Acoustic Transducer Patents (Class 29/594)
  • Patent number: 10367430
    Abstract: According to an embodiment, a microelectromechanical systems MEMS transducer includes a deflectable membrane attached to a support structure, an acoustic valve structure configured to cause the deflectable membrane to be acoustically transparent in a first mode and acoustically visible in a second mode, and an actuating mechanism coupled to the deflectable membrane. Other embodiments include corresponding systems and apparatus, each configured to perform various embodiment methods.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: July 30, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: David Tumpold, Alfons Dehe, Christoph Glacer
  • Patent number: 10368153
    Abstract: A waterproof sound-transmitting membrane (10) includes a sound-transmitting region (13c) having a porous polytetrafluoroethylene (PTFE) membrane (11). The porous PTFE membrane (11) has a through-thickness air permeability of 2 cm3/cm2/s or more. Thus, it is possible to provide a waterproof sound-transmitting membrane that is suitable for reducing crackling noise while ensuring waterproofness required for at least daily use. The porous PTFE membrane (11) has a water entry pressure of 3 kPa or more, preferably 20 kPa or more and 50 kPa or less. The waterproof sound-transmitting membrane (10) may include an edge region (13p) having an adhesive layer (12).
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: July 30, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yuichi Abe, Kouji Furuuchi, Kousei Takiishi
  • Patent number: 10263320
    Abstract: A method of making a stretchable and flexible electronic device includes the steps of creating a computer aided design using a computer modeling software system of the electronic device; digitizing the computer aided design and importing the design into a computer memory of a sewing machine capable of performing embroidery; using the sewing machine and a conductive thread to embroider the design on to a fabric substrate to create the electronic device, whereby the electronic device comprises at least a portion of conductive threads; removing the fabric substrate from the electronic device using heat; coating the electronic device with a polymer.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: April 16, 2019
    Inventors: Asimina Kourti, John L. Volakis, Robert Lee
  • Patent number: 10264359
    Abstract: In a speaker damper, art sections are disposed on warp reference lines and warp reference lines. Straight sections are disposed so as to intersect intermediate reference lines at right angles. By adopting this configuration, wave parts can be adjusted so that they are less likely to expand/contract on the warp reference lines and the warp reference lines in comparison with related-art concentric circular wave parts. Further, the wave parts can be adjusted so that they are more likely to expand/contract on the intermediate reference lines. In this way, the speaker damper can perform uniform vibrating motions throughout the entire speaker damper with a simple configuration.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: April 16, 2019
    Assignee: JVC KENWOOD CORPORATION
    Inventors: Hiroaki Kawai, Akira Shigeta, Satoshi Tomizawa
  • Patent number: 10238302
    Abstract: Intravascular devices, systems, and methods are disclosed. In some embodiments, the intravascular devices include at least one pressure sensing component within a distal portion of the device. In that regard, one or more electrical, electronic, optical, and/or electro-optical pressure-sensing components is secured to an elongated substrate such that the pressure-sensing component is mounted perpendicular to a central longitudinal axis of the device. In some implementations, the elongated substrate has a cylindrical profile. Methods of making, assembling, and/or using such intravascular devices and associated systems are also provided.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: March 26, 2019
    Assignee: VOLCANO CORPORATION
    Inventors: Bret C. Millett, David H. Burkett, Paul Douglas Corl
  • Patent number: 10189699
    Abstract: In accordance with an embodiment, a MEMS device includes a first membrane element, a second membrane element spaced apart from the first membrane element, a low pressure region between the first and second membrane elements, the low pressure region having a pressure less than an ambient pressure, and a counter electrode structure comprising a conductive layer, which is at least partially arranged in the low pressure region or extends in the low pressure region. The conductive layer includes a segmentation providing an electrical isolation between a first portion of the conductive layer and a second portion of the conductive layer.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: January 29, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Arnaud Walther, Alfons Dehe, Johann Strasser, Gerhard Metzger-Brueckl
  • Patent number: 10111021
    Abstract: The application describes a MEMS transducer in which first and second conductive elements of a capacitor are both provided on the membrane. The membrane is shaped that the first and second conductive elements are displaced relative to each other when the flexible membrane deflects in response to a pressure differential across the membrane. For example the membrane may be corrugated.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: October 23, 2018
    Assignee: Cirrus Logic, Inc.
