Abstract: A heat exchanger, in particular battery cooler, having a pipe which has a pipe end portion that is placed at an open end of the pipe and is widened, at least in part, with respect to the non-widened portion of the pipe that is further away from the pipe end portion, a head part that has an opening and a radial outside wall, wherein the non-widened portion of the pipe fits through the opening. The, a seal which is received by the head part in order to be compressed between the pipe and the radial outside wall of the head part, and a tank component which is connected to pipe end portion via the head part. A method for assembling a heat exchanger is also provided.

Abstract: Disclosed are a sealed box container, a main machine of a heat recovery switching device and a refrigeration device. The sealed box container includes box bodies that are spliced to form a sealed cavity, and is provided with a through hole in communication with the sealed cavity, and the sealed cavity is used for accommodating a pipeline assembly of a main machine, and the pipeline assembly is connected to an external pipeline by means of the through hole.

Abstract: An air conditioning system including swappable/interchangeable heat exchanger access panels with accessory mounting capabilities is disclosed. The air conditioning system includes a heat exchanger, a drain pan beneath the heat exchanger to collect condensation from the heat exchanger, a bracket with an opening coupled to the heat exchanger, a plurality of interchangeable access panels adapted to be interchangeably mounted to the opening on the bracket, and an accessory coupled to one of the plurality of access panels.

Abstract: An aircraft heat exchanger system according to an exemplary embodiment of this disclosure, among other possible things includes a first heat exchanger assembly that is disposed in an inlet duct assembly, and a skin heat exchanger assembly is in thermal communication with an outer surface of an aircraft structure. The skin heat exchanger is in fluid communication with the first heat exchanger such that a working fluid is communicated therebetween.

Abstract: An object of the present disclosure is to provide a technique capable of relaxing the stress to be applied around the attachment hole of the resin case at the time of fixing the resin case accommodating the semiconductor element to the heat dissipation component with a bolt. A semiconductor device includes a base plate, a heat dissipation component, and a resin case. In a state where the resin case is disposed on the heat dissipation component via the base plate, the resin case is attached to the heat dissipation component with a bolt. The resin case has a recess portion, an attachment hole formed below the recess portion, and at least one groove formed between a wall portion on an inner peripheral side forming the recess portion and the attachment hole. One end of the at least one groove reaches an outer peripheral end of the resin case.

Abstract: A silencing apparatus is provided with a shell, ventilation pipes communicating with the inside of the shell, insertion holes which are respectively formed in the shell so as to have sizes smaller than surrounding skirt parts and allow the ventilation pipes to be loosely inserted in, and partitions partitioning the inside of the shell. In the silencing apparatus, at least, a sound-absorbing chamber partitioned by the partition and positioned adjacent to the insertion hole is filled with a sound-absorbing fiber material, and a sound-absorbing fiber material filling gap between the insertion hole and the ventilation pipe is closed by an annular closing member. To provide a silencing apparatus allowing a sound-absorbing chamber to be filled with sound-absorbing fiber material without a gap, even in a complicated configuration having the inside of a shell partitioned by a partition.

Abstract: An object of the invention is a thermal management device (1) for a battery, including an extruded plate (2). The extruded plate (2) comprises a first channel (13) and a second channel (23), configured to allow a flow of a coolant. The extruded plate (2) also includes at least one encapsulation cavity (33), intended to be filled by a Phase Change Material. The first channel, the second channel and the encapsulation cavity extend between a front face (10) and a rear face (20) of the extruded plate (2). The device comprises an inlet/outlet cap (40), connected to the front face (10) and a diverting cap (50,50?), connected to the rear face (20). Both caps provide plugs of each encapsulation cavity. The diverting cap forms a connecting channel (52i,52s), connecting the first channel (13) to the second channel (23).

