Abstract: A rollo assembly for use in a vehicle comprises a rollo screen having opposite forward and rearward sides and two opposite lateral sides, a winding tube for the rollo screen at the rearward side, an operating beam connected to the forward side and having two outer ends, and two longitudinally extending guides for guiding respective ones of the outer ends of the operating beam and respective ones of the lateral sides of the rollo screen. Said lateral sides are provided with retention members cooperating with corresponding parts of the guides for retaining said lateral sides in said guides. The rollo screen is provided with light transmitting and emitting members which have an end portion extending at least up to a first one of the lateral sides of the rollo screen. At least one elongate light bar extends longitudinally along said guide to transmit light into said end portion.

Abstract: An organic light emitting diode (OLED) display includes a substrate, an organic light emitting diode, and a first barrier layer. The organic light emitting diode is disposed on the substrate, in which the projection of the organic light emitting diode on the substrate has a first profile. The first barrier layer is disposed on the organic light emitting diode, in which the projection of the first barrier layer on the substrate has a second profile. The first profile is non-conformal with the second profile.

Abstract: Provided are a light conversion substrate intended for converting an excited beam into a conversion beam, and a light emitting package including the light conversion substrate, the light conversion substrate being implemented in a structure in which side parts of the light conversion substrate for converting a beam emitted from a light emitting element are formed to have different tapers so that uniform color distribution can be implemented all over the entire surface of the light conversion substrate upon packaging the light conversion substrate with the light emitting element.

Abstract: According to one embodiment, an organic semiconductor device includes a supporting substrate, a plurality of organic EL light emitting elements, a first barrier layer, a flattening layer, and a second barrier layer. The flattening layer exists sporadically and makes gentle in inclination steep elevation change present in the surface of the first barrier layer. The first barrier layer and the second barrier layer are made of moisture penetration preventive material.

Abstract: The present invention discloses a diode and a manufacturing method thereof and a display apparatus. The diode comprises a composite anode, a transparent metal oxide layer, a basic stack layer, and a composite cathode. The composite anode comprises a transparent anode layer and a first transparent metal layer. The first transparent metal layer is formed on the transparent anode layer. The transparent metal oxide layer is formed on the first transparent metal layer. The basic stack layer is formed on the transparent metal oxide layer. The composite cathode comprises two second transparent metal layers. The two second transparent metal layers are formed on the basic stack layer. Both transmittance and efficiency of the diode are significantly improved. The reliability of the diode is improved to elongate the lifetime of the diode.

Abstract: A package structure of an electronic device includes a first substrate, a second substrate, an electronic device and a first barrier structure. The first substrate includes a first light-transmitting portion and a periphery portion. The second substrate includes a second light-transmitting portion and two covering portions located on two sides of the second light-transmitting portion. The first light-transmitting portion is disposed corresponding to the second light-transmitting portion, and a device disposition region exists therebetween. The covering portions cover the periphery portion of the first substrate and two opposite side surfaces of the first substrate. The electronic device is disposed on the first or second substrate, and is located in the device disposition region. The first barrier structure disposed on the first substrate or the second substrate is disposed corresponding to the periphery portion and disposed on at least one side of the device disposition region.

Abstract: An encapsulated light-emitting diode device is disclosed. The encapsulated light-emitting diode device includes a circuit carrier including a surface; a light-emitting device including a transparent substrate, the transparent substrate including a first surface and a second surface, and the first surface and the surface of the circuit carrier includes an included angle larger than zero; a light-emitting diode chip located on the first surface of the transparent substrate; and a first transparent glue covering the light-emitting diode chip and formed on the first surface; and a second transparent glue formed on the second surface corresponding to the first transparent glue; wherein the first transparent glue has a circular projection on the first surface and the light-emitting diode chip is substantially located at the center of the circular projection.

