Abstract: A disclosed lighting apparatus includes a first dielectric sheet disposed on the first electrically conductive sheet and a second electrically conductive sheet disposed on the first dielectric sheet. A plurality of solid-state lighting (SSL) elements are electrically coupled to the first electrically conductive sheet and to the second electrically conductive sheet. The first electrically conductive sheet, first dielectric sheet, and second electrically conductive sheet have bends that configure the first electrically conductive sheet, first dielectric sheet, and second electrically conductive sheet in a three-dimensional shape.

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

Abstract: An organic electroluminescent display panel, a fabrication method thereof, and a display device are provided. The organic electroluminescent display panel includes: a base substrate and a package cover plate disposed opposite to each other, and an organic electroluminescent structure disposed on the base substrate and provided between the base substrate and the package cover plate. The package cover plate has a first groove for accommodating the organic electroluminescent structure within a display region of the organic electroluminescent display panel; the package cover plate has at least one second groove surrounding the first groove and having a closed boundary within a non-display region of the organic electroluminescent display panel; the second groove accommodates a sealant; and a metal layer is located between a protrusion portion of the package cover plate and the base substrate.

Abstract: An organic light-emitting diode display is disclosed. In one aspect, the display includes a substrate including a pixel area and a peripheral area surrounding the pixel area and an organic light-emitting element formed in the pixel area and including a first electrode, an organic emission layer, and a second electrode. The display also includes a common voltage line formed in the peripheral area and configured to provide a common voltage to the second electrode, wherein the common voltage line and the first electrode are formed of the same material.

Abstract: Trenched-bonding-dam devices and corresponding methods of manufacture are provided. A trenched-bonding-dam device includes a bonding dam structure positioned upon a top surface of a substrate. The bonding dam structure has a bottom surface attached to a top surface of the substrate, an inner dam surrounded by an outer dam, and a trench between the inner and outer dams. The device may further include an optics system including a lens and an adhesive positioned within a bonding region between a bottom surface of the optics system and a top surface of at least one of the inner and outer dams. The trench may be dimensioned to receive a portion of the excess adhesive flowing laterally out of the bonding region during bonding of the substrate to the optics system, laterally confining the excess adhesive and reducing lateral bleeding of the adhesive.

Abstract: The present invention relates to an organic light-emitting element and a production method thereof. Specifically, the present invention relates to an organic light-emitting element, which has excellent productivity during mass production thereof and may allow simplification of vapor deposition equipment, and the like, and a production method thereof.

Abstract: A method of manufacturing a light emitting device includes: providing an undivided base having a first main surface and a second main surface on the opposite side from the first main surface, the undivided base having conductive patterns disposed on the first main surface and conductive patterns disposed on the second main surface; mounting a plurality of light emitting elements on the conductive patterns on the first main surface; forming a light reflecting member that integrally covers side surfaces of the light emitting elements and the first main surface of the undivided base; and, after the forming of the light reflecting member, forming at least one groove on the second main surface of the undivided base at a position corresponding to a space between the light emitting elements so that the groove reaches the first main surface and the undivided base is divided into a plurality of base members.

Abstract: The present invention relates to a color-converting substrate of a light-emitting diode and a method for producing same, and more specifically to a color-conversion substrate of a light-emitting diode capable of completely protecting the quantum dots (QDs) supported in the interior from the exterior as hermetic sealing is possible, and a method for producing the color-converting substrate.

Abstract: Disclosed is an array substrate, a method of manufacturing the same, and a display device. The method of manufacturing an array substrate includes: forming a pattern comprising an active layer, a source, a drain, a data line and a pixel electrode on a base substrate through a single patterning process; forming a pattern of an insulating layer; forming a pattern comprising a gate and a gate line through a single patterning process. In the array substrate, the method of manufacturing the same, and the display device of the present invention, only two patterning processes are required to achieve the fabrication of the array substrate, which has less and simple process steps, thereby reduces the manufacturing complexity and manufacturing cost, and increasing the production efficiency and the economic benefit.

Abstract: Provided are an encapsulation film, an organic electronic device (OED) comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device can be prevented.

Abstract: A high-energy LED is provided, in particular based on the n-polar technique, comprising a Eu3+ activated converter material based on tungsten/molybdenum oxide. Surprisingly, these materials do not show any saturation.

Abstract: A lighting system is disclosed for illuminating a container, such as a purse or bag. In an embodiment, the opening of the container causes a magnet to move away from a magnetic switch, which closes a circuit and activates a light that illuminates the interior of the container. In an embodiment, a magnetic switch, light, and battery may be incorporated into a detachable unit that is attached to one side of the opening of a container. A second magnetic detachable unit attached to the other side of the opening may cooperate with the first unit to activate the light when the container is opened.

