Acoustic Transducer Patents (Class 29/594)
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Publication number: 20140254857Abstract: An audio equipped fan is disclosed having a housing defining an inner cavity, a motor disposed at least partially in the inner cavity of the housing and having an output shaft extending therefrom that is rotatable by the motor, a fan connected to the output shaft of the motor and rotatable therewith, a grille connected to the housing and positioned in alignment with the fan, the grille having an interior side and an exterior side and defining first openings through which air may flow while the fan is rotated and second openings through which sound may travel, a speaker connected to at least one of the housing, motor, fan and grille and aligned on the interior side of the grille with the second openings of the grille so that sound may travel through the grille, and a temporary power source connected to the speaker. Related methods are also disclosed.Type: ApplicationFiled: May 23, 2014Publication date: September 11, 2014Applicant: Homewerks Worldwide, LLCInventors: Peter D. Berkman, Ruilin Zhang, Jeffrey Jon Pischke, Michael Malaker
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Publication number: 20140251014Abstract: The present invention relates to a pre-collapsed capacitive micro-machined transducer cell (10) comprising a substrate (12), and a membrane (14) disposed above a total membrane area (Atotal), wherein a cavity (20) is formed between the membrane (14) and the substrate (12), the membrane comprising a hole (15) and an edge portion (14a) surrounding the hole (15). The cell (10) further comprises a stress layer (17) on the membrane (14), the stress layer (17) having a predetermined stress value with respect to the membrane (14), the stress layer (17) being adapted to provide a bending moment on the membrane (14) in a direction towards the substrate (12) such that the edge portion (14a) of the membrane (14) is collapsed to the substrate (12). The present invention further relates to a method of manufacturing such pre-collapsed capacitive micro-machined transducer cell (10).Type: ApplicationFiled: October 26, 2012Publication date: September 11, 2014Inventors: Peter Dirksen, Ronald Dekker, Vincent Adrianus Henneken, Adriaan Leeuwestein, Bout Marcelis, John Douglas Fraser
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Publication number: 20140254850Abstract: Representative implementations of devices and techniques provide an improved signal receive time to a sensor component. The sensor component is enclosed within a package arranged to allow the sensor to potentially receive a signal in less time. The package may have a cavity, and the cavity may be at least partly filled with an acoustical transducer.Type: ApplicationFiled: March 6, 2013Publication date: September 11, 2014Applicant: Infineon Technologies AGInventors: Klaus ELIAN, Thomas MUELLER
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Publication number: 20140254835Abstract: A microphone structure has a lid forming an interior chamber. The lid includes a permanent magnet for forming a permanent magnetic field. The microphone structure includes an aperture for permitting acoustic access to the interior of the chamber and thus, the MEMS microphone. The MEMS microphone structure includes a substrate mechanically coupled to an electrically conductive diaphragm. The electrically conductive diaphragm has a first side defining a plane and the diaphragm moves through a range of motion perpendicular the plane of the first side. The permanent magnetic field is perpendicular to the direction of motion of the diaphragm and linear within the range of motion, such that a current will be generated and sensed by sensors within an electric circuit loop that includes the diaphragm.Type: ApplicationFiled: March 5, 2013Publication date: September 11, 2014Applicant: ANALOG DEVICES, INC.Inventor: James P. Yakura
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Publication number: 20140245596Abstract: A process for manufacturing a wave energy emitter and a system for manufacturing the same.Type: ApplicationFiled: October 15, 2013Publication date: September 4, 2014Inventor: George Whitaker
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Publication number: 20140247698Abstract: The present invention relates to a pre-collapsed capacitive micro-machined transducer cell (10) comprising a substrate (12), and a membrane (14) disposed above a total membrane area ((Atotal), wherein a cavity (20) is formed between the membrane (14) and the substrate (12), the membrane (14) comprising a hole (15) and an edge portion (14a) surrounding the hole (15), the edge portion (14a) of the membrane (14) being collapsed to the substrate (12). The cell further comprises a plug (30) arranged in the hole (15) of the membrane (14), the plug (30) being located only in a subarea (Asub) of the total membrane area (Atotal). The present invention further relates to a method of manufacturing such pre-collapsed capacitive micro-machined transducer cell (10).Type: ApplicationFiled: October 15, 2012Publication date: September 4, 2014Inventors: Peter Dirksen, Ronald Dekker, Vincent Adrianus Henneken, Adriaan Leeuwestein, Bout Marcelis, John Douglas Fraser
