Abstract: A cooling liquid can be circulated in a liquid cooling system, so that a light source unit and a control unit can be forcedly cooled by the cooling liquid. Thus, a temperature increase in these components can be suppressed, thereby achieving an increase in the output power of a liquid-cooled LED lighting device. The liquid-cooled LED lighting device can include a housing, a light source unit having LEDs as light sources, a liquid cooling system, and a control unit to control the light source unit to be turned on. The liquid cooling system can include a heat receiving jacket, a radiator, a circulation pump and a fan. The light source unit and the control unit can be disposed with the heat receiving jacket of the liquid cooling system interposed therebetween. Further, one surface of the control unit can be brought in close contact with the heat receiving jacket while a heat radiation portion (e.g., fins or pins) can be provided at an other surface of the control unit.

Abstract: A self-cooling screw bulb-type electromagnetic induction lamp comprises a bulb body, an inner tube, amalgam and a coupler, wherein the inner tube is arranged inside the bulb body, and the coupler is arranged inside the inner tube; besides, the lamp further comprises a screw-type lamp cap and a radiating piece, wherein the bulb body is connected on the screw-type lamp cap through the radiating piece, and the coupler is connected with the radiating piece. The disclosure effectively solves the problem that the installation of the electromagnetic induction lamp is incompatible with the conventional lighting fitting, while effectively improving the heat-radiating efficiency and the performances, thereby facilitating the promotion, popularization, application and development of the electromagnetic induction lamp.

Abstract: Lighting apparatus and methods employing LED light sources are described. The LED light sources are integrated with other components in the form of a luminaire or other general purpose lighting structure. Some of the lighting structures are formed as Parabolic Aluminum Reflector (PAR) luminaires, allowing them to be inserted into conventional sockets. The lighting structures display beneficial operating characteristics, such as efficient operation, high thermal dissipation, high output, and good color mixing.

Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region.

Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.

Abstract: Disclosed is a light emitting device package. The light emitting device includes a package body having a cavity defined by a sidewall and a bottom surface, a light emitting device disposed in the cavity, a radiator inserted into the package body and disposed below the light emitting device, and a second electrode pattern disposed around the radiator and electrically connected to the light emitting device via wire bonding. The second electrode pattern includes a first region to which a wire is bonded, and a second region connected to the first region, and a width of the first region differs from a width of the second region.

Abstract: An object of the present invention is to provide a light emitting element lamp and a lighting equipment effectively suppressing a temperature rising of a substrate on which a light emitting element is mounted by using a reflector.

Abstract: An illumination apparatus comprises a base, a heat sink group, and at least one fastening arm. The base is made of material with high heat conductivity and has a first surface and an opposite second surface for receiving a light source. The heat sink group is placed on the first surface and comprises three types of heat sinks arranged in three lines extending along a lengthwise direction of the base. The fastening arm has a recess defined therein. First and second heat sinks are alternately arranged on each of outer two lines of the heat sink group. Third heat sinks are arranged on the middle line. Each third heat sink is positioned between two first heat sinks at one side thereof and two second heat sinks at the other side thereof.

Abstract: The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.

Abstract: A lamp device includes: a housing formed with heat-dissipating holes; a conductive connecting head mounted on a first side of the housing; a heat-conducting member mounted on a second side of the housing opposite to the first side, and having opposite first and second side surfaces; a lighting unit thermally contacting and mounted on the first side surface of the heat-conducting member, and covered by a transparent body; and a heat-dissipating layer made of an infrared radiating material. The heat-dissipating layer is disposed on and is in thermal contact with the second side surface of the heat-conducting member. Heat generated by the lighting unit is transmitted by the first heat-conducting member to the heat-dissipating layer, and is dissipated by the heat-dissipating layer through the heat-dissipating holes in the housing.

Abstract: A heat dissipating device for lightings includes a light source module, a heat sink, and a converter. The heat sink has a substrate and a plurality of heat dissipating fins extending outward from the substrate. A plurality of channels is formed between the heat dissipating fins. Insides of the channels respectively have a port open to the center of the heat sink. Thereby, the channels of the heat sink can effectively direct the airflow into the center of the heat sink, enhancing the heat dissipating effect of the heat sink.

