Abstract: Stock having printed circuits thereon is conveyed in a transport plane by a conveying device, and electronic components carried by a transfer belt are transferred to the stock under pressure exerted by the belt. The electronic components are transferred to the belt by a feed device individually in such a way that the electronic components are accurately positioned on the stock by the transfer device.

Abstract: Embodiments of tool mounted structural positioning devices and techniques are described. In one embodiment, a positioning device includes mountings to mount the device directly to a tool device configured to travel a path and perform a manufacturing operation on an element. Engagement mechanisms coupled to the positioning device are aligned to the predefined path and are configured to exert a clamping force upon the element such that the element is secured and positioned by the positioning device in constant relation to the predefined path as the operations are performed.

Abstract: An assembly-target-object-and-assembly-component carrier pallet carries thereon a target object (semi-finished product) 2 and a plurality of assembly components arranged, as viewed in plane, on a straight line which passes through a predetermined attachment position on the target object where the predetermined assembly component is to be attached. This allows a minimum of moving parts in the attaching device which attaches the assembly components to the assembly target object. Therefore, the structure of an assembling apparatus is simplified and mechanical errors and assembly time are reduced, thereby improving assembling accuracy.

Abstract: A cup attaching apparatus for attaching a cup to an eyeglass lens, comprises: a lens mount on which the lens is to be mounted; at least three support pins provided on the lens mount to support the lens when a rear refractive surface of the lens is brought in contact with the support pins; and a first moving mechanism adapted to simultaneously move the support pins to change a distance of each support pin from a central axis for attachment of the cup.

Abstract: Exemplary system and process for assembling a camera module are provided. The system includes a worktable, a light intensity sensor, a lens module holding device and a controlling unit. The worktable provide placement of the image sensor module thereon, thus a center of the image sensor having a coordinate value thereof. The lens module holding device can hold and move the lens module above the worktable, and it has a light source to emit parallel light that converged at a focus point, wherein the light intensity sensor can detect the focus point location and generating a signal associated with a coordinate value of the focus point. The controlling unit can receive the signal and instruct the lens module holding device to move the lens module toward the image sensor module so that the optical axis of the lens module is aligned with the center of the image sensor.

Abstract: A plurality of reference electronic components (M1, M2) marked in advance are identified and recognized, and the positions of the plurality of the reference electronic components (M1, M2) positioned in the vicinity of an electronic component to be taken out (2a) and component arrangement information in a wafer mapping file (MF) stored in a storage device (11f) are used to calculate the position of the electronic component to be taken out (2a).

Abstract: A wafer table for providing electrical components of a wafer includes a rotary disk to receive a wafer. The rotary disk is configured to be displaced parallel to a wafer plane in discrete steps such that the components arrive at a stationary pick-up position. A stationary auxiliary facility is assigned to the pick-up position, and a first rotary drive rotates the rotary disk. A carriage supports the rotary disk and is displaced in a stationary linear guide parallel to the wafer by means of a linear drive. The first rotary drive and the linear drive are positioned such that each of the components arrives at the pick-up position.

Abstract: Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.

Abstract: A device for fixing and positioning in tubes and its use in tubular reactors.

Abstract: An optical fiber structure (10) includes an optical fiber (11a), and a block-like chip (12) joined to the optical fiber (11a). The block-like chip (12) is tapered toward its fiber-joined end.

Abstract: A window glass can be accurately and preferably mounted by correcting a displacement of a curved surface shape of the window glass in the crosswise direction even when there is a displacement of the curved surface shape of the window glass in the crosswise direction. A slit laser beam is irradiated with from slit laser beam irradiators 12c and 12d across the right and left ends of the window glass 6, the circumference of a window glass mounting opening 8, and a windshield pillar section 11; rotation adjustment of the window glass 6 is performed, based on a processed image obtained by image processing of images, which have been photographed with a CCD cameras 10c and 10d, of the slit laser beams, in such a way that clearances in the pressing direction at the right and left ends of the window glass 6 are the same as each other; and the window glass 6 is pressed onto a window glass mounting surface on the circumference of the window glass mounting opening 8 for mounting onto the surface.