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Patent number: 8819928Abstract: An intravascular ultrasonic imaging catheter is provided with a flexible circuit electrically coupled to a transducer array mounted on the distal end of the catheter, a portion of the flexible circuit being helically wound about the catheter in order to enhance the flexibility of the circuit. The catheter may be a balloon catheter which is also provided with a stent mounted on the balloon, the stent carrying one or more drugs designed to be eluted or washed into a patient's blood stream after the stent has been delivered, by a the balloon catheter, into a target area within the patient's vascular system.Type: GrantFiled: July 27, 2010Date of Patent: September 2, 2014Assignee: Volcano CorporationInventors: Elvin Nix, William Howes, Robert Dickinson, Stephan Wnendt
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Patent number: 8819904Abstract: A process for producing an acoustic device having a phononic crystal structure comprising inclusions produced in a first medium distributed in a matrix of a second medium, to block propagation of acoustic waves within a bandgap frequency band, includes: defining geometric parameters of said inclusions, which have walls contacting said matrix, making at least one non-zero first wall angle, to the normal of the plane of said structure, said geometric parameters including said first wall angle; determining a function relating to variation in frequency position of said bandgap with said wall angle or relating to variation in width of said bandgap with said wall angle; determining said at least first angle, for a selected frequency position and/or selected width of the bandgap, from the function or functions determined beforehand; and producing said inclusions having at least said first wall angle in said matrix formed by said second medium.Type: GrantFiled: February 10, 2012Date of Patent: September 2, 2014Assignee: Commissariat a l'Energie Atomique et aux Energies AlternativesInventors: Marie Gorisse, Alexandre Reinhardt
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Publication number: 20140236015Abstract: An ultrasound probe includes a therapeutic ultrasound transducer, a slot disposed in the therapeutic ultrasound transducer, and a first diagnostic ultrasound transducer disposed in the slot and configured to move along the slot.Type: ApplicationFiled: November 14, 2013Publication date: August 21, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ho-taik LEE, Won-chul BANG
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Patent number: 8806738Abstract: A method for manufacturing a quartz crystal unit, comprising the steps of forming a quartz crystal tuning fork shape having a quartz crystal tuning fork base, and first and second quartz crystal tuning fork tines, a quartz crystal tuning fork resonator having the quartz crystal tuning fork shape, forming at least one groove in at least one of opposite main surfaces of each of the first and second quartz crystal tuning fork tines, determining each of a length of the at least one groove and an overall length of the quartz crystal tuning fork resonator so that a series resistance R1 of a fundamental mode of vibration of the quartz crystal tuning fork resonator is less than a series resistance R2 of a second overtone mode of vibration thereof, housing the quartz crystal tuning fork resonator in a case, connecting a lid to the case, and disposing a metal or a glass in a through-hole of the case.Type: GrantFiled: February 15, 2013Date of Patent: August 19, 2014Assignee: Piedek Technical LaboratoryInventor: Hirofumi Kawashima
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Patent number: 8806727Abstract: A method of forming a piezoelectric actuator on a vibration plate to provide a driving force to each of a plurality of pressure chambers includes forming a lower electrode on the vibration plate, forming a piezoelectric layer on the lower electrode at a position corresponding to each of the pressure chambers, forming a supporting pad on the lower electrode, the supporting pad contacting one end of the piezoelectric layer and extending away from the one end of the piezoelectric layer, forming an upper electrode extending from a top surface of the piezoelectric layer to a top surface of the supporting pad, and bonding the upper electrode to a driving circuit above the supporting pad to receive a voltage from the driving circuit.Type: GrantFiled: February 25, 2010Date of Patent: August 19, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae-kyung Lee, Jae-woo Chung, Kyo-yeol Lee, Hwa-sun Lee, Seung-mo Lim, Jae-chang Lee
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Publication number: 20140226846Abstract: A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (PCB). A diaphragm can be surface micro-machined onto an interior surface of the first PCB at a region having the one or more holes. Interface electronics can also be interconnected to the interior surface of the PCB. One or more spacer PCBs can be attached to a second PCB to the first PCB, such that appropriate interconnections between interconnect vias are made. The second PCB and first PCB with spacers in between can be attached so as to create a cavity in which the diaphragm and interface electronics are located.Type: ApplicationFiled: April 22, 2014Publication date: August 14, 2014Inventors: Mark SHEPLAK, David Patrick ARNOLD
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Patent number: 8803404Abstract: An ultrasound probe and a method for manufacturing the same are provided. More particularly, a one-dimensional or two-dimensional ultrasound probe having a multi-element-type piezoelectric material is easily manufactured by inserting a flat wire in a backing material, wherein the flat wire is used as a signal cable to supply electrical signals, enabling easy and simple arrangement of piezoelectric units as well as the signal cable.Type: GrantFiled: March 3, 2011Date of Patent: August 12, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Oh Soo Kwon, Jeong Pyo Kim
