Abstract: A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

Abstract: The invention relates to a device (11) and a method for producing transformer cores (12), the device comprising a retaining system (19) having a stacking table (18) for collecting sheets of metal (16) from which a transformer core (12) is constructed and having at least two positioning aids for the sheets, the stacking table forming a positioning surface (26) for the positioning aids and being equipped with the positioning aids, the stacking table and the positioning aids being realized such that a free positioning and a location-independent fastening of the positioning aids within the positioning surface is possible, the device having a positioning system (25) by means of which the positioning aids can be disposed on and/or be removed from the stacking table.

Abstract: An assembly method and a combined and bivalent workstation for automatically assembling photovoltaic panels, with printing of ECA on cell portions and progressive arrangement with a partial superimposition on the contacts, pre-forming shingled strings in a continuous cycle, which are ready for loading on a backsheet, without dry-curing. The method provides a macro-phase of lay-up entirely made in the station, with simultaneous and coordinated sub-phases: picking of portions with a first handler and control, oriented loading on a vacuum belt, control of positioning on the belt, printing of ECA, control of printing and positioning, progressive superimpositions on a shuttle-tray with bidirectional translation coordinated with a second handler with chocked vacuum, picking of the shingled string with a third handler, control of string alignment, loading and pre-fixing. Vision systems are integrated for the execution of said sub-phases.

Abstract: A system for laminating photovoltaic stacks comprising at least two sealed independent housings, each sealed housing delimiting an inner volume configured to contain one of the photovoltaic stacks and at least one evacuation port; a docking station, which comprises at least two independent compartments for receiving one of the sealed housings; heating means configured for heating each photovoltaic stack independently; an evacuation device for evacuating the inner volume of the sealed housings via the evacuation port; and a transfer device for transferring each sealed housing into one of the receiving compartments.

Abstract: A flexible solar panel module is provided having a plurality of non-flexible solar panels, a plurality of non-flexible covers and a flexible back sheet. Each of the non-flexible solar panels has a photoreactive device layer, a positive ribbon and a negative ribbon. The non-flexible covers correspond to the non-flexible solar panels respectively and are disposed on front surfaces of the non-flexible solar panels. Each of the non-flexible covers is bigger in size than each of the non-flexible solar panels. The flexible back sheet is disposed under back surfaces of the non-flexible solar panels and has a plurality of openings therein. A first water-resistant sealant is disposed between adjacent non-flexible covers and physically contacts the flexible back sheet. A second water-resistant sealant is disposed between the non-flexible covers and the flexible back sheet and covers sidewalls of the non-flexible solar panels.

Abstract: A tool having a blank positioning system and method for forming a container. The tool has a first tool assembly and a second tool assembly that cooperate to shape the container from a blank. The blank positioning system positions the blank between the first tool assembly and the second tool assembly prior to forming the blank into the container.

Abstract: An actuator for a switchgear is disclosed, which can include a core having a package of core element layers made of magnetic material, and permanent magnets between the core elements, fixed with screws with screwheads. A movable plate is configured to open or close a magnetic circuit to the core, and an electromagnetic coil is surrounded by the core elements. To avoid mechanical infringement of the environment of the actuator by prominent screwheads, without weakening the magnetic force, screws for mechanical connection of the core element layers and the permanent magnets can be oriented perpendicular to the plane of stacking of the core element layers, and screw-holes for the screws can be implemented through the core element layers and the permanent magnets, and the screw-holes can end in diameter extended openings, so that the screwheads and/or the screwnuts are recessed into the diameter extended openings.

Abstract: An apparatus for manufacturing a field pole magnetic body formed by laminating magnet segments produced by cutting and dividing a permanent magnet and to be arranged in a rotary electric machine includes a housing part adapted to successively house a plurality of the magnet segments having adhesive applied to cut surfaces with the cut surfaces facing each other and has an inner side surface adjacent to outer side surfaces of the housed magnet segments, and a pressing unit adapted to press the magnet segments housed in the housing part toward a bottom part of the housing part in a longitudinal direction. The magnet segments are restrained in a width direction and a thickness direction by the inner side surface of the housing part when the magnet segments are pressed by the pressing unit.

