Abstract: The disclosure provides a battery management device, method, and a chip. The device includes: an analog-digital converter connected with a first power supply access terminal, a second power supply access terminal and an impedance measuring element: wherein the analog-digital converter is configured to achieve analog-digital conversion between an accessed power supply and the impedance measuring element; the impedance measuring element is further connected with a comparator and a driving element; the impedance measuring element is configured to test an impedance of the accessed power supply; the comparator is configured to compensate delay generated by the driving element and an excitation signal generator; and the driving element is configured to drive the battery management device to work; and the excitation signal generator is connected with the comparator, the driving element, the first power supply access terminal and the second power supply access terminal.

Abstract: A measuring device includes a switch that switches a connection of an electrode to which a direct current voltage is applied, wherein the electrode is within an electrostatic chuck disposed in a plasma processing device; a component provided with electrostatic capacitance, wherein the component is connected to the switch; and a measuring unit that measures a value corresponding to an electric charge amount accumulated in the component provided with the electrostatic capacitance.

Abstract: A detection device is provided. The detection device includes a transmitter and a detector. The transmitter supplies an induced current to an antenna and to adjust a strength of an induced voltage generated in the antenna by adjusting the induced current. The detector monitors the strength of the induced voltage of the antenna and generates a control signal for controlling the induced current to the antenna based on the monitored strength of the induced voltage of the antenna.

Abstract: A diagnostic method and system is described for diagnosing an operating condition of a conductive particulate matter sensor. The sensor has a substrate with electrical resistance that varies with temperature and two electrodes on the substrate adapted to collect particulate matter between the electrodes, thereby establishing an electrically conductive path through collected particulate matter between the electrodes that can be detected by measuring electrical resistance between the electrodes, Relect. The diagnosis is performed by heating the substrate in the area between the electrodes and using the resistance between the electrodes to determine detecting whether contamination is present on the surface of the sensor. Heat may be maintained on the sensor to attempt to burn off a detected contaminant, and a subsequent resistance reading may be used to determine if the contaminant was successfully burned off.

Abstract: A metrology device optically measures the electrical conductivity of a magnetic sample, such as a Tunneling Magnetoresistance (TMR) or Giant-Magneto Resistance (GMR) device, using Time Domain Thermo Reflectance (TDTR) to measure a cooling curve for the sample while a magnetic field is applied to the sample. The thermal conductivity of the sample may be determined using the cooling curve and the variation of the cooling curve with varying applied magnetic fields is measured. The electrical conductivity is determined for the sample in the magnetic field based on the thermal conductivity. If desired, single reflectance changes may be measured at a particular delay after heating, and the reflectance change at this delay may be used to determine the electrical conductivity. Of particular interest is the amount of change in electric conductivity for a given applied magnetic field because this yields a measure of the sensitivity of the sensor.

Abstract: The present device includes a high frequency induction thermal plasma generation unit 10; a second tube portion 20, which is connected to a first tube portion 13 and which includes window 25 on at least one side surface; and a testing subject installing pedestal 23 configured to be fixedly attached at a reference position in the second tube portion 20, wherein the testing subject installing pedestal 23 includes a seating portion for installing the testing subject 40, and a hold-down portion for fixing the installed testing subject 40 with a part of the testing subject exposed; and an ablated vapor generated from the testing subject is observed through the window from an outer side of the second tube portion.

Abstract: A multi-sensor as disclosed herein can include a substrate and at least three sensing elements disposed on the substrate. Each sensing element includes two electrodes separated by a distance and a nanowire mat adjacent to and in contact with the electrodes. The nanowire mats include nanowires which define a percolation network. The density of the nanowires in the nanowire mat of one sensing element is different than the density of the nanowires in the nanowire mat of either of the other at least two sensing elements.

Abstract: The inspection apparatus includes a probe having a contact for contacting an electrode of an inspected object and having a built-in heater for correcting dislocation of the contact to the electrode caused by temperature difference between the probe and the inspected object; a tester for testing the probe and supplying electric power to the heater; an electric power supply, provided on the tester, for supplying electric power to the heater; and a temperature control unit for controlling electric power to the heater of the probe through the electric power supply, wherein the electric power supply includes at least one open/close switch for switching power to the heater on and off. A connector has a male connector and a female connector on opposing ends. A continuity-checking device checks supply of electric power to the heater from the electric power supply.

