Laminated Device Patents (Class 29/738)
  • Patent number: 7730606
    Abstract: A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each one effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.
    Type: Grant
    Filed: August 30, 2006
    Date of Patent: June 8, 2010
    Inventors: Ian J Forster, Patrick F King
  • Publication number: 20100115762
    Abstract: The present invention provides an apparatus for the horizontal stacking of laminations 10 and donuts to form a stator core. A stator generator frame 2 has multiple keybars 6 that run the axial length of the frame. The laminations 10 have grooves 12 there-in that engage the keybars to provide a secure fit of the laminations to the generator frame. By extending two or more of the keybars 6, these extensions 7 may be used as rails on which the laminations may be horizontally inserted into the stator frame.
    Type: Application
    Filed: January 28, 2010
    Publication date: May 13, 2010
    Inventors: Thomas Majernik, James Bauer, Barry Sargeant, George Dailey
  • Publication number: 20100058584
    Abstract: The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from a top position to the preferred stack orientation employing a preferred four-axis orientation.
    Type: Application
    Filed: September 11, 2008
    Publication date: March 11, 2010
    Inventors: Anthony Faraci, Gary N. Sortino
  • Patent number: 7665203
    Abstract: An insulator-combining apparatus which can correctly detects whether or not insulators are lined up in a predetermined sequence is provided. The plate-combining apparatus includes a plate-setting jig which includes a frame, holder, combining part and erroneous attaching-preventing part. The holders hold insulating plates and are provided being spaced from each other and supported by the frame capable of approaching and leaving each other. The combining part includes a pair of nipping members which positions the holder therebetween so as to cause the holders to approach each other. The erroneous attaching-preventing part prevents the holders from approaching each other until the insulators combine with each other when an incorrect insulating plate is attached on the holder.
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: February 23, 2010
    Assignee: Yazaki Corporation
    Inventor: Hiroshi Hasegawa
  • Patent number: 7600312
    Abstract: A progressive die assembly and method for manufacturing lamina stacks from a strip of substantially planar material, in which at least some of the individual laminas are formed with portions which extend from, or are otherwise not within, the plane of the material strip. The die assembly includes die stations having punches for punching features substantially within the plane of the strip corresponding to individual laminas, such as lamina profiles and lamina interlock features. Additionally, the die assembly also includes at least one forming station which includes a selectively actuable forming tool which is configured to form a lamina portion in the strip which is disposed outwardly of the strip plane, such as by bending a portion of the strip.
    Type: Grant
    Filed: July 12, 2005
    Date of Patent: October 13, 2009
    Assignee: L.H. Carbide Corporation
    Inventors: Barry A. Lee, Thomas R. Neuenschwander
  • Patent number: 7587813
    Abstract: An assembly device assembles a recording and reproducing device for an optical disc by bonding spindle motor to a mechanical chassis. The assembly device adjusts the attitude of the spindle motor relative to the mechanical chassis prior to bonding by adjusting an inclination of the spindle motor about a first axis and about a second axis perpendicular to the first axis. The assembly device also adjusts a height of the spindle motor.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: September 15, 2009
    Assignee: Panasonic Corporation
    Inventor: Kenichi Miyamori
  • Patent number: 7562439
    Abstract: An apparatus for manufacturing an electric motor having a laminated core structure formed by a plurality of core plates made of rolled material of electromagnetic sheet steel. The core plates are manufactured by punching rolled electromagnetic sheet steel in a die set. The rolled electromagnetic sheet steel is displaced angularly relative to the die set. The core plates have rolling directions of the electromagnetic sheet steel angularly displaced by a machine angle determined in accordance with the number of slots or poles provided in the laminated core structure so that a phase difference of cogging torques produced by magnetic anisotropy of the core plates is substantially 180°.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: July 21, 2009
    Assignee: Fanuc Ltd
    Inventors: Tomonaga Yamamoto, Takuya Maeda
  • Publication number: 20090151154
    Abstract: The invention relates to a system for transferring a nanostructure from a die to a flat side of a large-area substrate with a substrate holder that receives the substrate on a substrate receiving surface, and an actuator device that can be oriented parallel to the substrate receiving surface and opposite to this movable structural surface of the die and that acts orthogonally to the substrate receiving surface. To be able to use reasonably priced dies and in this case to achieve the highest possible throughput, a good edge yield, and a homogeneous structure with the substrate as much as possible without scrapping, a system is proposed with which the resultant force that acts through the die on the substrate surface can be shifted along the die surface.
