Voltage Probe Patents (Class 324/72.5)
  • Patent number: 10274513
    Abstract: A system for atomic force microscopy in which a sharp electrode tip of an flexing probe cantilever is positioned closely adjacent a sample being probed for its electrical characteristics. An optical beam irradiates a portion of the sample surrounding the probe tips and is modulated at a radio or lower modulation frequency. In one embodiment, a reference microwave signal is incident to the electrode tip. Microwave circuitry receives a microwave signal from the probe tip, which may be the reflection of the incident signal. Electronic circuitry processes the received signal with reference to the modulation frequency to produce one or more demodulated signals indicative of the electronic or atomic properties of the sample. Alternatively, the optical beam is pulsed and the demodulated signal is analyzed for its temporal characteristics. The beam may non-linearly produce the microwave signal. Two source lasers may have optical frequencies differing by the microwave frequency.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: April 30, 2019
    Assignee: Primenano, Inc.
    Inventors: Stuart L. Friedman, Michael M. Kelly
  • Patent number: 10254312
    Abstract: The present disclosure describes a semiconductor wafer testing environment for routing signals used for testing integrated circuits formed onto a semiconductor wafer. The semiconductor wafer testing environment includes a semiconductor wafer tester to control overall operation and/or configuration of the semiconductor wafer testing environment and a semiconductor wafer prober to test the integrated circuits formed onto the semiconductor wafer. The semiconductor wafer prober includes a probe card having a transmission line coupler formed onto a flexible substrate. The transmission line coupler includes multiple transmission line coupling blocks that extend radially from a central point of the flexible substrate in a circular manner.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: April 9, 2019
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Timothy Scranton, Michael Boers, Seunghwan Yoon, Jesus Castaneda
  • Patent number: 10234482
    Abstract: A probe card includes a probe board and a needle disposed on the probe board, the needle including a needle tip. The needle tip includes a bottom surface having a long axis and a short axis that crosses the long axis. The needle tip includes a top surface being spaced apart from the bottom surface, wherein the top surface has a long axis and a short axis that crosses the long axis, and wherein the long axis of the bottom surface and the long axis of the top surface extend in different directions. The needle tip includes a side surface connecting the bottom surface with the top surface, wherein the side surface is twisted between the top and bottom surfaces.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: March 19, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Sangboo Kang
  • Patent number: 10229873
    Abstract: A three plate MIM capacitor test structure includes a three plate MIM capacitor, a first test wire in a metal layer above/below the three plate MIM, a second test wire below/above the three plate MIM, a third test wire below/above the three plate MIM, a first via connected to the first test wire, a second via connected to a middle plate of the three plate MIM, and a third via connected to the top and bottom plates of the three plate MIM. The test structure may verify the integrity the MIM capacitor by applying a potential to the first test wire, applying ground potential to both the second test wire and the third test wire, and detecting leakage current across the first test wire and the second and third test wires or detecting leakage current across the second test wire and the third test wire.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: March 12, 2019
    Assignee: International Business Machines Corporation
    Inventors: Andrew T. Kim, Baozhen Li, Barry P. Linder, Ernest Y. Wu
  • Patent number: 10215775
    Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: February 26, 2019
    Assignee: University of Southern California
    Inventors: Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard, Dennis R. Smalley
  • Patent number: 10215801
    Abstract: A contact inspection device includes: plural probes each having a first end to be brought into contact with a test object; a probe substrate including contact portions in contact with respective second ends of the probes; a probe head through which the probes extend and which is detachably attached to the probe substrate; and plural positioning members which are provided on a surface of the probe head facing the probe substrate and through which the probes extend. Each probe has a rotation restricted portion provided on the side of the second end. Each positioning member has rotation restricting portions adapted to engage the rotation restricted portions. When the positioning members are moved relative to each other, the rotation restricting portions align the probes and switch the probes from a rotation unrestricted state to a rotation restricted state.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: February 26, 2019
    Assignee: KABUSHIKI KAISHA NIHON MICRONICS
    Inventor: Mika Nasu
  • Patent number: 10186823
    Abstract: According to one aspect, an apparatus includes an expansion element, an expandable element, and a frame. The expandable element is configured to have an expanded state and an unexpanded state, wherein the expandable element is arranged to be inserted between a mated pair of printed circuit boards (PCBs) while in the unexpanded state. The expansion element is arranged to cause the expandable element to expand to the expanded state. When the expandable element is in the expanded state, the expandable element causes the pair of PCBs to demate. The frame is arranged to facilitate an insertion of the expandable element between the mated pair of PCBs. In one embodiment, the expandable element is an inflatable element and the expansion element is an inflator element that includes an air supply.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: January 22, 2019
    Assignee: Cisco Technology, Inc.
