Abstract: An electronic component manufacturing apparatus has a holding member for holding an electronic component body, a surface plate, a moving unit that causes the holding member and the surface plate to relatively move, and a control unit that controls the moving unit. The control unit causes the moving unit to simultaneously perform a distance changing movement for changing, by shortening or extending, the distance between an end face of each electronic component body and a surface of the surface plate, and a position changing movement for changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction in which the two-dimensional position moves in parallel with the surface of the surface plate successively varies (for example, along a circular path).

Abstract: A method for producing a receptacle for a sensor element, such as a combustion chamber pressure sensor, includes introducing a first amount of a pre-ceramic substance into an injection mold, forming a base layer of the receptacle by molding the pre-ceramic substance in the mold, and applying at least one conductor track to the base layer. A further amount of a pre-ceramic substance is introduced into the mold onto at least a partial region of the conductor track. A top region of the receptacle is formed directly on the base layer while at least partially covering over the conductor track by molding the further pre-ceramic substance in the injection mold. The method also includes debinding and sintering the molded body. The method forms a receptacle for a sensor element that has conductor tracks lying on the inside and incorporated in a gas-tight manner in a ceramic body.

Abstract: A circuit includes a conductive clip coupled to at least one component in the circuit. At least one lead portion is located on an end of the clip. The circuit further includes a first lead frame having at least one opening sized to receive the at least one lead portion. The at least one lead portion is received in the at least one opening and the at least one lead portion is an external conductor of the circuit.

Abstract: Apparatus are provided for infusion devices and related control systems and methods. In one embodiment, an infusion device includes a voided portion adapted to receive a shaft portion that includes a shaft coupled to a plunger of a reservoir. The shaft portion includes a detectable feature, and the infusion device includes a sensing arrangement proximate the voided portion to sense the detectable feature. In some embodiments, a control module is coupled to the sensing arrangement to determine a remaining amount of fluid in the reservoir based at least in part on the sensed position of the detectable feature. In other embodiments, the control module identifies an anomalous condition based at least in part on the sensed position of the detectable feature.

Abstract: A holding sealing material includes a mat and at least one pair of electrodes. The mat contains inorganic fibers and has a rectangular shape in a plan view. The at least one pair of electrodes are arranged on a main surface of the mat. An exhaust gas purifying apparatus includes an exhaust gas treating body, the holding sealing material, and a casing. The exhaust gas treating body has a pillar-shape and electric conductivity. The holding sealing material is wound around the exhaust gas treating body, with the main surface of the mat in contact with the exhaust gas treating body. The casing houses the exhaust gas treating body.

Abstract: The present invention provides a heating element, including a transparent substrate, an adhesive agent layer provided on at least one side of the transparent substrate, a conductive heat emitting line provided on the adhesive agent layer, a coating film capsulating the conductive heat emitting line and an upper side of the adhesive agent layer not covered by the heat emitting line, a bus bar electrically connected to the conductive heat emitting line, and a power part connected to the bus bar, and a manufacturing method thereof.

Abstract: A method of securing a terminal to a ceramic heater is provided by the present disclosure. The ceramic heater includes a ceramic substrate and a resistive heating element, and the method includes exposing a portion of the resistive heating element, forming an intermediate layer on at least one of the portion of the resistive heating element and the ceramic substrate proximate the portion of the resistive heating element, the intermediate layer being selected from a group consisting of Mo/AlN and W/AlN, and bonding the terminal to the intermediate layer.

Abstract: The present invention is to provide an electronic component where positional accuracy for arranging members constituting a circuit element such as a resistor element and the like is mitigated and corrosion of a terminal electrode caused by sulfur in the atmosphere is reduced.

Abstract: A monolithic, multi-layer heating element forms the high temperature tip of a glow plug assembly. The heating element includes a conductive core which is surrounded by an insulator layer, which in turn supports a resistive layer. An optional conductive jacket can surround the resistive layer. These layered components are pre-formed in prior operations and then assembled one into the other to form a precursor structure. The precursor structure is transferred to a die, where it is compressed to form a so-called green part having dimensional attributes proportional to the finished heating element. The individual layers remain substantially intact, with some boundary layer mixing possible to enhance material-to-material bonding. The green part is sintered to bond to various materials together into an essentially solid mass. Various finishing operations may be required, following which the heating element is assembled to form a glow plug.

Abstract: A method for fabricating a negative temperature coefficient thermistor is provided, including the steps of: (A) combining ceramic powders having a negative temperature coefficient of resistance, a polymer binder and a solvent to form a mixture; (B) removing the solvent and granulating the mixture to form granulous powders; (C) compressing the granulous powders to obtain a thermistor material with a specific shape; (D) curing the thermistor material at 80° C. to 350° C.; and (E) mounting an electrode to the thermistor material to form the negative temperature coefficient thermistor. The method can be performed in a low temperature without the problem of interface diffusion. Further, the desired resistance value and thermistor constant (B) can be easily adjusted and obtained by mixing ceramic powders with different characteristics of temperature coefficient of resistance and/or the addition of conductive metal powder.

Abstract: A method of making a titanium heating element for electric water heaters includes heating commercially pure titanium tubing to a specified temperature for a predetermined period of time. A resistance wire and magnesium dioxide powder may be positioned in the tubing prior to the annealing process. The outer surfaces of the titanium tube are exposed to the air during at least a portion of the annealing process, such that a layer of titanium dioxide develops on the outer surface of the titanium. The heating element is then formed into a loop or other suitable shape, and it is positioned inside a housing. The housing may include fittings to connect the water heater to the tubing of a pool, jetted tub, spa, hot tub or the like.

Abstract: A process for making a fluid ejector head for a micro-fluid ejection device. In one embodiment, the process comprises depositing a thin film resistive layer on a substrate to provide a plurality of thin film heaters. The thin film resistive layer comprises a tantalum-aluminum-nitride material consisting essentially of AlN, TaN, and TaAl alloys, and containing from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.

Abstract: A method of manufacturing an activated carbon fiber soft electric heating product for overcoming existing problems including uneven temperature rise and heat dissipation at surfaces of the product, unbendable feature, short life and poor safety. An activated carbon fiber cloth and a woven fiber cloth of the activated carbon fiber soft electric heating product are fixed by an epoxy resin layer, and a conducting copper net is disposed between the activated carbon fiber cloth and the epoxy resin layer and coupled to a power input wire. The manufacturing method includes the steps of: (1) spraying an epoxy resin on a surface of the woven fiber cloth, and bake-drying and hot pressing the woven fiber cloth; and (2) connecting the conducting copper net and the power input wire, laying the activated carbon fiber cloth, and performing a second-time hot pressing.

Abstract: A metal strip resistor is provided. The metal strip resistor includes a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the conductive pattern, and adjusting resistance of the metal strip.

Abstract: A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.

Abstract: A multi-layer type over-current and over-temperature protection structure and a method of manufacturing the same are disclosed. The present invention utilizes the concept of multi-layer design to integrate more than two over-current and over-temperature protection elements on a component structure that can be adhered to a substrate. Hence, the over-current and over-temperature protection structure has more than two over-current and over-temperature protection functions at the same time. Therefore, the advantages of the present invention is that the over-current and over-temperature protection structure effectively integrates two or more over-current and over-temperature protection elements together in order to increase the usage range of the over-current and over-temperature protection structure. Moreover, the present invention effectively reduces size of the over-current and over-temperature protection elements on a PCB and reduces the number of solder joints.

Abstract: A monolithic, multi-layer heating element forms the high temperature tip of a glow plug assembly. The heating element includes a conductive core which is surrounded by an insulator layer, which in turn supports a resistive layer. An optional conductive jacket can surround the resistive layer. These layered components are pre-formed in prior operations and then assembled one into the other to form a precursor structure. The precursor structure is transferred to a die, where it is compressed to form a so-called green part having dimensional attributes proportional to the finished heating element. The individual layers remain substantially intact, with some boundary layer mixing possible to enhance material-to-material bonding. The green part is sintered to bond to various materials together into an essentially solid mass. Various finishing operations may be required, following which the heating element is assembled to form a glow plug.

Abstract: A heating element with a ceramic body that has PTC properties is specified. The heating element has electrodes that are arranged on ceramic body. Both the ceramic body and the electrodes are lead-free.

Abstract: A composite chip varistor device includes a body; at least one inner varistor, disposed in the body; and a plurality of end electrodes, disposed at two sides of the inner varistor. The body is a highly insulative and imporous mono-material. The body of the present invention provides protection for the inner varistor to avoid being damaged by external factors and the manufacturing cost of the varistor device is effectively reduced.