    Type: Application
    Filed: November 7, 2008
    Publication date: June 18, 2009
    Inventors: Friedrich Paul Lindner, Thomas Glinsner, Markus Wimplinger
  • Patent number: 7526859
    Abstract: The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.
    Type: Grant
    Filed: October 13, 2006
    Date of Patent: May 5, 2009
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Kenji Sasaoka, Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Yoshizumi Sato, Koichiro Shibayama
  • Publication number: 20090098789
    Abstract: A desired optical sheet for a display is easily provided while flexibly responding to addition of size and change in size of an optical sheet for a display. An equipment for producing an optical sheet for a display, including: a joining device which joins two or more optical sheets at one or more parts, a cutting device which cuts the optical sheets joined by the joining device or periphery of optical sheets not joined by the joining device into a product size, a packaging device which stacks and packages the optical sheets joined by the joining device and a control device which variably sets the product size and the order of the joining step by the joining device, the cutting step by the cutting device and the packaging step by the packaging device.
    Type: Application
    Filed: September 8, 2006
    Publication date: April 16, 2009
    Applicant: FUJIFILM CORPORATION
    Inventors: Keisuke Endo, Shotaro Ogawa
  • Publication number: 20090077805
    Abstract: The present invention generally relates to a system that can be used to form a photovoltaic device, or solar cell, using processing modules that are adapted to perform one or more steps in the solar cell formation process. The automated solar cell fab is generally an arrangement of automated processing modules and automation equipment that is used to form solar cell devices. The automated solar fab will thus generally comprise a substrate receiving module that is adapted to receive a substrate, one or more absorbing layer deposition cluster tools having at least one processing chamber that is adapted to deposit a silicon-containing layer on a surface of the substrate, one or more back contact deposition chambers, one or more material removal chambers, a solar cell encapsulation device, an autoclave module, an automated junction box attaching module, and one or more quality assurance modules that are adapted to test and qualify the completely formed solar cell device.
    Type: Application
    Filed: August 29, 2008
    Publication date: March 26, 2009
    Inventors: Robert Z. BACHRACH, Yong-Kee Chae, Soo Young Choi, Nicholas G.J. De Vries, Yacov Elgar, Eric A. Englhardt, Michael R. Frei, Charles Gay, Parris Hawkins, Choi (Gene) Ho, James Craig Hunter, Penchala N. Kankanala, Liwei Li, Wing Hoo (Hendrick) Lo, Danny Cam Toan Lu, Fang Mei, Stephen P. Murphy, Srujal (Steve) Patel, Matthew J.B. Saunders, Asaf Schlezinger, Shuran Sheng, Tzay-Fa (Jeff) Su, Jeffrey S. Sullivan, David Tanner, Teresa Trowbridge, Brice Walker, John M. White, Tae K. Won
  • Publication number: 20090038146
    Abstract: A laminated iron core includes a plurality of stacked iron core pieces punched out from a thin steel sheet material, each iron core piece including a plurality of slot holes for receiving coil windings. At least one electrically insulating sheet piece is stacked on an outer surface of a lowermost iron core piece. The electrically insulating sheet pieces include a spindle hole and a plurality of slot holes which have a substantially similar configuration to, but are smaller than, the slot holes of the iron core pieces whereby edges of slot holes of electrically insulating sheet pieces extend outwardly beyond edges of slot holes of iron core pieces. Burrs formed at edges of slot holes of iron core pieces are covered with edges of slot holes of electrically insulating sheet pieces so that a coil can be wound safely without directly contacting the burrs.
    Type: Application
    Filed: October 8, 2008
    Publication date: February 12, 2009
    Applicant: KURODA PRECISION INDUSTRIES LTD.
    Inventors: Takeshi NISHIZAWA, Hideo Horrii
  • Publication number: 20090038130
    Abstract: A method for manufacturing a piezoelectric actuator, the method comprising: co-extruding alternating strips of a high permittivity material and a low permittivity material to form a green tape comprising said alternating strips of said high permittivity material and said low permittivity material; cutting said green tape to form a plurality of sheets, each sheet comprising a high permittivity region and at least two low permittivity regions adjacent to the high permittivity region; applying at least one conductive region to each one of two or more of the sheets to overly the high permittivity region and to leave exposed at least one low permittivity region; and stacking a plurality of sheets to form an actuator stack comprising adjacent sheets, wherein the or each conductive region on each sheet is offset with respect to a conductive region on a different sheet within the actuator stack.
