Abstract: An apparatus for detecting a stacking direction of internal electrodes of a multilayer capacitor includes a capacitor moving unit having a supply unit in which a plurality of multilayer capacitors are continuously supplied ad moving the supplied multilayer capacitors in one direction, a sensor unit including a coil, installed on the capacitor moving unit, and detecting inductance of the coil when each of the multilayer capacitors approaches the coil to determine a stacking direction of internal electrodes of the multilayer capacitor based on the detected inductance of the coil, and a separating unit installed on the capacitor moving unit and separating a multilayer capacitor selected as an unsuitable multilayer capacitor by the sensor unit.

Abstract: A multilayer ceramic capacitor includes a second alloy portion including one metal element provided in a greatest amount among metal elements of an internal electrode layer, and one or more metal elements among a metal group including Sn, In, Ga, Zn, Bi, Pb, Cu, Ag, Pd, Pt, Ph, Ir, Ru, Os, Fe, V, and Y is provided between a second dielectric ceramic layer and a first internal electrode layer, and between a second dielectric ceramic layer and a second internal electrode layer, respectively.

Abstract: A semiconductor device includes: a first electrode; a second electrode; and a multi-layered stack including a hafnium oxide layer of a tetragonal crystal structure which is positioned between the first electrode and the second electrode, wherein the multi-layered stack includes: a seed layer for promoting tetragonal crystallization of the hafnium oxide layer and having a tetragonal crystal structure; and a booster layer for boosting a dielectric constant of the hafnium oxide layer.

Abstract: A sintered body that includes ceramic layers and an internal electrode which are alternately stacked on one another is prepared. A first external electrode is formed on a side surface of the sintered body such that the first external electrode is connected to the internal electrode. An insulating layer is formed on a surface of the sintered body by applying a glass coating over an entire of the sintered body having the formed first external electrode. The insulating layer is exposed from the first external electrode. A second external electrode is formed on the first external electrode. This method provides the produced multilayer electronic component with a stable electric connection between the internal electrodes and the external electrodes.

Abstract: An acoustic transducer comprises a transducer substrate defining an aperture therein. A diaphragm is disposed on the transducer substrate. The diaphragm comprises a diaphragm inner portion disposed over the aperture such that an outer edge of the diaphragm inner portion is located radially inwards of a rim of the aperture, the diaphragm inner portion having a first stress. A diaphragm outer portion extends radially from the outer edge of the diaphragm inner portion to at least the rim of the aperture, the diaphragm outer portion having a second stress different from the first stress.

Abstract: A film capacitor includes: a film winding portion formed by winding at least one metalized film that includes a dielectric film and a metal film provided on a surface of the dielectric film; a pair of metallikon electrodes formed respectively on end faces of the film winding portion in a winding axis direction of the film winding portion; and a pair of busbars each of which is joined to a corresponding one of the metallikon electrodes via a joining metal. Each of the busbars is plate-shaped to cover an outer surface of the corresponding metallikon electrode. At least one of the metallikon electrodes has a ridge that is formed on the outer surface of the metallikon electrode to be convex in the winding axis direction toward the corresponding busbar. In the corresponding busbar, there is formed a ridge-receiving portion in which the ridge of the metallikon electrode is received.

Abstract: A multilayer ceramic capacitor includes a laminate and an outer electrode. The laminate includes a plurality of laminated ceramic layers and a plurality of internal electrode layers. The internal electrode layers are respectively laminated on the ceramic layers. The outer electrode is provided on each end surface of the laminate. Each outer electrode includes a metal layer. The metal layer includes at least a Pd layer, an Ni layer, and an Sn layer laminated from a portion adjacent to or in a vicinity of the laminate in order of the Pd layer, the Ni layer, and the Sn layer. The metal layer is located at an outermost surface of the outer electrode. A thickness of the Ni layer is greater than or equal to about 0.4.

Abstract: A curved recess in a stopper includes a groove-pattern region and a groove-free region. When a sensor diaphragm reaches a bottom of the curved recess in the stopper, a groove-free region is divided into a ring-shaped first region with which a sensor diaphragm is in close contact and a ring-shaped second region disposed between an inner wall surface of a ring-shaped wall and the ring-shaped first region. The first region serves as a sealing region and the second region serves as a confinement region so that a pressure transmitting medium that remains in a space adjacent to the inner wall surface of the ring-shaped wall is confined in the confinement region, and abnormal deformation of the sensor diaphragm is prevented.