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Publication number: 20140221878Abstract: A manufacturing method of an ultrasonic probe includes analyzing a first lateral vibration which is superposed on a longitudinal vibration because of an asymmetric shape of a distal asymmetric portion when the ultrasonic probe is longitudinally vibrated. The manufacturing method includes specifying a bending position to bend a proximal-direction side part of the ultrasonic probe so that the proximal-direction side part is parallel to a X-Y plane and tilted relative to a X-axis, a second lateral vibration, which has the same wavelength and vibration direction as the first lateral vibration and which is in anti-phase with respect to the first lateral vibration, being superposed on the longitudinal vibration and the first lateral vibration in the ultrasonic probe while the ultrasonic probe is bent at the bending position.Type: ApplicationFiled: February 21, 2014Publication date: August 7, 2014Applicant: OLYMPUS MEDICAL SYSTEMS CORP.Inventor: Tsunetaka AKAGANE
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Patent number: 8793849Abstract: A method of fabricating a thickness shear mode (TSM) gas and organic vapor sensor having a visco-elastic polymer coating and a fundamental frequency greater than 20 MHz. The method begins by providing a piezoelectric crystal and milling a central region of the crystal. Milling the crystal creates a central oscillating region of reduced thickness surrounded by a thicker outer region. Two electrodes are then deposited in the oscillating region of the crystal—one on each side of the crystal. The oscillating region on both sides of the crystal and the electrodes are then coated with a polymer coating.Type: GrantFiled: June 5, 2009Date of Patent: August 5, 2014Assignee: University of South FloridaInventors: Venkat R. Bhethanabotla, Randolph D. Williams
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Publication number: 20140211588Abstract: An ultrasonic holography imaging system and method are provided. The ultrasonic holography imaging system includes an ultrasonic transducer array coupled to an analog processing section. The analog processing section is coupled to a digital processing section. The digital processing section generates digital signals to be converted by the analog processing section into analog signals that are transmitted to individual transceiver elements within the ultrasonic transducer array to cause separate ones of the individual transceiver elements to emit ultrasonic waveforms that are differentiated from each other by one or more parameters, including amplitude, frequency, and phase or modulation thereof.Type: ApplicationFiled: January 25, 2013Publication date: July 31, 2014Applicant: GENERAL ELECTRIC COMPANYInventors: Stephan Falter, Dieter Lingenberg
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Publication number: 20140203682Abstract: An electromechanical transducer includes a plurality cells that are electrically connected to form a unit. Each of the cells includes a first electrode and a second electrode provided with a gap being disposed therebetween. Dummy cells that are not electrically connected to the cells are provided around the outer periphery of the unit of the cells.Type: ApplicationFiled: May 1, 2013Publication date: July 24, 2014Applicant: Canon Kabushiki KaishaInventor: Canon Kabushiki Kaisha
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Patent number: 8782876Abstract: A process for fabricating an integrated Micro-Electro-Mechanical Systems (MEMS) filter includes bonding an insulating substrate having a first end and a second end to a base substrate, the second end of the insulating substrate cantilevered over and separated from the base substrate by a gap, forming a resonator element on the second end of the insulating substrate, forming an inductive element comprising a coil, wherein the coil is formed on the insulating substrate, and forming a capacitive element on the first side of the insulating substrate, the capacitive element comprised of two conductive plates, wherein one of the two conductive plates is formed on the insulating substrate.Type: GrantFiled: June 17, 2011Date of Patent: July 22, 2014Assignee: HRL Laboratories, LLCInventors: Randall L. Kubena, David T. Chang
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Patent number: 8776334Abstract: A method of manufacturing a piezoelectric thin film resonator which can reduce variations in resonant frequency and resonant resistance by uniformly planarizing a structural film. The method of manufacturing the piezoelectric thin film resonator includes the steps of forming sacrifice layer patterns on an upper surface of a mother substrate; forming a dielectric film on the sacrifice layer patterns; processing a surface of the dielectric film by a plasma treatment; forming vibration portions on the dielectric film, the vibration portions each being composed of two excitation electrodes and a piezoelectric thin film provided therebetween; etching the sacrifice layer patterns; and cutting the mother substrate into separate piezoelectric thin film resonators.Type: GrantFiled: March 24, 2008Date of Patent: July 15, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Hidetoshi Fujii, Ryuichi Kubo