    Type: Application
    Filed: January 30, 2008
    Publication date: February 12, 2009
    Inventors: Michael Peter Cooke, Christopher Andrew Goat
  • Publication number: 20080315385
    Abstract: A semiconductor device with a sheet-like insulating substrate (101) integral with two or more patterned layers of conductive lines and vias, a chip attached to an assembly site, and contact pads (103) in pad locations has an encapsulated region on the top surface of the substrate, extending to the edge of the substrate, enclosing the chip, and having contact apertures (703) at the pad locations for external communication with the pad metal surfaces. The apertures may have not-smooth sidewall surfaces and may be filled with solder material (704) to contact the pads. Metal-filled surface grooves (710) in the encapsulated region, with smooth groove bottom and sidewalls, are selected to serve as customized routing interconnections, or redistribution lines, between selected apertures and thus to facilitate the coupling with another semiconductor device to form a package-on-package assembly.
    Type: Application
    Filed: June 22, 2007
    Publication date: December 25, 2008
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Mark A. Gerber, David N. Walter
  • Publication number: 20080318349
    Abstract: Systems and methods for forming an encapsulated MEMS device include a hermetic seal which seals an insulating gas between two substrates, one of which supports the MEMS device. The hermetic seal may be formed by heating at least two metal materials, in order to melt at least one of the metal materials. The first melted metal material flows into and forms an alloy with a second metal material, forming a hermetic seal which encapsulates the MEMS device.
    Type: Application
    Filed: August 18, 2008
    Publication date: December 25, 2008
    Applicant: Innovative Micro Technology
    Inventors: David M. Erlach, Jeffery F. Summers, Douglas L. Thompson
  • Publication number: 20080278268
    Abstract: Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at least one shunt bar located at a nodal line of a vibrational mode of the deformable plate, so that the shunt bar remains relatively stationary when the plate is vibrating in that vibrational mode. The hermetic seal may be a gold/indium alloy, formed by heating a layer of indium plated over a layer of gold. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate.
    Type: Application
    Filed: May 9, 2007
    Publication date: November 13, 2008
    Applicant: Innovative Micro Technology
    Inventors: John S. Foster, Kimberly L. Turner
  • Patent number: 7402758
    Abstract: A multilayer PCB including at least one carrier, wherein the at least one carrier comprises a pseudo three-layer core. Each three-layer core includes a first metal layer, a first dielectric layer, an internal bridge layer, a second dielectric layer, and a second metal layer. The bridge layer includes a plurality of bridge pads. Each carrier includes a plurality of interlayer interconnection units for interconnecting the first and second metal layers. Each interlayer interconnection unit comprises a pair of opposed blind vias and a bridge pad disposed between, and in electrical contact with, the pair of blind vias.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: July 22, 2008
    Assignee: QUALCOMM Incorporated
    Inventor: Dwight W. Mattix
  • Publication number: 20080155815
    Abstract: An insulator-combining apparatus which can correctly detects whether or not insulators are lined up in a predetermined sequence is provided. The plate-combining apparatus includes a plate-setting jig which includes a frame, holder, combining part and erroneous attaching-preventing part. The holders hold insulating plates and are provided being spaced from each other and supported by the frame capable of approaching and leaving each other. The combining part includes a pair of nipping members which positions the holder therebetween so as to cause the holders to approach each other. The erroneous attaching-preventing part prevents the holders from approaching each other until the insulators combine with each other when an incorrect insulating plate is attached on the holder.
    Type: Application
    Filed: August 31, 2007
    Publication date: July 3, 2008
    Applicant: Yazaki Corporation
    Inventor: Hiroshi Hasegawa
  • Publication number: 20080058230
    Abstract: A resin-coated metal plate used for drilling a printed wiring board is provided, by which a drilled hole excellent in smoothness of an inner wall can be provided at an accurate position with high quality and high efficiency under a high-density drilling condition in which drill entering speed is high, production volume is large, and a distance between adjacent drilled holes (pitch) is short, and breakability is reduced with respect to a drill; and a method of drilling the printed wiring board using the metal plate is provided. A resin-coated metal plate used as a protective back plate in drilling a printed wiring board has a metal plate, and a resin film including a thermoplastic resin coated on at least one surface of the metal plate; wherein in the thermoplastic resin, melting peak temperature is in a range of 60° C. to 120° C., and in a TMA curve, temperature difference is within a range of 5° C. to 30° C.