Abstract: A disclosed light-emitting device may provide white light with a cyan gap coinciding with a melanopic sensitivity range and thus having reduced melanopic content. The disclosed light-emitting device may include a light source providing violet or blue light with a peak wavelength under 450 nanometers (nm). The disclosed light-emitting device may include at least one down-converter coupled to and located downstream of the light source and configured with a long-wavelength onset to convert the spectrum of the violet or blue light to generate white light with a spectral power content in a 447-531 nm wavelength range that is less than or equal to 10% of a total spectral power content in a 380-780 nm wavelength range. The disclosed light-emitting device may be incorporated in a light engine system that further includes a control system that controls a drive current to the light-emitting device.

Abstract: An object is to provide an organic light-emitting panel and an organic light-emitting device capable of reducing ink repellence at portions of banks intersecting an insulating layer. Light-emitting units of the organic light-emitting panel are separated by the insulating layer and the banks. The insulating layer is disposed between first electrode units that are adjacent in a first direction, and the banks are disposed between first electrode units that are adjacent in a second direction. Portions of the banks that intersect with the insulating layer extend over the insulating layer in the first direction. Each of the portions of the banks over the insulating layer, in lateral cross-section, have a surface where an inclination angle ?1 and an inclination angle ?2 between the surface and a surface of the insulating layer satisfy ?1>20° and ?2>20°.

Abstract: To prevent cracks on a sealing glass or a substrate in a LED package in which a light-emitting device is sealed with a sealing glass. The LED package comprises a substrate, a LED mounted on the substrate, and a sealing glass for sealing a LED formed on the substrate. A wiring pattern being connected to an electrode of the LED is formed on the surface of the substrate. A back electrode pattern is formed on the rear surface of the substrate. A columnar via is formed in the substrate. Thus, the wiring pattern on the surface of the substrate and the back electrode pattern on the rear surface of the substrate are electrically connected. A softening point of the substrate is set higher than softening point of the sealing glass.

Abstract: A display device includes: a pixel electrode formed on an insulating surface; a bank that covers an edge of the pixel electrode and at the same time has an opening in which an upper surface of the pixel electrode is not covered by the bank; an organic layer that covers the opening and includes a light emitting layer; an opposing electrode that is formed on the organic layer and the bank; a cap layer that is formed on the opposing electrode; and a hygroscopic layer that contains a hygroscopic agent and that is formed on the opposing electrode in a region that overlaps with the bank but does not overlap with the opening in a planar view from a display surface side.

Abstract: A light emitting device includes a base including a support having a support surface. The light emitting element has a first surface and a second surface opposite to the first surface. The light emitting element is mounted on the base. The first surface faces the support surface. The reflecting film is provided on the second surface of the light emitting element. The light-transmissive covering member is provided on the base on a side of the support surface to cover the light emitting element and a covered region of the base except for an uncovered region of the base. An average reflectivity in the uncovered region of the base with respect to a peak emission wavelength of light emitted from the light emitting element is higher than an average reflectivity in the covered region of the base with respect to the peak emission wavelength of light.

Abstract: A lamp includes an optically transmissive enclosure and a base connected to the enclosure. A LED board is positioned in the enclosure and has a first side and a second side. A first LED array is mounted on the first side and a second LED array is mounted on the second side where the LED arrays are operable to emit light when energized through an electrical path from the base. A first diffusive lens and a second diffusive lens are located inside of and spaced from the enclosure. The first diffusive lens receives light emitted from the first LED array and the second diffusive lens receives light emitted from the second LED array.

Abstract: Both light stimulation of a specimen at a high intensity and detailed fluorescence observation at a low intensity are realized by using a single laser light source. Provided is a laser scanning microscope apparatus (1) including a laser light source (11) that generates laser light; output-power control portion (13) that can set an output power of the laser light source (11) by changing the output power in a step-wise manner; an AOTF (15) that can adjust a light level of the laser light emitted from the laser light source (11) in a step-wise manner at a resolution that is finer than a resolution at which the output-power control portion (13) changes the output power of the laser light source (11); and an observation device (17) that scans the laser light whose light level has been adjusted by the AOTF (15) on a specimen and that detects fluorescence generated at the specimen.

Abstract: The present disclosure provides a display device that includes a first lower film, a second lower film extended toward one side of the first lower film, and a third lower film extended toward another side of the first lower film; a first upper film, a second upper film extended toward one side of the first upper film, and a third upper film extended toward another side of the first upper film; subpixels formed between the first lower film and the first upper film; and a sealing layer formed between the first to third lower films and the first to third upper films.

