to form a second cavity in the epitaxial layer. The method may include exposing the first cavity and the second cavity by removing a portion of the substrate and the epitaxial layer.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: March 31, 2020
    Assignee: Infineon Technologies Dresden GmbH
    Inventor: Thoralf Kautzsch
  • Patent number: 10593475
    Abstract: A multi-layer ceramic capacitor includes: a ceramic body that includes a plurality of ceramic layers laminated in one axial direction and includes polycrystal having a Perovskite structure as a main phase, the Perovskite structure containing calcium and zirconium and being expressed by a general expression ABO3, the polycrystal containing silicon, boron, and lithium; first and second internal electrodes alternately disposed between the ceramic layers; a first external electrode provided on an outer surface of the ceramic body and connected to the first internal electrodes; and a second external electrode provided on the outer surface of the ceramic body and connected to the second internal electrodes, the multi-layer ceramic capacitor satisfying 0.2858V+0.4371?CLi?0.1306V+3.0391, where V (mm3) represents a volume of the ceramic body, and CLi (atm %) represents a concentration of the lithium when a concentration of a B-site element of the main phase of the polycrystal is 100 atm %.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: March 17, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Norihiro Arai, Katsuo Sakatsume, Takeshi Nosaki, Masumi Ishii, Joji Ariga
  • Patent number: 10567886
    Abstract: For manufacturing a sound transducer structure, membrane support material is applied on a first main surface of a membrane carrier material and membrane material is applied in a sound transducing region and an edge region on a surface of the membrane support material. In addition, counter electrode support material is applied on a surface of the membrane material and recesses are formed in the sound transducing region of the membrane material. Counter electrode material is applied to the counter electrode support material and membrane carrier material and membrane support material are removed in the sound transducing region to the membrane material.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: February 18, 2020
    Assignee: Infineon Technologies AG
    Inventors: Alfons Dehe, Stefan Barzen, Marc Fueldner
  • Patent number: 10517167
    Abstract: Systems and methods for providing a PWB. The methods comprise: forming a Core Substrate (“CS”) a First Via (“FV”) formed therethrough; disposing a First Trace (“FT”) on an exposed surface of CS that is in electrical contact with FV; laminating a first HDI substrate to CS such that FT electrically connects FV via with a Second Via (“SV”) formed through the first HDI substrate; disposing a Second Trace (“ST”) on an exposed surface of the first HDI substrate that is in electrical contact with SV; and laminating a second HDI substrate to the first HDI substrate such that ST electrically connects SV to a Third Via (“TV”) formed through the second HDI substrate. SV comprises a buried via with a central axis spatially offset from central axis of FV and SV. FV and SV have diameters which are smaller than TV's diameter.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: December 24, 2019
    Assignee: Eagle Technology, LLC
    Inventors: Michael T. DeRoy, Marvin D. Miller, Andres M. Gonzalez, David Cure, Tena M. Hochard
  • Patent number: 10488288
    Abstract: Aspects of the disclosure provide a capacitive pressure sensor. The sensor can include a first substrate having a first surface and a second surface, a movable plate at a bottom of a first cavity recessed into the substrate from the first surface, and a second substrate bonded to the first substrate over the first surface. The second substrate includes a fixed plate disposed over the movable plate to form a capacitor. A second cavity is formed between the movable plate and the second surface.
    Type: Grant
    Filed: February 22, 2017
    Date of Patent: November 26, 2019
    Inventors: Kathirgamasundaram Sooriakumar, Anu Austin, Ian Rose Bihag, Dieter Naegele-Preissmann
  • Patent number: 10475584
    Abstract: An electronic component mount structure includes an electronic component and a mount substrate. The electronic component includes a multilayer body including dielectric layers, internal electrode layers and an insulating layer stacked in a stacking direction. The multilayer body includes two main surfaces opposed to each other in the stacking direction, two side surfaces opposed to each other in a width direction perpendicular to the stacking direction, and two end surfaces opposed to each other in a length direction perpendicular to the stacking and width directions. An insulator is provided on the side surfaces of the multilayer body. The mount substrate includes a land electrode on a mount surface. The electronic component is mounted on the land electrode with a solder fillet being interposed such that the side surfaces are perpendicular to the mount surface. The land electrode is smaller in the width direction than the electronic component.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: November 12, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Akio Masunari
  • Patent number: 10453591
    Abstract: An end closure for a superconductive electric cable which has at least one superconductive conductor which is surrounded by a tubular cryostat serving for conducting a cooling agent, which at its end is surrounded by a housing. The housing (G) has two walls (7, 8) which are separated from each other by an intermediate space (9) and having insulating material, wherein a thermal insulation containing gas is placed in the intermediate space. The pressure in the intermediate space (9) of the housing (G) is adjusted to a value of between 10?9 mbar and 1000 mbar and, connected to the intermediate space (9) are a pressure measuring device (12) and a vacuum pump (11) which serve for adjusting the pressure prevailing in the intermediate space (9) of the housing (G).