    Type: Application
    Filed: July 25, 2007
    Publication date: March 6, 2008
    Inventors: Eiichiro Yoshikawa, Akitoshi Fujisawa
  • Patent number: 7328502
    Abstract: Apparatus for making circuitized substrates using a continuous roll format in which layers of conductor and dielectric are fed into the apparatus, bonded, and passed on to other nearby work stations in which various processes such as hole formation, circuitization and, finally, segmentation occur. The resulting substrates can then be individually bonded to other, like substrates to form a larger multi-layered substrate with a plurality of conductive thru-holes, conductive and dielectric layers as part thereof.
    Type: Grant
    Filed: August 3, 2007
    Date of Patent: February 12, 2008
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: John M. Lauffer, Voya R. Markovich, James W. Orband, William E. Wilson
  • Patent number: 7302754
    Abstract: The present invention provides for a method and apparatus of horizontally stacking a stator core. A central rail structure 34 that runs down approximately the center axis of the stator frame 2, and attached to the central rail structure are adjustable supports 40 that hold the central rail structure within the stator frame. A dolly 36 is positioned on top of the central rail structure 34. The dolly 36 has multiple finger supports 38 disposed on its top and the finger supports match corresponding grooves in stator core laminations 10. Lamination are placed onto the dolly, gaps in the lamination engage the finger supports on the upper inner diameter of the lamination. This allows for the lamination to be horizontally moved into place within the stator frame.
    Type: Grant
    Filed: January 7, 2005
    Date of Patent: December 4, 2007
    Assignee: Siemens Power Generation, Inc.
    Inventors: Tom Majernik, James Bauer, George F. Dailey, Barry Sargeant
  • Patent number: 7297614
    Abstract: An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: November 20, 2007
    Assignee: MEGICA Corporation
    Inventors: Jin-Yuan Lee, Mou-Shiung Lin, Ching-Cheng Huang
  • Patent number: 7290326
    Abstract: A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.
    Type: Grant
    Filed: July 22, 2005
    Date of Patent: November 6, 2007
    Assignee: Dynaco Corp.
    Inventor: Steven Lee Dutton
  • Patent number: 7207103
    Abstract: A powder compaction press having opposed rib and channel punches which are interleaved and a production method are used to produce capacitor elements having a uniform compaction density and which are free of surface imperfections.
    Type: Grant
    Filed: December 8, 2003
    Date of Patent: April 24, 2007
    Assignee: Kemet Electronics Corporation
    Inventor: Jeffrey P. Poltorak
  • Patent number: 7168158
    Abstract: The stacked core assembly apparatus, which can perform assembly at a high speed while keeping strength of an angle indexing apparatus, comprises a press machine 1, a non-synchronous transmitting apparatus 10 and an angle indexing apparatus 7. The non-synchronous transmitting apparatus 10 transforms a constant revolution of the press machine 1 into a variable revolution. The angle indexing apparatus 7 is connected to the non-synchronous transmitting apparatus 10 via a coupling device 20, and is connected to a rotatably stacking cavity device 51 of a press die 5. An accelerated rotational speed period of an output shaft 13 of the non-synchronous transmitting apparatus 10 is set during a Feeding-Phase period of time of the press machine 1, and thereby, a rotational state completion of a driving shaft 33 of the angle indexing apparatus 7 completes earlier than the Feeding-Phase period of time completion of the press machined 1 so that a non-rotating period of time can be provided.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: January 30, 2007
    Assignees: Yamada Dobby Co., Ltd., Minebea Co., Ltd.