Abstract: A coated wire is solderable with soft solder while maintaining separate phases of the core and the coating. A 100 ?m to 400 ?m thick nickel wire may be coated galvanically with silver. For a film resistor with coated wires as connection wires, including a platinum measurement resistor on an electrically insulating substrate and connection wires connected to the measurement resistor, the connection wires have a coated nickel core. The coating may be made of silver or glass or ceramic or a mixture of these materials, or on its outside may be made of glass or ceramic or a mixture of these materials. For producing film resistors a thin metal or glass component is deposited on a connection wire connected to a track conductor arranged on an electrically insulating substrate, and a thick glass paste is deposited and fired on this metal or glass component. For mass production of film, several film resistors encased together in glass may be partitioned by fracturing.

Abstract: A resistor includes first and second opposite terminations, a resistive element formed from a plurality of resistive element segments between the first and second opposite terminations, at least one segmenting conductive strip separating two of the resistive element segments, and at least one open area between the first and second opposite terminations and separating at least two resistive element segments. Separation of the plurality of resistive element segments assists in spreading heat throughout the resistor. The resistor or other electronic component may be packaged by bonding to a heat sink tab with a thermally conductive and electrically insulative material. The resistive element may be a metal strip, a foil, or film material.

Abstract: A metal oxide varistor with heat protection has a body, an insulated washer, a first lead, a second lead and a thermal fuse. The body has two sides and two contacts respectively on the sides. The insulated washer is attached to one contact and has a through hole. The first lead is mounted on the other contact. The second lead is mounted on the insulated washer. The thermal fuse is mounted on the insulated washer and electrically connects to the second lead and the second contact. When the body overloads and overheats, the thermal fuse causes the circuit to open quickly, and the insulated washer keeps the thermal fuse from electrically connecting to the second contact again.

Abstract: An method for manufacturing an electrical component comprises providing a base body of a ceramic material with at least two contact regions with terminal elements secured thereto. The base body is immersed into a solution that contains a fluid that wets the base body and a hydrophobic and lipophobic intermediate layer material dissolved in the fluid. The base body is removed from the solution so that a part of the solution remains adhering thereto as a film that completely envelopes the base body. An intermediate layer is produced by evaporating the fluid contained in the film, and a protective layer is applied onto the intermediate layer.

Abstract: The present invention is to provide a method of trimming during short time without any difficulty of controlling a device for trimming and a trimming device having a simple structure. The method of manufacturing a resister device comprises: trimming a resister element 5 including a resister film 4 in order to adjust a resister value of the resister element 5, the resister film 4 contacting a pair of electrodes 3 for a resister formed on a substrate 2. A region of the substrate located in a position of a side portion 6 and along with the resister film 4 is heated in the trimming, the position being on a surface where the electrodes 3 for a resister and the resister film 4 are formed. The heating is performed by laser beam irradiation. The side portion 6 is irradiated by a laser beam to form a concave portion 7.

Abstract: A manufacturing method for a substrate heating device comprises forming a base plate having a substrate heating surface in which a resistance heating element is buried, forming a tubular member, joining the tubular member to the base plate, measuring temperature distribution in the substrate heating surface by supplying power to the resistance heating element, and grinding the tubular member according to a grinding condition based on a measurement result of the temperature distribution.

Abstract: A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices. The assembly is made by providing first and second laminates, each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface of the stack, and making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.

Abstract: A method of manufacturing an inexpensive fine resistor which do not require dimensional classifications of discrete substrates is disclosed. The method eliminates a process of replacing a mask according to a dimensional ranking of each discrete substrate. The method includes: dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; forming a top electrode layer on a top face of the discrete substrate; forming a resistor layer such that a part of the resistor layer overlaps the top electrode layer; forming protective layers so as to cover the resistor layer; and forming side electrode layer on a side face of the discrete substrate such that the side electrode layer is electrically coupled to the top electrode layer.

Abstract: In manufacturing a chip resistor by dividing a chip resistance substrate which includes an insulator, resistance film formed on a surface of the insulator, and a plurality of conductive strips disposed on the resistance film at fixed intervals, grooves are formed by removing a predetermined width of the resistance film including at least second prescribed severing lines. After forming the grooves, the chip resistance substrate is severed in longitudinal and lateral directions along first prescribed severing lines for dividing the conductive strips into two parts and the second prescribed severing lines perpendicular to the first prescribed severing lines so as to produce discrete chip resistors.

