Abstract: A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a connection conductor arranged at a side of the mounting table and electrically connected to a mounting table electrode formed on a mounting surface of the mounting table, and a cleaning mechanism including a polishing unit for polishing a contact portion of the connection conductor, a brush cleaning unit for performing a brush-cleaning of the contact portion, and a contact resistance measuring unit for measuring a contact resistance of the contact portion. The mounting table electrode is in contact with a backside electrode of a semiconductor device of the semiconductor wafer. When the connection conductor is connected to the electrode plate, a backside electrode formed on a backside of the semiconductor device and the tester are electrically connected to each other.

Abstract: Provided is a method for manufacturing a probe card which inspects electrical characteristics of a plurality of semiconductor devices in batch. The method includes: a step of forming a plurality of probes, which are to be brought into contact with external terminals of the semiconductor devices, on one side of a board which forms the base body of the probe card; a step of forming on the board, by photolithography and etching, a plurality of through-holes which reach the probes from the other side of the board; a step of forming, in the through-holes, through electrodes to be conductively connected with the probes, respectively; and a step of forming wiring, which is conductively connected with the through electrodes, on the other side of the board.

Abstract: An apparatus for maintaining a conductivity of electrical contacts of a test contactor for testing electronic devices comprises a rotary turret disk having a plurality of test stands operative to hold respective electronic devices, the electronic devices being rotatable by the rotary turret disk to a position of the test contactor to be contacted by the electrical contacts during testing. At least one contactor maintenance stand comprising a maintenance component is located between adjacent test stands on the rotary turret disk, wherein the electrical contacts of the test contactor are adapted to engage the maintenance component so as to automatically clean the electrical contacts and/or verify the conductivity thereof.

Abstract: Test structures for performing electrical tests of devices under one or more microbumps are provided. Each test structure includes at least one microbump pad and a test pad. The microbump pad is a part of a metal pad connected to an interconnect for a device. A width of the microbump pad is equal to or less than about 50 ?m. The test pad is connected to the at least one microbump pad. The test pad has a size large enough to allow circuit probing of the device. The test pad is another part of the metal pad. A width of the test pad is greater than the at least one microbump pad.

Abstract: A probe includes a contact member brought into contact with an object to be tested. Contact particles having conductivity are uniformly distributed in the contact member. A part of the contact particles protrude from a surface of the contact member on the side of the object to be tested. A conductive member having elasticity is placed on a surface of the contact member on the opposite side to the object to be tested. The probe further includes an insulating sheet including a through hole and the contact member is so positioned as to penetrate the through hole. An upper part of the contact member is formed of a conductor which does not include the contact particles. An additional conductor is placed on a surface of the conductor on the side opposite to the object to be tested.

Abstract: A first device and a second device can include at least one alignment feature and at least one corresponding constraint. The alignment feature and the constraint can be configured to align the first device and the second device when the alignment feature is inserted into the constraint. The alignment feature and the constraint can be further configured to direct relative movement between the first device and the second device due to relative thermal expansion or contraction between the first device and the second device. The directed relative movement can keep the first device and the second device aligned over a predetermined temperature range.

Abstract: A system is provided for cleaning of probe contacts. The system has a base plate with three mounting means, such as openings, for receiving each an adjustable attachment, and means, such as further openings, for connecting the base plate to a probe machine; and a cleaning plate having on a bottom side three holding means, such as openings, for receiving the respective adjustable attachment, and a top area for supporting a cleaning device, wherein the holding means do not reach into a top area of the cleaning plate; and wherein the adjustable attachment means allows the top area to be leveled.

Abstract: Methods and apparatuses for modifying a stage position and measuring at least one parameter of a motor connected with a stage during a commanded stage position are described. In one embodiment of one aspect of the invention, the motor is configured to move the stage in a first direction in response to the at least one parameter and determine whether the at least one parameter is within a threshold range.

Abstract: An apparatus for maintaining a conductivity of electrical contacts of a test contactor for testing electronic devices comprises a rotary turret disk having a plurality of test stands operative to hold respective electronic devices, the electronic devices being rotatable by the rotary turret disk to a position of the test contactor to be contacted by the electrical contacts during testing. At least one contactor maintenance stand comprising a maintenance component is located between adjacent test stands on the rotary turret disk, wherein the electrical contacts of the test contactor are adapted to engage the maintenance component so as to automatically clean the electrical contacts and/or verify the conductivity thereof.

