Heat Exchanger Or Boiler Making Patents (Class 29/890.03)
  • Patent number: 10307874
    Abstract: The present invention relates to a method for sealing a heat transfer unit, which includes the steps of providing a heat transfer unit having at least one opening, welding the opening to form a welding section and close the opening, and pinching off the welding section and cutting part of the welding section to form a cutting end and complete sealing the opening of the heat transfer unit. By means of the method of the present invention, an extremely short dead zone can be obtained and high heat conduction efficiency is enhanced, further having the effects of reducing the arrangement space and shrinking steps of the heat pipe.
    Type: Grant
    Filed: January 6, 2015
    Date of Patent: June 4, 2019
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Hsiu-Wei Yang
  • Patent number: 10304756
    Abstract: A power semiconductor module includes a laminate substrate; a semiconductor element joined to a front surface of the laminate substrate; a base plate 14 joined to a rear surface of the laminate substrate; a cooling case 15 which 15 has a heat sink 17, a bottom wall 15a, a side wall 15b formed around the bottom wall 15a, an inlet portion 15c and an outlet portion 15d for a cooling-liquid which are connected to either the bottom wall 15a or the side wall 15b, in which one end of the side wall 15b is joined to a rear surface of the base plate 14 such that a cooling liquid can flow into a space surrounded by the base plate 14, the bottom wall 15a, and the side wall 15b. The power semiconductor module further includes a spacer 20 between the inlet portion 15c and the outlet portion 15d.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: May 28, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Daisuke Inoue
  • Patent number: 10156798
    Abstract: Described herein is a technique capable of suppressing a generation of particles. A substrate processing apparatus may include: a substrate support including: a protruding portion supporting a substrate including a pattern region at a center thereof and a non-contacting region at a periphery thereof; and a bottom portion defining a space along with the protruding portion; a process chamber wherein the substrate support is provided and the substrate is processed; a process gas supply unit configured to supply a process gas into the process chamber; and a hot gas supply unit configured to heat and supply an inert gas into the space.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: December 18, 2018
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventor: Naofumi Ohashi
  • Patent number: 10128199
    Abstract: A multi-chip module structure (MCM) having improved heat dissipation includes a plurality of semiconductor chips having a front side mounted on a packaging substrate, wherein each semiconductor chip of the plurality of semiconductor chips further includes a through-substrate vias located at a backside of each semiconductor chip of the plurality of semiconductor chips. A plurality of wire bonds is present that provides interconnect between each semiconductor chip of the plurality of semiconductor chips and is located at the backside of each semiconductor chip of the plurality of semiconductor chips. A heat sink is located above a gap containing the plurality of wire bonds, and a cooling element is located on a surface of the heat sink.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: November 13, 2018
    Assignee: International Business Machines Corporation
    Inventor: Effendi Leobandung
  • Patent number: 10126073
    Abstract: A corrugated fin, in particular for a heat exchanger, having a substantially corrugated design, having a plurality of fin surfaces, wherein adjoining fin surfaces are connected to one another by means of a fin arch in such a way that a medium can flow through an intermediate space between adjoining fin surfaces, wherein the fin surfaces are arranged at an angle with respect to one another perpendicularly with respect to a throughflow direction for the medium, wherein the fin surface has at least one bulge which protrudes out of the plane of the fin surface, wherein the extent of the bulge in a direction perpendicularly with respect to the air throughflow direction is smaller than the extent of the fin surface in said direction.
