Abstract: The test probe comprises a handle and a rod, the rod including a flat face which can be placed against an electrical terminal to be tested. The rod includes a loop residing in a cavity in the handle. An alligator clip may be applied to the loop.

Abstract: A photoresponsive pulser/sampler system for investigating electrical signals and responses in VLSI systems employs a microtip which communicates electrically and mechanically with the device under test, and electrically with an electrode via a photoresponsive gate. The photoresponsive gate is formed of interdigitated electrodes which have interdigital spacings therebetween on the order of 1 .mu.m. The structure of the invention is operable in the dual modalities of probe and pulser which share a common probe tip. Simultaneous implementation of the pulser and sampler functions is achieved with the use of a lock-in amplifier and the technique of difference frequency mixing, where the pulser optical pulse frequency is f.sub.1 and the gate optical pulse frequency is f.sub.2. Multiple photoresponsive gates coupled to a common probe tip and having respective electrodes are disclosed for achieving respective pulsing and sampling functions, and also for effecting S-parameter measurements.

Abstract: A method and apparatus for the accurate non-contact detection and measurement of static electric charge on an object using a reciprocating sensing probe that moves relative to the object. A monitor measures the signal generated as a result of this cyclical movement so as to detect the electrostatic charge on the object.

Abstract: A multi-channel electromagnetically transparent voltage probe transmission link system for monitoring a plurality of voltage signals at a plurality of test points of a device under test that is subjected to a radiation field. Each channel includes two voltage probes, an electrical to optical signal transmitter, an optical signal transmission line and a receiver located out of the radiation field. The voltage probes contact and sense the voltage signals at the test point. The electrical to optical transmitters are removably mounted in a common base and are powered by either a common (or shared) power supply and/or by dedicated power supplies, such as rechargeable batteries. The receivers process the optical signals and provide display signals corresponding to the sensed voltage signal at the plurality of test points for evaluating the effect of the test radiation field.

Abstract: A testing device for single-pole voltage testing comprises, between a test electrode (1) and a ground electrode (2), a high impedance dropping resistor (R1) and a measurement resistor (R2) connected in series. The ground electrode (2) is capacitively coupled to earth through the body of the user. The value of the dropping resistor (R1) is at least 10 times greater than the maximum variation which occurs in the capacitively coupled reactance (C1, C2) of the user relative to the ground, so that the total impedance is almost constant. The voltage drop across the measurement resistor (R2) is amplified, rectified and compared in a comparison circuit with predetermined reference voltages in order to control a light emitting diode indicator (D2, D3, D4, D5) corresponding to the measured voltage. The test device can also be constructed for contactless voltage testing or can also be used as a continuity tester.

Abstract: A signal probe apparatus having a probe tip, a grounding attachment, a main body portion and a connector for use with a signal measuring device. The probe tip and the grounding attachment are coupled by way of first and second signal lines to the connector for supplying signals therefrom to the signal measuring device. A plurality of circuit elements, such as resistors, are connected between the second signal line and a third line in the connector; and switch means located on the main body portion enables a predetermined circuit value, for example, the resistance between the second and third lines, to be selectively changed to a respective value which corresponds to a respective one of several predetermined functions which may be performed by the signal measuring device. The selected circuit value is detected by the signal measuring device and the corresponding function is thereafter implemented.

Abstract: A tester applies a high-voltage test signal across the probes of a high-voltage measuring apparatus, wherein at least one of the probes is mounted at a probe end of an elongated insulated pole. The tester includes a battery-powered generator for generating the test signal which is applied across two contact terminals, respectively adapted for connection to the probes. One of the contact terminals is disposed at the bottom of an elongated tubular socket which receives the probe end of the pole, the contact terminal including two conductive members spring-biased apart until the pole is inserted in the socket. The generator is energized through a switch which may be mounted on the generator housing. In one embodiment the other contact terminal is an alligator clip and in a second embodiment the other contact terminal is disposed in a second socket.