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Patent number: 8776336Abstract: A first metal film is formed on a piezoelectric substrate surface. A pattern of openings forming a first resist mask is formed in the first metal film. Portions of the metal film are removed by etching. The substrate is brought into contact with a first etching solution to remove substrate material to shape an outer surface. After, openings in the first metal film are filled in with a second metal film. The substrate is shaped into a first plurality of piezoelectric resonators using a second etching solution. Rough frequency adjustment is conducted by etching side surfaces of the substrate in increments and cutting a piezoelectric resonator from the substrate. The rough frequency adjustment continues until a measured oscillation frequency is within a predetermined frequency range. Electrode patterns then are formed for each one of the second plurality of piezoelectric resonators.Type: GrantFiled: April 14, 2011Date of Patent: July 15, 2014Assignee: Nihon Dempa Kogyo Co., Ltd.Inventor: Takehiro Takahashi
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Patent number: 8776335Abstract: A method of fabricating a plurality of ultrasound transducer assemblies is provided. The method includes applying one or more layers of patternable material to at least a portion of a surface of a wafer comprising a number of die. The method further includes patterning the patternable material to define a plurality of openings, where each of the openings is aligned with a respective one of the die, disposing ultrasound acoustic arrays in respective ones of the openings, coupling the ultrasound acoustic arrays to the respective die to form the respective ultrasound transducer assemblies, and separating the ultrasound transducer assemblies to form individual ultrasound transducer assemblies.Type: GrantFiled: November 17, 2010Date of Patent: July 15, 2014Assignee: General Electric CompanyInventor: Charles Edward Baumgartner
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Patent number: 8769802Abstract: A method for manufacturing a resonator is presented in the present application. The method includes providing a handle substrate, providing a host substrate, providing a quartz substrate comprising a first surface opposite a second surface, applying interposer film to the first surface of the quartz substrate, bonding the quartz substrate to the handle substrate wherein the interposer film is disposed between the quartz substrate and the handle substrate, thinning the second surface of the quartz substrate, removing a portion of the bonded quartz substrate to expose a portion of the interposer film, bonding the quartz substrate to the host substrate, and removing the handle substrate and the interposer film, thereby releasing the quartz substrate.Type: GrantFiled: July 6, 2010Date of Patent: July 8, 2014Assignee: HRL Laboratories, LLCInventors: David T. Chang, Randall L. Kubena, Pamela R. Patterson
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Patent number: 8769803Abstract: Provided is a method of manufacturing a loudspeaker including assembling a magnetic circuit and a frame. In the step of assembling the magnetic circuit and the frame, parallelism between a plate and a damper attachment portion of the frame is ensured by bringing an upper portion of the plate and the damper attachment portion of the frame into contact with a jig. In addition, perpendicularity between a magnetic gap and the damper attachment portion of the frame is ensured by bringing an outer circumferential side portion of the plate of the magnetic gap and an inner circumferential side portion of the yoke into contact with the jig. The magnetic circuit and the frame are assembled in such a state. With such a manufacturing method, it is possible to achieve a superior loudspeaker capable of reducing a gap defect while being downsized and having increased maximum input power.Type: GrantFiled: March 30, 2011Date of Patent: July 8, 2014Assignee: Panasonic CorporationInventors: Toshiyuki Koike, Shinsaku Sawa, Tadashi Akiyama
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Publication number: 20140187959Abstract: The present disclosure provides various embodiments of an ultrasound transducer for use in intravascular ultrasound (IVUS) imaging. An exemplary ultrasound transducer includes substrate having a first surface and a second surface opposite the first surface. A well is disposed in the substrate that extends from the first surface to the second surface, where a well surface of the substrate defines a shape of the well. The well surface has a greater surface area than a cylindrically-shaped well surface. The ultrasound transducer further includes an arcuate-shaped transducer membrane is positioned within the well adjacent to the first surface of the substrate, and a backing material is disposed in the well that physically contacts the well surface and the transducer membrane. The backing material secures the arcuate-shape of the transducer membrane.Type: ApplicationFiled: December 23, 2013Publication date: July 3, 2014Applicant: Volcano CorporationInventor: Paul Douglas Corl
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Patent number: 8763234Abstract: A method for making a thermoacoustic module is disclosed. An insulating substrate and a sound wave generator are provided. A conductive paste is screen printed on the insulating substrate to form a first patterned conductive paste layer. The sound wave generator is placed on the first patterned conductive paste layer and at least partially suspended above the insulating substrate by the patterned conductive paste layer.Type: GrantFiled: March 26, 2010Date of Patent: July 1, 2014Assignee: Beijing FUNATE Innovation Technology Co., Ltd.Inventors: Liang Liu, Li Qian