Abstract: According to one embodiment, a pressure sensor includes a base body, a supporter, a film part, a first electrode, and a second electrode. The supporter is fixed to the base body. The film part is separated from the base body. The film part includes first, second, and third partial regions, and a rim portion. The rim portion is supported by the supporter. The second partial region is between the first partial region and the rim portion. The third partial region is between the second partial region and the rim portion. The first electrode is provided between the base body and the first partial region and between the base body and the second partial region. The first electrode is fixed to the base body. The second electrode is provided between the first electrode and the first partial region and between the first electrode and the second partial region.

Abstract: A MEMS sensor includes a housing with an interior volume, wherein the housing has an access port to the interior volume, a MEMS component in the housing, and a protection structure, which reduces an introduction of electromagnetic disturbance radiation with a wavelength in the range between 10 nm and 20 ?m into the interior volume through the access port and reduces a propagation of the electromagnetic disturbance radiation in the interior volume.

Abstract: The invention relates to an inverter having an intermediate circuit capacitor, the connections of which are connected to supply lines for current supply and to a switching device which includes a plurality of half-bridges, wherein the intermediate circuit capacitor has a prespecified intermediate circuit capacitance, the magnitude of which is such that a ripple voltage which is formed in the supply lines by switching processes in the switching device is reduced to a prespecified maximum ripple voltage under prespecified operating conditions. For the purpose of reducing differential-mode interference, the invention proposes that a plurality of intermediate circuit capacitors which are connected in parallel are provided, wherein a sum of the capacitances of the plurality of intermediate circuit capacitors corresponds to the intermediate circuit capacitance.

Abstract: Sensor devices comprise a sensor die having a first membrane between a first outside surface and a buried cavity, and a second membrane between the buried cavity and a recessed section of the sensor die forming a backside cavity, wherein the first and second membranes oriented vertically adjacent one another. The sensor die comprises first and second members that are attached together, the buried cavity is formed between the members, and the first member comprises the first diaphragm and the second member comprises the second diaphragm. The membranes are configured to enable sensing over different ranges. Electrical sensing elements are in the sensor die for measuring movement of each of the first and second sensing membranes over the different ranges. Electrical contacts connected with sensing elements are exposed along a sensor die surface for providing an output signal for monitoring by an external device.

Abstract: Pressure sensors having ring-tensioned membranes are disclosed. A tensioning ring is bonded to a membrane in a manner that results in the tensioning ring applying a tensile force to the membrane, flattening the membrane and reducing or eliminating defects that may have occurred during production. The membrane is bonded to the sensor housing at a point outside the tensioning ring, preventing the process of bonding the membrane to the housing from introducing defects into the tensioned portion of the membrane. A dielectric may be introduced into the gap between the membrane and the counter electrode in a capacitive pressure sensor, resulting in an improved dynamic range.

Abstract: A pump assembly for use in an additive manufacturing system includes a viscosity pump having a first end and a second end wherein the first end has a cross sectional area greater than a cross sectional area of the second end. The viscosity pump has a conical shaped inner surface defining a pump chamber, an inlet proximate the first end and an outlet proximate the second end. The viscosity pump includes an impeller having an axis of rotation, where the impeller has a shaft positioned through the first end of the first housing and into the pump chamber. The impeller includes a distal tip-end at a distal end of the shaft wherein the impeller is configured to be axially displaced within the pump chamber of the viscosity pump parallel to the axis of rotation. An actuator is coupled to a proximal end of the impeller, wherein the actuator is configured to move the impeller parallel to the axis of rotation.

Abstract: A method for forming a microelectromechanical systems (MEMS) device may include performing a first silicon-on-nothing process to form a first cavity in a substrate. The method may include depositing an epitaxial layer on a surface of the substrate. The method may include performing a second silicon-on-nothing process to form a second cavity in the epitaxial layer. The method may include exposing the first cavity and the second cavity by removing a portion of the substrate and the epitaxial layer.

Abstract: A multi-layer ceramic capacitor includes: a ceramic body that includes a plurality of ceramic layers laminated in one axial direction and includes polycrystal having a Perovskite structure as a main phase, the Perovskite structure containing calcium and zirconium and being expressed by a general expression ABO3, the polycrystal containing silicon, boron, and lithium; first and second internal electrodes alternately disposed between the ceramic layers; a first external electrode provided on an outer surface of the ceramic body and connected to the first internal electrodes; and a second external electrode provided on the outer surface of the ceramic body and connected to the second internal electrodes, the multi-layer ceramic capacitor satisfying 0.2858V+0.4371?CLi?0.1306V+3.0391, where V (mm3) represents a volume of the ceramic body, and CLi (atm %) represents a concentration of the lithium when a concentration of a B-site element of the main phase of the polycrystal is 100 atm %.