    Inventors: Kuniyasu Shirai, Takuya Sato
  • Patent number: 7159297
    Abstract: It is an object of the present invention to provide a method of manufacturing a rotor for an electric motor, in which displacement of the center of gravity is prevented. According to a feature of the present invention, a rotor for an electric motor comprises an inner core fixed to a rotating shaft of the rotor and multiple coil units respectively fixed to the inner core, wherein the coil unit has an outer core, a bobbin and a winding wound on the bobbin, and wherein weight of outer cores as well as winding units (the bobbin and the winding wound thereon) is respectively measured and stratified into several groups, necessary number of the outer cores and winding units are respectively picked out from the same stratified group and then such outer cores and winding units are assembled to the inner core.
    Type: Grant
    Filed: March 11, 2004
    Date of Patent: January 9, 2007
    Assignee: Denso Corporation
    Inventors: Shingo Inaishi, Shinya Ishikawa, Hirotsugu Douba, Ryuichi Kanbe
  • Patent number: 7134193
    Abstract: The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.
    Type: Grant
    Filed: December 29, 2004
    Date of Patent: November 14, 2006
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Kenji Sasaoka, Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Yoshizumi Sato, Koichiro Shibayama
  • Patent number: 7103961
    Abstract: An amorphous laminated core and a method of making an amorphous laminated core by punching core pieces from amorphous thin sheet material, laminating the plural sheets of core pieces, and forming caulking through-holes by punching. Rod shaped materials are directed into the caulking through-holes of the laminated core pieces.
    Type: Grant
    Filed: January 9, 2003
    Date of Patent: September 12, 2006
    Assignee: Mitsui High-tec, Inc.
    Inventor: Katsufusa Fujita
  • Patent number: 7103966
    Abstract: A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet 2? is removed from continuously arranged circuit patterns of a first PCB sheet 4a. After removal of the defective circuit pattern sheet 2?, the first PCB sheet 4a is position-located by means of a position locating means 12. Then the space which is formed by removing the defective circuit pattern sheet 2? is filled with a second PCB sheet 4b on which a good quality circuit pattern 2b is printed. Then the first PCB sheet 4a and the second PCB sheet 4b are coupled together by using an adhesive means 14.
    Type: Grant
    Filed: January 21, 2005
    Date of Patent: September 12, 2006
    Assignee: Samsung Electro-Mechanics Co., LTD
    Inventors: Bong Kyu Choi, Chun Ho Choi
  • Patent number: 7096914
    Abstract: In an embodiment of the invention an apparatus is configured to stack a plurality of semiconductor chips having the same or similar size. The apparatus includes a tape providing unit for providing an insulating adhesive tape, a tape attaching device for attaching the insulating adhesive tape to an area between electrode pads of a first chip, and a chip attaching device for attaching a second chip to the insulating adhesive tape.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: August 29, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-Kuk Kim, Min-Il Kim, Sang-Yeop Lee, Chang-Cheol Lee
  • Patent number: 7082675
    Abstract: In a method for manufacturing a solid core of laminations, a sheet metal web is cut in the longitudinal direction of the sheet metal web to produce at least two sheet metal strips. The sheet metal strips are separated in a direction transverse to the longitudinal direction of the sheet metal strips to form laminations. The laminations are joined to form a solid core. Joining can be carried out by welding, riveting, gluing or pressing.
    Type: Grant
    Filed: July 5, 2001
    Date of Patent: August 1, 2006
    Inventors: Eberhard Frölich, Siegfried Jauss
  • Patent number: 7076867
    Abstract: A pressurizing method for pressurizing a second component arranged on a first component, against the first component by using a pressurizing apparatus having a stage on which the first component is mounted, a tool, and a protection sheet supplying section. The tool is disposed so as to face the stage and moved between a first position at which the tool faces the first and second components while spaced therefrom, and a second position at which the tool is biased toward the stage to pressurize the second component against the first component. When the tool is at the second position, the protection sheet supplying section supplies a protection sheet so that the protection sheet is placed between the second component and the tool.
    Type: Grant
    Filed: December 24, 2002
    Date of Patent: July 18, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akihiro Yamamoto, Sakae Kobayashi, Yoshikazu Yoshimura, Naoto Hosotani, Kenji Takahashi, Hiroshi Nasu, Naomi Kaino, Hidenobu Nishikawa
  • Patent number: 7062841
    Abstract: A method of manufacturing a stack of interlocked laminations in a progressive die assembly having a choke. A strip of sheet stock material is provided and a plurality of laminations are stamped therein. Each of the laminations include at least one interlock feature and include first and second regions and a connecting section extending between the first and second regions. The laminations are separated from the sheet stock material and stacked in the choke with the first and second regions in a first orientation. The laminations are also interlocked substantially concurrently with the separation and stacking of the laminations. The interlocked stack of laminations is removed from the choke with the first and second regions in their first orientation. The stack is then formed into a second shape wherein the first and second regions have a second orientation and the connecting section therebetween has been deformed.