    Inventors: James Thomas Deas, Scott Lyall Cargill
  • Patent number: 10045125
    Abstract: A MEMS sound transducer for at least one of generating and detecting sound waves in air in an audible wavelength spectrum includes a carrier substrate, a cavity defined in the carrier substrate, the cavity defining at least one opening, and a multilayered piezoelectric membrane structure spanning over the opening of the cavity and having an edge area connected with the carrier substrate so that with respect to the carrier substrate the membrane structure is capable of vibrating to at least one of generate and/or and detect sound energy, wherein the membrane structure has in cross-section at least in some areas a first piezo layer spaced from a second piezo layer. An interlayer is arranged in an area between the first and second piezo layers, the interlayer being made of at least one of silicon oxide, silicon nitride and polysilicon, the interlayer being configured so that sound energy can be reflected in the direction of at least one interface of the membrane structure adjacent to the air.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: August 7, 2018
    Assignee: USound GmbH
    Inventors: Andrea Rusconi Clerici Beltrami, Ferruccio Bottoni
  • Patent number: 9998830
    Abstract: A speaker is provided in the present disclosure. The speaker includes a shell, vibration system which received in the shell and a magnetic circuit system which disposed below the vibration system and used for driving the vibration system to vibrate for producing sound, the magnetic circuit system including a main magnet assembly and a fixing assembly, the main magnet assembly includes a first main magnet, a second main magnet homopolarly opposite to the first main magnet and spaced from the first main magnet, a magnetizer sandwiched between the first main magnet and the second main magnet, and positioning holes penetrating the first main magnet, the magnetizer and the second main magnet, the fixing assembly comprises fasteners penetrating through the positioning holes and a pressure plate matched with the fasteners to fix the main magnet assembly.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: June 12, 2018
    Assignee: AAC TECHNOLOGIES PTE. LTD.
    Inventors: Lubin Mao, Shun Guo, Chengxia Ji
  • Patent number: 9924250
    Abstract: The sound-transmitting structure (100) of the present invention includes a sound-transmitting membrane (1) that allows passage of sounds and prevents passage of foreign matters and a case (120) having a sound-transmitting opening (122). This sound-transmitting membrane (1) includes a supporting member (12) that is a nonwoven fabric containing an elastomer and a porous resin membrane (11) disposed on the supporting member (12) and containing polytetrafluoroethylene as a main component. The sound-transmitting membrane (1) covers the sound-transmitting opening (122) with the supporting member (12) welded to the case (120).
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: March 20, 2018
    Assignee: NITTO DENKO CORPORATION
    Inventor: Masaaki Mori
  • Patent number: 9913584
    Abstract: Intravascular devices, systems, and methods are disclosed. In some embodiments, the intravascular devices include at least one pressure sensing component within a distal portion of the device. In that regard, one or more electrical, electronic, optical, and/or electro-optical pressure-sensing components is secured to an elongated substrate such that the pressure-sensing component is mounted perpendicular to a central longitudinal axis of the device. In some implementations, the elongated substrate has a cylindrical profile. Methods of making, assembling, and/or using such intravascular devices and associated systems are also provided.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: March 13, 2018
    Assignee: VOLCANO CORPORATION
    Inventors: Bret C. Millett, David H. Burkett, Paul Douglas Corl
  • Patent number: 9873137
    Abstract: Disclosed is an ultrasonic transducer that is provided with: a bottom electrode; an electric connection part which is connected to the bottom electrode from the bottom of the bottom electrode; a first insulating film which is formed so as to cover the bottom electrode; a cavity which is formed on the first insulating film so as to overlap the bottom electrode when seen from above; a second insulating film which is formed so as to cover the cavity; and a top electrode which is formed on the second insulating film so as to overlap the cavity when seen from above. The electric connection part to the bottom electrode is positioned so as to not overlap the cavity when seen from above.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: January 23, 2018
    Assignee: HITACHI, LTD.
