Dividing Through Modified Portion Patents (Class 29/414)
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Patent number: 6125520Abstract: In a process and apparatus for forming parts from a sheet of metal stock material so that they can be separated by a shake-and-break operation, elongated holes are punched in the sheet to separate the first part from the second part except at at least one shake-and-break location. At the shake-and-break location, a frusto-conical shape punch and die punch an opening on either side of a center tab connecting the parts. The wider ends of the frusto-conical shape holes face the tab, and the narrower ends adjoin the elongated holes and have the same width as such holes. In such a manner, the points where ends of the tab connect to the first and second parts are located in recesses located to the outside of the edges of the elongated holes. When the pieces are subsequently separated in a shake and break process, any residual burrs from where the tabs separate from the parts are located in the recesses, rather than along the edges of the part, and do not need to be removed.Type: GrantFiled: April 19, 1999Date of Patent: October 3, 2000Assignee: Thyssen Elevator Holding CorporationInventor: Timothy W. Lindsey
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Patent number: 6108890Abstract: The invention relates to a method of removing punch rivets, which are set into a workpiece and have a male die end for driving the punch rivet and an opposite female die end which penetrates the workpiece. A pin is placed with its front end onto the male die end so as substantially to cover the latter and, with a simultaneous supply of energy through the pin, heats the contact area between pin and male die end up to a fusion temperature in the contact area, whereupon after cooling of the contact area the pin is retracted counter to the pressure of an abutment supported on the workpiece and carries along the punch rivet which is thereby withdrawn from the workpiece.Type: GrantFiled: June 18, 1998Date of Patent: August 29, 2000Assignee: Emhart Inc.Inventors: Reinhold Opper, Dieter Mauer
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Patent number: 6028489Abstract: A modular high-frequency oscillator structure utilizes a master circuit board to form a plurality of oscillator units. The master circuit board has an upper, middle and lower copper foil layer. The upper copper foil layer has a plurality of component circuit patterns and a plurality of positive voltage, ground and signal regulation circuit patterns. The middle copper foil layer has a plurality of power transfer and ground transfer circuit patterns. The lower copper foil layer has a large common ground circuit pattern. The master circuit board is etched in such a manner that the upper and lower copper foil layers are cut through to isolate each oscillator unit and the middle copper foil layer remains uncut.Type: GrantFiled: December 18, 1998Date of Patent: February 22, 2000Assignee: Chung-Shan Institute of Science and TechnologyInventors: Shing-Yeu Juang, Tseng-Hsin Chiu, Wen-Yuh Liao
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Patent number: 5832600Abstract: A method for manufacturing a leadless package type electronic part, the cost and the size of which can be reduced and which exhibits excellent reliability. The electronic part of a leadless package type includes a rectangular substrate having a plurality of external electrodes in the periphery thereof, an element part placed on the surface of the substrate while being electrically connected to the external electrodes, and molding resin for molding the element part onto the surface of the substrate, wherein the surface of the molding resin is formed to be flat, and each side surface of the molding resin is flush, or aligned, with a respective side surface of the substrate.Type: GrantFiled: May 14, 1997Date of Patent: November 10, 1998Assignee: Seiko Epson CorporationInventor: Nobuaki Hashimoto
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Patent number: 5755024Abstract: A large array or pagewidth printhead fabricated from printhead elements or subunits. The printhead subunits are butted together at either adjacent channel elements or adjacent heater elements to form a pagewidth printhead. The butting element, either heater or channel element, is slightly wider than the non-butting element thereby providing gaps between the non-butting elements of a printhead element array. Where channel elements are used as the butting element, gaps between the heater elements provide for reduction or elimination of potentially damaging thermal compressive forces between adjacent heater elements. Where heater elements are used as the butting element, structural strength is increased since the heater wafer is stronger than the channel wafer. In addition, the width of the polyimide wall at the edges of the heater wafer is increased providing greater protection for thermal transducers located at the edges of individual heater elements.Type: GrantFiled: December 18, 1995Date of Patent: May 26, 1998Assignee: Xerox CorporationInventors: Donald J. Drake, Mark A. Cellura, Hung C. Nguyen