Abstract: A light emitting device includes a package having a recess which includes a bottom surface. A first bottom surface of a first light emitting element is put on a first part of the bottom surface. A second bottom surface of a second light emitting element is put on the first part of the bottom surface. A first side surface of the first light emitting element is opposite to a second side surface of the second light emitting element with a gap. At least a part of the first side surface does not overlap with the second side surface viewed in a direction perpendicular to the first side surface. A protection element is provided at a second part of the bottom surface. A light reflective material covers the protection element.

Abstract: A display apparatus including a first substrate, a second substrate opposite to the first substrate, a pixel array disposed between the first substrate and the second substrate and a photoelectric conversion array disposed between the pixel array and the second substrate is provided. The pixel array includes sub-pixel units. An initial light from each of the sub-pixel units is converted into an electrical energy and a display light by the photoelectric conversion array. The electrical energy is stored and the display light passes through the second substrate to display an image. Display lights presented by two adjacent sub-pixel units have different wavelengths. The photoelectric conversion array includes photoelectric conversion cells. An area of each of the photoelectric conversion cells covers the two adjacent sub-pixel units and partially overlaps an area of another photoelectric conversion cell.

Abstract: An organic light emitting display device is discussed. The organic light emitting display device according to an embodiment includes an organic light emitting diode layer provided at an active area of a base substrate; an encapsulation layer encapsulating the organic light emitting diode layer to protect the organic light emitting diode layer; an adhesive layer in the encapsulation layer and provided on the organic light emitting diode layer to cover upper and side surfaces of the organic light emitting diode layer; and an encapsulation substrate in the encapsulation layer and provided on the adhesive layer. The encapsulation substrate is provided to have different thicknesses at the active area and outside the active area.

Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

Abstract: A safety end cap assembly includes an end cap base element to be arranged at one end thereof on an end of the elongate housing, at least one connector pin extending along a longitudinal axis of the end cap base element, an electrical switch electrically connected to the connector pin and switchable between an open state and a closed state, and an end cap cover element arranged slidable on the end cap base element between a protracted position where the switch button is covered by the end cap cover element, and a retracted position, where the switch button is exposed. When protracted, the end cap cover element extends beyond the end of the end cap base element, and for sliding the end cap cover element from its protracted position to its retracted position, the end cap cover element is moved towards the end cap base element.

Abstract: An organic light-emitting diode display may have an active area that contains pixels and an inactive area. The inactive area of the display may be provided with opaque masking layer structures having an appearance that matches the active area of the display when the pixels are off and are not displaying images. The opaque masking layer structures may include a polymer layer coated with a layer of metal. The display may have pixels with anodes and a cathode layer. The anodes may be formed from metal pads. Dummy structures such as a dummy cathode and dummy anodes may be formed in the inactive area. A circular polarizer in the display may overlap the active area and the inactive area or may overlap the active area without overlapping some or all of the inactive area.

Abstract: A light diffusion sheet for an organic electroluminescent element to be used in an organic electroluminescent panel. The light diffusion sheet includes: a glass fiber cloth composed of at least one glass fiber; silica on a surface of the glass fiber or between the glass fibers; and at least one selected from a group consisting of metal alkoxides and reaction products of metal alkoxides.

Abstract: An embodiment of the present invention discloses a light-emitting device. The light-emitting device includes a light source configured to emit a first light at a first high temperature; and an optical element, distant from the light source, configured to generate a second light in response to an irradiation of the first light, and reach a second high temperature higher than the first high temperature under the irradiation of the first light.

Abstract: A light-emitting diode (LED) lamp is provided that includes: an LED source coupled to a housing; and a lens over the source and coupled to the housing. The lens, or a portion of the lens, includes a plurality of glass beads, each having a metal-containing coating (e.g., a coating comprising at least one of Ni, Al, Cu, In and brass) and dispersed in a polymeric matrix (e.g., an acrylic or a polycarbonate). Further, the lens has a thermal conductivity of at least about 2 W/m*K and an optical transmissivity of at least 80%.

Abstract: An organic EL device includes a TFT substrate 1, a first electrode 5 provided on the TFT substrate 1, an organic EL layer 6 provided on the first electrode 5, a second electrode 7 provided on the organic EL layer 6, and a sealing film 10 covering the second electrode 7. The TFT substrate 1 is provided thereon with upward projections 11 and 12. The upward projections 11 and 12 are covered with the sealing film 10.