Abstract: An apparatus for supplying a support having a clean surface is provided. Alternatively, an apparatus for manufacturing a stack including a support and a remaining portion of a processed member whose one surface layer is separated is provided. A positioning portion, a slit formation portion, and a peeling portion are included. The positioning portion is provided with a first transfer mechanism of a stacked film including a support and a separator and a table for fixing the stacked film. The slit formation portion is provided with a cutter that can form a slit which does not pass through the separator. The peeling portion is provided with a second transfer mechanism and a peeling mechanism extending the separator and then peeling the separator. In addition, a pretreatment portion activating a support surface is included.

Abstract: A process and a blanking mold are described for the production of a ferromagnetic core for electric motors formed by a plurality of segments. The laminations are blanked from a sheet of ferromagnetic material and stacked in an accumulation chamber of the blanking mold, along which they advance until a segment constituted by a stack having a preset number of laminations is formed, which is mechanically connected to an adjacent segment, thereby forming a rectilinear sequence of segments. The segments are hinged to each other with the possibility of mutual rotation to allow the sequence of segments to be brought from the rectilinear condition to a closed circular configuration.

Abstract: The invention relates to a process for the manufacture of a part penetrated by fluid channels or ducts for the manufacture of a mold that includes channels or ducts for the circulation and/or transfer of a fluid from the molding portion to the non-molding portion and vice versa. The part is formed and manufactured by a Stratoconception (TM) method based on the principle of decomposing the part, via a set of inter-stratum planes, into a succession of strata. After assembly, the part is formed, and channels are provided in the various inter-stratum planes for allowing a fluid to pass through the part. The invention also relates to the parts obtained by the process.

Abstract: An apparatus for retaining a package of laminations of an electromagnetic core in a device (3) for the production thereof that is mounted into a panel (1) arranged at a distance from a yoke (2) of said device (3) for the production of individual laminations (4) and mutual joining of same into a package (5), wherein it comprises peripheral units like an aggregate for pressurized hydraulic oil, sensors, control unit and ejector.

Abstract: In a joint apparatus, a transfer region and a processing region are formed. In the transfer region, a transfer mechanism transferring a first substrate, a second substrate, or a superposed substrate, a position adjusting mechanism adjusting an orientation in a horizontal direction of the first substrate or the second substrate, and a reversing mechanism reversing front and rear surfaces of the second substrate are provided. In the processing region, a first holding member mounting and holding the first substrate on an upper surface thereof, a second holding member holding the second substrate on a lower surface thereof, and a pressing and moving member bringing one end portion of the first substrate and one end portion of the second substrate into abutment with each other and pressing the one end portions when joining the first substrate and the second substrate together are provided.

Abstract: A laminated core punching apparatus, configured such that a stator-punching press machine that has a molding die performing a partial punching gradually approaches the shape of the stator core piece. There is a punching die to punching out the stator core piece from a strip-form steel plate, and two stator lamination stations. A rotor-punching press machine and a stator-punching press machine are constructed to operate synchronously. An intermediate loop portion capable of causing a strip-form steel plate to hang down in a loop is provided in order to adjust a length of the strip-form steel plate between the two press machines, and a loop guide portion that guides a loop locus of the strip-form steel plate from above so that the strip-form steel plate does not invert is disposed above the intermediate loop portion to be capable of ascending and descending.

Abstract: An apparatus for pre-activation of a polymer electrolyte fuel cell includes a first plate and a second plate hot pressing the unit cell stack, each having a flow channel supplying water vapor to opposing inner surfaces with the unit cell stack therebetween and including a resistor producing heat, a compressor, a temperature controller and a water vapor supplier connected to the flow channels of the plates. The apparatus for pre-activating a polymer electrolyte fuel cell may be used to prepare a prep-activated integrated body of a polymer electrolyte fuel cell membrane electrode assembly and gas diffusion layers by performing hot pressing while supplying water vapor to the unit cell stack to hydrate the polymer electrolyte membrane.

Abstract: An apparatus that couples a first substrate and a second substrate of an electrowetting display panel, the apparatus comprising a first chuck provided with a first support surface and a second chuck provided with a second support surface opposite to the first support surface and positioned beneath the first chuck. The second support surface is smaller than the first support surface and is positioned in a plane parallel to a plane that includes the first support surface.