Abstract: A heat sink is provided. The heat sink may include an open cavity formed by a cavity wall, a cavity bottom wall thereof including a light source region adapted to have a light source mounted thereon and a lateral cavity wall thereof including a reflection region adapted to reflect light emitted from the light source; a heat spreading and dissipation structure covering at least part of an exterior of the heat sink including a bottom region and a lateral region, the heat spreading and dissipation structure including a plurality of vertically aligned fins; an air guidance structure adapted to separate the heat sink from an air flow generator; and at least one mounting column for attaching the heat sink to a lighting device.

Abstract: A LED lamp with straight tube comprises a tube body, a lamp cover sheathed at two ends of the tube body and a lamp strip which is in inserted connection in the tube body and comprises a circuit board and a heat diffuser; the lamp cover is internally, fixedly provided with a connecting device connected with the lamp strip; the connecting device comprises a connecting piece on which a connecting arm extending along the length direction of the lamp strip is arranged; the connecting arm is provided with a buckle body; the corresponding position on the surface of the lamp strip is provided with a buckle seat matched with the buckle body; and the circuit board is overlapped and adhered with the radiator to be into a whole through an insulating heat conducting layer.

Abstract: The lighting apparatus according to the present invention includes a thermal source such as a light source or a power supply unit and a heat releasing portion for releasing heat from the thermal source, and further includes the first heat radiation film formed by applying a coating material containing a heat radiating material on the surface of the heat releasing portion and curing the material. Since the first heat radiation film is formed by curing the material containing a heat radiating material, heat emittance by infrared is improved compared to the case with a heat radiation film formed by anode oxide coating (alumite treatment), thereby enhancing the heat releasing performance while maintaining the heat releasing performance by heat radiation for a long period of time because of the high resistance to damages.

Abstract: The core of this invention is that using recycled metal cans (after pretreatment processes) as a good heat sink, the lamp cups, of the LED lamps to adhere to the lamp bases, circuit boards with LED and lamp cups through advanced technology, there by producing a variety of LED lamps. And finally, this invention achieves a complete metal construction of LED lamps which not only improves the thermal performance of LED lamps but also develops a low-carbon, environmentally friendly and economical way of metal containers recycling consequently makes this LED lamps suitable to be widely used for the purpose of illumination or decoration.

Abstract: A light emitting diode (LED) light bulb includes a light shade, a heat conduction base, a plurality of heat sink fins, a heat conduction member and a plurality of LED light emitting elements. The heat conduction base has a circumferential portion connected with the plurality of heat sink fins and a central hole to accommodate the heat conduction member. The heat conduction member has an exposed end formed with a plurality of inclined planes and a top plane by stamping. Each of the inclined planes and the top plane are coupled with at least one of the LED light emitting elements, respectively. With the inclined planes and the top plane, the LED light emitting elements project light in different directions. The heat from the LED light emitting elements is transmitted to the plurality of heat sink fins through the heat conduction member to dissipate the heat quickly.

Abstract: An LED-based light can include a highly thermally conductive base having multiple radially outward projecting nodes. The nodes can be spaced apart in an axial and circumferential directions of the base. An electrical connector and at least one LED can be attached to the base, and a light transmitting bulb can be attached to the base and can cover the at least one LED. The geometry of the base can promote heat dissipation, which can allow the at least one LED to use enough power to produce an amount of luminosity that allows the LED-based light to replicate, for example, an incandescent light without overheating.