Abstract: Automatic bridge balancing apparatus includes a reference impedance and a measuring terminal pair for receiving an unknown impedance. A source of a test signal is coupled to the reference impedance and the measuring terminal pair. A measuring detector is connected in series with the unknown impedance when connected to the measuring terminal pair to provide a measured signal. A reference detector is coupled to the reference impedance to provide a reference signal. A combiner combines the measured signal with the reference signal to provide an error signal. The reference detector includes an up/down counter coupled to a digital attenuator that provides the reference signal. A controller responds to the error signal to control the count in the up/down counter so that the associated digital attenuator provides a signal to the combiner that reduces the error signal so that the count in the up/down counter is characteristic of the unknown impedance.

Abstract: An IC test instrument has an IC test circuit for an integrated semiconductor chip. A probe card is coupled to the IC test circuit. Probe needles are disposed on the probe card. The probe needles comprise a cobalt-based alloy containing at least 10 weight-percent of chromium. A passive-state film comprised of chromium oxide is formed on one end of the probe needles, and a solder-enhancing metallic layer is formed on the other end of the probe needles. The passive-state film may be formed by electrolytic polishing or chemical solution immersion. The passive-state film prevents a contaminating substance, such as aluminum oxide, from adhering to the needle. The probe needle substrate may be bent and may be formed by wiredrawing a cobalt-based alloy.

Abstract: An auto diagnostic apparatus having jawed, needle-toothed clips for connection to variable output wires of engine sensors adjacent to the sensors, and a processor which converts the output voltages to output values in reader friendly units understandable to the auto technician, and which stores and continuously updates the minimum and maximum output values for diagnosing intermittent or periodically interrupted electrical current. The needle-toothed clips establish an electrical connection to the variable output sensor wire without damaging the insulation or integrity of the sensor wire.

Abstract: An in-circuit test fixture for use in making a nonfunctional electrical inspection of individual components and/or circuit paths on a printed circuit board or wired backpanel assembly. The present in-circuit test fixture is cost effective and can be used when only small or moderate numbers of printed circuit boards have to be tested. The present test fixture eliminates the necessity for drilling holes in a support plate. Rather, a test head unit and a transition head unit are put together in modular fashion using assemblies which may be positioned in stacked arrays to provide a two-dimensional series of channels for support of pins to provide a test head for testing a two-dimensional product and to provide a two-dimensional series of channels for support of pins to provide a transition head for interconnection with an electronic circuit analyzer.

Abstract: A device for testing the polarity of both a power supply and a test element such as a circuit, wire or the like. The device is comprised of a body which contains a circuit board, a probe extending from one end of the body, and two lead wires extending from the opposite end of the body. The device will work on any DC voltage supply having a voltage from 6 volts to 24 volts.

Abstract: A probe to be electrically connected to an internal circuit of a semiconductor element, comprising a contact portion to be brought into pressure contact with an electrode formed on the semiconductor element, wherein the contact portion is made of an alloy consisting of Au, Cu, and an inevitable impurity. The contact resistance between the probe and electrode is low, and is maintained low in a stable manner even if the probe is repeatedly used.

Abstract: A return line for a probe station includes a sheet-like conductive strap having a first end connected electrically to a first probe and a self-coiling second end connected automatically detachably to a second probe, as by insertion of the second probe centrally within the coils of the second end. If the spacing between the probes exceeds a maximum distance, the strap harmlessly disconnects. The flat central portion of the strap automatically tracks any reductions in the spacing between the probes, which enables fast probe travel and minimizes noise pickup. Preferably a spindle rotatably engages the coiled probe and has a post member that carries the second end of the strap to a far side of the probe to improve tip visibility and electrical connection during close-in probing.

Abstract: A circuit testing fixture is provided in which a flexible membrane (17) is provided with raised features (25) on one side arranged in the pattern of contacts (65) on a device (63) to be tested and circuit means (26) connected to a probe card (12). On the opposite side of the membrane is a support form (58), (66), (70) that is clamped in position so that it acts as a pressure pad to deflect the membrane outwardly. The support form has a planar bottom edge which may provide ridges (61) in back of the raised features (25) on the membrane (17) or recesses (68) at that location. The support form also may have a flat bottom surface (71) and may be of soft compliant material or of rigid material.