    Inventors: Shuntaro Machida, Takashi Kobayashi
  • Patent number: 9866971
    Abstract: The present invention provides a method for manufacturing a thermal bimorph diaphragm and a MEMS speaker with thermal bimorphs, wherein the method comprises the steps of: thermally oxidizing a substrate to obtain an insulating layer thereon and providing a metal layer on the insulating layer; providing a sacrificial layer on the metal layer; providing a first thermal bimorph layer on the sacrificial layer; providing a second thermal bimorph layer on the first thermal bimorph layer; providing a metal connecting layer at the positions on the metal layer where the sacrificial layer is not provided; forming corresponding back holes on the substrate and the insulating layer and releasing the sacrificial layer; forming the thermal bimorph diaphragm which is warped with the first thermal bimorph layer and the second thermal bimorph layer after the sacrificial layer is released.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: January 9, 2018
    Assignee: GOERTEK INC.
    Inventors: Quanbo Zou, Zhe Wang, Jifang Tao, Guanxun Qiu
  • Patent number: 9828237
    Abstract: In accordance with an embodiment, a MEMS device includes a first membrane element, a second membrane element spaced apart from the first membrane element, a low pressure region between the first and second membrane elements, the low pressure region having a pressure less than an ambient pressure, and a counter electrode structure comprising a conductive layer, which is at least partially arranged in the low pressure region or extends in the low pressure region. The conductive layer includes a segmentation providing an electrical isolation between a first portion of the conductive layer and a second portion of the conductive layer.
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: November 28, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Arnaud Walther, Alfons Dehe, Johann Strasser, Gerhard Metzger-Brueckl
  • Patent number: 9771303
    Abstract: In an X-ray diffraction diagram of a cordierite sintered body of the present invention, the ratio of the total of the maximum peak intensities of components other than cordierite components to the peak top intensity of the (110) plane of cordierite is 0.0025 or less. Since having a significantly small amount of different phases other than the cordierite components, this cordierite sintered body has a high surface flatness when the surface thereof is mirror-polished.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: September 26, 2017
    Assignee: NGK Insulators, Ltd.
    Inventors: Yoshinori Isoda, Yosuke Sato, Yuji Katsuda
  • Patent number: 9681244
    Abstract: A method for manufacturing a microphone chip, includes steps of: providing a first underlay, and depositing insulating oxide layers at both sides; depositing the component layers on the insulating oxide layers respectively; depositing the tetraethyl orthosilicate oxide layers on the component layers; etching the tetraethyl orthosilicate oxide layers; patterning various deposition layers in the first underlay; providing the second underlay; depositing the oxide layers on the substrate; etching and patterning oxide layer; releasing the back plate; combining the first underlay and the second underlay by welding the tetraethyl orthosilicate oxide layer on the first underlay and the oxide layer on the second underlay under ambient temperature; etching the second underlay to form the back cavity; etching the first underlay to release the diaphragm and obtaining the microphone chip.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: June 13, 2017
    Assignee: AAC TECHNOLOGIES PTE. LTD.
    Inventors: Goh Wan Ling Serene, Loo Li Eng, Tan Qiu Yu Veronica, Xiaohui Zhong, Lin Yih Shung, Lai Kah Keen
  • Patent number: 9628886
    Abstract: A MEMS device includes a backplate electrode and a membrane disposed spaced apart from the backplate electrode. The membrane includes a displaceable portion and a fixed portion. The backplate electrode and the membrane are arranged such that an overlapping area of the fixed portion of the membrane with the backplate electrode is less than maximum overlapping.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: April 18, 2017
    Assignee: Infineon Technologies AG
    Inventors: Alfons Dehe, Stefan Barzen
  • Patent number: 9538980
    Abstract: According to certain described aspects, multiple acoustic sensing elements are employed in a variety of beneficial ways to provide improved physiological monitoring, among other advantages. In various embodiments, sensing elements can be advantageously employed in a single sensor package, in multiple sensor packages, and at a variety of other strategic locations in the monitoring environment. According to other aspects, to compensate for skin elasticity and attachment variability, an acoustic sensor support is provided that includes one or more pressure equalization pathways. The pathways can provide an air-flow channel from the cavity defined by the sensing elements and frame to the ambient air pressure.
