Abstract: A number of embodiments of component pick up and mounting devices that include a plurality of pick up heads. The speed of the device is improved by providing sensing of the orientation of the components picked up by the pick up devices in a common sensing station. The device also includes means whereby one of the pick up devices may pick up a component large enough to interfere with the picking up of components by the other pick up devices by precluding the picking up of components by the other pick up devices when such a component is picked up by the one pick up device. The device further increases the speed by permitting pick up, recognition and correction of component orientation and mounting either simultaneously or operation of two or more of these functions at the same time on different pick up devices.

Abstract: Electronic component packaging case comprising a substantially plate-like body having a substantially spiral passageway formed in its interior, a linear passageway formed therein as a continuation of an outermost circular portion of the sapiral passageway, an outlet formed therein as a continuation of the linear passageway to communicate with the exterior of the body, a plurality of electronic components received in a row in the spiral passageway, and a plurality of air-intakes for facilitating forwarding of the electronic components along the spiral passageway to the outlet, the air-intakes being formed in the casing body in a manner to communicate between respective circular portions of the spiral passageway and the exterior of the casing body, the case being adapted to be supported on a base of an electronic component supply mechanism with the body standing on the base when the case is used as an electronic component supply source, the outlet being formed at a portion of the casing body which is located at

Abstract: A wiring distribution system including connectors, tools, and methods is provided for building wiring. The mechanical and electrical interconnection is performed to the individual connector components in a crimping operation to the individual wires after removal of the outer covering. Using panels with apertures for accepting interchangeable connectors reduces the layers of connecting panels used between a wallplate and a computer.

Abstract: The invention relates to mounting components having angled terminals, in particular connectors, on a printed circuit card. The mounting apparatus comprises a guide part for guiding the ends of the angled terminals. This part is in the form of a comb having teeth that delimit slots through which the terminals pass. The teeth are provided with orifices in alignment along a Y direction perpendicular to the X direction of the teeth. The orifices are designed to receive rods on a temporary basis.

Abstract: A system of machining lead frames (7), such as punching, cutting and bending of the leads consists of a number of machining devices (1, 2, 3) placed in series. Transport means (8) are provided for transporting the lead frames between the successive machining device. Each device comprises means for transporting the lead frames in horizontal and vertical direction, a tool carrier driving means for driving the tool carrier (18). Further, a control device (4) is provided for controlling, synchronizing and protecting the operation of the machining devices. The machining devices are purely mechanically driven and the system is a device on a modular basis.

Abstract: A method and a device for loading an adapter for a printed circuit board testing device with adapter pins having head ends and contact ends. The adapter pins to be loaded into the adapter are transferred by gravity from at least one main magazine, with their head ends first, into an intermediate magazine. Also, the adapter pins that have been transferred into the intermediate magazine are then transferred by gravity with the contact ends first into the adapter. For simpler and more rapid loading of the adapter with minimal constructional outlay, the adapter pins are transferred from the main magazine head first into the intermediate magazine.

Abstract: A method and an apparatus for smoothly and securely inserting a terminal connected to an electric wire into a terminal accommodating chamber within a connector housing from an opening in a notched rear end portion of the housing. The housing has an interior divided by partition walls into a plurality of terminal accommodating chambers each having a rear end defining an opening through which the terminal can be inserted, a notched shoulder portion formed in each partition wall at at least one of joints between the partition wall and top and bottom walls of the housing, and a terminal retaining cover capable of opening away from and closing onto the notched shoulder portions. A guide wall capable of engaging with the notched shoulder portions when the terminal retaining cover is open, thereby defining a flame-shaped terminal insertion opening, allows the terminal to be inserted through the terminal insertion opening.

Abstract: First and second aligning portions each having a plurality of parallel downwardly sloped grooves, are inclinedly arranged to communicate with a chip box containing a plurality of chip parts at random. The chip box and the first aligning portion are supplied with vibration, to serially align the chip parts in the grooves of the first aligning portion. The chip parts are then received in the grooves of the second aligning portion. The first of the chip parts thus received in the second aligning portion are received in a plurality of receiving cavities provided in a separable portion respectively, so that the chip parts received in the receiving cavities are simultaneously discharged by a suction chuck.