Abstract: The present invention provides an OLED touch control display device and a manufacture method thereof, comprising: an OLED display (1) and a transparent touch panel (2); the OLED display (1) comprises: a substrate (11), a transparent package cover plate (12), first electrode layers (13), an organic emitting light layer (14) and a second electrode layer (15); the first electrode layer (13) is a reflective electrode, and the second electrode layer (15) is a transparent electrode; the transparent touch panel (2) is located at a side of the transparent package cover plate (12) of the OLED display (1) backing to the substrate (11). The OLED touch control display device can allow the top emitting OLED to possess touch control function to prevent the influence of the finger touch to the display result, and to diminish the thickness of the touch control display device and reduce the production cost.

Abstract: A miniaturized LED package substrate allowing for the better installation of an electrostatic protection device includes an upper substrate, a lower substrate, and a circuit layer. The circuit layer is positioned between the upper substrate and the lower substrate and electrically connected to the upper substrate and the lower substrate. At least one cavity is defined at the lower substrate, and each of the at least one cavity passes through the lower substrate to expose a portion of the circuit layer.

Abstract: A wavelength conversion member includes a substrate, a dichroic mirror layer, an SiO2 layer, a ZnO layer, and a phosphor layer, which are sequentially stacked from the substrate. The dichroic mirror layer reflects at least part of light incident from the above. The phosphor layer includes a plurality of phosphors and ZnO between the phosphors.

Abstract: An LED light-emitting element having reduced the occurrence of illuminance unevenness is provided. A light-emitting element comprising a substrate, an LED element mounted on the substrate, a phosphor resin arranged on the substrate so as to seal the LED element and having an emission surface from which light based on light emitted from the LED element is emitted, a reflective resin arranged around the phosphor resin; and a reflecting frame having an opening and at least part of which is arranged on the reflective resin, wherein the reflective resin is arranged directly under the reflecting frame and on the side surface of the phosphor resin, the ratio of the area of the emission surface to the area of an inside area of the reflecting frame is set to 80% or higher, and in the inside area of the reflecting frame, the reflective resin is exposed around the emission surface.

Abstract: A light source and a method for its use in an optical sensor are provided, the light source including a resistively heated element. The light source includes a power circuit configured to provide a pulse width modulated voltage to the resistively heated element, the pulse width modulated voltage including: a duty cycle with a first voltage; and a pulse period including a period with a second voltage, wherein: the duty cycle, the first voltage, and the pulse period are selected so that the resistively heated element is heated to a first temperature; and the first temperature is selected to emit black body radiation in a continuum spectral range. Also provided is an optical sensor for determining a chemical composition including a light source as above.

Abstract: An organic light-emitting display device is provided. The organic light-emitting display device includes: a substrate; a display unit on the substrate and includes a plurality of driving thin film transistors (TFTs) and a plurality of organic light-emitting diodes (OLEDs); and a sealing layer to cover the display unit which includes a first sealing layer that is formed of at least one inorganic layers to cover the plurality of OLEDs and a second sealing layer that is formed of at least one inorganic layers and at least one organic layers to enclose the plurality of OLEDs.

Abstract: An organic EL display device includes in order from a substrate side: a metal layer; an insulating layer formed on the metal layer; a first electrode layer formed on the insulating layer; an organic layer formed on the first electrode layer; and a second electrode layer formed on the organic layer. The metal layer is for use as a reflective layer configured to reflect, on a surface of the metal layer, light generated from the organic layer by applying a voltage between the first electrode layer and the second electrode layer.

Abstract: The present invention discloses a frameless display device and a method of fabricating the same. The frameless display device comprises a first substrate and a second substrate which are provided opposite to each other, an edge of the first substrate is coupled to an edge of the second substrate to realize frame sealing. In the technical solutions of the frameless display device and the method of fabricating the same provided by the present invention, an edge of the first substrate is coupled to an edge of the second substrate to realize frame sealing, so that frame sealing is achieved without any frame sealing adhesive, so complete frameless display is realized.

Abstract: An organic light emitting diode display and a manufacturing method thereof are provided. The organic light emitting diode display includes a first substrate, a second substrate, a plurality of organic light emitting diodes, and a frit layer. The organic light emitting diodes are disposed on the first substrate, and the frit layer adheres the first substrate and the second substrate to each other. The frit layer includes a first porous region having pores, a second porous region having pores, and a third porous region having pores. The number of the pores of the first porous region with a diameter of larger than or equal to 4 ?m and smaller than or equal to 15 ?m is greater than the number of the pores of the second porous region with the above-mentioned diameter range.

Abstract: An organic light emitting diode (OLED) display according to the present disclosure includes a substrate, a thin film transistor on the substrate, a first electrode on the thin film transistor and electrically coupled to the thin film transistor, an organic emission layer on the first electrode, a second electrode on the organic emission layer, and a capping layer on the second electrode, wherein a thickness of the second electrode is about 65 ? to about 125 ?, and wherein a thickness of the capping layer is about (500*1.88/n) ? to about (700*1.88/n) ?, n being an optical constant of the capping layer.

Abstract: Disclosed are a light-emitting device and a manufacturing method thereof. A light-emitting device according to a preferred embodiment of the disclosure comprises: a frame portion having a bottom and a sidewall; a light-emitting portion which is disposed on the frame portion and emits light; and a window portion disposed over the frame portion so as to cover the light-emitting portion.

Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

Abstract: A light emitting device is provided. The light emitting device includes a substrate and a plurality of light emitting elements. The light emitting elements are electrically connected on the substrate, each having a light emitting surface. A light-transmissive member is arranged on the light emitting elements and a light-reflective member covers a lateral surface of the light emitting elements and a lateral surface of the light-transmissive member. The plurality of light emitting elements include a plurality of first light emitting elements and a second light emitting element that has an area of the light emitting surface smaller than that of each of the first light emitting elements. The second light emitting element is arranged between the first light emitting elements.

Abstract: A light emitting device (10) includes a substrate (100), an organic EL element (102), a buffer film (210), and a sealing film (220). The organic EL element (102) is formed over the substrate (100). The sealing film (220) is located over the substrate (100) and over the organic EL element (102), and seals the organic EL element (102). In addition, the buffer film (210) is located between the organic EL element (102) and the sealing film (220), and comes into close contact with the sealing film (220). The sealing film (220) includes at least one layer formed of, for example, an oxide.

Abstract: A method of manufacturing a light emitting device includes preparing wafer with a plurality of light emitting elements arrayed on a growth substrate, on a first side of a semiconductor stacked layer body, forming a resin layer which includes metal wires respectively connected to a p-side electrode and an n-side electrode, forming a groove by removing at least portion of the resin layer from an upper surface side in a boundary region between the light emitting elements and exposing end surfaces of metal wires which are internal conductive members on an inner side surface defining a groove, forming electrodes for external connection respectively connecting to exposed end surfaces of metal wires, and singulating the wafer into a plurality of singulated light emitting elements.

Abstract: An organic light-emitting diode display may have an active area that contains pixels and an inactive area. The inactive area of the display may be provided with opaque masking layer structures having an appearance that matches the active area of the display when the pixels are off and are not displaying images. The opaque masking layer structures may include a polymer layer coated with a layer of metal. The display may have pixels with anodes and a cathode layer. The anodes may be formed from metal pads. Dummy structures such as a dummy cathode and dummy anodes may be formed in the inactive area. A circular polarizer in the display may overlap the active area and the inactive area or may overlap the active area without overlapping some or all of the inactive area.

Abstract: Disclosed is an organic light emitting display device that includes a foreign matter compensation layer on an inorganic layer. A passivation layer and a second inorganic layer are in direct contact with each other at the edge of the substrate. Accordingly, the number of interfaces between the inorganic layers is decreased. Thus, even if the organic light emitting display device is bent, a moisture permeation path, which may be unexpectedly formed, can be minimized.