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: October 22, 2019
    Assignee: NEXANS
    Inventors: Erik Marzahn, Mark Stemmle
  • Patent number: 10444054
    Abstract: Sensor probes for capacitance-type liquid level sensors do not comprise an acceptable balance between cost, performance and durability for mobile applications. An improved sensor probe is provided. A first electrode comprises two or more first plate sections arranged in angular relationship with respect to each other. A second electrode comprises two or more second plate sections arranged in angular relationship with respect to each other. Spacers are located between the first and second electrodes such that each first plate section is spaced apart in parallel and substantially overlapping relationship with respective second plate sections. Fasteners securely fix the first and second electrodes in position.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: October 15, 2019
    Assignee: WESTPORT POWER INC.
    Inventor: Gregory C. Harper
  • Patent number: 10431386
    Abstract: A multilayer electronic component includes a main body including an active region in which a plurality of internal electrodes are stacked with respective dielectric layers interposed therebetween, and upper and lower cover regions disposed above and below the active region, respectively, external electrodes disposed on external surfaces of the main body and electrically connected to the plurality of internal electrodes, and a composite body disposed below the lower cover region of the main body and lower portions of the external electrodes.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: October 1, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Soo Kim, Moon Soo Park, Jong Ho Lee, Hyuk Jin Hong
  • Patent number: 10403438
    Abstract: In an embodiment, a multilayer ceramic capacitor 10 has supplementary dielectric layers 11d covering the spaces between two first base conductor films 11c on both height-direction faces of a capacitive element 11?, respectively, in such a way that clearances CL are left between the first base conductor films 11c and the supplementary dielectric layers 11d in the length direction. External electrodes 12, 13 each have a second base conductor film 12a, 13a and a surface conductor film 12b, 13b, and the wraparound locations 12b1, 13b1 of each surface conductor film 12b, 13b have insertion parts 12b2, 13b2 that fill in the clearances CL. The multilayer ceramic capacitor can mitigate deterioration in moisture resistance.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: September 3, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: So Sato, Yoshiaki Iijima, Takashi Sasaki
  • Patent number: 10395840
    Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers disposed therebetween, first and second external electrodes disposed on first and second external surfaces of the ceramic body, respectively, the first and second external electrodes each including first and second base electrode layers having at least a portion in contact with first and second external surfaces of the ceramic body, respectively, and first and second plating layers disposed to cover the first and second base electrode layers, respectively, and a water repellent layer disposed to cover both external side surfaces of the first and second plating layers and a surface of the ceramic body.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: August 27, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chae Min Park, Ki Won Kim, Ji Hee Moon, Dong Hwi Shin, Sang Soo Park, Woo Chul Shin
  • Patent number: 10395839
    Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes, first and second external electrodes disposed on first and second external surfaces of the ceramic body, respectively, the first and second external electrodes each including first and second base electrode layers having at least a portion in contact with first and second external surfaces of the ceramic body, respectively, and first and second plating layers, and a water repellent layer including a portion disposed to cover a gap between the ceramic body and the first and second plating layers, having a first thickness and a portion disposed to cover a surface of the ceramic body, to having a second thickness, smaller than the first thickness.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: August 27, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chae Min Park, Ki Won Kim, Ji Hee Moon, Dong Hwi Shin, Sang Soo Park, Woo Chul Shin
  • Patent number: 10373758
    Abstract: It is an object to provide an electrically insulating oil composition that can maintain dielectric breakdown voltage high in a wide temperature range of ?50° C. to 65° C., and can suppress a decrease in dielectric breakdown voltage even in the case of use at high temperature for a long time, and there is provided an electrically insulating oil composition comprising 1,1-diphenylethane and benzyltoluene, wherein the proportion of a para isomer in the benzyltoluene is 45% by mass or more based on a total amount of the benzyltoluene.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: August 6, 2019
    Assignee: JXTG NIPPON OIL & ENERGY CORPORATION
    Inventors: Takashi Morikita, Hiroyuki Hoshino
  • Patent number: 10361035