    Type: Grant
    Filed: April 7, 2014
    Date of Patent: January 10, 2017
    Assignee: MASIMO CORPORATION
    Inventors: Valery G. Telfort, Dimitar Dimitrov, Phi Trang
  • Patent number: 9543787
    Abstract: The present invention is directed to an apparatus for more efficient exergy and power usage in data centers. Denominated FRAME (standing for “Forced Recuperation, Aggregation & Movement of Exergy”), the apparatus is a power production and exergy management system (exergy being energy available to do useful work, as opposed to energy, which can be changed to a form, usually heat, rendering it unavailable). The apparatus integrates generally isothermal operation with phase-change and single-phase liquid cooling having variable operating temperatures and pressures, aided by a dynamically reconfigurable “thermal bus” comprising multi-fluid thermal fluid transport channels, virtual plumbing, and associated support devices. The apparatus minimizes exergy use through efficient operation and by recuperating and aggregating useful exergy that may then be dynamically repurposed to meet energy or power needs that would otherwise have to be met via external means.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: January 10, 2017
    Inventor: David D. Duchesneau
  • Patent number: 9518849
    Abstract: An acoustic sensor apparatus mounted to a medium is disclosed. The acoustic sensor apparatus includes: a sensor unit processing an input acoustic signal; and a housing including a body unit having an accommodation groove in which the sensor unit is accommodated, a cap unit formed to close an opening of the accommodation groove, and a coupling unit formed to mechanically couple the body unit or the cap unit to a medium.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: December 13, 2016
    Assignee: HYUNDAI MOTOR COMPANY
    Inventors: Hui Sung Lee, Kwang Myung Oh, Sung Jin Sah, Sung-Min Park
  • Patent number: 9439017
    Abstract: In various embodiments, a method for manufacturing microphone structures is provided.
    Type: Grant
    Filed: February 10, 2014
    Date of Patent: September 6, 2016
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Ursula Hedenig, Daniel Maurer, Thomas Grille, Peter Irsigler, Soenke Pirk, Andre Brockmeier
  • Patent number: 9347245
    Abstract: Disclosed is a sliding arm for use with a docking station having a connector block with a plurality of plugs, the arm includes a block-side portion and a follower portion. The block-side portion can have a first end connected to the connector block. The follower portion can be connected to a second end of the block-side portion with a linear clutch. The linear clutch can include a bolt, a spring, and two sliding members. The bolt can pass through the block-side portion and the follower portion. A force on an end of the arm can cause the clutch to slip allowing the follower portion to move independently of the block-side portion. A sensor can detect a slippage of the linear clutch.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: May 24, 2016
    Assignee: Henge Docks LLC
    Inventor: Matthew Leigh Vroom
  • Patent number: 9337773
    Abstract: An oscillation device (electro-acoustic transducer (100)) includes an oscillation element (110) that has a vibrating member (120) and a piezoelectric element (111) that is attached to one surface of the vibrating member (120). The oscillation device includes a sheet-shaped waterproof member (140) that is constituted by a waterproof material. The oscillation device includes a frame-shaped supporting member (130) that holds an outer peripheral portion of the vibrating member (120) and an outer peripheral portion of the waterproof member (140) so that the waterproof member (140) and the oscillation element (110) face each other. The oscillation device includes a connection member (150) that partially connects mutual opposed surfaces of the oscillation element (110) and the waterproof member (140).