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Patent number: 5692280Abstract: A method of manufacturing laminated ceramic electronic components includes a step of forming a block by laminating ceramic green-sheets each having a main surface on which interior electrodes are formed with intervals in a direction orthogonally intersecting the main surfaces of the green-sheets. In a first cutting step, a first dicing blade having a width of 0.3 mm is pressed against the block at positions corresponding to the intervals between the electrodes to form grooves extending from one main surface toward the other main surface of the block, thereby to form a green mother board series in which a plurality of green mother boards being divided by the grooves are connected to each other via connection portions. Each of the green mother boards includes a plurality of element portions. Thereafter, the green mother board series is fired in a firing step. In a second cutting step, a second dicing blade having a width of 0.Type: GrantFiled: June 1, 1995Date of Patent: December 2, 1997Assignee: Murata Manufacturing Co., Ltd.Inventors: Masaaki Taniguchi, Kyoshin Asakura
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Patent number: 5661889Abstract: A process for producing a container and closure assembly includes molding a preliminary container including a closed bottom portion, a body portion and a shoulder and neck portion. The shoulder and neck portion is separated from the body portion. An open ended second container is formed from the body portion, the second container having a rim at its open end and an encircling wall. The open end of the second container is then closed with a closure comprised of a cap and a cap liner. The cap liner has a weakened portion adapted to be broken by the cap. The cap or the cap liner are formed from the shoulder and neck portion of the preliminary container.Type: GrantFiled: June 5, 1995Date of Patent: September 2, 1997Inventor: Emery I. Valyi
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Patent number: 5653022Abstract: The slow production rates associated with cutting machines for cutting extruded metal tubing to length are avoided in an apparatus that continually cuts extruded metal tubing (46) and which include a reel (44) for providing a coil of (42) of metal tubing (46) to a cutting nip defined by rollers (66) carrying scoring knives (68). The tubing is continuously moved through the nip by a continuously operated set of feeding rolls (70) and then passed to a set of pull rolls (74) which are driven at a more rapid rate to place the tubing (46) in tension to cause it to be severed where scored. Also disclosed is a method of continuously cutting extruded metal tubing.Type: GrantFiled: May 3, 1995Date of Patent: August 5, 1997Assignee: Modine Manufacturing CompanyInventor: Jeff Logic
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Patent number: 5590467Abstract: The bolt-together wheel consists of a pair of side plates separated from one another by cylindrical spacers. The spacers are connected to the side plates by shearable bolts where the head of the bolt will shear off when a predetermined torque is applied thereto. The predetermined torque is selected such that the bolt head will shear after the bolt securely fixes the spacers to the side plates. As a result, the bolt does not extend from the side plate such that wear on the blast wheel is reduced. After the bolt head shears, it can be machined to provide a uniform, smooth surface that further minimizes wear. Finally, the edges of the side plates can be provided with tapered faces to reduce the impact force of rebounding shot and the wear resulting therefrom and to direct the rebounding shot away from the interior of the blast wheel.Type: GrantFiled: October 17, 1994Date of Patent: January 7, 1997Assignee: The Wheelabrator CorporationInventor: George Schloetzer
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Patent number: 5507093Abstract: A forged-steel connecting rod blank is formed with intentional-break zones extending over one or both of the broad crankshaft-eye surfaces of the connecting rod or as crevices formed radially in the inner surface of the large-diameter bore of the eye and running from an upper edge to a web of the material which is ultimately punched out.Type: GrantFiled: April 4, 1994Date of Patent: April 16, 1996Assignee: Hammerwerk Schulte GmbH & Co. KGInventors: Horst Wittenstein, Hendrik Muntinga
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Patent number: 5355569Abstract: A method for producing capacitive sensors which is used in particular for the parallel production of capacitive sensors with exactly defined stray capacitance. For this purpose, troughs (15, 16, 17) are cut along or parallel to the splitting lines (6), so that adjustment errors in the position of the cut, during separation of the sensors, and variations in the cut width have no effect on the stray capacitance.Type: GrantFiled: September 25, 1992Date of Patent: October 18, 1994Assignee: Robert Bosch GmbHInventors: Jiri Marek, Helmut Baumann, Guenther Findler, Michael Offenberg, Martin Willmann
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Patent number: 5347699Abstract: A device for partially shearing single or multiple sheets of material comprising a base having a recess and a lower blade fixed in the recess. A pair of movable blades having opposed ends are pivotally attached to the base at one end. A lost-motion connecting link connects the free ends of the pair of movable blades together and is connected to a hydraulic piston which moves the link a limited distance towards the base, thereby to rotate both movable blades relative to the fixed blade with a scissors-like action. When the pair of blades is moved towards the lower blade, the material is cut inward from both sides or edges of the material, leaving an inner uncut portion of material having a width which corresponds to the stroke of the movable blades.Type: GrantFiled: December 11, 1992Date of Patent: September 20, 1994Assignee: ABB Power T&D Company Inc.Inventor: Thomas A. Ward