Abstract: Provided are a method of manufacturing a display apparatus and the display apparatus. A method of manufacturing a display apparatus includes preparing a first substrate including a display; adhering a second substrate to the first substrate by using a sealing element; exposing the sealing element by using a blocking member including a plurality of blocking patterns arranged apart from one another; and cutting the first substrate and the second substrate along portions thereof inside the blocking member.

Abstract: An object is to realize a hermetically sealed package which ensures long-term airtightness inside the package by sealing using a substrate, or a sealing structure for reducing destruction caused by pressure from the outside. A frame of a semiconductor material is provided over a first substrate, which is bonded to a second substrate having a semiconductor element so that the semiconductor element is located inside the frame between the first substrate and the second substrate. The frame may be formed using, as frame members, two L-shaped semiconductor members in combination or four or more stick semiconductor members in combination.

Abstract: A light emitting display panel includes a cover plate and a substrate disposed opposite to each other; a plurality of light emitting devices located between the cover plate and the substrate; and a packaging structure surrounding the plurality of light emitting devices. The packaging structure includes at least three rows of protruded frames and a first packaging material which is located between adjacent protruded frames, each of the protruded frames having four sides which are looped and the at least three rows of protruded frames being adjacent to and embedded into each other in an outward direction. The packaging structure further includes a third packaging material which is located between the cover plate and the substrate, and located outside the outermost one of the at least three rows of protruded frames and inside the innermost one of the at least three rows of protruded frames.

Abstract: A console assembly for an appliance has a console shell having a front surface with integrated light reflector cups, and a printed circuit board (PCB) mounted to the console shell and having light emitting diodes (LEDs) emitting light into at least some of the integrated light reflector cups.

Abstract: A display device includes a first substrate including a display region arranged with a plurality of pixels arranged with a light emitting element, a second substrate including a light shielding layer having an aperture part corresponding to the pixel and a color filter being arranged in at least the aperture part and including a pigment layer, a seal component including glass, the seal component bonding the first substrate and second substrate, the display region and color filter facing each other, and being arranged on the exterior side of the color filter, and an inorganic insulation layer covering at least an upper surface and end part of the color filter.

Abstract: An organic light-emitting diode (OLED) display and method of fabricating the same are disclosed. In one aspect, the OLED display includes a first substrate including a display area and a peripheral area surrounding the display area. The display area includes a plurality of pixels each including an OLED and the peripheral area includes a signal driver electrically connected to the pixels. A conductive layer is formed over the signal driver and on opposing sides of the signal driver and a second substrate is formed over the first substrate. The OLED display further includes a first seal interposed between the first and second substrates in the peripheral area and substantially sealing the first and second substrates and a second seal surrounding the first seal and formed over the signal driver.

Abstract: Disclosed is an organic light emitting display (OLED) device that may include a thin film transistor on a substrate; a first electrode electrically connected with the thin film transistor; an organic emitting layer on the first electrode, the organic emitting layer separated by a partition; a partition cover on the partition; a second electrode on the organic emitting layer; and an encapsulation layer on the second electrode, wherein a width of an upper surface of the partition cover is smaller than a width of a lower surface of the partition cover.

Abstract: An organic light-emitting display apparatus, including a lower substrate having a peripheral area, which includes a first peripheral part and a second peripheral part, and a display area between the first peripheral part and the second peripheral part; an upper substrate on the lower substrate; a sealing member between the lower substrate and the upper substrate and on the lower substrate in the peripheral area; and a first material layer between the sealing member and the lower substrate and including a first opening pattern at the first peripheral part and a second opening pattern at the second peripheral part, the second opening pattern having a smaller size than the first opening pattern.

Abstract: Embodiments of the invention include a semiconductor light emitting diode (LED) attached to a top surface of a mount. A multi-layer reflector is disposed on the top surface of the mount adjacent to the LED. The multi-layer reflector includes layer pairs of alternating layers of low index of refraction material and high index of refraction material. A portion of the top surface in direct contact with the multi-layer reflector is non-reflective.

Abstract: Apparatuses for playing signals received from the internet or other information highway or a stored database on one or more speakers are described. The apparatus has a receiver for receiving information from preselected addresses; a processor for interpreting the signals; and at least one speaker for playing signals from the internet. There is at least display device connected to the receiver for displaying an image received from the internet. The processor selects images that correspond with the signals played by the speaker.

Abstract: A OLED encapsulation structure includes: a first encapsulation layer; a second encapsulation arranged on one side of the first encapsulation layer; and scattering particles formed between the first encapsulation layer and the second encapsulation layer, and the scattering particles are configured to scatter incident lights. In addition, an encapsulation method of OLEDs and the OLEDs having the encapsulation structure are disclosed. The scattering particles are formed within the cathode encapsulation layer. The scattering particles may generate the scattering effect for the ambient lights or the stray lights to reduce the reflection of the light beams by the cathode. Thus, the brightness and the clearness of the OLED may be enhanced.