    Inventor: Robert Gregory Twiss
  • Patent number: 10184957
    Abstract: The present disclosure provides a testing apparatus, a holding assembly and a probe card carrier. In some embodiments of the present disclosure, the testing apparatus includes a basic circuit board having a first surface and a second surface; a holding assembly disposed on the first surface; a signal transfer assembly disposed on the second surface and electrically connected to the basic circuit board; and a probe card carrier configured to carry a probe card. In some embodiments of the present disclosure, when the probe card carrier is assembled to the holding assembly, the probe card is electrically connected to the signal transfer assembly.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: January 22, 2019
    Assignee: STAR TECHNOLOGIES, INC.
    Inventors: Choon Leong Lou, Ho Yeh Chen, Li Min Wang, Hsiao Ting Tseng
  • Patent number: 10153589
    Abstract: A system for automatically establishing a temporary electrical power connection comprises a first coupling member including a sealing ring surrounding a first electrical coupling means and a second coupling member including a sealing ring contact surface surrounding a second electrical coupling means. The sealing ring and the sealing ring contact surface are configured for being pressed together, whereby they seal off a vacuum chamber. A vacuum conduit is connected to the vacuum chamber for establishing therein a vacuum capable of firmly holding together both coupling members, thereby defining a mechanical coupling position. The first or second electrical coupling means include a surface electrode dimensioned for achieving a plurality of possible electrical coupling positions around a central electrical coupling position. The seal ring and seal ring contact surface are configured for achieving a sealed contact and thereby a mechanical coupling position in each of these possible electrical coupling positions.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: December 11, 2018
    Assignee: IPALCO BV
    Inventor: Michael Widegren
  • Patent number: 10107837
    Abstract: Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: October 23, 2018
    Assignee: STMicroelectronics S.r.l.
    Inventor: Alberto Pagani
  • Patent number: 10024908
    Abstract: A probe comprises a first end that contacts and separates from a test object and a second end that contacts a circuit board to perform inspection of the test object. The second end is provided with a rotation restricted portion that restricts rotation of the probe about the axial direction thereof. An extendable portion, which is freely extendable and contractible in the axial direction of the probe and has at least one spiral slit, is provided between the first end and the second end. The second end is formed by a tubular member. Also, at least two of the extendable portions are provided between the first end and the second end, and an intermediate portion is formed between the extendable portions.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: July 17, 2018
    Assignee: KABUSHIKI KAISHA NIHON MICRONICS
    Inventors: Hiroyasu Ando, Mika Nasu
  • Patent number: 10006939
    Abstract: Testing probe and semiconductor testing fixture, and their fabrication methods are provided. A testing probe may configure a chamber through an insulating body. A first testing pin is disposed inside the chamber of the insulating body. The first testing pin includes: a first testing terminal on one end of the first testing pin and a first connection terminal on another end of the first testing pin. An elastic member is disposed inside the chamber and attached to the first testing pin to drive an upward or downward movement of the first testing pin along the chamber. A second testing pin is disposed around an outer sidewall surface of the insulating body enclosing the first testing pin. The second testing pin includes a second testing terminal on one end of the second testing pin and a second connection terminal on another end of the second testing pin.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: June 26, 2018
    Assignee: TONGFU MICROELECTRONICS CO., LTD.