Abstract: A self-contained autonulling bridge circuit based on phase-sensitive deteon of an impedance to be measured is described. The system utilizes a feedback structure to control a variable impedance in order to establish the null of the bridge. The system utilizes a voltage-variable impedance having both resistance and capacitance and provides the phase sensitive relationship in the control means in order to provide highly accurate measurement of an unknown test impedance. The ability to measure small changes in impedance provides particularly useful application to the area of biological sensor impedance measurement or electrochemical impedance measurement using silicon-based devices.

Abstract: A system for simultaneously probing an electrical test circuit while remotely controlling the test equipment used to measure the probing. The probing is performed by the use of an electrical test probe of the type utilized with oscilloscopes or the like. Incorporated within the probe are switches adapted to detecting both lateral and longitudinal pressures exerted by the probe user. The lateral pressure is applied to the lower portion of the probe and depending upon the direction of the pressure causes a cursor displayed on the test equipment to move. The user moves the displayed cursor to the desired position, which position corresponds to a function or option of the test instrument. Upon selection, the user exerts a longitudinal force upon the probe, which force is detected by the probe and activates the selected function or option on the test instrument.

Abstract: A switch probe includes an electrically conductive tubular outer receptacle and a tubular barrel in the receptacle. The barrel has a conductive inside surface and an insulative coating on its outside surface in contact with the inside of the receptacle to isolate the barrel from the receptacle. A terminal disposed in the receptacle has a conductive bearing affixed to the conductive inside of the barrel and a conductive terminal pin extending through the receptacle. An insulative coating on the surface of the terminal contacting the inside of the receptacle electrically isolates the terminal from the receptacle. A conductive plunger travels axially in the barrel against a biasing spring which retains the plunger in a normally open position. A stop in the wall of the barrel engages the plunger to retain it at a critical distance travel spaced from the receptacle. Two parallel electrically conductive paths, electrically isolated from each other, are formed axially.

Abstract: Three classes of active probes all with coaxial inputs and coplanar waveguide probe tips are described. A millimeter-wave active probe for generating signals with frequencies about 50 gHz and supplying same to millimeter-wafer including a substrate upon which a frequency multiplier consisting of filter sections and impedance matching sections and nonlinear elements are integrated in uniplanar transmission line medium. Also disclosed is a harmonic mixer probe to step down RF received from an integrated circuit to a lower frequency by mixing it with the harmonics of a local oscillator signal.

Abstract: A double-headed spring contact probe for loaded board testing includes a barrel having a hollow interior and opposite plungers which slide axially in the barrel. The plungers have outer portions which extend through opposite open ends of the barrel, each terminating in a contact tip outside the barrel for contacting a test point on a circuit board. One of the plungers has a hollow receptacle extending into the barrel with a rectangular or notched keyway opening into the receptacle. The other plunger has a twisted guide member extending through the barrel into the keyway of the other plunger whereby axial translation of the plungers relative to each other causes a rotation thereof. A spring engages opposite collar portions of the plungers to bias the plungers outwardly against opposite ends of the barrel. Necked portions of the barrel limit travel of the plungers out from the barrel.

Abstract: A DC current-comparator-based circuit generates an adjustable output proportional to an input signal, i.e. an input voltage or current. One use of the circuit is in the formation of a DC resistance bridge that can be controlled automatically by a microprocessor. The ends of a pair of test resistors (the resistances of which are to be compared) are connected to respective ratio windings of the current comparator. The same potential is applied across these resistors by a master power supply. A microprocessor is alternately supplied with two voltage signals, a first being proportional to the current in a variable one of the ratio windings of the comparator, and the second being proportional to any inequality between the current in the other ratio winding and the test resistor to which it is connected. The microprocessor controls a slave power supply that receives both the first signal and a third signal that is indicative of any unbalance in the bridge.