    Type: Grant
    Filed: October 8, 2002
    Date of Patent: June 20, 2006
    Assignee: L.H. Carbide Corporation
    Inventor: Thomas R Neuenschwander
  • Patent number: 7032293
    Abstract: A process for producing bundles of laminated sheet metal for magnet cores, wherein laminations are punched free along two longitudinal edges of a sheet metal strip, at least two sheet metal laminations of a magnet core are of a different width extending from one longitudinal edge to the other, and several laminations, which rest against each other, are connected with each other to form the bundle. To simplify the tool control, the two longitudinal edges of a lamination are punched in edge cutting stations, which are separate from each other and are arranged offset in the feed direction of the sheet metal strip. The edge cutting stations for cutting the longitudinal edges have a cutting die and an associated bottom die. The cutting die, together with the bottom die, is displaced for creating different laminate widths.
    Type: Grant
    Filed: January 9, 2003
    Date of Patent: April 25, 2006
    Assignee: Dr. Karl Bausch GmbH & Co. KG
    Inventor: Günther Bausch
  • Patent number: 7020948
    Abstract: The stacked core assembly apparatus, which can perform assembly at a high speed while keeping strength of an angle indexing apparatus, comprises a press machine 1, a non-synchronous transmitting apparatus 10 and an angle indexing apparatus 7. The non-synchronous transmitting apparatus 10 transforms a constant revolution of the press machine 1 into a variable revolution. The angle indexing apparatus 7 is connected to the non-synchronous transmitting apparatus 10 via a coupling device 20, and is connected to a rotatably stacking cavity device 51 of a press die 5.
    Type: Grant
    Filed: June 11, 2002
    Date of Patent: April 4, 2006
    Assignees: Yamada Dobby Co., Ltd., Minebea Co., Ltd.
    Inventors: Kuniyasu Shirai, Takuya Sato
  • Patent number: 7000664
    Abstract: A sheet supply section disposed along a transport way of a substrate feeds a sheet wound in a roll shape. A sheet cutting section cuts a sealing sheet to be set on the substrate from a fed portion of the sheet. A sheet set section including a transfer head of a vacuum suction type with a plurality of suction holes disposed therein reciprocates/moves the transfer head over a sheet receiving position in the sheet cutting section and a sheet covering position in the transport way. The sheet set section lowers the transfer head in the sheet receiving position, raises the transfer head at the sheet covering position. The transfer head attracts the sheet at the sheet-receiving position and does not attract the sheet at the sheet covering position the sheet covers the substrate.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: February 21, 2006
    Assignee: Kaneka Corporation
    Inventor: Yuzuru Kondoh
  • Patent number: 6915828
    Abstract: A punch apparatus for punching and laminating simultaneously a plural number of thin sheets is disclosed. This punch apparatus includes a punch provided on an upper portion of the punch apparatus, a die provided on a lower portion of the punch apparatus and used for punching a material to be processed, a stripper for guiding the punch during punching operation, a device for laminating punched materials using the punch as a laminating axis, a device for adjusting a relative position between the punch and the stripper when the upper and the lower portions of the punch apparatus are separated, and a device for adjusting a clearance between the die and the stripper during punching operation. The punch apparatus can open precisely almost straight very fine through-holes of a diameter of 100 ?m or less even in a sheet of thin, soft and deformable material.
    Type: Grant
    Filed: November 13, 2002
    Date of Patent: July 12, 2005
    Assignee: NGK Insulators, Ltd.
    Inventors: Yukihisa Takeuchi, Hiroyuki Tsuji, Kazumasa Kitamura, Yoshinori Yamaguchi, Satoshi Matsubayashi, Syusaku Kabe
  • Patent number: 6877214
    Abstract: A method of manufacturing a stack of interlock laminations and thereby shaping the stack of laminations into a desired shape. Each of the individual laminations is formed by a series of punching operations from sheet stock material. The laminations are blanked from the stock material, are stacked atop one another, and are interlocked in a choke. The laminations are thereafter repositioned to form the stack into a second shape. The stacking axis and the core axis may be either parallel or perpendicular to one another. The second shape of the core may be variable in that the second shape may be changed from time to time or may be continuously changed.