Abstract: Aspects of the present disclosure include a primary air chamber configured to receive primary air, an induced air chamber configured to receive secondary air, a heating coil disposed in the induced air chamber, wherein the heating coil is removable from the induced air chamber without disassembling at least a portion of the induced air chamber, and the heating coil does not receive the primary air, a fan disposed in the induced air chamber, wherein the fan is configured to blow the secondary air received via the induced air chamber toward the heating coil and the heating coil heats the secondary air.

Abstract: An HVAC system includes a blower, a motor drive, and a controller. A benchmark rate of the flow of air provided by the blower and a corresponding benchmark power output of the motor drive associated with operation of the blower at a test condition are received. The controller determines a first motor drive frequency at which the motor drive is operating. Based on the benchmark rate and a comparison of the first motor drive frequency to the predefined motor drive frequency, a first rate of the flow of air provided by the blower is determined. At a later time, a current power output of the motor drive is determined during operation of the blower at the test condition. Based on a comparison of the current benchmark power output to the benchmark power output, an updated benchmark rate of the flow of air provided by the blower is determined.

Abstract: A radiator for cooling a transformer, preferably a power transformer, or a choke, includes a plurality of plate-shaped radiator elements which are disposed parallel to one another and through which a coolant can flow in parallel. At least one elastically deformable element is provided at least between two adjacent radiator elements and is constructed in such a way that it counteracts an expansion of the radiator elements perpendicular to the surface of the radiator elements. Plastic deformation of the walls of the radiator elements can be prevented by the elastically deformable elements. A unit including a transformer or a choke and a method for producing a radiator are also provided.

Abstract: The cooling module comprises a main supply connector, a main return connector, an internal cooling loop, a plurality of cooling plates, a base layer and a lid. The base layer includes a plurality of supply sub-connectors and return sub-connectors and a plurality of cooling areas corresponding to a plurality of cooling plates. Each cooling plate has a supply connector, a return connector and a contacting area. The plurality of supply sub-connectors and return sub-connectors are connected with the internal cooling loop. Each cooling area is to contact with a contacting area of a corresponding cooling plate. Each supply sub-connector is to be connected to a supply connector of the corresponding cooling plate, and each return sub-connector is to be connected to a return connector of the corresponding cooling plate. The corresponding cooling plate is to be removably attached with the base layer and to be serviced independently.

Abstract: A heat pipe assembly includes walls having porous wick linings, an insulating layer coupled with at least one of the walls, and an interior chamber sealed by the walls. The linings hold a liquid phase of a working fluid in the interior chamber. The insulating layer is directly against a conductive component of an electromagnetic power conversion device such that heat from the conductive component vaporizes the working fluid in the porous wick lining of the at least one wall and the working fluid condenses at or within the porous wick lining of at least one other wall to cool the conductive component of the electromagnetic power conversion device. The assembly can be placed in direct contact with the device while the device is operating and/or experiencing time-varying magnetic fields that cause the device to operate.

Abstract: The present disclosure provides a liquid-cooling type double-sided cooler, including a first cooling portion and a second cooling portion. In the liquid-cooling type double-sided cooler, another end of the first cooling portion is formed with a first communication hole that is configured to penetrate the first cooling liquid path and an outside of the first cooling portion, another end of the second cooling portion is formed with a second communication hole that is configured to penetrate the second cooling liquid path and an outside of the second cooling portion; and the first cooling portion and the second cooling portion are positioned such that the first communication hole and the second communication hole face each other, and the first cooling liquid path and the second cooling liquid path are connected with each other.

Abstract: A heat sink includes a base plate; a cover overlapping the base plate; fins, each having a plate-like shape projecting from the base plate in a direction perpendicular to the base plate, located between the base plate and the cover; one or a plurality of first fin groups composed of a plurality of the fins arranged with a gap therebetween in a first direction; and one or a plurality of second fin groups composed of a plurality of the fins arranged with a gap therebetween in the first direction, and adjacent to the first fin group with a gap therebetween in a second direction. Positions in the first direction of the fins belonging to the second fin group are displaced with respect to positions in the first direction of the fins belonging to the first fin group. Each of the fines has an S-shape.