Abstract: The present invention relates to a LED lamp and a heat sink thereof having a wound heat pipe. The LED lamp includes the heat sink, a LED module and a lamp base electrically connected to the LED module. The heat sink includes a heat-conducting base, a heat-dissipating fin set and a wound heat pipe. The heat-dissipating fin set includes a plurality of heat-dissipating fins arranged at the outer periphery of the heat-conducting base. The heat-dissipating fins form an accommodating space. The wound heat pipe includes an evaporating section brought into thermal contact with the heat-conducting base and a condensing section brought into thermal contact with the heat-dissipating fins. The LED module abuts against the heat-conducting base and the evaporating section. By this structure, the heat-conducting path is shortened, the heat-conducting speed is accelerated, and the heat is rapidly and uniformly distributed to the heat-dissipating fins to improve the heat-dissipating efficiency.

Abstract: A lamp structure includes a transparent cap, a lamp housing, a ring section, a separating pad, and a lamp board. The lamp housing has heat dissipating fins annularly arranged around the lamp housing. An end of each of the heat dissipating fins adjacent to the transparent cap has a groove, and the transparent cap covers the top of the groove. The ring section connects the end of each of the heat dissipating fins adjacent to the transparent cap. The separating pad is disposed on the bottom of the groove and extends along a sidewall of the groove to a region below the transparent cap to form a separating wall. The lamp board having light emitting diode devices is disposed in a containing space between the transparent cap and the separating pad to preclude damages caused by electrostatic discharge.

Abstract: An object is to provide a lighting apparatus the cost of which is low, which is excellent in terms of heat dissipation capacity, and which does not make a human get burned even in the case where the human directly touches the lighting apparatus. An LED substrate unit (1) is mounted on a metal heat conduction plate (3) with high heat conductivity. Resin heat radiation plates (4, 5) with high thermal emittance and low heat conductivity are adhered to the entire exposure surface of both surfaces of the heat conduction plate (3) except for a portion on which the LED substrate unit (1) is mounted. Thus, a three layer structure is formed of the heat conduction plate and the heat radiation plates provided on both surfaces of the heat conduction plate. Heat discharged from the LED substrate unit (1) is diffused in the heat conduction plate (3) and transmitted to the resin heat radiation plates (4, 5), and the transmitted heat is discharged from the resin heat radiation plates (4, 5) to outer air.

Abstract: A heat dissipating device for lightings includes a light source module, a heat sink, and a converter. The heat sink has a substrate and a plurality of heat dissipating fins extending outward from the substrate. A plurality of channels is formed between the heat dissipating fins. Insides of the channels respectively have a port open to the center of the heat sink. Thereby, the channels of the heat sink can effectively direct the airflow into the center of the heat sink, enhancing the heat dissipating effect of the heat sink.

Abstract: An improved incandescent lamp and incandescent lighting system are disclosed, for projecting a beam of light with substantially improved energy efficiency. The incandescent lamp includes a pair of reflective ceramic filament supports for supporting one or more filaments in prescribed position(s) within an envelope while reflecting back substantially all visible and infrared light for incorporation into the projected beam or for absorption by the filament(s).

Abstract: The LED lamp of the invention includes a base, a heat dissipation assembly and a circuit board. The heat dissipation assembly has a cylindrical casing. Two ends of the casing are formed with a tube connecting the base and a mount portion, respectively. The casing is provided with radial fins which extend from the mount portion but do not connect with the tube. Slots are formed between the fins and the casing. The circuit board which is mounted by LEDs is fastened on one end of the heat dissipation assembly.

Abstract: A rotatable heat dissipating device includes a heat-transfer element and a heat-dissipation element. The heat-transfer element includes a flat main body, a heat transfer section extended from one face of the main body. The heat-dissipation element includes base having a recess provided on one face oriented toward the main body, a heat radiating section, and a connecting section extended between the base and the radiating section. The main body is rotatably received in and connected to the recess of the base, enabling the rotatable heat dissipating device to flexibly connect to a heat-producing unit in different directions without the need of using any external adaptor. Therefore, the rotatable heat dissipating device provides upgraded heat dissipation efficiency and can avoid thermal resistance due to too many adaptors between different elements.

Abstract: A light source module including a heat dissipation block, a light emitting diode (LED) package and a circuit board is provided. The heat dissipation block has a surface and the LED package is disposed on the surface of the heat dissipation block. The circuit board is electrically connected to the LED package, and the circuit board and the LED package are located at two opposite sides of the heat dissipation block respectively.