Abstract: Generally planar component carrier plates and loading plates include a framework having a perimeter portion and an interior portion having an array of component passageways. A resilient layer is positioned parallel to the interior portion and is provided with component apertures collinear with corresponding component passageways for resiliently gripping components. The component carrier and loading plates are non-rectangular, and have three or more axes of symmetry in the plane of the framework. Component carrier and loading plates are also provided with handling and alignment bores and recesses.

Abstract: An apparatus and method for simultaneously mounting lead strip segments onto each side of a rectangular ceramic substrate. Four lead strip mounting assemblies are equally spaced 90 degrees apart around a central vertically oriented substrate support so that each assembly is perpendicular an edge of a substrate on the support. Lead strip feed assemblies located adjacent each mounting assemblies cuts lead strip segments and feeds the lead strip segments into the mounting assemblies. The four mounting assemblies simultaneously mount the lead strip segments on the substrate.

Abstract: A work mounting apparatus according to the present invention comprises a rotating drum divided into upper and lower drums, a head unit arranged on the outer periphery of the rotating drum or the lower drum, a circular work head attached to the head unit, and a suction nozzle protruding from the outer peripheral surface of the work head toward a workbench. While the lower drum is rotating, the suction nozzle of the work head repeats cycloid motion along the workbench with its posture or orientation kept fixed with respect to the workbench. While repeating the cycloid motion, the nozzle receives a work from a work feeder of the workbench by suction, and mounts the work on a printed board on the workbench. The work mounting apparatus further includes a balance weight for the work head, and a friction brake for applying a frictional force to the turning shaft of the work head, to thereby stabilize the turning motion of the work head.

Abstract: An alignment fixture for use in sealing integrated circuit packages including a body having rectangular alignment cavities therein for receiving components of integrated circuit packages. The body is inclined at an angle relative to a horizontal reference plane. The rectangular alignment cavities are rotated at 451/2 angle relative to a longitudinal axis of the body.

Abstract: In an of electronic components mounting apparatus pick-and-place heads are rotated for indexing along a rotary head to pick up electronic components of an electronic components feeding device and the components are mounted on a circuit board, which is positioned on an X-Y table. A moving base is moved in lateral direction, and the components placed on feeders are supplied to the pick-and-place heads. The moving base is divided into a feeding area and retreat areas, and accommodating areas for accommodating tables are provided near the retreat areas to move the tables reciprocatively between the retreat areas and the feeding areas. The tables hindering this movement are accommodated in the accommodating areas. Therefore, only a desired table is positioned in the feeding area. By moving this table at high speed, the electronic components can be supplied to the pick-and-place heads. When there is no more electronic component on a feeder, the feeder can be exchanged in the accommodating area.

Abstract: A press for assembling an electrical connector (C) having tines (T) projecting therefrom, to a printed circuit board (PCB), comprises a press ram (40) which is pivotally mounted to the top of the forward end of a press frame (16). A ram (40) has, at its forward end, a connector holder (54) for receiving a connector (C) with the tines (T) of the connector (C) projecting from the holder (54). A ram (40) has a raised, connector loading position, in which the connector holder (54) projects obliquely downwardly towards the operator so that the operator can easily load the connector (C), which may be of microminiature size, into the holder (54). The ram (40) has a drive unit (36) for driving it from its loading position into a vertical position, in which the holder (54) projects towards a printed circuit board (PCB) on a support structure (14).

Abstract: An assembling position-adjusting mechanism of a magnetic disk apparatus able to adjust the azimuth, radial alignment, and index of a magnetic head by adjusting a position thereof during the assembling process of a spindle motor. A positioning head movable in a direction perpendicular to a top surface of a table is provided. A plurality of positioning pins are provided on the bottom of the positioning head. Moving mechanisms are provided in the positioning head so that the bottom surface of the positioning head is movable and rotatable parallel to the top surface of the table. Each positioning pin of the positioning head is inserted into a respective positioning hole of a motor assembly so as to move the motor assembly with a movement of the positioning head so that the spindle motor of the motor assembly is at an appropriate position relative to the magnetic head of the main body of the magnetic disk apparatus.