Abstract: A diagnostic method and system is described for diagnosing an operating condition of a conductive particulate matter sensor. The sensor has a substrate and two electrodes on the substrate adapted to collect particulate matter between the electrodes, thereby establishing an electrically conductive path through collected particulate matter between the electrodes that can be detected by measuring electrical resistance between the electrodes, Relect. The diagnosis is performed by detecting whether water vapor condensate may be present between the electrodes and if it is, then measuring resistance between the electrodes while subjecting the sensor to conditions sufficient to evaporate any water vapor condensate and diagnosing a validation that the sensor is in proper operating condition if resistance increases in a manner consistent with evaporation of condensate.

Abstract: Solutions for determining a critical current density of a line are disclosed. In one embodiment a method of determining a critical current density in a line includes: applying a temperature condition to each of a plurality of samples including the line; calculating a cross-sectional area of the line for each of the plurality samples using data about an electrical resistance of the line over each of the temperature conditions; measuring an electrical current reading through the line for each of the plurality of samples; determining a current density through the line for each of the plurality of samples by dividing each electrical current reading by each corresponding cross-sectional area; determining an electromigration (EM) failure time for each of the plurality of samples; and determining the critical current density of the line using the current density and the plurality of EM failure times.

Abstract: There is described a method to change the value of a thermally-trimmable resistor in a non-permanent way by raising the temperature of the thermally-trimmable resistor to a level that is somewhere between room temperature and trimming temperature. By doing this, the trimming range that is available via true thermal trimming may be explored without actually trimming the value of the resistor. This is possible when the thermally-trimmable resistor, or a portion thereof, has an essentially non-zero temperature coefficient of resistance (TCR).

Abstract: An apparatus for controlling the temperature of a warm bore of a superconducting magnet in a magnetic resonance imaging (MRI) includes a plurality of warm bore thermal sensors positioned on a surface of the warm bore and a plurality of heater elements positioned on the surface of the warm bore. A heater element thermal sensor is coupled to each of the plurality of heater elements and configured to monitor the temperature of the corresponding heater element. A controller is coupled to the plurality of warm bore thermal sensors and the plurality of heater element thermal sensors. The controller is configured to control each of the plurality of heater elements to maintain a predetermined temperature of the warm bore.

Abstract: The invention relates to different designs of a microelectronic device comprising heating electrodes (HE) and field electrodes (FE) that have effect in the same sub-region of a sample chamber. By applying appropriate voltages to the field electrodes (FE), an electrical field (E) can be generated in the sample chamber. By applying appropriate currents to the heating electrodes (HE), the sample chamber can be heated according to a desired temperature profile. The heating electrodes (HE) may optionally be operated as field electrodes such that they generate an electrical field in the sample chamber, too.

Abstract: A method for operating an exhaust gas probe, in particular a lambda probe, in the exhaust gas of an internal combustion engine, where at least one heating element for achieving the operating temperature in the exhaust gas probe and determination of the temperature of the exhaust gas probe is performed by measuring the internal resistance. Measurement of the internal resistance occurs by the superimposition of discrete bipolar test pulses that include a pulse and a counter pulse, and by acquisition of the Nernst voltage.

Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a temperature compensated microelectromechanical resonator as well as fabricating, manufacturing, providing and/or controlling microelectromechanical resonators having mechanical structures that include integrated heating and/or temperature sensing elements. In another aspect, the present invention is directed to fabricate, manufacture, provide and/or control microelectromechanical resonators having mechanical structures that are encapsulated using thin film or wafer level encapsulation techniques in a chamber, and including heating and/or temperature sensing elements disposed in the chamber, on the chamber and/or integrated within the mechanical structures. Other aspects of the inventions will be apparent from the detailed description and claims herein.

Abstract: There are many inventions described and illustrated herein. These inventions are directed to a method of fabricating a microelectromechanical resonator having an output frequency that may be adjusted, tuned, set, defined and/or selected whether before and/or after final packaging. In one aspect, the method of the present invention adjusts, tunes, sets, defines and/or selects the frequency of the microelectromechanical resonator by changing and/or removing material from the mechanical structure of the resonator by resistively heating (in a selective or non-selective manner) one or more elements and/or beams of the mechanical structure (for example, the moveable or expandable electrodes and/or frequency adjustment structures).