    Type: Grant
    Filed: October 14, 2014
    Date of Patent: November 13, 2018
    Assignee: MAHLE International GmbH
    Inventors: Carolin Agner, Bjoern Haller, Jonas Kilian, Jens Ruckwied, Florian Schmidt, Eberhard Pantow, Gerd Schleier
  • Patent number: 10008435
    Abstract: A semiconductor device including a semiconductor chip and a heat dissipation unit (heat sink) is configured as follows. The heat dissipation unit (heat sink) includes a resin tape, and a fin constituted of a graphite sheet and protruding from the resin tape. The fin, including graphene, is disposed on the semiconductor chip such that the graphene is disposed in a direction crossing a surface of the semiconductor chip. The heat dissipation unit is a rolled body in which the graphite sheet and the resin tape are layered and rolled. Thus, by use of the graphene as a constituent material of the fin, thermal conductivity is improved, whereby a heat dissipation characteristic is improved. Furthermore, since the fin is protruded from the resin tape, an exposed area of the fin is increased, and accordingly, the heat dissipation characteristic can be improved.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: June 26, 2018
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventor: Yoshihisa Matsubara
  • Patent number: 9815117
    Abstract: A forming die assembly includes an upper die including a first backup member and a first press member that is attached to the first backup member, has an L shape in a vertical sectional view, and is heat-resistant; and a lower die including a second backup member and a second press member that is attached to the second backup member, has an L shape in the vertical sectional view, and is heat-resistant. The first press member and the second press member press upper and lower surfaces of a workpiece accommodated in a press space that is formed between the first press member and the second press member, so as to produce a forged product.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: November 14, 2017
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Osamu Yamashita
  • Patent number: 9791219
    Abstract: A method for fabricating a straight fin heat sink (50) of the type having a base (52) and a plurality of fins (54) extending from the base is disclosed. Each fm (54) of the plurality of fins of the heat sink is spaced from one another a predetermined distance and lies along a plane generally parallel to planes of the other fins of the plurality of fins. The method includes: providing a die (20) configured to produce a heat sink (30) having a base (32) and a plurality of fins (34) attached to be base in a radial fashion about the base from at least one side of the base; extruding a blank of material through the die (20) to produce the heat sink (30); and compressing the plurality of fins (34) with a compression tool (40) so that the plurality of fins (54) extend from the base along planes generally parallel to each other.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: October 17, 2017
    Assignee: SCHNEIDER ELECTRIC IT CORPORATION
    Inventors: Gorm Gamborg, Preben Bonde
  • Patent number: 9776244
    Abstract: A forming die assembly includes an upper die including a first backup member and a first press member that is attached to the first backup member, has an L shape in a vertical sectional view, and is heat-resistant; and a lower die including a second backup member and a second press member that is attached to the second backup member, has an L shape in the vertical sectional view, and is heat-resistant. The first press member and the second press member press upper and lower surfaces of a workpiece accommodated in a press space that is formed between the first press member and the second press member, so as to produce a forged product.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: October 3, 2017
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Osamu Yamashita
  • Patent number: 9725677
    Abstract: A cleaner composition includes: a saturated aliphatic hydrocarbon (A); an anionic surfactant (B); a nonionic surfactant (C); and water (D). The cleaner composition contains the saturated aliphatic hydrocarbon (A) in a proportion of 60.0% by mass to 85.0% by mass, the anionic surfactant (B) in a proportion of 8.0% by mass to 15.0% by mass, the nonionic surfactant (C) in a proportion of 2.0% by mass to 5.0% by mass, and the water (D) in a proportion of 1.0% by mass to 20.0% by mass, forms a W/O microemulsion or a solubilized W/O emulsion, and has a volume resistivity of 1×109 ?·cm or less.
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: August 8, 2017
    Assignee: JX NIPPON OIL & ENERGY CORPORATION
    Inventors: Ko Aoyagi, Mizuho Yoshida, Koichiro Kai, Hiroe Otsuka
  • Patent number: 9390995
    Abstract: An object is to provide a fin integrated type semiconductor device and a method of manufacturing the same, which are provided with a simple structure and good heat dissipation characteristics. The semiconductor device includes: a base plate on which fins arranged in a standing condition are formed on a first main face; an insulating layer formed on a second main face of the base plate, the second main face being opposite to the first main face of the base plate; a circuit pattern fixed to the insulating layer; and a semiconductor element joined to the circuit pattern. The fins are formed with slits that pass through in the thickness direction of the fins.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: July 12, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kei Yamamoto, Kazuhiro Tada, Hideki Komori, Toru Kimura, Masaki Goto, Hiroyuki Yoshihara
  • Patent number: 9337121
    Abstract: Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes: an active region provided on a substrate; an inlet channel formed as a single cavity buried in one side of the substrate; an outlet channel formed as a single cavity buried in the other side of the substrate; a micro channel array comprising a plurality of micro channels, wherein the plurality of micro channels are formed as a plurality of cavities buried in the substrate, and one end of the micro channel array is connected to a side of the inlet channel and the other end of the micro channel array is connected to a side of the outlet channel; and a micro heat sink array separating the micro channels from one another.
    Type: Grant
    Filed: July 7, 2014
    Date of Patent: May 10, 2016
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Chi Hoon Jun, Sang Choon Ko, Seok-Hwan Moon, Woojin Chang, Sung-Bum Bae, Young Rak Park, Je Ho Na, Jae Kyoung Mun, Eun Soo Nam
  • Patent number: 9328973
    Abstract: A heat exchanger (30) includes vertically arranged flat tubes (33) and plate-like fins (36) arranged in the direction in which the flat tubes (33) extend. The flat tubes (33) are inserted into notches (45) of the fins (36). Parts of the fins (36) between vertically adjacent ones of the notches (45) are windward plate parts (70), and parts of the fins (36) at leeward sides of the notches (45) are leeward plate parts (75). Each of the windward plate parts (70) includes windward heat transfer promotion parts (71) constituted by protrusions (81-83) and louvers (50a, 50b). On the plate parts (75), leeward heat transfer promotion parts (76) constituted by leeward protrusions (84) are provided. The heat transfer promotion parts (76) are located at leeward sides of the notches (45), and overlap with the heat transfer promotion parts (71) when viewed from front edges (38) of the fins (36).
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: May 3, 2016
    Assignee: Daikin Industries, Ltd.
    Inventors: Masanori Jindou, Yoshio Oritani
  • Patent number: 9320173
    Abstract: A semiconductor device includes a base plate having a first major plane and a second major plane opposite to each other, and having a plurality of fins held upright on the first major plane and a bulge portion formed on the first major plane to encircle the plurality of fins, an insulation layer formed on the second major plane of the base plate, a circuit pattern fixed to the insulation layer, a semiconductor element connected to the circuit pattern, and a sealing resin sealing the insulation layer, the circuit pattern, and the semiconductor element. The bulge portion formed on the first major plane continuously encircles the plurality of fins, the bulge portion has a widthwise margin on an outer peripheral edge of the base plate, and the sealing resin covers an outer peripheral side face of the bulge portion and the widthwise margin.
    Type: Grant
    Filed: February 18, 2013
    Date of Patent: April 19, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kei Yamamoto, Kazuhiro Tada
  • Patent number: 9151541
    Abstract: A heat transfer system includes a heat exchanger configured to transfer heat between a first fluid and a second fluid. The heat exchanger includes an outer sleeve and a microchannel unit. The outer sleeve has an interior surface defining a cavity and an exterior surface configured to be in direct thermal communication with the first fluid. The microchannel unit is received in the cavity. The microchannel unit has a plurality of microchannels configured to receive the second fluid therein and be in direct thermal communication with the second fluid. The microchannel unit has an exterior surface in direct thermal communication with the interior surface of the outer sleeve to transfer heat therebetween. At least one of the interior surface of the outer sleeve and the exterior surface of the microchannel unit has grooves defining breach channels for the first fluid or the second fluid should a breach in the outer sleeve or the microchannel unit occur.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: October 6, 2015
    Assignee: Grundfos Holding A/S
    Inventor: Tadeusz Frank Jagusztyn
  • Patent number: 9078539
    Abstract: Cookware comprising a selectively bonded composite of at least two layers of materials wherein the first of the at least two layers of materials has a plurality of spaced-apart bubbles formed on its surface, defining a cooking surface of the cookware, and a second layer of two layers of material is bonded thereto, wherein the bonding between the bubbles and the second material is of a lesser degree than the bonding between the first and second layers of materials in areas intermediate the bubbles, whereby a coefficient of heat conductivity is greater in the intermediate areas than in the bubbles.
    Type: Grant
    Filed: March 17, 2014
    Date of Patent: July 14, 2015
    Assignee: All-Clad Metalcrafters LLC
    Inventors: William A. Groll, John Watkins
  • Patent number: 9067270
    Abstract: A heat exchanger comprises a first plate and a second plate. A coolant flow passage is formed by brazing the first plate and the second plate by use of a first brazing filler metal. A pipe is brazed between a first groove portion provided in the first plate and a second groove portion provided in the second plate by use of a second brazing filler metal. A pair of first flanges provided contiguously with the first groove portion. Each of the first flanges includes an inner surface. A pair of second flanges provided contiguously with the second groove portion. Each of the second flanges includes an inner surface. At least one of the inner surfaces of the first flanges and the inner surfaces of the second flanges is covered with the second brazing filler metal. The first and second flanges are held by jigs upon brazing of the pipe.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: June 30, 2015
    Assignees: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI, SHOWA DENKO K.K.
    Inventors: Takashi Okamoto, Tomoya Hirano
  • Publication number: 20150144309
    Abstract: The present invention provides an apparatus and method for heat exchange. Embodiments of the present invention include a method and apparatus for heat exchange employing a unit cell using interior and exterior fins, the interior fins disposed within a flattened envelope structure. In one particular embodiment, the heat exchanger is directed for use as a gas engine recuperator.
    Type: Application
    Filed: November 26, 2014
    Publication date: May 28, 2015
    Inventor: James S. Nash
  • Publication number: 20150144318
    Abstract: A heat dissipating device includes a base and a heat dissipating fin. The base includes an accommodating recess formed thereon. The heat dissipating fin includes a heat dissipating portion and a protruding portion, wherein the protruding portion protrudes from an end of the heat dissipating portion and is disposed in the accommodating recess. The base and the heat dissipating fin are combined with each other by a punching process, such that a first side wall of the accommodating recess covers at least a part of the protruding portion.
    Type: Application
    Filed: October 1, 2014
    Publication date: May 28, 2015
    Inventors: Chia-Yu Lin, Qingsong Zhang, Tao Song
  • Publication number: 20150136371
    Abstract: An end-piece for a plate heat exchanger comprises a frame part having an inner portion, an outer portion and an intermediate portion arranged between the inner and outer portions. An outer wall surface of the inner portion faces a first surface of a package of heat transfer plates comprised in the plate heat exchanger. The first surface has a center portion and a peripheral portion encircling the center portion. The frame part is extruded and the intermediate portion of the frame part comprises a first number of cavities extending in an extrusion direction of the frame part. The extrusion direction is parallel to an axis of the frame part. Further, outer dimensions of the outer wall surface of the inner portion are at least as large as outer dimensions of the center portion of the first surface of the package of heat transfer plates.
    Type: Application
    Filed: May 23, 2013
    Publication date: May 21, 2015
    Inventors: Anders Nyander, Klas Bertilsson, Clemens Wictor
  • Patent number: 9036354
    Abstract: Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller. A user is able to enter the controlling parameters into the programmable logic controller through an human operator interface. The thermal heads are able to be connected with one or more pneumatic solenoid to make the thermal heads moving vertically until the thermal head in contact with the heat sink. The thermal head is able to provide a temperature, at or above the operating temperature of the thermal pad, capable of making the phase change thermal interface material to bond the heat sink and the electronic boards.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: May 19, 2015
    Assignee: Flextronics, AP, LLC
    Inventors: Dason Cheung, Murad Kurwa, Richard Loi
  • Publication number: 20150130092
    Abstract: A fill in a rectilinear evaporative cooling tower includes a grid, grid support, module radial support, module column and module girts. The grid is to support a plurality of splash bars. The grid support is configured to provide support for the grid. The module support is configured to provide support for the grid support. The module column is configured to provide support for the module support. The module girts is configured to rest on a fill support frame of the rectilinear evaporative cooling tower and configured to provide support for the module columns.
    Type: Application
    Filed: November 13, 2014
    Publication date: May 14, 2015
    Inventor: Randy POWELL
  • Publication number: 20150130094
    Abstract: A fill in an evaporative cooling tower includes a grid, grid support, module radial support, module column and module radial girts. The grid is to support a plurality of splash bars. The grid support is configured to provide support for the grid. The module radial support is configured to provide support for the grid support. The module column is configured to provide support for the module radial support. The module radial girts is configured to rest on a fill support frame of the evaporative cooling tower and configured to provide support for the module columns.
    Type: Application
    Filed: November 10, 2014
    Publication date: May 14, 2015
    Inventor: Randy POWELL
  • Publication number: 20150129169
    Abstract: A heat transfer medium assembly unit, especially for a heat exchanger arrangement of a vehicle heater, includes a housing part (16) with at least one opening (22, 24) for receiving a connecting branch. At least one flexible fixing element is associated with the at least one opening (22, 24) for receiving a connecting branch. The at least one flexible fixing element is provided for fixing a connecting branch (12, 14) mounted in the opening (22, 24) for receiving a connecting branch for providing a connecting branch/housing part preassembled assembly unit (76).
    Type: Application
    Filed: November 13, 2014
    Publication date: May 14, 2015
    Inventor: Michael HAEFNER
  • Patent number: 9027248
    Abstract: A solar panel mounting system includes a plurality of solar panel support structures which can be formed from solid concrete in adjacent rows with mounting surfaces that are tilted towards the equator. The solar panels can have an adhesive backing which can be used to secure the solar panels directly to the mounting surfaces. The support structures can be made of concrete and formed with a slip form machine. This construction can reduce the time and materials required for the solar panel installation. The solar panel mounting system can also occupy significantly less ground space than conventional solar panel installations.
    Type: Grant
    Filed: June 6, 2012
    Date of Patent: May 12, 2015
    Assignee: Eco PowerDeck, Inc.
    Inventors: David Flaherty, Kevin Flaherty, Christopher Dillon
  • Patent number: 9027246
    Abstract: A method is provided for reproducibly producing a carbon band twisted about its longitudinal axis. According to the method carbon fibers are fed into a processing device and are formed into a band-shaped preform having a centerline and an edge on both sides thereof. A shorter average fiber length is fed by the processing device when forming the centerline area than when forming the edges. The preform is subsequently further processed into the carbon band.
    Type: Grant
    Filed: February 10, 2010
    Date of Patent: May 12, 2015
    Assignee: Heraeus Noblelight GmbH
    Inventor: Sven Linow
  • Publication number: 20150122456
    Abstract: A heat dissipation device includes a mounting bracket and a thermal module. The mounting bracket has at least one retaining hole and a mounting section, and the thermal module includes a plurality of radiating fins, to which the mounting bracket is connected. On the radiating fins, at least one engaging zone is provided for correspondingly engaging with the mounting bracket, and at least one locking portion is formed for correspondingly engaging with the retaining hole. With the above structural design, the mounting bracket can be more firmly and stably connected to the thermal module and be more accurately located on the radiating fins without the need of welding, so that the manufacturing cost for welding is saved. A method of manufacturing the heat dissipation device is also disclosed.
    Type: Application
    Filed: January 15, 2015
    Publication date: May 7, 2015
    Applicant: Asia Vital Components Co., Ltd.
    Inventors: Sheng-Huang Lin, Yen-Lin Chu
  • Publication number: 20150113806
    Abstract: Method for filling a heat storage tank with solid elements having at least one first particle size greater than at least one second particle size, the method includingthe following steps: a) pouring a first quantity of solid elements of the first particle size into the tank, b) levelling said first quantity of solid elements of the first particle size so as to form a layer of a substantially constant height, c) pouring a second given quantity of solid elements of the second particle size over the layer of solid elements of the first particle size such that the solid elements of the second particle size flow between the solid elements of the first particle size and such that the elements of the second particle size are flush with the layer of the solid elements of the first particle size and so as to form an intermediate layer.
    Type: Application
    Filed: May 6, 2013
    Publication date: April 30, 2015
    Inventors: Raphaël Couturier, Arnaud Bruch, Jean-François Fourmigue
  • Publication number: 20150116938
    Abstract: A heat sink for power modules can be incorporated into a power module of a machine. In embodiments, an alloy is extruded to form a body with a plurality of divider webs integral thereto and defining a plurality of longitudinal passage segments inside the body. The body is machined to remove alternating end portions of the divider webs to define a fitting end turn area and a return end turn area disposed in opposing relationship with each other, thereby forming a serpentine fluid passage. A fitting end cap is welded to the body. A fluid inlet and a fluid outlet of the fitting end cap are respectively in fluid communication with a passage inlet and a passage outlet of the serpentine fluid passage.
    Type: Application
    Filed: October 29, 2013
    Publication date: April 30, 2015
    Applicant: Caterpillar Inc.
    Inventors: Todd G. Nakanishi, Jon N. Husser, Keith E. Dixler
  • Patent number: 9015943
    Abstract: The current invention provides a tube-grasping body for grasping an insert tube in a heat exchanger, and heat exchanger production methods and apparatuses utilizing the tube-grasping body, wherein the tube-grasping body enables to enlarge and connect an insert tube to a heat radiating fin for producing a heat exchanger, still keeping the total length of insert tubes at an almost same level even after the enlargement; and the tube-grasping body is connected at its exterior to the guide-pipe.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: April 28, 2015
    Assignee: Kyoshin Kogyo Co., Ltd.
    Inventor: Kenji Tokura
  • Patent number: 9015944
    Abstract: A method of forming a microchannel cooled component is provided. The method includes forming at least one microchannel within a surface of a relatively planar plate. The method also includes placing a relatively planar cover member over the surface having the at least one microchannel formed therein. The method further includes adhering the relatively planar cover member to the relatively planar plate. The method yet further includes curving the microchannel cooled component by pressing the relatively planar cover member with a forming component for at least a portion of a time period of adhering the relatively planar cover member to the relatively planar plate.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: April 28, 2015
    Assignee: General Electric Company
    Inventors: Benjamin Paul Lacy, Paul Stephen Dimascio, Srikanth Chandrudu Kottilingam, David Edward Schick
  • Publication number: 20150109730
    Abstract: Cooling apparatuses and methods are provided facilitating transfer of heat from a working fluid to a coolant. The cooling apparatus includes a vapor condenser which includes a condenser housing with a condensing chamber accommodating the working fluid and coolant, which are in direct contact within the condensing chamber and are immiscible fluids. The condensing chamber includes a working fluid vapor layer and a working fluid liquid layer; and a working fluid vapor inlet facilitates flow of fluid vapor into the condensing chamber, and a working fluid vapor outlet facilitates egress of working fluid liquid from the condensing chamber. A coolant inlet structure facilitates ingress of coolant into the working fluid vapor layer of the condensing chamber in direct contact with the working fluid vapor to facilitate condensing the vapor into working fluid liquid, and the coolant outlet structure facilitates subsequent egress of coolant from the condensing chamber.
    Type: Application
    Filed: October 21, 2013
    Publication date: April 23, 2015
    Applicant: International Business Machines Corporation
    Inventors: Levi A. CAMPBELL, Richard C. CHU, Milnes P. DAVID, Dustin W. DEMETRIOU, Michael J. ELLSWORTH, JR., Madhusudan K. IYENGAR, Roger R. SCHMIDT, Robert E. SIMONS
  • Publication number: 20150107535
    Abstract: Heat exchanger comprising a first heat exchanging body having a first end and an opposite second end, at least a flue gas channel and at least a water channel, a longitudinal direction of the first body extending between the first and second end thereof, and a second heat exchanging body, having a first end and an opposite second end, at least a flue gas channel and at least a water channel, a longitudinal direction of the second body extending between the first and second end thereof, wherein the first end of the second body is connected to the second end of the first body, wherein a burner chamber is provided at the first end of the first body.
    Type: Application
    Filed: October 17, 2014
    Publication date: April 23, 2015
    Inventors: Jan Hubertus DECKERS, Paulus Mathijs Maria THIJSSEN
  • Patent number: 9009968
    Abstract: A cooling method is provided which includes providing a cooling apparatus that includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.
    Type: Grant
    Filed: December 5, 2012
    Date of Patent: April 21, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Eric J. McKeever, Robert E. Simons
  • Patent number: 9009971
    Abstract: A method is provided for facilitating cooling of electronic components of an electronic system. The method includes: providing a housing at least partially surrounding and forming a compartment about the components, and providing an immersion-cooling fluid is disposed within the compartment, at least one component of the electronic system being at least partially non-immersed within the fluid in the compartment; providing a wicking film element physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment; and securing, via a coupling element, the wicking film element in physical coupling to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: April 21, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
  • Publication number: 20150101785
    Abstract: A heat dissipation device includes a first copper sheet and a second copper sheet. The first copper sheet includes a number of first recesses and the second copper sheet includes a number of corresponding second recesses. The second copper sheet is fixed on the first copper sheet and an airtight receiving cavity is formed by each first recess and each the second recess, a working fluid in the airtight receiving cavity carries unwanted heat away.
    Type: Application
    Filed: October 13, 2014
    Publication date: April 16, 2015
    Inventors: MING-JAAN HO, XIAN-QIN HU, FU-YUN SHEN
  • Publication number: 20150098222
    Abstract: A heat sink comprises skived fins and a base. The base has a first side and a second side. The skived fins are disposed on the first side, and at least one semiconductor device is mounted on the second side. The base has at least one channel for gas flow between the first side and the second side. The skived fins are formed by skiving segments from at least one layer of an alloy. The skived fins have one or more of the following patterns: a wavy skived pattern; a triangular skived pattern; and a block skived pattern.
    Type: Application
    Filed: October 3, 2014
    Publication date: April 9, 2015
    Inventor: Jerry S. Lin
  • Publication number: 20150096728
    Abstract: A corrugated fin, in particular for a heat exchanger, having a substantially corrugated design, having a plurality of fin surfaces, wherein adjoining fin surfaces are connected to one another by means of a fin arch in such a way that a medium can flow through an intermediate space between adjoining fin surfaces, wherein the fin surfaces are arranged at an angle with respect to one another perpendicularly with respect to a throughflow direction for the medium, wherein the fin surface has at least one bulge which protrudes out of the plane of the fin surface, wherein the extent of the bulge in a direction perpendicularly with respect to the air throughflow direction is smaller than the extent of the fin surface in said direction.
    Type: Application
    Filed: October 14, 2014
    Publication date: April 9, 2015
    Inventors: Carolin AGNER, Bjoern HALLER, Jonas KILIAN, Jens Ruckwied, Florian SCHMIDT, Eberhard PANTOW, Gerd SCHLEIER
  • Publication number: 20150090657
    Abstract: A device, which is suitable for the processing of at least one fluid, is provided with at least one elongated foil, which is formed in a number of reciprocating foil layers. Between two opposite layers of foil, a spacer is situated that is permeable at least parallel to the foil layers. The foil layers and interposed spacers extend spirally around a central axis, wherein folding lines between two foil layers extend substantially parallel to the central axis. Each spacer is coupled to at least an end near the central axis with a support extending parallel to the central axis where, of the supports near the central axis, first supports are situated between two foil layers, which foil layers are connected to one another near the central axis, whereas second supports are situated between two successive first supports.
    Type: Application
    Filed: March 22, 2013
    Publication date: April 2, 2015
    Applicant: AKA PATENTEN B.V.
    Inventors: Bert Johan Nelemans, Jochem Franciscus Edith Lahaije
  • Publication number: 20150090430
    Abstract: A tube (2) of a heat exchanger (1) is intended to allow an exchange of heat between a first fluid and a second fluid flowing in contact with the tube (2). The tube (2) comprises an upper plate (22) and a lower plate (21) positioned facing one another and defining an internal space (25) in the tube (2) in which the first fluid is able to circulate. Each of the plates (21, 22) comprises a bottom (23) and at least one edge (24). The plates (21, 22) are in contact with one another at the edge (24). The tube (2) comprises a deflection screen (30) secured to the edge (24), with the deflection screen (30) comprising a first wall (31) extending transversely to the bottoms (23) and arranged to deflect the second fluid toward the bottoms (23). The invention also relates to a bundle of such tubes and to a heat exchanger comprising such a bundle, and to a method for producing a heat exchanger tube plate.
    Type: Application
    Filed: May 16, 2013
    Publication date: April 2, 2015
    Inventors: Sylvain Moreau, Francois Busson, Mohamed Ibrahimi, Maryse Philippe
  • Publication number: 20150083375
    Abstract: A device (1) for static mixing and heat exchange comprises a cladding element (2) and a mixer insert (3), whereby the mixer insert (3) is in the operative state arranged inside the cladding element (2). The mixer insert has a longitudinal axis and comprises a first group (5) of web elements and a second group (6) of web elements. The first group (5) of web elements extends along a first common group plane (7) and the second group (6) of web elements extends along a second common group plane (8). At least a portion of the web elements (9, 10) is provided with channels (11, 12). The channels extend from a first end (13) of the web element (11) to a second end (14) of the web element (11).
    Type: Application
    Filed: August 8, 2014
    Publication date: March 26, 2015
    Inventor: Rolf Heusser
  • Publication number: 20150083385
    Abstract: Gas heater/cooler apparatuses and methods of manufacturing thereof are provided. A gas heater/cooler apparatus has a gas pipe configured to transport a fluid inside a heat transfer block. A fluid flow through a cooling pipe in the proximity of the gas pipe or pushed towards the gas pipe by a fan cools the fluid. An electric heater disposed inside the heat transfer block close to the gas pipe may heat the fluid flowing therein via radiated heat.
    Type: Application
    Filed: July 25, 2012
    Publication date: March 26, 2015
    Applicant: NUOVO PIGNONE S.p.A.
    Inventor: Valentino Galasso
  • Publication number: 20150075000
    Abstract: A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.
    Type: Application
    Filed: November 19, 2014
    Publication date: March 19, 2015
    Inventors: Aaron R. Cox, William J. Grady, IV, Jason A. Matteson, Jason E. Minyard
  • Publication number: 20150075759
    Abstract: A variety of polymer manifolds and associated fabrication methods are described. The described manifolds can be used in heat exchangers and a variety of other applications. In one aspect a polymer manifold is formed by welding distal tips of a multiplicity of polymer tubes to a polymer retainer. The tubes pass through guide passages that extend between opposing faces of the retainer and the distal tip of each tube is welded to a manifold face of the retainer. The welds between the tubes and the manifold face form sealed connections between the tubes and the manifold face. In some embodiments a locking plate is positioned adjacent the retainer. The tubes also pass through the locking plate such that during assembly, the locking plate and/or the retainer can be translated or otherwise moved slightly relative to the other to hold the tubes in place during welding to the retainer.
    Type: Application
    Filed: September 16, 2013
    Publication date: March 19, 2015
    Applicant: Rhotech Solar LLC
    Inventors: Andrew McCANDLISH, Richard O. RHODES
  • Publication number: 20150075755
    Abstract: Methods of fabricating cooling apparatus are provided which facilitate cooling a multi-component assembly, such as a hub module assembly. The cooling apparatus includes a first liquid-cooled heat sink configured to facilitate removal of heat generated by one or more first electronic components of the multi-component assembly, and a second liquid-cooled heat sink configured to facilitate removal of heat generated by one or more second electronic components of the multi-component assembly. The first liquid-cooled heat sink is separably coupled to the multi-component assembly, and the second liquid-cooled heat sink is fixedly secured to the multi-component assembly. Fluid couplers fluidically couple the first and second liquid-cooled heat sinks to facilitate liquid coolant flow through the fixedly-secured, second liquid-cooled heat sink from the separably-coupled, first liquid-cooled heat sink.
    Type: Application
    Filed: November 24, 2014
    Publication date: March 19, 2015
    Inventors: Amilcar R. ARVELO, Levi A. CAMPBELL, Michael J. ELLSWORTH, JR., Eric J. McKEEVER
  • Patent number: 8979322
    Abstract: A lamp comprises an optical lens. The lamp further comprises a self-locking trim ring including a plurality of teeth. The self-locking trim ring is disposed over the optical lens. The lamp further comprises a heat sink. The heat sink has an inner chamber wherein the optical lens is disposed in the inner chamber. The heat sink also has an outer chamber disposed radially outwardly from the inner chamber. The outer chamber has a recess that engages the plurality of teeth. The self-locking trim ring secures the optical lens to the heat sink.
    Type: Grant
    Filed: May 7, 2012
    Date of Patent: March 17, 2015
    Assignee: Technical Consumer Products, Inc.
    Inventors: George Uhler, Timothy Chen
  • Patent number: 8978742
    Abstract: A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (30) to compress the camber (112) to form a contact plane (112?) and an attaching plane (113?) perpendicular to each other, coating an adhesive (50) on the contact planes (112?), connecting the contact planes to make the attaching planes co-planar.
    Type: Grant
    Filed: December 16, 2012
    Date of Patent: March 17, 2015
    Assignees: Cpumate Inc., Golden Sun News Techniques Co., Ltd.
    Inventors: Kuo-Len Lin, Chen-Hsiang Lin, Ken Hsu, Chih-Hung Cheng
  • Publication number: 20150068242
    Abstract: A thermal management system includes a case; an insulation material provided within the case, the insulation material defining an interior volume of the insulation material; a liner arranged in the interior volume, the liner having an inner surface that extends toward a center of the case; an outer container of phase change material provided in the liner, the outer container comprising a plurality of outer panels containing a first phase change material, the plurality of outer panels comprising a bottom outer panel, a top outer panel, and side outer panels; and an inner container of phase change material provided in the outer container, the inner container comprising a plurality of inner panels containing a second phase change material; wherein an outer surface of each of the side outer panels is parallel with the inner surface of the liner.
    Type: Application
    Filed: November 13, 2014
    Publication date: March 12, 2015
    Applicant: Pelican BioPharma, LLC
    Inventor: Christopher H. Patstone
  • Publication number: 20150068714
    Abstract: A method of localized cathodic protection of a heat exchanger, includes providing at least one fin formed from a first metal alloy; applying a sacrificial layer of a second metal to at least one region in the at least one fin; and connecting a refrigerant tube to the at least one fin; wherein the sacrificial layer of the second metal includes a metal from one of a zinc alloy or a magnesium alloy.
    Type: Application
    Filed: April 11, 2013
    Publication date: March 12, 2015
    Inventor: Thomas J. Garosshen
  • Publication number: 20150064032
    Abstract: An electric submersible well pump assembly includes a pump and an electrical motor filled with a dielectric lubricant. A capsule extends around a portion of the motor, defining a chamber between the capsule and the motor. A port through a side wall of the motor communicates the lubricant within the motor to the chamber. Thermoelectric devices are located within the chamber. Voltage supplied to the thermoelectric devices cools the lubricant.
    Type: Application
    Filed: September 4, 2014
    Publication date: March 5, 2015
    Inventors: Anil K. Sadana, Carlos A. Prieto, Sayantan Roy