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, disposed on an outer surface of the ceramic body. Each of the first and second external electrodes includes a first electrode layer including a conductive metal and a plating layer disposed on the first electrode layer. The first electrode layer extends beyond the plating layer on the ceramic body, and includes a first area covered by the plating layer, and a second area extending from the first area, and an insulating layer covers the second area.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: July 23, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Woo Song, Jin Man Jung, Sang Soo Park, Jin Kyung Joo, Woo Chul Shin, Min Gon Lee
  • Patent number: 10297387
    Abstract: A capacitor includes a body including a dielectric layer, first internal electrodes and second internal electrodes. Each of the first internal electrodes and each of the second internal electrodes are alternately disposed with the dielectric layer interposed therebetween. A first connection electrode is disposed on a first end surface of the body to connect an end of the first internal electrodes. A second connection electrode is disposed on a second end surface of the body opposite to the first end surface to connect an end of the second internal electrodes. A first insulating layer is disposed on one surface of the body. A first terminal electrode and a second terminal electrode are respectively disposed on opposing end surfaces of the first insulating layer to connect the first connection electrode and the second connection electrode, respectively. A second insulating layer is disposed on another surface of the body.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: May 21, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Heung Kil Park, Jong Hwan Park, Se Hun Park
  • Patent number: 10236129
    Abstract: A method for manufacturing an electrolytic capacitor according to the present disclosure includes a first step to a third step described below. The electrolytic capacitor includes an anode body having a dielectric layer, and a solid electrolyte layer formed on a surface of the dielectric layer. The first step is a step of preparing a first treatment solution by dissolving or dispersing a conductive polymer in a liquid first component and leaving a conductive polymer solution or a conductive polymer dispersion liquid to stand for a first period. The second step is a step of preparing a second treatment solution by mixing the first treatment solution with a second component. The third step is a step of forming a solid electrolyte layer on a surface of the dielectric layer by applying the second treatment solution to the surface of the dielectric layer.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: March 19, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventor: Yoshiaki Ishimaru
  • Patent number: 10186367
    Abstract: An electronic component includes a body having a bottom surface provided as a mounting surface, a top surface opposing the bottom surface, first and second side surfaces opposing each other in a width direction, and third and fourth end surfaces opposing each other in a length direction, a conductor part disposed therein, first and second external electrodes spaced apart from each other on the bottom surface of the body and connected to the conductor part, and a first insulating coating layer on the top surface of the body and a second insulating coating layer on the bottom surface of the body.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: January 22, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Wook Lee, Jae Yeol Choi, Sung Kwon Oh, Min Sung Choi, Ji Hea Kim
  • Patent number: 10139300
    Abstract: Provided is a pressure measuring device that can stably bond a strain detection element even to a diaphragm made of metal having a large coefficient of thermal expansion. In order to achieve the above object, the pressure measuring device of the present invention includes: a metal housing including a pressure introduction unit and a diaphragm deformed by a pressure introduced via the pressure introduction unit; and a strain detection element for detecting strain generated in the diaphragm, wherein a base made of a first brittle material is provided on the metal housing, and the strain detection element is bonded to the base via a second brittle material having a melting point lower than a melting point of the base.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: November 27, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Masayuki Hio, Mizuki Shibata
  • Patent number: 10121595
    Abstract: A multilayer ceramic electronic component includes a first plating layer in contact with a first organic layer and a second plating layer in contact with a second organic layer. When the first organic layer disposed on a first base electrode layer located on a first principal surface or a second principal surface, or the second organic layer disposed on a second base electrode layer located thereon, is referred to as an organic layer principal surface portion, and when the first organic layer disposed on the first base electrode layer located on a first end surface or a second end surface, or the second organic layer disposed on the second base electrode layer located thereon, is referred to as an organic layer end surface portion, the surface roughness of the organic layer end surface portion is larger than the surface roughness of the organic layer principal surface portion.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: November 6, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Nobuyasu Hamamori, Hiroshi Asano, Yoshiyuki Nomura, Koji Matsushita, Ichitaro Okamura
  • Patent number: 10079100