Abstract: A cable guide block has a guide groove for receiving and guiding an end portion of a cable having an elastically deformable sheath. The guide block is for use in a cable connection processing apparatus for making a cable connection by moving a cable pusher in a direction perpendicular to the guide groove and in a cable receiving direction in order to press the end portion of the cable onto a cable connection portion of a contact disposed below the guide groove. The guide groove has a pair of wall surfaces which are spaced apart by a distance which is greater than a diameter of the cable. At least one projection is formed on at least one of the wall surfaces so that the distance between the wall surfaces is less than the diameter of the cable. By the use of the cable guide block, the end portion of the cable is reliably sent along the cable receiving direction and inserted into the guide groove. The end portion of the cable is forced against the positioning projection in an elastically deformed condition.

Abstract: A tray and electronic supplying apparatus comprising a tray feeder for feeding a tray containing electronic parts; and an electronic parts feeder for transferring electronic parts in the tray, both the tray feeder and the electronic parts feeder being adjacent to a chip mounter and arranged in a board transferring line.

Abstract: A mounting apparatus for attaining a tolerance-insensitive connection of a conductor track foil with contact pins of an electrical component. The conductor track foil includes two insulating layers with an intervening conducting layer with lands in the upper layer for soldering the conductive layer to the contact pins of the electrical component. The conductor track foil is lowered, positionally correctly, onto the electrical component by use of a mounting device. The bottom insulating layer and the conducting layer of the soldering lands, which are free of an insulating layer on the top, are pierced by the contact pins extending at right angles to the conductor track foil. The conductor track foil is released by the mounting apparatus. A soldered connection is made between the lands and the contact pins. As a result, an electrically reliably gap free conducting connection is attainable even if the contact pins are eccentrically associated with the soldering lands.

Abstract: A tape automated bonding feeder apparatus employs a vertical carrier extraction unit to successively supply electronic circuit components to an output station from which a component is seized for placement and attachment to a circuit board. The feeder apparatus, which may be mounted on a rollable cart, includes a generally rectilinear housing on a top plate of which one or more magazines are mounted. A magazine contains a stack of circuit component carriers. The bottom of the magazine has a carrier extraction unit which controllably allows an individual component carrier at the bottom of the stack to drop away onto an underlying carrier shuttle. The carrier shuttle is supported for movement between the magazine and a lead forming unit. The lead forming unit detaches a component from the carrier and forms the leads of the excised component for mounting the component to a circuit board.

Abstract: Apparatus for taking a plurality of terminals arranged in a first spatial configuration, and rearranging them into a second spatial configuration for insertion into a stator or other electrical component, is provided. The apparatus includes a plurality of tubes, one for each terminal, which convey the terminals to new locations and, if necessary, twist along the way to change the orientations of the terminals.

Abstract: A method and apparatus for forming and attaching a preform to a metallic workpiece, particularly an epoxy preform for use in electronic packages. The epoxy preform is stamped from a strip and maintained in an upper die assembly. The metallic workpiece is indexed underneath the upper die assembly whereupon the epoxy preform is deposited onto the metallic workpiece and the metallic workpiece removed from underneath the upper die assembly.

Abstract: A light emitting diode has both end faces metallized and is mounted on a substrate with the light emitting junction perpendicular to the substrate. The electrically conductive ends are electrically bonded to conductive areas on the substrate by solder or conductive adhesive LED dice can be placed on the substrate by temporarily attaching the dice to a tape which has been wrapped around a knife edge. The dice tilt as the tape wraps around the edge and are picked off one at a time by a vacuum collet while temporarily supported by a movable finger, and then transferred by the vacuum collet to a substrate. A similar method may be used for placing semiconductor dice on a substrate without the tilting of dice around the edge. In another embodiment, an array of LEDs can be assembled in windows through a metallized plastic tape which is bonded to a foundation with additional metallized leads.