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Patent number: 5343602Abstract: A process for separating a glass-silicon-glass layer package wherein the glass-silicon-glass layer package is produced at a minimum process cost and is constructed from a plurality of acceleration sensors constructed with micro-mechanical structure techniques. At the same time, dirt is to be prevented from entering the acceleration sensors and the connection contacts are to be freed automatically. Separation is effected substantially by crosswise cutting and subsequent breaking. In order to prevent an "opening" of the acceleration sensors when cutting in one direction, i.e. transversely relative to the flexural resonators, and to achieve a defined breaking, one glass disk is cut until a predetermined breaking point is reached and the other glass disk is severed in a parallel plane. An intermediate layer which surrounds the connection in a U-shaped manner, serves as a blocking layer arranged between the two dividing planes and impedes a bonding of the glass disk and the silicon disk.Type: GrantFiled: January 14, 1993Date of Patent: September 6, 1994Assignee: Mannesmann Kienlze GmbHInventor: Horst Plankenhorn
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Patent number: 5271144Abstract: A method of providing localized corrosion protection to products manufactured of sheet metal wherein coils of sheet metal are passed through a coil coating line wherein one or more stripes of corrosion resistant material are applied to selected areas along both the upper and lower surfaces of the metal prior to the metal being cut, punched, or bent to form a product having predetermined portions of its surface area coated. In one embodiment, a selected corrosion resistant coating is applied to galvanized sheet metal prior to the metal being punched and formed into sheet metal fasteners having coated heads but uncoated shanks.Type: GrantFiled: June 29, 1992Date of Patent: December 21, 1993Assignee: ES ProductsInventor: John R. Barker
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Patent number: 5269565Abstract: A pipeline breakaway mechanism is provided which includes an elbow in a pipeline and two clamps holding the pipeline to a structure such as a platform or another pipeline. When a strong pull is exerted on the pipeline, the pipeline is bent until it buckles around the first clamp; the first clamp then fails at a preset load, causing the pipe to bend around the second clamp and causing the previously formed buckle to straighten. This buckling and straightening of pipe causes the pipe wall to fracture at a load much smaller than its tensile strength.Type: GrantFiled: January 27, 1992Date of Patent: December 14, 1993Assignee: Shell Oil CompanyInventor: Carl G. Langner
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Patent number: 5249345Abstract: A method of severing an elongated flat metal tube of the type including upper and lower flat horizontal walls, vertical edge walls and vertical partition walls spaced between the edge walls and interconnecting the upper and lower walls to divide the tube into a series of parallel, generally rectangular, longitudinally extending passages. The tube is cut by forming transverse kerfs in the upper and lower walls of the tube and thereafter exerting a relative pulling force on the tube sections on opposite sides of the plane in which the kerfs have been formed to tear apart the remaining tube material at the severing plane and sever the tube. The kerfs are formed in a two-step broaching operation comprising a first cut in which a narrow generally V-shaped narrow angle kerf is formed and a second cut in which the kerf is widened to provide a wide, generally V-shaped, wide angle kerf.Type: GrantFiled: February 10, 1992Date of Patent: October 5, 1993Assignee: Brazeway, Inc.Inventors: Milan Virsik, Henry McCarbery
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Patent number: 5222291Abstract: A method is provided for making unit heads from a material head. The unit heads are used to constitute a divisional-type thermal head. The material head includes an elongate insulating substrate carrying a longitudinal array of heating dot portions, and a protective layer extending longitudinally of the material head to cover the array of heat dot portions. According to the method, the material head is cut along at least one cutting line which extends transversely of the material head at a position between two adjacent heating dot portions, wherein the protective layer has cutouts which extend from the respective longitudinal edges of the protective layer toward the array of heating dot portions at the position of the cutting line.Type: GrantFiled: April 1, 1992Date of Patent: June 29, 1993Assignee: Rohm Co., Ltd.Inventors: Shigeo Ota, Fumiaki Tagashira, Shingo Ooyama
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Patent number: 5218762Abstract: A process to manufacture a cylinder for a rotary hermetic compressor having a rolling piston, of the type presenting a substantially cylindrical tubular body (20) which defines a pair of opposite end faces (21,22) that are parallel to each other; an internal cylindrical wall (23); and an external wall (24) which is spaced away from said internal cylindrical wall (23), said cylinder further presenting a radial vane slot (10) which is provided from said internal cylindrical wall (23), includes the steps of:a) shaping in a unique blank piece a substantially cylindrical tubular body (20);b) providing tension concentration zones in the cylindrical tubular body (20), so as to define a weakening line according to a partitioning diametral plane which passes through the cylinder part that is going to receive the vane slot (10).Type: GrantFiled: September 21, 1992Date of Patent: June 15, 1993Assignee: Empresa Brasileira de Compressores S/A -EmbracoInventor: Caio M. F. Netto Da Costa