Abstract: For manufacturing a sound transducer structure, membrane support material is applied on a first main surface of a membrane carrier material and membrane material is applied in a sound transducing region and an edge region on a surface of the membrane support material. In addition, counter electrode support material is applied on a surface of the membrane material and recesses are formed in the sound transducing region of the membrane material. Counter electrode material is applied to the counter electrode support material and membrane carrier material and membrane support material are removed in the sound transducing region to the membrane material.

Abstract: Systems and methods for providing a PWB. The methods comprise: forming a Core Substrate (“CS”) a First Via (“FV”) formed therethrough; disposing a First Trace (“FT”) on an exposed surface of CS that is in electrical contact with FV; laminating a first HDI substrate to CS such that FT electrically connects FV via with a Second Via (“SV”) formed through the first HDI substrate; disposing a Second Trace (“ST”) on an exposed surface of the first HDI substrate that is in electrical contact with SV; and laminating a second HDI substrate to the first HDI substrate such that ST electrically connects SV to a Third Via (“TV”) formed through the second HDI substrate. SV comprises a buried via with a central axis spatially offset from central axis of FV and SV. FV and SV have diameters which are smaller than TV's diameter.

Abstract: Aspects of the disclosure provide a capacitive pressure sensor. The sensor can include a first substrate having a first surface and a second surface, a movable plate at a bottom of a first cavity recessed into the substrate from the first surface, and a second substrate bonded to the first substrate over the first surface. The second substrate includes a fixed plate disposed over the movable plate to form a capacitor. A second cavity is formed between the movable plate and the second surface.

Abstract: An electronic component mount structure includes an electronic component and a mount substrate. The electronic component includes a multilayer body including dielectric layers, internal electrode layers and an insulating layer stacked in a stacking direction. The multilayer body includes two main surfaces opposed to each other in the stacking direction, two side surfaces opposed to each other in a width direction perpendicular to the stacking direction, and two end surfaces opposed to each other in a length direction perpendicular to the stacking and width directions. An insulator is provided on the side surfaces of the multilayer body. The mount substrate includes a land electrode on a mount surface. The electronic component is mounted on the land electrode with a solder fillet being interposed such that the side surfaces are perpendicular to the mount surface. The land electrode is smaller in the width direction than the electronic component.

Abstract: An end closure for a superconductive electric cable which has at least one superconductive conductor which is surrounded by a tubular cryostat serving for conducting a cooling agent, which at its end is surrounded by a housing. The housing (G) has two walls (7, 8) which are separated from each other by an intermediate space (9) and having insulating material, wherein a thermal insulation containing gas is placed in the intermediate space. The pressure in the intermediate space (9) of the housing (G) is adjusted to a value of between 10?9 mbar and 1000 mbar and, connected to the intermediate space (9) are a pressure measuring device (12) and a vacuum pump (11) which serve for adjusting the pressure prevailing in the intermediate space (9) of the housing (G).

Abstract: Sensor probes for capacitance-type liquid level sensors do not comprise an acceptable balance between cost, performance and durability for mobile applications. An improved sensor probe is provided. A first electrode comprises two or more first plate sections arranged in angular relationship with respect to each other. A second electrode comprises two or more second plate sections arranged in angular relationship with respect to each other. Spacers are located between the first and second electrodes such that each first plate section is spaced apart in parallel and substantially overlapping relationship with respective second plate sections. Fasteners securely fix the first and second electrodes in position.

Abstract: A multilayer electronic component includes a main body including an active region in which a plurality of internal electrodes are stacked with respective dielectric layers interposed therebetween, and upper and lower cover regions disposed above and below the active region, respectively, external electrodes disposed on external surfaces of the main body and electrically connected to the plurality of internal electrodes, and a composite body disposed below the lower cover region of the main body and lower portions of the external electrodes.