Abstract: A switch probe, generally for use in testing cable harnesses, is for placement within a standard probe receptacle and can be removed and replaced as necessary. The switch probe includes a conductive barrel with a front open end and a rear closed end. A conductive first switch portion is received within the barrel at the rear closed end and includes a first shaft projecting forwardly. A conductive second switch portion is received within the barrel and has an engagement tip positioned forwardly of the barrel open end for electrical contact with a test site. A second shaft extends rearwardly and into axially spaced relation to the first shaft. An elongate hollow insulator extends fully between and provides a guideway for reciprocatory contact between the first and second shafts and fully shields the second shaft from electrical leakage prior to conductive contact of the second shaft with the first shaft.

Abstract: Individual transistor or logic unit testing is accomplished by a specially fabricated flexible tester surface made in one embodiment of several layers of flexible silicon dioxide, each layer containing vias and conductive traces leading to thousands of microscopic metal probe points on one side of the test surface. The probe points electrically contact the contacts on the wafer under test by fluid pressure.

Abstract: A high-speed, low-profile logic analyzer test probe has a body of insulating material molded directly onto a narrow elongate substrate having electrical circuitry disposed thereon. The molded insulating material has a notch formed therein for exposing a conductive surface formed on the substrate. The exposed conductive surface is used for making a ground connection between the substrate and the ground of a device under test. The probe may be adapted for use in probe holder for multichannel probing wherein the probe holder has an electrically conductive chip disposed within the probe holder housing for providing the shortest possible ground connections between the ground pins on the device under test and the ground connections on the probes.

Abstract: An electrical switch usable in an electrical test probe has electrical contact pads formed on a substrate acting as fixed electrical switch contacts. A frame member is laterally disposed from the fixed electrical switch contacts. An actuator is disposed within the frame member having a movable switch pole contact extending from the actuator past the frame member for wipingly engaging the fixed electrical contacts on the substrate as the actuator is moved between first and second switch positions. For use in a switchable passive voltage probe, the electrical switch is formed on a circuit board that is disposed in an electrically conductive tubular body. Insulating material surrounds the fixed switch contacts on the circuit board to electrically isolate the contacts from the tubular body. The switch pole contact reaches into the electrically isolated region to perform the switching function.

Abstract: A wrist-worn static charge warning device constructed and arranged to remain silent most of the time. The device emits an audible signal in the event that the charged individual wearing the device is approaching a grounded or poorly grounded electronic circuit, thereby warning against possible damage to the circuit before the occurrence of such damage.The invention is based on the fundamental concept that movements of static charges can be detected by means of two RC circuits connected in a Master-Slave configuration.

Abstract: A modular ATE system includes a plurality of test modules and a receiver for use with a variety of fixtures to which printed circuit boards are to be coupled. Each test module includes a plurality of pin cards controlled by a single module controller. Multiple test module are included for testing a variety of functions. Test signals are generated by discrete sets of pin cards and controllers, then output to the receiver for interconnection to a fixture and printed circuit board(s) under test. A substantially wireless receiver is provided, including a translation board for electrically coupling test module pin cards to the fixture. By eliminating wiring and cabling by using a prefabricated translation board, noise is substantially reduced and test signal quality improved. The translation board defines prescribed signal mapping for interconnecting the I/O pins of ATE pin cards to the underside of the fixture. Different translation boards may have different mappings.

Abstract: A probe which is positioned in at least one axis by a piezoelectric transducer is provided. One or more piezoelectric transducers control position of the probe with respect to another probe, with respect to a sample surface, or with respect to a previous position of the probe itself. A method for measuring spreading resistance is provided where the distance between two probes is reproducibly controlled in the range of a few angstroms by measuring tunneling current between the two probes, and electrical contact between the two probes and a sample is reproducibly provided by monitoring current between the probes and the sample.