Abstract: An apparatus and a method for automatically joining components of photovoltaic elements are disclosed. The apparatus includes: a) at least two manufacturing lines and at least two assembly bridges for joining the substrates, films and glass panes, b) a stacking device for film feeding and a conveyor belt for feeding the glass panes, c) devices for centering and suctioning the films and the glass plates, d) devices for transporting and fixing the film transport frame and the glass transport frame e) devices for lowering the films and the glass plates from the respective transport frames, and f) devices for further transport.

Abstract: In manufacturing multilayer plastic laminates for printed circuits, a press with two surfaces exerts pressure under vacuum on a stack of laminates, the packs, alternated with separator plates made of anodized aluminum. The packs include prepreg layers. The metalizations present on the two sides of each pack are portions of a copper strip repeatedly folded 180° around each pack and each separator plate. A strong current circulates in the copper strip which heats the strip with resistive behavior: the heat causes the close fixing of the various layers. An auxiliary heater is applied to each surface of the press by element of an interposed insulating plate. This includes an aluminum plate with equidistant longitudinal holes containing the same number of armored candle-like resistors, connected in parallel. A main power supply provides direct current to the copper strip, two secondary power supplies provide alternating current to the two auxiliary heaters.

Abstract: A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.

Abstract: An apparatus for manufacturing a temporary substrate includes a jig having a table, a holding guide for positioning constituent members of the temporary substrate, a holding unit for holding the laminated constituent members, and a heater unit for performing a temporary bonding on the laminated constituent members, and further includes a drive mechanism for moving each member constituting the jig between a standby position and an in-use position. The holding guide has a plurality of step portions formed in such a manner that peripheries of the step portions define areas corresponding to outer sizes of the respective constituent members when the holding guide is moved to the in-use position. The temporary substrate has as the constituent members, a prepreg, inner metal foils respectively stacked on both surfaces of the prepreg and each having a smaller outer size than the prepreg, and outer metal foils respectively stacked on the inner metal foils and each having a larger outer size than the prepreg.

Abstract: A fabrication method of a semiconductor package includes: disposing a first wafer on a substrate having at least a conductive pad; stacking a second wafer on the first wafer, wherein the second wafer has a pre-open area corresponding in position to the conductive pad of the substrate; forming a protection layer on the second wafer; embrittling the protection layer on the pre-open area of the second wafer; and removing the embrittled portion of the protection layer and portions of the second and first wafers so as to form an opening to expose the conductive pad, thereby preventing an adhesive layer from being attached to a cutting tool as in the prior art.

Abstract: On a lamination frame is disposed a stacked member of photovoltaic cells and a concave-convex member. The photovoltaic cells are formed using a flexible substrate. When forming the stacked member, each of the plurality of photovoltaic cells is disposed on a lamination frame in the state of an intermediate member sandwiched between protective films for lamination and sealing. Among the protective films, the protective film positioned on the side of the light-receiving face of the photovoltaic cells is opposed entirely by the concave-convex member. The concave-convex member has concavities and convexities on the surface opposing the protective film. By simultaneously subjecting the intermediate member and the concave-convex member to lamination treatment, a plurality of photovoltaic cells can be simultaneously and individually sealed by the protective film.

Abstract: A radio frequency package on package (PoP) circuit is described. The radio frequency package on package (PoP) circuit includes a first radio frequency package. The first radio frequency package includes radio frequency components. The radio frequency package on package (PoP) circuit also includes a second radio frequency package. The second radio frequency package includes radio frequency components. The first radio frequency package and the second radio frequency package are in a vertical configuration. The radio frequency components on the first radio frequency package are designed to reduce the effects of ground inductance.

Abstract: Embodiments of the invention may provide a system for the production of photovoltaic modules that comprises at least a first work line having a plurality of positioning stations in which a series of first processing operations are performed and a second work line consisting of at least a positioning station in which at least a second processing operation is performed. The process sequence may include, for example, printing a layer material used to form one or more electric contacts on a base layer, and then positioning photovoltaic cells and various layers of insulating material in a desired orientation over the base layer to form a photovoltaic module.