Abstract: In an embodiment, a multilayer ceramic capacitor 10 has supplementary dielectric layers 11d covering the spaces between two first base conductor films 11c on both height-direction faces of a capacitive element 11?, respectively, in such a way that clearances CL are left between the first base conductor films 11c and the supplementary dielectric layers 11d in the length direction. External electrodes 12, 13 each have a second base conductor film 12a, 13a and a surface conductor film 12b, 13b, and the wraparound locations 12b1, 13b1 of each surface conductor film 12b, 13b have insertion parts 12b2, 13b2 that fill in the clearances CL. The multilayer ceramic capacitor can mitigate deterioration in moisture resistance.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers disposed therebetween, first and second external electrodes disposed on first and second external surfaces of the ceramic body, respectively, the first and second external electrodes each including first and second base electrode layers having at least a portion in contact with first and second external surfaces of the ceramic body, respectively, and first and second plating layers disposed to cover the first and second base electrode layers, respectively, and a water repellent layer disposed to cover both external side surfaces of the first and second plating layers and a surface of the ceramic body.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes, first and second external electrodes disposed on first and second external surfaces of the ceramic body, respectively, the first and second external electrodes each including first and second base electrode layers having at least a portion in contact with first and second external surfaces of the ceramic body, respectively, and first and second plating layers, and a water repellent layer including a portion disposed to cover a gap between the ceramic body and the first and second plating layers, having a first thickness and a portion disposed to cover a surface of the ceramic body, to having a second thickness, smaller than the first thickness.

Abstract: It is an object to provide an electrically insulating oil composition that can maintain dielectric breakdown voltage high in a wide temperature range of ?50° C. to 65° C., and can suppress a decrease in dielectric breakdown voltage even in the case of use at high temperature for a long time, and there is provided an electrically insulating oil composition comprising 1,1-diphenylethane and benzyltoluene, wherein the proportion of a para isomer in the benzyltoluene is 45% by mass or more based on a total amount of the benzyltoluene.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, disposed on an outer surface of the ceramic body. Each of the first and second external electrodes includes a first electrode layer including a conductive metal and a plating layer disposed on the first electrode layer. The first electrode layer extends beyond the plating layer on the ceramic body, and includes a first area covered by the plating layer, and a second area extending from the first area, and an insulating layer covers the second area.

Abstract: A capacitor includes a body including a dielectric layer, first internal electrodes and second internal electrodes. Each of the first internal electrodes and each of the second internal electrodes are alternately disposed with the dielectric layer interposed therebetween. A first connection electrode is disposed on a first end surface of the body to connect an end of the first internal electrodes. A second connection electrode is disposed on a second end surface of the body opposite to the first end surface to connect an end of the second internal electrodes. A first insulating layer is disposed on one surface of the body. A first terminal electrode and a second terminal electrode are respectively disposed on opposing end surfaces of the first insulating layer to connect the first connection electrode and the second connection electrode, respectively. A second insulating layer is disposed on another surface of the body.

Abstract: A method for manufacturing an electrolytic capacitor according to the present disclosure includes a first step to a third step described below. The electrolytic capacitor includes an anode body having a dielectric layer, and a solid electrolyte layer formed on a surface of the dielectric layer. The first step is a step of preparing a first treatment solution by dissolving or dispersing a conductive polymer in a liquid first component and leaving a conductive polymer solution or a conductive polymer dispersion liquid to stand for a first period. The second step is a step of preparing a second treatment solution by mixing the first treatment solution with a second component. The third step is a step of forming a solid electrolyte layer on a surface of the dielectric layer by applying the second treatment solution to the surface of the dielectric layer.

Abstract: An electronic component includes a body having a bottom surface provided as a mounting surface, a top surface opposing the bottom surface, first and second side surfaces opposing each other in a width direction, and third and fourth end surfaces opposing each other in a length direction, a conductor part disposed therein, first and second external electrodes spaced apart from each other on the bottom surface of the body and connected to the conductor part, and a first insulating coating layer on the top surface of the body and a second insulating coating layer on the bottom surface of the body.

Abstract: Provided is a pressure measuring device that can stably bond a strain detection element even to a diaphragm made of metal having a large coefficient of thermal expansion. In order to achieve the above object, the pressure measuring device of the present invention includes: a metal housing including a pressure introduction unit and a diaphragm deformed by a pressure introduced via the pressure introduction unit; and a strain detection element for detecting strain generated in the diaphragm, wherein a base made of a first brittle material is provided on the metal housing, and the strain detection element is bonded to the base via a second brittle material having a melting point lower than a melting point of the base.