    Type: Grant
    Filed: November 5, 2002
    Date of Patent: April 12, 2005
    Assignee: L. H. Carbide Corporation
    Inventors: Thomas R. Neuenschwander, Steven D. Shane
  • Patent number: 6865801
    Abstract: The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.
    Type: Grant
    Filed: July 5, 2001
    Date of Patent: March 15, 2005
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kenji Sasaoka, Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Yoshizumi Sato, Koichiro Shibayama
  • Patent number: 6865797
    Abstract: Punchings for stator core laminations of a generator stator frame are disposed on a rotary table to form annular arrays of punching, with each layer staggered relative to adjacent layers. A mandrel is disposed at the center of the table and has fingers projecting radially for receiving the slots of the punchings to facilitate location of the punchings on the table and relative to one another. An annular cover is provided and disposed over the uppermost layer of punchings and clamped to the superposed sets of annular layers of punchings. The cover and punchings can then be removed from the table for disposition in the generator stator frame. The fingers on the mandrel are displaced vertically relative to the table as the height of the punchings on the table increases.
    Type: Grant
    Filed: July 16, 2002
    Date of Patent: March 15, 2005
    Assignee: General Electric Company
    Inventors: Steven Charles Walko, John Anthony Petti, Frank Joseph Zwack
  • Patent number: 6851176
    Abstract: The method makes it possible to form a stator of an electric motor by means of a multiple-slide press (21, 22, 23). The starting point is a bundle consisting of rectilinear segments of sheets obtained by stamping and welded. The stator is formed by means of four successive operations carried out by four groups of slides of a multiple-slide press and corresponding dies. The cylinder formed is subsequently welded along its joining generatrix and is calibrated in a hydraulic press.
    Type: Grant
    Filed: March 13, 2003
    Date of Patent: February 8, 2005
    Assignee: R. Bourgeois
    Inventor: Raymond Bourgeois
  • Patent number: 6817083
    Abstract: A processing device for an elongated workpiece defining a primary axis and further defining a first row and a second row of alignment holes, the first and second rows running parallel to the primary axis, is disclosed. The processing device includes a belt having a first protrusion configured to mate with an alignment hole from the first row to the exclusion of any alignment hole from the second row, and a tooling member having a second protrusion configured to mate with an alignment hole from the second row.
    Type: Grant
    Filed: May 8, 2003
    Date of Patent: November 16, 2004
    Assignee: Micron Technology, Inc.
    Inventor: Morley J. Weyerman
  • Publication number: 20040211057
    Abstract: Equipment for bonding a flexible printed circuit board made of thermoplastic resin on a printed circuit board includes a heater and a jig. The heater head presses and heats the flexible printed circuit board. The jig prevents the thermoplastic resin from flowing out when the flexible printed circuit is bonded on the printed circuit board. The jig is to be disposed between the flexible printed circuit board and the heater head. The jig includes a thin plate having a base plate and a wing plate. The base plate is parallel to a top surface of the heater head to be sandwiched between the flexible printed circuit board and the heater head. The wing plate is disposed on both sides of the base plate to bend from the base plate.
    Type: Application
    Filed: April 22, 2004
    Publication date: October 28, 2004
    Applicants: DENSO CORPORATION, DENSO WAVE INCORPORATED
    Inventors: Makoto Totani, Akinari Higashida
  • Patent number: 6796021
    Abstract: A stator core (20) and manufacturing frame (40) combination, a stator core plate punching member (30), and methods of rolling a core body (22) without risk of significant damage to the core body (22) are provided. The combination preferably includes a stator core (20) having a substantially cylindrical and elongate core body (22). The core body (22) preferably includes a plurality of plate punching members (30). Each of the plurality of plate punching members (30) has a substantially smooth outer surface (32). The combination also preferably includes a manufacturing frame (40) positioned to substantially underlie the core body (22). The frame (40) preferably includes a plurality of spaced-apart rollers (45) each positioned to contact the substantially smooth outer surface (32) of each of the plurality of place punching members (30).