Abstract: One aspect of a motor of the present disclosure may include a rotor having a motor shaft disposed along a central axis extending in one direction, a stator facing the rotor via a gap in a radial direction, and a housing having an accommodating portion configured to accommodate the rotor and the stator, and to enable oil to be stored therein, wherein the housing comprises a lower wall portion facing a vertical-directional lower region in the inside of the accommodating portion, the lower wall portion comprises a cooling flow passage formed therein, and refrigerant flows in the cooling flow passage, and at least a portion of the cooling flow passage overlaps the vertical-directional lower region in the inside of the accommodating portion when viewed along a vertical direction.

Abstract: A heat and mass transfer component comprises a lubricant-impregnated surface including hydrophobic surface features, which comprise nanostructured surface protrusions having a hydrophobic species attached thereto. The hydrophobic surface features are impregnated with a fluorinated lubricant having a viscosity in a range from about 400 mPa·s to about 6000 mPa·s. A method of fabricating a lubricant-impregnated surface on a heat and mass transfer component comprises: cleaning a thermally conductive substrate to form a cleaned substrate; exposing the cleaned substrate to a hot water or hot alkaline solution to form a thermally conductive substrate having nanostructured surface protrusions; depositing a hydrophobic species on the nanostructured surface protrusions to form hydrophobic surface features; and coating the hydrophobic surface features with a fluorinated lubricant having a viscosity in a range from 400 mPa·s to 6000 mPa·s.

Abstract: The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.

Abstract: A holder for an electronic rack includes a pivot point and a first end of the holder having a first blind-mate connector to be coupled to a second blind-mate connector at a first engagement interface. The first blind-mate connector and the second blind-mate connector are coupled in response to the holder moving to the second position in response to contact with the electronic rack. The holder additionally includes a second end of the holder having a third blind-mate connector to be coupled to a fourth blind-mate connector at a second engagement interface. The third blind-mate connector and the fourth blind-mate connector are coupled in response to the holder moving to the second position in response to contact with the electronic rack.

Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.

Abstract: A stage includes a plate and a heat exchanger. The plate has a front surface, on which a substrate is mounted, and a rear surface. The heat exchanger is configured to individually supply a heat exchange medium to a plurality of two-dimensionally distributed and mutually non-inclusive regions of the rear surface of the plate and to recover the heat exchange medium thus supplied.

Abstract: A method for manufacturing a lower housing of a battery pack having an embedded cooling pipe comprises the steps of: preparing a cooling pipe, which protrudes to the outside of the lower housing so as to be insert-connected to an external quick connector, includes a locking protrusion having a first outer diameter at a quick connector insertion part to be connected to the quick connector, and a second outer diameter for enabling the protrusion to be fixed to the quick connector in the inward direction in a first length at the end of the quick connector insertion part, and has a joint part which has a predetermined length and a third outer diameter corresponding to the second outer diameter in the inward direction in a second length longer than the first length at the end of the quick connector insertion part, and which is to be disposed over a cooling pipe inlet of the lower housing; preparing a slider including one or more pipe insertion parts having inner diameters corresponding to the third outer diameter

Abstract: A synthetic diamond plate comprising a polygonal plate formed of synthetic diamond material, the polygonal plate of synthetic diamond material having a thickness in a range 0.4 mm to 1. mm, and rounded corners having a radius of curvature in a range 1 mm to 6 mm. A mounted synthetic diamond plate is also disclosed comprising a polygonal synthetic diamond plate as described and a base to which the polygonal synthetic diamond plate is bonded, wherein the base comprises a cooling channel. An array of mounted synthetic diamond plates is also described, comprising a plurality of mounted synthetic diamond plates described above, wherein the cooling channels of the mounted synthetic diamond plates are linked to form a common cooling channel across the array of mounted synthetic diamond plates.