Abstract: In estimating a curved surface model by approximating the shape of the board surface of a circuit board, auxiliary measurement spots are set other than measurement spots on the board surface, eligibility as a sampling displacement magnitude in estimating a curved surface model is determined according to a difference in a displacement magnitude from a work reference surface. When the sampling displacement magnitude is determined to be ineligible, a new measurement spot is reset. By this operation, a local increase and decrease in the displacement magnitude due to a discontinuity of the board surface exerts no influence on the estimation of the curved surface model, and the curved surface model approximated more closely to the shape of the actual board surface is estimated, leading to an improvement in the work quality with the working height adjusted to the proper height.

Abstract: A tool mount assembly includes drop down connections to aid in mounting of a tool to a moving base and a fail-safe tool mounting system for preventing installation of a tool in an undesired or incorrect manner. A plurality of tool mount rails are received within mounts and are uniquely tailored to assure proper placement of tools such as grippers or vacuum cups at desired locations specific to the application requirements.

Abstract: A die bonding apparatus and a bonding method are provided wherein the apparatus comprises a bond head movable between a supply of semiconductor dice and a die bonding site, a pick-up tool attached to the bond head for holding a die to be bonded at the die bonding site and an optical assembly positioned for viewing an orientation of the die bonding site. The bond head is configured such that an orientation of the die being held by the pick-up tool between the optical assembly and the die bonding site is viewable by the optical assembly, whereby the orientation of the die may be aligned with the orientation of the die bonding site.

Abstract: A method of disassembling a washing machine is a disassembling method for a washing machine including a reduction-gear unit secured on the outside of a water tub and a dehydration tub disposed in the water tub, and the method includes a release step of applying force, along the axial direction of a rotary shaft, in the direction of separating the reduction-gear unit and the dehydration tub from each other to release connection between the reduction-gear unit and the dehydration tub. This scheme can be employed to provide a method of disassembling a washing machine that can recover resin included in the washing machine at a high recovery ratio.

Abstract: A wire setting device includes a first optical detecting portion that detects a setting of the wire in a groove based on a first light beam passing across the wire insertion groove, a second optical detecting portion that detects abutting contact of the distal end of the wire with a proper point on a wire abutment surface based on a second light beam in a direction intersecting the wire, a wire clamp between, and a control portion that determines that the wire is properly positioned in the wire insertion groove based on detection signals from the first and second optical detecting portions, and controls the wire clamp.

Abstract: Provided is an apparatus for assembling a camera module comprising a support frame that is formed in a rectangular shape and has a jig horizontally connected to an upper end thereof; a plurality of stages that are vertically stacked and installed in the support frame and adjust a printed circuit board (PCB) in three-axis directions; a board holder that is formed to extend from one end of the uppermost stage and has the PCB mounted on the extending end thereof; and a jig assembly that is disposed on an opening of the jig and has a barrel-integrated housing mounted on the central portion thereof.

Abstract: An apparatus for restoring the alignment of the support socket with other structural components during the fabrication of a leg prosthesis comprising a stand with base, a means to secure the lower aspect of the leg prosthesis to the stand base, and a laser source attached to the top of the stand that emits visible cross-beams downward onto the leg prosthesis when the prosthesis is mounted on the stand base. The method of the invention uses the described apparatus with leg prosthesis mounted thereon to mark points on the inside of a check or test socket that coincide with the laser cross-beams; transferring these marks from the check socket to the permanent support socket; and re-aligning the permanent support socket with the lower aspect prosthetic components by mounting the leg prosthesis with permanent support socket on the alignment apparatus and matching the marks to the laser cross-beams.

Abstract: A vacuum-mounted clamp for clamping a first component to a second component. The clamp includes a substantially rigid body having an application face, a back face opposite the application face, a side, and a vacuum port extending between the application face and the back face. The application face has a step adjacent the side for engaging the first component. The clamp includes a flexible seal connected to the rigid body adjacent the application face. The seal has a vacuum port in fluid communication with the vacuum port in the primary body and a periphery for contacting the second component to create a vacuum area between the clamp and the second component. The vacuum port of the body and the seal are in fluid communication with a vacuum generator for generating a vacuum in the vacuum area.