Abstract: A method of packaging each of chips on a substrate within each of different cycle time periods through a packaging device driven by a motor, the packaging device being arranged to pick up the chip and carrying it to the substrate for the packaging, the method comprises the step of gradually decreasing a rotational speed of the motor when the cycle time period is changed to be longer and gradually increasing the rotational speed of the motor when the cycle time period is changed to be shorter. This method can package chips at a high speed on the substrate without increasing the capacity of the motor.

Abstract: A method for producing relative motion on multiple articles by providing a tray with cavities, locating each article in a separate cavity and banking all articles against a similar cavity wall without tilting the tray, movement of the articles being generated by placing the tray between a horizontal vibration device and at least one cooperating bumper, the vibrations having an amplitude decreasing with time according to a predetermined decay envelope.

Abstract: A substrate supply apparatus includes a substrate-accommodating section for accommodating a substrate on which electronic components are to be mounted, a substrate-width-adjusting device, a transporting device, a substrate-sucking device, and an elevating device. The accommodating section has substrate-width-regulating sections a distance between which can be adjusted in a width direction of the substrate. The adjusting device adjusts the distance between the regulating sections by moving one of the regulating sections in the width direction. The transporting device is supported by the regulating sections, has a pair of rails, is arranged above the accommodating section, and transports the substrate to an electronic component-mounting apparatus. The sucking device has a long substrate-sucking arm and a plurality of short substrate-sucking arms. Each of the substrate-sucking short arms is position-changeably installed on the long substrate-sucking arm.

Abstract: A tool bank is located in the path of a populated printed circuit board to minimize the travel required for tool tip changing. Prior to removal of the populated printed circuit board, the tool bank is displaced below the printed circuit.

Abstract: An electronic component mounting apparatus includes a table for feeding in and out a printed circuit board and holding the board thereon, a supply section for supplying an electronic component, a head portion for suctioning the component thereto and mounting the component on the board, an XY-robot for placing the head portion at an arbitrary position, a suction device for suctioning the component thereto, arranged at the head portion and vertically moving with respect to the head portion, and having a function of placing the component in a rotational direction thereof, a recognizing camera for recognizing the component and measuring an error amount of a position of the component before and after correction of the position of the component, and a controller for controlling the head portion, the XY-robot, and the camera.

Abstract: A guidance type placement apparatus for placing and mounting integrated circuit (IC) components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus includes a mechanical positioning subsystem, an image acquisition/processing subsystem, a master control subsystem, and optionally, a heater array subsystem. The mechanical positioning subsystem is sequentially operative to position the circuit board and IC device for the generation of images thereof, to align the IC device with a designated placement site on the board, and to mount the IC device in aligned combination with the board. The image acquisition subsystem is operative to generate images of at least one pair of diagonally opposed corners of the placement site and IC device from the same optical perspective. Images generated by the image acquisition subsystem provide feedback control to regulate the placement process to attain and verify lead-to-pad alignment.

Abstract: A press machine comprises a holding plate provided with a number of receiving holes at constant arrangement pitches and a pin head having a number of press pins at the same arrangement pitches as the receiving holes. A portion provided with the receiving holes is in the form of a square, while a portion provided with the press pins is also in the form of a square, which has a width identical to that of the portion provided with the receiving holes and a depth half that of the portion provided with the receiving holes. The holding plate is placed on a movable table, which in turn is moved to a first working position to insert a first group of chip type electronic components into the receiving holes provided in a first half region of the holding plate by the press pins, and then moved to a second working position to press a second group of chip type electronic components into the receiving holes provided in a second half region of the holding plate by the press pins.