Abstract: An electrostatic measurement apparatus having a single balanced beam vibratory element supported and balanced at its center, so that it may be driven in a manner to cause a regular vibration of the beam. The apparatus also has an electrode suitable for sensing a capacitive coupling relationship with an electrostatic field to produce a signal indicative of the magnitude of the electrostatic field. The coupling of the electrode with the electrostatic field is modulated (coupled/decoupled) either by attaching the electrode to the end of the beam and vibrating the electrode past an aperture, or by affixing a vane to the end of the beam, whereupon the vibration of the beam causes the vane to occlude the electrode from capacitively coupling with the electrostatic field.

Abstract: A test apparatus for testing electronic integrated circuitry, a test probe assembly for use in the apparatus, and a method of forming the test probe assembly are provided. The test apparatus subjects electronic integrated circuitry under test to changing temperatures while communicating test signals from external test equipment to the circuitry under test and back to the test equipment. The test probe assembly used in the apparatus is adapted to expand and contract along with the electronic integrated circuitry as the probe assembly and the integrated circuitry are heated and subsequently allowed to cool during testing, thereby maintaining precise alignment of probes on the probe assembly with test contact points on the electronic integrated circuitry.

Abstract: A contact assembly for use in testing electric devices such as integrated circuits (IC's) and the like is comprised of a test socket and a corresponding carrier module for positioning the electric devices to be tested in alignment with the test socket. The carrier module is provided with a holding mechanism for retaining electronic devices to be tested in their proper position in the seat of the module, the holding mechanism being retractable so as to not interfere with the electrical contact between the socket and the electric device. In another aspect of the present invention, the contact assembly is provided with a slide positioning mechanism for slidably positioning the electronic device in its proper location on the seat of the carrier module.

Abstract: A system for detecting and positioning objects, the electric conductivity of which differs from the surrounding medium thereof by measuring variations in an electric field generated into the medium. More precisely, the invention concerns a method and assembly for detecting objects or objectives, for example vessels, in electrically conductive medium, for example sea, by measuring changes, disturbances, signs, indications or the like caused by the object or objective, especially for surveying water fairways and/or extent.

Abstract: A method for testing an integrated circuit (IC) chip (10) in accordance with the invention comprises the step of forming a solder bump (14) on each of an array of bonding pads (13) on a first surface of the chip, in accordance with the known flip-chip method of IC device packaging. Each of the solder bumps (14) is inserted through an aperture (25) in a spacer member (22), the spacer member having a smaller thickness than the length of each solder bump, whereby each solder bump protrudes through an aperture. The solder bumps are then placed on a layer of anisotropic conductive material (11) which is arranged over an array of test fixture conductive pads so that the anisotropic conductive layer is sandwiched between the IC chip and the test fixture. The integrated circuit chip is then compressed against the anisotropic conductor material to establish electrical contact between the solder bumps of the integrated circuit chip and the test fixture conductor pads (17).

Abstract: A contact probe consisting of a tubular receptacle, a needle member received in the tubular receptacle in a freely slidable manner, and a compression coil spring coiled around the needle member, and compressed between a shoulder surface defined in the receptacle and another shoulder surface defined in the needle member to urge the needle member out of the front end of the tubular receptacle. The compression coil spring is provided with a large diameter portion at its inner end for elastically engaging with an inner surface of the receptacle so that the needle member may be replaced without requiring the receptacle to be removed.

Abstract: A head assembly for a vacuum actuated printed circuit board test fixture includes a top plate adapted for receiving a printed circuit board thereon, a probe plate having a plurality of spring-loaded contact probes thereon, and a support assembly for supporting the top plate in sealed relation above the probe plate. The support assembly includes a primary seal member having a channel formed therein and a resilient secondary seal member in the channel which cooperates with the primary seal member to provide a seal between the top plate and the probe plate around the entire perimeter of the top plate and to support the top plate so that it is movable toward the probe plate by resiliently compressing the secondary seal member.

Abstract: The present invention provides compensation for temperature in a transducer by connecting the adjustment resistors to the transducer itself to provide a correct transducer output. A number of switches are used to couple the adjustment resistors to the transducer circuit. An individual resistor may be coupled in parallel or in series with a transducer resistance. The control input for the switches are each coupled to a separate bit output of a multiple bit memory. The memory is programmed to control the duty cycle of the switches when addressed.