Abstract: Two or more plates, each having a matching alignment hole, are precisely aligned and mated together by an aligning and clamping device that includes: (a) a plurality of movable aligning fingers, retraction means for causing the aligning fingers to move into a retracted state where they occupy a first volumetric space sufficiently small to allow the two or more plates to be moved over the retracted fingers so as to have their respective alignment holes surrounding the retracted aligning fingers; (b) expansion means for use after the plates have been moved over the fingers, the expansion means urging the fingers to expand outwardly to occupy a second volumetric space greater than the first volumetric space such that the fingers begin to contact and begin to improve co-alignment between the surrounding alignment holes; and (d) clamping means for use after the alignment holes of the plates have begun to come into improved co-alignment, the clamping means applying a clamping force for clamping the two or more mate

Abstract: An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.

Abstract: A component recognition apparatus for a chip mounter includes a head portion having a frame and at least one nozzle portion installed on the frame, the nozzle portion picking up an electronic component and mounting the electronic component on a substrate, a camera coupled with the frame and comprising an imaging device, and a mirror portion having a mirror support portion installed on the frame and a mirror held by the mirror support portion in a space that does not interfere with the movement path of the electronic component held by the nozzle portion. The camera includes a lens portion, and an image of the electronic component held by the nozzle portion is reflected by the mirror, passes off-axis through the lens portion, and is formed on the imaging device.

Abstract: A machine and a method for assembling a vehicle body is disclosed as including a locating pin (26) formed with a seating flange portion (35) having a work seating surface (35a) and a clamp arm (39) contained in the locating pin to be operable in a clamping or unclamping movement responsive to an extrusion and retraction of a clamp cylinder (34). A detection pin (47) is mounted for an extruding and extracting movement from the work seating surface (35a), with the detection pin (47), a shaft (44) ad a proximity switch (48) forming a work seating detection mechanism (49). A mutual engagement between the locating pin (26) and a locating bore (R) allows a panel W3 to be positioned, simultaneously detecting the presence of seating of the panel W3 responsive to a movement of the detection pin (47).

Abstract: A turbine blade with a tip squealer and method of rebuilding a turbine blade for a gas turbine engine. The blade is of the type including an airfoil having first and second spaced-apart sidewalls defining an interior void and joined at a leading edge and a trailing edge. The first and second sidewalls extending from a root disposed adjacent the dovetail to a tip cap for channeling combustion gases, and a squealer tip including at least one tip rib extending outwardly from the tip cap. The method includes the steps of removing the squealer tip, including the at least one rib tip, from the tip cap and adding new material to the tip cap to serve as a new squealer tip. A plurality of spaced-apart notches is formed in the new material between the leading edge and the trailing edge of the airfoil. At least one hole is formed in each notch communicating with the interior void of the airfoil for channeling cooling air from the interior void of the airfoil to thereby form a squealer tip.

Abstract: A printed-board supporting apparatus includes a support pin that is attached to a pin-supporting table. An image of the support surface of the support pin is taken by a mark-image taking device, at a first position where a center of an image-take surface of the mark-image taking device is expected to coincide with a center of the support surface of the support pin. Another image of the support surface is taken at a second position where the center of the image-take surface is distant from the center of the support surface by a predetermined distance. At the second position, the image of the support surface is formed on the image-take surface at a position corresponding to the height of the support surface. Based on the position corresponding to the height of the support surface, the height of the support surface relative to the mark-image taking device is obtained.

Abstract: Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include using a position sensitive device that measures the position of the placement head relative to the workpiece as the placement head travels towards and away from the workpiece during a placement cycle. The output of this sensor is used to selectably trigger the acquisition of the images used to measure a placement characteristic of the component placement machine.

Abstract: The invention is directed to increased stabilization of a pickup operation by reducing a reaction against disturbance by reducing a feedback value when a pickup rate is improved. A positional shifting amount of an electronic component on a suction nozzle before the electronic component is mounted on a printed board is stored in a RAM each time the component is picked up at a component feeding unit until a pickup count number reaches a predetermined pickup number, and a CPU calculates an average of the positional shifting amounts. When the pickup count number reaches the predetermined pickup number, the CPU obtains a temporary coefficient by adding an initial value to a value obtained by multiplying a negative coefficient by the pickup count number, and calculates a feedback value by multiplying the temporary coefficient by the average.