Abstract: The production line according to the present invention is provided with a pressurization measurement apparatus adjacent to a press-working apparatus, a temporary laminate assembly worked and laminated by a press in the press-working apparatus is sent to the pressurization measurement apparatus, and a laminate assembly is produced by being pressurized and being subjected to regular caulking by a hydraulic servo press of the pressurization measurement apparatus. At this time, the lamination height of a regularly caulked laminate assembly is measured by a linear scale secured at the pressurization measurement apparatus.

Abstract: A method for producing thin-film solar modules, comprising the following steps: providing flexible thin-film solar cells as separate segments in a container or on a web wound up to a roll, the flexible thin-film solar cells bearing with a first side against the web, wherein each of the flexible thin-film solar cells is designed to have a first electric pole and a second electric pole; transferring the flexible thin-film solar cells from the web to a first film web such that the first pole of a first flexible thin-film solar cell is positioned next to the second pole of a second thin-film solar cell; and applying electrically conductive contact strips to the first and second poles of the flexible thin-film solar cells in longitudinal and/or transverse direction relative to the conveying direction of the first film web.

Abstract: An apparatus for manufacturing a transformer core includes a drawing which draws magnetic sheet materials in parallel from winding bodies. A cutter cuts the sheet materials at predetermined positions substantially simultaneously to form sheets each with a different length. An overlapping unit forms a block-shaped laminate by laminating the cut magnetic sheet materials in length and forms a resultant laminate by laminating the formed block-shaped laminates. An annulation unit forms an annular structure of the resultant laminate so that the longer block-shaped laminate forms the outer annular portion and the shorter block-shaped laminate forms the inner annular portion. Both ends of the magnetic sheet materials are abutted or overlapped to locate the abutted or overlapped portions at annularly different positions between adjoining layers of the magnetic sheet materials. A control unit controls the drawing unit, cutter and overlapping unit.

Abstract: A method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a conductor in each of the apertures, connecting the antenna to the conductor, forming a recess in the substrate layer, attaching continuous connection wires to a plurality of chip modules, attaching the continuous connection wires to a plurality of conductors on a corresponding plurality of the substrate layers, cutting the continuous connection wires so as to retain portions thereof which connect each chip module to a corresponding pair of conductors and sealing the chip module in the recess.

Abstract: In a joint apparatus, a transfer region and a processing region are formed. In the transfer region, a transfer mechanism transferring a first substrate, a second substrate, or a superposed substrate, a position adjusting mechanism adjusting an orientation in a horizontal direction of the first substrate or the second substrate, and a reversing mechanism reversing front and rear surfaces of the second substrate are provided. In the processing region, a first holding member mounting and holding the first substrate on an upper surface thereof, a second holding member holding the second substrate on a lower surface thereof, and a pressing and moving member bringing one end portion of the first substrate and one end portion of the second substrate into abutment with each other and pressing the one end portions when joining the first substrate and the second substrate together are provided.

Abstract: A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method.

Abstract: The present invention relates to a fastening apparatus for fastening a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The fastening apparatus includes a support assembly. An authentication system is arranged on the support assembly and is configured to authenticate the printhead assembly. At least one bonding assembly is configured to bond the PCB to the printhead assembly. A controller is configured to control the bonding assembly to bond the PCB to the printhead assembly subsequent to the authentication of the printhead assembly.

Abstract: The invention permits a plurality of strips of resin adhesive film having a desired width and unwound from a single feeding reel to be simultaneously pasted on a solar cell. For this purpose, the invention comprises the steps of: unwinding a resin adhesive film sheet from a reel on which the resin adhesive film sheet is wound; splitting the unwound resin adhesive film into two or more film strips in correspondence to lengths of wiring material to bond; pasting the strips of resin adhesive film on an electrode of the solar cell; and placing the individual lengths of wiring material on the electrode of the solar cell having the plural strips of resin adhesive film pasted thereon and thermally setting the resin adhesive film by heating so as to fix together the electrode of the solar cell and the wiring material.

Abstract: It is an objective of the present invention to eliminate wafer testing. Provided is a manufacturing apparatus comprising a detecting section that detects a position of a device terminal of a device; a generating section that generates a substrate-side terminal, which connects to the device terminal, on a substrate at a position corresponding to the device terminal; and a mounting section that mounts the device on the substrate and connects the device terminal to the substrate-side terminal. The detecting section captures an image of the device and detects the position of the device terminal based on the captured image, and the generating section prints a pattern of the substrate-side terminal on the substrate at a position corresponding to the device terminal.