    Inventor: Lei Shi
  • Patent number: 9995786
    Abstract: An apparatus for evaluating a semiconductor device includes: a chuck stage; an insulating substrate; a plurality of probes; a temperature adjustment unit; an evaluation/control unit; and a probe position/temperature inspection device including an inspection plate, a thermo-chromic material, a photographing unit, and an image processing unit. The photographing unit photographs a color-change image of the thermo-chromic material in a state in which distal end portions of the plurality of probes are pressed against the upper surface of the inspection plate. The image processing unit performs image processing to the color-change image to calculate in-plane positions and temperatures of the distal end portions of the plurality of probes.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: June 12, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Akira Okada, Norihiro Takesako, Hajime Akiyama
  • Patent number: 9983231
    Abstract: A multipoint probe for establishing an electrical connection between a test apparatus and a test sample, the multipoint probe comprising a base defining a top surface and a plurality of traces provided on the top surface, each trace individually interconnecting a contact pad and a contact electrode for establishing the electrical connection to the test sample, each trace comprising a wide portion connected to the contact pad and a narrow portion connected to the contact electrode; the first top surface comprising first intermediate surfaces, each interconnecting a pair of neighboring traces at their respective wide portions, and second intermediate surfaces, each interconnecting a pair of neighboring traces at their respective narrow portions, and the first intermediate surfaces being provided on a first level and the second intermediate surfaces being provided on a second level above the first level relative to the base.
    Type: Grant
    Filed: June 20, 2013
    Date of Patent: May 29, 2018
    Assignee: CAPRES A/S
    Inventor: Lior Shiv
  • Patent number: 9970901
    Abstract: An eddy current testing to detect defects at the surface or at shallow depth in a blade root for an airplane engine fan is provided. The device includes a probe containing a sensor, the probe being hinge-mounted to the end of a handle, a guide presenting a reference surface, and a mechanism for adjusting the position of the guide parallel to an axis of the handle.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: May 15, 2018
    Assignee: SNECMA
    Inventors: Christian Armand Marceau, Andre Rouff
  • Patent number: 9903888
    Abstract: A probe card for contacting an LED chip of flip-chip type includes a circuit board, two probes and a fixing seat. The circuit board has a mounting surface and a lateral edge. Each probe has a connecting portion mounted on the circuit board, an extending portion extending from the connecting portion, a cantilever portion connected with the extending portion and protruding out of the lateral edge, and a contacting portion extending from the cantilever portion. The fixing seat is mounted on the mounting surface of the circuit board and has a fixing surface. A part of the extending portion is located between the circuit board and the fixing seat. A test equipment for testing optical characteristics of an LED chip of flip-chip type is provided with the probe card.
    Type: Grant
    Filed: August 13, 2015
    Date of Patent: February 27, 2018
    Assignee: MPI CORPORATION
    Inventors: Chia-Tai Chang, Hsiu-Wei Lin, Hung-Yi Lin
  • Patent number: 9900478
    Abstract: Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: February 20, 2018
    Assignee: FLIR SYSTEMS, INC.
    Inventors: Michael Fox, Mark Nussmeier, Eric A. Kurth, Nicholas Högasten, Theodore R. Hoelter, Katrin Strandemar, Pierre Boulanger, Barbara Sharp, Jeffrey D. Frank, Andrew C. Teich, Dwight Dumpert, Gerald W. Blakeley
  • Patent number: 9897644
    Abstract: A method of testing a semiconductor device against electrostatic discharge includes operating the semiconductor device, and, while operating the semiconductor device, monitoring a functional performance of the semiconductor device. The monitoring includes monitoring one or more signal waveforms of respective one or more signals on respective one or more pins of the semiconductor device to obtain one or more monitor waveforms, and monitoring one or more register values of one or more registers of the semiconductor device to obtain one or more monitor register values as function of time. The method includes applying an electrostatic discharge event to the semiconductor device while monitoring the functional performance of the semiconductor device. The method can further comprise determining a functional change from the one or more monitor waveforms and the one or more monitor register values as function of time.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: February 20, 2018
    Assignee: NXP USA, Inc.
    Inventors: Alain Salles, Patrice Besse, Stephane Compaing, Philippe DeBosque
  • Patent number: 9880213
    Abstract: An illustrative example conductor monitoring device includes a generator configured to radiate a field into a conductor. A detector is configured to detect at least some of the field propagated along the conductor. A processor is configured to determine when a change in the propagated field detected by the detector indicates contact between the conductor and a conductive blade of a wire processing machine. The example conductor monitoring device is capable of providing information regarding the condition of a conductor that has gone through a wire handling process that involves cutting the wire and stripping insulation from near the end of the cut wire, for example. The information regarding the condition of the wire is obtained without making contact with the wire and without interfering with or requiring any alteration of the wire handling process or machine.
    Type: Grant
    Filed: August 19, 2013
    Date of Patent: January 30, 2018
    Assignee: OES, INC.