Abstract: The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.

Abstract: An LED lamp includes a lamp holder, a heat sink, a light source and an envelope. The lamp holder is configured for electrically connecting with a power source. The heat sink is connected to the lamp holder. The light source is mounted on the heat sink. The envelope is mounted on the heat sink and covers the light source. The envelope has a light incident surface and a light output surface opposite to the light incident surface. A plurality of lens are formed on the lamp envelope and configured for collecting light rays generated by the light source.

Abstract: Disclosed is a cooling apparatus of a discharge lamp for applying a heat spreading plate to a high intensity discharge lamp or for applying both a heat spreading plate and a cooling fan to a high intensity discharge lamp so as to improve the durability of an embedded electronic ballast and to increase an optical output efficiency of a discharge lamp.

Abstract: Disclosed is a lighting device. The lighting device includes: a substrate; a light emitting device disposed on the substrate; a heat radiating body radiating heat from the light emitting device; and a pad being interposed between the substrate and the heat radiating body and transferring heat generated from the light emitting device to the heat radiating body and comprising silicon of 10 to 30 wt %, a filler of 70 to 90 wt %, glass fiber of 2 to 7 wt % in terms of weight percent (wt %).

Abstract: An LED comprises a substrate, an LED chip mounted on the substrate, an encapsulation encapsulating the LED chip, and a phosphor layer containing phosphor particles disposed on an outer surface of the encapsulation. A luminous intensity I of light generated by the LED chip and a radiation angle ? are in Lambertian distribution and satisfy following formula: I=I0×cos ?, here the radiation angle ? is not lower than 0°, and is not higher than 90°, and I0 is a luminous intensity at a central axis of the LED chip, and the radiation angle ? is an angle between the light and the central axis. One of parameters of concentration, particle number of the phosphor particles in the phosphor layer and a thickness of the phosphor layer is also in Lambertian distribution relative to the radiation angle ?.

Abstract: An extended-life lamp with integral cooling includes a circular central body having a proximal end terminating in a male screw base and a distal end having a light source. A pair of electrical conductors from the male screw base pass through an electrically-insulating, heat-conducting matrix within the central body to the electrodes of the light source. Heat generated by the light source and electrodes, as well as any heat generated by power-conditioning components, such as a fluorescent ballast or an incandescent low-voltage transformer, is conducted through the matrix to a circular heat-conductive, heat-emissive radiator, thermally bonded to the central body and emitting lamp heat from the cooling fins.

Abstract: Various exemplary embodiments of an illumination apparatus are disclosed.

Abstract: The light emitting part is obtained by depositing fluorescent materials on a metal plate with a predetermined shape to form a fluorescent material film. The fluorescent material emits light upon irradiation with a laser beam.

Abstract: A light-emitting diode (LED) lamp device includes at least one light-emitting module and a heat-dissipation module. The heat-dissipation module includes a plurality of cooling fins arranged in a radial pattern and connected annularly at intervals around the light-emitting module. Each of the cooling fins has an outer rim folded back a predetermined distance toward the light-emitting module to form a bent edge. The bent edges are formed with arcuate folded-back portions so that the cooling fins have rib-like outer perimeters after the bent edges are formed. Thus, the LED lamp device is allowed to be held safely by the folded-back portions while the cooling fins are structurally strengthened.

Abstract: A fluorescent lamp can be configured to prevent a decrease in luminescent efficiency when located in a high temperature room. The fluorescent lamp can include a couple of stems each including an emitter electrode located opposite to each other at each end of a tube, a filler gas located in the tube, a damping material and a coolest portion connected to the tube via the stem and the damping material. The coolest portion can be configured with a first material that has a higher thermal conductivity than the conductivity of both the tube and the stems. The damping material can be configured with both the first material and a second material that has a lower conductivity than the conductivity of the first material. A content ratio of first material vs. second material can change along a length of the damping material. Thus, the coolest portion can maintain a favorable temperature and the fluorescent lamp can maintain a favorable luminescent efficiency even when in a sealed casing.