Abstract: There are many inventions described and illustrated herein. These inventions are directed to a method of fabricating a microelectromechanical resonator having an output frequency that may be adjusted, tuned, set, defined and/or selected whether before and/or after final packaging. In one aspect, the method of the present invention adjusts, tunes, sets, defines and/or selects the frequency of the microelectromechanical resonator by changing and/or removing material from the mechanical structure of the resonator by resistively heating (in a selective or non-selective manner) one or more elements and/or beams of the mechanical structure (for example, the moveable or expandable electrodes and/or frequency adjustment structures).

Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a temperature compensated microelectromechanical resonator as well as fabricating, manufacturing, providing and/or controlling microelectromechanical resonators having mechanical structures that include integrated heating and/or temperature sensing elements. In another aspect, the present invention is directed to fabricate, manufacture, provide and/or control microelectromechanical resonators having mechanical structures that are encapsulated using thin film or wafer level encapsulation techniques in a chamber, and including heating and/or temperature sensing elements disposed in the chamber, on the chamber and/or integrated within the mechanical structures. Other aspects of the inventions will be apparent from the detailed description and claims herein.

Abstract: A biological cell test method and apparatus employs a conventional perforated cell carrier which has a plurality of holes. Each hole has two metal electrodes. A cell is disposed in the hole to contact the two electrodes. The electrodes are connected to electric current or voltage. The electric current or field flows from one electrode through the cell to another electrode. Through the inherent impedance, inductance or capacitance of the cell, the presence or property reactions of the cell may be detected.

Abstract: A method and apparatus for a thermal stratification test providing cyclical and steady-state stratified environments. In order to test an electronic device, for example one having one or more levels of ball-grid-array interconnections, e.g., connecting a chip to a flip-chip substrate and connecting the flip-chip substrate to a printed circuit board of a device, an apparatus and method are provided to heat one side of the device while cooling the second side. In some embodiments, the process is then reversed to cool the first side and heat the second. Some embodiments repeat the cycle of heat-cool-heat-cool several times, and then perform functional tests of the electronic circuitry. In some embodiments, the functional tests are performed in one or more thermal-stratification configurations after cycling at more extreme thermal stratification setups. In some embodiments, a test that emphasizes solder creep is employed.

Abstract: A sensor has a series circuit, which includes first and second end terminals, a set of thermocouples electrically connected in series between the first end terminal and the second end terminal, and electrical inspection terminals, which extend from corresponding intermediate points in the series circuit between the first end terminal and the second end terminal to divide the set of thermocouples into smaller groups of thermocouples. A resistance value of each group of thermocouples is measured through adjacent two of the first and second end terminals and the electrical inspection terminals while the sensor is in a wafer state. Whether the thermopile infrared sensor is normal is determined based on the measured resistance value of each group of thermocouples.

Abstract: According to one exemplary embodiment, a method for establishing a relationship between Joule heating in a conductor and a current density in the conductor is implemented by performing wafer level measurements. According to this exemplary embodiment, wafer level measurements are performed to arrive at a temperature coefficient of resistance in the conductor. The method also includes determining a thermal resistance of the conductor. The thermal resistance is then utilized to establish a relationship between Joule heating in the conductor and the current density in the conductor. The relationship so obtained is then utilized to determine design rules, mean time to fail, and other information to aid in the design of reliable semiconductor devices. According to another exemplary embodiment, a wafer level measurement system is utilized to establish a relationship between Joule heating in a conductor and a current density in the conductor.

Abstract: A specialized computer program is utilized to operate apparatus for testing internal components of an integrated circuit package. A Peltier-junction module is controlled so as to ramp-up and ramp-down the temperature of an integrated circuit package while reading out and plotting the power-bus-ground resistance of the package during the up-ramp and down-ramp cycles. The computer screen then indicates a characteristic graph for a properly working package and erratic graph for a package having a short circuit or open circuit components.

Abstract: A system for stressing and monitoring an electrical device, such that the imposed stress conditions may be terminated at electronic speeds, thereby preventing destruction of the device under test. The system includes stress channels each paired with a control and monitor circuit, such that the control and monitor circuit may shut down the stress if a limiting stress level is detected by the control and monitor circuit. A microprocessor is used to communicate via a digital control bus with each of the paired stress channels and control and monitor circuits to determine the status of the stress channel; control the stress input; and enable or disable the control and monitor circuits. A computer is used to communicate with the microprocessor through a serial interface.