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Patent number: 5208979Abstract: A method of manufacturing a multiple part component such as a connecting rod by integrally forming the connecting rod in one piece, laser cutting a stress riser along a surface of the connecting rod characterized by a deep and narrow groove and applying a tension force to separate the connecting rod into two parts, a main body and a bearing cap.Type: GrantFiled: September 25, 1992Date of Patent: May 11, 1993Inventor: Howard Schmidt
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Patent number: 5205039Abstract: A method for aligning multiple printing plates on a single piece of printing plate stock, whereby all plates register to one another and one or more printing press cylinders. The method includes the steps of (1) punching image and cylinder registration indices on the stock; (2) imaging a plurality of regions on the stock defining separate printing plates; (3) forming slitting indices relative to the defined plate regions; (4) forming a cylinder registration bend along at least one edge of the stock; and (5) slitting the stock into a plurality of printing plates. In one process, elongated image registration apertures, cylinder registration bends and notches and V-shaped slitting notches are successively provided to all plate regions to assure alignment of the printing plates to each other and the press cylinders.Type: GrantFiled: November 14, 1991Date of Patent: April 27, 1993Inventor: James Ternes
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Patent number: 5188546Abstract: A carrier web of sheet metal material joining stamped and formed components of an electrical connector is disclosed. The component is carried through the stamping and forming process by the carrier web of the sheet metal material. The component is stamped and formed from the material such that at least a portion of the component projects from one side of the original plane of the sheet metal material. The carrier web is formed into a three-dimensional configuration to reduce the spacing between adjacent components. A portion of the web may project a sufficient distance from the one side of the original plane of the sheet metal material to protect the projecting portion of the component during subsequent manufacturing operations on the component. A retaining structure may also be provided to retain the components at a predetermined spacing on the carrier web. A method of manufacturing the carrier web is also disclosed.Type: GrantFiled: February 25, 1992Date of Patent: February 23, 1993Assignee: Molex IncorporatedInventors: Kenneth D. Ballard, Ronald E. Bottino, Mark K. Labbe, John E. Lopata, Tom Malinski, Wilhelm Meier, Lou Morelli, Michael G. Pacyga, Mitch Primorac, Bernardus Roodnat, Shawn Simpson
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Patent number: 5181306Abstract: The invention is directed to a method of making ring laser resonator blocks according to the sandwich principle. Channel and hollow chamber structures are machined into two plates of a multiple expansion of a resonator block. The structures in the blocks complement each other. The plates machined in this manner are placed one atop the other and positioned in correspondence to the structures and joined to each other and thereafter separated into individual resonator blocks.Type: GrantFiled: February 6, 1992Date of Patent: January 26, 1993Assignee: Carl-Zeiss-StiftungInventors: Arnold Guttner, Jobst Herrmann, Karl-H. Simon
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Patent number: 5175927Abstract: A flat strip of conductive material is formed by extrusion with an integrally formed thickened or flanged portion along at least one longitudinal edge of the extrusion. Individual contact/connector terminals are then stamped from the extrusions with the flat portions forming the blade of the connector terminal and the thickened flanged portion forming a head on the blade which provides the integrally formed contact surface.Type: GrantFiled: October 2, 1991Date of Patent: January 5, 1993Assignee: Eaton CorporationInventor: John B. Coniff
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Patent number: 5152047Abstract: A method of producing a laminated metal belt with a space corresponding to the thickness of resin between respective ring belts by a step for forming a laminated sheet by bonding the number of metal sheets corresponding to the number of ring belts constituting the laminated metal belts of one unit with resin, a step for forming a seamless cylindrical body having predetermined inside and outside diameters from the laminated sheet, a step for cutting the cylindrical body radially into sections to obtain laminated rings and a step for removing resin from the laminated ring.Type: GrantFiled: April 13, 1990Date of Patent: October 6, 1992Assignee: Sumitomo Metal Industries, Ltd.Inventors: Masayasu Kojima, Chihiro Hayashi
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Patent number: 5134765Abstract: A generally continuous strip of thermoplastic material is deformed into a desired preformed configuration, while retaining continuity with the generally continuous strip to form a chain of the configurations. The chain remains continuous with the generally continuous strip. End portions of the chain are severed so as to form a stack of preformed configurations to be used in the formation of a dispensing cartridge.Type: GrantFiled: March 26, 1991Date of Patent: August 4, 1992Assignee: Roberts Systems, Inc.Inventors: John T. Roberts, Claude E. Monsees, William Z. Vanhook