    Inventors: Kiet Ngo, Michael Reeve
  • Patent number: 9863991
    Abstract: A method of inspecting a sensor sheet formed by a roll-to-roll scheme for a touch sensor, the sensor sheet including a roll sheet and a sensor electrode layer thereon, the sensor electrode layer including sensor electrodes running in a prescribed direction, the sensor sheet further including a terminal connected to the sensor electrode layer and alignment marks, the method including: arranging the sensor sheet on an inspection table of an inspection device, the inspection table having an alignment mark and inspection electrodes running in another prescribed direction such that at least one of the alignment marks aligns with the alignment mark on the inspection table and such that the inspection electrodes face the sensor electrodes orthogonally in a plan view and are vertically separated by a dielectric to form capacitances at respective intersections therebetween; measuring the capacitances at the respective intersections; and outputting the measured capacitances as an inspection result.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: January 9, 2018
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Yuhji Yashiro, Kazuya Yoshimura, Shinji Matsumoto
  • Patent number: 9805891
    Abstract: A fluid pressure actuated device for establishing electrical contact includes a first side and a second side each defining a respective cavity. A respective flexible membrane is positioned across each cavity. Each membrane has an outer side that carries an electrically conducting contactor. The contactors are electrically connected to a conducting connector that extends at least partially through the device. Each flexible membrane extends and withdraws moving the associated electrically conducting contactor in opposing directions when fluid pressure is increased and decreased in the associated cavity. Each membrane may have an undulating shape by including concentric frustum portions that narrow in opposite directions. The contacts may have neutral positions that are internal relative to outer surfaces of the device until fluid pressure is increased in the respective cavities causing extension by movement of the membranes.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: October 31, 2017
    Assignee: Componentzee, LLC
    Inventor: Masud Beroz
  • Patent number: 9793226
    Abstract: The present invention describes essentially three different embodiments for the implementation of low impedance (over frequency) power delivery to a die. Such low impedance to a high frequency allows the die to operate at package-level speed, thus reducing yield loss at the packaging level. Each embodiment addresses a slightly different aspect of the overall wafer probe application. In each embodiment, however, the critical improvement of this disclosure is the location of the passive components used for supply filtering/decoupling relative to prior art. All three embodiments require a method to embed the passive components in close proximity to the pitch translation substrate or physically in the pitch translation substrate.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: October 17, 2017
    Assignee: R & D Circuits, Inc.
    Inventors: Thomas P. Warwick, James V. Russell, Dhananjaya Turpuseema
  • Patent number: 9772352
    Abstract: A probe unit includes a probe pin and a support unit supporting the probe pin. The support unit includes first and second arms disposed at a distance along a direction in which the probe pin probes a probed object; a holding unit holding base ends of the arms; and a linking unit attached to the probe pin and linking front ends of the arms. The support unit constructs a four-bar linkage that permits linear or approximately linear movement of the probe pin in an opposite direction to the probing direction. The first and second arms have through-holes at positions slightly closer to the front ends than the base ends and positions slightly closer to the base ends than the front ends, center parts between the through-holes function as bars in the four-bar linkage, and formation positions of the through-holes function as joints in the four-bar linkage.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: September 26, 2017
    Assignee: HIOKI DENKI KABUSHIKI KAISHA
    Inventors: Masashi Kobayashi, Takahiro Ogawara
  • Patent number: 9702906
    Abstract: A structure and method of facilitating testing of an electronic device (device under test or DUT) using a non-permanent and reusable structure to terminate contact pads and contact pin holes on a surface of the DUT.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: July 11, 2017
    Assignee: International Business Machines Corporation
    Inventors: Matteo Cocchini, Michael A. Cracraft, Jayapreetha Natesan, John G. Torok
  • Patent number: 9696344
    Abstract: The present invention relates to a test socket which allows for ease of alignment, and more particularly, to a test socket that is interposed between a device to be inspected and an inspection apparatus so as to electrically connect terminals of the device to be inspected and pads of the inspection apparatus, the test socket including: an alignment member that has a plurality of through-holes formed at points corresponding to the terminals of the device to be inspected or the pads of the inspection apparatus and is attached to the inspection apparatus such that the through-holes are located at the pads of the inspection apparatus; and an elastic conductive sheet including conductive parts that are disposed at the points corresponding to the terminals of the device to be inspected and include a plurality of conductive particles that are distributed in an insulating elastic material, insulating support parts that support the conductive parts and disconnect an electrical connection between adjacent conductive pa
    Type: Grant
    Filed: April 29, 2013
    Date of Patent: July 4, 2017
    Assignee: ISC Co, Ltd.