    Abstract: Provided is a capacitor, which includes a first electrode including aluminum, a second electrode facing the first electrode, and a first dielectric layer interposed between the first electrode and the second electrode, including aluminum oxide, and having multiple pores defined in a surface of the first dielectric layer in contact with the second electrode.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: September 18, 2018
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Su-jeong Suh, Jin-ha Shin, Chang-hyoung Lee
  • Patent number: 9998843
    Abstract: The present disclosure provides one embodiment of an integrated microphone structure. The integrated microphone structure includes a first silicon substrate patterned as a first plate. A silicon oxide layer formed on one side of the first silicon substrate. A second silicon substrate bonded to the first substrate through the silicon oxide layer such that the silicon oxide layer is sandwiched between the first and second silicon substrates. A diaphragm secured on the silicon oxide layer and disposed between the first and second silicon substrates such that the first plate and the diaphragm are configured to form a capacitive microphone.
    Type: Grant
    Filed: February 8, 2016
    Date of Patent: June 12, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jung-Huei Peng, Chia-Hua Chu, Chun-wen Cheng, Chin-Yi Cho, Li-Min Hung, Yao-Te Huang
  • Patent number: 9978528
    Abstract: A capacitor having at least two side-by-side anodes with a cathode current collector disposed between the anodes and housed inside a casing is described. Cathode active material is supported on the opposed major faces of the current collector and the current collector/cathode active material subassembly is housed in a first separator envelope. The first separator envelope is positioned between the side-by-side anodes and this electrode assembly is then contained in a second separator envelope. The two anodes can be connected in parallel inside or outside casing, or they can be unconnected to each other. There is also cathode active material supported on inner surfaces of the casing in a face-to-face alignment with an adjacent one of the anodes. That way, the second separator envelope also prevents direct physical contact between the anode pellets and the cathode active material supported on the casing sidewalls.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: May 22, 2018
    Assignee: Greatbatch Ltd.
    Inventors: Jason T. Hahl, Barry C. Muffoletto, Todd C. Sutay, Glenn A. Dumais, Wendy J. Baumler
  • Patent number: 9929231
    Abstract: An electronic component includes a body part and a via part. The body part includes first and second metal layers disposed with at least one dielectric layer interposed therebetween. The via part is disposed in the body part and includes first and second vias penetrating through the body part and selectively connected to the first and second metal layers, respectively. The first and second metal layers contain different metals. In some examples, a first insulating film is disposed between the first metal layer and the second via to electrically insulate the second via from the first metal layer, and a second insulating film is disposed between the second metal layer and the first via to electrically insulate the first via from the second metal layer. A method for forming the electronic component includes use of first and second etchants to selectively etch the first and second metal layers.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: March 27, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hai Joon Lee, Makoto Kosaki, Ji Hyun Park, Jong Bong Lim
  • Patent number: 9875847
    Abstract: A multilayer ceramic electronic component includes a plurality of dielectric layers; and internal electrodes disposed on the dielectric layers and containing an additive. The additive contains lithium (Li) and a dielectric material.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: January 23, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Gi Sin, Kum Jin Park, Jong Hoon Yoo, Chi Hwa Lee, Chang Hak Choi
  • Patent number: 9857390
    Abstract: A physical quantity sensor has a package, which is provided with a substrate and a lid and has an internal space inside, and a functional element which is accommodated in the internal space, the lid is formed on a partition wall section which is provided on the periphery of the internal space in planar view and has a communication hole which causes a lower surface at the substrate side to communicate with an upper surface at the opposite side to the substrate, and the communication hole communicates with the internal space via a groove which is formed in the substrate.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: January 2, 2018
    Assignee: Seiko Epson Corporation
    Inventor: Teruo Takizawa
  • Patent number: 9804045
    Abstract: A method of manufacturing an overheat or fire alarm detection system, comprises the steps of micromachining a pressure sensor and securing a sensor tube in fluid communication with the pressure sensor. The sensor tube may comprise a hollow tube containing a material that evolves gas upon heating. The micromachining step may comprise doping at least a portion of a first layer, forming a cavity at least partially within the doped portion and forming a deformable diaphragm over the cavity.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: October 31, 2017
    Assignee: KIDDE TECHNOLOGIES, INC.
