By Oxidation Patents (Class 29/617)
  • Patent number: 8304701
    Abstract: A resistive heating element 30 has a higher molybdenum carbide content in a central portion 35 than in a peripheral portion 34. Since molybdenum carbides have a low temperature coefficient of resistance compared to molybdenum, the amount of heat generated in the central portion 35 of the resistive heating element 30 does not increase as much as in the peripheral portion 34 even when the temperature is increased, and the increase in difference in temperature between the peripheral portion 34 and the central portion 35 can be suppressed. In other words, generation of hot spots near the center can be suppressed and a good uniform heating property in a wide range of operation temperatures can be obtained.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: November 6, 2012
    Assignee: NGK Insulators, Ltd.
    Inventors: Yuji Akatsuka, Yoshinobu Goto
  • Patent number: 8117739
    Abstract: An electrical module assembly used in a surge arrester is manufactured by wrapping an electrical module assembly including at least one metal oxide varistor (MOV) disk to which a reinforcing structure including a pre-impregnated epoxy/glass-fiber composite has been applied with shrink film and compacting the wrapped electrical module assembly by heating the shrink film such that the shrink film shrinks and applies a radially compressive force to the electrical module assembly. The wrapped electrical module assembly then is cured at a temperature at which the shrink film no longer applies a compressive force.
    Type: Grant
    Filed: January 23, 2004
    Date of Patent: February 21, 2012
    Assignee: Cooper Technologies Company
    Inventors: Michael M. Ramarge, Alan P. Yerges, David P. Bailey, Roger S. Perkins
  • Patent number: 7275308
    Abstract: A method for manufacturing the same, wherein the monolithic ink-jet printhead includes a manifold for supplying ink, an ink chamber having a hemispheric shape, and an ink channel formed monolithically on a substrate; a silicon oxide layer, in which a nozzle for ejecting ink is centrally formed in the ink chamber, is deposited on the substrate; a heater having a ring shape is formed on the silicon oxide layer to surround the nozzle; a MOS integrated circuit is mounted on the substrate to drive the heater and includes a MOSFET and electrodes connected to the heater. The silicon oxide layer, the heater, and the MOS integrated circuit are formed monolithically on the substrate. Additionally, a DLC coating layer having a high hydrophobic property and high durability is formed on an external surface of the printhead.
    Type: Grant
    Filed: December 22, 2003
    Date of Patent: October 2, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyeon-cheol Kim, Yong-soo Oh, Keon Kuk, Kwang-joon Yoon, Jae-sik Min, Sang-hyun Lee, Chang-seung Lee, Seog Soon Baek, Sang-wook Lee, Jong-cheol Shin
  • Patent number: 6868605
    Abstract: A bubble-jet type ink-jet printhead and manufacturing method thereof including a substrate integrally having an ink supply manifold, an ink chamber, and an ink channel; a nozzle plate having a nozzle on the substrate; a heater centered around the nozzle and an electrode for applying current to the heater on the nozzle plate; and an adiabatic layer on the heater for preventing heat generated by the heater from being conducted upward from the heater. Alternatively, a bubble-jet type ink-jet printhead may be formed on a silicon-on-insulator (SOI) wafer having a first substrate, an oxide layer, and a second substrate stacked thereon and include an adiabatic barrier on the second substrate. In the bubble-jet type ink-jet printhead and manufacturing method thereof, the adiabatic layer or the adiabatic barrier is provided to transmit most of the heat generated by the heater to ink under the heater, thereby increasing energy efficiency.
    Type: Grant
    Filed: January 31, 2003
    Date of Patent: March 22, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Doo-jin Maeng, Keon Kuk, Yong-soo Oh, Hyeon-cheol Kim, Sang-wook Lee
  • Patent number: 4940960
    Abstract: In case of manufacturing a voltage non-linear resistor, a sintering process is divided into two completely separate steps, i.e. primary and secondary sinterings. The primary sintering is carried out under a reduced pressure and the second sintering is conducted under an atmospheric pressure with a sufficient amount of oxygen. The primary sintering is effects such that the relative density and open porosity of the primarily sintered body are 85% or more and 1% or less, respectively. The secondary sintering removes to a large extent, voids existing in the body and, oxidation of the body is sufficiently effected. Therefore, the finally sintered body has a high density, a large surge withstanding capability, and a high non-linearity index.
    Type: Grant
    Filed: December 16, 1988
    Date of Patent: July 10, 1990
    Assignee: NGK Insulators, Ltd.
    Inventors: Hiroshi Nemoto, Koichi Umemoto, Shinji Kawasaki
  • Patent number: 3967229
    Abstract: A heavy duty PTC resistor with a pressed and sintered hollow cylindrical body of a ceramic composition which has two end faces in a radial plane with a connection contact on each end face.A heavy duty PTC resistor sintered body of a ceramic composition which has two end-faces carrying a connection contact; the invention also concerns a method of manufacturing such PTC-resistor.High duty PTC-resistors are required for some purposes. If for example a PTC-resistor is used as a starting device for a single-phase motor, it has to be designed to deal with almost the entire mains voltage and to carry power of 500 W or more. The usual cylindrical bodies, provided at their two end-faces with connection contacts, frequently exhibit cracks under loads of this kind.A high-duty PTC-resistor is thus known (German Patent Specification OS 1 465 349) which is made up of a stack of solid or hollow flat cylindrical discs, the end-faces of the superposed discs being interconncted by a contact layer.
    Type: Grant
    Filed: November 6, 1974
    Date of Patent: June 29, 1976
    Assignee: Danfoss A/S
    Inventor: Holger Wilhelm Vind