    Inventor: Jae Hak Lee
  • Patent number: 9696373
    Abstract: A circuit is designed to be executed in a predeterminable operating mode of a plurality of operating modes. The circuit includes a first functional unit and a second functional unit. The first functional unit is designed as a static functional unit that in each of the plurality of operating modes of the circuit carries out a consistent function. The second functional unit is designed as an adaptable functional unit that is designed to be configured, prior to the circuit being put into service, according to a first configuration of a plurality of different configurations and during the operating time of the circuit to maintain the first configuration so that the first configuration of the second functional unit defines the predeterminable operating mode of the circuit. This makes it possible to reduce the verification expenditure for the circuit because verification can be limited to the adaptable functional unit.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: July 4, 2017
    Assignee: Airbus Defence and Space GmbH
    Inventors: Daniel J. Muench, Michael Paulitsch, Michael Honold, Wolfgang Schlecker
  • Patent number: 9627814
    Abstract: A coaxial connector includes a body having a longitudinal axis passing through first and second opposed body ends, the second body end for engaging a male coaxial connector, within the body a coil spring, a connector center conductor, and a second body end insulator supporting the connector center conductor, and a spring for urging an electromagnetic shield to protrude from the body.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: April 18, 2017
    Assignee: Holland Electronics LLC
    Inventors: Reed Gibson, George Goebel, Michael Holland, Jason Holt
  • Patent number: 9618599
    Abstract: Responses of voltage and current probes are characterized or corrected. A voltage probe method includes measuring output of the voltage probe and a first output of a through, in response to an input signal applied to the through, with the voltage probe connected, measuring a second output of the through with the voltage probe disconnected, and characterizing the response of the voltage probe using the output of the voltage probe and the first and/or second outputs. A current probe method includes measuring output current of the current probe and first output current of a through, in response to an input signal applied to the through with the current probe connected in series, measuring second output current of the through with the current probe disconnected, and characterizing the response of the current probe using the output current of the current probe and the first and/or second output currents of the through.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: April 11, 2017
    Assignee: Keysight Technologies, Inc.
    Inventor: David Dascher
  • Patent number: 9594096
    Abstract: In accordance with an embodiment, a probe card comprises a contact pad interface comprising front side contacts and back side contacts electrically coupled together. The front side contacts are arranged to simultaneously electrically couple respective bumps of a plurality of dies on a wafer, and the back side contacts are arranged to electrically couple respective contacts of a testing structure.
    Type: Grant
    Filed: August 16, 2013
    Date of Patent: March 14, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: You-Hua Chou, Yi-Jen Lai
  • Patent number: 9593991
    Abstract: A printed circuit board may have embedded strain gauges. A strain gauge may be formed from a metal trace on a polymer substrate. The metal trace may form a variable strain gauge resistor that is incorporated into a bridge circuit for a strain gauge. The printed circuit may have a rigid printed circuit layer with a recess that receives the polymer substrate. Metal pads on the polymer substrate may be coupled to respective ends of the variable strain gauge resistor. The rigid printed circuit substrate with the recess may be laminated between additional rigid printed circuit layers. Vias may be formed through the additional rigid printed circuit layers to contact the metal pads. Embedded strain gauges may be used in gathering strain data when strain is imparted to a printed circuit during use of the printed circuit in an electronic device or during testing.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: March 14, 2017
    Assignee: Apple Inc.
    Inventors: Anne M. Mason, Bryan McDonald, Shawn X. Arnold, Matthew Casebolt, Dennis R. Pyper
  • Patent number: 9583857
    Abstract: An object of the present invention is to provide an electrical contactor highly resistant to deformation capable of achieving satisfactory performance of electrical contact with a small number of elements. An electrical contactor of this invention includes a barrel having a spring part achieving a spring function formed in a partial section, and a first plunger and a second plunger inserted in the barrel through an opening at one end and an opening at an opposite end of the barrel and fixed to the barrel. It is preferable that an end part of the first plunger in the barrel and an end part of the second plunger in the barrel are placed in internal space of the same non-spring part not to achieve a spring function. It is preferable that the barrel has three or more spring parts separated while non-spring parts are placed between the spring parts.
    Type: Grant
    Filed: May 19, 2015
    Date of Patent: February 28, 2017
    Assignee: KABUSHIKI KAISHA MIHON MICRONICS
    Inventors: Mika Nasu, Darren Russell Aaberge, Hiroyasu Ando
  • Patent number: 9535095
    Abstract: Wire probes are described that resist rotation during assembly into a probe head of a die tester. One example includes probe wires with a protrusion at a pre-determined position along the length of the wire. A probe substrate with pads on one side each to attach to and electrically connect with a probe wire and a pads on the opposite side to connect to test equipment and a probe holder above the substrate with holes. Each hole holds a respective one of the probe wires against the probe substrate. Each hole also has a key to mate with a protrusion of a respective probe wire so that the protrusions engage the keys to prevent rotation of the respective wire.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: January 3, 2017
    Assignee: Intel Corporation
    Inventors: David Shia, Todd P. Albertson, Keith J. Martin
  • Patent number: 9535092
    Abstract: A spring probe includes a needle, a spring sleeve sleeved onto the needle, and a protrusion. The spring sleeve has upper and lower non-spring sections, and at least a spring section therebetween. The needle has a bottom end portion protruding out from the lower non-spring section, and a top end portion located in the upper non-spring section. The protrusion is located at one of the top end portion and the upper non-spring section. The needle is movable relative to the upper non-spring section from an initial position to a connected position where the upper non-spring section is electrically connected with the needle through the protrusion when receiving an external force. As a result, the spring probe effectively prevents signals from being transmitted through the spring section, thereby improving stability of signal transmission and preventing the spring section from fracture.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: January 3, 2017
    Assignee: MPI CORPORATION
    Inventors: Ting-Hsin Kuo, Tsung-Yi Chen, Tien-Chia Li, Yi-Lung Lee, Chien-Chou Wu
  • Patent number: 9529014
    Abstract: Provided is a method and an apparatus for acquiring electrical measurements of an electronic device. The method and the apparatus comprise securing an elastomeric connector at least partially inside a cavity within a truncated front end of an electrical probe, wherein the electrical probe is physically and electrically coupled to an electric cable; physically and electrically coupling the electric cable to a data processor; electrically connecting the elastomeric connector end to said electronic device; and outputting electrical measurement data from the elastomeric connector end through the electric cable to said data processor. The advantages are that the connection can be single wire per probe or two wires per probe, with only a single physical connection required, and the lack of probe damage to the feature being probed.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: December 27, 2016
    Assignee: Insight Photonic Solutions, Inc.
    Inventor: Michael Minneman
  • Patent number: 9500701
    Abstract: An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.
    Type: Grant
    Filed: March 15, 2011
    Date of Patent: November 22, 2016
    Assignee: Delta Design, Inc.
    Inventors: Jerry Ihor Tustaniwskyj, James Wittman Babcock
  • Patent number: 9482694
    Abstract: A device for measuring electronic components having a plurality of conductors applied to a dielectric cable carrier, which conductors are each connected both to a contact finger and to a connection contact, such that a switch is integrated in at least one of the conductors, via which the conductor can be additionally connected to a ground connection.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: November 1, 2016
    Assignee: Rosenberger Hochfrequenztechnik GmbH & Co., KG
    Inventor: Roland Neuhauser
  • Patent number: 9444239
    Abstract: The present invention relates to a bar for the electrical contacting of an electrically conductive substrate in the form of a thin, electrically conducting and resilient contact. The bar comprises a current-collecting bar on which a plurality of contact fingers is fitted. The invention is distinguished by the contact fingers being configured resiliently in the direction of the contact to be produced.
    Type: Grant
    Filed: January 3, 2012
    Date of Patent: September 13, 2016
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventors: Harry Wirth, Johann Walter
  • Patent number: 9431742
    Abstract: A spring-loaded contact may include a barrel to form a housing for the spring-loaded contact, a plunger at least partially enclosed by the barrel, a spring enclosed by the barrel, and a sphere between the plunger and the spring. A back of the plunger may be formed at an angle and to include a retention guide, the retention guide partly over the sphere such that the sphere may be in contact with the back of the plunger and the retention guide.
    Type: Grant
    Filed: June 15, 2015
    Date of Patent: August 30, 2016
    Assignee: Apple Inc.
    Inventors: John DiFonzo, Shuhi Mori
  • Patent number: 9430957
    Abstract: A virtual load board includes a connection port, a conversion circuit, and an indication unit, wherein the connection port comprises at least one terminal. The terminal receives an output voltage from the liquid crystal display control board. The conversion circuit converts the output voltage into an operating voltage for the indication unit and supplies the operating voltage to the indication unit. A test system and a test method for liquid crystal display control board are also provided. With the above-discussed arrangement, the virtual load board replaces a liquid crystal display panel to carry out a reliability test of the liquid crystal display control board, and has the advantages of small volume and low cost and can be accommodated, together with the liquid crystal display control board, in reliability test equipment in order to carry out a reliability test of the liquid crystal display control board in a specific environment.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: August 30, 2016
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Shiue-shih Liao, Chun-jiang Li, Xiao-xin Zhang, Jung-mao Tsai
  • Patent number: 9423417
    Abstract: A tester includes a main body and a removable probe. The main body includes a main body probe and a front panel including selectable options for selecting a tester function. The removable probe may be coupled to the main body via a cord. The removable probe is fixable to the main body via a latch assembly. The latch assembly includes a socket disposed on one of the removable probe or the main body and a mating protrusion disposed at the other of the removable probe or the main body.
    Type: Grant
    Filed: October 12, 2011
    Date of Patent: August 23, 2016
    Assignee: Fluke Corporation
    Inventors: Ferdinand Laurino, Jeff Worones
  • Patent number: 9417266
    Abstract: A method and structures implement an enhanced handheld transfer impedance probe including a rigid probe housing body that carries a pair of coaxial RF connectors providing connections to a network analyzer. A base member includes a respective pair of independent electrical contacts and a common interconnect electrical contact. Each of the respective electrical contacts includes a respective associated electrically conductive compressible pad. Each respective compressible pad extends between rigid stops having a set height to limit gasket compression and enable repeatable gasket compressions for repeatable measurements with the handheld transfer impedance probe. An interconnection structure includes respective interconnects connecting between the coaxial RF connectors and respective electrical contacts.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: August 16, 2016
    Assignee: International Business Machines Corporation
    Inventors: Timothy P. Duncan, Edward C. Gillard, Don A. Gilliland
  • Patent number: 9354253
    Abstract: A probe module includes a substrate having a through hole, and at least four probe-needle rows arranged on the substrate. The probe-needle rows are arranged from a first side to a second side along a first direction. Each of the probe-needle rows has at least two needles arranged along a second direction. Each of the needles has a contact segment and an arm segment having an included angle with the contact segment. An end of the arm segment is connected to the substrate, and the other end of which extends toward the through hole to connect the contact segment. The lengths of the contact segments of the needles of each of the probe-needle rows are the same. The included angles of the needles of the probe-needle rows along the first direction are gradually increased from the first side to the second side.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: May 31, 2016
    Assignee: MPI Corporation
    Inventor: Chia-Tai Chang
  • Patent number: 9350105
    Abstract: Provided is a surface-mount type electric connecting terminal which is disposed between opposing conductive objects and is configured to electrically connecting the objects while easily adjusting pressing force and recovery force. The electric connecting terminal includes a cylindrical fixed member which is made from a metallic material; a cylindrical movable member which is slidably inserted in the fixed member and is made from a metallic material; and an electrical conductive spring which is accommodated in the fixed member and whose one end contacts with the bottom of the fixed member and the other end contacts with the bottom of the movable member for thereby allowing the movable member to elastically slide against the fixed member.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: May 24, 2016
    Assignee: Joinset Co., Ltd. & Sun-Ki Kim
    Inventors: Sun-Ki Kim, Tae-Man Kang, Eung-Won Kim
  • Patent number: 9335343
    Abstract: A test contactor is provided. The test socket includes a printed circuit board (PCB) that transfers electrical signals through a plurality of PCB traces. The plurality of PCB traces couples a signal source to a signal destination. The test contactor also has a first test contact that couples to a first signal pathway from the plurality of PCB traces, whereby the first test contact may be utilized for transferring the electrical signals. The test contactor also has a second test contact that is coupled to a second signal pathway from the plurality of PCB traces, whereby the second test contact may be utilized to provide a ground voltage. The first test contact and the second test contact are of different lengths. A method of testing an integrated circuit is also provided.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: May 10, 2016
    Assignee: Altera Corporation
    Inventor: Adrian Cortez
  • Patent number: 9312616
    Abstract: A plug connector set-up for a control unit includes: a pin support having a pin; and a guide element having a lead-through for positioning the pin at a circuit board of the control unit. The lead-through has an entrance opening on the side facing the pin support and an outlet opening on the side facing away from the pin support. A diameter of the entrance opening is greater than a diameter of the outlet opening. The pin includes a centering region having a diameter which is less than the diameter of the entrance opening and greater than the diameter of the outlet opening.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: April 12, 2016
    Assignee: ROBERT BOSCH GMBH
    Inventors: Dieter Ludwig, Reiner Herold
  • Patent number: 9306308
    Abstract: Provided is a surface-mount type electric connecting terminal which is disposed between opposing conductive objects and is configured to electrically connecting the objects while easily adjusting pressing force and recovery force. The electric connecting terminal includes a cylindrical fixed member which is made from a metallic material; a cylindrical movable member which is slidably inserted in the fixed member and is made from a metallic material; and an electrical conductive spring which is accommodated in the fixed member and whose one end contacts with the bottom of the fixed member and the other end contacts with the bottom of the movable member for thereby allowing the movable member to elastically slide against the fixed member.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: April 5, 2016
    Assignees: Joinset Co., Ltd.
    Inventors: Sun-Ki Kim, Tae-Man Kang
  • Patent number: 9291645
    Abstract: A probe unit includes: contact probes; and a probe holder, each of the contact probe including a plunger and a spring coil, each of the plunger including: a contact portion contacting an electrode of a contacted body; a flange portion extending from a base end of the contact portion and having a diameter larger than a diameter of the contact portion; a boss portion extending from an end of the flange portion different from an end continuing to the contact portion and having a diameter smaller than the diameter of the flange portion; and a base end portion extending from an end of the boss portion different from an end continuing to the flange portion and having a substantially same diameter with the boss portion.
    Type: Grant
    Filed: October 4, 2012
    Date of Patent: March 22, 2016
    Assignee: NHK Spring Co., Ltd.
    Inventors: Akihiro Matsui, Takashi Mori
  • Patent number: 9285394
    Abstract: A test apparatus includes a DUT block, at least one probe and at least one variable-length pusher. The DUT block is used for allowing the DUT to be disposed thereon. The probe is located on the DUT block. The variable-length pusher is located above the probe. The actuator is used for moving the variable-length pusher to push against the DUT to force the DUT to be in electrical contact with the probe.
    Type: Grant
    Filed: January 9, 2014
    Date of Patent: March 15, 2016
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Kai-Yi Tang
  • Patent number: 9264154
    Abstract: Systems and methods for high-speed compression of dynamic electrical signal waveforms to extend the measuring capabilities of conventional measuring devices such as oscilloscopes and high-speed data acquisition systems are discussed. Transfer function components and algorithmic transfer functions can be used to accurately measure signals that are within the frequency bandwidth but beyond the voltage range and voltage resolution capabilities of the measuring device.
    Type: Grant
    Filed: October 8, 2013
    Date of Patent: February 16, 2016
    Assignee: The United States of America as Represented by the Administrator of National Aeronautics and Space Administration
    Inventor: Matthew C. Laun
  • Patent number: 9250266
    Abstract: In assembly of probe arrays for electrical test, a problem can arise where a bonding agent undesirably wicks between probes. According to embodiments of the invention, this wicking problem is alleviated by disposing an anti-wicking agent on a surface of the probe assembly such that wicking of the bonding agent along the probes toward the probe tips is hindered. The anti-wicking agent can be a solid powder, a liquid, or a gel. Once probe assembly fabrication is complete, the anti-wicking agent is removed. In preferred embodiments, a template plate is employed to hold the probe tips in proper position during fabrication. In this manner, undesirable bending of probes caused by introduction or removal of the anti-wicking agent can be reduced or eliminated.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: February 2, 2016
    Assignee: MICROPROBE, INC.
    Inventor: January Kister