Abstract: An apparatus is described for individually inserting successive components of a series of components having mounting legs by movement of the components along an insertion direction to introduce the mounting legs into holes in a substrate at an insertion station. The apparatus includes a guide for guiding a strip of components along a feedpath generally normal to the insertion direction with the mounting legs oriented in the direction of the substrate surface. The strip is advanced stepwise after each insertion operation to position the next successive components of the strip at the insertion station. The carrier web between a components to be inserted and the next successive upstream component is centered relative to a web shearing line, a first cutting element at the insertion station being arranged for abutment against a carrier edge or line proximate to the mounting legs for preventing movement of that portion of the carrier web upstream of the shearing line in the insertion direction.

Abstract: Disposable tools for locating a power receptacle or a power pin within the corresponding port therefor in a header housing are disclosed. The tool for positioning a receptacle within a port includes a base having a positioning contour and a plug having an axis therethrough extending from the base. The plug is sized such that when the positioning contour on the base is engaged against at least two opposed lead-in surfaces about the port the plug extends into the barrel of the first receptacle to align the axis of the same with the axis of the port. The tool for positioning a pin within a port includes a sleeve having a central bore extending therethrough and an outer positioning surface thereon. The power pin is receivable in and retainable by the sleeve. The sleeve is sized such that when the positioning surface thereon engages against at least two opposed surfaces of the port the axis of the pin is retained in a predetermined relationship with the housing.

Abstract: An apparatus for automatic equipping of printed circuit boards with components includes at least two conveying elements arranged at a distance relative to one another along an endless drive. The conveying elements, which are preferably nipper-shaped grabbers, take the components from delivery devices in retrieving positions and conveys them to a transfer position at which they are transferred to an equipping head. The distances between the conveying elements on the endless drive is such that every retrieving position and every transfer position is approached independently of one another under the control of a programmed controller. Stretching of the endless drive, thus, does not deteriorate the exact approach of the retrieving positions and transfer positions.

Abstract: In case of inserting an IC having multiple pins into an IC socket so as to be brought into contact with the IC socket, a contact pressure application unit is integrated with the IC socket, whereby the IC is inserted into and brought into contact with the IC socket without bending a lead of the IC. An IC contact mechanism comprises a contact pressure application unit having a through hole at the center thereof, the contact pressure application unit also having a mold guide portion so as to contact an outer periphery of a package of an IC and a lead presser portion for pressing a lead of the IC; and a suction block having a suction pad at the tip end thereof and movable vertically in the through hole of the contact pressure application unit characterized in that the IC is inserted into a contact socket so as to be brought into contact with the contact socket while the suction pad sucks the IC.

Abstract: A method for assembling a wire harness and an apparatus for carrying out the method. Main wires serving as the main line of the wire harness are arranged horizontally and in parallel with each other. A required portion of each main wire held by a cover installed at the leading end portion of a rod is dropped to a predetermined lower position so as to obtain a branch wire. The cover holding the branch wire is inserted into a terminal-accommodating chamber of a connector disposed at a lower position so as to connect the connector with the branch wire. Then, the rod formed on the cover is removed therefrom by moving the rod upwardly. The covers, which are spaced apart from each other, are made to be close to each other to insert them into the connector. A cutter mounted on the connector jig accommodating the connector cuts unnecessary wires connected with the connector.

Abstract: An electronic parts mounting method for taking out from a parts supply device having a plurality of electronic parts at least one of the electronic parts, and mounting the part at a predetermined position of a substrate to be manufactured, includes steps of storing quantity of parts, which is held by each parts supply device, in a storing section provided in each parts supply device, rewriting the quantity of parts according to number of parts taken out from the parts supply device by a calculating section provided in each parts supply device, reading out an initial value of the quantity of parts held by each parts supply device, by a control section provided in an electronic parts mounting machine, calculating one of the quantity of parts required for the substrate and period of time required for mounting the part on the substrate by a calculating section provided in the electronic parts mounting machine, and carrying out, in advance, a parts shortage advance notification in each parts supply device based on

Abstract: An assembling apparatus includes a mounting table on which a printed circuit board is supported by back-up pins held on a base plate. The mounting table is movable in an X direction and a mounting head for mounting electronic parts on the printed circuit board is movable in a Y direction. A back-up pin stocker is provided in the vicinity of the base plate, which stores spare back-up pins being not used. A replacing unit is provided attached to the mounting head to be movable between the base plate and the back-up pin stocker together with the mounting head so that the back-up pins held on the base plate can be replaced with the back-up pins stored in the back-up pin stocker on the basis of data representative of the type of a printed circuit board, etc. by the replacing unit when the printed circuit board to be assembled is changed.