Abstract: An oxygenator apparatus for use in an extracorporeal circuit. The apparatus includes a housing and a membrane assembly disposed within the housing. The membrane assembly includes a first plurality of gas exchange elements disposed in a first zone and a second plurality of gas exchange elements disposed in a second zone. The second zone is arranged concentrically around the first zone. The first and second plurality of gas exchange elements are fluidly open along a body and fluidly separated along a distal end. The first zone is configured to be fluidly coupled to an oxygen source and the second zone is configured to be fluidly coupled to a negative pressure source. A blood flow path includes a generally radial flow through the first zone to add oxygen to the blood and the second zone to separate gaseous micro emboli from the blood through the plurality of gas exchange elements.

Abstract: A heat exchange and noise reduction panel the panel for an aircraft comprising: an external surface intended to be swept by an airflow and from which fins extend along a first and a second main predetermined direction; cavities forming Helmholtz resonators, linked to the first ends of channels for the passage of air, the second ends of which communicate with said airflow, such that said channels form necks, referred to as Helmholtz resonators, extending substantially along the first direction; and at least one oil flow chamber extending between said external surface and said at least one cavity, and intended to discharge the thermal energy carried by the oil, wherein said channels are formed, at least in part, inside said fins.

Abstract: A power semiconductor module has a base plate with a heat sink affixed thereto, a housing affixed to the base plate, a DC busbar affixed to the base plate and to the housing, an AC busbar affixed to the base plate and to the housing on a side of the housing opposite the DC busbar, and control electronics positioned in an interior of the housing and connected to the DC busbar and to the AC busbar. The heat sink has a plurality of pins affixed to one side of the base plate and extending outwardly therefrom. Each of the plurality of pins is of a forged or impact extruded pure aluminum material.

Abstract: A multi-chip module structure (MCM) having improved heat dissipation includes a plurality of semiconductor chips having a front side mounted on a packaging substrate, wherein each semiconductor chip of the plurality of semiconductor chips further includes a through-substrate vias located at a backside of each semiconductor chip of the plurality of semiconductor chips. A plurality of wire bonds is present that provides interconnect between each semiconductor chip of the plurality of semiconductor chips and is located at the backside of each semiconductor chip of the plurality of semiconductor chips. A heat sink is located above a gap containing the plurality of wire bonds, and a cooling element is located on a surface of the heat sink.

Abstract: A pressing method and a finished product thereof are provided. The pressing method includes the steps of: providing a heat conductive base (1), and defining a pressed zone (10) on the heat conductive base (1); forming a plurality of penetrated holes (100) arranged with intervals in the pressed zone (10), and forming a pressed part (101) between any two of the adjacent penetrated holes (100); and processing a pressing and extruding operation to the pressed part (101) for allowing the pressed part (101) to be pressed and extruded so as to be extended and deformed towards the adjacent penetrated hole (100) for filling the penetrated hole (100).

Abstract: A cooling jacket includes, a base having a portion that is in contact with a heat generating component, a plurality of grooves formed on a surface of the base, each of the plurality of grooves that is arranged in parallel each other, and a cover that is in contact with an upper end of each of fins formed by the plurality of grooves on the same plane as the surface of the base. Each of the plurality of grooves has curved bottom surfaces provided in both end portions thereof, and is shallower toward the end portions thereof. The cover is bonded to the base in a state of covering all of the plurality of grooves.

Abstract: The present disclosure is directed to a method of making a heat exchanger tube, such as multichannel tubes. The heat exchanger tube may include a plurality of generally parallel flow paths extending between opposite ends. The method may include removing a section of an outer wall along the length of the tube to expose at least some of the plurality of generally parallel flow paths.

