Utilizing Bond Inhibiting Material Patents (Class 29/890.041)
  • Patent number: 9653763
    Abstract: A heat exchanger assembly includes a fluid transfer layer and a first external layer. The fluid transfer layer is made from an elastomeric material and the first external layer includes flexible graphite. The fluid transfer layer includes at least one channel and is configured to form a passage for receiving a thermal transfer fluid between the channel and a portion of the first external layer.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: May 16, 2017
    Assignee: Advanced Energy Technologies LLC
    Inventors: Ryan J. Wayne, Jonathan Andrew Taylor
  • Patent number: 8839519
    Abstract: A scalable method of edge cooling and making a cold chassis for electronic modules. The steps include fabrication of modular cooling ribs, each including microchannels along the cooling edge and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a chassis frame member. The rib flanges are sealed (e.g. friction stir welded) with respect to the frame member. The Application includes new and retrofit environments with increased cooling needs and multi-scaled manufacturing.
    Type: Grant
    Filed: November 16, 2009
    Date of Patent: September 23, 2014
    Assignee: Raytheon Company
    Inventors: David H. Altman, Scott R. Cheyne, Anurag Gupta
  • Patent number: 8205337
    Abstract: The present invention is a method for fabricating a thermal spreader. The method may include laminating a plurality of layer portions together to fabricate a mechanically flexible substrate. The method may further include providing an internal channel within the mechanically flexible substrate, the internal channel configured for containing an electrically-conductive liquid, the internal channel being further configured to allow for closed-loop flow of the electrically-conductive liquid within the internal channel. The method may further include integrating a pump with the mechanically flexible substrate. The method may further include fabricating a plurality of rigid metal inserts. The method may further include forming a plurality of extension portions on a surface of each rigid metal insert included in the plurality of rigid metal inserts. The method may further include connecting the plurality of rigid metal inserts to the mechanically flexible substrate.
    Type: Grant
    Filed: September 12, 2008
    Date of Patent: June 26, 2012
    Assignee: Rockwell Collins, Inc.
    Inventors: Nathan P. Lower, Ross K. Wilcoxon, James R. Wooldridge, David W. Dlouhy
  • Patent number: 7849598
    Abstract: A method for manufacturing an isothermal plate includes the steps of preparing a plurality of heat pipes, a first plate body and a second plate body; pressing on the second plate body to form a plurality of shielding covers recessed into the bottom surface of the second plate body and protruding from the top surface of the second plate body, the recessed portion of each shielding cover having a cambered space for horizontally accommodating the heat pipe therein; disposing each heat pipe into each cambered space to make the first plate body adhered to the bottom surface of the second plate body and the two plate bodies overlapped with each other; and applying an external force to the second plate body to bring each heat pipe into a tight and planar contact with the inner wall of its corresponding cambered space in the direction of pressing.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: December 14, 2010
    Assignee: Jaffe Limited
    Inventor: Hul-Chun Hsu
  • Patent number: 7836597
    Abstract: An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
    Type: Grant
    Filed: January 6, 2006
    Date of Patent: November 23, 2010
    Assignee: Cooligy Inc.
    Inventors: Madhav Datta, Mark McMaster, Rick Brewer, Peng Zhou, Paul Tsao, Girish Upadhaya, Mark Munch
  • Patent number: 7673389
    Abstract: Cold plate apparatuses and methods of fabrication are provided for facilitating cooling of an electronics component. The fabrication approach includes: forming a tube with a first metal and having first and second ends with a heat transfer region disposed therebetween; positioning the heat transfer region of the tube within a mold and casting a heat sink member around the tube by contacting a second metal in molten form over the tube, wherein the first and second metals react peritectically to form an alloy layer between the tube and the heat sink member, and a metallurgical bond is formed between the tube and heat sink member with cooling of the molten second metal; and controlling casting of the heat sink member to minimize a thickness of the alloy layer to enhance a heat transfer characteristic of the metallurgical bond formed between the tube and the heat sink member.
    Type: Grant
    Filed: July 19, 2005
    Date of Patent: March 9, 2010
    Assignee: International Business Machines Corporation
    Inventors: Bret W. Lehman, Roger R. Schmidt, Prabjit Singh
  • Patent number: 7669327
    Abstract: Methods of applying an ozone-depleting catalytic coating to a heat exchanging device for producing a durable surface with optimal ozone depletion characteristics are provided. An adhesively coated metallic substrate is exposed to a concentration of ozone-depleting catalytic particles, wherein the receptive surface of the coated substrate binds the ozone-depleting catalytic coating.
    Type: Grant
    Filed: September 1, 2004
    Date of Patent: March 2, 2010
    Assignee: JW Aluminum Company
    Inventor: Mark Thompson
  • Patent number: 7467467
    Abstract: A method for manufacturing a heat exchanger, including forming at least one flexible heat exchanging assembly with first and second adjacent conduits defined therein, shaping the flexible heat exchanging assembly, and heating the heat exchanging assembly to transform at least a portion of the flexible heat conducting material into a rigid heat conducting material.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: December 23, 2008
    Assignee: Pratt & Whitney Canada Corp.
    Inventor: Lev Alexander Prociw
  • Patent number: 7446412
    Abstract: Some aspects include a heat sink base, an upper metal cladded to an upper surface of the heat sink base, the upper metal defining at least one groove, and a heat sink fin disposed in the groove and secured to the upper metal. Some aspects may also include a lower metal cladded to a lower surface of the heat sink base, and a pedestal secured to the lower cladding.
    Type: Grant
    Filed: March 28, 2006
    Date of Patent: November 4, 2008
    Assignee: Intel Corporation
    Inventor: Paul J Gwin
  • Publication number: 20070246824
    Abstract: According to some embodiments, an outer metal is cladded to a core metal to create a cladded heat sink fin, the cladded heat sink fin is inserted in a groove of a heat sink base, and the outer metal is heated to a reflow temperature of the outer metal. Embodiments may alternatively include a heat sink base, an upper metal cladded to an upper surface of the heat sink base, the upper metal defining at least one groove, and a heat sink fin disposed in the groove and secured to the upper metal. Further to the foregoing, embodiments may include a lower metal cladded to a lower surface of the heat sink base, and a pedestal secured to the lower cladding.
    Type: Application
    Filed: March 28, 2006
    Publication date: October 25, 2007
    Inventor: Paul Gwin
  • Publication number: 20060225283
    Abstract: In manufacturing brazed, double wall plate heat exchangers the double walls (5, 6) should comprise areas (5a, 5b) connected and sealed to each other around the port holes of the exchanger. This is obtained thereby that the said areas (5a, 5b) are shaped such as to comprise areas not covering each other. The brazing is thus established by capillary suction of brazing material from other plate areas.
    Type: Application
    Filed: June 9, 2004
    Publication date: October 12, 2006
    Applicant: SWEP INTERNATIONAL AB
    Inventors: Per Rissler, Peter Nilsson
  • Patent number: 7047640
    Abstract: A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.
    Type: Grant
    Filed: March 1, 2005
    Date of Patent: May 23, 2006
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Meng Fu, Chi Liang
  • Patent number: 6971169
    Abstract: This invention concerns a heat-resistant assembly having a heat-resistant block conformed to the contours of boiler tubes and the surface of their connecting rib. The heat-resistant assembly has an arm which protrudes from the surface of the rib toward the heat-resistant block and which has a catch on the end. The block has an indentation in which the catch on the arm engages. The block can be hung on or removed from the tube assembly by means of the arms and indentations. The heat-resistant assembly is further distinguished by the fact that a space is created between the end of the arm and the indentation of the block. A fusible substance, which will melt when the temperature of the arm exceeds a given value, is placed in the space. The heat-resistant assembly is further distinguished by the fact that an indentation is formed in the block in which a heat-resistant sleeve is adhered to engage the arm. This arrangement makes it possible to manufacture the heat-resistant block using press molding.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: December 6, 2005
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Yasuhiro Terashima, Yuji Nakagawa, Keita Inoue, Minoru Ike
  • Patent number: 6871399
    Abstract: In a fin forming step, fins of heat exchangers are formed into a connected state where the fins are connected to each other via a parting portion. In a fin attaching step, the fins in the connected state are temporarily attached to the respective heat exchangers. In a fin fixing step, an integrated heat exchanger in which the fins are temporarily attached is passed through a heating oven to braze the fins to the respective heat exchangers. In a fin separating step W4, the fins in the connected state of the respective heat exchangers are separated from each other in the parting portion. Therefore, each of the heat exchangers can independently perform a heat exchanging operation without being affected by heat conduction from the other heat exchanger via the fins.
    Type: Grant
    Filed: January 24, 2003
    Date of Patent: March 29, 2005
    Assignee: Calsonic Kansei Corporation
    Inventors: Mitsuru Iwasaki, Kazunori Namai, Hiroshi Chikuma
  • Patent number: 6829824
    Abstract: A method for producing a component out of stacked plates (9, 10) soldered to one another, into at least some of which recesses (11, 12, 13) are made, is proposed, in which at least one solder layer (8) is provided between the plates (9, 10) for a solder diffusion process. According to the invention, the plates (9, 10), with solder layers (8) between them, are stacked on one another and compressed in the cold state before the solder diffusion process. With this provision, the use of complicated pressing tools in the actual solder diffusion process is avoided.
    Type: Grant
    Filed: May 8, 2003
    Date of Patent: December 14, 2004
    Assignee: Robert Bosch GmbH
    Inventors: Wilfried Reschnar, Stephan Borges, Stephan Leuthner, Juergen Hackenberg, Franz Wetzl