Abstract: Embodiments of the present invention provide a lamination module and procedure for cooling the edges of a partially formed thin film solar module to substantially the same temperature as the central region of the module just prior to compressing and bonding the layers of the heated module. The lamination module may include a cooling module having a plurality of nozzles configured to apply a curtain of cooling fluid to leading and trailing edges of the partially formed solar module after heating the module and just prior to compressing the module. The nozzles may further be configured to apply a curtain of cooling fluid to side edges of the partially formed solar cell module as it passes through the cooling module. As a result, the chance of bubble formation within the bonding material in the edge regions of the completed solar cell module is significantly lowered with respect to conventional lamination processes.

Abstract: Apparatus (1) for manufacturing solar cell matrices includes several stringers (2) for forming strings from solar cells, a lay-up and interconnection station (5) for arranging and interconnecting the strings to form a solar cell matrix, and a transportation system (3) for transferring the strings from the stringers (2) to the lay-up and interconnection station (5), wherein the stringers (2) are arranged perpendicular to the direction of flow of the transportation system (3), or in an acute angle to an axis perpendicular to the direction of flow of the transportation system (3). Furthermore, a process for operating such apparatus (1), wherein the several stringers (2) are controlled such that collision between different strings is avoided in the transportation system (3).

Abstract: There is provided a device for electronic components including: a tray provided with electronic components formed by stacking dielectric sheets on which inner conductors are formed; a transfer unit continuously transferring the electronic components moved from the tray; and a magnetic field providing unit providing a magnetic field to the electronic components moved from the transfer unit to align the inner conductors in a direction in which the magnetic field and magnetic resistance are reduced.

Abstract: A carrier assembly for temporary accommodation of one or more solar cell laminates while the solar laminates are conveyed through a lamination plant. The solar cell laminate comprises a solar cell layer of silicon material, an upper and a lower encapsulating layer of EVA material covering the top and bottom of the solar cell layer, an upper and lower protective layer covering the upper and lower encapsulating layer, respectively. The encapsulating layer has a specific melting temperature and a specific curing temperature; the melting temperature is lower than the curing temperature.

Abstract: The present invention is a method and apparatus for producing ready to use RFID devices in a convenient and economical manner. The apparatus of the present invention may be collocated with a manufacturer of consumer goods.

Abstract: Transformer core manufacturing apparatus and method having magnetic thin plates aligned with high accuracy are provided for manufacturing the transformer core using the thin and lightweight magnetic plates.

Abstract: A method of manufacturing a laminated iron core using a die, includes punching out iron core pieces from a thin steel sheet material by a first working row, each piece having a spindle hole and a plurality of slot holes of a given configuration. Electrically insulating sheet pieces are punched out from an electrically insulating thin sheet material by a second working row, each piece having a spindle hole and a plurality of slot holes with a configuration similar to, but smaller than, the slot holes of the iron core pieces. Thereafter, the iron core pieces and electrically insulating sheet pieces are stacked such that edges of the slot holes of the electrically insulating sheet pieces extend outwardly beyond edges of the slot holes of the iron core pieces.

Abstract: A winding device for producing a field coil including a double-layer multiple-circuit winding for an electric motor includes a drive. The drive is configured to operate upon a winding mandrel with multiple lamellas arranged to be swung radially outwardly and inwardly by the drive in order to produce the double-layer multiple-circuit winding as a plurality of winding stacks that are arranged in separate slots and electrically connected in series, in parallel or both. At least two axially-separated winding stacks can be produced at the same time by the drive.

Abstract: An apparatus for manufacturing a temporary substrate includes a jig having a table, a holding guide for positioning constituent members of the temporary substrate, a holding unit for holding the laminated constituent members, and a heater unit for performing a temporary bonding on the laminated constituent members, and further includes a drive mechanism for moving each member constituting the jig between a standby position and an in-use position. The holding guide has a plurality of step portions formed in such a manner that peripheries of the step portions define areas corresponding to outer sizes of the respective constituent members when the holding guide is moved to the in-use position. The temporary substrate has as the constituent members, a prepreg, inner metal foils respectively stacked on both surfaces of the prepreg and each having a smaller outer size than the prepreg, and outer metal foils respectively stacked on the inner metal foils and each having a larger outer size than the prepreg.