Abstract: A method for cleaning a contact pad of a microstructure or device to be tested when it is in electric contact with a measure apparatus, being obtained by electrically contacting a flexible probe with said contact pad. The method includes mechanically engaging a free end of the flexible probe in a manner that sticks the free end in the pad; and laterally flexing, by means of a tip charge, the flexible probe in a manner that keeps the free end stuck in the pad, so as to locally dig into a covering layer of the pad and realize a localized crushing thereof.

Abstract: There is provided a signal output apparatus for outputting a pattern signal. The signal output apparatus includes a pattern generating section that generates waveform data of the pattern signal to be generated, a timing generating section that generates timing signals in accordance with an expected pattern cycle time of the pattern signal, a timing control section that receives the waveform data output from the pattern generating section, and controls output timings of the timing signals to be output from the timing generating section, in accordance with the waveform data, and a waveform shaping section that generates the pattern signal corresponding to data values of the waveform data output from the pattern generating section, in accordance with the timing signals output from the timing generating section.

Abstract: A method and apparatus for a pre-biasing storage mechanism to prevent oxidation and other contaminants from forming on the probe tips and probe tails of a probe card. The pre-biasing storage mechanism imposes a positive bias on the probe needles of the probe card so as to create physical contact between the probe tails and the conductive pads of the printed circuit board (PCB) arrangement of the probe card during a disengaged state of the probe card. In addition, the storage mechanism imposes a positive bias on the probe needles of the probe card, so as to create physical contact between the probe tips and a probe tip cleaning pad, or other protective surface, during a disengaged state of the probe card.

Abstract: Methods and apparatus for testing packaged ICs are disclosed. In some embodiments, an apparatus for testing a packaged integrated circuit (IC) can include a device handler for moving the packaged IC; a testing station for testing the packaged IC; and a pre-test conditioning station configured to remove at least a portion of an oxidation layer formed on contacts of the packaged IC prior to testing. In some embodiments, a method for testing packaged ICs may include providing a packaged IC to be tested; at least partially removing an oxidation layer from contacts of the packaged IC prior to testing; inserting the packaged IC into an interface structure; and testing the packaged IC.

Abstract: A vertical probe tip rotational scrub and method is described. The vertical probe includes a wafer prober chuck; a wafer positioned on the wafer prober chuck; and at least one probe having a probe tip, the at least one probe tip rotatably mounted such that the probe tip provides a rotational scrub on a surface of a wafer surface. A method for wafer probing is also described, the method includes: determining a vertical location of a wafer surface relative to at least one probe having a probe tip; retracting the probe tip; and imparting an upward motion on the at least one probe in response to the retracting of the probe tip, wherein the upward motion results in a rotational scrub of the wafer surface.

Abstract: The present invention relates to a self-cleaning package testing socket, which comprises a base plate, a surround wall is configured on the periphery of the base plate and surrounding with a central testing tank inside. Two transversal channels respectively disposed at two opposite sides of the surround wall. Each transversal channel comprises a nozzle tube between inlet and outlet; the nozzle tube radially connects two bypass pipes. Herewith, the testing tank through the bypass pipes connected to the nozzle tubes of the transversal channels. Hence, when passing air into one end of the each transversal channel, it will cause the airflow rate inside the nozzle tube to speed up, so that the pressure inside the bypass pipes will reduce, and the testing tank results a vacuum-clean effect. Therefore, the present invention can be on-line self-cleaning the test socket.

Abstract: A probe for engaging a conductive pad is provided. The probe includes a probe contact end for receiving a test current, a probe retention portion below the contact end, a block for holding the probe retention portion, a probe arm below the retention portion, a probe contact tip below the arm, and a generally planar self-cleaning skate disposed perpendicular below the contact tip. The self-cleaning skate has a square front, a round back and a flat middle section. The conductive pad is of generally convex shape having a granular non-conductive surface of debris and moves to engage the skate, whereby an overdrive motion is applied to the pad causing the skate to move across and scrub non-conductive debris from the pad displacing the debris along the skate and around the skate round back end to a position on the skate that is away from the pad.