Abstract: During operation of a vending machine, a dispensed product moves from a product dispensing location to a product retrieval location. To detect movement of the dispensed product to the dispensing location, the intensity of light at an array of pixels is monitored. The monitored array of pixels forms a portion of a larger group of pixels. A change in the intensity of light at pixels in the array of pixels is detected upon movement of a dispensed product to a product retrieval location.

Abstract: When performing the device type changing operation with the change of the board type to undergo mounting, the component mounting device, which has a first mounting lane and a second mounting lane and which is structured so as to be able to select either an independent mounting mode or an alternate mounting mode, moves a mounting head of the mounting lane to and thereafter positions and fixes to a previously-set predetermined withdraw position [P] where entry of a portion of a body of an operator by way of an opening (19) formed in a protective cover (18a) can be prevented and where safety of the operator is not impaired even if a mounting head of a mounting lane on the other side has undergone collision.

Abstract: In a component mounting device (1) which includes a first mounting lane (L1) and a second mounting lane (L2) and for which an independence mounting mode and an alternation mounting mode are selectable, a first limited movable area (R1A) and a first limited movable area (R1B) in which the movements in the horizontal direction of a first mounting head (13A) and a second mounting head (13B) of the mounting lanes are permitted in the independence mounting mode, are set as areas different from second limited movable areas in the alternation mounting mode, to prevent the mounting head of the mounting lane which is continuously operating from entering into the area of the mounting lanes for which the device type changing operation is being performed.

Abstract: A system for aligning and connecting components including a support structure and a measuring apparatus coupled to the support structure. The measuring apparatus is arranged to spatially analyze a first tubular component with respect to a second tubular component for determining an adjustment vector therebetween. An alignment apparatus is coupled to the support structure and in data communication with the measuring apparatus. The alignment apparatus includes a plurality of actuators operatively arranged in parallel for moving at least one of the first or second tubular components relative to the other for coaxially arranging the first and second tubular components in accordance with the adjustment vector. A connection apparatus is coupled to the support structure and operatively arranged for connecting the first and second tubular components together.

Abstract: An system for manufacturing a field emission structure is provided that involves a magnet supplying device and a magnet placement device for placing each of a plurality of magnets at a corresponding location of a plurality of locations of the field emission structure. The corresponding location and a corresponding orientation of each of the magnets relative to each other are defined in accordance with a code that specifies at least one magnet of the plurality of magnets having a first polarity orientation and at least one other magnet of the plurality of magnets having a second polarity orientation that is opposite from the first polarity orientation.

Abstract: An assembly tool for assembling a lens tube in a lens base includes a support base, a fastening unit, a first height sensor, and a second height sensor. The support base defines a positioning groove for receiving the lens base. The fastening unit includes a fastening pole and a torque meter connected to an end of the fastening pole. The fastening pole forms a plurality of connecting portions for engaging with the lens tube. The first height sensor is positioned on the support base to detect a height of the lens base. The second height sensor is positioned on the support base to detect a height of an optical lens formed by the lens tube and the lens base.

Abstract: The invention aims at reducing unevenness at the intersections of mutually crossing electrodes with a method of and an apparatus for forming electrodes on a substrate. After forming a number of finger electrodes on a substrate, wide bus electrodes intersecting them are formed by application of an application liquid. Upon applying the application liquid which contains an electrode material and a photo-curing resin to the substrate, the application liquid is irradiated with UV light after a predetermined time and the application liquid is thus made to harden. A time difference since applying until light irradiation is set based on the result of measurement on changes of the height of the application liquid experimentally applied.

Abstract: In a joint apparatus, a transfer region and a processing region are formed. In the transfer region, a transfer mechanism transferring a first substrate, a second substrate, or a superposed substrate, a position adjusting mechanism adjusting an orientation in a horizontal direction of the first substrate or the second substrate, and a reversing mechanism reversing front and rear surfaces of the second substrate are provided. In the processing region, a first holding member mounting and holding the first substrate on an upper surface thereof, a second holding member holding the second substrate on a lower surface thereof, and a pressing and moving member bringing one end portion of the first substrate and one end portion of the second substrate into abutment with each other and pressing the one end portions when joining the first substrate and the second substrate together are provided.