Abstract: A multilayer ceramic electronic component includes a first plating layer in contact with a first organic layer and a second plating layer in contact with a second organic layer. When the first organic layer disposed on a first base electrode layer located on a first principal surface or a second principal surface, or the second organic layer disposed on a second base electrode layer located thereon, is referred to as an organic layer principal surface portion, and when the first organic layer disposed on the first base electrode layer located on a first end surface or a second end surface, or the second organic layer disposed on the second base electrode layer located thereon, is referred to as an organic layer end surface portion, the surface roughness of the organic layer end surface portion is larger than the surface roughness of the organic layer principal surface portion.

Abstract: Provided is a capacitor, which includes a first electrode including aluminum, a second electrode facing the first electrode, and a first dielectric layer interposed between the first electrode and the second electrode, including aluminum oxide, and having multiple pores defined in a surface of the first dielectric layer in contact with the second electrode.

Abstract: The present disclosure provides one embodiment of an integrated microphone structure. The integrated microphone structure includes a first silicon substrate patterned as a first plate. A silicon oxide layer formed on one side of the first silicon substrate. A second silicon substrate bonded to the first substrate through the silicon oxide layer such that the silicon oxide layer is sandwiched between the first and second silicon substrates. A diaphragm secured on the silicon oxide layer and disposed between the first and second silicon substrates such that the first plate and the diaphragm are configured to form a capacitive microphone.

Abstract: A capacitor having at least two side-by-side anodes with a cathode current collector disposed between the anodes and housed inside a casing is described. Cathode active material is supported on the opposed major faces of the current collector and the current collector/cathode active material subassembly is housed in a first separator envelope. The first separator envelope is positioned between the side-by-side anodes and this electrode assembly is then contained in a second separator envelope. The two anodes can be connected in parallel inside or outside casing, or they can be unconnected to each other. There is also cathode active material supported on inner surfaces of the casing in a face-to-face alignment with an adjacent one of the anodes. That way, the second separator envelope also prevents direct physical contact between the anode pellets and the cathode active material supported on the casing sidewalls.

Abstract: An electronic component includes a body part and a via part. The body part includes first and second metal layers disposed with at least one dielectric layer interposed therebetween. The via part is disposed in the body part and includes first and second vias penetrating through the body part and selectively connected to the first and second metal layers, respectively. The first and second metal layers contain different metals. In some examples, a first insulating film is disposed between the first metal layer and the second via to electrically insulate the second via from the first metal layer, and a second insulating film is disposed between the second metal layer and the first via to electrically insulate the first via from the second metal layer. A method for forming the electronic component includes use of first and second etchants to selectively etch the first and second metal layers.

Abstract: A multilayer ceramic electronic component includes a plurality of dielectric layers; and internal electrodes disposed on the dielectric layers and containing an additive. The additive contains lithium (Li) and a dielectric material.

Abstract: A physical quantity sensor has a package, which is provided with a substrate and a lid and has an internal space inside, and a functional element which is accommodated in the internal space, the lid is formed on a partition wall section which is provided on the periphery of the internal space in planar view and has a communication hole which causes a lower surface at the substrate side to communicate with an upper surface at the opposite side to the substrate, and the communication hole communicates with the internal space via a groove which is formed in the substrate.

Abstract: A method of manufacturing an overheat or fire alarm detection system, comprises the steps of micromachining a pressure sensor and securing a sensor tube in fluid communication with the pressure sensor. The sensor tube may comprise a hollow tube containing a material that evolves gas upon heating. The micromachining step may comprise doping at least a portion of a first layer, forming a cavity at least partially within the doped portion and forming a deformable diaphragm over the cavity.

Abstract: A multilayer electronic component may include: a magnetic body in which a plurality of magnetic layers are stacked; and conductor patterns formed on the magnetic body. The magnetic body may include: metal magnetic particles; an oxide film formed on a surface of the metal magnetic particle as a first oxide obtained by oxidation of at least one component of the metal magnetic particle; and a filling portion formed in a space between the metal magnetic particles as a second oxide obtained by oxidization of at least one component of the metal magnetic particle. At least one of the first oxide and the second oxide is provided between adjacent metal magnetic particles, and an oxide film formed on a surface of a metal magnetic particle forms a neck portion with an oxide film formed on a surface of an adjacent metal magnetic particle.