    Type: Grant
    Filed: November 25, 2011
    Date of Patent: May 10, 2016
    Assignee: NEC CORPORATION
    Inventors: Yasuharu Onishi, Yuichiro Kishinami, Jun Kuroda, Yukio Murata, Shigeo Satou, Motoyoshi Komoda, Nobuhiro Kawashima, Tatsuya Uchikawa
  • Patent number: 9312169
    Abstract: Method for producing a microelectronic device formed from a stack of supports (W) each provided with one or more electronic components (C) and comprising a conductive structure (170, 470) formed from a first blind conductive via (171b, 472) and a second blind conductive via (171a, 473) with a greater height, the first via and the second via being connected together.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: April 12, 2016
    Assignee: Commissariat a l'energie atomique et aux energies alternatives
    Inventors: Christophe Bouvier, Gabriel Pares
  • Patent number: 9254996
    Abstract: Embodiments related to pressure sensitive structures are described and depicted.
    Type: Grant
    Filed: February 8, 2012
    Date of Patent: February 9, 2016
    Assignee: INFINEON TECHNOLOGIES AG
    Inventor: Thoralf Kautzsch
  • Patent number: 9226074
    Abstract: An acoustic device includes a resilient surround having a proportionately unequal distribution of half roll and inverted half roll segments. Half roll segments may be sized and located to provide additional clearance for internal components. Regions of transitional concavity may be sized and located to provide increased stiffness in one or more dimensions. Transitions between inversions of concavity may be smooth and free of localized inflexions.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: December 29, 2015
    Assignee: Bose Corporation
    Inventors: Weidong Zhu, Johan Isaksson, Benjamin Peterson
  • Patent number: 9079760
    Abstract: An apparatus has a packaged microphone with a base and a lid that at least in part form an interior chamber containing a microphone die. The base has a bottom surface with an electrical interface and a base aperture. The apparatus also has a device housing having an internal surface, and a filter extending between the internal surface of the device housing, through an underlying substrate, and the bottom surface of the base.
    Type: Grant
    Filed: June 20, 2013
    Date of Patent: July 14, 2015
    Assignee: INVENSENSE, INC.
    Inventors: Thomas M. Goida, Jason P. Fiorillo
  • Patent number: 9048608
    Abstract: One aspect relates to an electrical bushing for use in a housing of an implantable medical device. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element is set-up to establish, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body. The at least one conducting element includes at least one cermet. The cermet has a metal fraction in a range from 30% by volume to 60% by volume.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: June 2, 2015
    Assignee: Heraeus Precious Metals GmbH & Co. KG
    Inventor: Goran Pavlovic
  • Publication number: 20150146899
    Abstract: Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect of the present subject matter includes a method of manufacturing a hearing assistance device. According to various embodiments, the method includes providing a molded interconnect device (MID) housing and inserting a flexible circuit module having conductive surface traces into the MID housing. One or more hearing assistance electronic modules are connected to the MID housing using direct compression without the use of wires or solder, according to various embodiments. In one embodiment, the MID housing includes a laser-direct structuring (LDS) housing.
    Type: Application
    Filed: November 27, 2013
    Publication date: May 28, 2015
    Applicant: Starkey Laboratories, Inc.
    Inventors: John Dzarnoski, Susie Krzmarzick, Douglas F. Link, David Prchal
  • Publication number: 20150143688
    Abstract: A catheter is provided for medical ultrasound imaging that can be effectively used in combination with other imaging modalities to detect medical structures of interest as well as the catheter. Markers are added to the catheter with precision, which provides a means to merge the images from different modalities. Using a template, apertures for marker placement are formed in the catheter after creating the catheter housing. The ultrasound array may be used for accurate positioning of the template. Alternatively or additionally, a rigid insert with markers connects with the array. The insert holds the markers in place and may reduce artifacts in ultrasound scanning due to flexing of the array.
    Type: Application
    Filed: January 28, 2015
    Publication date: May 28, 2015
    Inventors: Lex J. Garbini, Wilko Gerwin Wilkening, Ricardo Espinosa
  • Publication number: 20150146914
    Abstract: An apparatus including a diaphragm, where the diaphragm includes a membrane having electrically conductive material; a drive configured to move the diaphragm; and a connector configured to connect the membrane to a ground.