Abstract: The invention provides a manufacturing apparatus in which inter-substrate transfer of a thin film circuit or a thin film element can automatically be performed. An apparatus for manufacturing electronic devices includes a laser device to generate laser beams, a masking unit having a masking substrate to shape beam spots of the laser beams, a first stage to place a first substrate, which carries a object to be transferred, a second stage to place a second substrate, to which the object to be transferred is transferred, an adhesive agent applying unit to apply an adhesive agent on the object to be transferred or on a transferred position on the second substrate, and a control unit to control the actions of the first and the second stages.

Abstract: In a board placement method and system, a PCB panel having multiple interconnected PCB units and a vacant space is placed on a work surface of a reference platform. The work surface has an opening corresponding to the vacant space. The reference platform has a micro-adjusting unit, which includes a support seat disposed in the opening and movable along three directions. The support seat is used for placement of a good PCB unit. The current positions of the PCB panel and the good PCB unit are measured so as to calculate a target position of the good PCB unit and an error between the target position and the current position of the good PCB unit. The micro-adjusting unit can drive the support seat to move so as to move the good PCB unit to the target position. The good PCB unit is then fixed in the vacant space.

Abstract: This present invention discloses a cutting shield machine used for separating iron shells of connectors from a metal strip. The cutting shield machine includes a worktable, a separation apparatus located in the worktable, a carrying apparatus located in the worktable delivering the metal strip into the separation apparatus, a receiving box located in the worktable for receiving the iron shells from the separation apparatus, a crossing apparatus and a driving apparatus located in the worktable. The separation apparatus has a prop stand located in the worktable, a rotating portion with a columned portion capable of rotation and a pole are fixed in the prop stand in sequence in the transmission direction of the metal strip. The metal strip passes from the top of the rotating portion and the bottom of the pole or from the bottom of the rotating portion and the bottom of the pole.

Abstract: In an electronic part mounting apparatus provided with first, second and third beam members 31, 32 and 33, all supported by a common Y-axis frame at both ends thereof, holding a chip 6 by suction from an electronic part feeding unit 2 by means of a mounting head attached to the first beam member 31, and mounting the chip onto a substrate held by first and second substrate-holding units 10A and 10B, a supporting mechanism for the substrate-holding unit (an SHU-supporting mechanism) 10 is provided which supports a slide table 50, on which the first and second substrate-holding unit 10A and 10B are arranged, in such a manner that the slide table is movable between an operating position P1 and a maintenance position P2. With such configuration, the slide table 50 can be moved to the maintenance position P2 easily accessible for maintenance, leading to the improvement of working efficiency.

Abstract: To provide an electronic component pickup method, an electronic component mounting method and an electronic component mounting device capable of stably picking up, with high productivity, an electronic component adhered and held to a carrier. An electronic component pickup method for picking up a chip 6 adhered and held to a sheet 5 with an adhesive layer 5a by way of a support tool 20 uses an adhesive containing a compound that generates a gas by radiation of light. In the pickup operation, the support tool 20 is brought into contact with the top surface of the chip 6 and a light radiating part 8 is positioned below the chip 6. Then ultraviolet light is radiated from the bottom surface of the sheet 5 onto the adhesive layer 5a positioned on the rear surface of the chip 6. When a nitrogen gas generated from the adhesive layer 5a has formed a gas layer G at the adhesive interface between the rear surface of the chip 6 and the adhesive layer 5a, the support tool 20 is lifted to pick up the chip 6.

Abstract: A structured cabling tool includes a lower frame base that supports cable axles, the tool being extended in a ready for use condition and compacted in a ready for transport condition; frame arms supported by the lower frame base, the frame arms fixable upright orthogonal to the lower frame base in the ready for use condition and coextensive with the lower frame in the ready for transport condition; a cable sorting threader supported between the frame arms; and a revolvable tape segmenting spindle supported by the frame arms below the cable sorting threader.

Abstract: In a board placement method and system, a PCB panel having multiple interconnected PCB units and a vacant space is placed on a work surface of a reference platform. The work surface has an opening corresponding to the vacant space. The reference platform has a micro-adjusting unit, which includes a support seat disposed in the opening and movable along three directions. The support seat is used for placement of a good PCB unit. The current positions of the PCB panel and the good PCB unit are measured so as to calculate a target position of the good PCB unit and an error between the target position and the current position of the good PCB unit. The micro-adjusting unit can drive the support seat to move so as to move the good PCB unit to the target position. The good PCB unit is then fixed in the vacant space.