Abstract: Methods for injecting charge include providing a target comprising a first layer on a second layer, coupling a conductive base to the second layer, and providing a medium which is in contact with at least a portion of the first layer. An electrode is positioned to face and is spaced from the first layer and is at least partially in contact with the medium. An electric field is provided across the first and second layers to inject charge to an interface between the first layer and the second layer.

Abstract: Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, thereby a laser trimming process is omitted or minimally utilized. The method has advantages in that a production time of the PCB is shortened and productivity is improved because an operation condition is rapidly set without being greatly affected by the position precision of a printing device. Other advantages of the method are that the resistor paste with a relatively uniform thickness is secured through a screen printing process, thereby easily forming the resistor and improving resistance tolerance.

Abstract: A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween. According to the method the resistive strip is attached to a single co extensive strip of conductive material and a central portion of the conductive material is removed to create the exposed central portion of the resistive strip.

Abstract: A method for manufacturing the same, wherein the monolithic ink-jet printhead includes a manifold for supplying ink, an ink chamber having a hemispheric shape, and an ink channel formed monolithically on a substrate; a silicon oxide layer, in which a nozzle for ejecting ink is centrally formed in the ink chamber, is deposited on the substrate; a heater having a ring shape is formed on the silicon oxide layer to surround the nozzle; a MOS integrated circuit is mounted on the substrate to drive the heater and includes a MOSFET and electrodes connected to the heater. The silicon oxide layer, the heater, and the MOS integrated circuit are formed monolithically on the substrate. Additionally, a DLC coating layer having a high hydrophobic property and high durability is formed on an external surface of the printhead.

Abstract: A method of manufacturing an electrical-resistance heating element includes forming sintered ceramics or calcined ceramics, forming an electrode on the sintered ceramics or the calcined ceramics, and forming a ceramic base material having mainly a high melting point metal on the electrode embedded therein, thereby forming a heating element with built-in electrode.

Abstract: The present invention relates to a method of manufacturing surge arrestors, the method including stacking varistors; and forming a coating of composite material on the stack. Between these steps, also included is placing a bead of flexible, adhesive, and dielectric material on the previously formed stack in register with the various interfaces between each pair of adjacent varistors.

Abstract: An inner terminal installation jig used to install an inner electrode terminal mount formed on an inner peripheral surface of a hollow cylindrical sensor element of a gas sensor.

Abstract: A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit board. Compared with conventional discrete resistors, embedded thin film resistors contribute to a smaller printed circuit board as the space for installing conventional resistors is saved, and better signal transmission speed and quality as the capacitive reactance effect caused by two connectors of the conventional resistors is avoided. The method for fabricating the embedded thin film resistors provided by the invention can be conducted using the process and equipment for conventional printed circuit boards and thereby saving the investment on new types of equipment. The method can be applied in the mass production of printed circuit boards and thereby reduce the manufacturing cost significantly.

Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.

Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.

Abstract: An electrical resistor is made by providing a sacrificial layer and conductive pads disposed on a first surface of the sacrificial layer. An electrically resistive material is deposited over the pads and on the first surface of the sacrificial layer to form at least one unit including the resistive material and the pads. At least part of the sacrificial layer is then removed so as to expose one or more of the pads.

Abstract: The present invention provides for a method for manufacturing flip chip resistors by applying a first electrode layer to a substrate to create at least one pair of opposite electrodes, applying a resistance layer between each pair of opposite electrodes, applying a first protective layer at least partially overlaying the resistance layer, applying a second protective layer at least partially overlaying at least a portion of the resistance layer, and applying a second electrode layer overlaying the first electrode layer, a portion of the resistance layer, and at least a portion of the second protective layer. The present invention provides for higher reliability performance and enlarging the potential soldering area despite small chip size.

Abstract: A method of fabricating a current control device is presented. The method impregnates a pressure conduction composite within a current control device with a fluid additive via suffusion. The suffusion process is performed by placing the pressure conduction composite within a bath of a liquid additive. The method generally includes the steps of mixing a compressible non-conductive matrix and conductive filler, forming a pressure conduction composite composed of the non-conductive matrix having the conductive filler electrically isolated therein, suffusing the composite within a bath so as to impregnate the composite with an additive, and attaching a pair of conductive plates to the composite. Alternate methods include attaching non-conductive plates to the composite, forming pores within the pressure conduction composite, and inserting a temperature responsive material into a porous composite.