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Patent number: 5117949Abstract: A caliper type brake for braking a brake disc including a caliper having a recess in the caliper on one side of the disc, a piston mounted in the caliper on the other side of the disc and including a recess, each recess having one or more ribs forming two or more cavities in each recess and a brake pad mounted in each recess, each brake pad being formed with a number of frangible portions, which break on engagement with the ribs to separate the brake pads into separate sections corresponding to the number of cavities in the recesses.Type: GrantFiled: September 21, 1990Date of Patent: June 2, 1992Assignee: Hayes Industrial Brake, Inc.Inventors: James A. Buckley, George H. Hinkens, James J. Dimsey
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Patent number: 5110033Abstract: A segmented brush seal (10) having coaxial annular backing (20) and side (25) plates sandwiching a plurality of tightly packed, circumferentially arrayed bristles (30) which extend radially inwardly at a constant circumferential skew angle, and its method of manufacture, is disclosed. The side plate (25) has a plurality of radially inwardly extending tabs (32) each having a tab end (34) which extends proximate to an inner diameter (22) of the backing plate. The sandwiched plates (20, 25) and bristles (30) are welded together at each tab (32), wherein the resulting weld zone (50) lengthwisely extends from the radially innermost tab end (34) to an outer circumferentially weld (40) at the local bristle skew angle. The seal is then lengthwisely bifurcated through each weld zone (50) at the local bristle skew angle to produce the segmented seal (10).Type: GrantFiled: February 21, 1991Date of Patent: May 5, 1992Assignee: United Technologies CorporationInventors: Lawrence E. Noone, Leo J. Lagasse
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Patent number: 5103546Abstract: A process and apparatus is described for providing a strip of flexible closure material to be affixed to a receptacle. The strip of flexible closure material comprises a combination of a plurality of interengaging strip portions in their interengaged state. The process includes the step of supplying a tape of flexible closure material having a transverse width with a plurality of interengaging elements across the transverse width that extend from the tape. Then, the tape is separated along its longitudinal length into a plurality of strip portions with at least two of the strip portions having an interengaging element extending therefrom. Lastly, the strip portions having an interengaging element are brought into contact with one another while mating the interengaging element of each of the strip portions brought together with that of the other. The process takes place continuously in line with equipment for affixing the flexible closure material to a receptacle.Type: GrantFiled: November 9, 1990Date of Patent: April 14, 1992Assignee: Minnesota Mining and Manufacturing CompanyInventors: Steven J. Rossini, Daniel J. Wilson, Shari J. Wilson
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Patent number: 5074018Abstract: A method and apparatus for cutting pipes into sections are described. A punching unit (7) forms apertures (8) in strip (2) from which pipe (4) is formed on winding core (3). A cutting device (5) has a circular shears (10) which has a first, smaller-diameter cutting roller (13) and a second cutting roller (14) each having two cutting edges. The first cutting roller (13) is swivelled through aperture (8) into the pipe (4). Rotary movement of the pipe (4) effects cutting, during which the cutting rollers (13, 14) move in synchronism with the pipe (4) so that the pipe is cut from the inside and the outside by the cutting rollers (13, 14).Type: GrantFiled: June 6, 1990Date of Patent: December 24, 1991Assignee: Emil Suter Maschinenfabrik AGInventors: Rudolf Binggeli, Fritz Langmeier
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Patent number: 5063664Abstract: A process for manufacturing wheel hub comprises an iron tube being swaged in wave form that can be cut to form a plurality of axle tubes; a plurality of bearing receiving bowls and a plurality of bowl holders. Each axle tube has a hub flange by stamping. Each hub flange has at its face plate a plurality of spoke holes and therein a bowl receiving recess. For the front wheel hub each bearing receiving bowl has at its bottom center an axial hole corresponding to the axial hole of the axle tube. In alignment with the axial hole of the bearing receiving bowl and the axial hole of the axle tube, the bearing receiving bowls are respectively provided for permitting to insert into the bowl receiving recesses and defining as a front wheel hub. For the rear wheel hub, the bowl holders have an inner surface, attaching to the outer portion of each bearing receiving bowl by brazing, being defined as a front portion.Type: GrantFiled: April 24, 1990Date of Patent: November 12, 1991Inventor: Jung-Yi Huang
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Patent number: 5018267Abstract: Method for forming a laminate and a product formed therefrom. A thin layer of oil is applied to a facing surface of at least one of a plurality of adjacent sheets and a wax is applied along the longitudinal edges of a facing surface of at least one of the sheets. The sheets are combined into a laminate by being passed between a pair of rollers which apply sufficient pressure to remove excess oil from between the facing surfaces and to spread the wax thereby forming a continuous seal along the longitudinal edges of the laminate. Air between the facing surfaces is displaced by the oil and the wax forms the seal to prevent reentry of the air and seepage of the oil along the longitudinal edges of the laminate. The laminate is tightly held together to permit handling or fabrication without delamination.Type: GrantFiled: September 5, 1989Date of Patent: May 28, 1991Assignee: Armco Inc.Inventor: Jerry W. Schoen