Abstract: An apparatus for manufacturing electronic parts is provided. The apparatus includes a head unit installed on a main body and configured to move up and down, a nozzle unit installed on the head unit and configured to move up and down, and a positioning unit sequentially displacing the head unit and the nozzle unit to a position where the electronic parts are on standby to suction the electronic parts using the nozzle unit. Thus, when the head unit is used to suction the electronic parts on standby at a standby position of the electronic parts, the head unit and the nozzle unit installed on the head unit are sequentially lowered, so that it is possible to relieve an impact occurring when the electronic parts are suctioned to the ends of nozzles.

Abstract: A workpiece transfer apparatus includes a nozzle unit and an imaging unit. The nozzle unit includes a tubular body, a suction hole opening at one end of the tubular body and an end face member of a transparent body sealing the other end of the tubular body. The imaging unit captures images of first patterns for positioning that are located on an upper surface of a workpiece. The size and shape of the suction hole fits within an outline of the upper surface of the workpiece. The end face member of the transparent body maintains a negative pressure inside the cylindrical body and permits optical penetration for the imaging unit. The imaging unit captures the image of the first pattern for positioning of the workpiece while the imaging unit views a suctioned surface of the workpiece through the transparent body and the suction hole.

Abstract: An image taking system including: (a) a lighting device capable of changing a light emission time to various time length values; (b) an image taking device configured to take an image of a subject portion while light is being emitted by the lighting device; (c) a subject-portion moving device configured to move the subject portion relative to the image taking device, and capable of changing a movement velocity of the subject portion relative to the image taking device, to various velocity values; and (d) a control device configured, during movement of the subject portion by the subject-portion moving device, to cause the lighting device to emit the light for one of the time length values as the light emission time and to cause the image taking device to take the image, and is configured to control the movement velocity, such that an amount of the movement of the subject portion for the above-described one of the time length values is not larger than a predetermined movement amount.

Abstract: A single piece pulsed flow wing assembly method providing for horizontal wing manufacture is accomplished using synchronized automated vehicles guided in a predetermined manner to move and, locate wing structure in a plurality of assembly positions. Multi-axis assembly positioning systems (MAPS) are used at each assembly position to support and index components in the wing structure and determinant assembly techniques are used for indexing of the components. Modular automated manufacturing processes employing magnetic assembly clamping, drilling, fastener insertion, and sealant application are employed.

Abstract: It is an object to provide an electronic component mounting method that makes it possible to assure stable pickup operation even when a dimensional error attributable to a difference in production lot exists in electronic components or carrier tapes. During electronic component mounting adopting a tape splicing technique for splicing a carrier tape 15 already loaded on a tape feeder to a newly loaded carrier tape 15A, when an optical sensor 30 has detected a joint J between the already-loaded carrier tape 15 and the newly-loaded carrier tape 15A, a height measurement device 12 performs measurement of a component pickup height targeted for components P housed in the carrier tape 15A in connection with the tape feeder for which the joint J has been detected. Component pickup height data showing a target lowering height to which pickup nozzles 10a are to be lowered are updated on the basis of the measurement result.

Abstract: It is described a clamping system (30) of special conductors (S1, S2, S3) for a stator or rotor bar winding (U1, S1, S2, S3) for an electric machine, such as connection terminals (S1), jumpers (S2), neutrals or star points (S3), etc. The system (30) allows the special conductors (S1, S2, S3) to be clamped during a twisting step and/or a step of picking up such conductors from a twisting device (250). The system comprises a system axis (T-T), a plurality of grippers (10) aligned or able to be aligned along a circumference lying on a plane substantially perpendicular to the system axis (T-T) and actuation elements (50, 60, 70, 80, 90) of the grippers (10). Each gripper includes a pair of jaws (32, 33) mounted so as to be mobile in a plane transversal to said system axis (T-T).

Abstract: A seat assembling method for assembling at least one seat into an airplane, the method having the steps of position a seat installing device at a predetermined assembly position in the airplane, convey the at least one seat into the interior of the airplane to the seat installing device by means of a seat conveying device, transfer the seat from the seat conveying device to the seat installing device, and install the seat by means of the seat installing device which is positioned at the assembly position.

Abstract: The present invention relates to ultrasound transducers for ultrasonic imaging systems and, in particular, to improved grip assemblies for ultrasound transducers. One grip assembly includes a locking plate defining first and second apertures and a coupling post extending from the locking plate. An interface plate has a first elongate extension being extendable at least partially through the first aperture and a second elongate extension being extendable at least partially through the second aperture. A handle is coupled to the locking plate and includes a grip, a coupling interface, and a neck extending between the grip and the coupling interface. The coupling interface defines a coupling aperture for receiving the coupling post.