Abstract: Described in one embodiment is a system that has a multiple number of different stations for forming solar cell modules. Described in another embodiment is a system that includes a cutting station, a setting station, and an interconnection station to create different series-connected flexible solar cell modules. Described in still another embodiment is a monolithically integrated multi-module power supply.

Abstract: A method for manufacturing a photovoltaic module including a laminating step.

Abstract: Separators (5A, 5B, 6) and membrane-electrode assemblies (2) of a fuel cell stack (1) are alternately stacked in a guide box (40). The separators (5A, 5B, 6) each have groove-like gas paths (10A, 10B). Powder of an adhesive agent (7) is adhered in advance to the surfaces of the separators (5A, 5B, 6), except the gas paths (10A, 10B), through photosensitive drums (31A, 31B) to which the powder is adsorbed in a given pattern. The separators (5A, 5B, 6) and the membrane-electrode assemblies (2), stacked in the guide box (40), are heated and compressed by a press (43) and heaters (40C) to obtain a unitized fuel cell stack (1).

Abstract: A stator manufacturing apparatus for manufacturing a stator efficiently includes a base plate, a plurality of radially inward displacing jigs disposed radially in an annular pattern on the base plate and which are radially displaceable toward and away from each other, a plurality of core holding jigs disposed radially inward of the radially inward displacing jigs and which are radially displaceable toward and away from each other, a movable plate disposed vertically upward of the base plate and which is vertically movable toward and away from the base plate, a cam disposed on the movable plate for displacing the radially inward displacing jigs radially toward each other when the movable plate is lowered, and a spacer holding jig for holding spacers that are inserted between adjacent separate cores.

Abstract: A die machine for manufacturing a laminated iron core includes a first working row for punching out iron core pieces from a steel sheet material and a second working row for punching out electrically insulating sheet pieces from an electrically insulating synthetic resin sheet material. Each iron core piece includes a spindle hole and a plurality of slot holes for receiving coil windings. Each electrically insulating sheet includes a spindle hole and a plurality of slot holes which have a substantially similar configuration to, but are smaller than, the slot holes of the iron core pieces. The die machine includes a stacking die mold for selectively receiving the iron core pieces and the electrically insulating sheet pieces such that successive stacks of iron core pieces are sandwiched between electrically insulating sheet pieces.

Abstract: In a soldering method for mounting a semiconductor device on a wiring board, a plurality of solid-phase solders are provided between the semiconductor device and the wiring board, and are thermally melted to thereby produce a plurality of liquid-phase solders therebetween. A constant force is exerted on the liquid-phase solders by relatively moving the semiconductor device with respect to the wiring board so that an invariable gap is determined between the semiconductor device and the wiring board.

Abstract: An electronic package and method and system for forming the electronic package. The electronic package has a first substrate including a first electronic device and including through-holes extending through an entire thickness of the first substrate. The electronic package has a second substrate bonded to the first substrate, metallizations formed in the through-holes of the first substrate to connect to components of the first electronic device, and a patternable substance disposed between the first substrate and the second substrate and adhering the first substrate and the second substrate together in regions apart from the metallizations.

Abstract: Connection with an ACF is realized relative to a wiring board having an electronic component mounted on the rear surface thereof with high connection reliability and uniform thermal compression bonding. A thermal compression bonding head 12 is used to apply pressure to flexible printed circuit boards 4 and 5 relative to a motherboard substrate 1 having an electronic component 6 mounted thereon and heat an anisotropic conductive film, thereby connecting the motherboard substrate 1 with the ACF to the flexible printed circuit boards 4 and 5 that are connecting members. At this time, in a state in which a receiving plate 13 made of an elastic material, such as silicone rubber, and provided at a mounting position of the electronic component 6 of the motherboard substrate 1 with a concave portion 13a corresponding in shape to the electronic component 6 supports thereon the rear surface of the motherboard substrate 1, the thermal compression bonding is performed.