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Patent number: 4996411Abstract: The invention relates to implanting an electronic module (i.e. an integrated circuit plus electrical contact tabs) in the body of an electronic memory card. The integrated circuit (38) is directly fixed to a lead frame (10) defining electrical connections and electrical contact tabs. The terminals (42) of the integrated circuit (38) are connected by wires (44) to the lead frame. The assembly is placed in a cavity provided in the card body. Such cards constitute credit cards, for example.Type: GrantFiled: July 20, 1987Date of Patent: February 26, 1991Assignee: Schlumberger IndustriesInventor: Alain Rebjock
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Patent number: 4984358Abstract: Integrated circuit dies, while still in wafer form, are prepared for stacking without requiring packaging. Holes are made through a wafer having a plurality of integrated circuit dies and are placed between the dies and adjacent the die pads. A layer of insulating material is placed on the wafer and in the outer periphery of the holes. An electrically conductive connection is made between the top of each pad and the inside of the insulating material in an adjacent hole. The insulating layer and the electrically conductive layer can be further extended to the backside of the dies if desired. The dies are separated from each other and can be assembled in a stack and/or surface mounted to a substrate.Type: GrantFiled: June 18, 1990Date of Patent: January 15, 1991Assignee: Microelectronics and Computer Technology CorporationInventor: Bradley H. Nelson
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Patent number: 4970775Abstract: A plurality of frequency selective limiting units are prepared on a common substrate. A plurality of generally linear signal carrying conductors are formed in spaced relation on a first ferrite member, the opposite side of which contains a lower ground plane. A second ferrite member is bonded to the first ferrite member with a nonconductive adhesive to form a layered structure. Grooves are formed in a free surface of the structure to a depth sufficient to cut through the first and second ferrite members and to expose the lower ground plane. The structure is metallized in a conformal manner so that the metallization is in contact with the lower ground plane. The units are separated by dicing to thereby provide a plurality of individual FSL's.Type: GrantFiled: March 5, 1990Date of Patent: November 20, 1990Assignee: Westinghouse Electric Corp.Inventors: Stephen A. Brown, Chester L. Brewer, III, Smith Paul S.
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Patent number: 4970783Abstract: A method of cracking bearing assembles including the steps of (a) forming a ductile metal (steel, aluminum or titanium) connecting rod in one piece (e.g., by hot forging) having an annular wall defining a crankshaft opening with preformed surface crevices for guiding the initiation of a cracking plane that extends across the crank opening; (b) charging (i.e., for about 40 seconds) the region of such wall along at least one portion of the cracking plane with hydrogen by means of an electrolytic cell or by means of reacting the metal rod with a strong acid (e.g., concentrated sulfuric) to cause hydrogen to dissolve in the metal to facilitate hydrogen stress cracking thereat, with or without the imposition of static mechanical tensile loading at such crevices (i.e., for about 40 seconds) of a magnitude insufficient to cause yielding of the metal; and (c) prolonging, increasing, or imposing the static mechanical loading (i.e.Type: GrantFiled: December 14, 1989Date of Patent: November 20, 1990Assignee: Ford Motor CompanyInventors: Moses A. Olaniran, Charles A. Stickels
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Patent number: 4967461Abstract: Method and apparatus for manufacturing thin wafers from bars, such as in the manufacture of wafers for use as semiconductor substrates, include an arrangement wherein a holder member is fastened to the bar, the bar is sliced to separate a disc-shaped wafer therefrom and wherein prior to completion of the slicing operation, the end face of the bar is leveled to a precisely planar condition. The slicing operation is terminated after the bar is sliced completely through and the holder member is partially, but not completely, sliced through so that a wafer formed by the slicing operation remains connected to the bar by the holder member. The wafer is disconnected from the bar by abrading a portion of the holder member connecting the wafer to the bar.Type: GrantFiled: July 31, 1989Date of Patent: November 6, 1990Assignee: GMN Georg Muller Nurnberg AGInventor: Fritz Feldmeier
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Patent number: 4965933Abstract: A method and apparatus are provided for forming insert molded circuits. The process includes inserting a circuit network comprised of a lace curtain with a plurality of individual circuits which are connected by interconnect members into a mold and then separating the individual circuits in the mold by cutting the interconnect members while the lace curtain is in the mold. After the interconnect members have been severed, plastic is injected into the mold thereby surrounding the individual traces. A mold for performing the process is disclosed which includes a retractable punch arrangement.Type: GrantFiled: May 22, 1989Date of Patent: October 30, 1990Assignee: The Cherry CorporationInventors: James E. Mraz, Martin T. Schwartz, James M. Kemp, Joel M. Schotanus, Donald P. Schwarz
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Patent number: 4930216Abstract: Integrated circuit dies, while still in wafer form, are prepared for surface mounting direct to a substrate without requiring packaging. Holes are made through a wafer having a plurality of integrated circuit dies and are placed between the dies and adjacent the die pads. A layer of insulating material is placed on the wafer and in the outer periphery of the holes. An electrically conductive connection is made between the top of each pad and the inside of the insulating material in an adjacent hole. The dies are separated from each other and may be surface mounted to a substrate by soldering.Type: GrantFiled: March 10, 1989Date of Patent: June 5, 1990Assignee: Microelectronics and Computer Technology CorporationInventor: Bradley H. Nelson
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Patent number: 4920641Abstract: An electronic part comprises an electronic element, for example, a piezo-electric vibrator. This electronic element has a first connecting electrode on one of the main surfaces thereof and has a second connecting electrode on the other main surface thereof. A first external electrode is connected to this first connecting electrode. Furthermore a second external electrode is connected to the second connecting electrode. The first external electrode and the second external electrode are fixed by fixing member composed of an insulating material at the peripheral edge parts thereof. Thereby, the electronic element is covered with the first connecting electrode, the second connecting electrode and the fixing member.Type: GrantFiled: November 2, 1988Date of Patent: May 1, 1990Assignee: Murata Manufacturing Co., Ltd.Inventor: Takeshi Nakamura
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Patent number: 4905364Abstract: A method for producing the latch bearing in a latch needle for textile machines of the type in which a latch is pivotably mounted in a longitudinal slot between two cheeks of a needle shank by a hinge pin passing through mutually aligned transversely extending bores in at least one of the cheeks and a bearing portion of the latch between the cheeks. In accordance with the method a cylindrical wire is provided with transversely extending notches at intervals corresponding to the length of a hinge pin. The notched wire is converted by hot or cold treatment into a bittle, hard state. Individual hinge pins are broken off from the wire at the notches, and are subsequently inserted into the bores in the cheeks and the bearing portion of the latch to be securely fixed there.Type: GrantFiled: January 12, 1989Date of Patent: March 6, 1990Assignee: Theodor Groz & Sohne & Ernst Beckert Nadelfabrik Commandit-GesellschaftInventor: Hardo Berentzen
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Patent number: 4852227Abstract: A green-ceramic parent substrate having buried therein a stack of spaced-apart sheet electrodes, each electrode having multiple tab portions extending in one direction to a plane that is orthogonal to the sheet electrodes and to the one direction. A row of holes is drilled between the tabs and through the ceramic in that plane. A plurality of elemental capacitor substrates are cut from the parent substrate, the cutting including dicing through the row of holes so as to leave a castellated edge in each elemental capacitor substrate. The elemental substrates are then fired to maturity and the castellated edge touched to a reservoir of a conductive paste and heated to form spaced apart conductive terminals contacting tabs of the buried electrodes at only the edge castellations.Type: GrantFiled: November 25, 1988Date of Patent: August 1, 1989Assignee: Sprague Electric CompanyInventor: Darnall P. Burks
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Patent number: 4830554Abstract: Routing a circuit board from the bottom side allows board removal from areas not generally accessible from the top side, such as board areas which are overhung by top side, such as board areas which are overhung by electrical connector "headers", as well as variable potentiometer and capacitor controls which may not be easily accessible from the top side. One embodiment combines such routing with shearing to merge their respective advantages.Type: GrantFiled: February 19, 1988Date of Patent: May 16, 1989Assignee: Cencorp, Inc.Inventor: Gilbert T. Lopez
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Patent number: 4769899Abstract: A twin head for use in an electronic still camera includes a shield plate, first and second head chips bonded on opposite sides of the shield plate, and first and second reinforcing core members further bonded on first and second head chips, respectively. Each of the first and second head chip members has an elongated face that faces a recording medium and a magnetic gap defined at an intermediate portion of the elongated face. The length Wh of the elongated face is between 0.3 millimeter and 1 millimeter. Each of the first and second reinforcing core members has a coil wound thereon. The first and second head chip members, the shield plate, and the first and second reinforcing core members are bonded together such that the elongated faces of the first and second head chip members are in flush with each other and that the magnetic gaps of the first and second head chip members are aligned to each other.Type: GrantFiled: August 24, 1987Date of Patent: September 13, 1988Assignee: Sanyo Electric Co., Ltd.Inventors: Isao Yasuda, Yorinobu Yoshisato, Hideki Yoshikawa, Kazuhiko Taketa