Abstract: An electronic component mounting apparatus includes a head unit, component supply device, camera unit, and controller controlling the head unit and component supply device. The component supply device has a holder holding electronic component accommodating tapes, each having storage cells arranged in a row, the storage cells storing electronic components, and a feeder forwarding the electronic component accommodating tapes and moving the storage cells to a suction area where the electronic component can be suctioned by the nozzle. The camera unit is fixed to a head support, and captures an image of the suction area. The controller analyzes the image of the suction area obtained by the camera unit. When the controller determines that a portion of the electronic component accommodating tape in the suction area is a spliced portion based on a result of the analysis, the controller determines that the electronic component accommodating tape is changed.

Abstract: A surface mounting apparatus includes a mounting head which is movable in X and Y directions and which mounts an electronic component on a positioned board, and a board recognizing camera is fixed to a base and which moves integrally with the mounting head. A correction jig includes a correction mark which is imaged by the board recognizing camera, and an imaging result is used to correct temporal change in an interior portion of the camera including an optical system, and is fixed to the base.

Abstract: Provided are a chip mounting method and device. The chip mounting device comprises: a bonding head on which a device is loaded; and a controller which places the bonding head at a preparation height above a board, determines a search height at which a mounting position on the board, on which the device is to be mounted, is searched for by the controller, and lowers the bonding head from the preparation height to a bonding height via the search height and mounts the device on the mounting position on the board, by controlling movements of the bonding head, wherein the controller determines that the device touches the board if at least one of a plurality of conditions is satisfied.

Abstract: Systems and methods for assembling non-occluding earbuds are disclosed. The earbud includes a non-occluding housing having a directional sound port offset with respect to a center axis of the earbud. The housing can have an asymmetric shape amenable to in-the-ear retention. Additionally, the housing can have a seamless or nearly seamless construction even though two or more parts are joined together to form the housing.

Abstract: A tool mounting system having at least one support tool structure with at least one tool connected to each of the at least one tool support. A first and second mounting portion is connected to each of the at least one tool support structure and is connectable to a first and second mount on a base, respectively. The first and second mounting portions have particular mounting characteristics for each of the at least one support tool structure such that the first and second mounting portions are only correspondable to the first and second mounts of the base to ensure the proper position of the at least one tool support structure relative to the base.

Abstract: An apparatus and method for aligning one or more components while attaching the component to a substrate. The component is positioned over the substrate. An alignment tool is attachable to the component. The alignment tool includes a tool alignment element, an optical tool, and a substrate alignment element attached to the substrate. The tool alignment element aligns with the substrate alignment element such that the components are positioned at specified locations on the substrate for attachment to the substrate. Further, in the method according to the disclosure, the tool alignment element aligns with the substrate alignment element to position one or more components at a specified location on the substrate.

Abstract: In a component mounting apparatus, when one of first and second board transfer devices is performing the unloading and loading of boards, a controller operates a component placing device to mount components on a first or second board loaded by the other board transfer device. Thus, it is possible to effectively utilize the time which is taken for the unloading and the loading of either boards, for component mountings on the other board, so that the efficiency in producing boards can be enhanced. Further, since the controller executes a control so that while component mountings are performed on the first boards of M-sheets on the first board transfer device, component mountings are performed on the second boards of N-sheets on the second board transfer device, it is realized to suppress the occurrence of an intermediate stock of either boards where the first boards of the M-sheets and the second boards of the N-sheets are required.

Abstract: Some embodiments include a connection device for electrically coupling an electrical device to a test system. The connection device can include at least one suction cup configured to be coupled to the electrical device, spring loaded connector pins configured to electrically couple the electrical device to the test system, and a support frame coupled to the at least one suction cup and the spring loaded connector pins. The at least one suction cup can include three suction cups including a first suction cup, a second suction cup, and a third suction cup, and the support frame can include a first end coupled to the first suction cup, a second end opposite the first end and coupled to the second suction cup, and a third end between the first and second ends and coupled to the third suction cup. Other embodiments of related devices and methods are also described herein.