Abstract: The present invention relates to a method for sealing a heat transfer unit, which includes the steps of providing a heat transfer unit having at least one opening, welding the opening to form a welding section and close the opening, and pinching off the welding section and cutting part of the welding section to form a cutting end and complete sealing the opening of the heat transfer unit. By means of the method of the present invention, an extremely short dead zone can be obtained and high heat conduction efficiency is enhanced, further having the effects of reducing the arrangement space and shrinking steps of the heat pipe.

Abstract: A power semiconductor module includes a laminate substrate; a semiconductor element joined to a front surface of the laminate substrate; a base plate 14 joined to a rear surface of the laminate substrate; a cooling case 15 which 15 has a heat sink 17, a bottom wall 15a, a side wall 15b formed around the bottom wall 15a, an inlet portion 15c and an outlet portion 15d for a cooling-liquid which are connected to either the bottom wall 15a or the side wall 15b, in which one end of the side wall 15b is joined to a rear surface of the base plate 14 such that a cooling liquid can flow into a space surrounded by the base plate 14, the bottom wall 15a, and the side wall 15b. The power semiconductor module further includes a spacer 20 between the inlet portion 15c and the outlet portion 15d.

Abstract: Described herein is a technique capable of suppressing a generation of particles. A substrate processing apparatus may include: a substrate support including: a protruding portion supporting a substrate including a pattern region at a center thereof and a non-contacting region at a periphery thereof; and a bottom portion defining a space along with the protruding portion; a process chamber wherein the substrate support is provided and the substrate is processed; a process gas supply unit configured to supply a process gas into the process chamber; and a hot gas supply unit configured to heat and supply an inert gas into the space.

Abstract: A corrugated fin, in particular for a heat exchanger, having a substantially corrugated design, having a plurality of fin surfaces, wherein adjoining fin surfaces are connected to one another by means of a fin arch in such a way that a medium can flow through an intermediate space between adjoining fin surfaces, wherein the fin surfaces are arranged at an angle with respect to one another perpendicularly with respect to a throughflow direction for the medium, wherein the fin surface has at least one bulge which protrudes out of the plane of the fin surface, wherein the extent of the bulge in a direction perpendicularly with respect to the air throughflow direction is smaller than the extent of the fin surface in said direction.

Abstract: A multi-chip module structure (MCM) having improved heat dissipation includes a plurality of semiconductor chips having a front side mounted on a packaging substrate, wherein each semiconductor chip of the plurality of semiconductor chips further includes a through-substrate vias located at a backside of each semiconductor chip of the plurality of semiconductor chips. A plurality of wire bonds is present that provides interconnect between each semiconductor chip of the plurality of semiconductor chips and is located at the backside of each semiconductor chip of the plurality of semiconductor chips. A heat sink is located above a gap containing the plurality of wire bonds, and a cooling element is located on a surface of the heat sink.

Abstract: A semiconductor device including a semiconductor chip and a heat dissipation unit (heat sink) is configured as follows. The heat dissipation unit (heat sink) includes a resin tape, and a fin constituted of a graphite sheet and protruding from the resin tape. The fin, including graphene, is disposed on the semiconductor chip such that the graphene is disposed in a direction crossing a surface of the semiconductor chip. The heat dissipation unit is a rolled body in which the graphite sheet and the resin tape are layered and rolled. Thus, by use of the graphene as a constituent material of the fin, thermal conductivity is improved, whereby a heat dissipation characteristic is improved. Furthermore, since the fin is protruded from the resin tape, an exposed area of the fin is increased, and accordingly, the heat dissipation characteristic can be improved.

Abstract: A forming die assembly includes an upper die including a first backup member and a first press member that is attached to the first backup member, has an L shape in a vertical sectional view, and is heat-resistant; and a lower die including a second backup member and a second press member that is attached to the second backup member, has an L shape in the vertical sectional view, and is heat-resistant. The first press member and the second press member press upper and lower surfaces of a workpiece accommodated in a press space that is formed between the first press member and the second press member, so as to produce a forged product.