Abstract: Conductor feeding apparatus for selectively feeding conductors selected from a group or from feeding all of the conductors in the group comprises first and second clamping assemblies which are moveable towards and away from each other between remote and proximate positions. Each clamping assembly has a clamp for each one of the conductors. When it is desired to feed selected conductors, the selected conductors are clamped in the first clamping assembly and the non-selected conductors are clamped in the second clamping assembly. The second clamping assembly is moved towards the first clamping assembly so that the ends of the selected conductors project beyond the second clamping assembly. The projecting ends are gripped in a conductor puller and pulled along the feed paths.

Abstract: A circuit assembly robot has one component grasping mechanism, whereby it is possible to reduce manufacturing costs and increase the ease of manufacture in comparison with the prior art. The component grasping mechanism is pivotable in a vertical plane, whereby it is possible to decrease operation time.

Abstract: A tool (10) and a jig (70) include intermating surfaces to facilitate mounting of the jig in reverse relationship to facilitate wiring of different sizes of connectors (160) having top and bottom rows of terminals (176, 177) with the jig having projections (100-114) precisely positioning terminals and connectors relative to index projections (74) which engage index means (60) on the tool and clamp means to hold cable (140) and wire in appropriate positions for different connectors and a wedge shaped adjustment (42) affixed to the tool to vary inserter movement for different size wires.

Abstract: A manipulating apparatus includes a first linear axis element (X), comprising two parallel individual axis elements (20a, 20b). The first linear axis element (X) includes a double slider (25, 27). The double slider runs on the profiles of the two individual axis elements (20a, 20b). The double slider is coupled with a drive means of the one individual axis element and runs without drive means on the profile of the other individual axis element. This manipulating apparatus permits the largest possible number of motion possibilities and motion processes along several coordinate directions within a smallest possible space.

Abstract: A hand-operated device for the precise positioning of electronic components on a printed circuit board (PCB) to assist in the assembly, repair or rework of PCB's. The device has a base ring with three adjustable-length legs which rest on or straddle the PCB. An x-ring is slidably mounted to the base ring and is moved in the direction of the x-axis by an actuator. A y-ring is slidably mounted to the x-ring and is moved in the direction of the y-axis by an actuator. A .theta.-ring is removably mounted on the y-ring and can rotate about the z-axis. A hub, which houses the z-actuator, is supported within the .theta.-ring by one or more arms. A grasping device, such as a vacuum gripper, is mounted on the z-actuator. In use, the device is positioned over a bonding site on the PCB, and the z-.theta. assembly is lifted off of the x-y base. An electronic component, such as an integrated circuit (IC), is picked up with the vacuum gripper and the z-.theta. assembly is replaced on the x-y base.

Abstract: A header assembly includes an insulating block having a given thickness and a plurality of pin-receiving passages therethrough. A plurality of terminal pins are received in the passages and project from the insulator block for insertion into holes in a printed circuit board and for solder connection to circuit traces on the circuit board. The terminal pins are interference-fit in the passages in the insulator block to allow the block to be slid off the pins after soldering to the printed circuit board. The area of the inference-fit between the terminal pins and the pin-receiving passages is less than the thickness of the insulator block to reduce the amount of force required to slide the block off of the pins while affording the block to be of a substantial thickness. The pin-receiving passages are provided with chamfered mouths to facilitate insertion of terminal pins into the passages.

Abstract: An electrical component placing apparatus is provided which includes a support body; a first table mounted on the support body; a rotary head which undergoes indexed rotation and includes a pick and place head; an X-Y table which moves a printed circuit board in X-Y directions; a second table mounted on the support body and including an electrical component placing portion; an electrical component supplying device mounted on the second table; and an assembly for laterally reciprocatingly moving the first and second tables independently of one another relative to the support body. The electrical component supplying unit includes a tray supplying unit having at least one tray for containing an electrical component and a sub pick and place head for picking up the electrical component contained in the tray and placing it onto the placing portion of the second table.