Abstract: A probe apparatus has a quartz probe formed of a quartz probe body and a metallic pattern layer formed thereon, the quartz probe body including a plurality of probe portions having a large number of probes corresponding to an electrode array of an object of examination, lead pattern portions continuous individually with the probe portions, and a supporting portion supporting all the lead pattern portions, the quartz probe body being designed so that the longitudinal direction of each probe is inclined with respect to a crystal axis X or Y of a quartz plate by etching a Z plane of the quartz plate perpendicular to a crystal axis Z of the quartz plate, and a tester fitted with the quartz probe by means of an adapter.

Abstract: An improved spring loaded contact probe for testing printed circuit boards, electronic components, and substrates includes a center conductor, or wire, at least one outer layer of dielectric material surrounding the wire, a conductive layer surrounding the conductive layer, and a dielectric material surrounding the conductive layer, all in turn surrounded by a non-conductive bushing slidably mounted within a conductive tube and loaded by a compression spring with respect to the tube. One end of the tube has an end cap that contains and holds in place the compression spring. At the end of the center conductor, extending from the tube end opposite to the cap end, a conductive contact head is attached to center conductor, makes for making physical and electrical contact with the electronic component.

Abstract: A test probe device is attachable to alligator clips of test equipment for establishing electrical engagement between an electrical contact supported within an insulative housing, which is accessible through an opening therein and the test equipment. The alligator clip includes a pair of actuatable jaws defining a connection region therebetween. The test probe device includes an elongate probe member insertable into the housing through the opening for electrical engagement with the contact. An attachment member is electrically coupled to the probe member. The attachment member is attachable to the alligator clip at a location remote from the connection region thereof, permitting the alligator clip to be used without removing the test probe device.

Abstract: A contact probe consisting of a tubular receptacle, a needle member received in the tubular receptacle in a freely slidable manner, a compression coil spring coiled around the needle member, and compressed between a shoulder surface defined in the receptacle and another shoulder surface defined in the needle member to urge the needle member out of the front end of the tubular receptacle, and a wire coil or a sleeve member securely wrapped around the part of the needle member which can be adjacent the rear end of the receptacle over the entire stroke of the needle member. The wire coil or the sleeve member effectively reinforces the part of the needle member placed adjacent the rear end of the receptacle against bending stress without substantially reducing the flexibility of the reinforced part of the needle member, and substantially improves the durability of the contact probe for the given material and dimensions of the contact probe.

Abstract: A circuit for measuring the R.M.S. voltage of a high frequency signal (e.g. 100MHz) comprises two series-connected ntc thermistors (TH1, TH2) in a bridge circuit which is energized by a current source (1). The unknown signal is applied across one (TH1) of the thermistors and the resulting change in the resistance causes a D.C. output voltage to appear across the balanced terminals (T3, T4) of the bridge. This output voltage is proportional to the square of the R.M.S. voltage of the A.C. signal. In another embodiment, two ptc thermistors are connected in parallel in a bridge circuit which is energized by a voltage source, and are used to measure R.M.S. current. In each case, the thermistors are preferably operated in a negative slope resistance portion of their voltage-current characteristic.

Abstract: An universal connector employing a plurality of double female contacts installed with a certain clearance in receptacles of a body which may be suspended in a coupling position with a plurality of male contacts arranged on the top face of an EWS probe card and with a plurality of male contacts arranged on the bottom surface of a test card in a test-on-wafer station, provides a multicontact universal connection for any pair of so equipped cards of the inventories of probe cards and of test cards of the station. The connection is easily set up and exhibits excellent stability and uniformity characteristics of the electrical couplings, while reducing sensibly the time necessary for the setting-up and debugging of the test station for initiating a certain cycle of testing-on-wafer. The stability and reproducibility of the electrical couplings provided by the connection increases the precision of the measurements of critical parameters of the integrated devices with a positive effect on the production yield.