Abstract: A process for changing an anode of a cell for the production of aluminum by fused bath electrolysis including a plurality of anodes. According to the invention, an anode handling tool is used including a positioning device, a gripping device and a sensor detecting the vertical position of the gripping device, and the position sensor is used to measure the vertical distances traveled by the gripping device with respect to a reference level N. At least one sound or electromagnetic waves beam is then produced in a determined reference line or plane and the passage of the anode in the beam is used to measure the distances. The vertical position of the replacement anode in the cell is determined starting from the values obtained for the traveled distances and the replacement anode is put into this position in the place initially occupied by the spent anode.

Abstract: Tooling fixtures and methods are described for securing a solid-matrix panel for cutting. In one embodiment, a tooling fixture includes a first clamping system and a second clamping system. The first clamping system receives a solid-matrix panel of PCBs and secures the solid-matrix panel for cutting of the solid-matrix panel along a first axis. Once secured, a cutting apparatus cuts the solid-matrix panel along the first axis between the PCBs to cut the solid-matrix panel into a plurality of strips. The second clamping system then moves into a position relative to the strips of the solid-matrix panel and secures the strips for cutting of the strips along a second axis. When secured by the second clamping system, the cutting apparatus cuts the individual PCBs from the strips.

Abstract: A holding structure, such as a manipulator, includes a plurality fingers. At least one of the fingers is movable such that an object can be held or released by a closing or opening motion of the movable finger. At least one contact surface of the fingers, which is capable of being brought into contact with the object, is formed by an elastic member, and at least one elastic member is adapted to reversibly change its elasticity under the control of an external supply of energy to the elastic member.

Abstract: A folding stand adapted to be secured to the bottom wall of a portable crimping device which, in a folded position, is substantially flat against a wall portion thereof and, in an unfolded position, vertically raises the crimping device to a predetermined working height, the folding stand including a base portion, having a rear pivot axis, a mounting portion, having a front pivot axis, and a pair of elongated cross members for interconnecting the base and mounting portions, via oppositely directed fastening members, with opposed ends of the cross members being adapted to pivot, relative to the adjoining base and mounting members, between respective first and second stop point folding surfaces, in a folded position, and first and second stop point standing surfaces, in an unfolded position, the respective stop point folding and stop point standing surfaces being angularly spaced therebetween via first and second predetermined reflex angles.

Abstract: When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is executed so that, while a component recognition or board recognition operation is performed in either one of the two mounting units, the component placing or component holding operation is not performed in the other of the mounting units.

Abstract: An apparatus, a system and a method are provided to separate a gear from a shaft. The apparatus, the system and the method implement a base plate, a handle, a face plate, a first fastener, a second fastener, and/or a press. The gear is attached to a shaft of a motor. The fasteners connect and/or attach the face plate to the base plate. The fasteners extend through a passage in the gear. The gear is positioned between the face plate and the base plate which abuts a backside of the gear. The press is inserted into a central hole of the face plate and/or abuts a second side of the gear. The base plate maintains the gear in a stationary position with respect to the face plate and/or the press. The press engages the shaft and/or pulls the gear inward with respect to the face plate. As a result, a first side of the base plate moves the gear inward with respect to the face plate.

Abstract: An optimization apparatus capable of efficiently placing an electronic component. An optimization unit (203) determines a first assignment to the placement apparatus and calculates a first placement time required for placing all the electronic components assigned to the placement apparatus by the first assignment onto a circuit board by the placement apparatus. The optimization unit selects two placement apparatuses among a plurality of placement apparatuses, selects a type of an electronic component assigned for the selected placement apparatus, determines a second assignment by interchanging two selected times assigned, calculates a second placement time required for placing all the electronic components assigned to the placement apparatus by the second assignment onto the circuit board by the placement apparatus, and employs the one of the first assignment and the second assignment which has a smaller placement time.