Abstract: When a component mounting process by mounting heads is executed on substrates which are positioned alternately by two substrate carrying lines, a determination is made on whether or not a mounting turn can be completed every time the mounting heads perform the mounting turn, and when it is determined that one of the mounting turns performed by the mounting head cannot be completed, a component mounting process is executed on the substrate which is positioned by the substrate carrying line which is opposite to the substrate carrying line.

Abstract: Provided are a tripod constant velocity joint, and a method and a device for assembling the joint. The opening of a through-hole formed in an inner member of the tripod constant velocity joint has formed therein a tapered, reduced diameter section having a diameter tapered from the opening toward the inside. A first annular groove is formed in the side wall of a driving power transmission shaft, and a clip serving as an engaging member is engaged with the first annular groove. A second annular groove is formed in the inner wall of the through-hole in the inner member. In inserting the driving power transmission shaft through the through-hole in the inner member, the tapered, reduced diameter section guides the shaft in such a manner that the clip is contracted toward the bottom surface of the first annular groove. The clip expands and contracts due to the elasticity thereof when the positions of the first annular groove and the second annular groove coincide with each other.

Abstract: A system for aligning and connecting components including a support structure and a measuring apparatus coupled to the support structure. The measuring apparatus is arranged to spatially analyze a first tubular component with respect to a second tubular component for determining an adjustment vector therebetween. An alignment apparatus is coupled to the support structure and in data communication with the measuring apparatus. The alignment apparatus includes a plurality of actuators operatively arranged in parallel for moving at least one of the first or second tubular components relative to the other for coaxially arranging the first and second tubular components in accordance with the adjustment vector. A connection apparatus is coupled to the support structure and operatively arranged for connecting the first and second tubular components together.

Abstract: Vehicle body assembly apparatus (10) includes a sensor assembly (11) having a lateral Y axis slide assembly (20), a longitudinal X axis assembly (22) and a vertical Z axis assembly (24) that respectively include magnetostrictive type linear sensors for sensing X, Y and Z locations of a vehicle body to control vehicle body assembly. Signals of the X, Y and Z locations are sent to a controller (12) that operates a robot (14r) that supports an end effector.

Abstract: An End-Of-Arm-Tooling for a robot that includes at least one tool mounted upon a section of channel having a generally cruciform cross sectional shape that includes lobes having an arcuate-shaped portion, one end of the section of channel being adapted to be attached to a robot arm.

Abstract: An assembly tool for assembling a lens tube in a lens base includes a support base, a fastening unit, a first height sensor, and a second height sensor. The support base defines a positioning groove for receiving the lens base. The fastening unit includes a fastening pole and a torque meter connected to an end of the fastening pole. The fastening pole forms a plurality of connecting portions for engaging with the lens tube. The first height sensor is positioned on the support base to detect a height of the lens base. The second height sensor is positioned on the support base to detect a height of an optical lens formed by the lens tube and the lens base.

Abstract: A smart card processing system for processing a plurality of smart card portions on a smart card panel substantially simultaneously. The system may include a transfer member for moving card panels. Smart card panels may be loaded into an input magazine capable of elevating the panels with respect to a processing station. A transfer member may transport smart card panels from the input magazine to the processing station wherein one or more pre-personalization operations may be conducted. The transfer member may also be operative to move the smart card panels from the processing station to a marking station such that defective smart portions may be marked. The transfer may also move panels from the marking station to an output magazine. The output magazine may lower the smart card panels with respect to the marking station to accommodate more initiated smart card panels.

Abstract: A door hanging tool includes a horizontal member having at least one bubble vial for the determination of the angle of a surface with respect to the horizontal member and, a vertical member having at least one bubble vial for indicating the inclination of the surface with respect to the vertical member. The horizontal member further defines anchor slots for receiving an anchor means for releasably attaching the tool to the existing pre-drilled hole for lockset from the door manufacturer, such that the user can view the bubble vial of the vertical member for indicating the vertical inclination of the door with respect to the vertical member, and can view the bubble vial of the horizontal member to determine the angle of the door with respect to the horizontal member, and can adjust the door accordingly.