Abstract: An open topped carrier (2) has a space (6) dimensioned to receive a plurality of coiled wire segments (100) hung on hangers (26) carried by upper portions of dividers (22). The dividers (22) are held in vertical, horizontally spaced use positions by slots (12) formed on the inner wall surfaces of the carrier (2). Each divider (22) may be independently grasped and slid into an elevated use position to facilitate hanging the coiled segment (100) on the hanger (26). A clamping device (32) extends along each of opposite side portions of an upper flange (14) of the carrier (2). The ends (102) of each segment (100) are clamped in an accessible transport position by the clamping device (32). The carrier (2) may have portions to facilitate handling of the segment ends (102) by an operator and/or an indicator bar (58) with a plurality of lights (62) aligned with the segment ends (102) for a human operator.

Abstract: An apparatus and method for loading integrated circuit packages into package carriers is disclosed. Featured is a pick-and-place mechanism mounted on a tiltable table. Packages and carriers slide toward the pick-and-place mechanism under the influence of gravity. The pick-and-place mechanism combines the packages with carriers. The package/carrier combinations then slide away from the pick-and-place mechanism.

Abstract: The production system comprises a lift and carry device (6) and a handling unit (9) each actuated by an electric motor (13, 14), the two motors being synchronized.The rectangular walking beam lift and carry cycle of the products (1) is perfected by modulation of the speeds limiting the impacts exerted on the product. The vertical movement (M1-M2; M3-M4) of the movable walking beam support (11) present an intermediate low-speed phase corresponding to contact or placing of the product to limit impacts.

Abstract: A modular connector press for terminating different types of connectors to a flat cable includes left and right cable tray assemblies that are mounted for accurately positioning and laterally translating the cable in a first direction transverse to the axial direction of the cable between a loading position for initial positioning of the cable and a termination position where the cable is positioned beneath a press ram. Each tray assembly includes a main body, a cable tray and means for mounting the cable tray to the main body to allow adjustable translation of the cable tray in a second direction transverse to the first direction of translation of the tray assembly means. Each cable tray includes a plurality of connector positioning slots allowing the accurate positioning of terminated connectors of a harness on each cable tray.

Abstract: An electronic part mounting apparatus wherein an original orientation position of a nozzle can be restored accurately at a high speed with a simplified structure includes an index table supported for rotation around a first axis, and a nozzle mechanism carried on the index table and having a nozzle. The nozzle mechanism includes an original orientation returning gear mounted for rotation around a second axis on the index table for returning the nozzle to a predetermined original orientation position.

Abstract: A wire spreading unit (6) for a harness making machine which is longitudinally moveable from a position proximate to a wire feed mechanism, where it picks up individual wires for the harness, to a position remote from the wire feed mechanism where it is aligned with a pitch setting station (8) which sets the pitch between individual gripper members (38) in the wire gripping mechanism (6). The pitch setting station (8) has a plurality of settings which are obtainable, through the use of machine balls (166) which sets stop rods (152) to various settings. When the desired setting is obtained, the rods (102) are moved against the stop rods (152) into an abutting relation, to set the wire grippers (38), and the wires which they carry, into their respective spacings.

Abstract: Connector loading apparatus which can be used with a cable-making machine comprises a support surface having a transfer mechanism thereon which comprises a transfer slide assembly that is reciprocable between a magazine containing a stack of connectors and a loading station. The slide assembly comprises a body portion and a connector holder which is pivoted to the body portion on an axis which extends transversely of the path of reciprocation. The support surface is discontinuous in the vicinity of the loading station so that the connector holder pivots through an angle of 90 degrees at the loading station under the influence of gravity and the connector is thereby reoriented and properly positioned for loading into the module or other connector receiving portion of the cable-making machine.