    Inventors: Paul Rennie, Paul D. Smith
  • Patent number: 9767950
    Abstract: A multilayer electronic component may include: a magnetic body in which a plurality of magnetic layers are stacked; and conductor patterns formed on the magnetic body. The magnetic body may include: metal magnetic particles; an oxide film formed on a surface of the metal magnetic particle as a first oxide obtained by oxidation of at least one component of the metal magnetic particle; and a filling portion formed in a space between the metal magnetic particles as a second oxide obtained by oxidization of at least one component of the metal magnetic particle. At least one of the first oxide and the second oxide is provided between adjacent metal magnetic particles, and an oxide film formed on a surface of a metal magnetic particle forms a neck portion with an oxide film formed on a surface of an adjacent metal magnetic particle.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: September 19, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Myeong Gi Kim, Il Jin Park, Ho Yoon Kim, Jin Woo Hahn, Min Kyoung Cheon
  • Patent number: 9756720
    Abstract: An apparatus has a permittivity attenuation layer interposed between a substrate and a first conductive trace, wherein the permittivity attenuation layer comprises a resin matrix containing functionalized carbon nanomaterial, such as functionalized single-wall carbon nanotubes (f-SWNTs). In some embodiments, a design structure for designing, manufacturing, or testing the apparatus is tangibly embodied in a machine readable medium. In some embodiments, the apparatus comprises an enhanced laminate core for use in a printed wiring board (PWB) that contains a differential pair having an inner-leg conductive trace and an outer-leg conductive trace. A permittivity attenuation layer is interposed between the inner-leg conductive trace and a laminate core, wherein the loading level of f-SWNTs in the permittivity attenuation layer is selected to attenuate the permittivity of the inner-leg conductive trace to match the permittivity of the outer-leg conductive trace.
    Type: Grant
    Filed: July 9, 2016
    Date of Patent: September 5, 2017
    Assignee: International Business Machines Corporation
    Inventors: Dylan J. Boday, Samuel R. Connor, Joseph Kuczynski
  • Patent number: 9744624
    Abstract: Disclosed is a method for manufacturing a circuit board, including preparing a substrate having a resin layer and a stop layer, forming at least one conduction hole penetrating the resin layer and stopping at the stop layer, forming a first metal layer through a sputtering process, forming a second metal layer on the first metal layer through a chemical plating process, forming a third metal layer having a circuit pattern, exposing part of the second metal layer and filling up the conduction hole through an electroplating process, and etching the second metal layer and the first metal layer under the second metal layer to expose the resin layer under the first metal layer. Since the first metal layer provides excellent surface properties, the second and third metal layers are well fixed and stable. The etched circuit pattern has a line width/pitch less than 10 ?m for fine line width/pitch.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: August 29, 2017
    Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventors: Jaen-Don Lan, Pin-Chung Lin, Chen-Rui Tseng, Cheng-En Ho, Yu-An Chen
  • Patent number: 9704649
    Abstract: In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.
    Type: Grant
    Filed: May 12, 2011
    Date of Patent: July 11, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Junichi Saito, Toshihiko Kobayashi, Makoto Ogawa, Akihiro Motoki, Kenichi Kawasaki, Tatsuo Kunishi
  • Patent number: 9660019
    Abstract: A concentric capacitor structure generally comprising concentric capacitors is disclosed. Each concentric capacitor comprises a first plurality of perimeter plates formed on a first layer of a substrate and a second plurality of perimeter plates formed on a second layer of the substrate. The first plurality of perimeter plates extend in a first direction and the second plurality of perimeter plates extend in a second direction different than the first direction. A first set of the first plurality of perimeter plates is electrically coupled to a first set of the second plurality of perimeter plates and a second set of the first plurality of perimeter plates is electrically coupled to a second set of the second plurality of perimeter plates. A plurality of capacitive cross-plates are formed in the first layer such that each cross-plate overlaps least two of the second plurality of perimeter plates.