Abstract: The present invention discloses a method for preparing a conductive polymeric composite material having carbon black utilized to a structure for composite materials of a positive temperature coefficient thermistor. The method first provides a metal laminated material comprising a top metal layer and a bottom metal layer, an insulating layer between the top and the bottom metal layer, and a conducting through hole disposed between the top metal layer and the bottom metal layer. A composite electroplating process is then performed to form an composite electroplating layer on the surface of the top metal layer, wherein the composite electroplating layer is a continuous porous structure with a secondary aggregation of carbon black and electroplated metal.

Abstract: A green ceramic heater including a green heating resistor formed of an electrically conductive ceramic (e.g., silicide or carbide of a metal element such as W, Ta, or Nb) and an insulative ceramic (e.g., silicon nitride) and power supply leads (e.g., made of W), a first end of each power supply lead being connected to a corresponding end of the green heating resistor, the green heating resistor and the power supply leads buried in a green substrate formed of a material (e.g., silicon nitride) is fired, and subsequently, the resultant ceramic heater is heat-treated at 900 to 1,600° C., to thereby enhance flexural strength of the ceramic heater. The heat treatment is preferably carried out prior to forming a glass layer on an outer circumferential surface of the ceramic heater.

Abstract: A pin having a voltage probe pin-head is provided. The pin includes a pin-head having a substantially flat surface at one end and a pin-head tip at an opposing end, the substantially flat surface is configured to attach to a resistor, and the pin-head tip contacts an electrical test point. The pin also has a neck-like portion that extends between a shaft and the pin-head, wherein the neck-like portion is shorter than the shaft and has a diameter that is smaller than a diameter of a cross-section of the shaft.

Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.

Abstract: A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween. According to the method the resistive strip is attached to a single co extensive strip of conductive material and a central portion of the conductive material is removed to create the exposed central portion of the resistive strip.

Abstract: The invention is a system for controlling the position of a movable member moved by a prime mover by monitoring the position of the movable member; generating position information based upon this monitoring; and controlling the prime mover based upon the position information by providing a counter force to the movable member substantially equal to an opposing force opposing the movement of the movable member. The invention may include a movable member, such as a ram used for fastening a terminal to a wire; a spring; a DC planetary gear motor for providing a force to the movable member opposing the spring; a position detector, such as an linear voltage displacement transducer, to detect the position of the movable member and generate position information; and a controller, which may include a logic board or microprocessor and memory, for controlling the force from the motor in response to the position information.

Abstract: A fast heat rise resistor comprising a substrate, a foil bridge on the surface of the substrate, the foil bridge having an elevated portion and a contact portion, the elevated portion above the substrate, the contact portion in contact with the substrate, a conductive layer attached to the contact portion of said foil bridge. The activation energy and/or response time is reduced as the foil bridge is suspended over the substrate. Another aspect of the invention include a method of manufacturing the foil bridge and application to autoignition vehicle airbags.

Abstract: A bubble-jet type ink-jet printhead and manufacturing method thereof including a substrate integrally having an ink supply manifold, an ink chamber, and an ink channel; a nozzle plate having a nozzle on the substrate; a heater centered around the nozzle and an electrode for applying current to the heater on the nozzle plate; and an adiabatic layer on the heater for preventing heat generated by the heater from being conducted upward from the heater. Alternatively, a bubble-jet type ink-jet printhead may be formed on a silicon-on-insulator (SOI) wafer having a first substrate, an oxide layer, and a second substrate stacked thereon and include an adiabatic barrier on the second substrate. In the bubble-jet type ink-jet printhead and manufacturing method thereof, the adiabatic layer or the adiabatic barrier is provided to transmit most of the heat generated by the heater to ink under the heater, thereby increasing energy efficiency.

Abstract: The invention provides for a method of manufacturing a stacked power chip resistor. The method includes adhering a first chip resistor to a second chip resistor with a glass encapsulant, connecting a first terminal of the first chip resistor to a first terminal of the second chip resistor with the first metal barrier, and connecting a second terminal on the first chip resistor to a second terminal of the second chip resistor with a second metal barrier.