Abstract: A workpiece transfer apparatus includes a nozzle unit and an imaging unit. The nozzle unit includes a tubular body, a suction hole opening at one end of the tubular body and an end face member of a transparent body sealing the other end of the tubular body. The imaging unit captures images of first patterns for positioning that are located on an upper surface of a workpiece. The size and shape of the suction hole fits within an outline of the upper surface of the workpiece. The end face member of the transparent body maintains a negative pressure inside the cylindrical body and permits optical penetration for the imaging unit. The imaging unit captures the image of the first pattern for positioning of the workpiece while the imaging unit views a suctioned surface of the workpiece through the transparent body and the suction hole.

Abstract: In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process.

Abstract: A sill is aligned in the vertical direction on a laser line. The alignment of the sill in the horizontal direction is undertaken with a line set of an assembly jig. The line set includes at least two lines, for example a first line and a second line. The first line runs by a first run from the first part of the assembly jig to a third marking of the first line and from there by a second run to the second part of the assembly jig. If the lines are tightened and the marking is at one corner of the sill and the free end of the second line at the other corner of the sill, the sill is aligned in horizontal direction.

Abstract: A head assembly for a chip mounter is provided. The head assembly includes a nozzle module disposed above a printed circuit board (PCB) and configured to pick up and move an electronic component to mount the electronic component on the PCB, and a component recognition module electrically connected to the nozzle module and configured to recognize presence of the electronic component, a distance between the PCB and the nozzle module, and alignment of the electronic component at least one given moving position of the electronic component.

Abstract: An insertion arrangement (20) is provided to make it easier for an operator to insert several needles (41, 44) clamped in a multiple clamping chuck (40), even in the case of certain positional deviations, simultaneously in the associate bores (11) of a needle board (10). The insertion arrangement (20) comprises a guide section (32) with many parallel grooves (51) that are arranged at the distance of the bores (11), and that, respectively, can accommodate the tip (45) of a needle (41, 44) and can guide said tip to the associate bore (11). In so doing, the grooves (51) help align the individual needles (41, 44) with respect to the bores (11) in that the grooves correct potential positional deviations by slightly bending the needles (41, 44). The insertion arrangement (20) is mounted to an automatic loading machine (1) and can be adjusted and locked relative to a needle board (10) accommodated in the automatic loading machine.

Abstract: In a joint apparatus, a transfer region and a processing region are formed. In the transfer region, a transfer mechanism transferring a first substrate, a second substrate, or a superposed substrate, a position adjusting mechanism adjusting an orientation in a horizontal direction of the first substrate or the second substrate, and a reversing mechanism reversing front and rear surfaces of the second substrate are provided. In the processing region, a first holding member mounting and holding the first substrate on an upper surface thereof, a second holding member holding the second substrate on a lower surface thereof, and a pressing and moving member bringing one end portion of the first substrate and one end portion of the second substrate into abutment with each other and pressing the one end portions when joining the first substrate and the second substrate together are provided.

Abstract: To assemble a belt including a plurality of elements and a ring for fastening the element efficiently. A belt assembling apparatus for fastening a plurality of plate-like elements being juxtaposed in a same orientation annularly by a ring includes a load applying mechanism, which applies a load to the ring or to the elements which have already been fastened by the ring during a process of fastening the elements sequentially by the ring, thereby widening a clearance in an array of the elements being fastened by the ring. Therefore, the clearance to which the last piece of the element to be fastened by the ring is inserted can be widened relatively so that the element is allowed to be inserted into the clearance easily.

Abstract: A system for performing bonding of a first substrate including a first plurality of solder pads to a second substrate including a second plurality of solder pads comprises a first alignment mark set and a first plurality of dots on the first substrate. The system further comprises a second alignment mark set and a second plurality of dots on the second substrate. The second plurality of dots are configured to interlock and form an interlocking key with the first plurality of dots. The first alignment mark set is aligned with the second alignment mark set corresponding to the first and second plurality of dots being aligned and the first and second plurality of solder pads being aligned. The first and second plurality of dots are configured to remain substantially solid during a reflow of the first plurality of solder pads.

Abstract: An assembly apparatus including a bearing support mechanism configured to hold a bearing for assembly into a housing and a housing register mechanism operatively connected to the bearing support mechanism. The housing register mechanism receives and aligns a housing with a bearing on the bearing support mechanism when the housing is placed over the housing register mechanism.