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Patent number: 8765530Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.Type: GrantFiled: March 15, 2013Date of Patent: July 1, 2014Assignee: Knowles Electronics, LLCInventor: Anthony D. Minervini
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Patent number: 8763220Abstract: Provided is a manufacturing method for a micro device. The manufacturing method includes forming a micro-electronic-mechanical system (MEMS) movable structure, forming a plurality of metal loops over the MEMS movable structure, forming a piezoelectric element over the MEMS movable structure, and a magnet disposed over the plurality of metal loops. The method also includes encapsulating the MEMS movable structure, the plurality of metal loops, and the piezoelectric element.Type: GrantFiled: February 12, 2013Date of Patent: July 1, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tien-Kan Chung, Chung-Hsien Lin, Yao-Te Huang, Chia-Hua Chu, Chia-Ming Hung, Wen-Chuan Tai, Chang-Yi Yang
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Publication number: 20140174561Abstract: An ultrasonic flowmeter includes a measurement pipe through which a fluid flows, and two ultrasonic transceivers provided on outer side portions of the measurement pipe so as to be spaced apart from each other in an axis direction. In the method of producing the ultrasonic flowmeter, fabricating the measurement pipe in advance is fabricated, and then is set in a mold as an insert. Two transmitting bodies are formed by insert molding on the outer side portions of the measurement pipe so as to be spaced apart from each other in the axis direction, so that the two transmitting bodies are integral with the measurement pipe. The two ultrasonic transceivers are mounted on the two transmitting bodies, respectively.Type: ApplicationFiled: October 23, 2013Publication date: June 26, 2014Applicant: ASAHI ORGANIC CHEMICALS INDUSTRY CO., LTD.Inventors: Syunichirou HAGIHARA, Hidenori EBIHARA
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Publication number: 20140174282Abstract: In one embodiment, a cymbal system includes a cymbal and a transducer couplable to the cymbal. The transducer has a sound pressure microphone, and a casing hermetically sealing the sound pressure microphone to prevent communication of air pressure differentials into the sound pressure microphone. An air gap is provided between the sound pressure microphone and the casing. The cymbal may be a perforated low volume cymbal. In one embodiment, a method for making a cymbal transducer includes sealing a sound pressure microphone in an airtight enclosure that includes an air gap between the microphone and enclosure wall, and configuring the sealed sound pressure microphone for attachment to a cymbal.Type: ApplicationFiled: December 21, 2012Publication date: June 26, 2014Applicant: AVEDIS ZILDJIAN CO.Inventor: Julia D. Truchsess
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Publication number: 20140180128Abstract: An ultrasound transducer for use in intravascular ultrasound (IVUS) imaging systems including a single crystal composite (SCC) layer is provided. The transducer has a front electrode on a side of the SCC layer; and a back electrode on the opposite side of the SCC layer. The SCC layer may have a bowl shape including pillars made of a single crystal piezoelectric material embedded in a polymer matrix. Also provided is an ultrasound transducer as above, with the back electrode split into two electrodes electrically isolated from one another. A method of forming an ultrasound transducer as above is also provided. An IVUS imaging system is provided, including an ultrasound emitter and receiver rotationally disposed within an elongate member; an actuator; and a control system controlling emission of pulses and receiving ultrasound echo data associated with the pulses. The ultrasound emitter and receiver include an ultrasound transducer as above.Type: ApplicationFiled: December 20, 2013Publication date: June 26, 2014Applicant: Volcano CorporationInventor: Paul Douglas Corl
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Publication number: 20140173888Abstract: The present disclosure provides a micro-structure for coupling a first micro-component with a second micro-component. The micro-structure includes a center portion. The micro-structure also includes a first pair of arms connected to the center portion and extending away from the center portion in a first direction. The first pair of arms are separated by a first gap that is approximately equal to, or less than, a thickness of the first micro-component. The micro-structure also includes a second pair of arms connected to the center portion and extending away from the center portion in a second direction different from the first direction. The second pair of arms are separated by a second gap that is approximately equal to, or less than, a thickness of the second micro-component.Type: ApplicationFiled: December 11, 2013Publication date: June 26, 2014Applicant: Volcano CorporationInventor: Michael Reiter