Abstract: A method for fabricating a straight fin heat sink (50) of the type having a base (52) and a plurality of fins (54) extending from the base is disclosed. Each fm (54) of the plurality of fins of the heat sink is spaced from one another a predetermined distance and lies along a plane generally parallel to planes of the other fins of the plurality of fins. The method includes: providing a die (20) configured to produce a heat sink (30) having a base (32) and a plurality of fins (34) attached to be base in a radial fashion about the base from at least one side of the base; extruding a blank of material through the die (20) to produce the heat sink (30); and compressing the plurality of fins (34) with a compression tool (40) so that the plurality of fins (54) extend from the base along planes generally parallel to each other.

Abstract: A forming die assembly includes an upper die including a first backup member and a first press member that is attached to the first backup member, has an L shape in a vertical sectional view, and is heat-resistant; and a lower die including a second backup member and a second press member that is attached to the second backup member, has an L shape in the vertical sectional view, and is heat-resistant. The first press member and the second press member press upper and lower surfaces of a workpiece accommodated in a press space that is formed between the first press member and the second press member, so as to produce a forged product.

Abstract: A cleaner composition includes: a saturated aliphatic hydrocarbon (A); an anionic surfactant (B); a nonionic surfactant (C); and water (D). The cleaner composition contains the saturated aliphatic hydrocarbon (A) in a proportion of 60.0% by mass to 85.0% by mass, the anionic surfactant (B) in a proportion of 8.0% by mass to 15.0% by mass, the nonionic surfactant (C) in a proportion of 2.0% by mass to 5.0% by mass, and the water (D) in a proportion of 1.0% by mass to 20.0% by mass, forms a W/O microemulsion or a solubilized W/O emulsion, and has a volume resistivity of 1×109 ?·cm or less.

Abstract: An object is to provide a fin integrated type semiconductor device and a method of manufacturing the same, which are provided with a simple structure and good heat dissipation characteristics. The semiconductor device includes: a base plate on which fins arranged in a standing condition are formed on a first main face; an insulating layer formed on a second main face of the base plate, the second main face being opposite to the first main face of the base plate; a circuit pattern fixed to the insulating layer; and a semiconductor element joined to the circuit pattern. The fins are formed with slits that pass through in the thickness direction of the fins.

Abstract: Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes: an active region provided on a substrate; an inlet channel formed as a single cavity buried in one side of the substrate; an outlet channel formed as a single cavity buried in the other side of the substrate; a micro channel array comprising a plurality of micro channels, wherein the plurality of micro channels are formed as a plurality of cavities buried in the substrate, and one end of the micro channel array is connected to a side of the inlet channel and the other end of the micro channel array is connected to a side of the outlet channel; and a micro heat sink array separating the micro channels from one another.

Abstract: A heat exchanger (30) includes vertically arranged flat tubes (33) and plate-like fins (36) arranged in the direction in which the flat tubes (33) extend. The flat tubes (33) are inserted into notches (45) of the fins (36). Parts of the fins (36) between vertically adjacent ones of the notches (45) are windward plate parts (70), and parts of the fins (36) at leeward sides of the notches (45) are leeward plate parts (75). Each of the windward plate parts (70) includes windward heat transfer promotion parts (71) constituted by protrusions (81-83) and louvers (50a, 50b). On the plate parts (75), leeward heat transfer promotion parts (76) constituted by leeward protrusions (84) are provided. The heat transfer promotion parts (76) are located at leeward sides of the notches (45), and overlap with the heat transfer promotion parts (71) when viewed from front edges (38) of the fins (36).

Abstract: A semiconductor device includes a base plate having a first major plane and a second major plane opposite to each other, and having a plurality of fins held upright on the first major plane and a bulge portion formed on the first major plane to encircle the plurality of fins, an insulation layer formed on the second major plane of the base plate, a circuit pattern fixed to the insulation layer, a semiconductor element connected to the circuit pattern, and a sealing resin sealing the insulation layer, the circuit pattern, and the semiconductor element. The bulge portion formed on the first major plane continuously encircles the plurality of fins, the bulge portion has a widthwise margin on an outer peripheral edge of the base plate, and the sealing resin covers an outer peripheral side face of the bulge portion and the widthwise margin.