Abstract: An optoelectronic component includes a substrate, a first electrode on the substrate, a radiation-emitting or radiation-absorbing layer sequence on the first electrode, a second electrode on the layer sequence, an encapsulation layer on the second electrode, and a covering layer on the encapsulation layer. The covering layer has a first main surface and second main surface. At least one intended rupture surface is provided between the first and the second main surface of the covering layer.

Abstract: The present invention relates to an array-type double-side light-emitting device, a manufacturing method thereof and a double-side display device. The array-type double-side light-emitting device comprises: a first protective layer, a first fluorescent layer or quantum dot layer, an array of first transparent conductive layers, a first anisotropic conductive adhesive layer, an array of light-emitting wafers, a second anisotropic conductive adhesive layer, an array of second transparent conductive layers, a second fluorescent layer or quantum dot layer and a second protective layer, which are attached together sequentially.

Abstract: An apparatus for fabricating an organic light-emitting diode (OLED) display device includes a chamber, a stage in the chamber to support an array substrate, a cover plate in the chamber above the stage, and a solvent absorption plate on a first surface of the cover, the solvent absorption plate including a solvent, and the solvent absorption plate facing the stage to have the array substrate face the solvent absorption plate.

Abstract: Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Abstract: A light emitting device includes a light emitting chip which generates a first light having a first color, a first cavity layer disposed on the light emitting chip and which generates a second light having a second color and has a first refractive index, a second cavity layer disposed on the first cavity layer and which generates a third light having a third color and has a second refractive index, a first half mirror layer disposed between the first cavity layer and the light emitting chip and which reflects at least a portion of the second light, a second half mirror layer disposed between the first cavity layer and the second cavity layer and which reflects at least a portion of the third light, and a third half mirror layer disposed on the second cavity layer and which transmits the first light.

Abstract: A bottom-emitting OLED display panel is provided. The bottom-emitting OLED display panel includes: a driving transistor disposed on a substrate; a protective layer covering the driving transistor; a planarization layer disposed on the protective layer; and a OLED device disposed on the planarization layer; and a reflective structure disposed between the protective layer and the planarization layer, the reflective structure is configured for reflecting light emitted from the OLED device and radiated on the reflective structure; a bottom surface of the reflective structure which is close to the protective layer at least covers a region occupied by the driving transistor.

Abstract: In a display substrate, a method for manufacturing the display substrate and an electro-wetting display apparatus including the display substrate, the display substrate includes a base substrate, a sidewall defining a unit pixel area, a pixel electrode, a hydrophobic insulating layer and a light blocking layer. The sidewall is on the base substrate and defines the unit pixel area. The pixel electrode is in the unit pixel area. The hydrophobic insulating layer is on the sidewall and the pixel electrode. The light blocking layer is on the hydrophobic insulating layer and overlaps the sidewall.

Abstract: According to one embodiment, an organic semiconductor device includes a supporting substrate, a plurality of organic EL light emitting elements, a first barrier layer, a flattening layer, and a second barrier layer. The flattening layer exists sporadically and makes gentle in inclination steep elevation change present in the surface of the first barrier layer. The first barrier layer and the second barrier layer are made of moisture penetration preventive material.

Abstract: According to one embodiment, an organic semiconductor device includes a supporting substrate, a plurality of organic EL light emitting elements, a first barrier layer, a flattening layer, and a second barrier layer. The flattening layer exists sporadically and makes gentle in inclination steep elevation change present in the surface of the first barrier layer. The first barrier layer and the second barrier layer are made of moisture penetration preventive material.

Abstract: The present invention relates to an organic light emitting device that has a structure which is capable of maximally extracting light generated in the organic light emitting device to the outside. In detail, the organic light emitting device according to the present invention is characterized in that the organic light emitting device includes a high refractive index layer or an electrode that includes a light reuse pattern.

Abstract: There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.