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Patent number: 8756777Abstract: A method of manufacturing a ladder filter including first and second resonators includes: forming a piezoelectric film on an entire surface of a substrate that has respective lower electrodes of the first and second resonator formed thereon, an conductive film on the piezoelectric film, and a second film on the conductive film; forming a pattern of the second film in a prescribed region in the second area; forming a first film on an entire surface of the substrate; etching the first film, forming a pattern of the first film, the second film and the conductive film in the second area, and forming a pattern of the first film and the conductive film in the first area, to form respective upper electrodes from the conductor film; and thereafter, etching the piezoelectric film to form respective patterns of the piezoelectric film in the first and second areas, respectively.Type: GrantFiled: December 28, 2009Date of Patent: June 24, 2014Assignee: Taiyo Yuden Co., Ltd.Inventors: Shinji Taniguchi, Tokihiro Nishihara, Tsuyoshi Yokoyama, Masafumi Iwaki, Go Endo, Yasuyuki Saitou, Hisanori Ehara, Masanori Ueda
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Patent number: 8756778Abstract: A method of adjustment during manufacture of a capacitance of a capacitor supported by a substrate, the method including the steps of: a) forming a first electrode parallel to the surface of the substrate and covering it with a dielectric layer; b) forming, on a first portion of the dielectric layer, a second electrode; c) measuring the electrical signal between the first electrode and the second electrode, and deducing therefrom the capacitance to be added to obtain the desired capacitance; d) thinning down a second portion of the dielectric layer, which is not covered by the second electrode, so that the thickness of this second portion is adapted to the forming of the deduced capacitance; and e) forming a third electrode on the thinned-down portion and connecting it to the second electrode.Type: GrantFiled: June 13, 2011Date of Patent: June 24, 2014Assignee: STMicroelectronics SAInventors: Pierre Bar, Sylvain Joblot, David Petit
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Patent number: 8756796Abstract: A method for producing an electric component including a dielectric layer on a substrate, includes the method steps of applying a metallic layer to the substrate and oxidizing the metallic layer to form a dielectric layer, wherein at least one partial region of the metallic layer is fully oxidized through the entire thickness of the layer.Type: GrantFiled: August 23, 2010Date of Patent: June 24, 2014Assignee: Epcos AGInventors: Werner Ruile, Markus Hauser, Christoph Eggs, Hans-Peter Kirschner
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Publication number: 20140161290Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalisation of the air volumes above and below the membrane.Type: ApplicationFiled: February 10, 2014Publication date: June 12, 2014Applicant: Wolfson Microelectronics plcInventors: Colin Robert Jenkins, Tsjerk Hans Hoekstra, Euan James Boyd
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Publication number: 20140161289Abstract: A silicon condenser microphone is disclosed. The microphone includes a transducer, an IC chip, a first board, a second board spaced from the first board by a frame, and a third board located between the first board and the second board. A cavity is accordingly formed by the first board, the frame and the third board to accommodate the transducer and the IC chip. The IC chip is electrically connected to a surface of the third board facing the second board. The microphone provides an enlarged back volume to the transducer and provides the transducer with a shield against electro-magnetic interference. A manufacturing process is also disclosed.Type: ApplicationFiled: August 26, 2013Publication date: June 12, 2014Applicants: AAC ACOUSTIC TECHNOLOGIES (CHANGZHOU) CO., LTD., AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.Inventors: Xu-dong Pan, Jian-quan Li
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Publication number: 20140161298Abstract: Electroformed housings for electronic devices and methods for making the same are provided. An electronic device is provided having at least one electronic part and an electroformed housing constructed from a metal that encloses the at least one electronic part.Type: ApplicationFiled: December 7, 2012Publication date: June 12, 2014Applicant: APPLE INC.Inventor: Peter N. Russell-Clarke
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Patent number: 8745845Abstract: The present disclosure relates to devices and methods for implanting a prosthesis into a heart of a mammal, such as a person. The disclosure includes a prosthesis that acts as a pressure vent between the left and right atria of the heart. The disclosure also includes a mounting tool for mounting the prosthesis onto a loading tool, the loading tool useful for loading the prosthesis onto a device for delivering the prosthesis into the patient's heart. Control devices and methods for using these devices are also disclosed. The intracardiac pressure vents disclosed allow sufficient flow from the left atrium to the right atrium to relieve elevated left atrial pressure and resulting patient symptoms. The devices also limit the amount of flow from the right atrium to the left atrium to minimize the potential for thrombi or other embolic material from entering arterial circulation.Type: GrantFiled: November 24, 2010Date of Patent: June 10, 2014Assignee: DC Devices, Inc.Inventors: Matthew J. Finch, Stephen J. Forcucci, Edward McNamara, Hiroatsu Sugimoto
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Publication number: 20140155747Abstract: An ultrasound transducer and methods of fabricating and using the ultrasound transducer. The ultrasound transducer includes a composite layer having a first surface and comprising a plurality of piezoelectric elements separated by isolating material filled kerfs. The composite layer is configured so that the first surface includes an exposed face of each element of the plurality of piezoelectric elements. The transducer further includes a plurality of electrodes defined on the first surface, the electrodes having boundaries configured so that none of the exposed faces are in contact with more than one of the plurality of electrodes. The electrodes may be defined in a conductive layer deposited on the first surface of the composite body by forming a channel in the conductive layer that is aligned vertically with the dielectric kerfs. The transducer may be used to scan a treatment region with both HIFU and imaging ultrasound signals.Type: ApplicationFiled: December 3, 2012Publication date: June 5, 2014Applicant: LIPOSONIX, INC.Inventors: Frederick Jay Bennett, John P. Collins, Blake W. Little
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Publication number: 20140146989Abstract: Occlusion devices, earpiece devices and methods of forming occlusion devices are provided. An occlusion device is configured to occlude an ear canal. The occlusion device includes an insertion element and at least one expandable element disposed on the insertion element. The expandable element is configured to receive a medium via the insertion element and is configured to expand, responsive to the medium, to contact the ear canal. Physical parameters of the occlusion device are selected to produce a predetermined sound attenuation characteristic over a frequency band, such that sound is attenuated more in a first frequency range of the frequency band than in a second frequency range of the frequency band.Type: ApplicationFiled: June 24, 2011Publication date: May 29, 2014Applicant: Personics Holdings Inc.Inventor: Steven W. Goldstein
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Patent number: 8732938Abstract: An improved method of packaging a sensor is provided. The method includes the step of affixing a tuning fork to a platform. The tuning fork includes tines comprising one or more surfaces, with each tine further comprising an electrode and a piezoelectric material. An application specific integrated circuit (ASIC) is affixed to the platform. Electrical communication between the ASIC and the electrode of each tine is established for providing stimulus to the tuning fork and for receiving a response signal from the tuning fork. A protective layer is applied to cover the platform and a portion of the tuning fork while maintaining a portion of a surface of each tine free from the protective layer such that the surface can displace the fluid in contact therewith.Type: GrantFiled: May 19, 2010Date of Patent: May 27, 2014Assignees: MEAS France, Hella KGaA Hueck & Co.Inventors: Oleg Kolosov, Leonid Matsiev, John F. Varni, G. Cameron Dales, Olaf Ludtke, Dirk Wullner, Andreas Buhrdorf, Heiko Dobrinski
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Publication number: 20140137397Abstract: A method for making thermoacoustic device includes following steps. A silicon substrate having a first surface and second surface opposite to the first surface is provided. The first surface is patterned by forming a plurality of grooves substantially oriented along a first direction, wherein the plurality of grooves is spaced from each other, and a bulge is formed between each two adjacent grooves. An insulating layer is coated on the patterned surface. A first electrode and a second electrode are formed on the insulating layer, wherein the first electrode and the second electrode are spaced from each other. A carbon nanotube structure is applied on the insulating layer, wherein the carbon nanotube structure is electrically connected to the first electrode and the second electrode, the carbon nanotube structure is suspended above the plurality of grooves.Type: ApplicationFiled: June 24, 2013Publication date: May 22, 2014Inventors: YANG WEI, XIAO-YANG LIN, KAI-LI JIANG, SHOU-SHAN FAN
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Publication number: 20140140566Abstract: Open-air earbuds and methods for making the same are disclosed. The earbud has a neck, which is open to the ambient environment in order to improve bass response. In order to prevent debris from entering the interior of the earbud, a filter is incorporated into the neck.Type: ApplicationFiled: January 24, 2014Publication date: May 22, 2014Applicant: Apple Inc.Inventor: Jeffrey Y. Hayashida
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Publication number: 20140142414Abstract: An imaging guidewire can include one or more optical fibers communicating light along the guidewire. At or near its distal end, one or more blazed or other Fiber Bragg Gratings (FBGs) can direct light to a photoacoustic transducer material that provides ultrasonic imaging energy. Returned ultrasound can be sensed by an FBG sensor. A responsive signal can be optically communicated to the proximal end of the guidewire, and processed such as to develop a 2D or 3D image. In an example, the guidewire outer diameter can be small enough such that an intravascular catheter can be passed over the guidewire. To minimize the size of the guidewire, an ultrasound-to-acoustic transducer that is relatively insensitive to the polarization of the optical sensing signal can be used. The ultrasound-to-optical transducer can be manufactured so that it is relatively insensitive to the polarization of the optical sensing signal.Type: ApplicationFiled: October 14, 2013Publication date: May 22, 2014Inventors: Michael J. Eberle, Diana Margaret Tasker, Howard Neil Rourke
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Publication number: 20140137398Abstract: A method for making a thermoacoustic device array includes the following step. A substrate having a surface is provided. The surface defines a grid having a number of cells. A number of recesses are defined on each of the cells. The recesses are parallel with and spaced from each other. A first electrode and a second electrode are formed on each of the cells. The first electrode is spaced from the second electrode, and one of the recesses is located between the first electrode and the second electrode. A sound wave generator is applied on the substrate and electrically connected to the first electrode and the second electrode. The sound wave generator is suspended over the recesses. The sound wave generator is separated according to the cells.Type: ApplicationFiled: June 28, 2013Publication date: May 22, 2014Inventors: YANG WEI, XIAO-YANG LIN, KAI-LI JIANG, SHOU-SHAN FAN
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Patent number: 8726489Abstract: An adjustment method of a magnetic resonance imaging apparatus includes: a cooling and excitation step in which work of transporting a superconducting magnet to a facility different from a facility where the superconducting magnet is to be installed, cooling a superconducting coil of the superconducting magnet with a refrigerant, and supplying a current from an external power supply for excitation is repeated until a predetermined rated current flows; a demagnetization and transportation step of demagnetizing the superconducting coil and transporting the superconducting magnet to the facility where the superconducting magnet is to be installed in a state where the superconducting coil is cooled by the refrigerant; and an installation step of installing the superconducting magnet in the facility where the superconducting magnet is to be installed and supplying a predetermined rated current from an external power supply to the superconducting coil in order to excite the superconducting coil.Type: GrantFiled: June 7, 2010Date of Patent: May 20, 2014Assignee: Hitachi Medical CorporationInventor: Munetaka Tsuda
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Publication number: 20140133679Abstract: There is provided a process for assembly of a capacitor microphone. The capacitor microphone has a frame and a counterpart electrode. The counterpart electrode is positioned in the frame and held. Adhesive is applied so that the counterpart electrode is glued directly to the frame.Type: ApplicationFiled: October 31, 2013Publication date: May 15, 2014Applicant: Sennheiser electronic GmbH & Co., KGInventors: Vladimir Gorelik, Joerg Riechers, Eckhard Welker
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Publication number: 20140135628Abstract: An ultrasonic probe configured to be connected to an apparatus main body of an ultrasonic diagnostic apparatus that is configured to perform an ultrasonic procedure on a subject is provided. The ultrasonic probe includes a transducer configured to transmit an ultrasonic wave to the subject and receive an ultrasonic echo reflected from the subject, an inductor connected in parallel with the transducer, and a current limiter connected to the inductor and configured to limit a current flowing through the inductor to a predetermined current level or lower.Type: ApplicationFiled: November 12, 2013Publication date: May 15, 2014Applicant: GE MEDICAL SYSTEMS GLOBAL TECHNOLOGY COMPANY, LLCInventors: Shinichi Amemiya, Masaki Tsuda
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Patent number: 8720024Abstract: A method for processing a ring type piezoelectric device comprises: providing a ring type piezoelectric embryo; printing at least a pair of electrodes to divide the ring type piezoelectric embryo into a plurality of equal sections; and immersing the divided ring type piezoelectric embryo into high temperature silicon oil with high voltage for polarization so as to make the polarization of the ring type piezoelectric device perpendicular to a cross-section thereof.Type: GrantFiled: April 1, 2011Date of Patent: May 13, 2014Assignee: Chung-Yuan Christian UniversityInventors: Yung Ting, Sheuan-Perng Lin
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Patent number: 8723623Abstract: An acoustic wave device includes a substrate and a plurality of piezoelectric thin film resonators formed over the substrate. Each of the plurality of the piezoelectric thin film resonators includes lower electrode provided on the substrate, a piezoelectric film provided on the lower electrode, and an upper electrode provided on the piezoelectric film and opposed to the lower electrode through the piezoelectric film. Each of the piezoelectric thin film resonators is partly supported by the substrate and extends above the substrate to form a cavity between the substrate and each lower electrodes. The cavity continuously extending under the plurality of the piezoelectric thin film resonators.Type: GrantFiled: July 15, 2009Date of Patent: May 13, 2014Assignee: Taiyo Yuden Co., Ltd.Inventors: Motoaki Hara, Tokihiro Nishihara, Shinji Taniguchi, Takeshi Sakashita, Tsuyoshi Yokoyama, Masafumi Iwaki, Masanori Ueda