Abstract: A heat transfer system includes a heat exchanger configured to transfer heat between a first fluid and a second fluid. The heat exchanger includes an outer sleeve and a microchannel unit. The outer sleeve has an interior surface defining a cavity and an exterior surface configured to be in direct thermal communication with the first fluid. The microchannel unit is received in the cavity. The microchannel unit has a plurality of microchannels configured to receive the second fluid therein and be in direct thermal communication with the second fluid. The microchannel unit has an exterior surface in direct thermal communication with the interior surface of the outer sleeve to transfer heat therebetween. At least one of the interior surface of the outer sleeve and the exterior surface of the microchannel unit has grooves defining breach channels for the first fluid or the second fluid should a breach in the outer sleeve or the microchannel unit occur.

Abstract: Cookware comprising a selectively bonded composite of at least two layers of materials wherein the first of the at least two layers of materials has a plurality of spaced-apart bubbles formed on its surface, defining a cooking surface of the cookware, and a second layer of two layers of material is bonded thereto, wherein the bonding between the bubbles and the second material is of a lesser degree than the bonding between the first and second layers of materials in areas intermediate the bubbles, whereby a coefficient of heat conductivity is greater in the intermediate areas than in the bubbles.

Abstract: A heat exchanger comprises a first plate and a second plate. A coolant flow passage is formed by brazing the first plate and the second plate by use of a first brazing filler metal. A pipe is brazed between a first groove portion provided in the first plate and a second groove portion provided in the second plate by use of a second brazing filler metal. A pair of first flanges provided contiguously with the first groove portion. Each of the first flanges includes an inner surface. A pair of second flanges provided contiguously with the second groove portion. Each of the second flanges includes an inner surface. At least one of the inner surfaces of the first flanges and the inner surfaces of the second flanges is covered with the second brazing filler metal. The first and second flanges are held by jigs upon brazing of the pipe.

Abstract: A heat dissipating device includes a base and a heat dissipating fin. The base includes an accommodating recess formed thereon. The heat dissipating fin includes a heat dissipating portion and a protruding portion, wherein the protruding portion protrudes from an end of the heat dissipating portion and is disposed in the accommodating recess. The base and the heat dissipating fin are combined with each other by a punching process, such that a first side wall of the accommodating recess covers at least a part of the protruding portion.

Abstract: The present invention provides an apparatus and method for heat exchange. Embodiments of the present invention include a method and apparatus for heat exchange employing a unit cell using interior and exterior fins, the interior fins disposed within a flattened envelope structure. In one particular embodiment, the heat exchanger is directed for use as a gas engine recuperator.

Abstract: An end-piece for a plate heat exchanger comprises a frame part having an inner portion, an outer portion and an intermediate portion arranged between the inner and outer portions. An outer wall surface of the inner portion faces a first surface of a package of heat transfer plates comprised in the plate heat exchanger. The first surface has a center portion and a peripheral portion encircling the center portion. The frame part is extruded and the intermediate portion of the frame part comprises a first number of cavities extending in an extrusion direction of the frame part. The extrusion direction is parallel to an axis of the frame part. Further, outer dimensions of the outer wall surface of the inner portion are at least as large as outer dimensions of the center portion of the first surface of the package of heat transfer plates.

Abstract: Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller. A user is able to enter the controlling parameters into the programmable logic controller through an human operator interface. The thermal heads are able to be connected with one or more pneumatic solenoid to make the thermal heads moving vertically until the thermal head in contact with the heat sink. The thermal head is able to provide a temperature, at or above the operating temperature of the thermal pad, capable of making the phase change thermal interface material to bond the heat sink and the electronic boards.