    Type: Application
    Filed: November 22, 2013
    Publication date: May 28, 2015
    Applicant: Nokia Corporation
    Inventors: Jian Guo, Antero Tossavainen, Veijo Kajanus, Jingyu Huang
  • Patent number: 9038263
    Abstract: Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: May 26, 2015
    Assignee: Delaware Capital Formation, Inc.
    Inventors: Derek Wayne Puccio, Errol P. EerNisse
  • Patent number: 9040360
    Abstract: Methods for manufacturing multiple bottom port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from panels of substrates, sidewall spacers, and lids. Each MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port disposed in the substrate. The panels are joined together, and each individual substrate, sidewall spacer, and lid cooperate to form an acoustic chamber for its respective MEMS microphone die. The joined panels are then singulated to form individual MEMS microphones.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: May 26, 2015
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Publication number: 20150139472
    Abstract: A mono-body set of headphones having a fixed length of headband between ear pads is provided. Although the distance between the ear pads is fixed, the fit of the headphones can be adjusted to the head of the user by coupling or decoupling a removable/insertable headphone pad. More particularly, a pad is provided that can be mated with, or removed from, the headband of the headphones, thus raising or lowering the lower surface of the headband relative to the crown of the user's head, in order to change the position of the ear pads relative to the user's ears. The mono-body headphones are, preferably, flexible and durable, permitting the headphones to be straightened, twisted or bent without breaking.
    Type: Application
    Filed: November 19, 2014
    Publication date: May 21, 2015
    Inventors: PETER SOLOMON, CHRISTOPHER PIEDRA, JUAN GALINDO, EDWARD MARTIN
  • Publication number: 20150141825
    Abstract: An ultrasonic device includes a substrate, an acoustic adjustment layer, an acoustic lens and a structural member. The substrate has an element array including a plurality of thin film ultrasonic transducer elements arranged in an array form. The acoustic adjustment layer covers the element array. The acoustic lens is arranged above the acoustic adjustment layer. The structural member is in contact with the acoustic lens and fixed to the substrate. The structural member has a modulus of rigidity greater than a modulus of rigidity of the acoustic lens.
    Type: Application
    Filed: October 27, 2014
    Publication date: May 21, 2015
    Inventor: Kanechika KIYOSE
  • Publication number: 20150128790
    Abstract: In an actuator (50), a bobbin (511) to which a voice coil (513) is attached is disposed within a magnetic path space formed by a magnetic path forming section (52). A connecting shaft (514) is coupled to the bobbin (511), and a connection end portion (516A) at a distal end of the connecting shaft is connected to a sound board of a musical instrument. The length of the shaft (514) can be adjusted. When the actuator (50) is attached to the sound board, the length of the shaft (514) is adjusted and the connection end portion (516A) is connected to the sound board while a position of the voice coil (513) within the magnetic path space is maintained in a predetermined reference mounting position, in a state in which the magnetic path forming unit (52) is supported in a predetermined position by a support unit (55).
    Type: Application
    Filed: December 14, 2012
    Publication date: May 14, 2015
    Inventors: Kenta Ohnishi, Yuji Takahashi
  • Publication number: 20150126805
    Abstract: A device, including an implantable microphone, including a chamber in which media corresponding to at least one of a liquid or a fluid resistant to compression is located such that vibrations originating external to the microphone are effectively transmitted through the media.
    Type: Application
    Filed: November 5, 2014
    Publication date: May 7, 2015
    Inventor: Scott Allen MILLER
  • Publication number: 20150124564
    Abstract: An ultrasonic sensor includes a housing having a peripheral side wall and a base surface, i.e., it is configured as essentially pot-shaped. The base surface is configured as a diaphragm. A transducer element, which is configured as a piezoelectric element, for example, and is used for generating and detecting ultrasonic oscillations, is situated on the base surface. At least one mass element is situated on the base surface so that the resistance of the mass element against an oscillation of the diaphragm increases with rising oscillation frequency.