Abstract: A temperature detection device is provided for an electronic circuit, in particular for a HF tuner. The temperature detection device comprises a temperature detector, an analog-to-digital converter and a standardized serial bus. At its output the temperature detector makes available a temperature-dependent voltage that is a predetermined function of the temperature. The temperature-dependent voltage is applied to the input of the analog-to-digital converter. On its output side, the analog-to-digital converter is coupled to the standardized serial bus.

Abstract: A generator interior cooling gas monitor includes a cooling gas introduction pipe for introducing a cooling gas into the interior of a generator, a mass spectrograph connected to the cooling gas introduction pipe for separating the substances in the cooling gas introduced through the cooling gas introduction pipe according to the masses of each of the substances and detecting the mass, and a computer for subjecting mass data detected by the mass spectrograph to an arithmetic operation and displaying the result of the arithmetic operation.

Abstract: There are provided electromagnetic wave source detecting apparatus and method as well as electromagnetic wave source analyzing system and method which can detect and analyze a source of (electromagnetic disturbing wave) representing a main factor in generating an electromagnetic field remotely of the apparatus in order to suppress the electromagnetic field intensity at the remote distance from the apparatus to below a regulated value.

Abstract: A method for evaluating quality of a resistance weld is provided, in which a nugget generation state during a welding process is evaluated by observable numerical values based on physical phenomena, and which can afford a wide application range in welding material as well as a capability of accurate knowledge as to the nugget generation state of the weld. Based on that a specific resistance value of a metal material to be welded has a temperature dependency in a conduction state of AC or current-pulsated welding current, a rate of change of inter-chip dynamic resistance instantaneous value during a current changing period is determined, a changing state of the dynamic resistance instantaneous value is further calculated, and a heat-generating state of a weld zone, i.e., a nugget formation state is estimated. Thus, a quality evaluation of a weld is performed accurately.

Abstract: A test instrument for testing magnet wire which is provided which tests, collects and permits analyzing the effect of temperature, frequency, voltage and rise time associated with magnet wire use, and more particularly, the effects of those variables on the insulation of the wire, so as to evaluate the magnet wire performance and inverter controlled dynamoelectric machine applications.

Abstract: In a system for evaluating a semiconductor device, a laser beam generating unit generates a laser beam, and an optical fiber receives the laser beam to heat an area of the semiconductor device. A current deviation detector or a voltage deviation detector is connected to a terminal of the semiconductor device. As a result, the current deviation detector or the voltage deviation detector detects a current deviation or a voltage deviation at the terminal of the semiconductor device.

Abstract: A microprocessor control (10, 24) has one or more temperature responsive thermistor sensors (20, 26, 28) used to provide temperature inputs to control operation of a temperature control system. The microprocessor control subjects the thermistor sensors to a series of diagnostic tests prior to reading the thermistor sensors, the tests including short and open circuits, shorts to ground or power and leakage paths to ground. The thermistors, along with a reference resistor (R11, R26) form an RC charge circuit with a capacitor (C6, C6'). The capacitor is charged through each thermistor and reference resistor for selected open and short tests while a watch dog timer is used to determine the time taken to charge the capacitor via a timer capture port coupled to the capacitor.

Abstract: A high-frequency detecting element that can detect a temperature increase in an instant due to high-frequency wave absorption using semiconducting ceramic with positive resistance-temperature characteristics. The ceramic is composed mainly of barium titanate. A high-frequency heater incorporating the high-frequency detecting element is also disclosed. In the high-frequency detecting element, electrodes are provided on one main surface of semiconducting ceramic 1 with positive resistance-temperature characteristics and leads 3a and 3b are soldered to the electrodes 2a and 2b.

Abstract: A test socket is provided as part of a high temperature electromigration test system to allow the prediction of median time to failure to temperatures in excess of 450.degree. C. of VSLI interconnects.

Abstract: A standard resistor having a known resistance value is connected to one transistor in a drive IC. The drive IC has a plurality of transistors each controlling the on/off of a heating element. The saturation voltage of each transistor is generally the same. One of a plurality of transistors is turned on, and a discharge time required for a capacitor to discharge via a standard resistor or via each heating element and lower its voltage to a predetermined voltage is measured. The resistance value of each heating element is determined from a ratio of a discharge time via each heating element to a discharge time via the standard resistor and the resistance value of the standard resistor. A difference between the standard resistance value and a resistance value of each heating element generates a bias heat energy error during bias heating and an image heat energy error during image heating. In accordance with these heat energy errors, bias data for generating a heat energy immediately before coloring is corrected.

