With Overlapping Orienting Patents (Class 29/872)
  • Publication number: 20090221175
    Abstract: A smaller conductor having an uninsulated portion and an insulated portion is positioned adjacent a larger conductor having an insulated portion and a conductive portion within said insulated portion and the two conductors are joined by a discontinuous metal band having respective ends extending across a top portion of said insulated portion to make electrical contact with said uninsulated portion, then bending downward on one side and then upward and through said insulated portion such that a first of said ends is positioned within said insulation and in contact with said conductive portion; the metal band bending downward on a second side and then upward and through said insulated portion such that a second of said ends is positioned within said insulation and in contact with said conductive portion
    Type: Application
    Filed: July 2, 2008
    Publication date: September 3, 2009
    Inventors: Dennis Pearson, Terry Horwitz
  • Patent number: 7578047
    Abstract: A method of stitching a plurality of interconnect wires on a stator of an electromagnetic machine is disclosed. The stator includes a plurality of discrete and individually wound stator segments having end caps positioned on the segments. The end caps have wire isolation features, including hooks, shelves and ledges, for separating the interconnect wires routed on the stator to electrically interconnect the segments. The method includes routing the interconnect wires between portions of the stator such that portions of the interconnect wires overlap and separating the overlapping portions in an axial direction with the wire isolation elements.
    Type: Grant
    Filed: October 2, 2006
    Date of Patent: August 25, 2009
    Assignee: Emerson Electric Co.
    Inventors: Weirong Wang, Paul G. Michaels, John Scott Rose, Mark E. Carrier, Jason J. Jurkowski
  • Patent number: 7426782
    Abstract: A method for connecting first and second elongate conductors using a wedge connector includes: providing a wedge connector including a sleeve member, a wedge member, and a lubricant coating disposed on at least one of the sleeve member and the wedge member, the sleeve member defining a sleeve cavity; mounting the sleeve member on the first and second conductors; and driving the wedge member into the sleeve cavity using a hydraulic power drive tool assembly to secure the wedge connector to each of the first and second conductors.
    Type: Grant
    Filed: April 17, 2006
    Date of Patent: September 23, 2008
    Assignee: Tyco Electronics Corporation
    Inventors: Barry Johnson, Dmitry Ladin, Randy Cole
  • Patent number: 7404252
    Abstract: A method and apparatus for fastening two substantially coplanar edges without a weld is disclosed. The method includes: configuring a dovetail feature on a first edge; configuring a complementary dovetail feature receptacle on a second edge to receive the dovetail feature therein; disposing the dovetail feature within the complementary dovetail receptacle; and swaging an interface defined between the dovetail feature in said first edge and said complementary dovetail feature in the second edge to swage mating edges defining the dovetail feature and the dovetail receptacle at at least six swage contact points. In one embodiment the swaging is with a hollow circle punch.
    Type: Grant
    Filed: October 18, 2004
    Date of Patent: July 29, 2008
    Assignee: International Business Machines Corporation
    Inventors: Dennis R. Barringer, Budy D. Notohardjono, Justin C. Rogers, Harold M. Toffler
  • Patent number: 7228627
    Abstract: A manufacturing method is provided to form an overhead transmission cable having an elongated stranded steel core, and at least one layer of conductor wires generally encircling the stranded steel core. Each conductor wire includes a circumferentially extending, metallurgically bonded aluminum outer layer of at least 99.5 percent pure aluminum and having an IACS conductivity of at least 20.3 percent. In one embodiment, the steel conductors include a generally circular cross-section and an aluminum outer layer metallurgically bonded thereto, with the thickness of the aluminum outer layer being at least 10 percent of the overall radial dimension of the conductor.
    Type: Grant
    Filed: December 16, 2005
    Date of Patent: June 12, 2007
    Assignee: United States Alumoweld Co., Inc.
    Inventors: Hironori Yoshimura, Thomas J. Higham, Henry T. Jarboe, Jr.
  • Patent number: 7225534
    Abstract: The present disclosure relates to a telecommunications cable having a jacket including a feature for allowing post-extrusion insertion of an optical fiber or other signal-transmitting member. The present disclosure also relates to a method for making a telecommunications cable having a jacket including a feature for allowing post-extrusion insertion of an optical fiber or other signal-transmitting member.
    Type: Grant
    Filed: February 11, 2005
    Date of Patent: June 5, 2007
    Assignee: ADC Telecommunications, Inc.