Abstract: A method and apparatus for the safe and easy installation of wall-mounted electrical outlets and switches utilizing a multi-functional tool. Two different but similar tools are provided, each in the form of an insulated handle that may be detachably engaged with either a wall socket or a wall switch. The wall socket device includes one or more prongs for temporary engagement with slots in the socket fixture, and may include testing circuitry. The wall switch device is temporarily attached to a switch fixture using one or more magnets. Both tools may also include built-in electrical wire measuring, stripping and bending structures.

Abstract: Positioning recognition marks are read by movable recognition device for positioning objects to be bonded to each other. An alignment method includes a step of reading the recognition marks during movement of the recognition device before its complete stop, and a step of identifying absolute positions of the recognition marks by correcting the mark recognition positions having been read based on a position feedback signal of the moving recognition device. A mounting method using the alignment method is also disclosed. It is possible to maintain a high alignment accuracy, eliminate necessity of assuring a settling time for complete stop of the movable recognition device, and significantly reduce the alignment time and mounting tact.

Abstract: An electronic component mounting apparatus enables a reliable decision of abnormal suction of a component even when the difference between the width and the height of the component is small. When the difference between the thickness of the electronic component detected by a sensor and the data on the thickness stored in the RAM is within the tolerance, a CPU judges that the component is held by a suction nozzle in a normal posture and executes a normal processing control. Then an image of the electronic component is captured by a recognition camera, and a recognition processing is made by an image processing unit to measure the geometry of the component. The CPU, then, judges whether the size of the component is within tolerance or not.

Abstract: An apparatus for detecting a location of conductive pins with respect to a circuit board during an assembly process using a press tool to mate the circuit board and the conductive pins includes a detector housing holding a plurality of switches aligned with corresponding conductive pins, wherein the detector housing is configured to be mounted to the press tool used during the assembly process. The switches change state based on the location of the conductive pins with respect to the circuit board. The apparatus further includes a sensor electrically coupled with the plurality of switches, wherein the sensor monitors the change of state of each switch to indicate that the respective conductive pins are properly mated with the circuit board.

Abstract: A tool, in particular a shaft tool, is inserted into and fixed in a clamping chuck. The actual position of the tool, particularly in the direction of the longitudinal axis of the tool or in the direction of insertion, is determined before and/or during the insertion of the tool into the clamping chuck. Based on the determined actual position, the tool is inserted into the clamping chuck until a setpoint position has been reached.

Abstract: An electric-component holding apparatus including a component holder which holds an electric component and includes an engaging portion, a holder-holding member to which the component holder is detachably attached, a lock member which consists of a substantially rigid body, and which is supported by the holder-holding member such that the lock member is movable relative to the holder-holding member, and is engaged with the engaging portion of the component holder to lock the component holder to the holder-holding member, and a locked-state maintaining device which includes an operable member and an elastic member and which maintains, owing to an elastic force of the elastic member, a locked state in which the lock member is engaged with the engaging portion of the component holder.

Abstract: A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.

Abstract: A system provides a zero interconnection height in a board-to-board interconnect while maintaining efficient space allocation for multiple axis connections by providing a floating connection in one plane thereby enabling a connection in another plane. A first circuit board having a first plurality of through-holes is aligned with a second circuit board having a second plurality of through-holes so that the first plurality of through-holes is matched with the second plurality of through-holes. An interconnection height of zero is provided between the first circuit board and the second circuit board. At least one pass-through socket, which includes pass-through socket through-holes, is aligned with the combination of the first circuit board and second circuit board. One or more pins disposed on a pin header are inserted through the pass-through socket, the first circuit board, and the second circuit board.

Abstract: A first electronic component having two alignment holes perforated at predetermined positions thereof at a predetermined interval is held with a receiving table, and also a second electronic component having two alignment marks formed at predetermined positions thereon at an interval therebetween in agreement with that between the two alignment holes is held with a position-adjusting mechanism. In a state in which the alignment marks of the second electronic component are introduced in the corresponding alignment holes of the first electronic component, the mark-recognition apparatus captures the alignment marks and the alignment holes in the same fields of view thereof and measures the positions of the two components, and the position-adjusting mechanism adjusts the position of the second electronic component such that the alignment marks of the second electronic component lie at predetermined positions in the alignment holes of the first electronic component.