Abstract: A twist lock probe tip has a flexible body of an insulative material with an electrical conductor embedded within the flexible body or coated on one side of a flat flexible body. The flexible body has a notch for exposing the embedded electrical conductor and/or for engaging a lead of an electrical component. The flexible body is inserted between the leads of the electrical component and twisted by means of an attached knob or wing lever so that the notches engage adjacent leads and the conductor contacts the desired lead.

Abstract: A heater control device for an air-fuel ratio sensor which comprises: an air-fuel ratio sensor comprising a sensor element which detects an air-fuel ratio state of exhaust gas of an engine, and a heater which heats the sensor elements; a heater current flow control means for controlling a value of a resistance of the heater to be a target resistance value; a harness having a couple of couplers at both ends thereof which connects between the air-fuel ratio sensor and the heater current flow control means; and a current detecting resistance which is incorporated in the coupler on the air-fuel ratio sensor side, or provided adjacent to said coupler on the air-fuel ratio sensor side, and which is connected to the heater in series and detects current of the heater.

Abstract: A contactor including a test fixture for receiving an integrated circuit chip mounted in a carrier package and for providing contacts with electrical conductor pads of the package to facilitate electrical testing thereof is provided. The test fixture comprises a plurality of contact members mounted to a spring-loaded plunger. Each contact member includes a strip of conductive fingers with protruding contacts for springing engagement with the conductor pads of the carrier when the plunger is depressed. The test fixture resides in a cavity of a housing unit and is aligned with a central aperture therein. In operation, a ram holding the carrier lowers it through the central aperture of the housing unit and onto the plunger. The carrier is then pressed against the plunger, causing it to depress. This allows the carrier conductor pads to frictionally engage the protruding contacts of the conductive fingers, thus effectuating electrical contact.

Abstract: A probe card (8,18) for testing unencapsulated semiconductor devices (7,17) wherein the probe card (8,18) is made from a semiconductor material (10). A plurality of pyramidally shaped conductive protrusions or probe tips (11,41) project from the surface of the probe card (8,18) to mate with electrode pads on an unencapsulated semiconductor device (7,17) to be tested. The probe tips (11,41) are formed using standard etch techniques, hence they can be configured to contact electrode pads that reside on the unencapsulated semiconductor device in either a peripheral or area array. Further, the probe card (8,18) is capable of testing integrated circuits in either wafer or die form.

Abstract: A probe (10) that can be used for forming a low resistance electrical connection to a semiconductor die includes a contact (18) that is created on a compliant layer (12) which is supported by a substrate (11). Pressure applied to the contact (18) compresses the compliant layer (11) which causes a distal end of the contact (18) to move in a motion that is substantially equal to an arc. As the contact (18) moves through the arc motion, it scrubs across a bonding pad of a semiconductor die and breaks through oxide that typically forms on the bonding pad thereby forming a low resistance electrical connection to the bonding pad.

Abstract: A shielded electrical contact spring probe assembly for testing electrical printed circuit boards includes an outer barrel having an open end and a remote end, an inner core of dielectric material coaxially mounted within the barrel, and an electrical contact spring probe reciprocally seated within an axial bore in the core. A shield surrounds the core between the barrel inner wall and the core and extends the full length of the barrel. A shielding plunger is located in a cylindrical space between the barrel and the shield. The probe assembly remote end is for connection of an electrical transmission line, or in an alternative embodiment, inserting a second electrical contact spring probe within the core. The configuration and material of the core and the shield enable the entire probe assembly to maintain a selected impedance.

Abstract: A proper apparatus includes a test head for generating a test signal. A probe card is fixed removably on the test head. The probe card supplies the test signal to a test piece when the probe card electrically contacts the test piece, and tests electric characteristics of the test piece.

Abstract: A semiconductor probe card having a plurality of micromachined probes tips for contacting an array of electrode pads formed on a semiconductor integrated circuit is provided. The plurality of probe tips are formed on the top surface of the substrate wherein the probe tips are arranged in an array matching of electrode pads on the integrated circuit to be tested. A portion of the semiconductor substrate underneath the probe tips is thin, so that the probe tips rests on a flexible diaphragm or beam.