Abstract: A light source having a substrate with a plurality of component LED light generators mounted thereon is disclosed. The substrate has a first metallic surface characterized by a normal that points in a normal direction. The first metallic surface is in contact with air over the first metallic surface. The component LED light generators are mounted directly on the first metallic surface. Each component LED light generator includes an LED characterized by an operating temperature and emitting light in the normal direction. Each LED generator generates more than 0.5 watts of heat. The component LED light generators are spaced apart on the first metallic surface such that the operating temperature remains less than 75° C. above the air temperature. In one aspect of the invention, the first metallic surface surrounding each component LED light generator radiates an amount of heat equal to the heat generated by that component LED light generator.

Abstract: Lighting fixtures using light-emitting devices are disclosed with heat sinks that are both decorative and functional by providing heat dissipation for the light-emitting devices used therein. A lighting fixture can contain an insert portion for removably attaching to a heat sink. A light-emitting device can be mechanically coupled and attached to the heat sink while simultaneously electrically coupling and connecting the light-emitting device. A lamp shade can be secured to the heat sink by attachably engaging with a retaining portion of the insert portion. The fixture comprises a lamp shade wherein at least a portion of a body of the heat sink forming a decorative portion can extend outward from the lamp shade.

Abstract: An LED package structure for increasing light-emitting efficiency includes a heat-dissipating unit, an insulating unit, a light-emitting unit and a conductive unit. The heat-dissipating unit has a heat-dissipating substrate. The insulating unit has an insulating layer formed on the heat-dissipating substrate and at least one receiving groove passing through the insulating layer and formed above the heat-dissipating substrate. The insulating layer has a top surface on a top side thereof and an inner surface, and the inner surface of the insulating layer is an annular inclined surface in the receiving groove. The light-emitting unit has at least one light-emitting element received in the receiving groove and disposed on the heat-dissipating substrate.

Abstract: An illumination system adapted for a projection apparatus is provided. The illumination system comprises a cooling air guiding apparatus, a lamp, and a cooling fan. The cooling air guiding apparatus comprises an air intake device and an adjustment device, while the adjustment device comprises an air-flow adjustment element and an air-flow guiding element. The cooling fan generates a cooling air, which flows from the exterior through the air intake device into the air-flow adjustment element. The air-flow guiding element guides the cooling air in the air-flow adjustment element out of an air-flow adjustment hole towards a specific direction. Since the adjustment device may move relatively to the air intake device, the air-flow adjustment hole is adapted to move from the first position substantially aligned with the opening to the second position constituting a substantial displacement with respect to the opening. The cooling air can cool the lamp no matter what angle the projection apparatus is disposed.

Abstract: A lamp uses a solid state source to pump one or more doped semiconductor nanophosphors to produce a light output of a desired characteristic. The nanophosphor(s) is dispersed in a material, examples of which include liquids and gases. Various nanophosphors are discussed. In the examples, the material with the doped semiconductor nanophosphor(s) dispersed therein appears at least substantially clear when the lamp is off. The exemplary lamp also includes circuitry for driving the solid state source and a housing that at least encloses the drive circuitry. The lamp has a lighting industry standard lamp base mechanically connected to the housing and electrically connected to provide electricity to the circuitry for driving the solid state source.

Abstract: A flat panel OLED device including a transparent deformable substrate having first and second sides and defining a predetermined illumination region and a non-illumination region; a moisture-sensitive OLED disposed over the first side of the transparent substrate within the illumination region and means for applying electrical signals to the OLED which causes the OLED to produce light and heat; a protective layer disposed over the OLED; a flexible encapsulating foil disposed over the protective layer, but not attached thereto; and a rigid chassis structure operatively associated with the transparent deformable substrate for dissipating the heat and providing rigidity to the transparent deformable substrate.