Abstract: The present disclosure relates to an organic light-emitting diode (OLED) device and a display device. The OLED device may include a substrate, thin film transistors (TFTs), an anode, a cathode, and an organic light-emitting layer between the anode and the cathode and configured to emit light. The organic light-emitting layer may be provided with a light-blocking layer which is configured to block ultraviolet (UV) light and arranged at a light-exiting side of the organic light-emitting layer. The display device may include the OLED device.

Abstract: A light emitting device that includes a conductive substrate, an insulating layer on the conductive substrate, a plurality of light emitting device cells on the insulating layer, a connection layer electrically interconnecting the light emitting device cells, a first contact section electrically connecting the conductive substrate with at least one light emitting device cell, and a second contact section on the at least one light emitting device cell.

Abstract: An organic EL display panel including: a substrate; display elements over the substrate; a first sealing layer over the display elements; a buffer layer covering the first sealing layer; and a second sealing layer covering the buffer layer. The first sealing layer, the buffer layer, and the second sealing layer are each made of a silicon nitride film, and a peak amount of ammonia gas desorbing from the silicon nitride film of the buffer layer within a predetermined temperature range is greater than one hundred times and smaller than one thousand times a peak amount of ammonia gas desorbing from each of the silicon nitride film of the first sealing layer and the silicon nitride film of the second sealing layer within the predetermined temperature range.

Abstract: An encapsulating structure for encapsulating a flexible OLED device includes a flexible substrate, a first flexible thin film encapsulating layer, a TFT array, an OLED device, a second flexible thin film encapsulating layer, an adhesion layer, a third flexible thin film encapsulating layer, and a polarizer layered in order. One or more barrier layers are arranged on the TFT array disposed on lateral sides of the OLED device, and the second flexible thin film encapsulating layer covers the OLED device and the one or more barrier layers. The present invention also proposes a display device having the encapsulating structure.

Abstract: The present invention provides an OLED panel, a packaging method thereof and a display device. The OLED panel includes a packaging coverplate and an OLED substrate opposite to each other, the OLED substrate having a display area and a packaging area surrounding the display area; and glass glue provided between the packaging coverplate and the OLED substrate and corresponding to the packaging area, and the OLED panel further includes a support structure provided at a side of the glass glue away from the display area, the support structure being used for supporting the packaging coverplate and the OLED substrate when cutting a display motherboard to form the OLED panel.

Abstract: Provided is a wavelength converting member made of a sintered body which inhibits color unevenness of exit light after wavelength conversion and has excellent light emitting efficiency and inhibited decrease in mechanical strength. The wavelength converting member includes a plate-like sintered body having one principal surface as a light entrance surface and the other principal surface as a light exit surface, and a porosity of 0.1% or less with fluorescent material grains containing an activator and light-transmitting material grains, the entrance surface and the exit surface are sintered surfaces in which the fluorescent material grains and light-transmitting material grains are exposed without processing. The sintered surface has an average roughness Ra of 0.1 ?m to 0.5 ?m, the fluorescent material grains exposed on a surface have an average roughness Ra1 of 0.2 nm to 0.5 nm, and the light-transmitting material grains exposed on a surface have an average roughness Ra2 of 0.3 nm to 0.7 nm.

Abstract: An object is providing an organic electroluminescence element and an illumination device in which a driving voltage does not increase even when a high-productivity sputtering method is used to form a transparent conductive layer of the organic electroluminescence element of a top or top-and-bottom emission type, and hence which has an improved driving voltage. The organic electroluminescence element includes at least a light emitting layer and a transparent conductive layer. Between the light emitting layer and the transparent conductive layer, a transparent protective layer is disposed. The light emitting layer contains a phosphorescence emitting compound. The transparent protective layer contains a metal oxide. The metal oxide is a molybdenum (VI) oxide, a rhenium (VI) oxide or a nickel (II) oxide in an oxygen deficient state.

Abstract: A lightweight flexible light-emitting device that is less likely to be broken is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, an element layer, a first bonding layer, and a second bonding layer. The element layer includes a light-emitting element. The element layer is provided between the first flexible substrate and the second flexible substrate. The first bonding layer is provided between the first flexible substrate and the element layer. The second bonding layer is provided between the second flexible substrate and the element layer. The first and second bonding layers are in contact with each other on the outer side of an end portion of the element layer. The first and second flexible substrates are in contact with each other on the outer side of the end portions of the element layer, the first bonding layer, and the second bonding layer.

Abstract: The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess.