Including Fluid Evacuating Or Pressurizing Patents (Class 29/870)
  • Patent number: 9009962
    Abstract: In a stamping step, when a stamping terminal piece formed as a connector terminal is stamped, an electric wire crimping part is stamped and extended from a chain part in a direction perpendicular to a feeding direction, an electric contact part is stamped and extended from the electric wire crimping part in a direction parallel to the feeding direction and a range to which a gold plating is applied by a gold plating step is not overlapped on a range to which a tin plating is applied by a tin plating step in the feeding direction.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: April 21, 2015
    Assignees: Yazaki Corporation, Honda Motor Co., Ltd.
    Inventors: Naoto Sugie, Tomoyuki Miyakawa, Kazuto Ohtaka, Hideki Homma, Tetsuya Mitani, Masaru Shinmura
  • Patent number: 8763246
    Abstract: Provided is an optical fiber connection method for using an optical fiber connector which includes a mechanical splice designed to connect a first optical fiber having a coating diameter D to mechanically connect two optical fibers that include a second optical fiber having a coating diameter d smaller than the coating diameter D. This method includes a first step of inserting the second optical fiber into a tube (30) to obtain a tubed optical fiber (31); a second step of fixing the tubed optical fiber (31) in a fiber holder (15); a third step of inserting the tubed optical fiber (31) into the mechanical splice (2) and placing distal ends of the two optical fibers including the tubed optical fiber (31) end to end; and a fourth step of fixing the tubed optical fiber (31) in the mechanical splice (2) in a state in which the distal ends of the two optical fibers are placed end to end.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: July 1, 2014
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Daizo Nishioka, Yukihiro Yokomachi
  • Patent number: 8656586
    Abstract: A method for enhancing the dielectric properties of an electrical cable segment having a central stranded conductor encased in a polymeric insulation jacket and an interstitial void volume in the region of the conductor, including filling the interstitial void volume with a dielectric property-enhancing fluid at a pressure below the elastic limit of the polymeric insulation jacket, and confining the fluid within the interstitial void volume at a residual pressure greater than about 50 psig, with the pressure being imposed along the entire length of the segment but below the elastic limit of the polymeric insulation jacket. Preferably, the residual pressure is sufficient to expand the interstitial void volume along the entire length of the cable segment by at least 5%.
    Type: Grant
    Filed: January 9, 2012
    Date of Patent: February 25, 2014
    Assignee: Novinium, Inc.
    Inventors: Glen John Bertini, Anthony Roy Theimer
  • Patent number: 8586866
    Abstract: A method for coupling ends of two insulated conductors includes coupling an end portion of a core of a first insulated conductor to an end portion of a core of a second insulated conductor. At least a part of the end portions of the cores are at least partially exposed. Electrically insulating material is placed over the exposed portions of the cores. An inner sleeve is placed over end portions of the two insulated conductors to be coupled. An outer sleeve is placed over the inner sleeve. There is an open volume between the inner sleeve and the outer sleeve. The inner sleeve and the outer sleeve are coupled to jackets of the insulated conductors. A pressurized fluid is provided into the open volume between the inner sleeve and the outer sleeve to compress the inner sleeve into the electrically insulating material and compact the electrically insulating material.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: November 19, 2013
    Assignee: Shell Oil Company
    Inventors: Charles D'Angelo, III, Ryan Michael Gonsoulin, David Joh Tilley
  • Patent number: 8429812
    Abstract: A manufacturing method of an ultrafine wire including a conductor formed from a plurality of wire, the method comprising: twisting three wires into a twisted wires; and forming the conductor by compressing the twisted wires through a compressing hole of a compressing die after the twisting. A ratio of a cross section of the conductor after compressing to an area of the compressing hole is 80% to 83%.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: April 30, 2013
    Assignee: Yazaki Corporation
    Inventors: Satoru Yoshinaga, Toshiyuki Yamada, Takanori Suzuki
  • Patent number: 8176620
    Abstract: A composite superconducting wire and a method of manufacturing the wire is disclosed. Nano-particle dispersion strengthened copper is co-drawn with Niobium rod to produce DSC-1Nb wire. n numbers of DSC-1Nb wires are then stacked in a hollow DSC tube and drawn to form a DSC-n.Nb hexagonal wire. In a separate preliminary process, Tin rod is co-deformed with Copper tube to form a Cu-1Sn wire. m DSC-n Nb wires and 1 Cu-1Sn wires are then wrapped by Niobium foil and placed into a Copper tube. This entire assembly is then drawn to a finished size. The drawn composite is then subjected to heat treatment with a final stage at 650-700° C. for about 100 hours or longer. The new wire has higher electric critical current and higher mechanical strength than the controlled conventional ones.
    Type: Grant
    Filed: December 6, 2007
    Date of Patent: May 15, 2012
    Assignee: Florida State University Research Foundation
    Inventors: Jingping Chen, Ke Han, Peter N. Kalu, William Markiewicz
  • Patent number: 8110011
    Abstract: A high voltage capacitor design is provided that provides improved performance. The high voltage capacitor includes a stack of mechanically bonded capacitor cells, which in one variant utilize a separator formed of two layers of paper. In one version, the high voltage capacitor may be used as a capacitative voltage divider.
    Type: Grant
    Filed: December 19, 2007
    Date of Patent: February 7, 2012
    Assignee: Maxwell Technologies, Inc.
    Inventors: Joseph Bulliard, Eric Pasquier
  • Patent number: 8037599
    Abstract: The invention relates to a method for removing a cable core from a cable sheath, which cable core comprises an envelope (8), wherein, at an end of the cable (1), a flowable medium (22) is introduced under pressure into the cable tube (9) so as to reduce friction, and a tensile force (F) is exerted on the cable core at an end (5) of the cable (1). To provide a method by which existing cables can be freed from their core in as quick and inexpensive a manner as possible, it is provided for the flowable medium to be introduced precisely targeted into the annular space between the inner side of the cable sheath and the envelope (8) of the cable core.
    Type: Grant
    Filed: October 15, 2010
    Date of Patent: October 18, 2011
    Inventor: Alois Pichler
  • Patent number: 7814654
    Abstract: The invention relates to a method for removing a cable core from a cable sheath, which cable core comprises an envelope (8), wherein, at an end of the cable (1), a flowable medium (22) is introduced under pressure into the cable tube (9) so as to reduce friction, and a tensile force (F) is exerted on the cable core at an end (5) of the cable (1). To provide a method by which existing cables can be freed from their core in as quick and inexpensive a manner as possible, it is provided for the flowable medium to be introduced precisely targeted into the annular space between the inner side of the cable sheath and the envelope (8) of the cable core.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: October 19, 2010
    Inventor: Alois Pichler
  • Patent number: 7478475
    Abstract: A blindmate interconnect coaxial connector includes a center conductor, a thermally-conductive dielectric surrounding the center conductor, and an outer tubular conductor surrounding the dielectric. The dielectric transfers heat from the center conductor to the outer conductor, and the outer conductor includes heat transfer fins to radiate such heat. The center conductor is formed by first and second halves which mate within the axial bore of the dielectric. The outer conductor is formed of two mating sections. The center conductor and surrounding dielectric are inserted within the first mating section, and the second mating section is then mated with the first section to complete the assembly of the connector.
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: January 20, 2009
    Assignee: Corning Gilbert Inc.
    Inventor: Richard D. Hall
  • Patent number: 7032310
    Abstract: A method of installing a socket with a socket contact on an underwater plug with a plug contact is provided so as to establish conductive contact between the socket contact and the plug contact. The socket is disconnectably attached to a recoverable fluid exchange unit and the socket engages with the plug to establish the conductive contact between the socket contact and plug contact. The recoverable fluid exchange unit is then operated to substantially replace a first fluid within the socket with a second fluid from the recoverable fluid exchange unit.
    Type: Grant
    Filed: July 28, 2000
    Date of Patent: April 25, 2006
    Assignee: Alpha Thames Ltd.
    Inventors: David Eric Appleford, Brian William Lane, Benjamin McGeever
  • Patent number: 7024768
    Abstract: In one embodiment, a fluid ejection device comprises a substrate having a first surface, and a fluid slot in the first surface. The device further comprises a fluid ejector formed over the first surface of the substrate, and a chamber layer formed over the first surface of the substrate. The chamber layer defines a chamber about the fluid ejector, wherein fluid flows from the fluid slot towards the to be ejected therefrom. The chamber layer has a discontinuity, wherein the discontinuity is positioned over the fluid slot.
    Type: Grant
    Filed: December 21, 2002
    Date of Patent: April 11, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Manish Giri, Philip H. Harding, Mark Sanders Taylor, Jeffery S. Hess
  • Patent number: 6981308
    Abstract: A rotating electric machine (1) has a rotor, a stator (2), and stator windings (3, 4). The windings (3, 4) include high voltage cable drawn through slots (5, 6) in the stator (2). Support members (8) are arranged inside the slots (5, 6) along and in contact with the windings (3, 4), said support members (8) comprising a hose (8?) with a substantially triangular cross-section. A wire (9) is extending through and being attached to each support member (8). When mounting the support members (8) air inside a support member (8) is evacuated in order to shrink the support member (8). Then the wire (9) extending through the support member (8) is used to pull the evacuated support member (8) into a slot (5, 6), whereupon the evacuated support member (8) is expanded by releasing the vacuum inside in order to make it clamp a cable inside a slot (5, 6) of the stator (2).
    Type: Grant
    Filed: August 11, 2003
    Date of Patent: January 3, 2006
    Assignee: ALSTOM Technology LTD
    Inventors: Olof Lundeberg, Pentti Virtanen
  • Patent number: 6920689
    Abstract: A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed by depositing conductive material, followed by coupling wires within the openings and performing another plating process by depositing more conductive material. The interconnect structure is completed by first removing the masking material and sacrificial substrate. Ends of the wires are coupled opposite now-formed contact structures to a board. To complete the socket, a support device is coupled to the board to hold a tested integrated circuit.
    Type: Grant
    Filed: December 6, 2002
    Date of Patent: July 26, 2005
    Assignee: FormFactor, Inc.
    Inventors: Igor Y. Khandros, Gaetan L. Mathieu, Carl V. Reynolds
  • Publication number: 20040211060
    Abstract: A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and the electronic part is mounted on the board by bringing the bonding members of the electronic part and the board into contact with each other at normal temperature to thereby mount the electronic part on the board, the method comprising forming the bonding members of at least one of the electronic part and the board out of a solder material, and bringing the bonding members of the electronic part and the board into contact with each other without preprocessing the bonding surfaces of the bonding members.
    Type: Application
    Filed: April 21, 2004
    Publication date: October 28, 2004
    Applicants: Tadatomo SUGA, SHINKO ELECTRIC INDUSTRIES CO., LTD, Oki Electric Industry Co., Ltd., SANYO ELECTRIC CO., LTD., SHARP KABUSHIKI KAISHA, SONY CORPORATION, KABUSHIKI KAISHA TOSHIBA, NEC CORPORATION, HITACHI, LTD., FUJITSU LIMITED, MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD., MITSUBISHI DENKI KABUSHIKI KAISHA, ROHM CO., LTD.
    Inventors: Tadatomo Suga, Toshihiro Itoh, Hideto Nakazawa, Masatoshi Akagawa
  • Patent number: 6578263
    Abstract: A wire harness includes a circuit unit having a plurality of electric wires with a predetermined path, a first soft sheet material formed into the shape as that of the predetermined path and a second soft sheet material adhesively joined to the first soft sheet material so that the circuit unit is interposed between the first and the second soft sheet materials.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: June 17, 2003
    Assignee: Yazaki Corporation
    Inventors: Hiroshi Ichikawa, Masashi Kitada
  • Patent number: 6419844
    Abstract: A calibration target for calibrating semiconductor wafer test systems including probe testers and probe card analyzers is provided. Also provided are calibration methods using the calibration target, and a method for fabricating the calibration target. The calibration target includes a substrate with various three dimensional alignment features formed thereon. A first type of alignment feature includes a contrast layer and an alignment fiducial formed on a tip portion thereof. The contrast layer and alignment fiducial are configured for viewing by a viewing device of the probe card analyzer, or the test system, to achieve X-direction and Y-direction calibration. A second type of alignment feature includes a conductive layer formed on a tip portion thereof, which is configured to electrically engage a contact on a check plate of the probe card analyzer, or a probe contact on a probe card of the test system, to achieve Z-direction calibration.
    Type: Grant
    Filed: December 20, 1999
    Date of Patent: July 16, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Andrew J. Krivy, Warren M. Farnworth, David R. Hembree, Salman Akram, James M. Wark, John O. Jacobson
  • Publication number: 20020069526
    Abstract: A slide-type solvent transfer unit is used, and a plurality of nozzles at a head part which suck and hold components are moved down simultaneously to transfer flux to electronic components. In comparison with an electronic component mounting method including a transfer operation whereby nozzles are lowered one by one by a conventional electronic component mounting apparatus equipped with a rotary type solvent transfer unit, the time required for moving the nozzles up and down is shortened and a total cycle time is reduced, so that production efficiency is improved.
    Type: Application
    Filed: February 11, 2002
    Publication date: June 13, 2002
    Inventors: Kazuo Mori, Osamu Okuda, Hiroshi Uchiyama, Akira Kabeshita
  • Publication number: 20020023345
    Abstract: A wire harness includes a circuit unit having a plurality of electric wires with a predetermined path, a first soft sheet material formed into the shape as that of the predetermined path and a second soft sheet material adhesively joined to the first soft sheet material so that the circuit unit is interposed between the first and the second soft sheet materials.
    Type: Application
    Filed: June 29, 2001
    Publication date: February 28, 2002
    Inventors: Hiroshi Ichikawa, Masashi Kitada
  • Patent number: 5456791
    Abstract: An automatic waterproofing apparatus for automatically waterproofing a joint of electric wires, comprising: a plurality of pallet jigs each of which is formed with a recess for receiving the joint, a pair of slots for receiving the electric wires and an air vent hole communicating with the recess; a transport device for continuously transporting the pallet jigs; a sheet feeding device for feeding onto an upper face of each pallet jig a flexible band-like sheet; a slit forming device for forming at opposite sides of the sheet a pair of slits corresponding to the slots, respectively; a suction device for sucking air in the recess of each Dallet jig from the air vent hole so as to bring the sheet into close contact with the recess; a joint placing device for placing the joint in the recess and inserting into the slots through the slits the electric wires disposed at opposite sides of the joint; a filler injecting device for injecting a predetermined quantity of filler into the recess; and an adhesive tape bondin
    Type: Grant
    Filed: August 31, 1994
    Date of Patent: October 10, 1995
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Takashi Ueno
  • Patent number: 5380953
    Abstract: End faces of copper alloys to be used for electrical conductors are placed in contacting relationship under a compressive force below the yield strength of the copper alloy conductor in the room temperature condition. The contacting end faces are heated under continuous compression at a temperature of at least 300.degree. C. but below the solvus temperature of the copper alloy in at least one heating cycle.
    Type: Grant
    Filed: November 5, 1993
    Date of Patent: January 10, 1995
    Assignee: Fisk Alloy Wire, Inc.
    Inventors: Brian Fisk, Joseph Winter
  • Patent number: 5293678
    Abstract: A communications system including an initially installed coaxial cable may be readily upgraded by installing a fiber optic cable therein. The coaxial cable has an empty longitudinal channel extending continuously along substantially the entire length thereof. A propellable fiber optic cable is later installed in the channel by a fluid flow which creates a sufficient drag to advance the fiber optic cable into the channel. The fiber optic cable is installed to meet increasing communications demands or when otherwise desired. The coaxial cable may include an empty electrically conductive tube serving as the center conductor for later receipt therein of the fiber optic cable. In other embodiments, the coaxial cable may have a channel provided in a dielectric material between the center and outer conductors, or a channel formed in the outer protective jacket.