Abstract: A method, a system and a computer readable medium having a set of instructions stored thereon for die-to-robot alignment for die-to-substrate bonding are described. First, a robot is aligned with a substrate to provide a pre-aligned robot. Next, a die is aligned with the pre-aligned robot to provide a robot-aligned die. Finally, the robot-aligned die is bonded to a region of the substrate. The substrate is held stationary immediately following the aligning of the robot with the substrate and at least until the robot-aligned die is bonded to the region of the substrate.

Abstract: A method of installing a door glass (15) on a vehicle door (16). The door glass is tilted relative to the front-rear direction of a vehicle to reduce the length in the front-rear direction of the door glass. The tilted door glass is lowered to position it between a pair of sashes (121, 122) provided at the front and rear of the vehicle door. The tilt of the door glass is corrected to a predetermined level to fit the door glass into the front and rear sashes and then the door glass is lowered.

Abstract: An apparatus (1) for fixing a planar object, in particular a substrate (2), on a working area (4) by means of vacuum is provided with an at least partly transparent bearing plate (5), one side of which forms the working area and which has a rear side arranged at a distance from the working area with a radiation-reflecting structure (7). The bearing plate additionally has vacuum channels which can be connected to a vacuum line and which open into the working area. In order to illuminate the substrate as homogeneously as possible by means of transmitted light, at least one light source (10) is provided, the radiation of which can be fed into the bearing plate. In addition, the working area is preferably operatively connected to a heating apparatus (11), so that the substrate (2) can be heated.

Abstract: A structured cabling tool includes an outer frame base supporting axle mounts that in turn support cable axles, the outer frame being extended in a ready for use condition and compacted in a ready for transport condition; inner frame arms supported within the outer frame base, the inner frame arms fixable upright orthogonal to the extended outer frame base in the ready for use condition and coextensive with the compacted outer frame in the ready for transport condition; a cable sorting threader supported between the inner frame arms; and a revolvable tape segmenting spindle supported by the inner frame arms below the cable sorting threader.

Abstract: In a positioning apparatus (40), a fixed scroll (34) is positioned with respect to an assembly body (11) in which a compressor motor (25) has been incorporated. In positioning the fixed scroll (34), electric power is supplied to the compressor motor (25) from an inverter (81) to rotate a crank shaft (20) by the compressor motor (25), thereby shifting a movable scroll (31). In the positioning apparatus (40), the shift of the movable scroll (31) leads to calculation of an appropriate position of the fixed scroll (34). A striking unit (70) applies impact force to the fixed scroll (34) to stir the fixed scroll (34) to the appropriate position.

Abstract: A clutching jig used to disassemble a lens socket and a lens component which has a lens base glued on a printed circuit board (PCB) and is fixed in the lens socket by a plurality of buckling pieces of the lens socket abutting on the lens component has a substantially rectangular base. The base defines two opposite first lateral surfaces, a bottom surface, and a slot passing through the first lateral surfaces and the bottom surface to divide the base into a first holding portion and a second holding portion. The bottom surface has a receiving recess communicating with the slot. When the receiving recess receives the lens component, a plurality of resisting slices attached to a periphery of the base inserts into a gap between the lens component and the lens socket for pressing the buckling pieces away from the lens component.

Abstract: A tool mount assembly includes drop down connections to aid in mounting of a tool to a moving base and a fail-safe tool mounting system for preventing installation of a tool in an undesired or incorrect manner. A plurality of tool mount rails are received within mounts and are uniquely tailored to assure proper placement of tools such as grippers or vacuum cups at desired locations specific to the application requirements.

Abstract: A measuring chip installation/removal device of the present invention secures and removes a measuring chip to and from the top surface of an SPR measurement device that measures a specimen in the measuring chip by surface plasmon resonance. The measuring chip installation/removal device includes: a chip carrier on which the measuring chip is mounted; a chip carrier guide that guides the chip carrier on the top surface; and a first magnet provided in the chip carrier, and a second magnet is provided in the chip carrier guide. Orientation of a magnetic force received by the first magnet from the second magnet is reversed by displacing the chip carrier guide, so that the chip carrier is secured to or removed from the top surface.

Abstract: A device and method for the molding of plugs as part of a pipe connection wherein the pipe connection is constructed as a sealing plug-in connection with a connecting piece and a plug that can be locked with the connecting piece. A molding slot is placed in the material of the plug with an expanding tool acting in a radial direction and a sensor subject to the radial deformation is arranged in the expanding jaw. The sensor records the radial deformation work of the expanding jaw and regulates the expanding drive.