Abstract: A display module encapsulating structure and preparation method thereof, which relates to the field of display devices and can be applied to preparing AMOLED and other related display devices as described in the application, mainly use the thin film encapsulation structure to hermetically protect the display module (such as OLED display module), that is sealing the display module by inorganic thin film layer having the characteristics of transparency as well as containing moisture-resistance and oxygen-resistance; buffering the internal and external stresses of the thin film layers and restraining the falling off of the layers caused by the bending stress when preparing flexible devices. Meanwhile, the raised features formed by multilayer stack can effectively inhibit the diffusion effect of inorganic coating and increase the number of side water retaining walls of thin film device, therefore, effectively improve the encapsulating effect.

Abstract: Embodiments of the present invention generally relate to a touch sensible organic light emitting device. The organic light emitting device according to an exemplary embodiment of the present invention comprises: a substrate; a thin film transistor disposed on the substrate; an organic light emitting element connected to the thin film transistor and receiving a data voltage; a plurality of encapsulation thin films disposed on the organic light emitting element, and encapsulating the thin film transistor and the organic light emitting element; a planarization layer disposed on the encapsulation thin film; and a touch sensor disposed on the planarization layer.

Abstract: A photoluminescent guide for an emergency lighting system includes a housing having a first end, a second end opposite the first end, and a longitudinal slot extending between the first end and the second end. A one-piece composite insert is disposed within the longitudinal slot. The one-piece composite insert includes a photoluminescent layer and a light-transmitting layer integrally secured to the photoluminescent layer. The one-piece composite insert is configured to receive light at the photoluminescent layer through the light-transmitting layer and to emit light from the photoluminescent layer through the light-transmitting layer.

Abstract: A hollow frame is configured to surround the periphery of a substantially self-supporting flip-chip light emitting device. The frame may be shaped to also contain a wavelength conversion element above the light emitting surface of the light emitting device. The lower surface of the light emitting device, which is exposed through the hollow frame, includes contact pads coupled to the light emitting element for surface mounting the light emitting module on a printed circuit board or other fixture. The flip-chip light emitting device may include a patterned sapphire substrate (PSS) upon which the light emitting element is grown, the patterned surface providing enhanced light extraction from the light emitting element, through the patterned sapphire substrate.

Abstract: The present invention discloses a display panel, a manufacturing method thereof and a display device. The display panel comprises a first substrate divided into a display area and a non-display area surrounding the display area, a plurality of sub-pixel units are provided on a part of the first substrate corresponding to the display area, a photo spacer is provided between two adjacent sub-pixel units and comprises a base and a plurality of protruding structures provided on the base, and the base is made from material including In+ ions which are replaceable with H+ ions. For the display panel, the photo spacers are manufactured using Haze phenomenon generated by contacting ITO thin film with ionized H2, so as to provide support between the encapsulation substrate and the evaporated substrate encapsulated by frit seal and effectively protect the OLED devices from damage, and therefore, the display panel has better performance.

Abstract: An OLED device and a preparation method thereof are provided by the present invention; the OLED device comprises an OLED device body and a protective layer which coats outside the OLED device body and is configured to package the OLED device body; the chemical formula of the protective layer is SiOXCYHZ, wherein the value of X is 0.5˜2.5, the value of Y is 0.5˜2.0, and the value of Z is 2˜8. In the present invention, the protective layer is deposited outside the OLED device to isolate water vapor.

Abstract: Embodiments of the present invention generally relate to a touch sensible organic light emitting device. The organic light emitting device according to an exemplary embodiment of the present invention comprises: a substrate; a thin film transistor disposed on the substrate; an organic light emitting element connected to the thin film transistor and receiving a data voltage; a plurality of encapsulation thin films disposed on the organic light emitting element, and encapsulating the thin film transistor and the organic light emitting element; a planarization layer disposed on the encapsulation thin film; and a touch sensor disposed on the planarization layer.