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Patent number: 4742615Abstract: Routing a circuit board from the bottom side allows router access to areas not generally accessible from the top side, such as board areas which are overhung by electrical connector "headers", as well as variable potentiometer and capacitor controls which may not be easily accessible from the top side. One embodiment combines such routing with shearing to merge their respective advantages.Type: GrantFiled: June 23, 1986Date of Patent: May 10, 1988Assignee: Cencorp, Inc.Inventor: Gilbert T. Lopez
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Patent number: 4716645Abstract: A new and improved method of making an opening extending between opposite faces of thin sheet material comprises the steps of forming a depression in one of the faces of the sheet material resulting in a projection opposite the depression on the opposite face protruding outwardly thereof and removing the projection to form an opening extending completely through the sheet material between said opposite faces.Type: GrantFiled: June 23, 1986Date of Patent: January 5, 1988Assignee: Masonite CorporationInventors: Raymond H. Pittman, William J. Schultz
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Patent number: 4685212Abstract: The invention discloses a method of manufacturing a jack comprising a step of punching a sheet metal by which a plurality of contact piece elements to be individual contact pieces of a jack are formed into a state of being partially connected to one another and arranged in parallel, a step of bending both ends of each contact piece element downward, a step of cutting off each contact piece element arranged in parallel by a cutter to form individual contact pieces, and a step of forcedly incorporating each contact piece into a jack body positioned right under a punching stroke of the cutter used in the cutting step whereby a complete automatization of the manufacturing is attained, considerably increasing productivity and decreasing an equipment cost as much.Type: GrantFiled: September 10, 1985Date of Patent: August 11, 1987Assignee: Hosiden Electronics Co., LtdInventors: Toru Masuda, Yasuji Shibano
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Patent number: 4624049Abstract: A switch actuator assembly comprises an insulating base and an insulating retainer assembled therewith. A switch contact assembly initially includes at least a first contact and a second contact interconnected by an integral narrow strip of sheet metal. The base and retainer are provided with an integral punch and die, and during assembly of the switch contact assembly with the base and the retainer the punch and die sever the connecting strip so that the first and second contacts are thereafter electrically isolated. During such severing the strip is deflected from its initial plane to augment the electrical isolation.Type: GrantFiled: May 23, 1985Date of Patent: November 25, 1986Assignee: Illinois Tool Works Inc.Inventor: Fred Levko
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Patent number: 4610079Abstract: A method of dicing a semiconductor wafer in which a physical discontinuity is formed on the surface of the wafer on both sides of a dicing line to limit the spreading of cracks and chips generated during dicing. Thereafter, the semiconductor wafer is diced to separate the pellets.Type: GrantFiled: February 26, 1985Date of Patent: September 9, 1986Assignee: Tokyo Shibaura Denki Kabushiki KaishaInventors: Masahiro Abe, Masafumi Miyagawa, Hatsuo Nakamura, Toshio Yonezawa
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Patent number: 4541157Abstract: A method of splitting bearing rings in a direction obliquely crossing their axes. This method comprises forming a notch of substantially V-shaped cross-section in the inner or outer peripheral surface of a bearing ring obliquely or in a V-direction, or forming a notch of substantially V-shaped cross-section in an end surface of a bearing ring at a predetermined angle with respect to the surface, heat-treating the bearing ring, and exerting wedge stress along the notch by a wedge type press-breaking tool.Type: GrantFiled: July 19, 1979Date of Patent: September 17, 1985Assignee: NTN Toyo Bearing Co., Ltd.Inventors: Noriyuki Tsushima, Toshiharu Hirose
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Patent number: RE35039Abstract: The invention relates to a method of manufacturing a jack comprising a step of punching a sheet metal by which a plurality of contact piece elements to be individual contact pieces of a jack are formed into a state of being partially connected to one another and arranged in parallel, a step of bending both ends of each contact piece element downward, a step of cutting off each contact piece element arranged in parallel by a cutter to form individual contact pieces, and a step of forcedly incorporating each contact piece into a jack body positioned right under a punching stroke of the cutter positioned right under a punching stroke of the cutter used in the cutting step whereby a complete automatization of the manufacturing is attained, considerably increasing productivity and decreasing an equipment cost as much.Type: GrantFiled: November 30, 1988Date of Patent: September 26, 1995Assignee: Hosiden Electronics Co., Ltd.Inventors: Toru Masuda, Yasuji Shibano