    Type: Grant
    Filed: March 21, 2016
    Date of Patent: May 23, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ying-Ta Lu, Chi-Hsien Lin, Hsien-Yuan Liao, Ho-Hsiang Chen, Tzu-Jin Yeh
  • Patent number: 9618412
    Abstract: A semiconductor physical quantity sensor includes: a first base material; an electrode formed on the first base material; a diaphragm which bends in accordance with a physical quantity applied from the outside; a second base material fixed to the first base material and supporting the diaphragm such that the diaphragm is opposed to the electrode with a space (S) in between; and an insulator formed on a surface on the first base material side of the diaphragm. Moreover, a wall portion to define the space (S) is formed between the insulator and the electrode.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: April 11, 2017
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Kazushi Kataoka, Jun Ogihara, Naoki Ushiyama, Hisanori Shiroishi
  • Patent number: 9568136
    Abstract: A replaceable seal system with high and low sides connectable to a coplanar inlet plate on a pressure transmitter. A first side of the seal system can be replaced without disturbing the sealing of a second side of the seal system. The seal system includes a stack of first and second plates with a central split line. At least one of the first and second plates is split along the central split line to provide for separate replacement on only one side of the system.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: February 14, 2017
    Assignee: Rosemount, Inc.
    Inventors: Paul Fadell, Liu Yang
  • Patent number: 9546923
    Abstract: Embodiments relate to sensors and more particularly to structures for and methods of forming sensors that are easier to manufacture as integrated components and provide improved deflection of a sensor membrane, lamella or other movable element. In embodiments, a sensor comprises a support structure for a lamella, membrane or other movable element. The support structure comprises a plurality of support elements that hold or carry the movable element. The support elements can comprise individual points or feet-like elements, rather than a conventional interconnected frame, that enable improved motion of the movable element, easier removal of a sacrificial layer between the movable element and substrate during manufacture and a more favorable deflection ratio, among other benefits.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: January 17, 2017
    Assignee: Infineon Technologies Dresden GmbH
    Inventors: Thoralf Kautzsch, Heiko Fröhlich, Mirko Vogt, Maik Stegemann, Andre Röth, Bernhard Winkler, Boris Binder
  • Patent number: 9536663
    Abstract: A metallized film capacitor includes an element formed by cutting a laminate made of a pair of metallized films to a predetermined length, and the element includes metallized contact electrodes disposed on both end faces in a width direction of the element. On each dielectric film, there are formed a protection mechanism portion including a plurality of segmented electrodes that are coupled with each other via a fuse, a solid electrode connecting with the metallized contact electrode of a corresponding polarity, and a vertical pattern extending across the dielectric film in the length direction between the protection mechanism portion and the solid electrode. The position and the width of the vertical pattern are set such that the range of the vertical pattern in the width direction overlaps the vertical pattern of a metallized film which forms a pair.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: January 3, 2017
    Assignee: Kojima Industries Corporation
    Inventor: Naoya Hirota
  • Patent number: 9508677
    Abstract: In one embodiment, a chip package assembly can include: a first substrate at a bottom layer, the first substrate having a first surface and a second surface opposite to the first surface, where the second surface is provided with a first group of inner leads; at least one chip layer above the first group of inner leads, where each of the chip layers comprises a third surface and a fourth surface opposite to the third surface, where electrodes on the third surface that that lie at the lowest level are electrically coupled to the first group of inner leads through a first connector; and a second substrate above the fourth surface on the topmost layer and having a fifth surface, and where the fifth surface is provided with a second group of inner leads electrically coupled to the electrodes on the fourth surface on the topmost layer.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: November 29, 2016
    Assignee: Silergy Semiconductor Technology (Hangzhou) LTD
    Inventors: Jiaming Ye, Junli Shentu
  • Patent number: 9411159
    Abstract: Disclosed embodiments demonstrate batch processing methods for producing optical windows for microdevices. The windows protect the active elements of the microdevice from contaminants, while allowing light to pass into and out of the hermetically sealed microdevice package. Windows may be batch produced, reducing the cost of production, by fusing multiple metal frames to a single sheet of glass. In order to allow windows to be welded atop packages, disclosed embodiments keep a lip of metal without any glass after the metal frames are fused to the sheet of glass. Several techniques may accomplish this goal, including grinding grooves in the glass to provide a gap that prevents fusion of the glass to the metal frames along the outside edges in order to form a lip. The disclosed batch processing techniques may allow for more efficient window production, taking advantage of the economy of scale.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: August 9, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Wei-Yan Shih, Bradley M. Haskett
  • Patent number: 9377487
    Abstract: An improved MEMS transducer apparatus and method is provided. The apparatus has a movable base structure including an outer surface region and at least one portion removed to form at least one inner surface region. At least one intermediate anchor structure is disposed within the inner surface region. The apparatus includes an intermediate spring structure operably coupled to the central anchor structure, and at least one portion of the inner surface region. A capacitor element is disposed within the inner surface region.