    Type: Application
    Filed: April 5, 2013
    Publication date: May 7, 2015
    Inventor: David Bartylla
  • Patent number: 9024432
    Abstract: A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a sidewall spacer and a lid, and the MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port in the substrate. The substrate, the sidewall spacer, and the lid are joined together to form the MEMS microphone, and the substrate, the sidewall spacer, and the lid cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: May 5, 2015
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 9021669
    Abstract: Provided is a method for manufacturing a surface acoustic wave apparatus that can reduce degradation of electric characteristics and also reduce the number of manufacturing processes. The method for manufacturing a surface acoustic wave apparatus includes the steps of: forming an IDT electrode on an upper surface of a piezoelectric substrate, forming a frame member surrounding a formation area in which the IDT electrode is formed on the piezoelectric substrate, and mounting a film-shaped lid member on the upper surface of the frame member so as to be joined to the frame member so that a protective cover, used for covering the formation area and for providing a tightly-closed space between it and the formation area, is formed.
    Type: Grant
    Filed: August 7, 2007
    Date of Patent: May 5, 2015
    Assignee: KYOCERA Corporation
    Inventor: Toru Fukano
  • Patent number: 9023689
    Abstract: A top-port, surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a sidewall spacer and a lid with an acoustic port, and the MEMS microphone die is lid-mounted and acoustically coupled to the acoustic port. The substrate, the sidewall spacer, and the lid are joined together to form the MEMS microphone, and the substrate, the sidewall spacer, and the lid cooperate to form an acoustic chamber for the lid-mounted MEMS microphone die.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: May 5, 2015
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Publication number: 20150113795
    Abstract: A method of fabricating a custom-fit in-ear-monitor (IEM) is provided that utilizes a pre-tuned, single piece driver module to simplify fabrication and reduce cost while insuring that the performance of the IEM consistently meets the acoustic goals set for the device. During fabrication the driver module, the drivers coupled to the module's driver ports, and the crossover circuit are installed in a custom-fit IEM shell such that the module's acoustic output is aligned with the output surface of the IEM shell. After installing the device components within the IEM shell, the shell is sealed.
    Type: Application
    Filed: October 24, 2013
    Publication date: April 30, 2015
    Applicant: LOGITECH EUROPE, S.A.
    Inventors: Philippe Depallens, Joseph A. Saggio, JR., Todd W. Lansinger
  • Patent number: 9015914
    Abstract: A method for manufacturing an electronic component includes a first step of preparing a piezoelectric body with a flat surface, a second step of implanting ions into the piezoelectric body such that an ion-implanted layer is formed in the piezoelectric body, a third step of forming sacrificial layers on the flat surface of the piezoelectric body, a fourth step of forming an insulating body over the flat surface of the piezoelectric body and the sacrificial layers to form a piezoelectric structure, a fifth step of dividing the piezoelectric body at the ion-implanted layer to form a piezoelectric laminar structure in which a piezoelectric film separated from the piezoelectric body is bonded to the insulating body, a sixth step of forming electrodes on portions of a division surface of the piezoelectric film, and a seventh step of removing the sacrificial layers from the piezoelectric laminar structure.
    Type: Grant
    Filed: July 24, 2012
    Date of Patent: April 28, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Taro Nishino, Takashi Iwamoto
  • Publication number: 20150110335
    Abstract: An open modular speaker assembly is configured to be inserted into a mobile wireless device and includes a frame, a magnetic assembly that is disposed within the frame and a membrane assembly disposed within the frame and in proximity to the magnetic assembly. Actuation of the magnetic assembly by an electric current causes a movement of the magnetic assembly causing a resultant movement of the membrane assembly. A first portion of the mobile wireless device and the membrane assembly form a front volume where the resultant movement of the membrane assembly produces sound in the front volume, and such that a second portion of the mobile wireless device and the membrane assembly form a back volume that is separated from the front volume by the membrane assembly. Air is displaced or exchanged between the front volume and the back volume.