Abstract: A manufacturing method of a display substrate, including preparing a carrier substrate; preparing a mixture of an organic material, an inorganic particle, and solvent; coating the mixture on the carrier substrate; forming a sacrificial layer including the inorganic particle in the organic material by curing the mixture; forming a barrier layer on the sacrificial layer; forming a display substrate on the barrier layer; and separating the barrier layer and the display substrate from the carrier substrate by applying a laser to the sacrificial layer.

Abstract: An embodiment relates to a light-emitting device package. In an embodiment, the light-emitting device package includes a package body configured to include a top surface, a plate guide unit disposed on the top surface, and a cavity formed in the top surface, a light-emitting device disposed within the cavity, a plate disposed on the top surface of the package body and guided by the plate guide unit, and an adhesive member disposed between the top surface of the package body and the plate. The adhesive member includes a base layer made of a flexible material, a first adhesive tape disposed between the base layer and the top surface of the package body and bonded to the base layer and the top surface of the package body, and a second adhesive tape disposed between the base layer and the plate and bonded to the base layer and the plate.

Abstract: A substrate-type LED light source (10) includes: at least one blue LED chip (2) which has an emission peak in a range from 400 nm to 480 nm so as to correspond to a blue light region absorption peak of chlorophyll; a red phosphor (7b) which emit, upon receiving excitation light from the at least one blue LED chip (2), light having a peak wavelength in a range from 620 nm to 700 nm so as to correspond to a red light region absorption peak of chlorophyll; and a resin layer (7) in which the red phosphor 7b is dispersed and which covers the at least one blue LED chip (2).

Abstract: To provide a method of manufacturing a display device having an excellent impact resistance property with high yield, in particular, a method of manufacturing a display device having an optical film that is formed using a plastic substrate. The method of manufacturing a display device includes the steps of: laminating a metal film, an oxide film, and an optical filter on a first substrate; separating the optical filter from the first substrate; attaching the optical filter to a second substrate; forming a layer including a pixel on a third substrate; and attaching the layer including the pixel to the optical filter.

Abstract: An organic light emitting diode display panel including an upper substrate, an organic light emitting device facing the upper substrate and emitting a light to the upper substrate, and a light extraction layer disposed between the upper substrate and the organic light emitting device, including first and second optical layers each having a polymer network liquid crystal and having different optical properties, and exiting the light to the outside of the upper substrate. The optical property of the polymer network liquid crystal in the first optical layer differs from the optical property of the polymer network liquid crystal in the second optical layer.

Abstract: The present invention relates to an organic light-emitting element and a production method thereof. Specifically, the present invention relates to an organic light-emitting element, which has excellent productivity during mass production thereof and may allow simplification of vapor deposition equipment, and the like, and a production method thereof.

Abstract: An organic light-emitting display device includes a first substrate having transmitting regions and pixel regions separated from each other by the transmitting regions, a plurality of thin film transistors on the first substrate in the pixel regions, a passivation layer covering the plurality of thin film transistors, a plurality of pixel electrodes on the passivation layer and electrically connected to the thin film transistors, the pixel electrodes being in the pixel regions and overlapping the thin film transistors, an opposite electrode in the transmitting regions and the pixel regions, the opposite electrode facing the plurality of pixel electrodes and being configured to transmit light, an organic emission layer interposed between the pixel electrodes and the opposite electrode, and a color filter in corresponding pixel regions.

Abstract: A LED freeform surface illumination system is provided. The LED freeform surface illumination system includes a LED point light source, a freeform surface lens, and a light receiving surface. A light emitting angle ? of the LED point light source is divided into three regions. The freeform surface lens includes a spherical surface and a freeform surface opposite to the spherical surface. The freeform surface comprises three annular regions. Each region of the three regions of the light emitting angle ? of the LED point light source corresponds with one annular region of the freeform surface. Lights of each region of the three regions of the light emitting angle ? of the LED point light source pass the corresponded annular region of the freeform surface to form one rectangular light spot.