    Inventor: Wayne M. Kachmar
  • Patent number: 7188414
    Abstract: A flat electrical cable and a modular rotary anvil for assembling a flat electrical cable wherein the flat cable includes an upper and lower layer. The upper layer has ribs protruding along its length that are substantially parallel to one another, and continuous substantially parallel and adjacent seams formed therebetween. Conductors are placed between the upper and lower layers adjacent the seams. The present invention may have upper and lower polyester layers having copper conductors therebetween and the seams ultrasonically welded in order to provide a flat electrical cable for various applications such as incorporation in an automobile clockspring. The modular rotary anvil includes multiple removable and interchangeable segments or inserts which provide the ability to impart a smooth or knurled textured surface pattern to the work-piece. piece. Other inserts include cutting inserts which provide for a seam on the work-piece while a the same time cuts the work-piece along a seam.
    Type: Grant
    Filed: May 21, 2003
    Date of Patent: March 13, 2007
    Assignee: Methode Electronics, Inc.
    Inventors: Tom Schilson, Steve Kamps
  • Patent number: 7168159
    Abstract: In a wire termination apparatus, an anvil for placing a terminal thereon is mounted on a base plate, corresponding in position to a crimper of a ram. The terminal is crimped by a crimping portion, which includes the crimper and the anvil. An elongate link piece is mounted on the ram, and a guide member having a groove in which an elongate component, such as a fluorescent tube, is placed, is mounted on the tip of the link piece. The guide member is positioned to be aligned with the terminal placed on the anvil, when the ram is in its uppermost position. A conductive lead of the component and a conductor of an insulated wire are inserted into the terminal from directions perpendicular to each other, then the terminal is crimped by the crimper.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: January 30, 2007
    Assignee: Tyco Electronics AMP K.K
    Inventor: Kouji Imai
  • Patent number: 7155819
    Abstract: A method for forming a conductive circuit on a substantially non-conductive substrate includes indenting a major surface of a substrate with a plurality of features, plating the major surface and the indentations formed with a conductive layer, and removing a portion of the conductive layer leaving at least one of the plurality of the indentations filled with conductive material separated from at least one other of the plurality of the indentations filled with conductive material separated by non-conductive material. An electrical device formed includes a sheet of insulative material having grooves therein. The sheet of insulative material has a first planar surface, and a second planar surface. A conductive material is positioned within the grooves. The conductive material within the grooves forms electrical traces in the electrical device. The conductive material within the grooves fills the groove and includes a surface coplanar with at least one of the first planar surface or the second planar surface.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: January 2, 2007
    Assignee: Intel Corporation
    Inventors: David P McConville, Mark Vininski
  • Patent number: 7121001
    Abstract: A compression connector for securing wires therein is disclosed. The compression connector comprises a first body portion connected to a second body portion, each of the first and second body portions having two pairs of leg portions extending therefrom to form two conductor receiving channels, respectively. The compression connector also has a first pair of slots and a second pair of slots for receiving a cable tie to secure wires therein before crimping. At least one transversely-oriented slot extends between the first pair of slots and the second pair of slots. A method for securing wires within a compression connector is also disclosed.
    Type: Grant
    Filed: October 6, 2004
    Date of Patent: October 17, 2006
    Assignee: Panduit Corp.
    Inventors: Bernard J. O'Grady, Robert L. Sokol, Robert W. Kossak
  • Patent number: 7087839
    Abstract: A slack-based method for determining fastener placement tolerances for a wire harness relative to a vehicle mounting point layout. The method uses a determination of maximum permissible slack between pairs of adjacent mounting points to calculate tolerances for each point-to-point segment of the wire harness. The determination of maximum permissible slack is made by inspection of the vehicle mounting point layout between each set of mounting points, and in particular is based on real-life slack-limiting factors found to exist between the mounting points. The point-to-point tolerances are easily summed to determine an overall harness length sufficient to create the desired slack and tolerances. The overall length can be optimized for the greatest number of fastener placement options with the least amount of excess harness.
    Type: Grant
    Filed: July 11, 2002
    Date of Patent: August 8, 2006
    Assignee: Yazaki North America, Inc.
    Inventor: Michael W. Gajewski
  • Patent number: 7040014
    Abstract: An object of the present invention is to provide a coil chip having a structure with which downsizing of the coil chip can be realized and a high inductance and a high Q can be obtained and to provide a method of producing such a coil chip. In order to attain the object, according to the present invention, there is provided a coil structure including a core member made of a material having low dielectric loss characteristics, a coil formed by metal plating and wound around the core member, and a layer functioning as a seed for metal plating provided between the core member and the coil.
    Type: Grant
    Filed: January 20, 2004
    Date of Patent: May 9, 2006
    Assignee: TDK Corporation
    Inventor: Shigeru Shoji
  • Patent number: 7024341
    Abstract: A modeling system that converts a three-dimensionally defined aircraft engine harness in a two-dimensional electronic model, a process known as unfolding, is described. The modeling system electronically unfolds the three-dimensionally defined harness to create a two-dimensional representation, while simultaneously determining a plurality of design parameters. The drawing and the design parameters are displayed in a format that may be used for inspection purposes and manufacturing purposes. More specifically, the modeling system determines branch angles, wire lengths, and a plurality of angles of the three-dimensionally defined harness.
    Type: Grant
    Filed: February 9, 2001
    Date of Patent: April 4, 2006
    Assignee: General Electric Company
    Inventors: Patrick Barrow, Dustin Lee Meyers, James Stephen Hoelle, Kenneth Alvin Jungeberg
  • Patent number: 6976308
    Abstract: A method for conductively connecting first and second electrical conductors is described which consist of different materials. In carrying out the method the ends of the first and second conductors are brought into mechanical contact with each other in an overlapping position. The first and second conductors then are connected to each other by welding without feeding of additional welding material. Finally the overlapping area is formed mechanically to achieve a smooth width transition between the first and second conductors.
    Type: Grant
    Filed: November 18, 2003
    Date of Patent: December 20, 2005
    Assignee: NEXANS
    Inventor: Odd Magne Jonli
  • Patent number: 6973721
    Abstract: An electrical and mechanical connection between (a) a first shielded cable including a metal sheath and electrical conductors and (b) a second cable including a ground conductor and electrical conductors, comprises a zone of interconnection between the first and second cables. In this interconnection zone, a first connection is made between the free end of the metal sheath and the free end of the ground conductor, and second connections are made between the free ends of the electrical conductors of the first cable and the free ends of the electrical conductors of the second cable, respectively. Still in the interconnection zone, the interconnected metal sheath and ground conductor have a first length shorter than second lengths of the interconnected electrical conductors of the first cable and electrical conductors of the second cable whereby, in operation, longitudinal tension in the interconnection zone is totally supported by the interconnected metal sheath and ground conductor.
    Type: Grant
    Filed: February 2, 2004
    Date of Patent: December 13, 2005
    Assignee: 6179142 Canada Inc.
    Inventor: Philippe Charron
  • Patent number: 6967287
    Abstract: In a water cutoff structure of a covered wire, a water cutoff portion of an upper side member of a water cutoff member is formed in a recessed shape which is a shape of a curved face along an outer shape of the covered wire. Further, a water cutoff portion of a lower side member is formed in a projected shape in correspondence with the water cutoff portion in the recessed shape and the projected shape is a shape of a curved face in a projected shape in correspondence with the shape of the curved face of the water cutoff portion in the recessed shape.
    Type: Grant
    Filed: October 20, 2003
    Date of Patent: November 22, 2005
    Assignee: Yazaki Corporation
    Inventors: Tetsuro Ide, Tsutomu Takayama
  • Patent number: 6948241
    Abstract: A corrugated tube includes a tubular body, formed with a slit extending in an axial direction of the tubular body; a plurality of ridge portions, formed on an outer periphery of the tubular body and arranged side by side in the axial direction; and a lap portion, protruded from one of opposed end portions of the tubular body which are separated by the slit and extended toward an inner face of the other opposed end portion of the tubular body. A plurality of fixation members are provided on the outer periphery of the tubular body to fix the corrugated tube onto the panel body in a state that the tubular body is so twisted that the slit is spirally extended.
    Type: Grant
    Filed: June 18, 2002
    Date of Patent: September 27, 2005
    Assignee: Yazaki Corporation
    Inventor: Shinichi Tadokoro
  • Publication number: 20040200068
    Abstract: The invention concerns a method for positioning of the stripped sites of two flat flexible cables (FFC) to be mechanically and electrically connected to each other.
    Type: Application
    Filed: April 26, 2004
    Publication date: October 14, 2004
    Inventor: Nikola Dragov
  • Patent number: 6766578
    Abstract: A method of manufacturing a ribbon cable, comprising providing a set of insulated wires and aligning said insulated wires in a predetermined arrangement. The insulated wires are warmed sufficiently for said insulation to be become soft and adhesive, are pressed together so that they adhere to one another and allowed to cool, to form a ribbon cable.
    Type: Grant
    Filed: January 17, 2003
    Date of Patent: July 27, 2004
    Assignee: Advanced Neuromodulation Systems, Inc.
    Inventors: John Swanson, James Pylant, Ky Huynh
  • Publication number: 20040134062
    Abstract: A method for conductively connecting first and second electrical conductors is described which consist of different materials. In carrying out the method the ends of the first and second conductors are brought into mechanical contact with each other in an overlapping position. The first and second conductors then are connected to each other by welding without feeding of additional welding material. Finally the overlapping area is formed mechanically to achieve a smooth width transition between the first and second conductors.
    Type: Application
    Filed: November 18, 2003
    Publication date: July 15, 2004
    Inventor: Odd Magne Jonli
  • Patent number: 6735862
    Abstract: A method of making an electrical cable, the method comprising: bonding a plurality of electrical conductors to respective neighboring ones of the electrical conductors to form a ribbon, the electrical conductors being electrically insulated from the respective neighboring ones; folding the ribbon to form cable assembly, each of the electrical conductors traversing the width of the cable assembly at least twice; optionally bonding the cable assembly; and optionally coiling the cable assembly.
    Type: Grant
    Filed: January 7, 2003
    Date of Patent: May 18, 2004
    Assignee: General Electric Company
    Inventors: John Stanley Glaser, Judson Sloan Marte, Canan Uslu Hardwicke, Michael Andrew De Rooij
  • Patent number: 6705008
    Abstract: A system and method for sleeving a lead wire of a stator is provided. The stator includes a metal core and a plurality of lead wires extending from the metal core for providing electrical power and control signals to the stator. A gathering system is used to group the lead wires together. The lead wires are then separated and positioned by a separating system. Next, a single lead wire is secured with a grasping system and extended forward to an x, y, and z position in space. A sleeving system, fitted with an appropriately sized sleeve, is then guided along the lead wire so as to thread the sleeve with the lead wire. The stator or sleeving system is then rotated to sleeve another lead wire.
    Type: Grant
    Filed: November 21, 2000
    Date of Patent: March 16, 2004
    Assignee: Reliance Electric Technologies, LLC
    Inventor: Charles Requet, III
  • Patent number: 6662445
    Abstract: In this method, a ground wire 2 is overlaid on a shield wire 1 in cross. Next, overlapping portions of the shield wire 1 and the ground wire 2 are interposed between an upper resin tip 13 and a lower resin tip 14. By executing a first ultrasonic oscillation while inserting a projection 7a of an ultrasonic horn 7 into a through hole 13b of the tip 13, outside rinds 1d, 2b of the wires 1, 2 are removed in the vicinity of the overlapping portions. Next, by arranging a low-melting metal 15 and a resin piece 16 on a contact between the braided wire 1c and the core line 2a and executing a second ultrasonic oscillation, the contact can be brazed with the mutual welding of the tips 13, 14.
    Type: Grant
    Filed: January 16, 2001
    Date of Patent: December 16, 2003
    Assignee: Yazaki Corporation
    Inventors: Satoshi Tanikawa, Takashi Ishii
  • Publication number: 20030217464
    Abstract: A method for manufacturing an electrical connector for a flat cable, wherein the connector has at least one terminal (2) inserted into a receiving slot (3) of a box-shaped housing (1) from a side of the housing and having upper and lower arms (4 and 5), comprises the step of inserting the terminal into the receiving slot in a manner that the upper arm and lower arms are guided by inner surfaces of upper and lower walls of the housing, respectively, while the lower arm is deflected toward the upper arm and then deflected back to its original shape at a time of insertion to a predetermined position.
    Type: Application
    Filed: May 27, 2003
    Publication date: November 27, 2003
    Inventor: Kazuhisa Tsunematsu
  • Patent number: 6612026
    Abstract: A process and system for mounting terminals with electric wires in cavities of connector housings. Press-connecting terminals are initially loaded in cavities arranged in an upper surface of a connector jig and electric wires are press-connected on the terminals in the jigs. Then, the terminals with electric wires are transferred from the connector jig to cavities arranged in a lower surface of a inserting jig by pins arranged to contact and push the terminals from below in the transfer direction. Then, the terminals are loaded from the inserting jig to cavities of connector housings from the back by blades arranged to contact and push the terminals from one end in the inserting directing.
    Type: Grant
    Filed: February 25, 2000
    Date of Patent: September 2, 2003
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Koji Fujita, Yoshinobu Ota, Junichi Shirakawa, Kenji Hashimoto
  • Patent number: 6609648
    Abstract: Electric wires (20) and (21) are intersected with each other at right angles such that the electric wires (20) and (21) are inclined with respect to the vibration direction of ultrasonic vibration through 45°, intersected portions (C) of the electric wires (20) and (21) are set between a horn-side chip (11) and an anvil-side chip (12) in a pressurized state, and ultrasonic vibration is input to the intersected portions (C), thereby bonding the electric wires (20) and (21) to each other.
    Type: Grant
    Filed: January 2, 2002
    Date of Patent: August 26, 2003
    Assignee: Yazaki Corporation
    Inventor: Masayuki Kondo
  • Patent number: 6598293
    Abstract: A connecting method of connecting covered wires with each other and recessed resinous tips used in the method are provided. In the method, it is executed at the first step to put a connecting part constituted by a shield wire and a ground wire between a first resin tip and a second resin tip. The first resin tip has, around the connecting part, first recessed parts for accommodating the molten cover of the shield wire and second recessed parts for accommodating the molten cover of the ground wire. The second resin tip has second recessed parts formed for accommodating the molten cover of the ground wire.
    Type: Grant
    Filed: June 22, 2000
    Date of Patent: July 29, 2003
    Assignee: Yazaki Corporation
    Inventors: Tetsuro Ide, Akira Mita
  • Patent number: 6584677
    Abstract: Twist pins having bulges are fabricated from helically coiled stranded wire. Wire is advanced from a source such as a spool to create slack wire configuration, and wire is then advanced from the slack wire configuration to a position where each bulge is formed. Each bulge is formed by gripping the wire in two spaced apart locations and rotating the wire in an anti-helical direction in a single continuous relative revolution to untwist the strands and form the bulge. The wire is thereafter advanced to the position of the next bulge or the position where the wire will be severed to release the fabricated twist pin. The severed fabricated twist pin is conveyed through a flow of gas in a delivery tube into a receptacle of a cassette where the twist pin is stored until used. The cassette is automatically moved to position an occupied receptacle to receive each newly fabricated twist pin.
    Type: Grant
    Filed: February 13, 2001
    Date of Patent: July 1, 2003
    Assignee: Medallion Technology, LLC
    Inventors: Steven E. Garcia, Randall J. Boudreaux, James A. Harden, Jr., David A. Hofmann
  • Publication number: 20030102145
    Abstract: A connecting method of connecting covered wires with each other and recessed resinous tips used in the method are provided. In the method, it is executed at the first step to put a connecting part constituted by a shield wire W1 and a ground wire W2 between a first resin tip 31 and a second resin tip 41. The upper resin tips 31 has, around the connecting part, first recessed parts 39a, 39b for accommodating the molten cover 7a of the shield wire W1 and second recessed parts 37a, 37b for accommodating the molten cover 9a of the ground wire W2. While, the lower resin tip 41 has second recessed parts 47a, 47b formed for accommodating the molten cover 9a of the ground wire W2.
    Type: Application
    Filed: January 16, 2003
    Publication date: June 5, 2003
    Applicant: Yazaki Corporation
    Inventors: Tetsuro Ide, Akira Mita
  • Patent number: 6563065
    Abstract: A method of adjusting an electrical switch arrangement comprising a pair of electrical contact members to a predetermined contact spacing is suggested. A first one of the contact members is associated with a first contact carrier and a second one of the contact members is associated with a second contact carrier. The first and second contact members are normally spaced from each other by the predetermined contact distance and are movable relative to each other across the contact distance. At least one of the contact members is displaceably held on the associated contact carrier. The contact carriers are moved towards each other across the predetermined contact distance. The one of the contact members is displaced relative to the associated contact carrier into physical contact with the other of the contact members. The one contact member is fixed in position on the associated contact member while physically contacting the other of the contact members.
    Type: Grant
    Filed: April 27, 1999
    Date of Patent: May 13, 2003
    Assignee: TRW Automotive Safety Systems GmbH & Co. KG
    Inventors: Manfred Schrammek, Michael Christ, Guido Hirzmann
  • Patent number: 6536106
    Abstract: This invention is directed toward a process of manufacturing, including a technique of assembling parts of an apparatus. The technique includes forming electrode structures on a substrate, suspending the apparatus part or parts in a dielectric medium between electrodes of the electrode structure, and using near-field (that is, short range) electric field forces to align the part or parts in pre-determined positions in accordance with the desired apparatus topography. The part or parts may include semiconductor die, nanometer wires for making connections to devices, or other components requiring precision alignment.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: March 25, 2003
    Assignee: The Penn State Research Foundation
    Inventors: Thomas N. Jackson, Theresa Mayer
  • Patent number: 6490789
    Abstract: A connecting structure for covered wires is provided. At first, a shield wire 1 and a ground wire 2 are prepared. After overlaying the ground wire 2 on the shield wire 1 cross each other, respective overlapping portions of the wires 1, 2 are interposed between an upper resin tip 13 and a lower resin tip 14. Next, the upper and lower resin tips 13, 14 are oscillated with ultrasonic waves while compressing the upper and lower resin tips 13, 14 from the outside. Consequently, respective outside rinds 1d, 2b of the wires 1, 2 are molten for removal, so that a braided wire 1c comes into electrical contact with a core line 2a. The upper and lower resin tips 13, 14 have wire receiving grooves 13a, 14a formed on their butt faces. Each of the groove 13a, 14a has a semi-circular cross section of a diameter corresponding to the diameter of the shield wire 1.
    Type: Grant
    Filed: March 14, 2000
    Date of Patent: December 10, 2002
    Assignee: Yazaki Corporation
    Inventor: Tetsuro Ide
  • Publication number: 20020111079
    Abstract: A first cable conductor portion is placed on a first connector terminal. The first cable conductor portion is accommodated in a pressing recessed portion formed in an applying member. Ultrasonic vibration is applied to the first cable conductor portion and the first connector terminal and the first cable conductor portion and the first connector terminal are pressed, and thereby to be welded to each other.
    Type: Application
    Filed: April 15, 2002
    Publication date: August 15, 2002
    Applicant: Yazaki Corporation
    Inventors: Hideki Adachi, Taro Imai
  • Patent number: 6421904
    Abstract: A method for using a template to cut an aperture in a planar member at the point where a fixture is to be installed by positioning the template on the planar member and cutting the planar member about the edge of the template.
    Type: Grant
    Filed: December 23, 1997
    Date of Patent: July 23, 2002
    Assignee: Genlyte Thomas Group LLC
    Inventors: Robert James Wedekind, Mark Owen Jones, Graham Michael Rippel
  • Patent number: 6393697
    Abstract: A first cable conductor portion is placed on a first connector terminal. The first cable conductor portion is accommodated in a pressing recessed portion formed in an applying member. Ultrasonic vibration is applied to the first cable conductor portion and the first connector terminal and the first cable conductor portion and the first connector terminal are pressed, and thereby to be welded to each other.
    Type: Grant
    Filed: April 19, 1999
    Date of Patent: May 28, 2002
    Assignee: Yazaki Corporation
    Inventors: Hideki Adachi, Taro Imai
  • Patent number: 6381840
    Abstract: A connecting structure of covered wires is provided. A ground wire 2 is overlaid by a shield wire 1 such that the wires cross each other. Respective overlapping portions of the wires 1, 2 are interposed between an upper resin tip 13 and a lower resin tip 14. Next, the upper and lower resin tips 13, 14 are oscillated with ultrasonic waves while compressing the upper and lower resin tips 13, 14 from the outside. Consequently, respective outside rinds 1d, 2b of the wires 1,2 are molten for removal, so that a braided wire 1c comes into electrical contact with a core line 2a. The upper resin tip 13 isS provided, on a periphery of the butt face, with a projection 13b. One the other hand, the lower resin tip 14 has a recess 14b formed on a periphery of the butt face, for engagement with the projection 13b. Owing to the provision of the projection 13b and the recess 14b, it is possible to exclude a possibility that the upper resin tip 13 deviates from the lower resin tip 14 during the ultrasonic oscillation.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: May 7, 2002
    Assignee: Yazaki Corporation
    Inventor: Tetsuro Ide
  • Patent number: 6330746
    Abstract: A method for determining lengths of electric wires to be used in constructing a wire harness takes into account curvature of the wires as the wires pass through a jig, an extent to which the ends of each wire extend into a connector housing, and a location of the cavity within the connector housing. Thus, the method helps avoid excess wire length exceeding a given tolerance.
    Type: Grant
    Filed: June 21, 1999
    Date of Patent: December 18, 2001
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Kenichi Uchiyama, Kiyokazu Kurihara, Hidetaka Yuri
  • Patent number: 6327777
    Abstract: A connecting structure for covered wires is provided. At first, a shield wire 1 and a ground wire 2 are prepared. After overlaying the ground wire 2 on the shield wire 1 cross each other, respective overlapping portions of the wires 1, 2 are interposed between an upper resin tip 13 and a lower resin tip 14. Next, the upper and lower resin tips 13, 14 are oscillated with ultrasonic waves while compressing the upper and lower resin tips 13, 14 from the outside. Consequently, respective outside rinds 1d, 2b of the wires 1, 2 are molten for removal, so that a braided wire 1c comes into electrical contact with a core line 2a. The upper and lower resin tips 13, 14 have wire receiving grooves 13a, 14a formed on their butt faces. Each of the groove 13a, 14a has a semi-circular cross section of a diameter corresponding to the diameter of the shield wire 1.
    Type: Grant
    Filed: October 6, 1999
    Date of Patent: December 11, 2001
    Inventors: Tetsuro Ide, Satoshi Tanikawa
  • Patent number: 6311394
    Abstract: A combination 37-wire unilay stranded conductor includes a 19-wire stable unilay construction includes two layers of wires on a core wire, each having a diameter D, to define a hexagon that circumscribes the 19 nineteen wires. A corner wire is positioned at each corner of the hexagon, the corner wires being formed to provide bearing surfaces facing radially outwardly and defining a circle having a diameter of approximately 4.7 D. A third layer of wires includes a smaller diameter wire having a diameter of approximately 0.8 D contacting each bearing surface, and pairs of two wires each having diameters D are positioned between the smaller wires and are nested in a recess formed by two wires in a preceding underlying layer to define a substantially circular outer cable configuration.
    Type: Grant
    Filed: August 9, 1999
    Date of Patent: November 6, 2001
    Assignee: Nextrom, Ltd.
    Inventor: Paul White
  • Patent number: 6291771
    Abstract: A connecting structure includes a shield wire 1, a ground wire 2, an upper resin tip 15, a lower resin tip 16, and a low-melting welding material 17. First, the ground wire 2 is overlaid on the shield wire 1 in cross. Next, overlapping portions of the shield wire 1 and the ground wire 2 are interposed between the resin tips 15 and 16. By oscillating the resin tips 15 and 16 with ultrasonic waves, respective outside rinds 1d, 2d of the wires 1,2 are removed in the vicinity of the overlapping portions. A braided wire 1c of the wire 1 is electrically connected with a core line 2a of the wire 2 and, simultaneously, the resin tips 15 and 16 are welded to each other to seal up the vicinity of a connecting part S1. With the ultrasonic oscillation, a low-melting materials 17 is molten to flow into the connecting part S1, so that the braided wire 1c of the wire 1 is joined to the core line 2a of the wire 2 through the molten material 17.
    Type: Grant
    Filed: March 23, 1999
    Date of Patent: September 18, 2001
    Assignee: Yazaki Corporation
    Inventors: Satoshi Tanikawa, Nobuyuki Asakura
  • Publication number: 20010001347
    Abstract: In this method, a ground wire 2 is overlaid on a shield wire 1 in cross. Next, overlapping portions of the shield wire 1 and the ground wire 2 are interposed between an upper resin tip 13 and a lower resin tip 14. By executing a first ultrasonic oscillation while inserting a projection 7a of an ultrasonic horn 7 into a through hole 13b of the tip 13, outside rinds 1d, 2b of the wires 1, 2 are removed in the vicinity of the overlapping portions. Next, by arranging a low-melting metal 15 and a resin piece 16 on a contact between the braided wire 1c and the core line 2a and executing a second ultrasonic oscillation, the contact can be brazed with the mutual welding of the tips 13, 14.
    Type: Application
    Filed: January 16, 2001
    Publication date: May 24, 2001
    Applicant: Yazaki Corp.
    Inventors: Satoshi Tanikawa, Takashi Ishii
  • Patent number: 6226865
    Abstract: In this method, a ground wire 2 is overlaid on a shield wire 1 in cross. Next, overlapping portions of the shield wire 1 and the ground wire 2 are interposed between an upper resin tip 13 and a lower resin tip 14. By executing a first ultrasonic oscillation while inserting a projection 7a of an ultrasonic horn 7 into a through hole 13b of the tip 13, outside rinds 1d, 2b of the wires 1, 2 are removed in the vicinity of the overlapping portions. Next, by arranging a low-melting metal 15 and a resin piece 16 on a contact between the braided wire 1c and the core line 2a and executing a second ultrasonic oscillation, the contact can be brazed with the mutual welding of the tips 13, 14.
    Type: Grant
    Filed: March 23, 1999
    Date of Patent: May 8, 2001
    Assignee: Yazaki Corporation
    Inventors: Satoshi Tanikawa, Takashi Ishii
  • Patent number: 6167616
    Abstract: A connection method is proceeded by: placing a covered electric wire (18) on a terminal (17); applying an ultrasonic vibration in a state of pressing the covered electric wire (18) against the terminal (17) so as to melt and remove a covering portion (26); arranging a plurality of core wires on the terminal (17) in parallel; and pressing the arranged core wires (25) against the terminal (17) so that the core wires (25) and the terminal (17) conductively contact with each other.
    Type: Grant
    Filed: June 17, 1998
    Date of Patent: January 2, 2001
    Assignee: Yazaki Corporation
    Inventor: Akira Shinchi
  • Patent number: 6059617
    Abstract: A protective member (28) having a melting point lower than a cover (12) is provided on a distal end of a protrusion (22) of the cover (12). A terminal (13) and a covered electric wire (19) are housed in a groove portion (18) of a connector housing (11), and the protrusion (22) of the cover (12) is inserted into the groove portion (18), and thereafter, an ultrasonic vibration is applied to the covered electric wire (19) and the terminal (13) from the cover (12). A covering portion (27) of the covered electric wire (19) is melted and removed by the ultrasonic vibration. The protective member (28) absorbs a heat generated in the cover (12) by applying the ultrasonic vibration, and is preferentially melted. Therefore, the protrusion (22) is not deformed due to the heat, so that a contact area of a core wire (26) and the terminal (13) can be secured.