    Type: Grant
    Filed: July 11, 2002
    Date of Patent: September 28, 2004
    Assignee: Siemens Westinghouse Power Corporation
    Inventor: Robert Fuller
  • Patent number: 6787966
    Abstract: A motor includes a permanent magnet unit at a circumference for providing a plurality of magnetic poles and a rotor disposed inside the circumference to be coaxial with the permanent magnet unit. Such a rotor is constituted of a center core, a plurality of coil cores disposed at the peripheral portions of the rotor and a plurality of concentrated coils respectively mounted on the coil cores. Each coil core is fitted to the center core by sliding along an axial direction of the center core.
    Type: Grant
    Filed: August 12, 2003
    Date of Patent: September 7, 2004
    Assignee: Denso Corporation
    Inventor: Shigeyuki Haga
  • Patent number: 6749422
    Abstract: Disclosed herein is a separable manifold of hot runners for metal molds of injection molding machines and a method of manufacturing the manifold. The manifold is designed to be separated into an upper plate and a lower plate while having a flow channel therebetween. The upper plate is assembled with the lower plate into a manifold after inserting a channel pipe covered with copper plates in the flow channel. Thus, the manifold of this invention is easy to manufacture. In addition, it is possible to easily grind the flow channel of the manifold so as to remove angled corners from the flow channel.
    Type: Grant
    Filed: June 13, 2002
    Date of Patent: June 15, 2004
    Assignee: Yudo Co. Ltd.
    Inventor: Young-Hee Yu
  • Patent number: 6745458
    Abstract: A method of manufacturing an elongate stack of interlocked laminae in a die assembly. The method includes the steps of stamping a first lamina having generally opposed first and second edges in the strip stock material, stamping at least one first interlock means for engaging another lamina in the first lamina, separating the first lamina from the strip stock material, placing the first lamina into the choke passageway, the first and second edges of the first lamina frictionally engaging the choke passageway, stamping a second lamina having first and second elongate edges in the strip stock material, stamping at least one second interlock means for engaging another lamina in the second lamina, at least partially engaging the first and second interlocking means, separating the second lamina from the strip stock material, placing the second lamina into the choke passageway, and frictionally engaging the choke passageway along the first and second elongate edges of only one of the first and second laminae.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: June 8, 2004
    Assignee: L.H. Carbide Corporation
    Inventor: Thomas R. Neuenschwander
  • Publication number: 20040106301
    Abstract: In a film lamination apparatus and method, there is no one-side contact of a pressing roller that presses a film to be laminated. The film is laminated using a rotatable pressing roller having a heater incorporated therein. The pressing roller is pressed onto the film placed on a semiconductor substrate while generating heat by the heater inside the pressing roller. The pressing roller is rolled on the film so as to laminate the film on the semiconductor substrate by partially heating the film by the pressing roller while moving the pressing roller.
    Type: Application
    Filed: November 24, 2003
    Publication date: June 3, 2004
    Applicant: FUJITSU LIMITED,
    Inventors: Kazuo Teshirogi, Yuzo Shimobeppu, Yoshiaki Shinjo
  • Patent number: 6742239
    Abstract: A progressive stamping die assembly apparatus and method in which strip stock material advances in a first direction through the apparatus and substantially simultaneously with the strip stock movement, a transversely moveable die station moves in opposite second and third directions substantially perpendicular to the first direction to one of a plurality of predetermined positions.
    Type: Grant
    Filed: October 1, 2002
    Date of Patent: June 1, 2004
    Assignee: L.H. Carbide Corporation
    Inventors: Barry Andrew Lee, Timothy L. Schrank
  • Patent number: 6732423
    Abstract: When ring components 4 of layers to assemble a laminated ring 3 are unloaded from a component storage facility 10, a computer 13 generates lamination combinatorial data representing a combination of ring components of layers. A target frequency distribution of circumferential length values of ring components 4 of each layer is established, and lamination combinatorial data including ring components of a class where an error of an actual inventory frequency with respect to a target frequency is large are selected in a layer where an error between the target frequency distribution and an actual inventory frequency distribution is maximum. Ring components 4 of all layers corresponding to the selected lamination combinatorial data are unloaded from the component storage facility 10.
    Type: Grant
    Filed: March 12, 2003
    Date of Patent: May 11, 2004
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Koji Saito, Yoshihiko Suzuki, Katsumune Inaki, Tetsuo Sugizono