    Type: Grant
    Filed: June 20, 2013
    Date of Patent: June 28, 2016
    Assignee: mCube Inc.
    Inventors: Daniel N. Koury, Jr., Sudheer Sridharamurthy
  • Patent number: 9355970
    Abstract: An embodiment of the invention provides a chip package including a semiconductor substrate having a first surface and a second surface opposite thereto. A conducting pad is located on the first surface. A side recess is on at least a first side of the semiconductor substrate, wherein the side recess extends from the first surface toward the second surface and across the entire length of the first side. A conducting layer is located on the first surface and electrically connected to the conducting pad, wherein the conducting layer extends to the side recess.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: May 31, 2016
    Assignee: XINTEC INC.
    Inventors: Yu-Lung Huang, Chao-Yen Lin, Wei-Luen Suen, Chien-Hui Chen
  • Patent number: 9352959
    Abstract: The disclosure relates to method and apparatus for micro-contact printing of micro-electromechanical systems (“MEMS”) in a solvent-free environment. The disclosed embodiments enable forming a composite membrane over a parylene layer and transferring the composite structure to a receiving structure to form one or more microcavities covered by the composite membrane. The parylene film may have a thickness in the range of about 100 nm-2 microns; 100 nm-1 micron, 200-300 nm, 300-500 nm, 500 nm to 1 micron and 1-30 microns. Next, one or more secondary layers are formed over the parylene to create a composite membrane. The composite membrane may have a thickness of about 100 nm to 700 nm to several microns. The composite membrane's deflection in response to external forces can be measured to provide a contact-less detector. Conversely, the composite membrane may be actuated using an external bias to cause deflection commensurate with the applied bias.
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: May 31, 2016
    Assignee: Massachusetts Institute of Technology
    Inventors: Vladimir Bulovic, Jeffrey Hastings Lang, Annie I-Jen Wang, Apoorva Murarka, Wendi Chang
  • Patent number: 9099245
    Abstract: A multilayer ceramic electronic component includes a ceramic main body having internal and floating electrode layers laminated therein and spaced apart from each other; and external electrodes formed on ends of the ceramic main body and including a first layer including a conductive metal and a second layer formed on the first layer and including a conductive resin. When Tc is thickness of a cover layer, G is gap between internal electrodes, L1 is length from either end of the ceramic main body in a length direction thereof to an end of the first layer formed on the upper or lower surface of the ceramic main body, Te is thickness of the internal electrode, Td is distance between internal and floating electrode layers, Lm is length of a margin part of the floating electrode layer, and L is length of the ceramic main body, Tc?80 ?m, (1.5)Lm?G?(L?2Lm), and L1<Lm+(Tc+Te+Td)×cot 50° are satisfied.