    Type: Grant
    Filed: February 28, 1992
    Date of Patent: March 15, 1994
    Assignee: Comm/Scope
    Inventors: John C. Chamberlain, Christopher A. Story
  • Patent number: 5251373
    Abstract: A method for protectively enclosing electrical cables, wherein a portion of at least one cable is sealably disposed in the interior of a housing, includes the steps of placing a pressure-relief valve in communication with the housing interior, the pressure-relief valve being selected to pass an encapsulant therethrough on exposure to a predetermined pressure in said housing interior, and introducing an encapsulant under pressure into the housing interior until the encapsulant passes through the pressure-relief valve. The encapsulant introduction step is practiced by providing a pump having an inlet and an outlet, placing the pump inlet in communication with the housing interior and supplying encapsulant to the pump inlet directly from a bulk encapsulant container.
    Type: Grant
    Filed: October 15, 1991
    Date of Patent: October 12, 1993
    Assignee: Thomas & Betts Corporation
    Inventors: David J. DeCarlo, Thomas L. Mineur, Ronald S. Stanwick
  • Patent number: 4952256
    Abstract: A method is described for making an electrical through connection between a first conduction line comprising a flat conductor to a second conduction line comprising a round conductor. The steps of such method comprise removing end portions of insulation layer from the flat conductor and the round conductor; placing a positioning ring about the exposed end of the round conductor; bonding the round conductor to the flat conductor; extending the bonded conductors with the positioning ring into an injection molding apparatus and axially fixing the round conductor by compressive engagment of the positioning ring by a plunger element; and injecting a plastic material into the injection molding apparatus to form an insulating seal longitudinally about the bonded conductors and the positioning ring.
    Type: Grant
    Filed: March 12, 1990
    Date of Patent: August 28, 1990
    Assignee: Kabelmetal Electro GmbH
    Inventors: Friedrich Schauer, Hans Berthold
  • Patent number: 4712285
    Abstract: A plastic sleeve for protecting splices of telephone cables and electric cables against moisture comprises two half-shells (1a, 1b) assembled together. The edge (2a) of one half-shell (1a) comprises a rib (12) engaged in a groove (13) formed in the edge (2b) of the other half-shell (1b). One side of the groove (13) is formed by a flexible wall (14). The rib (12) which is engaged in the groove has an inclined face (12a) which forms an angle (a) of a few degrees with the inclined inner face (14a) of the flexible wall (14). The space formed by this angle is filled with a strip of putty (16) which is deformed and compressed between the inclined faces (12a and 14a).
    Type: Grant
    Filed: March 11, 1986
    Date of Patent: December 15, 1987
    Assignee: Etablissements Morel - Ateliers Electromecaniques de Favieres
    Inventors: Jacques Morel, Didier Morel
  • Patent number: 4484022
    Abstract: A sleeve, terminal body, plug body, or the like receives tubular or ring-shaped, normally solid but thermoplastic filler elements, being traversed by a cable or conductor, particularly a portion from which insulation has been stripped. A plunger-like element receives also the cable or conductor and is inserted in one end of the sleeve, or body, the other end being closed by another plunger or body structure. Upon heating, the filler element melts and the plunger or plungers are forced further in to cause melted filler material to fill all voids; the deformed material resolidifies and seals and bonds all parts together.
    Type: Grant
    Filed: November 2, 1981
    Date of Patent: November 20, 1984
    Assignee: HEW-Kabel, Heinz Eilentropp KG
    Inventor: Heinz Eilentropp
  • Patent number: 4343665
    Abstract: This invention relates to a new method for manufacturing a SF.sub.6 pressurized gas continuous spacer cable, and improvements which reduce costs and improve quality control of high voltage cables. The conductor is passed through taping machines for surrounding the conductor with a continuous insulating spacer and through taping machines for applying a conducting shielding material which partially covers the spacer. The insulated and shielded cable is continued on in the same production line into conduit which is laid out horizontal in long lengths or is extruded loose-fit over the cable. The cable is then subjected to vacuum while in the conduit. Terminations are applied. Seals are tested for leaks. The cable is filled with SF.sub.6 gas to a high pressure. The cable is tested at 1.5 times its operating voltage to ground for 30 minutes without failure.
    Type: Grant
    Filed: October 15, 1979
    Date of Patent: August 10, 1982
    Inventor: Paul F. Pugh