Abstract: An apparatus has a permittivity attenuation layer interposed between a substrate and a first conductive trace, wherein the permittivity attenuation layer comprises a resin matrix containing functionalized carbon nanomaterial, such as functionalized single-wall carbon nanotubes (f-SWNTs). In some embodiments, a design structure for designing, manufacturing, or testing the apparatus is tangibly embodied in a machine readable medium. In some embodiments, the apparatus comprises an enhanced laminate core for use in a printed wiring board (PWB) that contains a differential pair having an inner-leg conductive trace and an outer-leg conductive trace. A permittivity attenuation layer is interposed between the inner-leg conductive trace and a laminate core, wherein the loading level of f-SWNTs in the permittivity attenuation layer is selected to attenuate the permittivity of the inner-leg conductive trace to match the permittivity of the outer-leg conductive trace.

Abstract: Disclosed is a method for manufacturing a circuit board, including preparing a substrate having a resin layer and a stop layer, forming at least one conduction hole penetrating the resin layer and stopping at the stop layer, forming a first metal layer through a sputtering process, forming a second metal layer on the first metal layer through a chemical plating process, forming a third metal layer having a circuit pattern, exposing part of the second metal layer and filling up the conduction hole through an electroplating process, and etching the second metal layer and the first metal layer under the second metal layer to expose the resin layer under the first metal layer. Since the first metal layer provides excellent surface properties, the second and third metal layers are well fixed and stable. The etched circuit pattern has a line width/pitch less than 10 ?m for fine line width/pitch.

Abstract: In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.

Abstract: A concentric capacitor structure generally comprising concentric capacitors is disclosed. Each concentric capacitor comprises a first plurality of perimeter plates formed on a first layer of a substrate and a second plurality of perimeter plates formed on a second layer of the substrate. The first plurality of perimeter plates extend in a first direction and the second plurality of perimeter plates extend in a second direction different than the first direction. A first set of the first plurality of perimeter plates is electrically coupled to a first set of the second plurality of perimeter plates and a second set of the first plurality of perimeter plates is electrically coupled to a second set of the second plurality of perimeter plates. A plurality of capacitive cross-plates are formed in the first layer such that each cross-plate overlaps least two of the second plurality of perimeter plates.

Abstract: A semiconductor physical quantity sensor includes: a first base material; an electrode formed on the first base material; a diaphragm which bends in accordance with a physical quantity applied from the outside; a second base material fixed to the first base material and supporting the diaphragm such that the diaphragm is opposed to the electrode with a space (S) in between; and an insulator formed on a surface on the first base material side of the diaphragm. Moreover, a wall portion to define the space (S) is formed between the insulator and the electrode.

Abstract: A replaceable seal system with high and low sides connectable to a coplanar inlet plate on a pressure transmitter. A first side of the seal system can be replaced without disturbing the sealing of a second side of the seal system. The seal system includes a stack of first and second plates with a central split line. At least one of the first and second plates is split along the central split line to provide for separate replacement on only one side of the system.

Abstract: Embodiments relate to sensors and more particularly to structures for and methods of forming sensors that are easier to manufacture as integrated components and provide improved deflection of a sensor membrane, lamella or other movable element. In embodiments, a sensor comprises a support structure for a lamella, membrane or other movable element. The support structure comprises a plurality of support elements that hold or carry the movable element. The support elements can comprise individual points or feet-like elements, rather than a conventional interconnected frame, that enable improved motion of the movable element, easier removal of a sacrificial layer between the movable element and substrate during manufacture and a more favorable deflection ratio, among other benefits.

Abstract: A metallized film capacitor includes an element formed by cutting a laminate made of a pair of metallized films to a predetermined length, and the element includes metallized contact electrodes disposed on both end faces in a width direction of the element. On each dielectric film, there are formed a protection mechanism portion including a plurality of segmented electrodes that are coupled with each other via a fuse, a solid electrode connecting with the metallized contact electrode of a corresponding polarity, and a vertical pattern extending across the dielectric film in the length direction between the protection mechanism portion and the solid electrode. The position and the width of the vertical pattern are set such that the range of the vertical pattern in the width direction overlaps the vertical pattern of a metallized film which forms a pair.

Abstract: In one embodiment, a chip package assembly can include: a first substrate at a bottom layer, the first substrate having a first surface and a second surface opposite to the first surface, where the second surface is provided with a first group of inner leads; at least one chip layer above the first group of inner leads, where each of the chip layers comprises a third surface and a fourth surface opposite to the third surface, where electrodes on the third surface that that lie at the lowest level are electrically coupled to the first group of inner leads through a first connector; and a second substrate above the fourth surface on the topmost layer and having a fifth surface, and where the fifth surface is provided with a second group of inner leads electrically coupled to the electrodes on the fourth surface on the topmost layer.