    Type: Grant
    Filed: January 18, 2013
    Date of Patent: August 4, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Chang Ho Lee
  • Patent number: 9050764
    Abstract: Disclosed embodiments demonstrate batch processing methods for producing optical windows for microdevices. The windows protect the active elements of the microdevice from contaminants, while allowing light to pass into and out of the hermetically sealed microdevice package. Windows may be batch produced, reducing the cost of production, by fusing multiple metal frames to a single sheet of glass. In order to allow windows to be welded atop packages, disclosed embodiments keep a lip of metal without any glass after the metal frames are fused to the sheet of glass. Several techniques may accomplish this goal, including grinding grooves in the glass to provide a gap that prevents fusion of the glass to the metal frames along the outside edges in order to form a lip. The disclosed batch processing techniques may allow for more efficient window production, taking advantage of the economy of scale.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: June 9, 2015
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Wei-Yan Shih, Bradley M. Haskett
  • Publication number: 20150143680
    Abstract: A method for fabricating an EDLC includes (a) coating a porous activated carbon material onto current collector sheets to form carbon-based electrodes, (b) drying the carbon-based electrodes, (c) winding or stacking carbon-based electrodes interleaved with separator sheets to fabricate a jelly roll or prismatic electrode assembly, (d) inserting the electrode assembly into a package and forming electrical connections between the electrode assembly and package terminals, (e) filling the package with a liquid electrolyte, and (f) sealing the package. Steps (a)-(f) are performed in an atmosphere having a low moisture content. The atmosphere may be vacuum or purged with dry gas.
    Type: Application
    Filed: November 22, 2013
    Publication date: May 28, 2015
    Applicant: Corning Incorporated
    Inventors: John Paul Krug, Kamjula Pattabhirami Reddy, James Scott Sutherland, Todd Marshall Wetherill
  • Patent number: 9021689
    Abstract: A method of forming a dual port pressure sensor includes forming a first opening and a second opening in a flag of a lead frame. An encapsulant is molded to hold the lead frame in which the encapsulant is over a top of the flag and a bottom of the flag is uncovered by the encapsulant. A first opening in the encapsulant is aligned with and larger than the first opening in the flag and a second opening in the encapsulant aligned with the second opening in the flag. A pressure sensor transducer is attached to the bottom of the flag to cover the first opening in the flag, wherein the pressure sensor transducer provides an electrically detectable correlation to a pressure differential based on a first pressure received on its top side and a second pressure received on its bottom side. An integrated circuit is attached to the bottom of the flag. The integrated circuit is electrically coupled to the pressure sensor. A lid is attached to the encapsulant to form an enclosure around the bottom of the flag.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: May 5, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Stephen R. Hooper, William G. McDonald
  • Publication number: 20150116903
    Abstract: A composite sheet includes a ceramic green sheet having a lengthwise direction and a conductor film printed on the ceramic green sheet. The conductor film has a shape that has a longitudinal dimension extending in the lengthwise direction and a lateral dimension perpendicular or substantially perpendicular to the longitudinal direction. The conductor film includes a plurality of thickness-varied regions arranged in a row or a plurality of rows extending in the lengthwise direction while being dispersed in the lengthwise direction. The thickness-varied regions have a thickness that is different from a thickness of a portion of the conductor film excluding the thickness-varied regions.
    Type: Application
    Filed: October 27, 2014
    Publication date: April 30, 2015
    Inventors: Yoshiharu KUBOTA, Hironori TSUTSUMI
  • Publication number: 20150113780
    Abstract: A method of manufacturing an electronic component includes the steps of: preparing a first block formed by stacking a plurality of green sheets serving as an element body; cutting the first block in a first direction into a plurality of second blocks such that a portion of an internal conductor connected to an external electrode is exposed at a cut surface; and cutting each of the plurality of second blocks in a second direction crossing the first direction such that the internal conductor exposed at each of both cut surfaces is located in the center of a portion serving as each element body in the first direction in each of the plurality of second blocks.
    Type: Application
    Filed: October 8, 2014
    Publication date: April 30, 2015
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Kengo TSUBOKAWA
  • Patent number: 9017854
    Abstract: Described herein are multi-functional composite materials containing energy storage assemblies that can be significantly resistant to tension/compression stress. The energy storage assemblies can contain at least one energy storage layer that contains an insulating layer having a plurality of openings arranged in a spaced apart manner, and a plurality of energy storage devices, each energy storage device being contained within one of the openings. The energy storage devices can be electrically connected to one another. The energy storage layer can contain a support material upon which electrical connections are formed. One or more energy storage layers can be disposed between two or more stress carrying layers to form an energy storage assembly that can have significant resistance to tension/compression stress. Energy storage devices suitable for use in the energy storage assemblies can include, for example, batteries, capacitors and/or supercapacitors.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: April 28, 2015
    Assignee: Applied Nanostructured Solutions, LLC
    Inventor: Corey Adam Fleischer