    Type: Application
    Filed: October 6, 2014
    Publication date: April 23, 2015
    Inventors: Vladimir Telemaque, Michael Schoffmann
  • Publication number: 20150112201
    Abstract: Provided is an ultrasonic device including: an ultrasonic element array substrate having a plurality of ultrasonic elements configured to perform at least one of transmission and reception of ultrasound; an acoustic lens configured to focus the ultrasound; an acoustic matching unit formed using resin, the acoustic matching unit being arranged between the ultrasonic element array substrate and the acoustic lens; and a plurality of spherical spacing members arranged between the ultrasonic element array substrate and the acoustic lens so as to be in contact with the ultrasonic element array substrate and the acoustic lens.
    Type: Application
    Filed: October 8, 2014
    Publication date: April 23, 2015
    Inventors: Daisuke NAKANISHI, Kazuki YOSHIDA, Yasunori ONISHI
  • Patent number: 9009947
    Abstract: A method of making a resonating beam accelerometer (RBA). In an example process, a proof mass device and resonators are created from a quartz material. A direct bond is formed between the proof mass and the resonators by applying a predefined amount of pressure at a predefined temperature for a predefined amount of time. One or more damping plates are created from a quartz material. A direct bond is formed between the damping plates and the proof mass device. The proof mass device is created by applying a predefined amount of pressure at pressure at temperature to two bases, two proof mass portions, and a flexure. The proof mass bases are on opposite sides of the flexure. The proof mass portions are on opposite sides of the flexure. A gap is present between the proof mass bases and the proof mass portions.
    Type: Grant
    Filed: April 19, 2012
    Date of Patent: April 21, 2015
    Assignee: Honeywell International Inc.
    Inventor: John S. Starzynski
  • Patent number: 9006880
    Abstract: The present invention relates to a surface mount package for a micro-electro-mechanical system (MEMS) microphone die and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components that simplifies manufacturing and lowers costs. The surface mount package features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the MEMS microphone die is mechanically attached, providing an interior surface for making electrical connections between the MEMS microphone die and the package, and providing an exterior surface for surface mounting the microphone package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The microphone package has a substrate with metal pads on its top and bottom surfaces, a sidewall spacer, and a lid.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: April 14, 2015
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 9003637
    Abstract: A method of manufacturing a microphone assembly having an ear set function includes assembling a mike cell unit; obtaining a region for connection with the mike cell unit on a PCB, mounting only a conductive member in the region, and mounting other remaining components outside the region; adhering the mike cell unit to a corresponding region of the PCB; and sealing an adhering portion between the mike cell unit and the PCB. Assembling the mike cell unit includes inserting a mike cell case having a sound hole and a curing portion into a diaphragm assembly; stacking a spacer on the diaphragm assembly; inserting a back electrode plate into an insulating ring base; mounting the insulating ring base on the spacer; mounting a metal ring base on the insulating ring base; and curing or clamping a curing portion of the mike cell case.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: April 14, 2015
    Assignee: BSE Co., Ltd.
    Inventors: Dong Sun Lee, Hyoung Joo Kim
  • Publication number: 20150096828
    Abstract: A battery powered wireless audio speaker comprising a passive radiator is disclosed. The perimeter portion of the passive radiator is sandwiched between the speaker chassis and the retention gasket that resides between an external overlying perforated cover to firmly secure the passive radiator. The construction is capable of being well suited to enhance and improve integrity to the seal between the passive radiator and the speaker chassis in strenuous environment conditions such as when a speaker is submerged in water.
    Type: Application
    Filed: September 30, 2014
    Publication date: April 9, 2015
    Inventor: Andy Fathollahi
  • Publication number: 20150098592
    Abstract: In an electrodynamic acoustic transducer which uses a surface potential of an electret dielectric film as a polarization voltage, prevention of partial suctional adhesion of a diaphragm caused by variation in surface potential across the electret dielectric film is ensured in a simple way. In an electrodynamic acoustic transducer including a diaphragm and a fixed pole which are arranged with a predetermined interval so as to face each other, a facing surface of either one of the diaphragm and the fixed pole having an electret dielectric film, a surface of the electret dielectric film is divided into a plurality of segment regions, and a predetermined surface potential is given to each of the segment regions by a polarization processing unit.
    Type: Application
    Filed: June 23, 2014
    Publication date: April 9, 2015
    Inventor: Hiroshi AKINO