Abstract: A standard resistor having a known resistance value is connected to one transistor in a drive IC. The drive IC has a plurality of transistors each controlling on/off switching of a heating element. The saturation voltage of each transistor is generally the same. One of a plurality of transistors is turned on, and a discharge time required for a capacitor to discharge via a standard resistor or via each heating element and lower its voltage to a predetermined voltage is measured. The resistance value of each heating element is determined from a ratio of a discharge time via each heating element to a discharge time via the standard resistor and the resistance value of the standard resistor. A difference between the standard resistance value and a resistance value of each heating element generates a bias heat energy error during bias heating and an image heat energy error during image heating.

Abstract: A thermistor network for a low temperature component of a temperature compensating circuit includes a series resistor-capacitor combination in parallel with a thermistor and a capacitor. The presence of the capacitor in series with the resistor permits DC measurement of the resistance of the resistor without the measurement being affected by current flow through the thermistor. This low temperature component may be connected in series with a high temperature component of the temperature compensating circuit. Alternatively, the low temperature component can be connected in parallel with the high temperature component.

Abstract: Device for estimating, at high temperature, the electromagnetic properties of a material, including:an oven (1, 19, 20);a waveguide (3) disposed at least in part in said oven, a housing for a specimen piece of uniform thickness made of said material, this specimen piece being such that, when it is disposed in said housing, its outer periphery matches the inner surface of the waveguide;means (4, 5, 6) for applying an incident very high frequency electromagnetic wave to the waveguide (3); andmeans (4, 5, 6) for collecting the electromagnetic wave reflected by said specimen piece.A vertically disposed waveguide has (3) said housing provided at the open lower end (3B ).

Abstract: A testing method and apparatus for conductive materials using electric current which makes it possible to rapidly evaluate the electromigration resistance of conductive materials. The apparatus includes a substrate support for supporting a substrate on which an interconnector pattern is formed, a cooling vessel for cooling the substrate, a first current supply for applying a first current to the interconnector, a resistance measurer for measuring the resistance of the interconnector pattern while the first electric current is being applied to the interconnector pattern, a second current supply for applying a second electric current larger than the first electric current to the interconnector pattern, and a controller which controls the repetition of the measurement of resistance of the interconnector pattern and the application of the second current to the interconnector pattern.

Abstract: The resistivity of the surface of a semiconductor wafer is measured at different temperatures to determine the resistivity as a function of temperature. The temperature of the semiconductor wafer is varied by a heater in thermal contact with the semiconductor wafer, and the temperature is measured by a temperature sensor in thermal contact with the semiconductor. The heater is controlled by a control unit which adjusts the amount of heat provided by the heater, thereby controlling the temperature at which a measurement from a four-point resistivity probe is taken.

Abstract: A method of measuring dielectric material constants, which includes steps of forming a dielectric resonator by providing a plurality of coupling terminals for input and output of signals, on a shield case, with a dielectric sample being disposed within the shield case, constituting an oscillation circuit together with the dielectric resonator by connecting a positive feed-back circuit including an amplification circuit, between the signal output coupling means and the signal output coupling means, and measuring variation in an oscillation frequency of the oscillation circuit by heating the dielectric sample through injection of a high frequency power into the particular coupling terminal, so as to obtain a specific material constant of the dielectric sample based on the variation of the oscillation frequency, and, also a measuring device employed for effecting the measuring method.

Abstract: Fiberoptic sensors of various configurations are provided for measuring the magnitude of the electric or magnetic fields, and thereby the power, at local points within a relatively high-power electromagnetic heating environment such as occurs, for example, in a microwave oven or an industrial microwave processing chamber. Each type of sensor includes one element that is heated by either the oscillating electric or magnetic field, and an optical temperature measuring element positioned to be heated by the first element, its temperature being optically determined by an instrument to which an opposite end of the optical fiber length is connected.

Abstract: A vapor electrical conductivity cell with sensing plates mounted on insulrs exposed to the vapor. Vapor condensation on those insulators cause errors in the conductivity measurements. The improvement of the invention keeps the insulators at a temperature higher than the vapor. The leakage errors are therefore reduced considerably.

Abstract: Two lead wires for each, connected to opposite ends of a heat generating element are secured to a holder. These lead wires form four-point-terminals at their other ends and thereby a disposable sensor is provided. A current source and a voltmeter are connected to the terminal and changes in various properties of fluid are determined on the basis of a value of current supplied from the current source and a value of voltage measured by the voltmeter.