    Type: Grant
    Filed: June 17, 1998
    Date of Patent: May 9, 2000
    Assignee: Yazaki Corporation
    Inventor: Akira Shinchi
  • Patent number: 6026567
    Abstract: A method of interconnecting a core, a stranded conductor such as a wire rope or cable and a component of a medical electrical lead provided with a internal lumen. At least one of the core and the internal lumen of the component is provided with a textured surface, such as threading. The conductor is located alongside said textured surface and the core is advanced into the lumen of said component, such that the textured surface engages the conductor and retains the conductor as the core is advanced into the lumen, and the conductor is compressed between the core and the inner lumen of the component.
    Type: Grant
    Filed: May 11, 1995
    Date of Patent: February 22, 2000
    Assignee: Medtronic, Inc.
    Inventors: John M. Swoyer, Diane M Radloff, Peter B. Mc Intyre, Timothy G. Laske
  • Patent number: 6004170
    Abstract: A covered wire connection structure is formed by the steps of: pinching a covered wire with a pair of resin chips; pressing and exciting a cover portion of the wire by ultrasonic vibration so as to conductively connect conductive portions of both the covered wires at the connection portion; and melting a pair of the resin chips so as to seal the connection portion. The resin chip comprises main melting portions for pinching the connection portion which are melted to a mating resin chip so as to seal the connection portion, and auxiliary melting portions which are formed of material compatible with the cover portion of the covered wire introduced from the main melting portions and pinch the cover portion such that they are melted to the mating resin chip. The auxiliary melting portions and cover portion of the covered wire are melted together and integrated so as to seal an introductive portion of the covered wire from the resin chips.
    Type: Grant
    Filed: October 23, 1997
    Date of Patent: December 21, 1999
    Assignee: Yazaki Corporation
    Inventors: Tetsuo Kato, Nobuyuki Asakura, Akira Shinchi, Tetsuro Ide
  • Patent number: 5959252
    Abstract: Two covered wires conductively connected are overlapped with each other at connection portions S. The overlapped connection portions are pinched by a pair of resin chips. Cover portions are melted and the conductive wire portions of both the covered wires are conductively contacted with each other at the connection portions by pressing from outside of the resin chips. Then, the pair of the resin chips are melt-fixed to each other to seal the connection portions. The resin chips are provided with first melting portions which are melt-fixed to a mating chip in area including the connection area to seal the connection portions and second melting portions which are separated from the first melting portions and melt-fixed to the mating chip in area other than the connection portion. Thus, it is possible to achieve reduction of conducting resistance and improvement of mechanical strength.
    Type: Grant
    Filed: June 3, 1997
    Date of Patent: September 28, 1999
    Assignee: Yazaki Corporation
    Inventors: Tetsuro Ide, Nobuyuki Asakura
  • Patent number: 5906044
    Abstract: The claimed invention provides an ultrasonic welding method, whereupon joint portions in which a copper foil portion and a twisted-wire electric cable are placed one upon the other in each groove of a resin casing, the grooves having a through-hole portion. In the through-hole portion, the copper foil portion and the twisted-wire electric cable are placed one upon the other. Welding is performed in a state in which the piled-up portion is sandwiched between a welding tip formed at an end of a welding head and an anvil. Thus, the joint portion between the copper foil portion and the twisted-wire electric cable invade and are invaded by a portion of the resin casing softened by welding heat. The joint portion is fastened not only by welding, but also by the solidified resin.
    Type: Grant
    Filed: December 4, 1996
    Date of Patent: May 25, 1999
    Assignees: Harness System Technologies Research, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Atsuhiko Fujii, Kazuhito Murakami
  • Patent number: 5901441
    Abstract: A protective construction for a splice portion of a plurality of wires, comprising: the splice portion in which conductors exposed at end portions of the wires, respectively are welded to each other; a cylindrical cap which is made of resin and has a mouth and a bottom formed at its opposite ends, respectively; and hot melt which is poured into the cap so as to be filled to vicinity of the mouth of the cap when the splice portion has been inserted into the cap.
    Type: Grant
    Filed: July 18, 1997
    Date of Patent: May 11, 1999
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Shigeto Kawamura, Atsushi Fujisawa
  • Patent number: 5898993
    Abstract: An object of the invention is to quickly supply inexpensive large current terminals without entailing complicated metal-working process and labor. Further, another object thereof is to provide methods of metal-working such terminals. A large current male terminal is constructed by forming a hollow cylindrical electric contact part on one end of a conductive pipe, a hollow cylindrical wire crimping part on the other end thereof, and a collar between the electric contact part and the wire crimping part. The electric contact part has a substantially conical nose and is formed by squeezing one end of the conductive pipe in such a manner that the diameter of the one end is gradually reduced frontward. The wire crimping part has such an inner diameter as to allow a wire to be inserted thereinto.
    Type: Grant
    Filed: April 28, 1997
    Date of Patent: May 4, 1999
    Assignee: Yazaki Corporation
    Inventors: Shigemitsu Inaba, Mitsuhiro Matsumoto, Satoki Masuda