Abstract: A flat panel OLED device including a transparent deformable substrate having first and second sides and defining a predetermined illumination region and a non-illumination region; a moisture-sensitive OLED disposed over the first side of the transparent substrate within the illumination region and means for applying electrical signals to the OLED which causes the OLED to produce light and heat; a protective layer disposed over the OLED; a flexible encapsulating foil disposed over the protective layer, but not attached thereto, and which dissipates the heat and sealingly connected to the substrate in the non-illumination region; and a rigid chassis structure operatively associated with the transparent deformable substrate for providing rigidity to the transparent deformable substrate.

Abstract: The present invention is to provide an LED lamp, which comprises a heat dissipation housing formed with a receiving hole axially passed therethrough, an insulation housing, an electrode cap connected to the insulation housing, a power PCB, and an installation base plate having a first side installed with at least one LED. A manufacturer only needs to firstly insert the insulation housing along with the electrode cap into the receiving hole for allowing the electrode cap to be extended out of a lower end of the heat dissipation housing, then insert the power PCB into the insulation housing and electrically connect the power PCB to the electrode cap, and finally position a second side of the installation base plate on the upper end of the heat dissipation housing and electrically connect the installation base plate to the power PCB, so as to rapidly complete the installation of the LED lamp.

Abstract: A modular LED unit having a number of LED modules separately mounted on individual interconnected preferably-extruded heat sinks, each heat sink having: a base configured to engage and hold an LED module in place and, in preferred forms, to facilitate the ganging of heat-sink/LED modules; and a plurality of fins, including inner-fins and side-fins, projecting from the opposite surface of the base and extending therealong, the side-fins having interlocking features to facilitate the ganging of heat-sink/module units together and, in preferred forms, to facilitate interconnection of the modular LED unit to other portions of a lighting fixture.

Abstract: The present invention relates to a heat dissipating device. More particularly, the present invention relates to a heat dissipating device in which an air flow is directed to a heat dissipating member by alternating rotation of blades within a preset range of angle for making a driving unit and a device thereof smaller, and improving heat dissipating efficiency.

Abstract: Disclosed is a lighting device. The lighting device includes: a substrate; a light emitting device disposed on the substrate; a driving unit supplying electric power to the light emitting device and connected to the substrate through a conductive line; a heat radiating body radiating heat from the light emitting devices and comprising a hole through which the conductive line to pass; and an insulator coupled with the hole and having a opening.

Abstract: Disclosed is a lighting device. The lighting device includes: a substrate; a light emitting device disposed on the substrate; a heat radiating body radiating heat from the light emitting device; and a pad being interposed between the substrate and the heat radiating body and transferring heat generated from the light emitting device to the heat radiating body and comprising silicon of 10 to 30 wt %, a filler of 70 to 90 wt %, glass fiber of 2 to 7 wt % in terms of weight percent (wt %).

Abstract: A plasma display apparatus is provided to reduce electromagnetic interference (EMI) emission, the plasma display apparatus including: a display panel; a plurality of conductive sheets of which first surfaces are connected to a rear surface of a lower panel; and a base chassis which is connected to second surfaces of the plurality of conductive sheets through a plurality of conductive substances. Therefore, emission of EMI generated while the plasma display panel is operating can be effectively reduced.

Abstract: An illumination apparatus includes a solid state light emitting source and a first radiator thermally coupled to the solid state light emitting source, wherein the radiator is configured to be connectable to a second apparatus. The illumination apparatus further includes a one or more electrical conductors coupled to the radiator, wherein the electrical conductors are adapted to couple electrically to the solid state light emitting source.

Abstract: A lamp comprising a solid state light emitter, the lamp being an A lamp and providing a wall plug efficiency of at least 90 lumens per watt. Also, a lamp comprising a solid state light emitter and a power supply, the emitter being mounted on a heat dissipation element, the dissipation element being spaced from the power supply. Also, a lamp, comprising a solid state light emitter and a heat dissipation element that has a heat dissipation chamber, whereby an ambient medium can enter the chamber, pass through the chamber, and exit. Also, a lamp, comprising a light emissive housing at least one solid state lighting emitter and a first heat dissipation element.